USD560457S1 - Polishing pad - Google Patents
Polishing pad Download PDFInfo
- Publication number
- USD560457S1 USD560457S1 US29/225,832 US22583205F USD560457S US D560457 S1 USD560457 S1 US D560457S1 US 22583205 F US22583205 F US 22583205F US D560457 S USD560457 S US D560457S
- Authority
- US
- United States
- Prior art keywords
- polishing pad
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005498 polishing Methods 0.000 title claims description 4
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Description
The broken line showing of portions of the polishing pad is for illustrative purposes only and forms no part of the claimed design.
Claims (1)
- The ornamental design for a polishing pad, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004030298 | 2004-10-05 | ||
| JP2004-030298 | 2004-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD560457S1 true USD560457S1 (en) | 2008-01-29 |
Family
ID=38974206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/225,832 Expired - Lifetime USD560457S1 (en) | 2004-10-05 | 2005-03-22 | Polishing pad |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD560457S1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD581237S1 (en) * | 2004-03-17 | 2008-11-25 | Jsr Corporation | Polishing pad |
| USD678745S1 (en) * | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
| US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
Citations (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US88649A (en) * | 1869-04-06 | Improvement in index for piling circular saws | ||
| US494471A (en) * | 1893-03-28 | Grinding or polishing wheel and the art of manufacturing same | ||
| US1092588A (en) * | 1914-01-05 | 1914-04-07 | Albert Monkiawicz | Grinding-wheel. |
| US1569403A (en) * | 1922-06-03 | 1926-01-12 | Standard Appliance And Souveni | Fiber-needle sharpener for talking-machine records |
| US3046708A (en) * | 1959-11-02 | 1962-07-31 | American Optical Corp | Lens surfacing technique |
| US5007207A (en) * | 1987-12-22 | 1991-04-16 | Cornelius Phaal | Abrasive product |
| US5131190A (en) * | 1990-02-23 | 1992-07-21 | C.I.C.E. S.A. | Lapping machine and non-constant pitch grooved bed therefor |
| US5507740A (en) * | 1993-05-03 | 1996-04-16 | O'donnell, Jr.; Francis E. | Corneal topography enhancement device |
| US5733178A (en) * | 1995-03-02 | 1998-03-31 | Minnesota Mining And Manfacturing Co. | Method of texturing a substrate using a structured abrasive article |
| US5778481A (en) * | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads |
| US5899799A (en) * | 1996-01-19 | 1999-05-04 | Micron Display Technology, Inc. | Method and system to increase delivery of slurry to the surface of large substrates during polishing operations |
| US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| US6066266A (en) * | 1998-07-08 | 2000-05-23 | Lsi Logic Corporation | In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation |
| US6217426B1 (en) * | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
| US6248000B1 (en) * | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface |
| US6267643B1 (en) * | 1999-08-03 | 2001-07-31 | Taiwan Semiconductor Manufacturing Company, Ltd | Slotted retaining ring for polishing head and method of using |
| US6273806B1 (en) * | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US20010031610A1 (en) * | 2000-02-25 | 2001-10-18 | Budinger William D. | Polishing pad with a transparent portion |
| US6332830B1 (en) * | 1998-08-04 | 2001-12-25 | Shin-Etsu Handotai Co., Ltd. | Polishing method and polishing device |
| US6375550B1 (en) * | 2000-06-05 | 2002-04-23 | Lsi Logic Corporation | Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer |
| US6402594B1 (en) * | 1999-01-18 | 2002-06-11 | Shin-Etsu Handotai Co., Ltd. | Polishing method for wafer and holding plate |
| US6443810B1 (en) * | 2000-04-11 | 2002-09-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing platen equipped with guard ring for chemical mechanical polishing |
| US6544373B2 (en) * | 2001-07-26 | 2003-04-08 | United Microelectronics Corp. | Polishing pad for a chemical mechanical polishing process |
| US6544111B1 (en) * | 1998-01-30 | 2003-04-08 | Ebara Corporation | Polishing apparatus and polishing table therefor |
| US20030068964A1 (en) * | 2001-10-05 | 2003-04-10 | Governor Of Akita Prefecture | Polishing apparatus |
| US6561890B2 (en) * | 1999-12-28 | 2003-05-13 | Ace Inc. | Polishing pad |
| US20030194962A1 (en) * | 2000-10-31 | 2003-10-16 | Weber Robert J. | Buffing tools and methods of making |
