USD571739S1 - Semiconductor wafer delivery apparatus - Google Patents

Description

FIG. 1 is a front elevational view of a semiconductor wafer delivery apparatus, showing my design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a cross-sectional view taken along line 7—7 in FIG. 1;

FIG. 8 is a top, front and right perspective view thereof; and,

FIG. 9 is a top and left rear perspective view thereof.

The broken line showing in the figures is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

CLAIM
1. The ornamental design for a semiconductor wafer delivery apparatus, as shown and described.

Images