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USD559066S1 - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
USD559066S1
USD559066S1 US29/228,555 US22855505F USD559066S US D559066 S1 USD559066 S1 US D559066S1 US 22855505 F US22855505 F US 22855505F US D559066 S USD559066 S US D559066S
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US
United States
Prior art keywords
polishing pad
view
partial
enlarged sectional
enlarged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/228,555
Inventor
Hiroyuki Tano
Hiroshi Shiho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Assigned to JSR CORPORATION reassignment JSR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SHIHO, HIROSHI, TANO, HIROYUKI
Priority to US29/295,290 priority Critical patent/USD600989S1/en
Priority to US29/295,294 priority patent/USD592030S1/en
Priority to US29/295,291 priority patent/USD592029S1/en
Priority to US29/295,292 priority patent/USD584591S1/en
Application granted granted Critical
Publication of USD559066S1 publication Critical patent/USD559066S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top plan view of a polishing pad showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevation view, left and right side elevational views being a mirror image of the side shown;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a partial, enlarged view of portion 44 in FIG. 1;
FIG. 5 is a partial, enlarged sectional view taken along line 55 in FIG. 4
FIG. 6 is a partial, enlarged sectional view taken along line 66 in FIG. 4;
FIG. 7 is a partial, greatly enlarged sectional view of portion 7 in FIG. 5; and,
FIG. 8 is a partial, enlarged view of portion 88 in FIG. 1.

Claims (1)

    CLAIM
  1. The ornamental design for a polishing pad, as shown and described.
US29/228,555 2004-10-26 2005-04-26 Polishing pad Expired - Lifetime USD559066S1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US29/295,290 USD600989S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,294 USD592030S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,291 USD592029S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,292 USD584591S1 (en) 2004-10-26 2007-09-25 Polishing pad

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2004-032514 2004-10-26
JP2004032514 2004-10-26
JP2004-032516 2004-10-26
JP2004-032512 2004-10-26
JP2004032515 2004-10-26
JP2004032512 2004-10-26
JP2004032513 2004-10-26
JP2004032516 2004-10-26
JP2004-032513 2004-10-26
JP2004-032515 2004-10-26

Related Child Applications (4)

Application Number Title Priority Date Filing Date
US29/295,292 Division USD584591S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,291 Division USD592029S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,290 Division USD600989S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,294 Division USD592030S1 (en) 2004-10-26 2007-09-25 Polishing pad

Publications (1)

Publication Number Publication Date
USD559066S1 true USD559066S1 (en) 2008-01-08

Family

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Family Applications (5)

Application Number Title Priority Date Filing Date
US29/228,555 Expired - Lifetime USD559066S1 (en) 2004-10-26 2005-04-26 Polishing pad
US29/295,290 Expired - Lifetime USD600989S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,291 Expired - Lifetime USD592029S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,294 Expired - Lifetime USD592030S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,292 Expired - Lifetime USD584591S1 (en) 2004-10-26 2007-09-25 Polishing pad

Family Applications After (4)

Application Number Title Priority Date Filing Date
US29/295,290 Expired - Lifetime USD600989S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,291 Expired - Lifetime USD592029S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,294 Expired - Lifetime USD592030S1 (en) 2004-10-26 2007-09-25 Polishing pad
US29/295,292 Expired - Lifetime USD584591S1 (en) 2004-10-26 2007-09-25 Polishing pad

Country Status (1)

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US (5) USD559066S1 (en)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD581237S1 (en) * 2004-03-17 2008-11-25 Jsr Corporation Polishing pad
USD592030S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
US20090311955A1 (en) * 2008-03-14 2009-12-17 Nexplanar Corporation Grooved CMP pad
US20120190281A1 (en) * 2011-01-26 2012-07-26 Allison William C Polishing pad with concentric or approximately concentric polygon groove pattern
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) * 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795666S1 (en) * 2014-06-06 2017-08-29 Diamond Tool Supply, Inc. Polishing pad
US10414012B2 (en) 2017-01-13 2019-09-17 Husqvarna Construction Products North America, Inc. Grinding pad apparatus
US10246885B2 (en) 2014-09-18 2019-04-02 Husqvarna Construction Products North America, Inc. Grouting pan assembly with reinforcement ring
US9580916B2 (en) 2014-09-18 2017-02-28 Diamond Tool Supply, Inc. Method for finishing a composite surface and a grounting pan for finishing a composite surface
WO2017053737A1 (en) 2015-09-24 2017-03-30 Diamond Tool Supply, Inc. Polishing or grinding pad assembly
USD854902S1 (en) 2016-09-23 2019-07-30 Husqvarna Construction Products North America, Inc. Polishing or grinding pad
USD852601S1 (en) * 2017-04-24 2019-07-02 Ehwa Diamond Ind. Co., Ltd. Polishing pad
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
USD927952S1 (en) * 2017-08-30 2021-08-17 Husqvarna Ab Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
AU201810919S (en) 2017-08-30 2018-04-13 Husqvarna Construction Products North America Polishing or grinding pad assembly with abrasive discs reinforcement and pad
USD958626S1 (en) * 2017-08-30 2022-07-26 Husqvarna Ab Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
US10710214B2 (en) 2018-01-11 2020-07-14 Husqvarna Ab Polishing or grinding pad with multilayer reinforcement