| US20030199234A1 (en) * | 2000-06-29 | 2003-10-23 | Shyng-Tsong Chen | Grooved polishing pads and methods of use |
| US20030207651A1 (en) * | 2002-05-06 | 2003-11-06 | Seung-Kon Kim | Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same |
| US6659850B2 (en) * | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| US20040014413A1 (en) * | 2002-06-03 | 2004-01-22 | Jsr Corporation | Polishing pad and multi-layer polishing pad |
| US6702651B2 (en) * | 2000-01-18 | 2004-03-09 | Applied Materials Inc. | Method and apparatus for conditioning a polishing pad |
| US20040053570A1 (en) * | 2002-09-13 | 2004-03-18 | Markus Naujok | Novel finishing pad design for multidirectional use |
| US20040058630A1 (en) * | 2001-08-16 | 2004-03-25 | Inha Park | Chemical mechanical polishing pad having holes and or grooves |
| US20040082271A1 (en) * | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
| US20040102144A1 (en) * | 2001-07-25 | 2004-05-27 | Brown Nathan R. | Polishing systems for use with semiconductor substrates including differential pressure application apparatus |
| US6749486B2 (en) * | 2000-02-24 | 2004-06-15 | Tokyo Electron Limited | Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method |
| US20040127145A1 (en) * | 2001-07-03 | 2004-07-01 | Shogo Takahashi | Perforated-transparent polishing pad |
| US20040259483A1 (en) * | 2003-06-17 | 2004-12-23 | Cabot Microelectronics Corporation | Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region |
| US20050113011A1 (en) * | 2003-11-04 | 2005-05-26 | Jsr Corporation | Chemical mechanical polishing pad |
| US6899611B2 (en) * | 1992-08-19 | 2005-05-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad for a semiconductor device having a dissolvable substance |
| US20050142996A1 (en) * | 2003-04-11 | 2005-06-30 | Hisatomo Ohno | Polishing pad and method of producing same |
| US20050148183A1 (en) * | 2002-08-30 | 2005-07-07 | Toray Industries, Inc. | Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device |
| US20050191945A1 (en) * | 2002-03-18 | 2005-09-01 | Angela Petroski | Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
| US20050211376A1 (en) * | 2004-03-25 | 2005-09-29 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| US6951510B1 (en) * | 2004-03-12 | 2005-10-04 | Agere Systems, Inc. | Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size |
| USD510850S1 (en) * | 2002-12-20 | 2005-10-25 | Production Chemical Mfg. Inc. | Polishing pad |
| US6960123B2 (en) * | 2004-03-01 | 2005-11-01 | Oki Electric Industry Co., Ltd. | Cleaning sheet for probe needles |
| US20050245171A1 (en) * | 2004-04-28 | 2005-11-03 | Jsr Corporation | Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers |
| US20060037699A1 (en) * | 2002-11-27 | 2006-02-23 | Masahiko Nakamori | Polishing pad and method for manufacturing semiconductor device |
| US20060063471A1 (en) * | 2004-09-22 | 2006-03-23 | Muldowney Gregory P | CMP pad having a streamlined windowpane |
| US7029747B2 (en) * | 2002-09-17 | 2006-04-18 | Korea Polyol Co., Ltd. | Integral polishing pad and manufacturing method thereof |
| US7070480B2 (en) * | 2001-10-11 | 2006-07-04 | Applied Materials, Inc. | Method and apparatus for polishing substrates |
| US20060194530A1 (en) * | 2005-02-25 | 2006-08-31 | Thomson Clifford O | Polishing pad for use in polishing work pieces |
| US20060199473A1 (en) * | 2003-04-03 | 2006-09-07 | Masao Suzuki | Polishing pad, process for producing the same and method of polishing therewith |
| US7112119B1 (en) * | 2005-08-26 | 2006-09-26 | Applied Materials, Inc. | Sealed polishing pad methods |
| US7121938B2 (en) * | 2002-04-03 | 2006-10-17 | Toho Engineering Kabushiki Kaisha | Polishing pad and method of fabricating semiconductor substrate using the pad |
| US20060276109A1 (en) * | 2003-03-24 | 2006-12-07 | Roy Pradip K | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US7183213B2 (en) * | 2003-07-17 | 2007-02-27 | Jsr Corporation | Chemical mechanical polishing pad and chemical mechanical polishing method |
-
2005
- 2005-03-22 US US29/225,832 patent/USD560457S1/en not_active Expired - Lifetime
Patent Citations (75)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US88649A (en) * | 1869-04-06 | Improvement in index for piling circular saws | ||
| US494471A (en) * | 1893-03-28 | Grinding or polishing wheel and the art of manufacturing same | ||
| US1092588A (en) * | 1914-01-05 | 1914-04-07 | Albert Monkiawicz | Grinding-wheel. |
| US1569403A (en) * | 1922-06-03 | 1926-01-12 | Standard Appliance And Souveni | Fiber-needle sharpener for talking-machine records |
