US6239199B1 - Resin composition resin molding and method for inhibiting polymerization of vinyl compound - Google Patents
Resin composition resin molding and method for inhibiting polymerization of vinyl compound Download PDFInfo
- Publication number
- US6239199B1 US6239199B1 US09/172,197 US17219798A US6239199B1 US 6239199 B1 US6239199 B1 US 6239199B1 US 17219798 A US17219798 A US 17219798A US 6239199 B1 US6239199 B1 US 6239199B1
- Authority
- US
- United States
- Prior art keywords
- vinyl compound
- polymerization
- resin
- polymerization inhibitor
- distillation tower
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000006116 polymerization reaction Methods 0.000 title claims abstract description 214
- -1 vinyl compound Chemical class 0.000 title claims abstract description 150
- 229920002554 vinyl polymer Polymers 0.000 title claims abstract description 120
- 229920005989 resin Polymers 0.000 title claims abstract description 84
- 239000011347 resin Substances 0.000 title claims abstract description 84
- 230000002401 inhibitory effect Effects 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000011342 resin composition Substances 0.000 title claims abstract description 25
- 238000000465 moulding Methods 0.000 title abstract description 21
- 239000003112 inhibitor Substances 0.000 claims abstract description 118
- 238000004821 distillation Methods 0.000 claims abstract description 77
- 238000012856 packing Methods 0.000 claims abstract description 61
- 239000000203 mixture Substances 0.000 claims description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 claims 2
- 239000004035 construction material Substances 0.000 abstract description 3
- 239000004743 Polypropylene Substances 0.000 description 33
- 150000002148 esters Chemical class 0.000 description 31
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 27
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 21
- 239000007788 liquid Substances 0.000 description 20
- 239000003921 oil Substances 0.000 description 18
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 9
- 238000010992 reflux Methods 0.000 description 9
- 239000007792 gaseous phase Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- UTGQNNCQYDRXCH-UHFFFAOYSA-N N,N'-diphenyl-1,4-phenylenediamine Chemical compound C=1C=C(NC=2C=CC=CC=2)C=CC=1NC1=CC=CC=C1 UTGQNNCQYDRXCH-UHFFFAOYSA-N 0.000 description 7
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- OUBMGJOQLXMSNT-UHFFFAOYSA-N N-isopropyl-N'-phenyl-p-phenylenediamine Chemical compound C1=CC(NC(C)C)=CC=C1NC1=CC=CC=C1 OUBMGJOQLXMSNT-UHFFFAOYSA-N 0.000 description 5
- 239000012295 chemical reaction liquid Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007670 refining Methods 0.000 description 5
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 4
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 4
- 238000000998 batch distillation Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000005395 methacrylic acid group Chemical class 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 229950000688 phenothiazine Drugs 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- UMGDCJDMYOKAJW-UHFFFAOYSA-N aminothiocarboxamide Natural products NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 3
- 235000011089 carbon dioxide Nutrition 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 2
- BKZXZGWHTRCFPX-UHFFFAOYSA-N 2-tert-butyl-6-methylphenol Chemical compound CC1=CC=CC(C(C)(C)C)=C1O BKZXZGWHTRCFPX-UHFFFAOYSA-N 0.000 description 2
- 229940044174 4-phenylenediamine Drugs 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- RGCLLPNLLBQHPF-HJWRWDBZSA-N phosphamidon Chemical compound CCN(CC)C(=O)C(\Cl)=C(/C)OP(=O)(OC)OC RGCLLPNLLBQHPF-HJWRWDBZSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- ORGWCTHQVYSUNL-UHFFFAOYSA-N 1,3-bis(hydroxymethyl)thiourea Chemical compound OCNC(=S)NCO ORGWCTHQVYSUNL-UHFFFAOYSA-N 0.000 description 1
- AUXGIIVHLRLBSG-UHFFFAOYSA-N 1,3-dipropylthiourea Chemical compound CCCNC(=S)NCCC AUXGIIVHLRLBSG-UHFFFAOYSA-N 0.000 description 1
- VETPHHXZEJAYOB-UHFFFAOYSA-N 1-n,4-n-dinaphthalen-2-ylbenzene-1,4-diamine Chemical compound C1=CC=CC2=CC(NC=3C=CC(NC=4C=C5C=CC=CC5=CC=4)=CC=3)=CC=C21 VETPHHXZEJAYOB-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- GPNYZBKIGXGYNU-UHFFFAOYSA-N 2-tert-butyl-6-[(3-tert-butyl-5-ethyl-2-hydroxyphenyl)methyl]-4-ethylphenol Chemical compound CC(C)(C)C1=CC(CC)=CC(CC=2C(=C(C=C(CC)C=2)C(C)(C)C)O)=C1O GPNYZBKIGXGYNU-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- ZZMVLMVFYMGSMY-UHFFFAOYSA-N 4-n-(4-methylpentan-2-yl)-1-n-phenylbenzene-1,4-diamine Chemical compound C1=CC(NC(C)CC(C)C)=CC=C1NC1=CC=CC=C1 ZZMVLMVFYMGSMY-UHFFFAOYSA-N 0.000 description 1
- PILIQRYPQJIREQ-UHFFFAOYSA-N 4-n-phenyl-1-n-propylbenzene-1,4-diamine Chemical compound C1=CC(NCCC)=CC=C1NC1=CC=CC=C1 PILIQRYPQJIREQ-UHFFFAOYSA-N 0.000 description 1
- WSGDRFHJFJRSFY-UHFFFAOYSA-N 4-oxo-TEMPO Chemical group CC1(C)CC(=O)CC(C)(C)N1[O] WSGDRFHJFJRSFY-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- UNMYWSMUMWPJLR-UHFFFAOYSA-L Calcium iodide Chemical compound [Ca+2].[I-].[I-] UNMYWSMUMWPJLR-UHFFFAOYSA-L 0.000 description 1
- 239000002656 Distearyl thiodipropionate Substances 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical class ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- VLCDUOXHFNUCKK-UHFFFAOYSA-N N,N'-Dimethylthiourea Chemical compound CNC(=S)NC VLCDUOXHFNUCKK-UHFFFAOYSA-N 0.000 description 1
- KFFQABQEJATQAT-UHFFFAOYSA-N N,N'-dibutylthiourea Chemical compound CCCCNC(=S)NCCCC KFFQABQEJATQAT-UHFFFAOYSA-N 0.000 description 1
- FLVIGYVXZHLUHP-UHFFFAOYSA-N N,N'-diethylthiourea Chemical compound CCNC(=S)NCC FLVIGYVXZHLUHP-UHFFFAOYSA-N 0.000 description 1
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical compound C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920000007 Nylon MXD6 Polymers 0.000 description 1
- QAPVYZRWKDXNDK-UHFFFAOYSA-N P,P-Dioctyldiphenylamine Chemical compound C1=CC(CCCCCCCC)=CC=C1NC1=CC=C(CCCCCCCC)C=C1 QAPVYZRWKDXNDK-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- QYTDEUPAUMOIOP-UHFFFAOYSA-N TEMPO Chemical group CC1(C)CCCC(C)(C)N1[O] QYTDEUPAUMOIOP-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- CAMXVZOXBADHNJ-UHFFFAOYSA-N ammonium nitrite Chemical compound [NH4+].[O-]N=O CAMXVZOXBADHNJ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- LYQFWZFBNBDLEO-UHFFFAOYSA-M caesium bromide Chemical compound [Br-].[Cs+] LYQFWZFBNBDLEO-UHFFFAOYSA-M 0.000 description 1
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 1
- 229940046413 calcium iodide Drugs 0.000 description 1
- 229910001640 calcium iodide Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 150000001845 chromium compounds Chemical class 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- WYYQVWLEPYFFLP-UHFFFAOYSA-K chromium(3+);triacetate Chemical compound [Cr+3].CC([O-])=O.CC([O-])=O.CC([O-])=O WYYQVWLEPYFFLP-UHFFFAOYSA-K 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- CMRVDFLZXRTMTH-UHFFFAOYSA-L copper;2-carboxyphenolate Chemical compound [Cu+2].OC1=CC=CC=C1C([O-])=O.OC1=CC=CC=C1C([O-])=O CMRVDFLZXRTMTH-UHFFFAOYSA-L 0.000 description 1
- XNEQAVYOCNWYNZ-UHFFFAOYSA-L copper;dinitrite Chemical compound [Cu+2].[O-]N=O.[O-]N=O XNEQAVYOCNWYNZ-UHFFFAOYSA-L 0.000 description 1
- BQVVSSAWECGTRN-UHFFFAOYSA-L copper;dithiocyanate Chemical compound [Cu+2].[S-]C#N.[S-]C#N BQVVSSAWECGTRN-UHFFFAOYSA-L 0.000 description 1
- IXPUJMULXNNEHS-UHFFFAOYSA-L copper;n,n-dibutylcarbamodithioate Chemical compound [Cu+2].CCCCN(C([S-])=S)CCCC.CCCCN(C([S-])=S)CCCC IXPUJMULXNNEHS-UHFFFAOYSA-L 0.000 description 1
- OBBCYCYCTJQCCK-UHFFFAOYSA-L copper;n,n-diethylcarbamodithioate Chemical compound [Cu+2].CCN(CC)C([S-])=S.CCN(CC)C([S-])=S OBBCYCYCTJQCCK-UHFFFAOYSA-L 0.000 description 1
- ZOUQIAGHKFLHIA-UHFFFAOYSA-L copper;n,n-dimethylcarbamodithioate Chemical compound [Cu+2].CN(C)C([S-])=S.CN(C)C([S-])=S ZOUQIAGHKFLHIA-UHFFFAOYSA-L 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 235000019305 distearyl thiodipropionate Nutrition 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 description 1
- 229920005674 ethylene-propylene random copolymer Polymers 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- SGRWGISGVDVSJV-UHFFFAOYSA-N hexyl nitrite Chemical compound CCCCCCON=O SGRWGISGVDVSJV-UHFFFAOYSA-N 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- VPBPOXIFRZBJEU-UHFFFAOYSA-L iron(2+);dinitrite Chemical compound [Fe+2].[O-]N=O.[O-]N=O VPBPOXIFRZBJEU-UHFFFAOYSA-L 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- CHSWJHYBLSIDRM-UHFFFAOYSA-N n,n-dimethylmethanamine;nitrous acid Chemical compound [O-]N=O.C[NH+](C)C CHSWJHYBLSIDRM-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- QPHJACNABSHDHC-UHFFFAOYSA-N octyl nitrite Chemical compound CCCCCCCCON=O QPHJACNABSHDHC-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- ATGUVEKSASEFFO-UHFFFAOYSA-N p-aminodiphenylamine Chemical compound C1=CC(N)=CC=C1NC1=CC=CC=C1 ATGUVEKSASEFFO-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 235000010289 potassium nitrite Nutrition 0.000 description 1
- 239000004304 potassium nitrite Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- 235000010288 sodium nitrite Nutrition 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- NLLZTRMHNHVXJJ-UHFFFAOYSA-J titanium tetraiodide Chemical compound I[Ti](I)(I)I NLLZTRMHNHVXJJ-UHFFFAOYSA-J 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/30—Loose or shaped packing elements, e.g. Raschig rings or Berl saddles, for pouring into the apparatus for mass or heat transfer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/30—Details relating to random packing elements
- B01J2219/302—Basic shape of the elements
- B01J2219/30223—Cylinder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/30—Details relating to random packing elements
- B01J2219/304—Composition or microstructure of the elements
- B01J2219/30466—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/32—Details relating to packing elements in the form of grids or built-up elements for forming a unit of module inside the apparatus for mass or heat transfer
- B01J2219/324—Composition or microstructure of the elements
- B01J2219/32483—Plastics
Definitions
- the present invention relates to a resin composition, a resin molding and a method for inhibiting polymerization of a vinyl compound, and particularly to a method for inhibiting polymerization in a distillation process using a distillation tower containing packing upon a production of a vinyl compound in order to prevent a polymerizate from producing and to conduct the distillation smoothly and cost-effectively.
