US9023921B2 - Method for inhibiting crystal growth rate of amide compound and method for producing molded article of polyolefin-based resin - Google Patents
Method for inhibiting crystal growth rate of amide compound and method for producing molded article of polyolefin-based resin Download PDFInfo
- Publication number
- US9023921B2 US9023921B2 US13/264,488 US201013264488A US9023921B2 US 9023921 B2 US9023921 B2 US 9023921B2 US 201013264488 A US201013264488 A US 201013264488A US 9023921 B2 US9023921 B2 US 9023921B2
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- US
- United States
- Prior art keywords
- polyolefin
- based resin
- carbon atoms
- amide compound
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- -1 amide compound Chemical class 0.000 title claims abstract description 255
- 229920005672 polyolefin resin Polymers 0.000 title claims abstract description 230
- 239000013078 crystal Substances 0.000 title claims abstract description 115
- 238000000034 method Methods 0.000 title claims abstract description 87
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 52
- 230000002401 inhibitory effect Effects 0.000 title claims abstract description 36
- 125000004432 carbon atom Chemical group C* 0.000 claims description 111
- 239000011342 resin composition Substances 0.000 claims description 53
- 238000002844 melting Methods 0.000 claims description 51
- 230000008018 melting Effects 0.000 claims description 51
- 239000002253 acid Substances 0.000 claims description 38
- 238000004090 dissolution Methods 0.000 claims description 37
- 238000002156 mixing Methods 0.000 claims description 35
- 239000004743 Polypropylene Substances 0.000 claims description 28
- 238000000465 moulding Methods 0.000 claims description 26
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 21
- 125000002947 alkylene group Chemical group 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 16
- 229920006395 saturated elastomer Polymers 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 14
- 229920005673 polypropylene based resin Polymers 0.000 claims description 14
- 125000001931 aliphatic group Chemical group 0.000 claims description 12
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 125000002723 alicyclic group Chemical group 0.000 claims description 10
- 150000004982 aromatic amines Chemical group 0.000 claims description 10
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical group OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 10
- 239000002667 nucleating agent Substances 0.000 claims description 10
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 claims description 7
- 238000002425 crystallisation Methods 0.000 claims description 6
- 230000008025 crystallization Effects 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- GAODDBNJCKQQDY-UHFFFAOYSA-N 2-methyl-4,6-bis(octylsulfanylmethyl)phenol Chemical compound CCCCCCCCSCC1=CC(C)=C(O)C(CSCCCCCCCC)=C1 GAODDBNJCKQQDY-UHFFFAOYSA-N 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 34
- 238000001556 precipitation Methods 0.000 description 27
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 238000011156 evaluation Methods 0.000 description 22
- 0 *C.OC1=CC=CC=C1 Chemical compound *C.OC1=CC=CC=C1 0.000 description 21
- 239000000203 mixture Substances 0.000 description 21
- 239000008188 pellet Substances 0.000 description 16
- 238000004898 kneading Methods 0.000 description 15
- 239000000047 product Substances 0.000 description 15
- 239000003112 inhibitor Substances 0.000 description 11
- 229920000098 polyolefin Polymers 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- MBSRTKPGZKQXQR-UHFFFAOYSA-N 2-n,6-n-dicyclohexylnaphthalene-2,6-dicarboxamide Chemical compound C=1C=C2C=C(C(=O)NC3CCCCC3)C=CC2=CC=1C(=O)NC1CCCCC1 MBSRTKPGZKQXQR-UHFFFAOYSA-N 0.000 description 10
- 239000003607 modifier Substances 0.000 description 8
- 241000519995 Stachys sylvatica Species 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- JOKYEDJSHIKSBI-UHFFFAOYSA-N n-cyclohexyl-4-[3-[4-(cyclohexylcarbamoyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound C=1C=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)NC2CCCCC2)C=CC=1C(=O)NC1CCCCC1 JOKYEDJSHIKSBI-UHFFFAOYSA-N 0.000 description 7
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 6
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 6
- LSBZKVAABYOMQH-UHFFFAOYSA-N C1=CC=C(C2OCC3(CO2)COC(C2=CC=CC=C2)OC3)C=C1.CC.CC Chemical compound C1=CC=C(C2OCC3(CO2)COC(C2=CC=CC=C2)OC3)C=C1.CC.CC LSBZKVAABYOMQH-UHFFFAOYSA-N 0.000 description 5
- 239000004594 Masterbatch (MB) Substances 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 150000004665 fatty acids Chemical class 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 4
- 241000251468 Actinopterygii Species 0.000 description 4
- KBLJNRAGGVUKLM-UHFFFAOYSA-N C1=CC=C2C=CC=CC2=C1.CC.CC Chemical compound C1=CC=C2C=CC=CC2=C1.CC.CC KBLJNRAGGVUKLM-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 230000000051 modifying effect Effects 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920005629 polypropylene homopolymer Polymers 0.000 description 4
- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- PLRFTHZEIJHEBJ-UHFFFAOYSA-N 2-n,6-n-bis(1-tert-butylcyclohexyl)naphthalene-2,6-dicarboxamide Chemical compound C=1C=C2C=C(C(=O)NC3(CCCCC3)C(C)(C)C)C=CC2=CC=1C(=O)NC1(C(C)(C)C)CCCCC1 PLRFTHZEIJHEBJ-UHFFFAOYSA-N 0.000 description 3
- IBOIHWVWMGMAIL-UHFFFAOYSA-N 2-n,6-n-bis(2,3-dimethylcyclohexyl)naphthalene-2,6-dicarboxamide Chemical compound CC1C(C)CCCC1NC(=O)C1=CC=C(C=C(C=C2)C(=O)NC3C(C(C)CCC3)C)C2=C1 IBOIHWVWMGMAIL-UHFFFAOYSA-N 0.000 description 3
- IXHLYXZSIBLXFV-UHFFFAOYSA-N 2-n,6-n-bis(2-methylcyclohexyl)naphthalene-2,6-dicarboxamide Chemical compound CC1CCCCC1NC(=O)C1=CC=C(C=C(C=C2)C(=O)NC3C(CCCC3)C)C2=C1 IXHLYXZSIBLXFV-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Oc1ccccc1 Chemical compound Oc1ccccc1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000000071 blow moulding Methods 0.000 description 3
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 3
- 238000000113 differential scanning calorimetry Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- BGBHHERYEGLHMF-UHFFFAOYSA-N n-(2,4-ditert-butylcyclohexyl)-4-[3-[4-[(2,4-ditert-butylcyclohexyl)carbamoyl]phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound CC(C)(C)C1CC(C(C)(C)C)CCC1NC(=O)C1=CC=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)NC2C(CC(CC2)C(C)(C)C)C(C)(C)C)C=C1 BGBHHERYEGLHMF-UHFFFAOYSA-N 0.000 description 3
- GSUVDDINWMUONZ-UHFFFAOYSA-N n-(4-tert-butylcyclohexyl)-4-[3-[4-[(4-tert-butylcyclohexyl)carbamoyl]phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound C1CC(C(C)(C)C)CCC1NC(=O)C1=CC=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)NC2CCC(CC2)C(C)(C)C)C=C1 GSUVDDINWMUONZ-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920005678 polyethylene based resin Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- NWDVCUXGELFJOC-UHFFFAOYSA-N 1-n,2-n,3-n-tris(2-methylcyclohexyl)propane-1,2,3-tricarboxamide Chemical compound CC1CCCCC1NC(=O)CC(C(=O)NC1C(CCCC1)C)CC(=O)NC1C(C)CCCC1 NWDVCUXGELFJOC-UHFFFAOYSA-N 0.000 description 2
- DCTOHCCUXLBQMS-UHFFFAOYSA-N 1-undecene Chemical compound CCCCCCCCCC=C DCTOHCCUXLBQMS-UHFFFAOYSA-N 0.000 description 2