| US3046708A (en) * | 1959-11-02 | 1962-07-31 | American Optical Corp | Lens surfacing technique |
| US5007207A (en) * | 1987-12-22 | 1991-04-16 | Cornelius Phaal | Abrasive product |
| US5131190A (en) * | 1990-02-23 | 1992-07-21 | C.I.C.E. S.A. | Lapping machine and non-constant pitch grooved bed therefor |
| US6899611B2 (en) * | 1992-08-19 | 2005-05-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad for a semiconductor device having a dissolvable substance |
| US5507740A (en) * | 1993-05-03 | 1996-04-16 | O'donnell, Jr.; Francis E. | Corneal topography enhancement device |
| US5733178A (en) * | 1995-03-02 | 1998-03-31 | Minnesota Mining And Manfacturing Co. | Method of texturing a substrate using a structured abrasive article |
| US5899799A (en) * | 1996-01-19 | 1999-05-04 | Micron Display Technology, Inc. | Method and system to increase delivery of slurry to the surface of large substrates during polishing operations |
| US5778481A (en) * | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads |
| US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| US5984769A (en) * | 1997-05-15 | 1999-11-16 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US6699115B2 (en) * | 1997-05-15 | 2004-03-02 | Applied Materials Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US20020137450A1 (en) * | 1997-05-15 | 2002-09-26 | Applied Materials, Inc., A Delaware Corporation | Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus |
| US20040072516A1 (en) * | 1997-05-15 | 2004-04-15 | Osterheld Thomas H. | Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus |
| US6645061B1 (en) * | 1997-05-15 | 2003-11-11 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in chemical mechanical polishing |
| US6273806B1 (en) * | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US6824455B2 (en) * | 1997-05-15 | 2004-11-30 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US20030092371A1 (en) * | 1997-05-15 | 2003-05-15 | Applied Materials, Inc., A Delaware Corporation | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US6520847B2 (en) * | 1997-05-15 | 2003-02-18 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in chemical mechanical polishing |
| US6544111B1 (en) * | 1998-01-30 | 2003-04-08 | Ebara Corporation | Polishing apparatus and polishing table therefor |
| US6248000B1 (en) * | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface |
| US6066266A (en) * | 1998-07-08 | 2000-05-23 | Lsi Logic Corporation | In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation |
| US6332830B1 (en) * | 1998-08-04 | 2001-12-25 | Shin-Etsu Handotai Co., Ltd. | Polishing method and polishing device |
| US6402594B1 (en) * | 1999-01-18 | 2002-06-11 | Shin-Etsu Handotai Co., Ltd. | Polishing method for wafer and holding plate |
| US20040082271A1 (en) * | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
| US6217426B1 (en) * | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
| US6267643B1 (en) * | 1999-08-03 | 2001-07-31 | Taiwan Semiconductor Manufacturing Company, Ltd | Slotted retaining ring for polishing head and method of using |
| US6561890B2 (en) * | 1999-12-28 | 2003-05-13 | Ace Inc. | Polishing pad |
| US6702651B2 (en) * | 2000-01-18 | 2004-03-09 | Applied Materials Inc. | Method and apparatus for conditioning a polishing pad |
| US6749486B2 (en) * | 2000-02-24 | 2004-06-15 | Tokyo Electron Limited | Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method |
| US20010031610A1 (en) * | 2000-02-25 | 2001-10-18 | Budinger William D. | Polishing pad with a transparent portion |
| US6517417B2 (en) * | 2000-02-25 | 2003-02-11 | Rodel Holdings, Inc. | Polishing pad with a transparent portion |
| US6659850B2 (en) * | 2000-03-31 | 2003-12-09 | Speedfam-Ipec Corporation | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| US20040259476A1 (en) * | 2000-03-31 | 2004-12-23 | Korovin Nikolay N. | Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece |
| US6443810B1 (en) * | 2000-04-11 | 2002-09-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing platen equipped with guard ring for chemical mechanical polishing |
| US6375550B1 (en) * | 2000-06-05 | 2002-04-23 | Lsi Logic Corporation | Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer |
| US6685548B2 (en) * | 2000-06-29 | 2004-02-03 | International Business Machines Corporation | Grooved polishing pads and methods of use |
| US20030199234A1 (en) * | 2000-06-29 | 2003-10-23 | Shyng-Tsong Chen | Grooved polishing pads and methods of use |
| US20030194962A1 (en) * | 2000-10-31 | 2003-10-16 | Weber Robert J. | Buffing tools and methods of making |
