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USD560457S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD560457S1
USD560457S1 US29/225,832 US22583205F USD560457S US D560457 S1 USD560457 S1 US D560457S1 US 22583205 F US22583205 F US 22583205F US D560457 S USD560457 S US D560457S
Authority
US
United States
Prior art keywords
polishing pad
view
taken along
enlarged
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/225,832
Inventor
Hiroyuki Miyauchi
Hiroshi Shiho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Assigned to JSR CORPORATION reassignment JSR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIYAUCHI, HIROYUKI, SHIHO, HIROSHI
Application granted granted Critical
Publication of USD560457S1 publication Critical patent/USD560457S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a polishing pad, showing our new design;
FIG. 2 is a front elevational view thereof, the rear, left, and right side elevational views being mirror images of the view shown;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is an enlarged, partial top plan view thereof taken along the intersection of lines 44 in FIG. 1;
FIG. 5 is an enlarged, partial cross-sectional view thereof taken along line 55 in FIG. 4;
FIG. 6 is a greatly enlarged, partial cross-sectional view thereof taken along line 6 in FIG. 5; and,
FIG. 7 is an enlarged, partial bottom plan view of taken along the intersection of lines 77 in FIG. 3.
The broken line showing of portions of the polishing pad is for illustrative purposes only and forms no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a polishing pad, as shown and described.
US29/225,832 2004-10-05 2005-03-22 Polishing pad Expired - Lifetime USD560457S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004030298 2004-10-05
JP2004-030298 2004-10-05

Publications (1)

Publication Number Publication Date
USD560457S1 true USD560457S1 (en) 2008-01-29

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ID=38974206

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/225,832 Expired - Lifetime USD560457S1 (en) 2004-10-05 2005-03-22 Polishing pad

Country Status (1)

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US (1) USD560457S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD581237S1 (en) * 2004-03-17 2008-11-25 Jsr Corporation Polishing pad
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate

Citations (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US88649A (en) * 1869-04-06 Improvement in index for piling circular saws
US494471A (en) * 1893-03-28 Grinding or polishing wheel and the art of manufacturing same
US1092588A (en) * 1914-01-05 1914-04-07 Albert Monkiawicz Grinding-wheel.
US1569403A (en) * 1922-06-03 1926-01-12 Standard Appliance And Souveni Fiber-needle sharpener for talking-machine records
US3046708A (en) * 1959-11-02 1962-07-31 American Optical Corp Lens surfacing technique
US5007207A (en) * 1987-12-22 1991-04-16 Cornelius Phaal Abrasive product
US5131190A (en) * 1990-02-23 1992-07-21 C.I.C.E. S.A. Lapping machine and non-constant pitch grooved bed therefor
US5507740A (en) * 1993-05-03 1996-04-16 O'donnell, Jr.; Francis E. Corneal topography enhancement device
US5733178A (en) * 1995-03-02 1998-03-31 Minnesota Mining And Manfacturing Co. Method of texturing a substrate using a structured abrasive article
US5778481A (en) * 1996-02-15 1998-07-14 International Business Machines Corporation Silicon wafer cleaning and polishing pads
US5899799A (en) * 1996-01-19 1999-05-04 Micron Display Technology, Inc. Method and system to increase delivery of slurry to the surface of large substrates during polishing operations
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6066266A (en) * 1998-07-08 2000-05-23 Lsi Logic Corporation In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6248000B1 (en) * 1998-03-24 2001-06-19 Nikon Research Corporation Of America Polishing pad thinning to optically access a semiconductor wafer surface
US6267643B1 (en) * 1999-08-03 2001-07-31 Taiwan Semiconductor Manufacturing Company, Ltd Slotted retaining ring for polishing head and method of using
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US20010031610A1 (en) * 2000-02-25 2001-10-18 Budinger William D. Polishing pad with a transparent portion
US6332830B1 (en) * 1998-08-04 2001-12-25 Shin-Etsu Handotai Co., Ltd. Polishing method and polishing device
US6375550B1 (en) * 2000-06-05 2002-04-23 Lsi Logic Corporation Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer
US6402594B1 (en) * 1999-01-18 2002-06-11 Shin-Etsu Handotai Co., Ltd. Polishing method for wafer and holding plate
US6443810B1 (en) * 2000-04-11 2002-09-03 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing platen equipped with guard ring for chemical mechanical polishing
US6544373B2 (en) * 2001-07-26 2003-04-08 United Microelectronics Corp. Polishing pad for a chemical mechanical polishing process
US6544111B1 (en) * 1998-01-30 2003-04-08 Ebara Corporation Polishing apparatus and polishing table therefor
US20030068964A1 (en) * 2001-10-05 2003-04-10 Governor Of Akita Prefecture Polishing apparatus
US6561890B2 (en) * 1999-12-28 2003-05-13 Ace Inc. Polishing pad
US20030194962A1 (en) * 2000-10-31 2003-10-16 Weber Robert J. Buffing tools and methods of making
US20030199234A1 (en) * 2000-06-29 2003-10-23 Shyng-Tsong Chen Grooved polishing pads and methods of use
US20030207651A1 (en) * 2002-05-06 2003-11-06 Seung-Kon Kim Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20040014413A1 (en) * 2002-06-03 2004-01-22 Jsr Corporation Polishing pad and multi-layer polishing pad
US6702651B2 (en) * 2000-01-18 2004-03-09 Applied Materials Inc. Method and apparatus for conditioning a polishing pad
US20040053570A1 (en) * 2002-09-13 2004-03-18 Markus Naujok Novel finishing pad design for multidirectional use
US20040058630A1 (en) * 2001-08-16 2004-03-25 Inha Park Chemical mechanical polishing pad having holes and or grooves
US20040082271A1 (en) * 1999-01-25 2004-04-29 Wiswesser Andreas Norbert Polishing pad with window
US20040102144A1 (en) * 2001-07-25 2004-05-27 Brown Nathan R. Polishing systems for use with semiconductor substrates including differential pressure application apparatus
US6749486B2 (en) * 2000-02-24 2004-06-15 Tokyo Electron Limited Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method
US20040127145A1 (en) * 2001-07-03 2004-07-01 Shogo Takahashi Perforated-transparent polishing pad
US20040259483A1 (en) * 2003-06-17 2004-12-23 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US20050113011A1 (en) * 2003-11-04 2005-05-26 Jsr Corporation Chemical mechanical polishing pad
US6899611B2 (en) * 1992-08-19 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad for a semiconductor device having a dissolvable substance
US20050142996A1 (en) * 2003-04-11 2005-06-30 Hisatomo Ohno Polishing pad and method of producing same
US20050148183A1 (en) * 2002-08-30 2005-07-07 Toray Industries, Inc. Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device
US20050191945A1 (en) * 2002-03-18 2005-09-01 Angela Petroski Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
US20050211376A1 (en) * 2004-03-25 2005-09-29 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US6951510B1 (en) * 2004-03-12 2005-10-04 Agere Systems, Inc. Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
USD510850S1 (en) * 2002-12-20 2005-10-25 Production Chemical Mfg. Inc. Polishing pad
US6960123B2 (en) * 2004-03-01 2005-11-01 Oki Electric Industry Co., Ltd. Cleaning sheet for probe needles
US20050245171A1 (en) * 2004-04-28 2005-11-03 Jsr Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
US20060037699A1 (en) * 2002-11-27 2006-02-23 Masahiko Nakamori Polishing pad and method for manufacturing semiconductor device
US20060063471A1 (en) * 2004-09-22 2006-03-23 Muldowney Gregory P CMP pad having a streamlined windowpane
US7029747B2 (en) * 2002-09-17 2006-04-18 Korea Polyol Co., Ltd. Integral polishing pad and manufacturing method thereof
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US20060194530A1 (en) * 2005-02-25 2006-08-31 Thomson Clifford O Polishing pad for use in polishing work pieces
US20060199473A1 (en) * 2003-04-03 2006-09-07 Masao Suzuki Polishing pad, process for producing the same and method of polishing therewith
US7112119B1 (en) * 2005-08-26 2006-09-26 Applied Materials, Inc. Sealed polishing pad methods
US7121938B2 (en) * 2002-04-03 2006-10-17 Toho Engineering Kabushiki Kaisha Polishing pad and method of fabricating semiconductor substrate using the pad
US20060276109A1 (en) * 2003-03-24 2006-12-07 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method