- a vinyl compound is polymerizable compound having a double bond.
- the polymerization is initiated by a radical induced by light, heat, a peroxide or the like, an ionic substance, a metal complex or the like.
- a diversity in the polymerization initiation means that undesirable polymerization, i.e., early polymerization is initiated by various triggers. The fact has been a great technical problem upon a production and a preservation of the vinyl compound.
- distillation using a distillation tower containing packing which is a normal refining step to obtain a high purity vinyl compound
- a step wherein polymerization is most likely to occur is a step wherein polymerization is most likely to occur. Specifically, polymerization is most likely to occur at an inside of the distillation tower such as a steam condensing part and a residence part of the condensate. Accordingly, many efforts have been made and many ideas have been introduced.
- the inside of the distillation tower is occupied with a vapor mainly including the vinyl compound and the condensate thereof.
- a polymerization inhibitor that vaporizes together with the vinyl compound i.e., the polymerization inhibitor having a high vapor pressure is preferable.
- Japanese Patent Application Laid-Open No. Showa 50(1975)-64214, No. Heisei 2(1990)-17151 and No. Heisei 7(1995)-316093 disclose a use of a combination of a polymerization inhibitor having a low vapor pressure for preventing polymerization of a crude liquid and the polymerization inhibitor having a high vapor pressure. The polymerization inhibitors are taken into a product.
- a polymerization inhibiting effect such as oxygen, air, nitrogen oxide or a combination of such gases and a polymerization inhibitor in the distillation tower.
- Oxygen and air are very effective in view of less contamination of the product and cost efficiency. However, oxygen and air have less polymerization inhibiting effect themselves and are typically used in combination with an other polymerization inhibitor. Nitrogen monoxide may deteriorate the product and the polymerization inhibitor used therewith, and easily react with oxygen in the air into nitrogen dioxide having no polymerization inhibiting effect. Thus, the nitrogen monoxide involves a technical difficulty in handling. According to the method, similar to the former method using the polymerization inhibitor having a high vapor pressure, when the vapor drifts in a short path in the distillation tower containing the packing, the polymerization inhibiting effect for the residence part formed is no more expected.
- Japanese Examined Patent Publication No. Showa 50(1975)-6449 and Japanese Patent Application Laid-Open No. Heisei 2(1990)-193944 disclose a method for spraying a polymerization inhibitor dissolved in a vinyl compound from a top of a distillation tower. According to the method, a high polymerization inhibiting effect is expected. However, there is economical problems that an expensive polymerization inhibitor should be provided continuously. In addition, it is required to distribute the polymerization inhibitor every nook and corners of an inside of the distillation tower. However, a dead space where the polymerization inhibitor does not reach is formed and no polymerization inhibiting effect is expected in the dead space.
- Japanese Patent Application Laid-Open No. Showa 63(1988)-41514, No. Showa 63(1988)-41440 and No. Heisei 1(1989)-180850 disclose a method for lowering a residence amount of fine condensate of a vinyl compound on a surface of a metal to inhibit an adhesion of a polymer to an inner surface of distilling equipment by a smoothing with an electrolytic polishing, a mechanical polishing, a surface treatment with nitric acid or the like. The method does not inhibit polymerization but avoid polymerization. Therefore, no great advantage is expected.
- distillation using a distillation tower containing packing having required numbers of stages is accompanied by a serious risk and therefore has scarcely been utilized especially for the vinyl compound that is highly polymerizable, although such distillation tower is the most common and efficient refining means for obtaining a high purity product.
- An object of the present invention is to provide a fundamental technique based on an entirely novel idea to solve the problems in the prior art described above.
- a resin composition containing a polymerization inhibitor for a vinyl compound has sufficient polymerization inhibiting ability to the vinyl compound and that said composition is used as a construction material for inside walls of a reactor, distilling equipment or piping, for packing to be packed in a distillation tower and for a storage container, thereby solving the above-mentioned problems.
- the present invention has been accomplished based on such findings.
- the present invention relates to (1) a resin composition for inhibiting polymerization of a vinyl compound, which composition comprises a resin and 0.1 to 30% by weight based on said resin, of a polymerization inhibitor for the vinyl compound, (2) a resin molding for inhibiting polymerization of a vinyl compound, which molding comprises a resin containing 0.1 to 30% by weight of a polymerization inhibitor for the vinyl compound, (3) packing for inhibiting polymerization of a vinyl compound in a distillation tower, wherein packing comprises the above resin composition or the resin molding, (4) a method for inhibiting polymerization of a vinyl compound, comprising the step of contacting the vinyl compound with the resin composition comprising a resin and 0.1 to 30% by weight based on said resin, of a polymerization inhibitor for the vinyl compound, and (5) a method for inhibiting polymerization of a vinyl compound, which comprises the step of contacting the vinyl compound with the packing in a distillation tower, said packing comprising the resin composition comprising a resin and 0.1 to 30% by weight based on said resin,
- examples of a vinyl compound include methacrylic acids, acrylic acids, methacrylic esters, acrylic esters, acrylonitrile, methacrylonitrile, acrylamides, methacrylamides, styrene, maleic acid, vinyl acetate and the like.
- acrylic esters and methacrylic esters include alkyl esters having an ester residue of methyl, ethyl, n-propyl, i-propyl, n-butyl, i-butyl, t-buityl, 2-ethylhexyl, latiryl or stearyl; esters including an aromatic ring, an alicyclic ring or a heterocyclic ring having an ester residue of benzyl, cyclohexyl, isobornyl, dicyclopentenyl, dicyclopentenylethyl or tetrahydrofurfuryl; esters having an ester residue of a fluorine atome; esters having an ester residue including an ether bond of methoxyethyl, ethoxyethyl or n-buthoxyethyl; esters having an ester residue including a hydroxy group of 2-hydroxyethyl, 2-hydroxypropyl, 2-hydroxy-3-chloro
- the present invention is particularly effective for methacrylic acid, methacrylic esters, acrylic acid and acrylic esters that are easily polymerized among the above-described vinyl compounds.
- the molding comprising the resin composition containing the polymerization inhibitor such as packing of the distillation tower can be obtained through various methods.
- the resin is, for example, a paint
- the polymerization inhibitor is well dispersed in the paint to dry and solidify the paint with an ordinary method or the paint is applied to a packing made of any material to be dried and solidified.
- the resin is a thermoplastic resin
- the polymerization inhibitor and the resin are mixed to be subjected to melt molding using an appropriate extruder or injection machine.
- the polymerization inhibitor and the resin are dissolved in the solvent and mixed to eliminate the solvent and to mold into an appropriate shape.
- no melting or dissolution can be conducted, the polymerization inhibitor and the resin are mixed to be subjected to compression molding.
- the resin containing the polymerization inhibitor for the vinyl compound is desirably substantially chemically inert under actual working conditions when the resin is contacted with the vinyl compound.
- the resin desirably does not deteriorate, alter or polymerize the vinyl compound, and also is not lowered in its strength, altered or deteriorated by the vinyl compound.
