US9768334B2 - High efficiency solar cells with quantum dots for IR pumping - Google Patents
High efficiency solar cells with quantum dots for IR pumping Download PDFInfo
- Publication number
- US9768334B2 US9768334B2 US14/676,183 US201514676183A US9768334B2 US 9768334 B2 US9768334 B2 US 9768334B2 US 201514676183 A US201514676183 A US 201514676183A US 9768334 B2 US9768334 B2 US 9768334B2
- Authority
- US
- United States
- Prior art keywords
- alp
- doped
- cqd
- junction
- quantum dots
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/143—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies comprising quantum structures
- H10F77/1433—Quantum dots
-
- H01L31/035218—
-
- H01L31/072—
-
- H01L31/074—
-
- H01L31/18—
-
- H01L31/1804—
-
- H01L31/1864—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
- H10F10/164—Photovoltaic cells having only PN heterojunction potential barriers comprising heterojunctions with Group IV materials, e.g. ITO/Si or GaAs/SiGe photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/128—Annealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y02P70/521—
Definitions
- This application pertains to methods for the low cost fabrication of high efficiency solar cells and to high efficiency solar cells prepared by such methods.
- PV photovoltaic
- each km 2 of area facing the sun receives solar radiation energy equal to a mid-sized nuclear power plant.
- the most desired parameters for solar cells include low specific weight, high photovoltaic (PV) efficiency, high durability in the space environment and high tolerance to radiation, as well as a relatively low fabrication cost. Nearly all these demanding parameters can be met by heterojunction solar cells enhanced by charged quantum dots (CQD) to be manufactured at a low fabrication cost as described hereinafter.
- CQD charged quantum dots
- Solar cell technologies under current practice can be considered in four areas; the thin film semiconductor, the silicon-based devices, the multijunction devices, and the more recent, charged quantum dots (CQD).
- the first three areas are related to the semiconductor material bandgap, and the CQD can add to the three by using solar IR photons to pump up the occupied electron states in a confined space linked by conductive semiconductor surface where the IR photoelectrons are forced into the degenerate system to result with harvested electron chargers as indicated in FIG. 4B .
- Such a CQD can deliver a much enhanced high efficiency without much additional costs in material and fabrication facilities.
- the Si-QD cannot be built on a silicon substrate as the deposition of silicon would simply make the substrate thicker upon annealing, but using a III-V compound as substrate having high binding energy (AlP melting point is 2,500° C.), the deposition of ultra-thin layer of silicon can be annealed to coalesce and form the CQD.
- CQD pumping can double the PV efficiency of certain materials, provided the hole current is balanced in the PV cell design, as considered in the charged p ++ layer surface.
- a single stage pn-junction solar cell that does not need to use lattice matched material selections, nor current matched multi-junction designs.
- the solar cell is based on the PV concept with sound physical principles described herein that enables low cost fabrication and high efficiency performance.
- the solar cell can be modified from low cost silicon solar cells by replacing the conventional phosphorous doped n-region with a low cost wide band III-V compound of intrinsic aluminum phosphide (i-AlP) annealed on the p-Si substrate with p ++ surface and implanted with n ++ Si-dopant in the i-AlP to support charged quantum dots (CQD) and form a conductive substrate surface of n ++ -AlP.
- the solar cell satisfies the following parameters.
- a low cost manufacturing process is provided to fabricate the solar cell. It uses a fast, continuous fabrication process, including the relatively slow but necessary annealing and cooling procedures without involving any high cost material and equipment.
- FIG. 1 is a PV cell design with high quantum efficiency in accordance with one embodiment of the invention.
- FIGS. 2A and 2B show a conventional PV cell in dark ( FIG. 2A ) and in light ( FIG. 2B ).
- FIG. 3 shows the relationship between the current output J and the voltage output V.
- FIGS. 4A and 4B show a heterojunction p-i-n PV cell according to the invention in dark ( FIG. 4A ) and light ( FIG. 4B ).
- FIG. 5 shows a continuous fabrication tool for fabricating solar PV cells in accordance with a preferred embodiment of the invention.
