[go: up one dir, main page]

USD446525S1 - IC memory card - Google Patents

IC memory card Download PDF

Info

Publication number
USD446525S1
USD446525S1 US29/119,086 US11908600F USD446525S US D446525 S1 USD446525 S1 US D446525S1 US 11908600 F US11908600 F US 11908600F US D446525 S USD446525 S US D446525S
Authority
US
United States
Prior art keywords
memory card
view
ornamental design
elevational view
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/119,086
Inventor
Kosei Okamoto
Takashi Torii
Yosi Pinto
Dan Auclair
Yoram Cedar
Bob Wallace
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SD-3C LLC
Original Assignee
Toshiba Corp
Matsushita Electric Industrial Co Ltd
SanDisk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Matsushita Electric Industrial Co Ltd, SanDisk Corp filed Critical Toshiba Corp
Assigned to SANDISK CORPORATION reassignment SANDISK CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AUCLAIR, DAN, CEDAR, YORAM, WALLACE, BOB, PINTO, YOSHI
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAMOTO, KOSEI
Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TORRI, TAKASHI
Application granted granted Critical
Publication of USD446525S1 publication Critical patent/USD446525S1/en
Assigned to SD-3C, LLC reassignment SD-3C, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SANDISK CORPORATION, TOSHIBA CORPORATION, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 is a top, front and right side perspective view of IC memory card showing our new design,
FIG. 2 is a front elevational view thereof,
FIG. 3 is a right side elevational view thereof,
FIG. 4 is a left side elevational view thereof,
FIG. 5 is a top plan view thereof,
FIG. 6 is a bottom plan view thereof,
FIG. 7 is a rear elevational view thereof; and,
FIG. 8 is a top, rear and right side perspective view thereof.

Claims (1)

  1. The ornamental design for IC memory card, as shown and described.
US29/119,086 1999-08-24 2000-02-23 IC memory card Expired - Lifetime USD446525S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11-22609 1999-08-24
JP2260999 1999-08-24

Publications (1)

Publication Number Publication Date
USD446525S1 true USD446525S1 (en) 2001-08-14

Family

ID=12087593

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/119,086 Expired - Lifetime USD446525S1 (en) 1999-08-24 2000-02-23 IC memory card

Country Status (1)

Country Link
US (1) USD446525S1 (en)