- the resin should have heat resistance.
- the resin should have thermostability at a working temperature to be stable in a reactor, distillation equipment and piping.
- the resin containing the polymerization inhibitor is, for example, a crystalline thermoplastic resin
- the resin should have a melting point of not less than the working temperature.
- the resin In the case of the resin being amorphous or sparingly crystalline, the resin should have a glass transition temperature (Tg) of not less than the working temperature.
- Tg glass transition temperature
- the resin containing the polymerization inhibitor is obtained through the melt molding, inactivation occurs due to alternation or deterioration of the polymerization inhibitor if a molding temperature of the resin is too high. Therefore, the resin having a too high molding temperature is not preferable.
- the molding temperature of the resin by the melt molding is preferably 300° C. or less in view of the above reason, depending on heat resistance of the polymerization inhibitor.
- the resin used in the present invention has preferably excellent mechanical properties.
- the resin when the resin is used for the piping or the packing to be packed in the distillation tower, the resin should have sufficient mechanical strength at a working temperature.
- the appropriate resin is not unequivocally defined because it depends on types and conditions of the vinyl compound intended.
- the resin can be selected easily and quickly by immersing it in the vinyl compound for a predetermined time at a higher temperature than an actual working temperature, observing a status after the immersion, measuring altered properties and analyzing the components of the vinyl compound.
- the resin has various types such as a coating type, a thermoplastic type, a thermosetting type or the like.
- polyolefin such as low density polyethylene, high density polyethylene, ethylene-propylene random copolymer, ethylene-propylene block copolymer, homo type polypropylene, polybutene-1 and poly-4-methyl pentene-1
- a fluororesin such as polytetrafluoroethylene, polytrifluorochloroethylene, polyvinyl fluoride and polyvinylidene fluoride or the like can be preferably used.
- polyester such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphtalate
- unsaturated polyester such as nylon 6, nylon 6,6, nylon 4,6, nylon 6,10 and nylon MXD6
- polycarbonate such as dioxydiphenylethanecarbonate, dioxydiphenyl-2,2-propanecarbonate, dioxydiphenyl-1,1-ethanecarbonate
- polyether such as polyoxymethylene and polytetramethylethyleneoxide may be preferably used because these resins have high heat resistance and an excellent mechanical property only if no chemical change occurs upon a contact with the vinyl compound. These resins are used alone or in combination.
- a polymerization stabilizer such as a polymerization terminator and a polymerization retarder may remain in the resin upon polymerization or an additive such as a coloring inhibitor and a oxidation inhibitor may be added to the resin in advance as long as the advantages of the present invention are achieved.
- the polymerization inhibitor for the vinyl compound contained in the resin used for the present invention has not only an excellent polymerization inhibiting effect to the vinyl compound, but also no substantial chemical change upon a contact with the resin under the actual working conditions. Specifically, the polymerization inhibitor does not alter or deteriorate the resin and also is not altered or deteriorated by the resin.
- the melting point of the polymerization inhibitor is desirably the actual working temperature or more. However, the melting point may be lower than the actual working temperature.
- the polymerization inhibitor may or may not be dissolved in the vinyl compound under the actual working conditions. Or both types of the polymerization inhibitor may be used together.
- a selection of the polymerization inhibitor is naturally determined by the quality of the objective vinyl compound, i.e., a permissive amount of the inhibitor contained in the vinyl compound, and by a desired polymerization inhibiting period. A run and an outflow of the polymerization inhibitor in and on the resin is permitted as long as it does not affect the mechanical properties thereof.
- the appropriate polymerization inhibitor is not unequivocally defined because it depends on types and conditions of the vinyl compound intended.
- the polymerization inhibitor can be selected easily and quickly by immersing the resin containing the polymerization inhibitor into the vinyl compound at a higher temperature than the actual working temperature, observing a status after the immersion, measuring the polymerization time of the vinyl compound or analyzing the components of the vinyl compound.
- Typical polymerization inhibitor includes a phenol type such as hydroquinon, p-methoxyphenol, cresol, t-butylcatechol, 3,5-di-t-butyl-4-hydroxytoluene, 2,2′-methylenebis(4-methyl-6-t-butylphenol), 2,2′-methylenebis(4-ethyl-6-t-butylphenol), 4,4′-thiobis(3-methyl-6-t-butylphenol); a thioether type such as phenothiazine, distearylthiodipropionate; an amine type such as p-phenylenediamine, 4-aminodiphenylamine, N,N′-diphenyl-p-phenylenediamine, N-i-propyl-N′-phenyl-p-phenylenediamine, N-(1,3-dimethylbutyl)-N′-phenyl-p-phenylenediamine, N,N′-d
- a content of the polymerization inhibitor in the resin is selected in the range so that the resin can be molded and therefore is not especially limited. However, if the content is too little, polymerization is insufficiently inhibited. On the other hand, if the content is too much, the resin composition has less mechanical strength. Accordingly, a suitable range exists.
- the resin should contain 0.1 to 30% by weight, preferably 0.2 to 20% by weight, more preferably 0.5 to 10% by weight of the polymerization inhibitor.
- the resin composition containing the polymerization inhibitor for the vinyl compound is characteristically contacted with the vinyl compound.
- the resin molding for inhibiting polymerization of the vinyl compound exists in the reactor.
- the polymerization inhibitor effective for the vinyl compound may be dissolved in a reaction liquid in advance or may be provided during the reaction, and a gas (i.e., oxygen, air) having a polymerization inhibiting effect may be provided together therewith.
- the resin composition containing the polymerization inhibitor for the vinyl compound, especially packing comprising the resin composition in a distillation tower is characteristically contacted with the vinyl compound.
- the distillation tower is packed with the resin molding for inhibiting polymerization of the vinyl compound.
- the polymerization inhibitor effective for the vinyl compound may be provided and allowed to exist in a substantial form of a gas (i.e., oxygen, air) or vapor (in the case of the polymerization inhibitor having the high vapor pressure), or the polymerization inhibitor effective for the vinyl compound may be dissolved in the vinyl compound and provided from a top of the distillation tower.
- the polymerization inhibitor used for this purpose may be same or different with/from the polymerization inhibitor contained in the resin.
- the resin composition for inhibiting polymerization of the vinyl compound and the molding comprising the resin composition of the present invention can be utilized for an inner wall of the reactor, the distillation equipment and the piping for producing the vinyl compound, for packing of the distillation tower or for a container storing the vinyl compound.
- the method for inhibiting polymerization of the vinyl compound of the present invention can be used for a reaction, distillation or transportation of the vinyl compound or a storage of the vinyl compound.
- the vinyl compound can be produced stably by adding a small amount of the polymerization inhibitor for the vinyl compound without adding a large amount of the polymerization inhibitor for the vinyl compound differently from prior methods. Even in a dead space in the equipment where the polymerization inhibitor does not reach, the polymerization can be prevented effectively. Further, the polymerization inhibitor for the vinyl compound can be easily separated from the vinyl compound because the polymerization inhibitor for the vinyl compound exists in the resin.
- distillation refining can be conducted using a distillation tower with a required numbers of stages, thereby producing a high purity product efficiently.
- 2-HEMA 2-hydroxyethyl methacrylate
- Polypropylene manufactured by Mitsubishi Chemical Corporation, under the trade name of FY-6C; hereinafter referred to as PP
- PP Polypropylene
- phenothiazine manufactured by Kawaguchi Chemical Industry Co., Ltd. under the trade name of Antage TDP
- the strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
- a transparent glass test tube (a length of 150 mm, an inside diameter of 12.6 mm, an outside diameter of 15 mm) were added 0.2 g of the resultant PP containing the polymerization inhibitor and 9.5 g of 2-HEMA.
- the PP containing the polymerization inhibitor floated at an upper portion of a test liquid in the test tube and the content of a gaseous phase was about 7 cc.
- the test tube was sealed and immersed in an oil bath at 135° C. to measure a polymerization time. The polymerization was acknowledged when at least one part of the test liquid was solidified or when the test liquid was changed opaque in white upon dropping to acetone. The results are shown in Table 1.
- the resin was prepared and polymerized in the same manner as Example 1 except that N,N′-diphenyl-p-phenylenediamine (manufactured by Kawaguchi Chemical Industry Co., Ltd. under the trade name of Antage DP) was used as the polymerization inhibitor.
- N,N′-diphenyl-p-phenylenediamine manufactured by Kawaguchi Chemical Industry Co., Ltd. under the trade name of Antage DP
- Example 2 To the test tube was added 10 g of 2-HEMA in the same manner as Example 1. The content of a gaseous phase in the test tube was about 7 cc. The test tube was sealed and immersed in the oil bath at 135° C. to measure a polymerization time. The results are also shown in Table 1.
- the resin molding for inhibiting polymerization of the vinyl compound according to the present invention is effective to inhibit the polymerization of 2-HEMA.
- GMA glycidyl methacrylate
- PP was mixed with 2,2′-methylenebis(4-methyl-6-t-butylphenol) (manufactured by Kawaguchi Chemical Industry Co., Ltd. under the trade name of Antage W-400) as the polymerization inhibitor at a 2,2′-2′-methylenebis(4-methyl-6-t-butylphenol) concentration of 5%, and the mixture was melted in the melting furnace of EXAMPLE 1 at 180° C. for 2 minutes, then extruded and air-cooled to obtain a strand. The strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
- 2,2′-methylenebis(4-methyl-6-t-butylphenol) manufactured by Kawaguchi Chemical Industry Co., Ltd. under the trade name of Antage W-400
- Poly4-methylpenten-1 (manufactured by Mitsui Chemical Co., Ltd. under the trade name of MX321XB; hereinafter referred to as TPX) was mixed with 2,2′-methylenebis(4-methyl-6-t-butylphenol) as the polymerization inhibitor at a 2,2′-metliylenebis(4-methyl-6-t-butylphenol) concentration of 5%, and the mixture was melted in the melting furnace of EXAMPLE 1 at 250° C. for 2 minutes, then extruded and air-cooled to obtain a strand. The strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
- TPX containing the polymerization inhibitor floated at an upper portion of a test liquid in the test tube and the content of a gaseous phase was about 10 cc.