- FIG. 6 depicts silicon and germanium quantum dots fabricated on sapphire surface where the surface mobility of the material largely defines the dot size.
- FIG. 7 depicts an automated cluster of atomic vapor deposition (ALD) chambers that can be used to process different functions in CQD fabrication.
- ALD atomic vapor deposition
- a simple heterojunction design that starts with a monocrystalline p-Si wafer at, for example, 40 ⁇ thick.
- the wafer surface is then covered with an inexpensive Al foil at, for example, 4 ⁇ thick.
- the Al/Si can then be heated to, for example, 300° C. in an oxygen-free oven with phosphorous vapor (from, e.g., red phosphorous powder) to form a self-limiting III-V wide band AlP compound that is stable up to 2,500° C.
- phosphorous vapor from, e.g., red phosphorous powder
- This can be followed by an annealing stage of up to 900° C. to melt the remaining Al and allow it to become the p ++ dopant on the p-Si substrate surface beneath the i-AlP.
- silicon-based CQD can be formed on the n ++ surface and organized into a quantized system that absorbs incoming IR photons and pumps the IR photoelectrons into the quantized CQD assembly to raise the charges into the E F level where they are collected by the digital n-electrodes, while the remaining i-AlP separates the n ++ and p ++ surfaces to prevent tunneling shorts while allowing the highly charged surfaces to drive the PV currents.
- the maximum power output could be derived by having the voltage V max setting at approximately 70% of open circuit voltage V oc and the current J max at almost the short circuit current J sc .
- the pn junction can either be silicon or III-V wide band.
- the hole current must balance the electron current, and leakages of hole current from the diffusion-limited collection restricts the V max to ⁇ 70% of V oc . As shown in FIG.
- the maximum current output J max could be made close to that of short circuit J sc , but the voltage output for maximum power V max is only ⁇ 70% of the open circuit voltage V oc due mainly to the diffusion-limited hole leakages, as shown in FIG. 2B .
- the hole leakages can be reduced as shown in FIG. 4B , and bringing V max closer to V oc , and therefore increasing V max the power output by ⁇ 40%.
- the hole leakage over the diffusive p-substrate is mainly responsible for the reduction of V max by ⁇ 30% from V oc ( FIG. 3 ).
- FIG. 4A shows a heterojunction p-i-n PV cell according to the invention in dark.
- a boron-doped p-Si substrate may be covered with a 4 ⁇ Al foil, forming i-AlP in over 300° C. in an oxygen-free oven with phosphorous vapor.
- the remaining Al merges into the p-Si as the dopant for p ++ surface at T ⁇ 660° C.
- Implanting Si on i-AlP to form n ++ surface supports the formation of CQD. They will form CQD on a conductive Si-doped n ++ -AlP surface.
- FIG. 4B shows the heterojunction p-i-n PV cell according to the invention in light.
- the wide band n-region largely blocks the hole leakages and brings V max close to V oc .
- the CQD will be formed by the deposition of n + Si on the conductive n ++ i-AlP substrate surface and annealed in order to self-assemble into the n + CQD on the conductive n ++ -AlP surface with Si as the implanted dopant.
- the remaining i-AlP region sandwiched between p ++ and n ++ surfaces will separate these highly charged surfaces from tunneling currents while allowing them to remain useful to drive the PV currents, both positive and negative, with minimal leakages.
- the wide band n-region of AlP while it does not add to the bandgap of the PV cell, it does effectively block the hole leakages, and results in bringing the V max much closer to V oc instead of settling at 70% of the V oc . This allows the PV cell to harvest as much as possible the diffusion-limited hole current from the pn junction, thus providing an enhancement in efficiency up to 40% without involving CQD.
- FIG. 6 shows the Si and Ge QD fabricated on an Al 2 O 3 substrate [4]. Note that the substrate material of sapphire and AlP are rather similar with respect to the depositions of Ge and Si, as they allow Ge or Si to move with a relatively high surface mobility over the ceramic-like substrate surfaces to coalesce and form the self-assembled QDs.