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 2
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 description 2
- XRJAKPQVGWIMDI-UHFFFAOYSA-N 2-n,6-n-bis(4-tert-butylphenyl)naphthalene-2,6-dicarboxamide Chemical compound C1=CC(C(C)(C)C)=CC=C1NC(=O)C1=CC=C(C=C(C=C2)C(=O)NC=3C=CC(=CC=3)C(C)(C)C)C2=C1 XRJAKPQVGWIMDI-UHFFFAOYSA-N 0.000 description 2
- ROXGIXYSKPWZEM-UHFFFAOYSA-N 2-n,6-n-di(cyclododecyl)naphthalene-2,6-dicarboxamide Chemical compound C=1C=C2C=C(C(=O)NC3CCCCCCCCCCC3)C=CC2=CC=1C(=O)NC1CCCCCCCCCCC1 ROXGIXYSKPWZEM-UHFFFAOYSA-N 0.000 description 2
- IWUJLUPWTMGHPJ-UHFFFAOYSA-N 2-n,6-n-di(cyclooctyl)naphthalene-2,6-dicarboxamide Chemical compound C=1C=C2C=C(C(=O)NC3CCCCCCC3)C=CC2=CC=1C(=O)NC1CCCCCCC1 IWUJLUPWTMGHPJ-UHFFFAOYSA-N 0.000 description 2
- BWPJTCIJWNGYFT-UHFFFAOYSA-N 2-n,6-n-dicyclopentylnaphthalene-2,6-dicarboxamide Chemical compound C=1C=C2C=C(C(=O)NC3CCCC3)C=CC2=CC=1C(=O)NC1CCCC1 BWPJTCIJWNGYFT-UHFFFAOYSA-N 0.000 description 2
- QWVBYALCTDIEIB-UHFFFAOYSA-N 2-n,7-n-dicyclohexylnaphthalene-2,7-dicarboxamide Chemical compound C=1C=C2C=CC(C(=O)NC3CCCCC3)=CC2=CC=1C(=O)NC1CCCCC1 QWVBYALCTDIEIB-UHFFFAOYSA-N 0.000 description 2
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 2
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 2
- GEPWIMZDDAXJJP-UHFFFAOYSA-N 4-[3-(4-carbamoylphenyl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C1OCC2(COC(OC2)C=2C=CC(=CC=2)C(N)=O)CO1 GEPWIMZDDAXJJP-UHFFFAOYSA-N 0.000 description 2
- XISFXHKEFRPZHK-UHFFFAOYSA-N 4-[3-[4-(diphenylcarbamoyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-n,n-diphenylbenzamide Chemical compound C=1C=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)N(C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1C(=O)N(C=1C=CC=CC=1)C1=CC=CC=C1 XISFXHKEFRPZHK-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- JULJUAKZHYTSBV-UHFFFAOYSA-N [4-[3-[4-(piperidine-1-carbonyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]phenyl]-piperidin-1-ylmethanone Chemical compound C=1C=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)N2CCCCC2)C=CC=1C(=O)N1CCCCC1 JULJUAKZHYTSBV-UHFFFAOYSA-N 0.000 description 2
- XSBAMYIKZDWTQE-UHFFFAOYSA-N [4-[3-[4-(pyrrolidine-1-carbonyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]phenyl]-pyrrolidin-1-ylmethanone Chemical compound C=1C=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)N2CCCC2)C=CC=1C(=O)N1CCCC1 XSBAMYIKZDWTQE-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001412 amines Chemical group 0.000 description 2
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 2
- 239000008116 calcium stearate Substances 0.000 description 2
- 235000013539 calcium stearate Nutrition 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 125000005647 linker group Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N methylene hexane Natural products CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- 239000013081 microcrystal Substances 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- QZLPDBKEVWFQNF-UHFFFAOYSA-N n,n'-diphenylhexanediamide Chemical compound C=1C=CC=CC=1NC(=O)CCCCC(=O)NC1=CC=CC=C1 QZLPDBKEVWFQNF-UHFFFAOYSA-N 0.000 description 2
- ZFCYQBRMDFUTCG-UHFFFAOYSA-N n,n-dicyclohexyl-4-[3-[4-(dicyclohexylcarbamoyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound C=1C=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)N(C2CCCCC2)C2CCCCC2)C=CC=1C(=O)N(C1CCCCC1)C1CCCCC1 ZFCYQBRMDFUTCG-UHFFFAOYSA-N 0.000 description 2
- OGCMGQVAZUIRNZ-UHFFFAOYSA-N n-(1-adamantyl)-4-[3-[4-(1-adamantylcarbamoyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound C1C(C2)CC(C3)CC2CC13NC(=O)C(C=C1)=CC=C1C(OC1)OCC1(CO1)COC1C(C=C1)=CC=C1C(=O)NC1(C2)CC(C3)CC2CC3C1 OGCMGQVAZUIRNZ-UHFFFAOYSA-N 0.000 description 2
- HNIJCGGJGKUROP-UHFFFAOYSA-N n-(2,3-dimethylcyclohexyl)-4-[3-[4-[(2,3-dimethylcyclohexyl)carbamoyl]phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound CC1C(C)CCCC1NC(=O)C1=CC=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)NC2C(C(C)CCC2)C)C=C1 HNIJCGGJGKUROP-UHFFFAOYSA-N 0.000 description 2
- YAADMTDSEMJUCB-UHFFFAOYSA-N n-(4-tert-butylphenyl)-4-[3-[4-[(4-tert-butylphenyl)carbamoyl]phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound C1=CC(C(C)(C)C)=CC=C1NC(=O)C1=CC=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)NC=2C=CC(=CC=2)C(C)(C)C)C=C1 YAADMTDSEMJUCB-UHFFFAOYSA-N 0.000 description 2
- DBAKIQICBSVAGJ-UHFFFAOYSA-N n-butyl-4-[3-[4-(butylcarbamoyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound C1=CC(C(=O)NCCCC)=CC=C1C1OCC2(COC(OC2)C=2C=CC(=CC=2)C(=O)NCCCC)CO1 DBAKIQICBSVAGJ-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/134—Phenols containing ester groups
- C08K5/1345—Carboxylic esters of phenolcarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/156—Heterocyclic compounds having oxygen in the ring having two oxygen atoms in the ring
- C08K5/1575—Six-membered rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
Definitions
- the present invention relates to a method for inhibiting the crystal growth rate of an amide compound that is present in a molten polyolefin-based resin, a crystal growth rate inhibitor for an amide compound, use of a phenol compound as a crystal growth rate inhibitor for an amide compound, and a method for producing a polyolefin-based resin molded article.
- polyolefin-based resins excel in moldability, mechanical properties, electrical properties and the like, they are used in various fields as materials for film forming (forming for film production), sheet forming (forming for sheet production), blow molding, injection molding, and the like.
- polyolefin-based resins generally have excellent physical properties, they are poor in transparency, crystallinity, and rigidity.
- technologies have been proposed in which amide compounds and the like are utilized as nucleating agents (Patent Literatures 1 to 5). When polyolefin-based resin compositions containing such amide compounds are molded, molded articles that excel in transparency and mechanical strength can be obtained.
- injection molding for example, it is necessary to combine and set various factors such as injection speed, injection pressure, resin temperature (cylinder temperature, nozzle temperature, and the like), resin injection amount, screw rotation speed, mold temperature, mold shape, gate-seal time, and the like.
- the setting operation is complicated and thus requires effort and time. If such settings are inappropriate, the inappropriateness adversely affects the physical properties of molded articles, or causes white spots or fish eyes due to undissolved matter of a nucleating agent remaining, resulting in defects in the appearance of polyolefin molded articles.
- An object of the present invention is to provide a method for inhibiting the crystal growth rate of an amide compound that is present in a molten polyolefin-based resin, a crystal growth rate inhibitor for an amide compound, use of a phenol compound as a crystal growth rate inhibitor for an amide compound, and a method for producing a polyolefin-based resin molded article.
- the inventors of the present invention produced a molded article using a specific amide compound while optimizing the production conditions.
