USD559066S1 - Polishing pad - Google Patents
Polishing pad Download PDFInfo
- Publication number
- USD559066S1 USD559066S1 US29/228,555 US22855505F USD559066S US D559066 S1 USD559066 S1 US D559066S1 US 22855505 F US22855505 F US 22855505F US D559066 S USD559066 S US D559066S
- Authority
- US
- United States
- Prior art keywords
- polishing pad
- view
- partial
- enlarged sectional
- enlarged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims description 3
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Description
Claims (1)
- The ornamental design for a polishing pad, as shown and described.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/295,290 USD600989S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,294 USD592030S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,291 USD592029S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,292 USD584591S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-032514 | 2004-10-26 | ||
| JP2004032514 | 2004-10-26 | ||
| JP2004-032516 | 2004-10-26 | ||
| JP2004-032512 | 2004-10-26 | ||
| JP2004032515 | 2004-10-26 | ||
| JP2004032512 | 2004-10-26 | ||
| JP2004032513 | 2004-10-26 | ||
| JP2004032516 | 2004-10-26 | ||
| JP2004-032513 | 2004-10-26 | ||
| JP2004-032515 | 2004-10-26 |
Related Child Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/295,292 Division USD584591S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,291 Division USD592029S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,290 Division USD600989S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,294 Division USD592030S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD559066S1 true USD559066S1 (en) | 2008-01-08 |
Family
ID=38893603
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/228,555 Expired - Lifetime USD559066S1 (en) | 2004-10-26 | 2005-04-26 | Polishing pad |
| US29/295,290 Expired - Lifetime USD600989S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,291 Expired - Lifetime USD592029S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,294 Expired - Lifetime USD592030S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,292 Expired - Lifetime USD584591S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/295,290 Expired - Lifetime USD600989S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,291 Expired - Lifetime USD592029S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,294 Expired - Lifetime USD592030S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
| US29/295,292 Expired - Lifetime USD584591S1 (en) | 2004-10-26 | 2007-09-25 | Polishing pad |
Country Status (1)
| Country | Link |
|---|---|
| US (5) | USD559066S1 (en) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD581237S1 (en) * | 2004-03-17 | 2008-11-25 | Jsr Corporation | Polishing pad |
| USD592030S1 (en) * | 2004-10-26 | 2009-05-12 | Jsr Corporation | Polishing pad |
| US20090311955A1 (en) * | 2008-03-14 | 2009-12-17 | Nexplanar Corporation | Grooved CMP pad |
| US20120190281A1 (en) * | 2011-01-26 | 2012-07-26 | Allison William C | Polishing pad with concentric or approximately concentric polygon groove pattern |
| USD678745S1 (en) * | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD902165S1 (en) * | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
| USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD946638S1 (en) | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1053230S1 (en) | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD1072774S1 (en) | 2021-02-06 | 2025-04-29 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD795666S1 (en) * | 2014-06-06 | 2017-08-29 | Diamond Tool Supply, Inc. | Polishing pad |
| US10414012B2 (en) | 2017-01-13 | 2019-09-17 | Husqvarna Construction Products North America, Inc. | Grinding pad apparatus |
| US10246885B2 (en) | 2014-09-18 | 2019-04-02 | Husqvarna Construction Products North America, Inc. | Grouting pan assembly with reinforcement ring |
| US9580916B2 (en) | 2014-09-18 | 2017-02-28 | Diamond Tool Supply, Inc. | Method for finishing a composite surface and a grounting pan for finishing a composite surface |