- n ++ Si on the n + AlP surface with Si being the implanted dopant to the i-AlP under PECVD, so that CQD will be linked by a conductive surface beneath to form a quantized charged system where any excessive photo-electrons from IR, for example, would force the system to have the excess electrons into a quantized upper energy state, raise the upper state to the Fermi level and be collected by digital electrodes built on the CQD surface.
- the photoelectrons generated in the connected CQD system would now simply raise energy of the top electrons to unoccupied energy states and deliver them to the digital electrodes, thus making the CQD the pumping function to facilitate the IR energy to enhance the J sc current independent of the PV function.
- the necessary hole current to balance the negative charge flows becomes particularly important so that the blocking of hole leakages as shown in FIG. 4B in the wide band heterojunction design becomes vital to the simple but much enhanced high efficiency approach.
- the solar cells described herein can be made at high efficiency with use of p-silicon wafers as the starting substrate, from which a low cost n ++ AlP surface can be added upon, followed by annealing and the growth of CQD.
- Very thin i-AlP layers can be formed with phosphorous vapor reacting with aluminum foil in an oxygen-free environment. While red phosphorous (red P) is very stable in air, at 300° C. the red P will undergo a phase transition to become white P with vapor pressure, which will react and form a self-limiting compound AlP on the exposed aluminum foil surface.
- red P red phosphorous
- the i-AlP surface will be implanted with Si as an n ++ dopant under PECVD followed by a micron thick coating of n + Si on n ++ -AlP surface at an elevated annealing T to form CQD as shown in FIG. 6 .
- the AlP is a ceramic-like semiconductor stable up to 2,500° C., its surface will readily support the deposition of Si or Ge, whose surface mobility on AlP would allow them to move and coalesce into CQD as indicated in FIG. 6 .
- n + CQD on n ++ AlP together with p ++ Si surface completes the formation of highly charged surfaces over i-AlP to serve the enhancement function of the PV cell as outlined in FIG. 1 .
- ALD atomic layer deposition
- IR pumping by CQD constructed on the single stage p-i-n heterojunction for enhanced PV efficiency could involve three possible systems of CQD, namely,
- n + (Ge) CQD on the conventional n + Si surface could have immediate implication to the current low cost Si-based PV cells as well as to the triple junction PV cells using III-V compounds on Ge substrates.
- the enhanced electron current from the addition of QD must be balanced by the hole current, which is mostly diffusion-limited and highly sensitive to the selection of V max .
- the deposition of Si on the Ge substrate could retain the Ge-based epitaxy for Si by stretching the Si-bonding length to conform to Ge and form the strained Si/Ge superlattice with an enhanced electron mobility of strained Si by 35%, but the potential well of Si or Ge bonds between stretching and compression are not symmetric. While Si bonding length could be stretched to follow the Ge lattice dimension, the Ge bonding length cannot be compressed to follow the Si lattice dimension.
- the surface deposition of n+ Ge on Si-surface, particularly on Si ⁇ 111> surface allows the Ge atoms to coalesce and form the Ge-based CQD, which will be verified by electron microscopy as well as by the PV efficiency evaluation with respect to the Vmax for the possible gain in power output.
- n++ CQD considered above can also be fabricated on the heterojunction p-i-n surface.
- the PV efficiency of the p-i-n photodevice can be demonstrated by comparing with the conventional monocrystalline pn Si-PV cells. Either CQD (Si) or CQD (Ge) can be added to verify their IR pumping functions.
- a 200 mm monocrystal Si wafer for use in the present invention can be purchased with a minimum thickness of ⁇ 200 ⁇ .
- Thinner wafers, as practiced in chip fabrication for more effective thermal management etc. could be thinned at the back by chemical mechanical operations down to 20 ⁇ after the completion of device fabrication, for example. In such a thinning process, the edge rim of the wafer remains at several hundred ⁇ to help the wafer handling. While un-thinned wafers may be used, thinning of the wafers may be desired to meet the demanding requirement of specific unit weight for space borne applications.
- the monocrystalline p-Si substrate coated with n+ Si or n+ Ge on n++ AlP to be followed by annealing to form the self-assembled CQD made of either Si or Ge.