Cited By (142)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD457887S1 (en) 2001-09-28 2002-05-28 Sony Corporation Recording medium
USD458935S1 (en) 2001-02-16 2002-06-18 Kabushiki Kaisha Toshiba Communications card
USD459355S1 (en) 2001-03-16 2002-06-25 Kabushiki Kaisha Toshiba IC memory card
USD460456S1 (en) 2001-03-16 2002-07-16 Kabushiki Kaisha Toshiba IC memory card
USD466872S1 (en) 2001-07-05 2002-12-10 Sony Corporation Cartridge
USD467586S1 (en) 2001-03-16 2002-12-24 Kabushiki Kaisha Toshiba IC memory card
USD474774S1 (en) 2002-02-20 2003-05-20 Kabushiki Kaisha Toshiba IC card
USD475056S1 (en) 2002-02-20 2003-05-27 Kabushiki Kaisha Toshiba IC card
USD475055S1 (en) 2002-02-20 2003-05-27 Kabushiki Kaisha Toshiba Portion of an IC card
US6570825B2 (en) 2001-08-21 2003-05-27 Amkor Technology, Inc. Method and circuit module package for automated switch actuator insertion
USD475713S1 (en) 2002-02-20 2003-06-10 Kabushiki Kaisha Toshiba IC card
USD475712S1 (en) 2002-02-20 2003-06-10 Kabushiki Kaisha Toshiba Portion of an IC card
USD475714S1 (en) 2002-02-20 2003-06-10 Kabushiki Kaisha Toshiba Portion of an IC card
USD475711S1 (en) 2002-02-20 2003-06-10 Kabushiki Kaisha Toshiba Portion of an IC card
USD476011S1 (en) 2002-02-20 2003-06-17 Kabushiki Kaisha Toshiba IC card
USD476012S1 (en) 2002-02-20 2003-06-17 Kabushiki Kaisha Toshiba IC card
US20030133262A1 (en) * 2002-01-17 2003-07-17 Minne' Mark W. Form factor card with status indicator
USD479845S1 (en) 2002-02-20 2003-09-23 Kabushiki Kaisha Toshiba IC card
US6632997B2 (en) 2001-06-13 2003-10-14 Amkor Technology, Inc. Personalized circuit module package and method for packaging circuit modules
US6646885B1 (en) * 2002-10-03 2003-11-11 C-One Technology Corp. Enhanced electronic card structure
US6717822B1 (en) 2002-09-20 2004-04-06 Amkor Technology, Inc. Lead-frame method and circuit module assembly including edge stiffener
USD488476S1 (en) 2002-12-13 2004-04-13 C-One Technology Corp. Removable dual-head electronic card
USD488475S1 (en) 2002-12-13 2004-04-13 C-One Technology Corp. Removable electronic card
USD488477S1 (en) 2002-12-13 2004-04-13 C-One Technology Corp. Removable electronic card
USD492688S1 (en) 2002-12-09 2004-07-06 Sandisk Corporation Memory card
USD493466S1 (en) 2003-10-13 2004-07-27 C-One Technology Corporation Memory card
USD494180S1 (en) 2003-05-07 2004-08-10 Kabushiki Kaisha Toshiba IC card
US6816032B1 (en) 2002-09-03 2004-11-09 Amkor Technology, Inc. Laminated low-profile dual filter module for telecommunications devices and method therefor
USD498760S1 (en) 2003-12-30 2004-11-23 Siliconware Precision Industries Co., Ltd. Digital memory card
USD499100S1 (en) 2003-06-10 2004-11-30 Home Diagnostics, Inc. Removable memory module for a meter
US20050011671A1 (en) * 2003-07-17 2005-01-20 Takiar Hem P. Memory card with and without enclosure
US20050041398A1 (en) * 2002-05-01 2005-02-24 Huemoeller Ronald Patrick Integrated circuit substrate having embedded back-side access conductors and vias
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
USD505959S1 (en) * 2002-10-15 2005-06-07 Matsushita Electric Industrial Co., Ltd. IC memory card
US6911718B1 (en) 2003-07-03 2005-06-28 Amkor Technology, Inc. Double downset double dambar suspended leadframe
US6910635B1 (en) 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
US20050230484A1 (en) * 2004-04-16 2005-10-20 Cuellar Edwin J Memory cards having two standard sets of contacts
US20050230483A1 (en) * 2004-04-16 2005-10-20 Miller Robert C Memory card with two standard sets of contacts and a contact covering mechanism
USD510935S1 (en) 2002-10-15 2005-10-25 Matsushita Electric Industrial Co., Ltd. IC memory card
US6967124B1 (en) 2001-06-19 2005-11-22 Amkor Technology, Inc. Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
USD515586S1 (en) 2004-04-16 2006-02-21 Sandisk Corporation Memory card with two sets of contacts
US7019387B1 (en) 2002-02-14 2006-03-28 Amkor Technology, Inc. Lead-frame connector and circuit module assembly
USD523435S1 (en) 2003-07-17 2006-06-20 Sandisk Corporation Memory card
US7074654B1 (en) 2004-04-21 2006-07-11 Amkor Technology, Inc. Tape supported memory card leadframe structure
USD525248S1 (en) 2003-07-17 2006-07-18 Sandisk Corporation Memory card
USD525978S1 (en) 2003-07-17 2006-08-01 Sandisk Corporation Memory card
US7092256B1 (en) 2002-04-26 2006-08-15 Sandisk Corporation Retractable card adapter
US7102214B1 (en) 2002-12-26 2006-09-05 Amkor Technology, Inc. Pre-molded leadframe
US7102891B1 (en) 2003-07-23 2006-09-05 Amkor Technology, Inc. Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
US7112875B1 (en) 2005-02-17 2006-09-26 Amkor Technology, Inc. Secure digital memory card using land grid array structure
USD531181S1 (en) * 2004-04-16 2006-10-31 Sandisk Corporation Combined memory card and carrier assembly
US7145238B1 (en) 2004-05-05 2006-12-05 Amkor Technology, Inc. Semiconductor package and substrate having multi-level vias
USD536382S1 (en) 2004-04-07 2007-02-06 Nintendo Co., Ltd. Information storage cartridge for electronic game machine
USD537081S1 (en) 2003-07-17 2007-02-20 Sandisk Corporation Memory card
USD537824S1 (en) * 2005-05-19 2007-03-06 Sandisk Corporation Flash memory card with translucent cover
US7185426B1 (en) 2002-05-01 2007-03-06 Amkor Technology, Inc. Method of manufacturing a semiconductor package
US7193305B1 (en) 2004-11-03 2007-03-20 Amkor Technology, Inc. Memory card ESC substrate insert
US7201327B1 (en) 2004-10-18 2007-04-10 Amkor Technology, Inc. Memory card and its manufacturing method
USD542797S1 (en) 2005-08-02 2007-05-15 Sandisk Corporation Memory card with a contact covering lid
US7220915B1 (en) 2005-02-17 2007-05-22 Amkor Technology, Inc. Memory card and its manufacturing method
USD552099S1 (en) * 2005-05-24 2007-10-02 Renesas Technology Corporation Memory card
USD552098S1 (en) * 2005-05-24 2007-10-02 Renesas Technology Corporation Memory card
USD552612S1 (en) * 2005-05-24 2007-10-09 Renesas Technology Corporation Memory card
US20070270040A1 (en) * 2006-05-05 2007-11-22 Jang Sang J Chamfered Memory Card
US7307848B2 (en) 2003-07-17 2007-12-11 Sandisk Corporation Memory card with raised portion
US20080043447A1 (en) * 2002-05-01 2008-02-21 Amkor Technology, Inc. Semiconductor package having laser-embedded terminals
US7334326B1 (en) 2001-06-19 2008-02-26 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded passive components
US7359204B1 (en) 2006-02-15 2008-04-15 Amkor Technology, Inc. Multiple cover memory card
US7358600B1 (en) 2003-05-01 2008-04-15 Amkor Technology, Inc. Interposer for interconnecting components in a memory card
US7375975B1 (en) 2005-10-31 2008-05-20 Amkor Technology, Inc. Enhanced durability memory card
US20080169541A1 (en) * 2001-09-19 2008-07-17 Jeffrey Alan Miks Enhanced durability multimedia card
USD579940S1 (en) * 2007-03-15 2008-11-04 Technologies Humanware Canada, Inc. Cartridge
USD585068S1 (en) * 2007-11-09 2009-01-20 Vizio, Inc Memory card with contact exposing openings
US20090021921A1 (en) * 2005-04-26 2009-01-22 Amkor Technology, Inc. Memory card and its manufacturing method
USD588133S1 (en) 2007-12-17 2009-03-10 Panasonic Corporation IC memory card
US7501338B1 (en) 2001-06-19 2009-03-10 Amkor Technology, Inc. Semiconductor package substrate fabrication method
USD588134S1 (en) 2008-01-11 2009-03-10 Panasonic Corporation IC memory card
USD588135S1 (en) 2008-04-01 2009-03-10 Panasonic Corporation IC memory card
USD588597S1 (en) 2007-12-17 2009-03-17 Panasonic Corporation IC memory card
USD588598S1 (en) 2008-04-01 2009-03-17 Panasonic Corporation IC memory card
USD588599S1 (en) 2008-04-01 2009-03-17 Panasonic Corporation IC memory card
US7548430B1 (en) 2002-05-01 2009-06-16 Amkor Technology, Inc. Buildup dielectric and metallization process and semiconductor package
US7550857B1 (en) 2006-11-16 2009-06-23 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
US7556986B1 (en) 2004-04-21 2009-07-07 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7589398B1 (en) 2006-10-04 2009-09-15 Amkor Technology, Inc. Embedded metal features structure
US7633765B1 (en) 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US7633763B1 (en) 2004-01-28 2009-12-15 Amkor Technology, Inc. Double mold memory card and its manufacturing method
US7670962B2 (en) 2002-05-01 2010-03-02 Amkor Technology, Inc. Substrate having stiffener fabrication method
US7710736B2 (en) 2005-08-02 2010-05-04 Sandisk Corporation Memory card with latching mechanism for hinged cover
US7719845B1 (en) 2005-04-26 2010-05-18 Amkor Technology, Inc. Chamfered memory card module and method of making same
US7750250B1 (en) 2006-12-22 2010-07-06 Amkor Technology, Inc. Blind via capture pad structure
US7752752B1 (en) 2007-01-09 2010-07-13 Amkor Technology, Inc. Method of fabricating an embedded circuit pattern
US7837120B1 (en) 2005-11-29 2010-11-23 Amkor Technology, Inc. Modular memory card and method of making same
USD628202S1 (en) * 2009-10-20 2010-11-30 Sandisk Corporation MicroSD memory card with different color surfaces
US7864540B2 (en) 2003-07-17 2011-01-04 Sandisk Corporation Peripheral card with sloped edges
USD638431S1 (en) * 2009-10-20 2011-05-24 Sandisk Corporation MicroSD memory card with a semi-transparent color surface
USD639302S1 (en) * 2010-05-17 2011-06-07 Panasonic Corporation Memory card
USD639812S1 (en) * 2010-05-17 2011-06-14 Panasonic Corporation Memory card
US7960827B1 (en) 2009-04-09 2011-06-14 Amkor Technology, Inc. Thermal via heat spreader package and method
USD643040S1 (en) * 2010-10-26 2011-08-09 Hon Hai Precision Ind. Co., Ltd. Electrical card
USD643431S1 (en) * 2010-05-17 2011-08-16 Panasonic Corporation Memory card
USD643432S1 (en) * 2010-05-17 2011-08-16 Panasonic Corporation Memory card
US8222538B1 (en) 2009-06-12 2012-07-17 Amkor Technology, Inc. Stackable via package and method
USD667830S1 (en) * 2011-11-29 2012-09-25 Samsung Electronics Co., Ltd. SD memory card
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8300423B1 (en) 2010-05-25 2012-10-30 Amkor Technology, Inc. Stackable treated via package and method
USD670292S1 (en) * 2011-05-17 2012-11-06 Sony Computer Entertainment Inc. Recording medium
US8323771B1 (en) 2007-08-15 2012-12-04 Amkor Technology, Inc. Straight conductor blind via capture pad structure and fabrication method
US8337657B1 (en) 2010-10-27 2012-12-25 Amkor Technology, Inc. Mechanical tape separation package and method
US8338229B1 (en) 2010-07-30 2012-12-25 Amkor Technology, Inc. Stackable plasma cleaned via package and method
US8471154B1 (en) 2009-08-06 2013-06-25 Amkor Technology, Inc. Stackable variable height via package and method
US8482134B1 (en) 2010-11-01 2013-07-09 Amkor Technology, Inc. Stackable package and method
US8525318B1 (en) 2010-11-10 2013-09-03 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8536462B1 (en) 2010-01-22 2013-09-17 Amkor Technology, Inc. Flex circuit package and method
US8535961B1 (en) 2010-12-09 2013-09-17 Amkor Technology, Inc. Light emitting diode (LED) package and method
US8557629B1 (en) 2010-12-03 2013-10-15 Amkor Technology, Inc. Semiconductor device having overlapped via apertures
US8623753B1 (en) 2009-05-28 2014-01-07 Amkor Technology, Inc. Stackable protruding via package and method
US8633598B1 (en) 2011-09-20 2014-01-21 Amkor Technology, Inc. Underfill contacting stacking balls package fabrication method and structure
US8653674B1 (en) 2011-09-15 2014-02-18 Amkor Technology, Inc. Electronic component package fabrication method and structure
USD700183S1 (en) * 2012-08-30 2014-02-25 Nifty Drives Ltd Computer accessory
US8690283B2 (en) 2009-10-20 2014-04-08 Sandisk Il Ltd. Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device
US8717775B1 (en) 2010-08-02 2014-05-06 Amkor Technology, Inc. Fingerprint sensor package and method
USD704192S1 (en) * 2012-08-30 2014-05-06 Nifty Drives Ltd Computer accessory
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
US8826531B1 (en) 2005-04-05 2014-09-09 Amkor Technology, Inc. Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
US8872329B1 (en) 2009-01-09 2014-10-28 Amkor Technology, Inc. Extended landing pad substrate package structure and method
US8890329B2 (en) 2011-04-26 2014-11-18 Amkor Technology, Inc. Semiconductor device
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
USD726189S1 (en) * 2014-04-03 2015-04-07 Transcend Information, Inc. Secure digital card
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
US9029962B1 (en) 2011-10-12 2015-05-12 Amkor Technology, Inc. Molded cavity substrate MEMS package fabrication method and structure
US9391043B2 (en) 2012-11-20 2016-07-12 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9543242B1 (en) 2013-01-29 2017-01-10 Amkor Technology, Inc. Semiconductor package and fabricating method thereof
US9691635B1 (en) 2002-05-01 2017-06-27 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US9704842B2 (en) 2013-11-04 2017-07-11 Amkor Technology, Inc. Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package
US9704747B2 (en) 2013-03-29 2017-07-11 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9721872B1 (en) 2011-02-18 2017-08-01 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
US9748154B1 (en) 2010-11-04 2017-08-29 Amkor Technology, Inc. Wafer level fan out semiconductor device and manufacturing method thereof
US9960328B2 (en) 2016-09-06 2018-05-01 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US10811277B2 (en) 2004-03-23 2020-10-20 Amkor Technology, Inc. Encapsulated semiconductor package
US11081370B2 (en) 2004-03-23 2021-08-03 Amkor Technology Singapore Holding Pte. Ltd. Methods of manufacturing an encapsulated semiconductor device