- the test tube was sealed and immersed in the oil bath at 135° C. to measure a polymerization time.
- PET Polyethylene terephthalate
- N,N′-diphenyl-p-phenylenediamine as the polymerization inhibitor at a N,N′-diphenyl-p-phenylenediamine concentration of 5%
- the mixture was melted in the melting furnace of EXAMPLE 1 at 280° C. for 2 minutes, then extruded and air-cooled to obtain a strand.
- the strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
- N-MXD6 Polymethaxylyleneagipamide (manufactured by Mitsubishi Gas Chemical Company under the trade name of 6007; hereinafter referred to as N-MXD6) was mixed with N,N′-diphenyl-p-phenylenediamine as the polymerization inhibitor at a N,N′-diphenyl-p-phenylenediamine concentration of 5%, and the mixture was melted in the melting furnace of EXAMPLE 1 at 260° C. for 2 minutes, extruded and air-cooled to obtain a strand. The strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
- Example 2 To the test tube was added 7.3 g of GMA in the same manner as Example 1. The content of a gaseous phase in the test tube was about 10 cc. The test tube was sealed and immersed in the oil bath at 135° C. to measure a polymerization time. The results are also shown in Table 2.
- the resin molding for inhibiting polymerization of the vinyl compound according to the present invention is effective to inhibit the polymerization of GMA.
- Polypropylene (manufactured by Chisso Corporation under the trade name of A5014) was mixed with N-isopropyl-N′-phenyl-p-phenylenediamine (manufactured by Kawaguchi Chemical Co., Ltd., under the trade name of Antage 3C) as the polymerization inhibitor at an N-isopropyl-N′-phenyl-p-phenylenediamine concentration of 2000 ppm, and the mixture was extruded from a die having a diameter of 3 mm at a resin temperature of 180° C. using a single screw extruder having a diameter of 30 mm. Immediately after the extrusion, the extrudate was quenched and solidified in a water bath at 20° C. to obtain a strand having a diameter of about 5 mm wherein the polymerization inhibitor was contained uniformly. A resident time of the resin in the extruder was about 2 minutes and an extruded pressure was about 40 kg/cm 2 .
- PP was mixed with N-isopropyl-N′-phenyl-p-phenylenediamine as the polymerization inhibitor at an N-isopropyl-N′-phenyl-p-phenylenediamine concentration of 10000 ppm, and the mixture was extruded from a cylindrical die having a diameter of 26 mm and a slit width of 2.5 mm at a resin temperature of 190° C. using a single screw extruder having a diameter of 40 mm. After the extrusion, the extrudate was extended and pulled into a water bath at 20° C., and solidified to obtain a tube having a diameter of about 6 mm wherein the polymerization inhibitor was contained uniformly. A resident time of the resin in the extruder was about 8 minutes and an extruded pressure was about 70 kg/cm 2 . The tube was cut into ring packing having a length of about 6 mm.
- the packing comprising the resin composition for inhibiting polymerization of the vinyl compound of the present invention instead of the conventionally used packing, a polymerization starting time is prolonged in a distillation refining, thereby allowing a long-term stable operation.
- Polypropylene (a melting point of 146° C., an MI is 5.6 [230° C./2.16 kgf]) was mixed with N-isopropyl-N′-phenyl-p-phenylenediamine at a concentration of 10000 ppm and CsI at a concentration of 10000 ppm, and the mixture was extruded from a cylindrical die having a diameter of 26 mm and a slit width of 2.5 mm at a resin temperature of 190° C. using a single screw extruder having a diameter of 40 mm.
- the extrudate was extended and pulled into a water bath at 20° C., and solidified to obtain a tube having a diameter of about 6 mm wherein the polymerization inhibitor was contained uniformly.
- a resident time of the resin in the extruder was about 8 minutes and an extruded pressure was about 60 kg/cm 2 .
- the tube was cut into ring packing having a length of about 6 mm.
- GMA was synthesized by using methacrylic acid, epichlorohydrin and sodium carbonate as raw materials.
- a crude reaction liquid of the GMA was batch-distilled.
- the purities of the crude reaction liquid and refined fraction were represented by a simple area ratio by a gas chromatography analysis.
- Injection temperature 230° C.
- distillation test used was the equipment consisting of a 500 cc three neck flask equipped with a thermometer and a capillary for providing air, a distillation tower (a height of 102 mm, an inside diameter of 18.4 mm) packed with the above PP ring packing containing the polymerization inhibitor in a length of 72 cm (36 g), a reflux head operated by a solenoid valve, a cooling pipe, a trap cooled with methanol/dry ice and a vacuum pump.
- a material of the part of the equipment contacted with a liquid was entirely made of glass, a coupling joint was a SPC joint. Heat was applied in an oil bath.
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Abstract
Disclosed are a resin composition for inhibiting polymerization of a vinyl compound, which includes a resin and 0.1 to 30% by weight based on the resin, of a polymerization inhibitor for the vinyl compound; a resin molding for inhibiting polymerization of a vinyl compound, and a packing for inhibiting polymerization of a vinyl compound in a distillation tower, the resin molding and packing each including this resin composition. Also disclosed are methods for inhibiting polymerization of a vinyl compound, which include contacting the vinyl compound with the resin composition; these methods include processes of inhibiting polymerization of a vinyl compound in a distillation tower, by contacting the vinyl compound in the distillation tower with packing therein which includes this resin composition. By using the resin composition as a construction material of an inner wall of a reactor, distillation equipment and piping and as packing in the distillation tower, to inhibit polymerization of the vinyl compound, the vinyl compound can be produced stably by adding a small amount of the polymerization inhibitor for the vinyl compound without adding a large amount thereof.
Description
1. Field of the Invention
The present invention relates to a resin composition, a resin molding and a method for inhibiting polymerization of a vinyl compound, and particularly to a method for inhibiting polymerization in a distillation process using a distillation tower containing packing upon a production of a vinyl compound in order to prevent a polymerizate from producing and to conduct the distillation smoothly and cost-effectively.
2. Description of the Related Art
A vinyl compound is polymerizable compound having a double bond. The polymerization is initiated by a radical induced by light, heat, a peroxide or the like, an ionic substance, a metal complex or the like. A diversity in the polymerization initiation means that undesirable polymerization, i.e., early polymerization is initiated by various triggers. The fact has been a great technical problem upon a production and a preservation of the vinyl compound.
In a method for producing the vinyl compound, distillation using a distillation tower containing packing, which is a normal refining step to obtain a high purity vinyl compound, is a step wherein polymerization is most likely to occur. Specifically, polymerization is most likely to occur at an inside of the distillation tower such as a steam condensing part and a residence part of the condensate. Accordingly, many efforts have been made and many ideas have been introduced.
For example, the following are disclosures concerning methacrylic acid, acrylic acid and esters thereof.
The inside of the distillation tower is occupied with a vapor mainly including the vinyl compound and the condensate thereof. In order to prevent polymerization in the distillation tower, a polymerization inhibitor that vaporizes together with the vinyl compound, i.e., the polymerization inhibitor having a high vapor pressure is preferable. Japanese Patent Application Laid-Open No. Showa 50(1975)-64214, No. Heisei 2(1990)-17151 and No. Heisei 7(1995)-316093 disclose a use of a combination of a polymerization inhibitor having a low vapor pressure for preventing polymerization of a crude liquid and the polymerization inhibitor having a high vapor pressure. The polymerization inhibitors are taken into a product. If an excess amount of polymerization inhibitors are used for fear of the polymerization, then the purity of the product is tend to be lowered or the quality of the product is tend to be deteriorated due to coloring caused by polymerization inhibitors. The excess amount of polymerization inhibitors in the product are also undesirable for producing a polymer using the vinyl compound as a raw material. When the vapor drifts in a short path in the distillation tower containing the packing, the residence part is formed in the distillation tower and the polymerization inhibitors never be introduced into the residence part. Accordingly, providing the polymerization inhibitor having the high vapor pressure is meaningless.
Japanese Examined Patent Publication No. Showa 50(1975)-6449, Japanese Patent Application Laid-Open No. Showa 49(1974)-85016, No. Showa 50(1975)-101313, No. Showa 59(1984)-7147, No. Showa 64(1989)-9957, No. Showa 64(1989)-42443, No. Showa 64(1989)-66140, No. Heisei 2(1990)-248402 and No. Heisei 7(1995)-53449 disclose a method for allowing a gas to exist which has a polymerization inhibiting effect such as oxygen, air, nitrogen oxide or a combination of such gases and a polymerization inhibitor in the distillation tower. Oxygen and air are very effective in view of less contamination of the product and cost efficiency. However, oxygen and air have less polymerization inhibiting effect themselves and are typically used in combination with an other polymerization inhibitor. Nitrogen monoxide may deteriorate the product and the polymerization inhibitor used therewith, and easily react with oxygen in the air into nitrogen dioxide having no polymerization inhibiting effect. Thus, the nitrogen monoxide involves a technical difficulty in handling. According to the method, similar to the former method using the polymerization inhibitor having a high vapor pressure, when the vapor drifts in a short path in the distillation tower containing the packing, the polymerization inhibiting effect for the residence part formed is no more expected.