- silicon solar cells could start with a 200 ⁇ thick boron-doped p-Si wafer before chemical-mechanical thinning to be coated with 2 ⁇ of phosphorous doped n+ Si by PECVD and annealed at 850° C. for a few hours to form epi-Si under dilute H2 in Ar to tie-up dangling bonds from lattice defects. If the epi-n+ surface follows the substrate in ⁇ 100> structures, it will display a 2 ⁇ 1 reconstructed surface pattern under RHEED (reflection high energy electron diffraction) imaging, or a 7 ⁇ 7 reconstructed image should the surface be ⁇ 111>.
- RHEED reflection high energy electron diffraction
- i-AlP film could start with an Al foil a few ⁇ thick placed on the p-Si-wafer surface together with red phosphorous powder. They will be delivered into an oxygen-free oven. At 300° C. plus, the red P turns into white P with phosphorous vapor, which reacts immediately with the exposed Al surface and forms a
- the present invention is based in part upon the realization that the lowest cost poly-Si solar cells would have more than 1 ⁇ 2 of its cost from the poly-Si material, yet more than 90% of the silicon material is wasted during the poly-Si wafer formation by slicing and polishing.
- Fine graphite powder can be added on the i-AlP surface to reduce surface reflectivity.
- a subsequent formation of n+ CQD on the n++ AlP surface will complete the formation of two highly charged surfaces separated by the i-AlP as indicated in FIG. 1 .
- FIG. 7 shows a highly automated cluster of several ALDs where 500 mm wafers can be transported from one ALD to another in order to process different fabrication functions that can be utilized for the CQD fabrication.
- the cluster of linked ALDs shown in FIG. 7 has a feed station where 500 mm wafers are housed in chambers-containing up to 25 wafers each that can be sent to different ALD stations for different gaseous depositions under different temperatures.
- Each ALD can be maintained with a vacuum level of 10-8 torr, not nearly as high as MBE, but the chambers can be purged with inert gas to reduce potential contamination.
- Up to 5 ALDs can function in this system, or 125 500 mm wafers can be processed sequentially or in parallel. That is, the incorporation of CQD can be conducted in the ALD cluster system as part of the continuous fabrication tool to be described next.
- the present invention is based in part upon the realization that the lowest cost poly-Si solar cells would have more than 1 ⁇ 2 of its cost from the poly-Si material, yet more than 90% of the silicon material is wasted during the poly-Si wafer formation by slicing and polishing.
- With a low cost ceramic-like AlP that is stable up to 2,500° C. which can be formed at low has solved the difficulty, as molten Si can be spray-formed upon and thereby reduce the fabrication cost of poly-Si solar cells by 1 ⁇ 2.
- the time-consuming annealing at an elevated temperature and its subsequent cooling can be conducted in vertical columns in order to avoid slowing down the high throughput process.
- the i-AlP with p ++ Si-surface beneath could receive a shallow implant of Si as the n ++ dopant to form the needed n ++ surface on i-AlP in order to support the formation of CQD for IR photoelectron harvesting.
- the fabrication tool shown in FIG. 5 depicts the following features of the invention:
- the wafer can enter an oxygen free chamber at 300+° C. where the red phosphorous will undergo a phase transition to become white phosphorous with vapor pressure that reacts with the aluminum foil beneath to form AlP which is stable up to 2,500° C.
- Rapid Thermal Pulse raises the surface of Si wafer to nearly 900° C. and melts the remaining Al into the p-Si substrate to become the additional p-dopant while allowing the self-limiting layer of AlP to firmly attach to the p-Si.
- Annealing Chamber maintained at 900° C. Since the annealing activities, even at 900° C., will need some time to conclude, the wafer can enter a vertical motion, ascending one by one and transfer at top to Chamber 6 for cooling.
- Cooling Chamber Wafers cool from 900° C. to ambient temperature can pass through all needed temperature regions to complete the remaining fabrication steps that include
- the p-substrate material of silicon could readily be modified from a flat surface to certain non-flat contour in order to mount on or integrate with ground vehicles or unmanned airborne vehicles.