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD267714S (en) 1980-02-01 1983-01-25 Victor Company Of Japan, Limited Pre-recorded cartridge video/audio disk
USD311391S (en) 1987-09-08 1990-10-16 Kabushiki Kaisha Toshiba Data recording cartridge for language learning machine
USD368082S (en) 1994-05-07 1996-03-19 Sony Corporation Memory card
USD369156S (en) 1994-09-20 1996-04-23 Kabushiki Kaisha Toshiba IC Card
USD369157S (en) 1995-03-16 1996-04-23 Kabushiki Kaisha Toshiba IC card
USD371548S (en) 1993-11-30 1996-07-09 Kabushiki Kaisha Toshiba Optical disk cartridge
USD374436S (en) 1993-11-30 1996-10-08 Kabushiki Kaisha Toshiba Optical disk cartridge
USD375941S (en) 1992-12-08 1996-11-26 International Business Machines Corporation Top, front, rear, left and right sides of an enlarged jacketed circuit card
USD405441S (en) 1997-09-04 1999-02-09 Citizen Watch Co., Ltd. IC card
USD407392S (en) 1997-06-23 1999-03-30 Siemens Aktiengesellschaft Chipcard
USD410913S (en) 1997-10-13 1999-06-15 Citizen Watch Co., Ltd. LC card
USD415132S (en) 1998-04-08 1999-10-12 Honda Tsushin Kogyo Co., Ltd. Memory card
USD416886S (en) 1998-12-24 1999-11-23 Honda Tsushin Kogyo Co., Ltd. Compact flash card
USD417212S (en) 1997-08-06 1999-11-30 Sony Corporation Case for semiconductor element
US6097605A (en) 1995-11-25 2000-08-01 Stocko Metallwaren Fabriken Henkels Und Sohn Gmbh & Co. Contacting unit for card-shaped support elements for electronic components
US6108209A (en) 1995-07-24 2000-08-22 International Business Machines Corporation Snap together PCMCIA cards with laser tack welded seams

