[go: up one dir, main page]

USD441726S1 - Semiconductor element - Google Patents

Semiconductor element Download PDF

Info

Publication number
USD441726S1
USD441726S1 US29/116,970 US11697000F USD441726S US D441726 S1 USD441726 S1 US D441726S1 US 11697000 F US11697000 F US 11697000F US D441726 S USD441726 S US D441726S
Authority
US
United States
Prior art keywords
semiconductor element
elevational view
view
side elevational
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/116,970
Inventor
Kenichi Sofue
Hiromitsu Yoshiyama
Toshinari Fukatsu
Toshiaki Nagase
Jun Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Original Assignee
Toyoda Jidoshokki Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Jidoshokki Seisakusho KK filed Critical Toyoda Jidoshokki Seisakusho KK
Assigned to KABUSHIKI KAISHA TOYODA JIDOSHOKKI SEISAKUSHO reassignment KABUSHIKI KAISHA TOYODA JIDOSHOKKI SEISAKUSHO ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKATSU, TOSHINARI, ISHIKAWA, JUN, NAGASE, TOSHIAKI, SOFUE, KENICHI, YOSHIYAMA, HIROMITSU
Application granted granted Critical
Publication of USD441726S1 publication Critical patent/USD441726S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 is a front elevational view showing a semiconductor element according to the present invention;
FIG. 2 is a rear elevational view of the element of FIG. 1;
FIG. 3 is a top plan view of the element of FIG. 1;
FIG. 4 is a bottom plan view of the element of FIG. 1;
FIG. 5 is a right side elevational view of the element of FIG. 1, the left side elevational view being a mirror image of the right side elevational view; and,
FIG. 6 is a top front perspective view of the element of FIG. 1.

Claims (1)

  1. The ornamental design for a semiconductor element, as shown and described.
US29/116,970 1999-07-14 2000-01-13 Semiconductor element Expired - Lifetime USD441726S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11-18965 1999-07-14
JP1896599 1999-07-14

Publications (1)

Publication Number Publication Date
USD441726S1 true USD441726S1 (en) 2001-05-08

Family

ID=11986380

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/116,970 Expired - Lifetime USD441726S1 (en) 1999-07-14 2000-01-13 Semiconductor element

Country Status (1)

Country Link
US (1) USD441726S1 (en)

Cited By (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD456367S1 (en) 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD605114S1 (en) * 2007-12-20 2009-12-01 Tamura Corporation Piezoelectric transformer
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD724554S1 (en) * 2014-02-19 2015-03-17 Fuji Electric Co., Ltd. Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD761746S1 (en) * 2014-11-04 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD904991S1 (en) * 2019-03-15 2020-12-15 Tamura Corporation Semiconductor element
USD911987S1 (en) * 2019-03-15 2021-03-02 Tamura Corporation Semiconductor element
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD949807S1 (en) * 2020-03-13 2022-04-26 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD1049066S1 (en) * 2022-02-28 2024-10-29 Syskey Technology Co., Ltd. Base for a multi-chamber semiconductor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD401567S (en) 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
USD402638S (en) 1997-04-25 1998-12-15 Micron Technology, Inc. Temporary package for semiconductor dice
USD427977S (en) 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD432097S (en) 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD401567S (en) 1997-04-25 1998-11-24 Micron Technology, Inc. Temporary package for semiconductor dice
USD402638S (en) 1997-04-25 1998-12-15 Micron Technology, Inc. Temporary package for semiconductor dice
USD427977S (en) 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD432097S (en) 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package

Cited By (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD456367S1 (en) 2000-12-15 2002-04-30 Protek Devices, Lp Semiconductor chip
USD605114S1 (en) * 2007-12-20 2009-12-01 Tamura Corporation Piezoelectric transformer
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD724554S1 (en) * 2014-02-19 2015-03-17 Fuji Electric Co., Ltd. Semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD761746S1 (en) * 2014-11-04 2016-07-19 Sumitomo Electric Industries, Ltd. Semiconductor module for power conversion
USD827593S1 (en) 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD814433S1 (en) 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD810706S1 (en) 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD773413S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD810036S1 (en) * 2016-11-08 2018-02-13 Fuji Electric Co., Ltd. Semiconductor module
USD858467S1 (en) * 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) * 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD873227S1 (en) 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD904991S1 (en) * 2019-03-15 2020-12-15 Tamura Corporation Semiconductor element
USD911987S1 (en) * 2019-03-15 2021-03-02 Tamura Corporation Semiconductor element
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module
USD949807S1 (en) * 2020-03-13 2022-04-26 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD916039S1 (en) * 2020-03-20 2021-04-13 Sansha Electric Manufacturing Co., Ltd. Semiconductor device
USD1049066S1 (en) * 2022-02-28 2024-10-29 Syskey Technology Co., Ltd. Base for a multi-chamber semiconductor

Similar Documents

Publication Publication Date Title
USD441726S1 (en) Semiconductor element
USD444132S1 (en) Semiconductor element
USD460872S1 (en) Chair
USD446684S1 (en) Mug
USD477720S1 (en) Chair
USD471801S1 (en) Dispenser
USD425294S (en) Medication case
USD472523S1 (en) Connector
USD471847S1 (en) Mirror
USD452157S1 (en) Bottle and top
USD467407S1 (en) Shoe
USD436830S1 (en) Latch handle
USD450814S1 (en) Flanged collet nipple
USD462525S1 (en) Toothbrush
USD447005S1 (en) Travel mug
USD426128S (en) Hammer
USD480371S1 (en) Semiconductor device
USD461065S1 (en) Chair
USD461969S1 (en) Chair
USD418408S (en) Package
USD459049S1 (en) Top frame
USD445434S1 (en) Cooling element
USD429590S (en) Rug
USD442829S1 (en) Mug
USD427776S (en) Brush