Japanese Examined Patent Publication No. Showa 50(1975)-6449 and Japanese Patent Application Laid-Open No. Heisei 2(1990)-193944 disclose a method for spraying a polymerization inhibitor dissolved in a vinyl compound from a top of a distillation tower. According to the method, a high polymerization inhibiting effect is expected. However, there is economical problems that an expensive polymerization inhibitor should be provided continuously. In addition, it is required to distribute the polymerization inhibitor every nook and corners of an inside of the distillation tower. However, a dead space where the polymerization inhibitor does not reach is formed and no polymerization inhibiting effect is expected in the dead space.
Japanese Patent Application Laid-Open No. Showa 63(1988)-41514, No. Showa 63(1988)-41440 and No. Heisei 1(1989)-180850 disclose a method for lowering a residence amount of fine condensate of a vinyl compound on a surface of a metal to inhibit an adhesion of a polymer to an inner surface of distilling equipment by a smoothing with an electrolytic polishing, a mechanical polishing, a surface treatment with nitric acid or the like. The method does not inhibit polymerization but avoid polymerization. Therefore, no great advantage is expected.
Other examples of the disclosure include a use of an empty distillation tower without packing, retarded numbers of stages for refining, a use of a thin film distillation tower having a few heat history disclosed in Japanese Patent Application Laid-Open No. Showa 62(1987)-201852 and distillation under high vacuum to decrease temperature. Some of the methods sacrifice for purity of a product to some extent, or urge economical burdens on facility and operation. Accordingly, distillation using a distillation tower containing packing having required numbers of stages is accompanied by a serious risk and therefore has scarcely been utilized especially for the vinyl compound that is highly polymerizable, although such distillation tower is the most common and efficient refining means for obtaining a high purity product.
An object of the present invention is to provide a fundamental technique based on an entirely novel idea to solve the problems in the prior art described above.
Through intense studies by the present inventor for attaining the object, the present inventors discovered that a resin composition containing a polymerization inhibitor for a vinyl compound has sufficient polymerization inhibiting ability to the vinyl compound and that said composition is used as a construction material for inside walls of a reactor, distilling equipment or piping, for packing to be packed in a distillation tower and for a storage container, thereby solving the above-mentioned problems. The present invention has been accomplished based on such findings.
The present invention relates to (1) a resin composition for inhibiting polymerization of a vinyl compound, which composition comprises a resin and 0.1 to 30% by weight based on said resin, of a polymerization inhibitor for the vinyl compound, (2) a resin molding for inhibiting polymerization of a vinyl compound, which molding comprises a resin containing 0.1 to 30% by weight of a polymerization inhibitor for the vinyl compound, (3) packing for inhibiting polymerization of a vinyl compound in a distillation tower, wherein packing comprises the above resin composition or the resin molding, (4) a method for inhibiting polymerization of a vinyl compound, comprising the step of contacting the vinyl compound with the resin composition comprising a resin and 0.1 to 30% by weight based on said resin, of a polymerization inhibitor for the vinyl compound, and (5) a method for inhibiting polymerization of a vinyl compound, which comprises the step of contacting the vinyl compound with the packing in a distillation tower, said packing comprising the resin composition comprising a resin and 0.1 to 30% by weight based on said resin, of a polymerization inhibitor for the vinyl compound at the time of distilling the vinyl compound in the distillation tower.
The present invention will be described below for detail.
According to the present invention, examples of a vinyl compound include methacrylic acids, acrylic acids, methacrylic esters, acrylic esters, acrylonitrile, methacrylonitrile, acrylamides, methacrylamides, styrene, maleic acid, vinyl acetate and the like. Concrete examples of acrylic esters and methacrylic esters include alkyl esters having an ester residue of methyl, ethyl, n-propyl, i-propyl, n-butyl, i-butyl, t-buityl, 2-ethylhexyl, latiryl or stearyl; esters including an aromatic ring, an alicyclic ring or a heterocyclic ring having an ester residue of benzyl, cyclohexyl, isobornyl, dicyclopentenyl, dicyclopentenylethyl or tetrahydrofurfuryl; esters having an ester residue of a fluorine atome; esters having an ester residue including an ether bond of methoxyethyl, ethoxyethyl or n-buthoxyethyl; esters having an ester residue including a hydroxy group of 2-hydroxyethyl, 2-hydroxypropyl, 2-hydroxy-3-chloropropyl, 2-hydroxybutyl or 4-hydroxybutyl; esters having an ester residue including an epoxy residue of glycidyl or mechylgrycidyl; esters having an ester residue including a carbolxyl group of β-carboxyethyl; esters having an ester residue including a sulfonic group; esters having an ester residue including an alkylamino group of dimethylaminoethyl or diethylaminoethyl; esters having an ester residue including a cationic group; esters having an ester residue including a double bond of vinyl or allyl; esters having an ester residue including a silicon atom; ester having an ester residue including an isocyanate group of 2-isocyanatoethyl, 2-isocyanatopropyl, 2-methyl-2-isocyanatoethyl or 4-isocyanatobutyl; esters having an ester residue including a phosphoric group; esters having an ester residue including an acetoacethyl group and the like.
The present invention is particularly effective for methacrylic acid, methacrylic esters, acrylic acid and acrylic esters that are easily polymerized among the above-described vinyl compounds.
According to the present invention, the molding comprising the resin composition containing the polymerization inhibitor such as packing of the distillation tower can be obtained through various methods. In the case where the resin is, for example, a paint, the polymerization inhibitor is well dispersed in the paint to dry and solidify the paint with an ordinary method or the paint is applied to a packing made of any material to be dried and solidified. In the case where the resin is a thermoplastic resin, the polymerization inhibitor and the resin are mixed to be subjected to melt molding using an appropriate extruder or injection machine. In the case that a common solvent coexists with the polymerization inhibitor and the resin, the polymerization inhibitor and the resin are dissolved in the solvent and mixed to eliminate the solvent and to mold into an appropriate shape. In the case that no melting or dissolution can be conducted, the polymerization inhibitor and the resin are mixed to be subjected to compression molding.
According to the present invention, the resin containing the polymerization inhibitor for the vinyl compound is desirably substantially chemically inert under actual working conditions when the resin is contacted with the vinyl compound. Specifically, the resin desirably does not deteriorate, alter or polymerize the vinyl compound, and also is not lowered in its strength, altered or deteriorated by the vinyl compound. As another desirable property, the resin should have heat resistance. In other words, the resin should have thermostability at a working temperature to be stable in a reactor, distillation equipment and piping. In the case that the resin containing the polymerization inhibitor is, for example, a crystalline thermoplastic resin, the resin should have a melting point of not less than the working temperature. In the case of the resin being amorphous or sparingly crystalline, the resin should have a glass transition temperature (Tg) of not less than the working temperature. However, when the resin containing the polymerization inhibitor is obtained through the melt molding, inactivation occurs due to alternation or deterioration of the polymerization inhibitor if a molding temperature of the resin is too high. Therefore, the resin having a too high molding temperature is not preferable. The molding temperature of the resin by the melt molding is preferably 300° C. or less in view of the above reason, depending on heat resistance of the polymerization inhibitor.
The resin used in the present invention has preferably excellent mechanical properties. For example, when the resin is used for the piping or the packing to be packed in the distillation tower, the resin should have sufficient mechanical strength at a working temperature.
The appropriate resin is not unequivocally defined because it depends on types and conditions of the vinyl compound intended. The resin can be selected easily and quickly by immersing it in the vinyl compound for a predetermined time at a higher temperature than an actual working temperature, observing a status after the immersion, measuring altered properties and analyzing the components of the vinyl compound. The resin has various types such as a coating type, a thermoplastic type, a thermosetting type or the like. Typically, polyolefin such as low density polyethylene, high density polyethylene, ethylene-propylene random copolymer, ethylene-propylene block copolymer, homo type polypropylene, polybutene-1 and poly-4-methyl pentene-1, a fluororesin such as polytetrafluoroethylene, polytrifluorochloroethylene, polyvinyl fluoride and polyvinylidene fluoride or the like can be preferably used.
Other resins, for example, polyester such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphtalate; unsaturated polyester; polyamide such as nylon 6, nylon 6,6, nylon 4,6, nylon 6,10 and nylon MXD6; polycarbonate such as dioxydiphenylethanecarbonate, dioxydiphenyl-2,2-propanecarbonate, dioxydiphenyl-1,1-ethanecarbonate; polyether such as polyoxymethylene and polytetramethylethyleneoxide may be preferably used because these resins have high heat resistance and an excellent mechanical property only if no chemical change occurs upon a contact with the vinyl compound. These resins are used alone or in combination.
A polymerization stabilizer such as a polymerization terminator and a polymerization retarder may remain in the resin upon polymerization or an additive such as a coloring inhibitor and a oxidation inhibitor may be added to the resin in advance as long as the advantages of the present invention are achieved.
The polymerization inhibitor for the vinyl compound contained in the resin used for the present invention has not only an excellent polymerization inhibiting effect to the vinyl compound, but also no substantial chemical change upon a contact with the resin under the actual working conditions. Specifically, the polymerization inhibitor does not alter or deteriorate the resin and also is not altered or deteriorated by the resin.