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD267714S (en) 1980-02-01 1983-01-25 Victor Company Of Japan, Limited Pre-recorded cartridge video/audio disk
USD311391S (en) 1987-09-08 1990-10-16 Kabushiki Kaisha Toshiba Data recording cartridge for language learning machine
USD375941S (en) 1992-12-08 1996-11-26 International Business Machines Corporation Top, front, rear, left and right sides of an enlarged jacketed circuit card
USD377344S (en) 1993-11-30 1997-01-14 Kabushiki Kaisha Toshiba Optical disk cartridge
USD371548S (en) 1993-11-30 1996-07-09 Kabushiki Kaisha Toshiba Optical disk cartridge
USD374436S (en) 1993-11-30 1996-10-08 Kabushiki Kaisha Toshiba Optical disk cartridge
USD368082S (en) 1994-05-07 1996-03-19 Sony Corporation Memory card
USD369156S (en) 1994-09-20 1996-04-23 Kabushiki Kaisha Toshiba IC Card
USD369157S (en) 1995-03-16 1996-04-23 Kabushiki Kaisha Toshiba IC card
US6108209A (en) 1995-07-24 2000-08-22 International Business Machines Corporation Snap together PCMCIA cards with laser tack welded seams
US6097605A (en) 1995-11-25 2000-08-01 Stocko Metallwaren Fabriken Henkels Und Sohn Gmbh & Co. Contacting unit for card-shaped support elements for electronic components
USD407392S (en) 1997-06-23 1999-03-30 Siemens Aktiengesellschaft Chipcard
USD417212S (en) 1997-08-06 1999-11-30 Sony Corporation Case for semiconductor element
USD405441S (en) 1997-09-04 1999-02-09 Citizen Watch Co., Ltd. IC card
USD410913S (en) 1997-10-13 1999-06-15 Citizen Watch Co., Ltd. LC card
USD415132S (en) 1998-04-08 1999-10-12 Honda Tsushin Kogyo Co., Ltd. Memory card
USD416886S (en) 1998-12-24 1999-11-23 Honda Tsushin Kogyo Co., Ltd. Compact flash card

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Panasonic Catalog, cover page, and pp. 3, 4, 13, 15 and 16, dated 1999.
San Disk, MultiMedia Card Product Manual, pp. 1, 2, 3 and 17, dated 1999.
SanDisk Compact Flash™ and MultimediaCard Brochure, dated Oct. 2000.
SanDisk Memory Cards and Connectivity Solutions Brochure, dated Oct. 2000.
SanDisk MultiMedia Card, Product/Applications Background Report, dated May 2000.