- the pressure of an extruder increased (such increase was mainly caused by clogging of a screen mesh or the like, and in this case, reduced productivity due to wasted operation time, loss in resin and the like that were caused by screen mesh replacement is posed as a problem), or white spots or fish eyes were developed in the molded article.
- the crystal growth rate of the specific amide compound (microcrystals) which was completely dissolved in the polyolefin-based resin and then cooled to be crystallized in the polyolefin-based resin was relatively high in the molten polyolefin-based resin.
- the crystal growth rate of the amide compound was relatively high when a resin temperature was generally in the range of 180 to 260° C., although the crystal growth rate depends on the type or content of the amide compound.
- the amide compound has a nucleating effect on the polyolefin-based resin. However, due to the crystal growth, the surface area of the amid compound was reduced, and thus the nucleating effect tended to be reduced.
- the inventors of the present invention thought that a technique to inhibit the crystal growth of the specific amide compound was needed in addition to the optimization of the molding conditions, and as a result of thorough research, the inventors found that when a phenol compound coexisted in the polyolefin-based resin in a range of a specific amount with respect to the specific amide compound, the crystal growth rate of the amide compound present in the molten polyolefin-based resin was able to be remarkably inhibited.
- the inventors of the present invention considered, as follows, the phenomenon that crystals of an amide compound present in a polyolefin-based resin in a molten state grow.
- a state where the amide compound is present in the polyolefin-based resin in a molten state is a state where it is in a temperature range lower than the temperature at which the amide compound is completely dissolved in the molten polyolefin-based resin.
- the amide compound present as crystals and the amide compound dissolved in the molten polyolefin-based resin are present. In general, it is thought that in this state, dissolution and precipitation of crystals are held in equilibrium.
- the polyolefin-based resin having a relatively low polarity and the amide compound having a relatively high polarity have poor compatibility with each other.
- the crystals of the amide compound are likely to aggregate rather than be dissolved in the polyolefin-based resin, and consequently the crystals of the amide compound grow.
- the inventors of the present invention thought that the inhibiting effect of the present invention is caused by the interaction between the specific amide compound and the phenol compound, in other words, it is related to decrease in the solubility of the amide compound to the molten polyolefin resin, inhibition of aggregation of the crystals, and the like.
- the interaction also influences the dissolution temperature of the amide compound. This influence is that it is recognized that with regard to the blending ratio of the amide compound and the phenol compound, when the rate of the phenol compound is high, the dissolution temperature tends to increase (below-described examples).
- a method for producing a polyolefin-based resin molded article comprising a step of molding a molten polyolefin-based resin composition in which crystals of an amide compound represented by the following general formula (1) are present in a polyolefin-based resin in a molten state, wherein the molten polyolefin-based resin composition contains a phenol compound, and a blending ratio of the amide compound and the phenol compound is 60:40 to 10:90 (weight ratio), general formula (1): R 1 —(CONHR 2 ) n (1),
- R 1 represents a saturated or unsaturated aliphatic polycarboxylic acid residue having 3 to 6 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 25 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 25 carbon atoms
- two to four R 2 s are the same or different and each represent a saturated or unsaturated aliphatic amine residue having 5 to 22 carbon atoms, an alicyclic amine residue having 5 to 20 carbon atoms, or an aromatic amine residue having 6 to 20 carbon atoms.
- m represents an integer of 2 to 5
- m R 3 s are the same or different and each represent a linear or branched alkyl group having 1 to 25 carbon atoms that may have an ester bond, a thioether bond, or an ether bond, general formula (2b):
- p represents an integer of 1 to 4
- p R's are the same as those in the formula (2a)
- X represents a linear or branched alkylene group having 1 to 10 carbon atoms that may have an ester bond or an ether bond, or general formula (2c):
- q represents an integer of 1 to 4
- q R 3 s are the same as those in the formula (2a)
- Y represents a linear or branched alkylene group having 1 to 10 carbon atoms.
- (Item 7) The method for producing a polyolefin-based resin molded article according to any one of Items 1 to 6, wherein a blending amount of the amide compound is 0.07 to 1 parts by weight per 100 parts by weight of the polyolefin-based resin.
- (Item 8) The method for producing a polyolefin-based resin molded article according to any one of Items 1 to 7, wherein the polyolefin-based resin is a polypropylene-based resin, the amide compound is a ⁇ -form crystallization nucleating agent for polypropylene, and the polyolefin-based resin molded article is a polypropylene-based resin molded article having a ⁇ -form crystal content of 50% or higher.
- R 1 represents a saturated or unsaturated aliphatic polycarboxylic acid residue having 3 to 6 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 25 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 25 carbon atoms
- two to four R 2 s are the same or different and each represent a saturated or unsaturated aliphatic amine residue having 5 to 22 carbon atoms, an alicyclic amine residue having 5 to 20 carbon atoms, or an aromatic amine residue having 6 to 20 carbon atoms.
- m represents an integer of 2 to 5
- m R 3 s are the same or different and each represent a linear or branched alkyl group having 1 to 25 carbon atoms that may have an ester bond, a thioether bond, or an ether bond, general formula (2b):
- p represents an integer of 1 to 4
- p R 3 s are the same as those in the formula (2a)
- X represents a linear or branched alkylene group having 1 to 10 carbon atoms that may have an ester bond or an ether bond, or general formula (2c):
- q represents an integer of 1 to 4
- q R 3 s are the same as those in the formula (2a)
- Y represents a linear or branched alkylene group having 1 to 10 carbon atoms.
- R 1 represents a saturated or unsaturated aliphatic polycarboxylic acid residue having 3 to 6 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 25 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 25 carbon atoms
- two to four R 2 s are the same or different and each represent a saturated or unsaturated aliphatic amine residue having 5 to 22 carbon atoms, an alicyclic amine residue having 5 to 20 carbon atoms, or an aromatic amine residue having 6 to 20 carbon atoms.
- R 1 represents a saturated or unsaturated aliphatic polycarboxylic acid residue having 3 to 6 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 25 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 25 carbon atoms
- two to four R 2 s are the same or different and each represent a saturated or unsaturated aliphatic amine residue having 5 to 22 carbon atoms, an alicyclic amine residue having 5 to 20 carbon atoms, or an aromatic amine residue having 6 to 20 carbon atoms.
- the crystal growth rate of an amide compound that is present in a molten polyolefin-based resin can be inhibited.
- the present invention can contribute to improvement of productivity by suppressing increase in the pressure of a molding machine or the like that is caused by growth of crystals of the amide compound (by reducing clogging of a screen mesh or the like), and can contribute to improvement of the appearance of a molded article by reducing white spots that are based on the amide compound in the polyolefin molded article.
- a producing method of the present invention is a method for producing a polyolefin-based resin molded article, comprising a step of molding a molten polyolefin-based resin composition in which crystals of an amide compound represented by the above general formula (1) are present in a polyolefin-based resin in a molten state.
- the molten polyolefin-based resin composition contains a phenol compound, and a blending ratio of the amide compound and the phenol compound is 60:40 to 10:90 (weight ratio).
- a mode is recommended in which the phenol compound is 0.07 to 1 parts by weight per 100 parts by weight of the polyolefin-based resin and/or the amide compound is 0.07 to 1 parts by weight per 100 parts by weight of the polyolefin-based resin.
- performing molding in a state where crystals of the amide compound are present in the molding step contributes to improvement of physical properties such as improvement of the rigidity of the molded article.
- the molecular chain of polyolefin tends to exhibit orientation due to this molding method, and thus the molded article tends to exhibit orientation.
- polyolefin resin according to the present invention examples include polyethylene-based resins, polypropylene-based resins, polymethylpentene-based resins, and polybutene-based resins, and these resins can be used singly or as mixtures of two or more types as appropriate.