Patent Citations (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US88649A (en) * 1869-04-06 Improvement in index for piling circular saws
US494471A (en) * 1893-03-28 Grinding or polishing wheel and the art of manufacturing same
US1092588A (en) * 1914-01-05 1914-04-07 Albert Monkiawicz Grinding-wheel.
US1569403A (en) * 1922-06-03 1926-01-12 Standard Appliance And Souveni Fiber-needle sharpener for talking-machine records
US3046708A (en) * 1959-11-02 1962-07-31 American Optical Corp Lens surfacing technique
US5007207A (en) * 1987-12-22 1991-04-16 Cornelius Phaal Abrasive product
US5131190A (en) * 1990-02-23 1992-07-21 C.I.C.E. S.A. Lapping machine and non-constant pitch grooved bed therefor
US6899611B2 (en) * 1992-08-19 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad for a semiconductor device having a dissolvable substance
US5507740A (en) * 1993-05-03 1996-04-16 O'donnell, Jr.; Francis E. Corneal topography enhancement device
US5733178A (en) * 1995-03-02 1998-03-31 Minnesota Mining And Manfacturing Co. Method of texturing a substrate using a structured abrasive article
US5899799A (en) * 1996-01-19 1999-05-04 Micron Display Technology, Inc. Method and system to increase delivery of slurry to the surface of large substrates during polishing operations
US5778481A (en) * 1996-02-15 1998-07-14 International Business Machines Corporation Silicon wafer cleaning and polishing pads
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US5984769A (en) * 1997-05-15 1999-11-16 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6699115B2 (en) * 1997-05-15 2004-03-02 Applied Materials Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US20020137450A1 (en) * 1997-05-15 2002-09-26 Applied Materials, Inc., A Delaware Corporation Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus
US20040072516A1 (en) * 1997-05-15 2004-04-15 Osterheld Thomas H. Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus
US6645061B1 (en) * 1997-05-15 2003-11-11 Applied Materials, Inc. Polishing pad having a grooved pattern for use in chemical mechanical polishing
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6824455B2 (en) * 1997-05-15 2004-11-30 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US20030092371A1 (en) * 1997-05-15 2003-05-15 Applied Materials, Inc., A Delaware Corporation Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6520847B2 (en) * 1997-05-15 2003-02-18 Applied Materials, Inc. Polishing pad having a grooved pattern for use in chemical mechanical polishing
US6544111B1 (en) * 1998-01-30 2003-04-08 Ebara Corporation Polishing apparatus and polishing table therefor
US6248000B1 (en) * 1998-03-24 2001-06-19 Nikon Research Corporation Of America Polishing pad thinning to optically access a semiconductor wafer surface
US6066266A (en) * 1998-07-08 2000-05-23 Lsi Logic Corporation In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation
US6332830B1 (en) * 1998-08-04 2001-12-25 Shin-Etsu Handotai Co., Ltd. Polishing method and polishing device
US6402594B1 (en) * 1999-01-18 2002-06-11 Shin-Etsu Handotai Co., Ltd. Polishing method for wafer and holding plate
US20040082271A1 (en) * 1999-01-25 2004-04-29 Wiswesser Andreas Norbert Polishing pad with window
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6267643B1 (en) * 1999-08-03 2001-07-31 Taiwan Semiconductor Manufacturing Company, Ltd Slotted retaining ring for polishing head and method of using
US6561890B2 (en) * 1999-12-28 2003-05-13 Ace Inc. Polishing pad
US6702651B2 (en) * 2000-01-18 2004-03-09 Applied Materials Inc. Method and apparatus for conditioning a polishing pad
US6749486B2 (en) * 2000-02-24 2004-06-15 Tokyo Electron Limited Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method
US20010031610A1 (en) * 2000-02-25 2001-10-18 Budinger William D. Polishing pad with a transparent portion
US6517417B2 (en) * 2000-02-25 2003-02-11 Rodel Holdings, Inc. Polishing pad with a transparent portion
US6659850B2 (en) * 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20040259476A1 (en) * 2000-03-31 2004-12-23 Korovin Nikolay N. Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6443810B1 (en) * 2000-04-11 2002-09-03 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing platen equipped with guard ring for chemical mechanical polishing
US6375550B1 (en) * 2000-06-05 2002-04-23 Lsi Logic Corporation Method and apparatus for enhancing uniformity during polishing of a semiconductor wafer