Cited By (240)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD458935S1 (en) 2001-02-16 2002-06-18 Kabushiki Kaisha Toshiba Communications card
USD459355S1 (en) 2001-03-16 2002-06-25 Kabushiki Kaisha Toshiba IC memory card
USD460456S1 (en) 2001-03-16 2002-07-16 Kabushiki Kaisha Toshiba IC memory card
USD467586S1 (en) 2001-03-16 2002-12-24 Kabushiki Kaisha Toshiba IC memory card
US6632997B2 (en) 2001-06-13 2003-10-14 Amkor Technology, Inc. Personalized circuit module package and method for packaging circuit modules
US6967124B1 (en) 2001-06-19 2005-11-22 Amkor Technology, Inc. Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
US7501338B1 (en) 2001-06-19 2009-03-10 Amkor Technology, Inc. Semiconductor package substrate fabrication method
US7334326B1 (en) 2001-06-19 2008-02-26 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded passive components
USD466872S1 (en) 2001-07-05 2002-12-10 Sony Corporation Cartridge
US6570825B2 (en) 2001-08-21 2003-05-27 Amkor Technology, Inc. Method and circuit module package for automated switch actuator insertion
US20080169541A1 (en) * 2001-09-19 2008-07-17 Jeffrey Alan Miks Enhanced durability multimedia card
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
USD457887S1 (en) 2001-09-28 2002-05-28 Sony Corporation Recording medium
US6762930B2 (en) 2002-01-17 2004-07-13 Hewlett-Packard Development Company, L.P. Form factor card with status indicator
US20030133262A1 (en) * 2002-01-17 2003-07-17 Minne' Mark W. Form factor card with status indicator
US7019387B1 (en) 2002-02-14 2006-03-28 Amkor Technology, Inc. Lead-frame connector and circuit module assembly
USD475056S1 (en) 2002-02-20 2003-05-27 Kabushiki Kaisha Toshiba IC card
USD475712S1 (en) 2002-02-20 2003-06-10 Kabushiki Kaisha Toshiba Portion of an IC card
USD476012S1 (en) 2002-02-20 2003-06-17 Kabushiki Kaisha Toshiba IC card
USD474774S1 (en) 2002-02-20 2003-05-20 Kabushiki Kaisha Toshiba IC card
USD476011S1 (en) 2002-02-20 2003-06-17 Kabushiki Kaisha Toshiba IC card
USD475711S1 (en) 2002-02-20 2003-06-10 Kabushiki Kaisha Toshiba Portion of an IC card
USD475055S1 (en) 2002-02-20 2003-05-27 Kabushiki Kaisha Toshiba Portion of an IC card
USD475713S1 (en) 2002-02-20 2003-06-10 Kabushiki Kaisha Toshiba IC card
USD479845S1 (en) 2002-02-20 2003-09-23 Kabushiki Kaisha Toshiba IC card
USD475714S1 (en) 2002-02-20 2003-06-10 Kabushiki Kaisha Toshiba Portion of an IC card
US20090201638A1 (en) * 2002-04-26 2009-08-13 Salazar Jeffrey A Retractable card adapter
US7492601B2 (en) 2002-04-26 2009-02-17 Sandisk Corporation Retractable card adapter
US7787243B2 (en) 2002-04-26 2010-08-31 Sandisk Corporation Retractable card adapter
US20070274117A1 (en) * 2002-04-26 2007-11-29 Salazar Jeffrey A Retractable card adapter
US7092256B1 (en) 2002-04-26 2006-08-15 Sandisk Corporation Retractable card adapter
US7312103B1 (en) 2002-05-01 2007-12-25 Amkor Technology, Inc. Method for making an integrated circuit substrate having laser-embedded conductive patterns
US7670962B2 (en) 2002-05-01 2010-03-02 Amkor Technology, Inc. Substrate having stiffener fabrication method
US7671457B1 (en) 2002-05-01 2010-03-02 Amkor Technology, Inc. Semiconductor package including top-surface terminals for mounting another semiconductor package
US7185426B1 (en) 2002-05-01 2007-03-06 Amkor Technology, Inc. Method of manufacturing a semiconductor package
US20050041398A1 (en) * 2002-05-01 2005-02-24 Huemoeller Ronald Patrick Integrated circuit substrate having embedded back-side access conductors and vias
US8322030B1 (en) 2002-05-01 2012-12-04 Amkor Technology, Inc. Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
US7399661B2 (en) 2002-05-01 2008-07-15 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded back-side access conductors and vias
US20080043447A1 (en) * 2002-05-01 2008-02-21 Amkor Technology, Inc. Semiconductor package having laser-embedded terminals
US7548430B1 (en) 2002-05-01 2009-06-16 Amkor Technology, Inc. Buildup dielectric and metallization process and semiconductor package
US9691635B1 (en) 2002-05-01 2017-06-27 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
US9812386B1 (en) 2002-05-01 2017-11-07 Amkor Technology, Inc. Encapsulated semiconductor package
US8026587B1 (en) 2002-05-01 2011-09-27 Amkor Technology, Inc. Semiconductor package including top-surface terminals for mounting another semiconductor package
US10461006B1 (en) 2002-05-01 2019-10-29 Amkor Technology, Inc. Encapsulated semiconductor package
US8316536B1 (en) 2002-05-01 2012-11-27 Amkor Technology, Inc. Multi-level circuit substrate fabrication method
US8341835B1 (en) 2002-05-01 2013-01-01 Amkor Technology, Inc. Buildup dielectric layer having metallization pattern semiconductor package fabrication method
US7297562B1 (en) 2002-05-01 2007-11-20 Amkor Technology, Inc. Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
US8110909B1 (en) 2002-05-01 2012-02-07 Amkor Technology, Inc. Semiconductor package including top-surface terminals for mounting another semiconductor package
US6816032B1 (en) 2002-09-03 2004-11-09 Amkor Technology, Inc. Laminated low-profile dual filter module for telecommunications devices and method therefor
US6717822B1 (en) 2002-09-20 2004-04-06 Amkor Technology, Inc. Lead-frame method and circuit module assembly including edge stiffener
US6646885B1 (en) * 2002-10-03 2003-11-11 C-One Technology Corp. Enhanced electronic card structure
US7011251B1 (en) 2002-10-08 2006-03-14 Amkor Technology, Inc. Die down multi-media card and method of making same
US6910635B1 (en) 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
USD510935S1 (en) 2002-10-15 2005-10-25 Matsushita Electric Industrial Co., Ltd. IC memory card
USD517072S1 (en) * 2002-10-15 2006-03-14 Matsushita Electric Industrial Co., Ltd. IC memory card
USD505959S1 (en) * 2002-10-15 2005-06-07 Matsushita Electric Industrial Co., Ltd. IC memory card
USD507795S1 (en) 2002-10-15 2005-07-26 Matsushita Electric Industrial Co., Ltd. IC memory card
USD510579S1 (en) 2002-10-15 2005-10-11 Matsushita Electric Industrial Co., Ltd. IC memory card
USD533556S1 (en) 2002-10-15 2006-12-12 Matsushita Electric Industrial Co., Ltd. IC memory card
USD492688S1 (en) 2002-12-09 2004-07-06 Sandisk Corporation Memory card
USD492686S1 (en) 2002-12-13 2004-07-06 C-One Technology Corp. Removable dual-head electronic card
USD491951S1 (en) 2002-12-13 2004-06-22 C-One Technology Corp. Removable electronic card
USD492687S1 (en) 2002-12-13 2004-07-06 C-One Technology Corp. Removable electronic card