The melting point of the polymerization inhibitor is desirably the actual working temperature or more. However, the melting point may be lower than the actual working temperature. The polymerization inhibitor may or may not be dissolved in the vinyl compound under the actual working conditions. Or both types of the polymerization inhibitor may be used together. A selection of the polymerization inhibitor is naturally determined by the quality of the objective vinyl compound, i.e., a permissive amount of the inhibitor contained in the vinyl compound, and by a desired polymerization inhibiting period. A run and an outflow of the polymerization inhibitor in and on the resin is permitted as long as it does not affect the mechanical properties thereof.
The appropriate polymerization inhibitor is not unequivocally defined because it depends on types and conditions of the vinyl compound intended. The polymerization inhibitor can be selected easily and quickly by immersing the resin containing the polymerization inhibitor into the vinyl compound at a higher temperature than the actual working temperature, observing a status after the immersion, measuring the polymerization time of the vinyl compound or analyzing the components of the vinyl compound. Typical polymerization inhibitor includes a phenol type such as hydroquinon, p-methoxyphenol, cresol, t-butylcatechol, 3,5-di-t-butyl-4-hydroxytoluene, 2,2′-methylenebis(4-methyl-6-t-butylphenol), 2,2′-methylenebis(4-ethyl-6-t-butylphenol), 4,4′-thiobis(3-methyl-6-t-butylphenol); a thioether type such as phenothiazine, distearylthiodipropionate; an amine type such as p-phenylenediamine, 4-aminodiphenylamine, N,N′-diphenyl-p-phenylenediamine, N-i-propyl-N′-phenyl-p-phenylenediamine, N-(1,3-dimethylbutyl)-N′-phenyl-p-phenylenediamine, N,N′-di-2-naphthyl-p-phenylenediamine, diphenylamine, N-phenyl-β-naphthylamine, 4,4′-dicumyldiphenylamine, 4,4′-dioctyl-diphenylamine; a nitoroso compound such as N-nitorosodiphenylamine, N-nitorosophenylnaphthylamine, N-nitorosodinaphtylamine, p-nitorosophenol, nitorosobenzene, p-nitorosodiphenylamine, α-nitoroso-β-naphtol; a nitrite such as ammonium nitrite, sodium nitrite, potassium nitrite, copper nitrite, iron nitrite, trimethylammonium nitrite, n-hexyl nitrite, 1-octyl nitrite and ester thereof; nitroxide such as piperidine-1-oxyl, pyrrolidine-1-oxyl, 2,2,6,6-tetramethyl-4-oxopiperidine-1-oxyl, 2,2,6,6-tetramethylpiperidine-1-oxyl; a copper salt such as copper dimethyldithiocarbamate, copper diethyldithiocarbamate, copper dibutyldithiocarbamate, copper acetate, copper salicylate, copper thiocyanate, copper sulfate and copper chloride; a chromium compound such as chromium acetate and chromium oxide; a thiourea compound such as thiourea, 1,3-dimethylthiourea, 1,3-diethylthiourea, 1,3-di-i-propylthiourea, 1,3-dibutylthiourea and dimethylolthiourea; iodine, iodide such as lithium iodide, sodium iodide, potassium iodide, cesium iodide, calcium iodide and titanium iodide; bromide such as lithium bromide, sodium bromide, potassium bromide and cesium bromide or the like. These polymerization inhibitors are used alone or in combination.
A content of the polymerization inhibitor in the resin is selected in the range so that the resin can be molded and therefore is not especially limited. However, if the content is too little, polymerization is insufficiently inhibited. On the other hand, if the content is too much, the resin composition has less mechanical strength. Accordingly, a suitable range exists. The resin should contain 0.1 to 30% by weight, preferably 0.2 to 20% by weight, more preferably 0.5 to 10% by weight of the polymerization inhibitor.
When a method for inhibiting polymerization of the present invention is conducted in, for example, a reactor, the resin composition containing the polymerization inhibitor for the vinyl compound is characteristically contacted with the vinyl compound. According to the present invention, the resin molding for inhibiting polymerization of the vinyl compound exists in the reactor. The polymerization inhibitor effective for the vinyl compound may be dissolved in a reaction liquid in advance or may be provided during the reaction, and a gas (i.e., oxygen, air) having a polymerization inhibiting effect may be provided together therewith. When the method is conducted in distillation equipment, the resin composition containing the polymerization inhibitor for the vinyl compound, especially packing comprising the resin composition in a distillation tower, is characteristically contacted with the vinyl compound. According to the present invention, the distillation tower is packed with the resin molding for inhibiting polymerization of the vinyl compound. The polymerization inhibitor effective for the vinyl compound may be provided and allowed to exist in a substantial form of a gas (i.e., oxygen, air) or vapor (in the case of the polymerization inhibitor having the high vapor pressure), or the polymerization inhibitor effective for the vinyl compound may be dissolved in the vinyl compound and provided from a top of the distillation tower. The polymerization inhibitor used for this purpose may be same or different with/from the polymerization inhibitor contained in the resin.
The resin composition for inhibiting polymerization of the vinyl compound and the molding comprising the resin composition of the present invention can be utilized for an inner wall of the reactor, the distillation equipment and the piping for producing the vinyl compound, for packing of the distillation tower or for a container storing the vinyl compound. The method for inhibiting polymerization of the vinyl compound of the present invention can be used for a reaction, distillation or transportation of the vinyl compound or a storage of the vinyl compound.
As described above, (i) by using the resin composition for inhibiting polymerization of the vinyl compound of the present invention as a construction material of the inner wall of the reactor, the distillation equipment and the piping and the packing of the distillation tower, the vinyl compound can be produced stably by adding a small amount of the polymerization inhibitor for the vinyl compound without adding a large amount of the polymerization inhibitor for the vinyl compound differently from prior methods. Even in a dead space in the equipment where the polymerization inhibitor does not reach, the polymerization can be prevented effectively. Further, the polymerization inhibitor for the vinyl compound can be easily separated from the vinyl compound because the polymerization inhibitor for the vinyl compound exists in the resin. (ii) By allowing the resin molding for inhibiting polymerization of the vinyl compound according to the present invention to exist as an inner wall or packing of the distillation tower in a gaseous phase, there is no need to use the polymerization inhibitor having a high vapor pressure, thereby preventing contamination of a product caused by the polymerization inhibitor for the vinyl compound. (iii) By using the packing for the distillation tower of the present invention, there is no need to spray a large amount of the polymerization inhibitor dissolved in the vinyl compound from a top of the distillation tower, thereby retarding the use of an expensive polymerization inhibitor. (iv) By using a container made of the resin molding for inhibiting polymerization of the vinyl compound according to the present invention to store the vinyl compound, there is no need to add the polymerization inhibitor for the vinyl compound for the purpose of preventing polymerization in storage. The polymerization inhibitor for the vinyl compound is easily separated from the vinyl compound because the polymerization inhibitor exists in the resin. (v) When the vinyl compound is distilled or stored by a method for inhibiting polymerization of the present invention, a polymerization inhibiting effect for the vinyl compound continues longer than using the polymerization inhibitor for the vinyl compound as such. (vi) According to a method for inhibiting polymerization of the present invention, distillation refining can be conducted using a distillation tower with a required numbers of stages, thereby producing a high purity product efficiently. (vii) According to a method for inhibiting polymerization of the present invention, there is no need to use special separation equipment such as thin film distillation equipment that is used inevitably for inhibiting polymerization, thereby improving productivity.
Examples of the present invention and Comparative Examples are given below by way of illustration of the present invention, and are not in any way designed to limit its scope.
A polymerization test for 2-hydroxyethyl methacrylate (hereinafter referred to as 2-HEMA) that is especially highly olymerizable among the vinyl compounds was conducted upposing a residence part in an inner portion of a reactor, distillation equipment and piping.
Polypropylene (manufactured by Mitsubishi Chemical Corporation, under the trade name of FY-6C; hereinafter referred to as PP) was mixed with phenothiazine (manufactured by Kawaguchi Chemical Industry Co., Ltd. under the trade name of Antage TDP) as the polymerization inhibitor at a phenothiazine concentration of 5%, and the mixture was melted in a melting furnace (a diameter of about 9.5 mm, a length of 152 mm) with a nozzle having a diameter of about 2 mm at 180° C. for 2 minutes, then extruded and air-cooled to obtain a strand. The strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
[Polymerization Test]
To a transparent glass test tube (a length of 150 mm, an inside diameter of 12.6 mm, an outside diameter of 15 mm) were added 0.2 g of the resultant PP containing the polymerization inhibitor and 9.5 g of 2-HEMA. The PP containing the polymerization inhibitor floated at an upper portion of a test liquid in the test tube and the content of a gaseous phase was about 7 cc. The test tube was sealed and immersed in an oil bath at 135° C. to measure a polymerization time. The polymerization was acknowledged when at least one part of the test liquid was solidified or when the test liquid was changed opaque in white upon dropping to acetone. The results are shown in Table 1.
The resin was prepared and polymerized in the same manner as Example 1 except that N,N′-diphenyl-p-phenylenediamine (manufactured by Kawaguchi Chemical Industry Co., Ltd. under the trade name of Antage DP) was used as the polymerization inhibitor. The results are also shown in Table 1.