| WO2017053737A1 (en) | 2015-09-24 | 2017-03-30 | Diamond Tool Supply, Inc. | Polishing or grinding pad assembly |
| USD854902S1 (en) | 2016-09-23 | 2019-07-30 | Husqvarna Construction Products North America, Inc. | Polishing or grinding pad |
| USD852601S1 (en) * | 2017-04-24 | 2019-07-02 | Ehwa Diamond Ind. Co., Ltd. | Polishing pad |
| US10777418B2 (en) * | 2017-06-14 | 2020-09-15 | Rohm And Haas Electronic Materials Cmp Holdings, I | Biased pulse CMP groove pattern |
| US10857648B2 (en) | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | Trapezoidal CMP groove pattern |
| US10857647B2 (en) | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | High-rate CMP polishing method |
| US10861702B2 (en) | 2017-06-14 | 2020-12-08 | Rohm And Haas Electronic Materials Cmp Holdings | Controlled residence CMP polishing method |
| US10586708B2 (en) | 2017-06-14 | 2020-03-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Uniform CMP polishing method |
| USD927952S1 (en) * | 2017-08-30 | 2021-08-17 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad |
| AU201810919S (en) | 2017-08-30 | 2018-04-13 | Husqvarna Construction Products North America | Polishing or grinding pad assembly with abrasive discs reinforcement and pad |
| USD958626S1 (en) * | 2017-08-30 | 2022-07-26 | Husqvarna Ab | Polishing or grinding pad assembly with abrasive disks, reinforcement and pad |
| US10710214B2 (en) | 2018-01-11 | 2020-07-14 | Husqvarna Ab | Polishing or grinding pad with multilayer reinforcement |
Citations (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US88649A (en) * | 1869-04-06 | Improvement in index for piling circular saws | ||
| US494471A (en) * | 1893-03-28 | Grinding or polishing wheel and the art of manufacturing same | ||
| US4693036A (en) * | 1983-12-28 | 1987-09-15 | Disco Abrasive Systems, Ltd. | Semiconductor wafer surface grinding apparatus |
| US5007207A (en) * | 1987-12-22 | 1991-04-16 | Cornelius Phaal | Abrasive product |
| US5400547A (en) * | 1992-02-28 | 1995-03-28 | Shin-Etsu Handotai Co., Ltd. | Polishing machine and method of dissipating heat therefrom |
| USD376744S (en) * | 1994-08-03 | 1996-12-24 | Gerd Eisenblatter Gmbh | Support plate |
| US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
| US5899799A (en) * | 1996-01-19 | 1999-05-04 | Micron Display Technology, Inc. | Method and system to increase delivery of slurry to the surface of large substrates during polishing operations |
| US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| US6033293A (en) * | 1997-10-08 | 2000-03-07 | Lucent Technologies Inc. | Apparatus for performing chemical-mechanical polishing |
| US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
| US6089966A (en) * | 1997-11-25 | 2000-07-18 | Arai; Hatsuyuki | Surface polishing pad |
| US6220942B1 (en) * | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
| US20010005667A1 (en) * | 1999-04-02 | 2001-06-28 | Applied Materials, Inc. | CMP platen with patterned surface |
| US20010034198A1 (en) * | 2000-04-25 | 2001-10-25 | Norio Kimura | Polishing apparatus |
| US6332830B1 (en) * | 1998-08-04 | 2001-12-25 | Shin-Etsu Handotai Co., Ltd. | Polishing method and polishing device |
| US6402594B1 (en) * | 1999-01-18 | 2002-06-11 | Shin-Etsu Handotai Co., Ltd. | Polishing method for wafer and holding plate |
| US6422922B1 (en) * | 1999-02-12 | 2002-07-23 | Shin-Etsu Handotai Co., Ltd. | Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece |
| US6517417B2 (en) * | 2000-02-25 | 2003-02-11 | Rodel Holdings, Inc. | Polishing pad with a transparent portion |
| US20040053566A1 (en) * | 2001-01-12 | 2004-03-18 | Applied Materials, Inc. | CMP platen with patterned surface |
| US20040082271A1 (en) * | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
| USD490827S1 (en) * | 2002-12-20 | 2004-06-01 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| US20040127145A1 (en) * | 2001-07-03 | 2004-07-01 | Shogo Takahashi | Perforated-transparent polishing pad |