USD488477S1 (en) 2002-12-13 2004-04-13 C-One Technology Corp. Removable electronic card
USD488475S1 (en) 2002-12-13 2004-04-13 C-One Technology Corp. Removable electronic card
USD488476S1 (en) 2002-12-13 2004-04-13 C-One Technology Corp. Removable dual-head electronic card
US7102214B1 (en) 2002-12-26 2006-09-05 Amkor Technology, Inc. Pre-molded leadframe
US7358600B1 (en) 2003-05-01 2008-04-15 Amkor Technology, Inc. Interposer for interconnecting components in a memory card
USD494180S1 (en) 2003-05-07 2004-08-10 Kabushiki Kaisha Toshiba IC card
USD499100S1 (en) 2003-06-10 2004-11-30 Home Diagnostics, Inc. Removable memory module for a meter
US6911718B1 (en) 2003-07-03 2005-06-28 Amkor Technology, Inc. Double downset double dambar suspended leadframe
USD537081S1 (en) 2003-07-17 2007-02-20 Sandisk Corporation Memory card
US7306160B2 (en) 2003-07-17 2007-12-11 Sandisk Corporation Memory card with adapter
USD538286S1 (en) 2003-07-17 2007-03-13 Sandisk Corporation Memory card
USD525248S1 (en) 2003-07-17 2006-07-18 Sandisk Corporation Memory card
USD525623S1 (en) 2003-07-17 2006-07-25 Sandisk Corporation Memory card
US7336498B2 (en) 2003-07-17 2008-02-26 Sandisk Corporation Memory card with push-push connector
US7416132B2 (en) 2003-07-17 2008-08-26 Sandisk Corporation Memory card with and without enclosure
USD525978S1 (en) 2003-07-17 2006-08-01 Sandisk Corporation Memory card
USD523435S1 (en) 2003-07-17 2006-06-20 Sandisk Corporation Memory card
US20050011671A1 (en) * 2003-07-17 2005-01-20 Takiar Hem P. Memory card with and without enclosure
US7864540B2 (en) 2003-07-17 2011-01-04 Sandisk Corporation Peripheral card with sloped edges
US7307848B2 (en) 2003-07-17 2007-12-11 Sandisk Corporation Memory card with raised portion
US7306161B2 (en) 2003-07-17 2007-12-11 Sandisk Corporation Memory card with chamfer
US7102891B1 (en) 2003-07-23 2006-09-05 Amkor Technology, Inc. Circuit module having interconnects for connecting functioning and non-functioning add ons and method therefor
USD493466S1 (en) 2003-10-13 2004-07-27 C-One Technology Corporation Memory card
USD498760S1 (en) 2003-12-30 2004-11-23 Siliconware Precision Industries Co., Ltd. Digital memory card
US7633763B1 (en) 2004-01-28 2009-12-15 Amkor Technology, Inc. Double mold memory card and its manufacturing method
US8018068B1 (en) 2004-03-23 2011-09-13 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US7633765B1 (en) 2004-03-23 2009-12-15 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US11094560B1 (en) 2004-03-23 2021-08-17 Amkor Technology Singapore Holding Pte. Ltd. Encapsulated semiconductor package
US8227338B1 (en) 2004-03-23 2012-07-24 Amkor Technology, Inc. Semiconductor package including a top-surface metal layer for implementing circuit features
US11081370B2 (en) 2004-03-23 2021-08-03 Amkor Technology Singapore Holding Pte. Ltd. Methods of manufacturing an encapsulated semiconductor device
US10811277B2 (en) 2004-03-23 2020-10-20 Amkor Technology, Inc. Encapsulated semiconductor package
USD536382S1 (en) 2004-04-07 2007-02-06 Nintendo Co., Ltd. Information storage cartridge for electronic game machine
US7822883B2 (en) 2004-04-16 2010-10-26 Sandisk Corporation Memory card with two standard sets of contacts and a hinged contact covering mechanism
USD518059S1 (en) 2004-04-16 2006-03-28 Sandisk Corporation Memory card with two sets of contacts
US20080064272A1 (en) * 2004-04-16 2008-03-13 Miller Robert C Memory card with two standard sets of contacts and a contact covering mechanism
US7355860B2 (en) 2004-04-16 2008-04-08 Sandisk Corporation Memory card with two standard sets of contacts and a contact covering mechanism
US20050230484A1 (en) * 2004-04-16 2005-10-20 Cuellar Edwin J Memory cards having two standard sets of contacts
US20050230483A1 (en) * 2004-04-16 2005-10-20 Miller Robert C Memory card with two standard sets of contacts and a contact covering mechanism
USD515586S1 (en) 2004-04-16 2006-02-21 Sandisk Corporation Memory card with two sets of contacts
US7364090B2 (en) 2004-04-16 2008-04-29 Sandisk Corporation Memory cards having two standard sets of contacts
US7554813B2 (en) 2004-04-16 2009-06-30 Sandisk Corporation Memory card with two standard sets of contacts and a contact covering mechanism
US20070032101A1 (en) * 2004-04-16 2007-02-08 Cuellar Edwin J Memory Cards Having Two Standard Sets of Contacts
USD515587S1 (en) 2004-04-16 2006-02-21 Sandisk Corporation Memory card with two sets of contacts
US20080191033A1 (en) * 2004-04-16 2008-08-14 Cuellar Edwin J Memory Cards Having Two Standard Sets Of Contacts
USD535297S1 (en) 2004-04-16 2007-01-16 Sandisk Corporation Memory card with two sets of contacts
US7152801B2 (en) 2004-04-16 2006-12-26 Sandisk Corporation Memory cards having two standard sets of contacts
US20060282553A1 (en) * 2004-04-16 2006-12-14 Miller Robert C Memory Card With Two Standard Sets of Contacts and a Contact Covering Mechanism
US7340540B2 (en) 2004-04-16 2008-03-04 Sandisk Corporation Memory card with contacts, device connector, and a connector covering mechanism
US20090134228A1 (en) * 2004-04-16 2009-05-28 Miller Robert C Memory cards having two standard sets of contacts and a hinged contact covering mechanism
US7487265B2 (en) 2004-04-16 2009-02-03 Sandisk Corporation Memory card with two standard sets of contacts and a hinged contact covering mechanism
US7310692B2 (en) 2004-04-16 2007-12-18 Sandisk Corporation Memory card with integral covered second device connector for use with computing devices without a memory card slot
USD532788S1 (en) 2004-04-16 2006-11-28 Sandisk Corporation Combined memory card and carrier assembly
US20070099511A1 (en) * 2004-04-16 2007-05-03 Miller Robert C Memory Card With Two Standard Sets of Contacts and a Contact Covering Mechanism
USD531181S1 (en) * 2004-04-16 2006-10-31 Sandisk Corporation Combined memory card and carrier assembly
US7556986B1 (en) 2004-04-21 2009-07-07 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7074654B1 (en) 2004-04-21 2006-07-11 Amkor Technology, Inc. Tape supported memory card leadframe structure
US7365006B1 (en) 2004-05-05 2008-04-29 Amkor Technology, Inc. Semiconductor package and substrate having multi-level vias fabrication method
US7145238B1 (en) 2004-05-05 2006-12-05 Amkor Technology, Inc. Semiconductor package and substrate having multi-level vias
US7201327B1 (en) 2004-10-18 2007-04-10 Amkor Technology, Inc. Memory card and its manufacturing method
US7193305B1 (en) 2004-11-03 2007-03-20 Amkor Technology, Inc. Memory card ESC substrate insert