- examples of polyethylene-based resins include high density polyethylene, medium density polyethylene, linear polyethylene, and ethylene copolymers having ethylene contents of 50 wt % or more (preferably 70 wt % or more, and particularly 85 wt % or more);
- examples of polypropylene-based resins include propylene homopolymers and propylene copolymers having propylene contents of 50 wt % or more (preferably 70 wt % or more, and particularly 85 wt % or more);
- examples of polybutene-based resins include butene homopolymers and butene copolymers having butene contents of 50 wt % or more (preferably 70 wt % or more, and particularly 85 wt % or more);
- examples of polymethylpentene-based resins include methylpentene homopolymers, methylpentene copolymers having methylpentene contents of 50 wt % or more (preferably 70 wt % or more, and
- copolymers may be random copolymers or block copolymers. When these resins have stereoregularity, these resins may be isotactic or syndiotactic.
- ⁇ -olefins having 2 to 12 carbon atoms such as ethylene, propylene, butene, pentene, hexene, heptene, octene, nonene, decene, undecene, and dodecene
- bicyclo-type monomers such as 1,4-endomethylenecyclohexene
- polyethylene-based resins and polypropylene-based resins are preferred, and polypropylene-based resins are particularly recommended.
- catalysts used for producing such polymers include not only generally used Ziegler-Natta catalysts, but also catalyst systems comprising a combination of a catalyst in which a transition metal compound (e.g., a titanium halide such as titanium trichloride, titanium tetrachloride or the like) supported on a support comprising, as a principal component, a magnesium halide such as magnesium chloride, with an alkylaluminum compound (tetraethylaluminum, diethylaluminum chloride or the like), and metallocene catalysts.
- a transition metal compound e.g., a titanium halide such as titanium trichloride, titanium tetrachloride or the like
- magnesium halide such as magnesium chloride
- alkylaluminum compound tetraethylaluminum, diethylaluminum chloride or the like
- the melt flow rate (measured according to JIS K 7210-1995) of the polyolefin-based resin according to the present invention is suitably selected according to the molding method to be used, and the recommended melt flow rate is normally 0.01 to 200 g/10 minutes and preferably 0.05 to 100 g/10 minutes.
- the amide compound according to the present invention is at least one amide compound represented by the above general formula (1).
- the amide compound can be produced according to a known method, or commercial products can also be used.
- the amide compound is used as a nucleating agent for a polyolefin-based resin.
- n is 2 to 4, and an integer of 2 or 3 is preferably recommended.
- R 1 is a saturated aliphatic polycarboxylic acid residue having 3 to 6 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 25 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 25 carbon atoms, a saturated aliphatic polycarboxylic acid residue having 3 to 5 carbon atoms, an alicyclic polycarboxylic acid residue having 5 to 10 carbon atoms, and an aromatic polycarboxylic acid residue having 6 to 22 carbon atoms are preferably recommended, and a saturated aliphatic polycarboxylic acid residue having 3 or 4 carbon atoms and an aromatic polycarboxylic acid residue having 10 to 20 carbon atoms are particularly recommended.
- n R 2 s are the same or different and each are a saturated aliphatic amine residue having 5 to 22 carbon atoms, a saturated alicyclic amine residue having 5 to 20 carbon atoms, or an aromatic amine residue having 6 to 20 carbon atoms, a saturated aliphatic amine residue having 6 to 10 carbon atoms, a saturated alicyclic amine residue having 5 to 14 carbon atoms, or an aromatic amine residue having 6 to 14 carbon atoms is preferably recommended, and a saturated alicyclic amine residue having 5 to 12 carbon atoms is particularly recommended.
- polycarboxylic acid residue refers to the groups remaining as a result of removing all the carboxyl groups from polycarboxylic acid, and the number of the carbon atoms indicates the total number of the carbon atoms in the polycarboxylic acid residue.
- amine residue refers to the groups remaining as a result of removing the amino groups from a monoamine, and the number of the carbon atoms indicates the total number of the carbon atoms in the amine residue.
- amide compound examples include N,N′-dicyclohexyl-1,4-cyclohexanedicarboxamide, N,N′-dicyclohexyl-terephthalamide, N,N′-dicyclohexyl-4,4′-biphenyldicarboxamide, N,N′-dicyclopentyl-4,4′-biphenyldicarboxamide, N,N′-dicyclooctyl-4,4′-biphenyldicarboxamide, N,N′-dicyclododecyl-4,4′-biphenyldicarboxamide, N,N′-dicyclohexyl-2,2′-biphenyldicarboxamide, N,N′-diphenylhexanediamide, N,N′-bis(p-methylphenyl)hexanediamide, N,N′-bis(p-ethylphenyl)hexanediamide, N,N,N
- N,N′-dicyclohexyl-2,6-naphthalenedicarboxamide, N,N′-di(2-methylcyclohexyl)-2,6-naphthalenedicarboxamide, N,N′-di(2,3-dimethylcyclohexyl)-2,6-naphthalenedicarboxamide, and N,N′-di(t-butylcyclohexyl)-2,6-naphthalenedicarboxamide are recommended.
- the polyolefin-based resin is a polypropylene-based resin
- a ⁇ -form crystallization nucleating agent that can cause the crystal form of the polypropylene-based resin to be ⁇ -form crystal when the polypropylene-based resin is molded is recommended among the amide compounds represented by the above general formula (1). In this case, the effect of the present invention is remarkably exerted.
- the ⁇ -form crystallization nucleating agent one that allows a polypropylene-based resin molded article having a ⁇ -form crystal content of preferably 50% or higher and more preferably 60% or higher to be formed is preferred.
- preferable examples of the above general formula (1) include general formula (1) wherein R 1 has formula (a) and formula (b). More preferably, the case where R 2 is a saturated alicyclic amine residue having 5 to 20 carbon atoms is recommended. More specific examples thereof include those described as the above-mentioned specific examples of formula (a) and the above-mentioned specific examples of formula (b).
- ⁇ -form crystal content For the ⁇ -form crystal content according to the present invention, an appropriate amount of a sample for evaluation is taken from the polypropylene-based resin molded article, and differential scanning calorimetry (DSC) is conducted under a nitrogen atmosphere at a temperature increase rate of 20° C./min. From the amounts of heat of fusion of ⁇ -form crystals and ⁇ -form crystals that are obtained from the DSC thermogram, the ⁇ -form crystal content is calculated according to the following equation.
- ⁇ -form crystal content (%) 100 ⁇ H ⁇ /( H ⁇ +H ⁇ ) [wherein, H ⁇ represents the amount of heat of fusion of ⁇ -form crystals (unit: J/g), and H ⁇ represents the amount of heat of fusion of ⁇ -form crystals (unit: J/g).]
- the crystal system of the amide compound according to the present invention is not particularly limited as long as the effect of the present invention is obtained, and any crystal systems such as hexagonal system, monoclinic system, and cubic system can be used. These crystals are also known or can also be produced according to known methods. For example, these crystals can be obtained by conducting an amidation reaction using polycarboxylic acid and a monoamine as raw materials according to the description of Japanese Unexamined Patent Publication No. H07-242610 or Japanese Unexamined Patent Publication No. H07-188245. In addition, these crystals can also be obtained by amidating reactive derivatives such as acid anhydrides and chlorides of these polycarboxylic acids, and ester compounds of these polycarboxylic acids and lower alcohol having 1 to 4 carbon atoms.
- An amide compound produced according to a known method may contain a small amount of impurity, but its recommended purity is preferably equal to or more than 90 wt %, more preferably equal to or more than 95 wt %, and particularly preferably equal to or more than 97 wt %.
- the impurity include partially amidated products derived from reaction intermediates or unreacted materials, and imide compounds derived from side reaction products.
- the particle size of the amide compound blended in the present invention is not particularly limited as long as the effect of the present invention is obtained.
- the particle size is preferably as small as possible, and the maximum particle size measured by laser diffraction light scattering measurement is normally equal to or less than 200 ⁇ m, preferably equal to or less than 100 ⁇ m, more preferably equal to or less than 50 ⁇ m, and particularly preferably equal to or less than 10 ⁇ m.
- the method for adjusting the maximum particle size within the above range include a method in which a usual apparatus known in this field is used to perform fine grinding and classify these fine particles.