- organic molecules such as pentacene [11] can provide singlet exciton at 2.83 eV and triplet exciton at 0.85 eV, which are bandgap energies similar to the expensive III-V multifunction PV cells fabricated on the Ge substrate.
- the biomolecule must be protected from the environment and sealed by a glass surface, for example.
- the described AlP compound could also conform to virtually any geometry and is stable up to 2,500° C.
- the low cost AlP can readily support a spray-coating procedure of molten silicon to form a p-layer with a thickness of 100 ⁇ , for example, followed by an annealing of 900° C. in H 2 and can similarly be coated with n + CQD on the n ++ AlP surface to result with a similar high efficiency PV structure: n + CQD-n ++ AlP-iAlP-p ++ Si-p-Si
- Such an inexpensive thin PV can be similarly sealed with glass to prevent AlP becoming hydroscopic from moisture with the needed contour and protect against all environmental elements absent from space.
- the PV efficiency could become reduced as much as 1 ⁇ 3 from the proposed monocrystalline wafer Si, and if the spray-coated low cost PV cell could still reach an efficiency of 25-30%, it remains to be a highly viable commercial product.
- the spray-coating apparatus could simply be an induction-heated high T nozzle under pressure to melt the Si and spray it like an automobile painting, although the low cost manufacturing for non-flat surface is not required for space-borne applications.
- 200 mm p-Si wafer at 40-60 ⁇ with Boron dopant can be covered with one ⁇ of n + Si layer by PECVD with phosphorus dopant and annealed with H 2 gas at 900° C. to form an epi-Si PV cell.
- Al foil at 4 ⁇ thick can be placed on the 200 mm p-Si wafer surface and placed in an oven with P vapor at 300° C. to form the self-liming i-AlP.
- the remaining Al from the self-limiting i-AlP will merge into the p-Si at an elevated temperature beyond 660° C. and become an additional p-dopant for the p-Si to form p ++ -Si surface, and shallowly implanting Si on i-AlP to replace Al in AlP becoming the n-dopant for the n ++ -AlP surface.
- a commercial light source of stimulated solar radiation spectrum can be used and illuminated without concentrator on the monocrystalline Si solar cell as well as the AlP/Si heterojunction solar cell to establish their respective PV efficiency without CQD.
- Si can be implanted into the i-AlP to form n ++ -AlP surface at a range of temperatures followed by deposition of n + Si to form CQD as indicated by FIG. 6 for various CQD sizes as verified by optical microscopy and illuminated with simulated solar radiation for enhanced PV efficiencies.
- One ⁇ of Ge will be deposited on the n + Si/p-Si surface or the n ++ AlP/p-Si surface using ALD to form Ge-CQD as indicated in FIG. 6 .
Landscapes
- Photovoltaic Devices (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
Abstract
Description
-
- The wide band n-region of i-AlP dramatically reduces the hole leakages and drives the voltage output Vmax at optimal power close to the open circuit voltage Voc.
- The CQD built on a conductive n++ surface forms a quantized system to absorb IR photoelectrons, drive them into the system and force top electron energy to join the free energy state EF to be collected at a level beyond the Jsc current level without degrading the Vmax.
- The stable i-AlP sandwiched between p++ and n++ surfaces separates these two regions so that photoelectrons created by IR pumping can readily be collected with very high collection efficiency, allowing p++ to drive the hole current effectively.
-
- Formation of CQD
- Attachment of Digital Electrode (Preprinted On a Waxy Paper Surface)
- Bonding with Protective Glass Surface if necessary
- Bonding with Aluminum Back for reflection and as the Positive Electrode
n+CQD-n++AlP-iAlP-p++Si-p-Si
-
- The PV efficiency of monocrystalline Si PV cells and n++ AlP/p-Si PV cells can be compared.