US7220915B1 (en) 2005-02-17 2007-05-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7485491B1 (en) 2005-02-17 2009-02-03 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US7293716B1 (en) 2005-02-17 2007-11-13 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US7112875B1 (en) 2005-02-17 2006-09-26 Amkor Technology, Inc. Secure digital memory card using land grid array structure
US8826531B1 (en) 2005-04-05 2014-09-09 Amkor Technology, Inc. Method for making an integrated circuit substrate having laminated laser-embedded circuit layers
US20090021921A1 (en) * 2005-04-26 2009-01-22 Amkor Technology, Inc. Memory card and its manufacturing method
US7719845B1 (en) 2005-04-26 2010-05-18 Amkor Technology, Inc. Chamfered memory card module and method of making same
USD554123S1 (en) * 2005-05-19 2007-10-30 Sandisk Corporation Flash memory card with a translucent cover
USD537824S1 (en) * 2005-05-19 2007-03-06 Sandisk Corporation Flash memory card with translucent cover
USD552099S1 (en) * 2005-05-24 2007-10-02 Renesas Technology Corporation Memory card
USD556764S1 (en) * 2005-05-24 2007-12-04 Renesas Technology Corporation Memory card
USD581932S1 (en) * 2005-05-24 2008-12-02 Renesas Technology Corp. Memory card
USD552612S1 (en) * 2005-05-24 2007-10-09 Renesas Technology Corporation Memory card
USD552098S1 (en) * 2005-05-24 2007-10-02 Renesas Technology Corporation Memory card
USD542797S1 (en) 2005-08-02 2007-05-15 Sandisk Corporation Memory card with a contact covering lid
US7710736B2 (en) 2005-08-02 2010-05-04 Sandisk Corporation Memory card with latching mechanism for hinged cover
US7375975B1 (en) 2005-10-31 2008-05-20 Amkor Technology, Inc. Enhanced durability memory card
US7837120B1 (en) 2005-11-29 2010-11-23 Amkor Technology, Inc. Modular memory card and method of making same
US7359204B1 (en) 2006-02-15 2008-04-15 Amkor Technology, Inc. Multiple cover memory card
US20070270040A1 (en) * 2006-05-05 2007-11-22 Jang Sang J Chamfered Memory Card
US11848214B2 (en) 2006-08-01 2023-12-19 Amkor Technology Singapore Holding Pte. Ltd. Encapsulated semiconductor package
US7589398B1 (en) 2006-10-04 2009-09-15 Amkor Technology, Inc. Embedded metal features structure
US7911037B1 (en) 2006-10-04 2011-03-22 Amkor Technology, Inc. Method and structure for creating embedded metal features
US7825520B1 (en) 2006-11-16 2010-11-02 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
US8629546B1 (en) 2006-11-16 2014-01-14 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
US8203203B1 (en) 2006-11-16 2012-06-19 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
US7550857B1 (en) 2006-11-16 2009-06-23 Amkor Technology, Inc. Stacked redistribution layer (RDL) die assembly package
US8671565B1 (en) 2006-12-22 2014-03-18 Amkor Technology, Inc. Blind via capture pad structure fabrication method
US7750250B1 (en) 2006-12-22 2010-07-06 Amkor Technology, Inc. Blind via capture pad structure
US7752752B1 (en) 2007-01-09 2010-07-13 Amkor Technology, Inc. Method of fabricating an embedded circuit pattern
USD579940S1 (en) * 2007-03-15 2008-11-04 Technologies Humanware Canada, Inc. Cartridge
US8323771B1 (en) 2007-08-15 2012-12-04 Amkor Technology, Inc. Straight conductor blind via capture pad structure and fabrication method
USD585068S1 (en) * 2007-11-09 2009-01-20 Vizio, Inc Memory card with contact exposing openings
USD588133S1 (en) 2007-12-17 2009-03-10 Panasonic Corporation IC memory card
USD588597S1 (en) 2007-12-17 2009-03-17 Panasonic Corporation IC memory card
USD588134S1 (en) 2008-01-11 2009-03-10 Panasonic Corporation IC memory card
USD588598S1 (en) 2008-04-01 2009-03-17 Panasonic Corporation IC memory card
USD588135S1 (en) 2008-04-01 2009-03-10 Panasonic Corporation IC memory card
USD588599S1 (en) 2008-04-01 2009-03-17 Panasonic Corporation IC memory card
US8872329B1 (en) 2009-01-09 2014-10-28 Amkor Technology, Inc. Extended landing pad substrate package structure and method
US9462704B1 (en) 2009-01-09 2016-10-04 Amkor Technology, Inc. Extended landing pad substrate package structure and method
US7960827B1 (en) 2009-04-09 2011-06-14 Amkor Technology, Inc. Thermal via heat spreader package and method
US8623753B1 (en) 2009-05-28 2014-01-07 Amkor Technology, Inc. Stackable protruding via package and method
US8222538B1 (en) 2009-06-12 2012-07-17 Amkor Technology, Inc. Stackable via package and method
US9730327B1 (en) 2009-06-12 2017-08-08 Amkor Technology, Inc. Stackable via package and method
US12035472B2 (en) 2009-06-12 2024-07-09 Amkor Technology Singapore Holding Ptd. Ltd. Stackable via package and method
US9012789B1 (en) 2009-06-12 2015-04-21 Amkor Technology, Inc. Stackable via package and method
US10548221B1 (en) 2009-06-12 2020-01-28 Amkor Technology, Inc. Stackable via package and method
US8704368B1 (en) 2009-06-12 2014-04-22 Amkor Technology, Inc. Stackable via package and method
US10206285B1 (en) 2009-06-12 2019-02-12 Amkor Technology, Inc. Stackable via package and method
US11700692B2 (en) 2009-06-12 2023-07-11 Amkor Technology Singapore Holding Pte. Ltd. Stackable via package and method
US11089685B2 (en) 2009-06-12 2021-08-10 Amkor Technology Singapore Holding Pte. Ltd. Stackable via package and method
US10034372B1 (en) 2009-06-12 2018-07-24 Amkor Technology, Inc. Stackable via package and method
US10257942B1 (en) 2009-08-06 2019-04-09 Amkor Technology, Inc. Stackable variable height via package and method
US8471154B1 (en) 2009-08-06 2013-06-25 Amkor Technology, Inc. Stackable variable height via package and method
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
USRE47112E1 (en) 2009-10-20 2018-11-06 Sandisk Il Ltd. Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device
US8690283B2 (en) 2009-10-20 2014-04-08 Sandisk Il Ltd. Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device
USD638431S1 (en) * 2009-10-20 2011-05-24 Sandisk Corporation MicroSD memory card with a semi-transparent color surface
USD628202S1 (en) * 2009-10-20 2010-11-30 Sandisk Corporation MicroSD memory card with different color surfaces
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US8536462B1 (en) 2010-01-22 2013-09-17 Amkor Technology, Inc. Flex circuit package and method
USD643431S1 (en) * 2010-05-17 2011-08-16 Panasonic Corporation Memory card
USD639812S1 (en) * 2010-05-17 2011-06-14 Panasonic Corporation Memory card
USD643432S1 (en) * 2010-05-17 2011-08-16 Panasonic Corporation Memory card
USD639302S1 (en) * 2010-05-17 2011-06-07 Panasonic Corporation Memory card
US8300423B1 (en) 2010-05-25 2012-10-30 Amkor Technology, Inc. Stackable treated via package and method