- fluidized bed type counter jet mil 100AFG apparatus name, manufactured by Hosokawa Micron Corporation
- supersonic jet mil PJM-200 apparatus name, manufactured by Nippon Pneumatic MFG. Co., Ltd.
- the recommended content of the amide compound is preferably 0.07 to 1 parts by weight, more preferably 0.1 to 0.7 parts by weight, and particularly 0.1 to 0.5 parts by weight, per 100 parts by weight of the polyolefin-based resin. In this range, a significant difference is recognized in the effect of the invention.
- the amide compound is less than 0.07 parts by weight, the modifying effect as the nucleating agent may not sufficiently be exerted.
- the amide compound exceeds 1 parts by weight, it is difficult to obtain the modifying effect corresponding to the amount of addition, and further the dissolution to the polyolefin-based resin is difficult and the tendency that the appearance is worsened by white spots, fish eyes and the like is recognized.
- the phenol compound according to the present invention is preferably those of the above formulae (2a), (2b), and (2c).
- the phenol compound can be produced according to a known method, or commercial products can also be used.
- m is an integer of 2 to 5, preferably an integer of 2 to 4, and more preferably 3.
- Each R 3 is a linear or branched alkyl group having 1 to 25 carbon atoms that may have an ester bond, a thioether bond, or an ether bond.
- each R 3 does not have a linking group of an ester bond, a thioether bond, or an ether bond, each R 3 is preferably a linear or branched alkyl group having preferably 1 to 6 carbon atoms and more preferably 1 to 4 carbon atoms.
- each R 3 is preferably a linear or branched alkyl group having preferably 5 to 25 carbon atoms and more preferably 8 to 22 carbon atoms.
- m R 3 s may be the same or different.
- each R 3 is preferably located at ortho position or para position with respect to a hydroxyl group, and it is particularly recommended that at least one R 3 is located at ortho position.
- R 3 s are the same as those in the above formula (2a).
- R 3 s are the same as those in the above formula (2a).
- examples thereof include 2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-4-ethylphenol, n-octadecyl- ⁇ -(4′-hydroxy-3′,5′-di-tert-butylphenyl)propionate, and 2,4-bis(octylthiomethyl)-6-methylphenol.
- p is an integer of 1 to 4, preferably an integer of 2 to 4, and more preferably 2.
- X represents a linear or branched alkylene group having 1 to 10 carbon atoms and preferably 1 to 6 carbon atoms that may have an ester bond or an ether bond.
- q is an integer of 1 to 4, preferably an integer of 2 to 4, and more preferably 2.
- Y represents a linear or branched alkylene group having 1 to 10 carbon atoms and preferably 1 to 4 carbon atoms.
- phenol compounds include 2,6-bis(1, dimethylethyl)-4-methylphenol, tocopherol, 2,2′-methylenebis(4-methyl-6-tert-butylphenol), 2,2′-methylenebis(4-ethyl-6-tert-butylphenol), 4,4′-butylidenebis(6-tert-butyl-m-cresol), 1,1-bis(2′-methyl-4′-hydroxy-5′-tert-butylphenyl)butane, 4,4′-thiobis(6-tert-butyl-m-cresol), 4,4′-thiobis(3-methyl-6-tert-butylphenol), 3,5-di-tert-butyl-4-hydroxybenzylphosphonic acid mono-ethyl ester calcium salt, 2,2′-oxamidebis[ethyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2,2′-ethylidenebis(
- the blending ratio, amide compound:phenol compound is 60:40 to 10:90 (weight ratio) and preferably 60:40 to 20:80 (weight ratio).
- the phenol compound is less than 60:40, the effect of the present invention is not sufficiently exerted.
- the phenol compound is more than 10:90, it is difficult to obtain the effect corresponding to this used amount, and this is not economically preferable.
- the phenol compound is preferably recommended to be in the range of 0.07 to 1 parts by weight, and more preferably recommended to be in the range of 0.08 to 0.8 parts by weight, per 100 parts by weight of the polyolefin-based resin.
- the phenol compound is less than 0.07 parts by weight, the effect of the present invention may not stably and sufficiently be exerted.
- the phenol compound is used in an amount exceeding 1 parts by weight, the tendency that a resin molded article is colored in yellow or yellowish green is recognized, and this is not preferable.
- a method for incorporating the phenol compound into the polyolefin-based resin is not particularly limited as long as the phenol compound can be incorporated into the polyolefin-based resin in a blending ratio, amide compound:phenol compound, of 60:40 to 10:90 (weight ratio) when or prior to molding the polyolefin resin composition containing the amide compound, and a known method can be used.
- the method for producing a polyolefin-based resin molded article of the present invention includes a step of molding a molten polyolefin-based resin composition in a specific state, and the specific state means that crystals of the amide compound represented by the above general formula (1) are present in the polyolefin-based resin in a molten state.
- the method for causing the crystals of the amide compound to be present in the polyolefin-based resin in a molten state is not particularly limited.
- examples thereof include a method in which the amide compound is heated and dissolved in the polyolefin-based resin and then cooled to precipitate crystals of the amide compound to obtain a polyolefin-based resin composition, and subsequently the polyolefin-based resin composition is heated to a temperature that is higher than the melting point of the polyolefin-based resin and lower than the dissolution temperature of the amide compound, and a method in which the amide compound and the polyolefin-based resin are dry-blended and the dry-blended product is heated to a temperature in a range that is higher than the melting point of the polyolefin-based resin and lower than the dissolution temperature of the amide compound.
- the former method is preferred.
- the extruded strand is cooled by means of water cooling, air cooling or the like (normally, cooled to a temperature equal to or lower than the crystallization temperature of the polyolefin resin composition, and preferably to room temperature), and the obtained strand is cut to obtain a pellet type polyolefin-based resin composition.
- the polyolefin-based resin composition is heated to a temperature that is equal to or higher than the melting point of the polyolefin-based resin and lower than the dissolution temperature of the amide compound.
- the above procedure (A) or master batch method of the procedure (A) corresponds to a specific description of the procedure of the steps (i) to (iii) according to the present invention (the invention of the above-mentioned item 2 and the configuration according to the invention of the above-mentioned item 11).
- the range of the melting temperature for providing the molten state is specifically a temperature range that is equal to or higher than the melting point of the polyolefin-based resin and lower than the dissolution temperature of the amide compound, and the recommended range is preferably T 1 +10° C. to T 2 ⁇ 10° C., more preferably T 1 +15° C. to T 2 ⁇ 15° C., and particularly T 1 +20° C. to T 2 ⁇ 15° C.
- T 1 represents the “melting point of the polyolefin-based resin”
- T 2 represents, as the “dissolution temperature of the amide compound”, the temperature at which the amide compound present in the polyolefin-based resin composition (a composition whose ingredients are the same as those of the intended polyolefin-based resin molded article) is completely dissolved.
- the relation of the temperature range satisfies (T 1 +10° C.) ⁇ (T 2 ⁇ 10° C.), (T 1 +15° C.) ⁇ (T 2 ⁇ 15° C.), or (T 1 +20° C.) ⁇ (T 2 ⁇ 15° C.).
- the melting point T 1 of the polyolefin-based resin represents a value measured by a method described in [Melting point] in below-described Examples
- the dissolution temperature T 2 of the amide compound represents a value measured by a method described in [Dissolution temperature and precipitation temperature] in below-described Examples.
- a more specific range of the melting temperature is preferably 180 to 260° C., more preferably 190 to 260° C., and even more preferably 200 to 255° C.
- Examples of the method for molding the molten polyolefin-based resin composition according to the present invention include a method in which the pellet type polyolefin-based resin composition is molded by a known molding method (e.g., pressure forming, compression molding, vacuum forming, sheet forming, film forming, blow molding, extrusion thermoforming, extrusion molding, injection molding, spinning or the like) suitable for desired shape and form (film, sheet, bottle, case or the like), to produce a polyolefin molded article.
- a known molding method e.g., pressure forming, compression molding, vacuum forming, sheet forming, film forming, blow molding, extrusion thermoforming, extrusion molding, injection molding, spinning or the like
- the phenol compound is caused to coexist or be blended.