| US20040259483A1 (en) * | 2003-06-17 | 2004-12-23 | Cabot Microelectronics Corporation | Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region |
| US6837780B1 (en) * | 1998-11-19 | 2005-01-04 | Lam-Plan S.A. | Lapping and polishing device |
| US20050113011A1 (en) * | 2003-11-04 | 2005-05-26 | Jsr Corporation | Chemical mechanical polishing pad |
| US20050142996A1 (en) * | 2003-04-11 | 2005-06-30 | Hisatomo Ohno | Polishing pad and method of producing same |
| US20050148183A1 (en) * | 2002-08-30 | 2005-07-07 | Toray Industries, Inc. | Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device |
| US20050191945A1 (en) * | 2002-03-18 | 2005-09-01 | Angela Petroski | Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
| US20050211376A1 (en) * | 2004-03-25 | 2005-09-29 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| USD510850S1 (en) * | 2002-12-20 | 2005-10-25 | Production Chemical Mfg. Inc. | Polishing pad |
| US20050245171A1 (en) * | 2004-04-28 | 2005-11-03 | Jsr Corporation | Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers |
| US6986706B1 (en) * | 2004-08-10 | 2006-01-17 | Universal Photonics, Inc. | Polishing pad and method of producing the same |
| US20060037699A1 (en) * | 2002-11-27 | 2006-02-23 | Masahiko Nakamori | Polishing pad and method for manufacturing semiconductor device |
| US20060063471A1 (en) * | 2004-09-22 | 2006-03-23 | Muldowney Gregory P | CMP pad having a streamlined windowpane |
| US7029747B2 (en) * | 2002-09-17 | 2006-04-18 | Korea Polyol Co., Ltd. | Integral polishing pad and manufacturing method thereof |
| US7112119B1 (en) * | 2005-08-26 | 2006-09-26 | Applied Materials, Inc. | Sealed polishing pad methods |
| US20060229002A1 (en) * | 2005-04-12 | 2006-10-12 | Muldowney Gregory P | Radial-biased polishing pad |
| US7121938B2 (en) * | 2002-04-03 | 2006-10-17 | Toho Engineering Kabushiki Kaisha | Polishing pad and method of fabricating semiconductor substrate using the pad |
| US20060276109A1 (en) * | 2003-03-24 | 2006-12-07 | Roy Pradip K | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US7183213B2 (en) * | 2003-07-17 | 2007-02-27 | Jsr Corporation | Chemical mechanical polishing pad and chemical mechanical polishing method |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4087581B2 (en) * | 2001-06-06 | 2008-05-21 | 株式会社荏原製作所 | Polishing equipment |
| USD559064S1 (en) * | 2004-03-17 | 2008-01-08 | Jsr Corporation | Polishing pad |
| USD559063S1 (en) * | 2004-03-17 | 2008-01-08 | Jsr Corporation | Polishing pad |
| JP4520327B2 (en) * | 2004-03-31 | 2010-08-04 | 不二越機械工業株式会社 | Water absorption method and water absorption device |
| US7329174B2 (en) * | 2004-05-20 | 2008-02-12 | Jsr Corporation | Method of manufacturing chemical mechanical polishing pad |
| USD559648S1 (en) * | 2004-10-05 | 2008-01-15 | Jsr Corporation | Polishing pad |
| USD559065S1 (en) * | 2004-10-05 | 2008-01-08 | Jsr Corporation | Polishing pad |
| USD559066S1 (en) * | 2004-10-26 | 2008-01-08 | Jsr Corporation | Polishing pad |
| JP3872081B2 (en) * | 2004-12-29 | 2007-01-24 | 東邦エンジニアリング株式会社 | Polishing pad |
| KR20070070094A (en) * | 2005-12-28 | 2007-07-03 | 제이에스알 가부시끼가이샤 | Chemical mechanical polishing pad and chemical mechanical polishing method |
| KR100741984B1 (en) * | 2006-02-17 | 2007-07-23 | 삼성전자주식회사 | A polishing pad of a chemical mechanical polishing device and a manufacturing method thereof |
| US20080003935A1 (en) * | 2006-07-03 | 2008-01-03 | Chung-Chih Feng | Polishing pad having surface texture |
| JP5080769B2 (en) * | 2006-09-15 | 2012-11-21 | 株式会社東京精密 | Polishing method and polishing apparatus |
-
2005
- 2005-04-26 US US29/228,555 patent/USD559066S1/en not_active Expired - Lifetime
-
2007
- 2007-09-25 US US29/295,290 patent/USD600989S1/en not_active Expired - Lifetime
- 2007-09-25 US US29/295,291 patent/USD592029S1/en not_active Expired - Lifetime
- 2007-09-25 US US29/295,294 patent/USD592030S1/en not_active Expired - Lifetime
- 2007-09-25 US US29/295,292 patent/USD584591S1/en not_active Expired - Lifetime
Patent Citations (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US88649A (en) * | 1869-04-06 | Improvement in index for piling circular saws | ||