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8338229B1 (en) 2010-07-30 2012-12-25 Amkor Technology, Inc. Stackable plasma cleaned via package and method
US8717775B1 (en) 2010-08-02 2014-05-06 Amkor Technology, Inc. Fingerprint sensor package and method
USD643040S1 (en) * 2010-10-26 2011-08-09 Hon Hai Precision Ind. Co., Ltd. Electrical card
US8337657B1 (en) 2010-10-27 2012-12-25 Amkor Technology, Inc. Mechanical tape separation package and method
US8753730B1 (en) 2010-10-27 2014-06-17 Amkor Technology, Inc. Mechanical tape separation package
US8482134B1 (en) 2010-11-01 2013-07-09 Amkor Technology, Inc. Stackable package and method
US9496210B1 (en) 2010-11-01 2016-11-15 Amkor Technology, Inc. Stackable package and method
US12009343B1 (en) 2010-11-01 2024-06-11 Amkor Technology Singapore Holding Pte. Ltd. Stackable package and method
US9748154B1 (en) 2010-11-04 2017-08-29 Amkor Technology, Inc. Wafer level fan out semiconductor device and manufacturing method thereof
US10903181B2 (en) 2010-11-04 2021-01-26 Amkor Technology Singapore Holding Pte. Ltd. Wafer level fan out semiconductor device and manufacturing method thereof
US11855023B2 (en) 2010-11-04 2023-12-26 Amkor Technology Singapore Holding Pte. Ltd. Wafer level fan out semiconductor device and manufacturing method thereof
US8525318B1 (en) 2010-11-10 2013-09-03 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US9837331B1 (en) 2010-12-03 2017-12-05 Amkor Technology, Inc. Semiconductor device having overlapped via apertures
US9177932B1 (en) 2010-12-03 2015-11-03 Amkor Technology, Inc. Semiconductor device having overlapped via apertures
US8557629B1 (en) 2010-12-03 2013-10-15 Amkor Technology, Inc. Semiconductor device having overlapped via apertures
US8535961B1 (en) 2010-12-09 2013-09-17 Amkor Technology, Inc. Light emitting diode (LED) package and method
US11488892B2 (en) 2011-02-18 2022-11-01 Amkor Technology Singapore Holding Pte. Ltd. Methods and structures for increasing the allowable die size in TMV packages
US10347562B1 (en) 2011-02-18 2019-07-09 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
US9721872B1 (en) 2011-02-18 2017-08-01 Amkor Technology, Inc. Methods and structures for increasing the allowable die size in TMV packages
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
US8890329B2 (en) 2011-04-26 2014-11-18 Amkor Technology, Inc. Semiconductor device
USD670292S1 (en) * 2011-05-17 2012-11-06 Sony Computer Entertainment Inc. Recording medium
US8653674B1 (en) 2011-09-15 2014-02-18 Amkor Technology, Inc. Electronic component package fabrication method and structure
US8941250B1 (en) 2011-09-15 2015-01-27 Amkor Technology, Inc. Electronic component package fabrication method and structure
US8633598B1 (en) 2011-09-20 2014-01-21 Amkor Technology, Inc. Underfill contacting stacking balls package fabrication method and structure
US8890337B1 (en) 2011-09-20 2014-11-18 Amkor Technology, Inc. Column and stacking balls package fabrication method and structure
US9029962B1 (en) 2011-10-12 2015-05-12 Amkor Technology, Inc. Molded cavity substrate MEMS package fabrication method and structure
USD667830S1 (en) * 2011-11-29 2012-09-25 Samsung Electronics Co., Ltd. SD memory card
USD700183S1 (en) * 2012-08-30 2014-02-25 Nifty Drives Ltd Computer accessory
USD704192S1 (en) * 2012-08-30 2014-05-06 Nifty Drives Ltd Computer accessory
US11527496B2 (en) 2012-11-20 2022-12-13 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof
US9728514B2 (en) 2012-11-20 2017-08-08 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US10679952B2 (en) 2012-11-20 2020-06-09 Amkor Technology, Inc. Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof
US9391043B2 (en) 2012-11-20 2016-07-12 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9852976B2 (en) 2013-01-29 2017-12-26 Amkor Technology, Inc. Semiconductor package and fabricating method thereof
US9543242B1 (en) 2013-01-29 2017-01-10 Amkor Technology, Inc. Semiconductor package and fabricating method thereof
US9704747B2 (en) 2013-03-29 2017-07-11 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9704842B2 (en) 2013-11-04 2017-07-11 Amkor Technology, Inc. Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package
US10192816B2 (en) 2013-11-19 2019-01-29 Amkor Technology, Inc. Semiconductor package and fabricating method thereof
US11652038B2 (en) 2013-11-19 2023-05-16 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor package with front side and back side redistribution structures and fabricating method thereof
US10943858B2 (en) 2013-11-19 2021-03-09 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor package and fabricating method thereof
US12159823B2 (en) 2013-11-19 2024-12-03 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor package with front side and back side redistribution structures and fabricating method thereof
USD726189S1 (en) * 2014-04-03 2015-04-07 Transcend Information, Inc. Secure digital card
US10490716B2 (en) 2016-09-06 2019-11-26 Amkor Technology, Inc. Semiconductor device with optically-transmissive layer and manufacturing method thereof
US9960328B2 (en) 2016-09-06 2018-05-01 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US11437552B2 (en) 2016-09-06 2022-09-06 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device with transmissive layer and manufacturing method thereof
US11942581B2 (en) 2016-09-06 2024-03-26 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor device with transmissive layer and manufacturing method thereof
US10784422B2 (en) 2016-09-06 2020-09-22 Amkor Technology, Inc. Semiconductor device with optically-transmissive layer and manufacturing method thereof

Similar Documents

Publication Publication Date Title
USD446525S1 (en) IC memory card
USD445111S1 (en) IC memory card
USD444473S1 (en) IC memory card
USD467586S1 (en) IC memory card
USD460456S1 (en) IC memory card
USD436991S1 (en) Credit card
USD533556S1 (en) IC memory card
USD459355S1 (en) IC memory card
USD449615S1 (en) Connector device for a smart card
USD415132S (en) Memory card
USD445422S1 (en) Integrated circuit card reader
USD504433S1 (en) Memory card
USD451099S1 (en) Memory card for electronic games
USD445776S1 (en) IC recorder
USD431035S (en) Card phone
USD482693S1 (en) Attaching device for memory card
USD454875S1 (en) Single smart card reader
USD475056S1 (en) IC card
USD467921S1 (en) Smart card reader
USD405441S (en) IC card
USD477322S1 (en) Card reader
USD475708S1 (en) Card reader
USD437851S1 (en) IC card reader and writer
USD434418S (en) IC module
USD484881S1 (en) Card reader