To the test tube was added 10 g of 2-HEMA in the same manner as Example 1. The content of a gaseous phase in the test tube was about 7 cc. The test tube was sealed and immersed in the oil bath at 135° C. to measure a polymerization time. The results are also shown in Table 1.
| TABLE 1 | ||
| Time (hr)* | ||
| Polymerization inhibitor | T1 | T2 | ||
| EXAMPLE 1 | Phenothiazine | 4.6 | 5.0 |
| EXAMPLE 2 | N,N′-diphenyl-p- | 6.2 | 6.4 |
| phenylenediamine | |||
| COMPARATIVE | 0.8 | 1.0 | |
| EXAMPLE 1 | |||
| *T1: Time until which polymerization was not acknowledged | |||
| T2: Time at which polymerization was acknowledged | |||
As apparent from the results of EXAMPLES 1 and 2, and COMPARATIVE EXAMPLE 1 in Table 1, the resin molding for inhibiting polymerization of the vinyl compound according to the present invention is effective to inhibit the polymerization of 2-HEMA.
A polymerization test for glycidyl methacrylate (hereinafter referred to as GMA) that is also a highly polymerizable vinyl compound was conducted supposing a residence part in an inner portion of a reactor, distillation equipment and piping.
PP was mixed with 2,2′-methylenebis(4-methyl-6-t-butylphenol) (manufactured by Kawaguchi Chemical Industry Co., Ltd. under the trade name of Antage W-400) as the polymerization inhibitor at a 2,2′-2′-methylenebis(4-methyl-6-t-butylphenol) concentration of 5%, and the mixture was melted in the melting furnace of EXAMPLE 1 at 180° C. for 2 minutes, then extruded and air-cooled to obtain a strand. The strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
[Polymerization Test]
To a test tube were added 0.4 g of the resultant PP containing the polymerization inhibitor and 6.5 g of GMA in the same manner as EXAMPLE 1. The PP containing the polymerization inhibitor floated at an upper portion of a test liquid in the test tube and the content of a gaseous phase was about 10 cc. The test tube was sealed and immersed in the oil bath at 135° C. to measure a polymerization time. The polymerization was acknowledged when at least one part of the test liquid was solidified or when the test liquid was changed opaque in white upon dropping to methanol. The results are shown in Table 2.
Poly4-methylpenten-1 (manufactured by Mitsui Chemical Co., Ltd. under the trade name of MX321XB; hereinafter referred to as TPX) was mixed with 2,2′-methylenebis(4-methyl-6-t-butylphenol) as the polymerization inhibitor at a 2,2′-metliylenebis(4-methyl-6-t-butylphenol) concentration of 5%, and the mixture was melted in the melting furnace of EXAMPLE 1 at 250° C. for 2 minutes, then extruded and air-cooled to obtain a strand. The strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
[Polymerization Test]
To a test tube were added 1.0 g of the resultant TPX containing the polymerization inhibitor and 6.0 g of GMA in the same manner as EXAMPLE 1. The TPX containing the polymerization inhibitor floated at an upper portion of a test liquid in the test tube and the content of a gaseous phase was about 10 cc. The test tube was sealed and immersed in the oil bath at 135° C. to measure a polymerization time.
The polymerization was acknowledged when at least one part of the test liquid was solidified or when the test liquid was changed opaque in white upon dropping to methanol. The results are also shown in Table 2.
Polyethylene terephthalate (manufactured by Nippon Unipet Co., Ltd. under the trade name of RT543C; hereinafter referred to as PET) was mixed with N,N′-diphenyl-p-phenylenediamine as the polymerization inhibitor at a N,N′-diphenyl-p-phenylenediamine concentration of 5%, and the mixture was melted in the melting furnace of EXAMPLE 1 at 280° C. for 2 minutes, then extruded and air-cooled to obtain a strand. The strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
[Polymerization Test]
To a test tube were added 0.4 g of the resultant PET containing the polymerization inhibitor and 7.0 g of GMA in the same manner as EXAMPLE 1. The PET containing the polymerization inhibitor sank to a bottom portion of the test tube and the content of a gaseous phase was about 10 cc. The test tube was sealed and immersed in the oil bath at 135° C. to measure a polymerization time. The polymerization was acknowledged when at least one part of the test liquid was solidified or when the test liquid was changed opaque in white upon dropping to methanol. The results are also shown in Table 2.
Polymethaxylyleneagipamide (manufactured by Mitsubishi Gas Chemical Company under the trade name of 6007; hereinafter referred to as N-MXD6) was mixed with N,N′-diphenyl-p-phenylenediamine as the polymerization inhibitor at a N,N′-diphenyl-p-phenylenediamine concentration of 5%, and the mixture was melted in the melting furnace of EXAMPLE 1 at 260° C. for 2 minutes, extruded and air-cooled to obtain a strand. The strand was cut into some pieces, ultrasonic cleaned with acetone for 30 minutes and vacuum dried at room temperature for 2 hours.
[Polymerization Test]
To a test tube were added 0.4 g of the resultant N-MXD6 containing the polymerization inhibitor and 7.0 g of GMA in the same manner as EXAMPLE 1. The N-MXD6 containing the polymerization inhibitor sank to a bottom portion of the test tube and the content of a gaseous phase was about 10 cc. The test tube was sealed and immersed in the oil bath at 135° C. to measure a polymerization time. The polymerization was acknowledged when at least one part of the test liquid was solidified or when the test liquid was changed opaque in white upon dropping to methanol. The results are also shown in Table 2.
To the test tube was added 7.3 g of GMA in the same manner as Example 1. The content of a gaseous phase in the test tube was about 10 cc. The test tube was sealed and immersed in the oil bath at 135° C. to measure a polymerization time. The results are also shown in Table 2.
| TABLE 2 | |||
| Polymerization | Time (hr)* | ||
| inhibitor/resin | T1 | T2 | ||
| EXAMPLE 3 | 2,2′-methylenebis(4- | 30.0 | |
| methyl-6-t- | |||
| butylphenol)/PP | |||
| EXAMPLE 4 | 2,2′-methylenebis(4- | 27.0 | |
| methyl-6-t- | |||
| butylphenol)/TPX | |||
| EXAMPLE 5 | N,N′-diphenyl-p- | 8.0 | 22.8 |
| phenylenediamine/PET | |||
| EXAMPLE 6 | N,N′-diphenyl-p- | 6.0 | 6.4 |
| phenylenediamine/N-MXD6 | |||
| COMPARATIVE | — | 0.8 | 1.0 |
| EXAMPLE 2 | |||
| *T1: Time until which polymerization was not acknowledged | |||
| T2: Time at which polymerization was acknowledged | |||
As apparent from the results of EXAMPLES 3 to 6 and COMPARATIVE EXAMPLE 2 in Table 2, the resin molding for inhibiting polymerization of the vinyl compound according to the present invention is effective to inhibit the polymerization of GMA.
Subsequently, a total reflux test for GMA was conducted supposing packing in a distillation tower.
Polypropylene (manufactured by Chisso Corporation under the trade name of A5014) was mixed with N-isopropyl-N′-phenyl-p-phenylenediamine (manufactured by Kawaguchi Chemical Co., Ltd., under the trade name of Antage 3C) as the polymerization inhibitor at an N-isopropyl-N′-phenyl-p-phenylenediamine concentration of 2000 ppm, and the mixture was extruded from a die having a diameter of 3 mm at a resin temperature of 180° C. using a single screw extruder having a diameter of 30 mm. Immediately after the extrusion, the extrudate was quenched and solidified in a water bath at 20° C. to obtain a strand having a diameter of about 5 mm wherein the polymerization inhibitor was contained uniformly. A resident time of the resin in the extruder was about 2 minutes and an extruded pressure was about 40 kg/cm2.
[Total Reflux Test]
In the total reflux test, equipment consisting of a 500 cc three neck flask equipped with a thermometer and a capillary for providing air, a fractionating column (a total length of 398 mm, a packing part length of 315 mm, and an inside diameter of 18.4 mm), a cooling pipe, a trap cooled with methanol/dry ice and a vacuum pump. A material of the equipment contacted with a liquid was entirely made of glass, a coupling joint was a SPC joint. Heat was applied in an oil bath.
To the three neck flask was added 300 g of GMA containing 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol). The resultant PP strand containing the polymerization inhibitor was cut to 31 cm and 8 strands (36.5 g) were charged to the fractionating column. The oil bath was heated to 150° C. under a pressure of 90 torr at a top of the column. A temperature of a liquid phase was 125° C. to 130° C. and a temperature of a topmost fractionating column was 120° C. to 125° C. The time period needed from the time vapor reached a bottom of PP strand until the time polymerization was acknowledged at an area packed with the PP strand was measured. After 2 to 3 hours, a white polymerizate was acknowledged at a center of the area packed with the PP strand.
[Total reflux test]
Same equipment as EXAMPLE 7 was used. To the three neck flask was added 300 g of GMA containing 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol). The fractionating column was packed with 8 pipes (each having an outside diameter of 4 mm, an inside diameter of 2.6 mm and a length of 31 cm) of SUS316. The oil bath was heated under similar conditions to EXAMPLE 7. After 0.8 to 1 hour, a white polymerizate was acknowledged at a bottom of the area packed with the pipes.
PP was mixed with N-isopropyl-N′-phenyl-p-phenylenediamine as the polymerization inhibitor at an N-isopropyl-N′-phenyl-p-phenylenediamine concentration of 10000 ppm, and the mixture was extruded from a cylindrical die having a diameter of 26 mm and a slit width of 2.5 mm at a resin temperature of 190° C. using a single screw extruder having a diameter of 40 mm. After the extrusion, the extrudate was extended and pulled into a water bath at 20° C., and solidified to obtain a tube having a diameter of about 6 mm wherein the polymerization inhibitor was contained uniformly. A resident time of the resin in the extruder was about 8 minutes and an extruded pressure was about 70 kg/cm2. The tube was cut into ring packing having a length of about 6 mm.