US6685548B2 (en) * 2000-06-29 2004-02-03 International Business Machines Corporation Grooved polishing pads and methods of use
US20030199234A1 (en) * 2000-06-29 2003-10-23 Shyng-Tsong Chen Grooved polishing pads and methods of use
US20030194962A1 (en) * 2000-10-31 2003-10-16 Weber Robert J. Buffing tools and methods of making
US6824447B2 (en) * 2001-07-03 2004-11-30 Rodel Nitta Corporation Perforated-transparent polishing pad
US20040127145A1 (en) * 2001-07-03 2004-07-01 Shogo Takahashi Perforated-transparent polishing pad
US20040102144A1 (en) * 2001-07-25 2004-05-27 Brown Nathan R. Polishing systems for use with semiconductor substrates including differential pressure application apparatus
US6899607B2 (en) * 2001-07-25 2005-05-31 Micron Technology, Inc. Polishing systems for use with semiconductor substrates including differential pressure application apparatus
US7059937B2 (en) * 2001-07-25 2006-06-13 Micron Technology, Inc. Systems including differential pressure application apparatus
US6544373B2 (en) * 2001-07-26 2003-04-08 United Microelectronics Corp. Polishing pad for a chemical mechanical polishing process
US20040058630A1 (en) * 2001-08-16 2004-03-25 Inha Park Chemical mechanical polishing pad having holes and or grooves
US6875096B2 (en) * 2001-08-16 2005-04-05 Skc Co., Ltd. Chemical mechanical polishing pad having holes and or grooves
US20030068964A1 (en) * 2001-10-05 2003-04-10 Governor Of Akita Prefecture Polishing apparatus
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US20050191945A1 (en) * 2002-03-18 2005-09-01 Angela Petroski Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
US7121938B2 (en) * 2002-04-03 2006-10-17 Toho Engineering Kabushiki Kaisha Polishing pad and method of fabricating semiconductor substrate using the pad
US20030207651A1 (en) * 2002-05-06 2003-11-06 Seung-Kon Kim Polishing endpoint detecting method, device for detecting a polishing endpoint of a polishing process and chemical-mechanical polishing apparatus comprising the same
US20040014413A1 (en) * 2002-06-03 2004-01-22 Jsr Corporation Polishing pad and multi-layer polishing pad
US20050148183A1 (en) * 2002-08-30 2005-07-07 Toray Industries, Inc. Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device
US20040053570A1 (en) * 2002-09-13 2004-03-18 Markus Naujok Novel finishing pad design for multidirectional use
US7029747B2 (en) * 2002-09-17 2006-04-18 Korea Polyol Co., Ltd. Integral polishing pad and manufacturing method thereof
US20060037699A1 (en) * 2002-11-27 2006-02-23 Masahiko Nakamori Polishing pad and method for manufacturing semiconductor device
USD510850S1 (en) * 2002-12-20 2005-10-25 Production Chemical Mfg. Inc. Polishing pad
US20060276109A1 (en) * 2003-03-24 2006-12-07 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
US20060199473A1 (en) * 2003-04-03 2006-09-07 Masao Suzuki Polishing pad, process for producing the same and method of polishing therewith
US20050142996A1 (en) * 2003-04-11 2005-06-30 Hisatomo Ohno Polishing pad and method of producing same
US20040259483A1 (en) * 2003-06-17 2004-12-23 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US20050113011A1 (en) * 2003-11-04 2005-05-26 Jsr Corporation Chemical mechanical polishing pad
US6960123B2 (en) * 2004-03-01 2005-11-01 Oki Electric Industry Co., Ltd. Cleaning sheet for probe needles
US6951510B1 (en) * 2004-03-12 2005-10-04 Agere Systems, Inc. Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
US20050211376A1 (en) * 2004-03-25 2005-09-29 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
US20050245171A1 (en) * 2004-04-28 2005-11-03 Jsr Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
US20060063471A1 (en) * 2004-09-22 2006-03-23 Muldowney Gregory P CMP pad having a streamlined windowpane
US20060194530A1 (en) * 2005-02-25 2006-08-31 Thomson Clifford O Polishing pad for use in polishing work pieces
US7112119B1 (en) * 2005-08-26 2006-09-26 Applied Materials, Inc. Sealed polishing pad methods
US20070049167A1 (en) * 2005-08-26 2007-03-01 Applied Materials, Inc. Sealed polishing pad, system and methods

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD581237S1 (en) * 2004-03-17 2008-11-25 Jsr Corporation Polishing pad
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate

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