| US6824447B2 (en) * | 2001-07-03 | 2004-11-30 | Rodel Nitta Corporation | Perforated-transparent polishing pad |
| US20040127145A1 (en) * | 2001-07-03 | 2004-07-01 | Shogo Takahashi | Perforated-transparent polishing pad |
| US20040102144A1 (en) * | 2001-07-25 | 2004-05-27 | Brown Nathan R. | Polishing systems for use with semiconductor substrates including differential pressure application apparatus |
| US6899607B2 (en) * | 2001-07-25 | 2005-05-31 | Micron Technology, Inc. | Polishing systems for use with semiconductor substrates including differential pressure application apparatus |
| US7059937B2 (en) * | 2001-07-25 | 2006-06-13 | Micron Technology, Inc. | Systems including differential pressure application apparatus |
| US6544373B2 (en) * | 2001-07-26 | 2003-04-08 | United Microelectronics Corp. | Polishing pad for a chemical mechanical polishing process |
| US20040058630A1 (en) * | 2001-08-16 | 2004-03-25 | Inha Park | Chemical mechanical polishing pad having holes and or grooves |
| US6875096B2 (en) * | 2001-08-16 | 2005-04-05 | Skc Co., Ltd. | Chemical mechanical polishing pad having holes and or grooves |
| US20030068964A1 (en) * | 2001-10-05 | 2003-04-10 | Governor Of Akita Prefecture | Polishing apparatus |
| US7070480B2 (en) * | 2001-10-11 | 2006-07-04 | Applied Materials, Inc. | Method and apparatus for polishing substrates |
| US20050191945A1 (en) * | 2002-03-18 | 2005-09-01 | Angela Petroski | Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
| US7121938B2 (en) * | 2002-04-03 | 2006-10-17 | Toho Engineering Kabushiki Kaisha | Polishing pad and method of fabricating semiconductor substrate using the pad |
| US20030207651A1 (en) * | 2002-05-06 | 2003-11-06 | Seung-Kon Kim | Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same |
| US20040014413A1 (en) * | 2002-06-03 | 2004-01-22 | Jsr Corporation | Polishing pad and multi-layer polishing pad |
| US20050148183A1 (en) * | 2002-08-30 | 2005-07-07 | Toray Industries, Inc. | Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device |
| US20040053570A1 (en) * | 2002-09-13 | 2004-03-18 | Markus Naujok | Novel finishing pad design for multidirectional use |
| US7029747B2 (en) * | 2002-09-17 | 2006-04-18 | Korea Polyol Co., Ltd. | Integral polishing pad and manufacturing method thereof |
| US20060037699A1 (en) * | 2002-11-27 | 2006-02-23 | Masahiko Nakamori | Polishing pad and method for manufacturing semiconductor device |
| USD510850S1 (en) * | 2002-12-20 | 2005-10-25 | Production Chemical Mfg. Inc. | Polishing pad |
| US20060276109A1 (en) * | 2003-03-24 | 2006-12-07 | Roy Pradip K | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US20060199473A1 (en) * | 2003-04-03 | 2006-09-07 | Masao Suzuki | Polishing pad, process for producing the same and method of polishing therewith |
| US20050142996A1 (en) * | 2003-04-11 | 2005-06-30 | Hisatomo Ohno | Polishing pad and method of producing same |
| US20040259483A1 (en) * | 2003-06-17 | 2004-12-23 | Cabot Microelectronics Corporation | Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region |
| US7183213B2 (en) * | 2003-07-17 | 2007-02-27 | Jsr Corporation | Chemical mechanical polishing pad and chemical mechanical polishing method |
| US20050113011A1 (en) * | 2003-11-04 | 2005-05-26 | Jsr Corporation | Chemical mechanical polishing pad |
| US6960123B2 (en) * | 2004-03-01 | 2005-11-01 | Oki Electric Industry Co., Ltd. | Cleaning sheet for probe needles |
| US6951510B1 (en) * | 2004-03-12 | 2005-10-04 | Agere Systems, Inc. | Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size |
| US20050211376A1 (en) * | 2004-03-25 | 2005-09-29 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| US20050245171A1 (en) * | 2004-04-28 | 2005-11-03 | Jsr Corporation | Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers |
| US20060063471A1 (en) * | 2004-09-22 | 2006-03-23 | Muldowney Gregory P | CMP pad having a streamlined windowpane |
| US20060194530A1 (en) * | 2005-02-25 | 2006-08-31 | Thomson Clifford O | Polishing pad for use in polishing work pieces |
| US7112119B1 (en) * | 2005-08-26 | 2006-09-26 | Applied Materials, Inc. | Sealed polishing pad methods |
| US20070049167A1 (en) * | 2005-08-26 | 2007-03-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD581237S1 (en) * | 2004-03-17 | 2008-11-25 | Jsr Corporation | Polishing pad |
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| USD678745S1 (en) * | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
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