- the timing and procedure for blending the phenol compound is not particularly limited as long as the coexisting state is provided.
- the phenol compound may be blended independently, may be blended together with the amide compound, another modifier or the like, may be blended in batch, or may be divided and blended.
- a conventionally known polyolefin modifier may be added in such a range that the effect of the present invention is exerted.
- modifiers for polyolefin examples include various additives mentioned in “Pojitibu Risuto No Tenkazai Youran (Additives Handbook of Positive List)” edited by Japan Hygienic Olefin and Styrene Plastics Association (January, 2002).
- More specific examples include stabilizers (metallic compounds, epoxy compounds, nitrogen compounds, phosphorus compounds, sulfur compounds and the like), ultraviolet absorbers (benzophenone-based compounds, benzotriazol-based compounds and the like), antioxidants (phosphite-based compounds, sulfur-based compounds), surfactants, lubricants (aliphatic hydrocarbons such as paraffin and wax, and higher fatty acids having 8 to 22 carbon atoms, metal (Al, Ca, Ma, Zn) salts of higher fatty acids having 8 to 22 carbon atoms, fatty acids having 8 to 18 carbon atoms, aliphatic alcohols having 8 to 22 carbon atoms, polyglycols, esters of higher fatty acids having 4 to 22 carbon atoms and aliphatic monohydric alcohols having 4 to 18 carbon atoms, higher fatty acid amides having 8 to 22 carbon atoms, silicone oils, and rosin derivatives), fillers (talc, hydrotalcite, mica, zeolite, perlite, diatomaceous earth, calcium
- a method of the present invention is a method for inhibiting, in a polyolefin-based resin containing an amide compound, the crystal growth rate of the amide compound represented by the above general formula (1) that is present in the molten polyolefin-based resin.
- the above-mentioned phenol compound is incorporated in a weight ratio to the amide compound, amide compound:phenol compound, of 60:40 to 10:90. More preferably, it is recommended that the phenol compound is 0.07 to 1 parts by weight per 100 parts by weight of the polyolefin-based resin and/or the amide compound is 0.07 to 1 parts by weight per 100 parts by weight of the polyolefin-based resin. In this recommended mode, the effect of the present invention is more remarkably or more stably exerted.
- the amide compound present in the molten polyolefin-based resin is an amide compound (microcrystals) which is dissolved in the polyolefin-based resin and cooled to be crystallized in the polyolefin-based resin, remarkableness of the effect of the present invention is recognized.
- a description of the polyolefin resin, the amide compound, and the phenol compound according to the present invention is synonymous with the description in the above ⁇ Method for producing polyolefin-based resin molded article>.
- a description of the phenol compound is synonymous with the description in the above ⁇ Method for producing polyolefin-based resin molded article>.
- the maximum lengths of the crystals of the amide compound present in the molten polyolefin-based resin that was allowed to stand on the hot stage for two hours were visually determined and evaluated.
- a melting point was measured according to JIS K 7121 (1987). About 10 mg of a polyolefin-based resin was set to the apparatus and held at 30° C. for three minutes, and then heated at a heating rate of 10° C./minute, and the highest point of the endothermic peak was regarded as the melting point (° C.).
- a polyolefin-based resin composition whose ingredients are the same as those of the intended polyolefin-based resin molded article was previously prepared.
- a predetermined amount of each ingredient was dry-blended at room temperature, the dry-blended product was melt-kneaded with a twin-screw extruder, and the extruded strand was cooled with water and cut with a pelletizer to obtain a polyolefin-based resin composition in pellet form.
- the kneading temperature was set to a temperature at which the strand became visually transparent.
- the dry-blended product was melt-kneaded with a twin-screw extruder at a kneading temperature (resin temperature) of 300° C. to dissolve N,N′-dicyclohexyl-2,6-naphthalenedicarboxamide, and the extruded strand was cooled with water and cut with a pelletizer to obtain a polyolefin-based resin composition in pellet form.
- the strand was transparent, and no undissolved matter was recognized.
- 100 parts by weight of the obtained polyolefin-based resin composition and 0.3 parts by weight of tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane were dry-blended at room temperature.
- the dry-blended polyolefin-based resin composition was melted and kneaded with a single-screw extruder at a melting temperature (resin temperature) of 230° C. and extruded into strand form, and the strand was cooled with water and then cut with a pelletizer to obtain a polyolefin-based resin molded article (pellet form) of the present invention.
- the effect of inhibiting the crystal growth rate of the amide compound, the dissolution temperature, the precipitation temperature and the like were evaluated using the obtained polyolefin-based resin molded article.
- the inhibiting effect the numbers of crystals equal to or larger than 10 ⁇ m were 0 after one minute, and three after two hours. It is evaluated that this result indicates a high effect of inhibiting the crystal growth rate.
- the dissolution temperature was 295° C.
- the precipitation temperature was 239° C.
- the evaluated crystals are crystals of N,N′-dicyclohexyl-2,6-naphthalenedicarboxamide
- the hot stage temperature was set to 200° C., which is equal to or higher than the melting points of the other additives, the temperature increasing process was observed, and the crystals existed even when the temperature reached 200° C.
- Table 1 summarizes the composition, the production conditions, the evaluation results and the like.
- 100 parts by weight of the above-mentioned polypropylene homopolymer and 9 parts by weight of tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane were dry-blended at room temperature.
- the dry-blended product was extruded with a single-screw extruder at a resin temperature of 200° C., and the extruded strand was cooled with water and cut with a pelletizer to prepare a masterbatch of the phenol compound in pellet form.
- the effect of inhibiting the crystal growth rate of the amide compound, the dissolution temperature, the precipitation temperature and the like were evaluated using the obtained polyolefin-based resin molded article.
- the numbers of crystals equal to or larger than 10 ⁇ m were 0 after one minute, and four after two hours. It is evaluated that this result indicates a high effect of inhibiting the crystal growth rate.
- the dissolution temperature was 295° C.
- the precipitation temperature was 240° C. Table 1 summarizes the composition, the production conditions, the evaluation results and the like.
- the dry-blended product was melt-kneaded with a twin-screw extruder at a kneading temperature (resin temperature) of 300° C. to dissolve N,N′-dicyclohexyl-2,6-naphthalenedicarboxamide, and the extruded strand was cooled with water and cut with a pelletizer to obtain a polyolefin-based resin composition in pellet form.
- resin temperature kneading temperature
- the obtained polyolefin-based resin composition was melted and kneaded with a single-screw extruder at a melting temperature (resin temperature) of 230° C. and extruded into strand form, and the strand was cooled with water and then cut with a pelletizer to obtain a polyolefin-based resin molded article (pellet form) of the present invention.
- the effect of inhibiting the crystal growth rate of the amide compound, the dissolution temperature, the precipitation temperature and the like were evaluated using the obtained polyolefin-based resin molded article.
- the numbers of crystals equal to or larger than 10 ⁇ m were 0 after one minute, and four after two hours. It is evaluated that this result indicates a high effect of inhibiting the crystal growth rate.
- the dissolution temperature was 295° C.
- the precipitation temperature was 240° C. Table 1 summarizes the composition, the production conditions, the evaluation results and the like.
- the effect of inhibiting the crystal growth rate of the amide compound, the dissolution temperature, the precipitation temperature and the like were evaluated using the obtained polyolefin-based resin molded article.
- the inhibiting effect the numbers of crystals equal to or larger than 10 ⁇ m were 0 after one minute, and four after two hours. It is evaluated that this result indicates a high effect of inhibiting the crystal growth rate.
- the dissolution temperature was 295° C.
- the precipitation temperature was 238° C. Table 1 summarizes the composition, the production conditions, the evaluation results and the like.
- 100 parts by weight of the polyolefin-based resin composition obtained in Example 1 and 0.3 parts by weight of 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione were dry-blended at room temperature.
