USD570307S1 - Portion of a printed circuit board - Google Patents
Portion of a printed circuit board Download PDFInfo
- Publication number
- USD570307S1 USD570307S1 US29/279,838 US27983807F USD570307S US D570307 S1 USD570307 S1 US D570307S1 US 27983807 F US27983807 F US 27983807F US D570307 S USD570307 S US D570307S
- Authority
- US
- United States
- Prior art keywords
- circuit board
- printed circuit
- view
- showing
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
The broken lines are for illustrative purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for a portion of a printed circuit board, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006033056 | 2006-11-30 | ||
| JP2006-033056 | 2006-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD570307S1 true USD570307S1 (en) | 2008-06-03 |
Family
ID=39466905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/279,838 Expired - Lifetime USD570307S1 (en) | 2006-11-30 | 2007-05-08 | Portion of a printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD570307S1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD597504S1 (en) * | 2006-11-30 | 2009-08-04 | Kabushiki Kaisha Toshiba | Portion of a printed circuit board |
| USD615506S1 (en) | 2009-06-23 | 2010-05-11 | Dbg Group Investments, Llc | Integrated energy management system |
| USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD804437S1 (en) * | 2016-09-30 | 2017-12-05 | Norton (Waterford) Limited | Circuit board |
| USD852763S1 (en) * | 2017-08-31 | 2019-07-02 | ebm-papst Lanshut GmbH | Circuit board |
| USD942974S1 (en) * | 2018-11-20 | 2022-02-08 | Thales Dis Ais Deutschland Gmbh | Cellular module |
| USD1022931S1 (en) * | 2021-08-02 | 2024-04-16 | Hewlett-Packard Development Company, L.P. | Integrated circuit |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5339219A (en) * | 1993-04-05 | 1994-08-16 | Alex Urich | Modulated electronic breadboard |
| USD363920S (en) | 1992-12-02 | 1995-11-07 | K. W. Muth Company, Inc. | Electrical circuit board |
| US5614698A (en) * | 1995-01-17 | 1997-03-25 | Dell Usa, L.P. | Circuit board apparatus with integral, edge-readable bar code structure, and associated methods |
| US5661343A (en) * | 1994-03-16 | 1997-08-26 | Hitachi, Ltd. | Power hybrid integrated circuit apparatus |
| US5838546A (en) * | 1996-04-12 | 1998-11-17 | Nec Corporation | Mounting structure for a semiconductor circuit |
| US5905639A (en) * | 1997-09-29 | 1999-05-18 | Raytheon Company | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
| USD428860S (en) | 1999-06-30 | 2000-08-01 | Peter Michael Siperek | Circuit board within a display box |
| USD466093S1 (en) | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
| US20020189083A1 (en) * | 2000-04-12 | 2002-12-19 | Murata Manufacturing Co., Ltd. | Surface-mount type switching power-supply unit and mounting method for the same |
| USD471524S1 (en) * | 2001-04-27 | 2003-03-11 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
| US6585525B2 (en) * | 2000-04-29 | 2003-07-01 | Samsung Electronics Co., Ltd. | Memory modules having conductors at edges thereof and configured to conduct signals to or from the memory modules via the respective edges |
| US6721821B1 (en) * | 2000-04-13 | 2004-04-13 | General Dynamics Information Systems | Apparatus for electronic data storage |
| US20060126314A1 (en) * | 2004-12-15 | 2006-06-15 | Kwang-Jin Jeong | Plasma display apparatus |
| US20070217177A1 (en) * | 2003-02-27 | 2007-09-20 | Seiko Epson Corporation | Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus |
| US20070294889A1 (en) * | 2001-12-06 | 2007-12-27 | Reinhold Schmitt | Electronic circuit module and method for its assembly |
| US20080007926A1 (en) * | 2006-07-10 | 2008-01-10 | Samsung Electronics Co., Ltd. | Printed circuit board and electronic device having the same |
-
2007
- 2007-05-08 US US29/279,838 patent/USD570307S1/en not_active Expired - Lifetime
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD363920S (en) | 1992-12-02 | 1995-11-07 | K. W. Muth Company, Inc. | Electrical circuit board |
| US5339219A (en) * | 1993-04-05 | 1994-08-16 | Alex Urich | Modulated electronic breadboard |
| US5661343A (en) * | 1994-03-16 | 1997-08-26 | Hitachi, Ltd. | Power hybrid integrated circuit apparatus |
| US5614698A (en) * | 1995-01-17 | 1997-03-25 | Dell Usa, L.P. | Circuit board apparatus with integral, edge-readable bar code structure, and associated methods |
| US5838546A (en) * | 1996-04-12 | 1998-11-17 | Nec Corporation | Mounting structure for a semiconductor circuit |
| US5905639A (en) * | 1997-09-29 | 1999-05-18 | Raytheon Company | Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds |
| USD428860S (en) | 1999-06-30 | 2000-08-01 | Peter Michael Siperek | Circuit board within a display box |
| US20020189083A1 (en) * | 2000-04-12 | 2002-12-19 | Murata Manufacturing Co., Ltd. | Surface-mount type switching power-supply unit and mounting method for the same |
| US6721821B1 (en) * | 2000-04-13 | 2004-04-13 | General Dynamics Information Systems | Apparatus for electronic data storage |
| US6585525B2 (en) * | 2000-04-29 | 2003-07-01 | Samsung Electronics Co., Ltd. | Memory modules having conductors at edges thereof and configured to conduct signals to or from the memory modules via the respective edges |
| USD466093S1 (en) | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
| USD471167S1 (en) * | 2001-04-27 | 2003-03-04 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit board |
| USD471524S1 (en) * | 2001-04-27 | 2003-03-11 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
| US20070294889A1 (en) * | 2001-12-06 | 2007-12-27 | Reinhold Schmitt | Electronic circuit module and method for its assembly |
| US20070217177A1 (en) * | 2003-02-27 | 2007-09-20 | Seiko Epson Corporation | Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus |
| US20060126314A1 (en) * | 2004-12-15 | 2006-06-15 | Kwang-Jin Jeong | Plasma display apparatus |
| US20080007926A1 (en) * | 2006-07-10 | 2008-01-10 | Samsung Electronics Co., Ltd. | Printed circuit board and electronic device having the same |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD597504S1 (en) * | 2006-11-30 | 2009-08-04 | Kabushiki Kaisha Toshiba | Portion of a printed circuit board |
| USD615506S1 (en) | 2009-06-23 | 2010-05-11 | Dbg Group Investments, Llc | Integrated energy management system |
| USD761745S1 (en) * | 2013-06-28 | 2016-07-19 | Sumitomo Electric Industries, Ltd. | Semiconductor device |
| USD804437S1 (en) * | 2016-09-30 | 2017-12-05 | Norton (Waterford) Limited | Circuit board |
| USD852763S1 (en) * | 2017-08-31 | 2019-07-02 | ebm-papst Lanshut GmbH | Circuit board |
| USD942974S1 (en) * | 2018-11-20 | 2022-02-08 | Thales Dis Ais Deutschland Gmbh | Cellular module |
| USD1054404S1 (en) | 2018-11-20 | 2024-12-17 | Kontron Europe Gmbh | Cellular module |
| USD1022931S1 (en) * | 2021-08-02 | 2024-04-16 | Hewlett-Packard Development Company, L.P. | Integrated circuit |
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