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US88649A (en) * 1869-04-06 Improvement in index for piling circular saws
US494471A (en) * 1893-03-28 Grinding or polishing wheel and the art of manufacturing same
US4693036A (en) * 1983-12-28 1987-09-15 Disco Abrasive Systems, Ltd. Semiconductor wafer surface grinding apparatus
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US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
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US6402594B1 (en) * 1999-01-18 2002-06-11 Shin-Etsu Handotai Co., Ltd. Polishing method for wafer and holding plate
US6422922B1 (en) * 1999-02-12 2002-07-23 Shin-Etsu Handotai Co., Ltd. Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece
US6517417B2 (en) * 2000-02-25 2003-02-11 Rodel Holdings, Inc. Polishing pad with a transparent portion
US20040053566A1 (en) * 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
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USD490827S1 (en) * 2002-12-20 2004-06-01 Ngk Spark Plug Co., Ltd. Electrostatic chuck
US20040127145A1 (en) * 2001-07-03 2004-07-01 Shogo Takahashi Perforated-transparent polishing pad
US20040259483A1 (en) * 2003-06-17 2004-12-23 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US6837780B1 (en) * 1998-11-19 2005-01-04 Lam-Plan S.A. Lapping and polishing device
US20050113011A1 (en) * 2003-11-04 2005-05-26 Jsr Corporation Chemical mechanical polishing pad
US20050142996A1 (en) * 2003-04-11 2005-06-30 Hisatomo Ohno Polishing pad and method of producing same
US20050148183A1 (en) * 2002-08-30 2005-07-07 Toray Industries, Inc. Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device
US20050191945A1 (en) * 2002-03-18 2005-09-01 Angela Petroski Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making
US20050211376A1 (en) * 2004-03-25 2005-09-29 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
USD510850S1 (en) * 2002-12-20 2005-10-25 Production Chemical Mfg. Inc. Polishing pad
US20050245171A1 (en) * 2004-04-28 2005-11-03 Jsr Corporation Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers
US6986706B1 (en) * 2004-08-10 2006-01-17 Universal Photonics, Inc. Polishing pad and method of producing the same
US20060037699A1 (en) * 2002-11-27 2006-02-23 Masahiko Nakamori Polishing pad and method for manufacturing semiconductor device
US20060063471A1 (en) * 2004-09-22 2006-03-23 Muldowney Gregory P CMP pad having a streamlined windowpane
US7029747B2 (en) * 2002-09-17 2006-04-18 Korea Polyol Co., Ltd. Integral polishing pad and manufacturing method thereof
US7112119B1 (en) * 2005-08-26 2006-09-26 Applied Materials, Inc. Sealed polishing pad methods
US20060229002A1 (en) * 2005-04-12 2006-10-12 Muldowney Gregory P Radial-biased polishing pad
US7121938B2 (en) * 2002-04-03 2006-10-17 Toho Engineering Kabushiki Kaisha Polishing pad and method of fabricating semiconductor substrate using the pad
US20060276109A1 (en) * 2003-03-24 2006-12-07 Roy Pradip K Customized polishing pads for CMP and methods of fabrication and use thereof
US7183213B2 (en) * 2003-07-17 2007-02-27 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method

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USD559064S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
USD559063S1 (en) * 2004-03-17 2008-01-08 Jsr Corporation Polishing pad
JP4520327B2 (en) * 2004-03-31 2010-08-04 不二越機械工業株式会社 Water absorption method and water absorption device
US7329174B2 (en) * 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
USD559648S1 (en) * 2004-10-05 2008-01-15 Jsr Corporation Polishing pad
USD559065S1 (en) * 2004-10-05 2008-01-08 Jsr Corporation Polishing pad
USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
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US494471A (en) * 1893-03-28 Grinding or polishing wheel and the art of manufacturing same
US4693036A (en) * 1983-12-28 1987-09-15 Disco Abrasive Systems, Ltd. Semiconductor wafer surface grinding apparatus
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Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD581237S1 (en) * 2004-03-17 2008-11-25 Jsr Corporation Polishing pad
USD592030S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
USD592029S1 (en) * 2004-10-26 2009-05-12 Jsr Corporation Polishing pad
US20090311955A1 (en) * 2008-03-14 2009-12-17 Nexplanar Corporation Grooved CMP pad
US9180570B2 (en) * 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US20120190281A1 (en) * 2011-01-26 2012-07-26 Allison William C Polishing pad with concentric or approximately concentric polygon groove pattern
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
USD678745S1 (en) * 2011-07-07 2013-03-26 Phuong Van Nguyen Spinning insert polishing pad
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) * 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber

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Publication number Publication date
USD600989S1 (en) 2009-09-29
USD584591S1 (en) 2009-01-13
USD592030S1 (en) 2009-05-12
USD592029S1 (en) 2009-05-12

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