| US494471A (en) * | 1893-03-28 | Grinding or polishing wheel and the art of manufacturing same | ||
| US4693036A (en) * | 1983-12-28 | 1987-09-15 | Disco Abrasive Systems, Ltd. | Semiconductor wafer surface grinding apparatus |
| US5007207A (en) * | 1987-12-22 | 1991-04-16 | Cornelius Phaal | Abrasive product |
| US5400547A (en) * | 1992-02-28 | 1995-03-28 | Shin-Etsu Handotai Co., Ltd. | Polishing machine and method of dissipating heat therefrom |
| US5718620A (en) * | 1992-02-28 | 1998-02-17 | Shin-Etsu Handotai | Polishing machine and method of dissipating heat therefrom |
| USD376744S (en) * | 1994-08-03 | 1996-12-24 | Gerd Eisenblatter Gmbh | Support plate |
| US5899799A (en) * | 1996-01-19 | 1999-05-04 | Micron Display Technology, Inc. | Method and system to increase delivery of slurry to the surface of large substrates during polishing operations |
| US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
| US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
| US20020137450A1 (en) * | 1997-05-15 | 2002-09-26 | Applied Materials, Inc., A Delaware Corporation | Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus |
| US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| US5984769A (en) * | 1997-05-15 | 1999-11-16 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US20040072516A1 (en) * | 1997-05-15 | 2004-04-15 | Osterheld Thomas H. | Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus |
| US6645061B1 (en) * | 1997-05-15 | 2003-11-11 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in chemical mechanical polishing |
| US20030092371A1 (en) * | 1997-05-15 | 2003-05-15 | Applied Materials, Inc., A Delaware Corporation | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US6520847B2 (en) * | 1997-05-15 | 2003-02-18 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in chemical mechanical polishing |
| US6033293A (en) * | 1997-10-08 | 2000-03-07 | Lucent Technologies Inc. | Apparatus for performing chemical-mechanical polishing |
| US6089966A (en) * | 1997-11-25 | 2000-07-18 | Arai; Hatsuyuki | Surface polishing pad |
| US6332830B1 (en) * | 1998-08-04 | 2001-12-25 | Shin-Etsu Handotai Co., Ltd. | Polishing method and polishing device |
| US6837780B1 (en) * | 1998-11-19 | 2005-01-04 | Lam-Plan S.A. | Lapping and polishing device |
| US6402594B1 (en) * | 1999-01-18 | 2002-06-11 | Shin-Etsu Handotai Co., Ltd. | Polishing method for wafer and holding plate |
| US20040082271A1 (en) * | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
| US6422922B1 (en) * | 1999-02-12 | 2002-07-23 | Shin-Etsu Handotai Co., Ltd. | Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece |
| US20010005667A1 (en) * | 1999-04-02 | 2001-06-28 | Applied Materials, Inc. | CMP platen with patterned surface |
| US6592438B2 (en) * | 1999-04-02 | 2003-07-15 | Applied Materials Inc. | CMP platen with patterned surface |
| US6220942B1 (en) * | 1999-04-02 | 2001-04-24 | Applied Materials, Inc. | CMP platen with patterned surface |
| US6517417B2 (en) * | 2000-02-25 | 2003-02-11 | Rodel Holdings, Inc. | Polishing pad with a transparent portion |
| US20010034198A1 (en) * | 2000-04-25 | 2001-10-25 | Norio Kimura | Polishing apparatus |
| US20040053566A1 (en) * | 2001-01-12 | 2004-03-18 | Applied Materials, Inc. | CMP platen with patterned surface |
| US20040127145A1 (en) * | 2001-07-03 | 2004-07-01 | Shogo Takahashi | Perforated-transparent polishing pad |
| US6824447B2 (en) * | 2001-07-03 | 2004-11-30 | Rodel Nitta Corporation | Perforated-transparent polishing pad |
| US20050191945A1 (en) * | 2002-03-18 | 2005-09-01 | Angela Petroski | Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making |
| US7121938B2 (en) * | 2002-04-03 | 2006-10-17 | Toho Engineering Kabushiki Kaisha | Polishing pad and method of fabricating semiconductor substrate using the pad |
| US20050148183A1 (en) * | 2002-08-30 | 2005-07-07 | Toray Industries, Inc. | Polishing pad, platen hole cover, polishing apparatus, polishing method, and method for fabricating semiconductor device |