- Ge-CQD on Si-PV cells and on AlP/Si PV cells can be compared with Si-CQD on AlP/Si PV cells by using the commercial simulated solar radiation without concentrator.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/676,183 US9768334B2 (en) | 2012-10-02 | 2015-04-01 | High efficiency solar cells with quantum dots for IR pumping |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261708807P | 2012-10-02 | 2012-10-02 | |
| US61708807 | 2012-10-02 | ||
| US201361779027P | 2013-03-13 | 2013-03-13 | |
| US61779027 | 2013-03-13 | ||
| PCT/US2013/063018 WO2014055620A1 (en) | 2012-10-02 | 2013-10-02 | Methods for fabricating solar pv cells |
| US14/676,183 US9768334B2 (en) | 2012-10-02 | 2015-04-01 | High efficiency solar cells with quantum dots for IR pumping |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2013/063018 Continuation-In-Part WO2014055620A1 (en) | 2012-10-02 | 2013-10-02 | Methods for fabricating solar pv cells |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20160013339A1 US20160013339A1 (en) | 2016-01-14 |
| US9768334B2 true US9768334B2 (en) | 2017-09-19 |
Family
ID=50435394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/676,183 Expired - Fee Related US9768334B2 (en) | 2012-10-02 | 2015-04-01 | High efficiency solar cells with quantum dots for IR pumping |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9768334B2 (en) |
| WO (1) | WO2014055620A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116891737B (en) * | 2023-02-28 | 2024-09-20 | 中国科学院深圳先进技术研究院 | Synthesis method of fluorescent silicon dot, fluorescent silicon dot and application |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2132360A (en) | 1936-05-19 | 1938-10-04 | American Agricultural Chem Co | Vaporizing and oxidizing phosphorus |
| US4323419A (en) | 1980-05-08 | 1982-04-06 | Atlantic Richfield Company | Method for ribbon solar cell fabrication |
| EP0111394A2 (en) | 1982-11-09 | 1984-06-20 | Energy Conversion Devices, Inc. | Laminated strip of large area solar celle and method of producing that laminated strip |
| US5024706A (en) | 1989-01-21 | 1991-06-18 | Canon Kabushiki Kaisha | Pin heterojunction photovoltaic elements with polycrystal AlP(H,F) semiconductor film |
| US5693961A (en) | 1994-11-22 | 1997-12-02 | Nec Corporation | Top-gate type thin film transistor with dangling bonds of silicon partly combined with hydrogen |
| WO2008109133A1 (en) | 2007-03-08 | 2008-09-12 | Integrated Photovoltaics, Inc. | Plasma spraying of semiconductor grade silicon |
| WO2009029902A1 (en) | 2007-08-31 | 2009-03-05 | Applied Materials, Inc. | Photovoltaic production line |
| US20100288189A1 (en) | 2009-02-26 | 2010-11-18 | Uri Cohen | Floating Semiconductor Foils |
| WO2012009808A1 (en) | 2010-07-19 | 2012-01-26 | Cyrium Technologies Incorporated | Solar cell with epitaxially grown quantum dot material |
| US8158880B1 (en) * | 2007-01-17 | 2012-04-17 | Aqt Solar, Inc. | Thin-film photovoltaic structures including semiconductor grain and oxide layers |
-
2013
- 2013-10-02 WO PCT/US2013/063018 patent/WO2014055620A1/en not_active Ceased
-
2015
- 2015-04-01 US US14/676,183 patent/US9768334B2/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2132360A (en) | 1936-05-19 | 1938-10-04 | American Agricultural Chem Co | Vaporizing and oxidizing phosphorus |
| US4323419A (en) | 1980-05-08 | 1982-04-06 | Atlantic Richfield Company | Method for ribbon solar cell fabrication |
| EP0111394A2 (en) | 1982-11-09 | 1984-06-20 | Energy Conversion Devices, Inc. | Laminated strip of large area solar celle and method of producing that laminated strip |
| US5024706A (en) | 1989-01-21 | 1991-06-18 | Canon Kabushiki Kaisha | Pin heterojunction photovoltaic elements with polycrystal AlP(H,F) semiconductor film |
| US5693961A (en) | 1994-11-22 | 1997-12-02 | Nec Corporation | Top-gate type thin film transistor with dangling bonds of silicon partly combined with hydrogen |
| US8158880B1 (en) * | 2007-01-17 | 2012-04-17 | Aqt Solar, Inc. | Thin-film photovoltaic structures including semiconductor grain and oxide layers |
| WO2008109133A1 (en) | 2007-03-08 | 2008-09-12 | Integrated Photovoltaics, Inc. | Plasma spraying of semiconductor grade silicon |