- the dry-blended product was melted and kneaded with a single-screw extruder at a melting temperature (resin temperature) of 230° C. and extruded into strand form, and the strand was cooled with water and then cut with a pelletizer to obtain a polyolefin-based resin molded article (pellet form) of the present invention.
- the effect of inhibiting the crystal growth rate of the amide compound, the dissolution temperature, the precipitation temperature and the like were evaluated using the obtained polyolefin-based resin molded article.
- the inhibiting effect the numbers of crystals equal to or larger than 10 ⁇ m were 0 after one minute, and three after two hours. It is evaluated that this result indicates a high effect of inhibiting the crystal growth rate.
- the dissolution temperature was 295° C.
- the precipitation temperature was 241° C. Table 1 summarizes the composition, the production conditions, the evaluation results and the like.
- a polyolefin-based resin molded article of the present invention was obtained by performing the same procedure as in Example 3 except that the type and the blending amount of the amide compound were changed to 0.2 parts by weight of 3,9-bis[4-(N-cyclohexylcarbamoyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, the blending amount of the phenol compound was changed to 0.2 parts by weight, the kneading temperature was changed to 80° C., and the melting temperature was changed to 200° C. Table 1 summarizes the composition, the production conditions, the evaluation results, and the like. It should be noted that the precipitation temperature was 210° C.
- a polyolefin-based resin molded article of the present invention was obtained by performing the same procedure as in Example 1 except that the type of the amide compound was changed to 3,9-bis[4-(N-cyclohexylcarbamoyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, the kneading temperature was changed to 290° C., and the melting temperature was changed to 210° C. Table 1 summarizes the composition, the production conditions, the evaluation results, and the like. It should be noted that the precipitation temperature was 240° C.
- Polyolefin-based resin molded articles of the present invention were obtained by performing the same procedure as in Example 3 except that the blending amount of the amide compound, the kneading temperature, and the melting temperature were changed to numerical values described in Table 1.
- Table 1 summarizes the compositions, the production conditions, the evaluation results and the like. It should be noted that the precipitation temperatures were 230° C. in Example 8, 235° C. in Example 9, 250° C. in Example 10, 235° C. in Example 11, and 240° C. in Example 12.
- a polyolefin-based resin molded article of the present invention was obtained by performing the same procedure as in Example 3 except that the type of the phenol compound was changed to 1,3,5-tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione.
- Table 1 summarizes the composition, the production conditions, the evaluation results and the like. It should be noted that the precipitation temperature was 240° C.
- Table 1 summarizes the composition, the production conditions, the evaluation results and the like. It should be noted that the precipitation temperature was 240° C.
- Polyolefin-based resin molded articles of the present invention were obtained by performing the same procedure as in Example 3 except that the type of the amide compound was changed to amide compounds described in Table 1.
- Table 1 summarizes the compositions, the production conditions, the evaluation results and the like. It should be noted that the precipitation temperatures were 220° C. in Example 15 and 250° C. in Example 16.
- a polyolefin-based resin molded article of the present invention was obtained by performing the same procedure as in Example 3 except that the polyolefin modifier was not used.
- Table 1 summarizes the composition, the production conditions, the evaluation results and the like. It should be noted that the precipitation temperature was 240° C.
- a molded polyolefin-based resin article (sheet form) of the present invention was obtained by performing the same procedure as in Example 1 except that in the molding step, the single-screw extruder equipped with the screen mesh (wire gauze; 500 mesh) was replaced with a T-die extruder, an operation of performing extrusion into sheet form and cooling the sheet on a chill roll whose surface temperature was kept at 40° C. to obtain a polyolefin-based resin molded article in sheet form was performed instead, thereby performing continuous production. It should be noted that this production was performed continuously for 12 hours. Table 1 summarizes the composition, the production conditions, the evaluation results and the like. Clogging of the screen mesh was hardly recognized. The appearance was good. The precipitation temperature was 240° C.
- a polyolefin-based resin molded article (sheet form) of the present invention was obtained by performing the same procedure as in Example 20 except that in Example 20, the surface temperature of the chill roll was set to 120° C. and the cooling time (contacting time) at the chill roll was adjusted to 20 seconds.
- the ⁇ -form crystal content of the molded article was 72%. The appearance was good.
- the polyolefin-based resin composition described in Example 1 was melted and kneaded with a single-screw extruder at a melting temperature (resin temperature) of 230° C. and extruded into strand form, and the strand was cooled with water and then cut with a pelletizer to obtain a polyolefin-based resin molded article (pellet form) that is out of the present invention.
- a polyolefin-based resin molded article that is out of the present invention was obtained by performing the same procedure as in Example 3 except that the blending amount of the phenol compound was changed to 3 parts by weight.
- Table 1 summarizes the composition, the production conditions, the evaluation results and the like. It should be noted that the precipitation temperature was 250° C.
- a polyolefin-based resin molded article that is out of the present invention was obtained by performing the same procedure as in Example 3 except that the type of the amide compound was changed to 3,9-bis[4-(N-cyclohexylcarbamoyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, the blending amount of the phenol compound was changed to 0.05 parts by weight, the kneading temperature was changed to 280° C., and the melting temperature was changed to 210° C. Table 1 summarizes the composition, the production conditions, the evaluation results and the like. It should be noted that the precipitation temperature was 230° C.
- a polyolefin-based resin molded article that is out of the present invention was obtained by performing the same procedure as in Example 18 except that in Example 18, split addition of the phenol compound was not performed and its blending amount was changed to 0.05 parts by weight. This production was performed continuously for 12 hours. Table 1 summarizes the composition, the production conditions, the evaluation results and the like. Clogging of the screen mesh was clearly recognized, and the pressure of the screw increased. Thus, while the screen mesh was replaced, the 12-hour operation was performed. Table 1 summarizes the composition, the production conditions, the evaluation results and the like. It should be noted that the precipitation temperature was 220° C.
- the crystal growth rate of the amide compound present in the molten polyolefin-based resin in the molding step can be inhibited.
- the method is effective particularly when a step in which a retention time of the polyolefin-based resin composition is long is included in the molding step.
- the method can contribute to reduction of white spots that are based on the amide compound in the obtained polyolefin resin molded article.
- FIG. 1 is a photomicrograph of a polyolefin-based resin composition (Example 1).
- FIG. 2 is a photomicrograph of a polyolefin-based resin molded article (Example 1) when an effect of inhibiting a crystal growth rate was evaluated (heated and allowed to stand for two hours), showing crystals of 10 ⁇ m or larger in circles or ellipses.
- FIG. 3 is a photomicrograph of a polyolefin-based resin molded article (Comparative Example 1) when an effect of inhibiting a crystal growth rate was evaluated (heated and allowed to stand for two hours), showing crystals of 10 ⁇ m or larger in circles or ellipses.
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Abstract
Description
- [PTL 1] Japanese Unexamined Patent Publication No. H06-192496
- [PTL 2] Japanese Unexamined Patent Publication No. H07-188246
- [PTL 3] Japanese Unexamined Patent Publication No. H07-242610
- [PTL 4] Japanese Unexamined Patent Publication No. H07-278374
- [PTL 5] Japanese Unexamined Patent Publication No. H08-100088
(iii) The crystal growth rate of the amide compound was relatively high when a resin temperature was generally in the range of 180 to 260° C., although the crystal growth rate depends on the type or content of the amide compound.
(iv) In addition, the amide compound has a nucleating effect on the polyolefin-based resin. However, due to the crystal growth, the surface area of the amid compound was reduced, and thus the nucleating effect tended to be reduced.
general formula (1):
R1—(CONHR2)n (1),
general formula (2b):
general formula (1):
R1—(CONHR2)n (1),
general formula (1):
R1—(CONHR2)n (1),
general formula (1):
R1—(CONHR2)n (1),
β-form crystal content (%)=100×H β/(H β +H α)
[wherein, Hβ represents the amount of heat of fusion of β-form crystals (unit: J/g), and Hα represents the amount of heat of fusion of α-form crystals (unit: J/g).]