| US7029747B2 (en) * | 2002-09-17 | 2006-04-18 | Korea Polyol Co., Ltd. | Integral polishing pad and manufacturing method thereof |
| US20060037699A1 (en) * | 2002-11-27 | 2006-02-23 | Masahiko Nakamori | Polishing pad and method for manufacturing semiconductor device |
| USD490827S1 (en) * | 2002-12-20 | 2004-06-01 | Ngk Spark Plug Co., Ltd. | Electrostatic chuck |
| USD510850S1 (en) * | 2002-12-20 | 2005-10-25 | Production Chemical Mfg. Inc. | Polishing pad |
| US20060276109A1 (en) * | 2003-03-24 | 2006-12-07 | Roy Pradip K | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US20050142996A1 (en) * | 2003-04-11 | 2005-06-30 | Hisatomo Ohno | Polishing pad and method of producing same |
| US20040259483A1 (en) * | 2003-06-17 | 2004-12-23 | Cabot Microelectronics Corporation | Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region |
| US7183213B2 (en) * | 2003-07-17 | 2007-02-27 | Jsr Corporation | Chemical mechanical polishing pad and chemical mechanical polishing method |
| US20050113011A1 (en) * | 2003-11-04 | 2005-05-26 | Jsr Corporation | Chemical mechanical polishing pad |
| US20050211376A1 (en) * | 2004-03-25 | 2005-09-29 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| US20050245171A1 (en) * | 2004-04-28 | 2005-11-03 | Jsr Corporation | Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers |
| US6986706B1 (en) * | 2004-08-10 | 2006-01-17 | Universal Photonics, Inc. | Polishing pad and method of producing the same |
| US20060063471A1 (en) * | 2004-09-22 | 2006-03-23 | Muldowney Gregory P | CMP pad having a streamlined windowpane |
| US20060229002A1 (en) * | 2005-04-12 | 2006-10-12 | Muldowney Gregory P | Radial-biased polishing pad |
| US7112119B1 (en) * | 2005-08-26 | 2006-09-26 | Applied Materials, Inc. | Sealed polishing pad methods |
| US20070049167A1 (en) * | 2005-08-26 | 2007-03-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
Non-Patent Citations (2)
| Title |
|---|
| U.S. Appl. No. 11/132,365, filed May 19, 2005, Shiho et al. |
| U.S. Appl. No. 29/228,555, filed Apr. 26, 2005, Tano et al. |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD581237S1 (en) * | 2004-03-17 | 2008-11-25 | Jsr Corporation | Polishing pad |
| USD592030S1 (en) * | 2004-10-26 | 2009-05-12 | Jsr Corporation | Polishing pad |
| USD592029S1 (en) * | 2004-10-26 | 2009-05-12 | Jsr Corporation | Polishing pad |
| US20090311955A1 (en) * | 2008-03-14 | 2009-12-17 | Nexplanar Corporation | Grooved CMP pad |
| US9180570B2 (en) * | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| US20120190281A1 (en) * | 2011-01-26 | 2012-07-26 | Allison William C | Polishing pad with concentric or approximately concentric polygon groove pattern |
| US9211628B2 (en) * | 2011-01-26 | 2015-12-15 | Nexplanar Corporation | Polishing pad with concentric or approximately concentric polygon groove pattern |
| USD678745S1 (en) * | 2011-07-07 | 2013-03-26 | Phuong Van Nguyen | Spinning insert polishing pad |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD894137S1 (en) | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD946638S1 (en) | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD902165S1 (en) * | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD908645S1 (en) | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
| USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD970566S1 (en) | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD937329S1 (en) | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD940765S1 (en) | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD966357S1 (en) | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1072774S1 (en) | 2021-02-06 | 2025-04-29 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1007449S1 (en) | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1053230S1 (en) | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| USD600989S1 (en) | 2009-09-29 |
| USD584591S1 (en) | 2009-01-13 |
| USD592030S1 (en) | 2009-05-12 |
| USD592029S1 (en) | 2009-05-12 |
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