| WO2009029902A1 (en) | 2007-08-31 | 2009-03-05 | Applied Materials, Inc. | Photovoltaic production line |
| US20100288189A1 (en) | 2009-02-26 | 2010-11-18 | Uri Cohen | Floating Semiconductor Foils |
| WO2012009808A1 (en) | 2010-07-19 | 2012-01-26 | Cyrium Technologies Incorporated | Solar cell with epitaxially grown quantum dot material |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014055620A1 (en) | 2014-04-10 |
| US20160013339A1 (en) | 2016-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7846759B2 (en) | Multi-junction solar cells and methods of making same using layer transfer and bonding techniques | |
| US11817523B2 (en) | Automated assembly and mounting of solar cells on space panels | |
| US11257973B2 (en) | Method for passing photovoltaic current between a subcell formed from a group II-VI semiconductor material and a subcell formed from a group IV semiconductor material | |
| US9853176B2 (en) | Nitride-based multi-junction solar cell modules and methods for making the same | |
| TWI542026B (en) | Efficient multi-junction solar cell | |
| US8816191B2 (en) | High efficiency photovoltaic cells and manufacturing thereof | |
| CN103477448B (en) | Graphene-based multijunction flexible solar cells | |
| US20070175507A1 (en) | High efficiency photovoltaic cells | |
| US11437535B2 (en) | Voltage-matched multi-junction solar module made of 2D materials | |
| JP2017505989A (en) | Integration of epitaxial lift-off solar cells with a small parabolic concentrator by printing method | |
| CN102484147A (en) | Multi-junction photovoltaic cell with nanowires | |
| US9455364B2 (en) | Tunnel homojunctions in group IV / group II-VI multijunction solar cells | |
| US20120180857A1 (en) | Conversion solar cell | |
| US20140014169A1 (en) | Nanostring mats, multi-junction devices, and methods for making same | |
| US20110277820A1 (en) | Solar Cell Structure Including A Silicon Carrier Containing A By-Pass Diode | |
| JP2014220351A (en) | Multi-junction solar cell | |
| US9768334B2 (en) | High efficiency solar cells with quantum dots for IR pumping | |
| EP2056362A2 (en) | Multi-junction multi-spectral solar converter | |
| CN104916725A (en) | Three-junction laminated solar cell and manufacturing method thereof | |
| US9991407B1 (en) | Process for creating high efficiency photovoltaic cells | |
| US20130240010A1 (en) | Solar cell and manufacturing method thereof | |
| Cheek et al. | Thin film PV: Moving at the speed of solar | |
| KR101464086B1 (en) | Solar cell structure using multiple junction compound | |
| WO2012173619A1 (en) | Tunnel heterojunctions in group iv / goup ii-vi multijunction solar cells | |
| TWI383509B (en) | A method of stacking solar cells |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
| AS | Assignment |
Owner name: NANOX-MEDICAL CORP., NEW YORK Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, CHIA GEE;CHENG, ZHAO;REEL/FRAME:045494/0677 Effective date: 20180410 |
|
| FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
| LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
| STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
| FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20210919 |
|
| PRDP | Patent reinstated due to the acceptance of a late maintenance fee |
Effective date: 20220527 |
|
| FEPP | Fee payment procedure |
Free format text: PETITION RELATED TO MAINTENANCE FEES FILED (ORIGINAL EVENT CODE: PMFP); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY Free format text: PETITION RELATED TO MAINTENANCE FEES GRANTED (ORIGINAL EVENT CODE: PMFG); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY Free format text: SURCHARGE, PETITION TO ACCEPT PYMT AFTER EXP, UNINTENTIONAL. (ORIGINAL EVENT CODE: M2558); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
| MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2551); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY Year of fee payment: 4 |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
| FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
| LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
| STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
| FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20250919 |