[wherein, R3s are the same as those in the above formula (2a).], and more specific examples thereof include 2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-4-ethylphenol, n-octadecyl-β-(4′-hydroxy-3′,5′-di-tert-butylphenyl)propionate, and 2,4-bis(octylthiomethyl)-6-methylphenol.
Procedure (B): The above dry-blended product is used as a polyolefin-based resin composition and heated to a temperature in the range that is equal to or higher than the melting point of the polyolefin-based resin and lower than the dissolution temperature of the amide compound.
Procedure (C): The similar procedure is performed by a master batch method instead of the full compound method of the above procedure (A) or (B).
| TABLE 1 | |||
| Composition of polyolefin-based resin molded article | Evaluation results | ||
| Polyolefin- | Growth | |||||
| based | Amide | inhibiting | ||||
| resin | compound | Phenol compound | Production conditions | effect |
| (parts | (parts | (parts | Kneading | Melting | Dissolution | Number | ||||||
| by | by | by | Blending | temp. | temp. | temp. | after two | |||||
| weight) | Type | weight) | Type | weight) | Type | method | (° C.) | (° C.) | (° C.) | hours | Appearance | |
| Ex. 1 | 100 | h-PP | 0.3 | A | 0.352 | a | Split addition | 300 | 230 | 295 | 3 | ∘ |
| Ex. 2 | 100 | h-PP | 0.292 | A | 0.291 | a | Masterbatch | 300 | 230 | 295 | 4 | ∘ |
| Ex. 3 | 100 | h-PP | 0.3 | A | 0.35 | a | Batch addition | 300 | 230 | 295 | 4 | ∘ |
| Ex. 4 | 100 | h-PP | 0.3 | A | 0.352 | a, b | Split addition | 300 | 230 | 295 | 4 | ∘ |
| Ex. 5 | 100 | h-PP | 0.3 | A | 0.352 | a, c | Split addition | 300 | 230 | 295 | 3 | ∘ |
| Ex. 6 | 100 | h-PP | 0.2 | B | 0.2 | a | Batch addition | 280 | 200 | 275 | 4 | ∘ |
| Ex. 7 | 100 | h-PP | 0.3 | B | 0.352 | a | Split addition | 290 | 210 | 280 | 5 | ∘ |
| Ex. 8 | 100 | h-PP | 0.1 | A | 0.08 | a | Batch addition | 280 | 230 | 270 | 6 | ∘ |
| Ex. 9 | 100 | h-PP | 0.2 | A | 0.15 | a | Batch addition | 290 | 230 | 280 | 5 | ∘ |
| Ex. 10 | 100 | h-PP | 0.5 | A | 0.35 | a | Batch addition | 310 | 240 | 300 | 7 | ∘ |
| Ex. 11 | 100 | h-PP | 0.1 | A | 0.4 | a | Batch addition | 290 | 230 | 280 | 3 | ∘ |
| Ex. 12 | 100 | h-PP | 0.2 | A | 0.8 | a | Batch addition | 300 | 230 | 290 | 3 | ∘ |
| Ex. 13 | 100 | h-PP | 0.3 | A | 0.35 | d | Batch addition | 300 | 230 | 295 | 3 | ∘ |
| Ex. 14 | 100 | b-PP | 0.3 | A | 0.352 | a | Split addition | 300 | 230 | 295 | 3 | ∘ |
| Ex. 15 | 100 | h-PP | 0.5 | C | 0.35 | a | Batch addition | 270 | 225 | 260 | 10 | ∘ |
| Ex. 16 | 100 | h-PP | 0.5 | D | 0.35 | a | Batch addition | 310 | 240 | 300 | 11 | ∘ |
| Ex. 17 | 100 | h-PP | 0.3 | A | 0.3 | a | Batch addition | 300 | 230 | 295 | 4 | ∘ |
| Ex. 18 | 100 | h-PP | 0.3 | A | 0.352 | a | Split addition | 300 | 230 | 295 | 4 | ∘ |
| Com. | 100 | h-PP | 0.3 | A | 0.05 | a | Batch addition | 300 | 230 | 290 | 25 | ∘ |
| Ex. 1 | ||||||||||||
| Com. | 100 | h-PP | 0.3 | A | 3.0 | a | Batch addition | 300 | 230 | 295 | 4 | x |
| Ex. 2 | ||||||||||||
| Com. | 100 | h-PP | 0.3 | B | 0.05 | a | Batch addition | 280 | 210 | 275 | 30 | ∘ |
| Ex. 3 | ||||||||||||
| Com. | 100 | h-PP | 0.3 | A | 0.05 | a | Batch addition | 300 | 230 | 290 | 27 | ∘ |
| Ex. 4 | ||||||||||||
Claims (17)
general formula (1):
R1—(CONHR2)n (1),
general formula (1):
R1—(CONHR2)n (1),
general formula (1):
R1—(CONHR2)n (1),
general formula (1):
R1—(CONHR2)n (1),
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-116550 | 2009-05-13 | ||
| JP2009116550 | 2009-05-13 | ||
| PCT/JP2010/058098 WO2010131705A1 (en) | 2009-05-13 | 2010-05-13 | Method for controlling crystal growth rate of amide compound and method for producing molded article of polyolefin-based resin |
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| Publication Number | Publication Date |
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| US20120035304A1 US20120035304A1 (en) | 2012-02-09 |
| US9023921B2 true US9023921B2 (en) | 2015-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| US13/264,488 Active 2031-10-02 US9023921B2 (en) | 2009-05-13 | 2010-05-13 | Method for inhibiting crystal growth rate of amide compound and method for producing molded article of polyolefin-based resin |
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| Country | Link |
|---|---|
| US (1) | US9023921B2 (en) |
| EP (1) | EP2431415A4 (en) |
| JP (1) | JP5794145B2 (en) |
| KR (1) | KR101711227B1 (en) |
| CN (1) | CN102421843B (en) |
| BR (1) | BRPI1013736A2 (en) |
| TW (1) | TWI483978B (en) |
| WO (1) | WO2010131705A1 (en) |
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| JP5861713B2 (en) * | 2011-09-30 | 2016-02-16 | 新日本理化株式会社 | Method for producing polypropylene resin molded body including method for controlling crystallization of amide compound, polypropylene resin molded body obtained by the production method, and secondary processed molded article thereof |
| JP5974655B2 (en) * | 2012-06-13 | 2016-08-23 | 新日本理化株式会社 | Method for producing polypropylene-based resin molded product including method for refining amide compound crystal, polypropylene-based resin molded product obtained by the production method, and secondary processed molded product thereof |
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|---|---|---|---|---|
| JP4158004B2 (en) | 2000-06-02 | 2008-10-01 | 新日本理化株式会社 | Porous polypropylene film, method for producing the same, and absorbent article using the film |
-
2010
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- 2010-05-13 JP JP2011513370A patent/JP5794145B2/en active Active
- 2010-05-13 KR KR1020117029666A patent/KR101711227B1/en not_active Expired - Fee Related
- 2010-05-13 EP EP10774962A patent/EP2431415A4/en not_active Withdrawn
- 2010-05-13 WO PCT/JP2010/058098 patent/WO2010131705A1/en not_active Ceased
- 2010-05-13 TW TW099115390A patent/TWI483978B/en not_active IP Right Cessation
- 2010-05-13 US US13/264,488 patent/US9023921B2/en active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102421843B (en) | 2015-01-28 |
| EP2431415A1 (en) | 2012-03-21 |
| WO2010131705A1 (en) | 2010-11-18 |
| KR101711227B1 (en) | 2017-02-28 |
| TWI483978B (en) | 2015-05-11 |
| KR20120023778A (en) | 2012-03-13 |
| EP2431415A4 (en) | 2012-11-14 |
| JPWO2010131705A1 (en) | 2012-11-01 |
| JP5794145B2 (en) | 2015-10-14 |
| TW201114823A (en) | 2011-05-01 |
| US20120035304A1 (en) | 2012-02-09 |
| CN102421843A (en) | 2012-04-18 |
| BRPI1013736A2 (en) | 2019-09-24 |
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