[Total reflux test]
Same equipment as EXAMPLE 7 was used. To the three neck flask were added 300 g of GMA and 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol). The fractionating column was packed with the resultant PP ring packing having a length of 31 cm (16 g) containing the polymerization inhibitor. The oil bath was heated to 140° C. under a pressure of 60 torr at a top of the column. A temperature of a liquid phase was 120° C. and a temperature of a topmost fractionating column was 106° C. to 109° C. The time period needed from the time vapor reached a bottom of PP ring packing until the time polymerization was acknowledged at an area packed with the PP ring was measured. After 3.5 to 4 hours, a white polymerizate was acknowledged at a top of the area packed with the PP ring packing.
[Total reflux test]
Same equipment as EXAMPLE 7 was used. To the three neck flask was added 300 g of GMA containing 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol). The fractionating column was packed with McMahon packing (a size of 6 mm, manufactured by Tokyo Special Wire Netting Co., Ltd.) made of SUS316 in a length of 31 cm (15 g). The oil bath was heated under similar conditions to EXAMPLE 8. After 0.5 to 1 hour, a white polymerizate was acknowledged on whole area packed with the McMahon packing.
By using the packing comprising the resin composition for inhibiting polymerization of the vinyl compound of the present invention instead of the conventionally used packing, a polymerization starting time is prolonged in a distillation refining, thereby allowing a long-term stable operation.
Polypropylene (a melting point of 146° C., an MI is 5.6 [230° C./2.16 kgf]) was mixed with N-isopropyl-N′-phenyl-p-phenylenediamine at a concentration of 10000 ppm and CsI at a concentration of 10000 ppm, and the mixture was extruded from a cylindrical die having a diameter of 26 mm and a slit width of 2.5 mm at a resin temperature of 190° C. using a single screw extruder having a diameter of 40 mm. After the extrusion, the extrudate was extended and pulled into a water bath at 20° C., and solidified to obtain a tube having a diameter of about 6 mm wherein the polymerization inhibitor was contained uniformly. A resident time of the resin in the extruder was about 8 minutes and an extruded pressure was about 60 kg/cm2. The tube was cut into ring packing having a length of about 6 mm.
[Total reflux test]
In the total reflux test, equipment consisting of a 500 cc three neck flask equipped with a thermometer and a capillary for providing air, a fractionating column (a total length of 398 mm, a packing part length of 315 mm, and an inside diameter of 18.4 mm) with the resultant PP ring packing containing the polymerization inhibitor at a height of 31 cm (18 g), a cooling pipe, a trap cooled with methanol/dry ice and a vacuum pump. A material of the part of the equipment contacted with a liquid was entirely made of glass, a coupling joint was a SPC joint. Heat was applied in an oil bath.
To the three neck flask were added 300 g of GMA and 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol). The oil bath was heated to 140° C. under a pressure of 60 torr at a top of the column. A temperature of a liquid phase was 120° C. and a temperature of a topmost fractionating column was 105° C. to 110° C. A temperature of the fractionating pipe was kept at 120° C. using a cylindrical heating mantle. The time period needed from the time vapor reached a bottom of the PP ring packing until the time polymerization was acknowledged at an area packed with the PP ring packing was measured. Even after 14 hours, no polymerizate was acknowledged on the PP ring packing and an area where the PP ring packing existed.
Same equipment as EXAMPLE 9 was used. To the three neck flask were added 300 g of GMA and 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol). The fractionating column was packed with Dixon packing (a diameter of 3 mm, manufactured by Tokyo Special Wire Netting Co., Ltd.) made of SUS316 in a height of 31 cm (37 g). The oil bath was heated under similar conditions to EXAMPLE 9. After 0.5 to 1 hour, a white polymerizate was acknowledged on a whole area packed with the Dixon packing.
Same equipment as EXAMPLE 9 was used. To the three neck flask were added 300 g of GMA and 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol). The fractionating column was packed with a McMahon packing (a size of 6 mm) made of SUS316 in a length of 31 cm (15 g). The oil bath was heated under similar conditions to EXAMPLE 9. After 0.5 to 1 hour, a white polymerizate was acknowledged on a whole area packed with the McMahon packing.
Then, GMA was synthesized by using methacrylic acid, epichlorohydrin and sodium carbonate as raw materials. A crude reaction liquid of the GMA was batch-distilled. The purities of the crude reaction liquid and refined fraction were represented by a simple area ratio by a gas chromatography analysis.
[Conditions of the chromatography analysis]
Device: GC-14A manufactured by Shimadzu Corporation
Column: capillary column J&W PEG-20M (DBWAX)
Injection temperature: 230° C.
Column temperature: 100° C. to 230° C.; increased at a rate of 4° C./min
Detector temperature: 230° C.
The packing were prepared by the same method as EXAMPLE 9.
[Distillation Test]
In the distillation test, used was the equipment consisting of a 500 cc three neck flask equipped with a thermometer and a capillary for providing air, a distillation tower (a height of 102 mm, an inside diameter of 18.4 mm) packed with the above PP ring packing containing the polymerization inhibitor in a length of 72 cm (36 g), a reflux head operated by a solenoid valve, a cooling pipe, a trap cooled with methanol/dry ice and a vacuum pump. A material of the part of the equipment contacted with a liquid was entirely made of glass, a coupling joint was a SPC joint. Heat was applied in an oil bath. To the three neck flask were added 300 g of the crude reaction liquid containing about 75 wt % of GMA and 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol). The oil bath was heated to 115° C. under a pressure of 6 torr at a top of the tower. The batch distillation was conducted until about 80 wt % of the crude liquid added was distilled. A temperature of the distillation tower was kept at 75° C. during GMA distillation using a cylindrical heating mantle. A temperature of a liquid phase upon the GMA distillation was 89° C. to 101° C. and a temperature of a top of the distillation tower was 72° C. to 74° C. Entire heating time was 5.4 hours. After the completion of the distillation, the cylindrical heating mantle was detached and the PP ring packing were observed. No polymerizate was acknowledged on the PP ring packing and an area where the PP ring packing existed. The resultant distillate was colorless. Purity of the GMA was 99.3 wt % at the initial cut ratio of distillate of 25 wt % for the charged liquid.
After the distillation test, 300 g of another GMA reaction crude liquid and 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol) were placed in the three neck flask to batch-distillate under the same conditions as described above without washing the distillation tower and with the PP ring packing as such. Thus, the batch distillation was conducted sequentially. After the completion of the distillation, the cylindrical heating mantle was detached to observe a production of a polymerizate on the PP ring packing and an area where the PP ring packing existed. As a result, after 13 times of the repeated batch distillation, a white polymerizate was acknowledged on the PP ring packing for the first time. The cumulative total heating time was 71 hours.
Same equipment as EXAMPLE 10 was used. To the three neck flask were added 300 g of a crude reaction liquid, about 75 wt % of GMA and 10000 ppm of 2,2′-methylenebis(4-methyl-6-t-butylphenol). The distillation tower was packed with McMahon packing (a size of 6 mm) made of SUS316 in a height of 72 cm (35 g). The batch distillation was conducted under the same conditions as EXAMPLE 10. During the GMA distillation, another GMA containing 1% of 2,2′-methylenebis(4-methyl-6-t-butylphenol) was provided from a top of the distillation tower so that the distillation tower contained 500 ppm of GMA. As a result, a total heating time was 5.5 hours until the production of a white polymerizate was acknowledged on the packing in the distillation tower.
Claims (10)
1. Packing for inhibiting polymerization of a vinyl compound in a distillation tower, comprising a resin composition for inhibiting polymerization of the vinyl compound, which composition consists essentially of at least one thermoplastic resin selected from the group consisting of a polyolefin, a fluororesin, a polyester, a polyamide, a polycarbonate and a polyether, and 0.1 to 30% by weight based on said resin of a polymerization inhibitor for the vinyl compound, wherein the vinyl compound is selected from the group consisting of a methacrylic acid, a methacrylic ester, an acrylic acid and an acrylic ester.
2. A method for inhibiting polymerization of a vinyl compound, which comprises a step of contacting the vinyl compound with a packing in a distillation tower, said packing comprising a resin composition consisting essentially of at least one thermoplastic resin selected from the group consisting of a polyolefin, a fluororesin, a polyester, a polyamide, a polycarbonate and a polyether, and 0.1 to 30% by weight based on said resin of a polymerization inhibitor for the vinyl compound at the time of distilling the vinyl compound in the distillation tower.
3. The method for inhibiting polymerization of a vinyl compound according to claim 2, wherein the polymerization inhibitor for the vinyl compound that is substantially gas or vapor is allowed to exist in the distillation tower.
4. The method for inhibiting polymerization of a vinyl compound according to claim 2, wherein the vinyl compound in which the polymerization inhibitor for the vinyl compound is dissolved, is provided from a top of the distillation tower.
5. The method for inhibiting polymerization of a vinyl compound according to claim 2, wherein the polymerization inhibitor for the vinyl compound that is substantially gas or vapor is allowed to exist in the distillation tower, and wherein the vinyl compound in which the polymerization inhibitor for the vinyl compound is dissolved, is provided from a top of the distillation tower.
6. The method for inhibiting polymerization of a vinyl compound according to claim 2, wherein the vinyl compound is selected from the group consisting of methacrylic acid, a methacrylic ester, acrylic acid and an acrylic ester.
7. The packing for inhibiting polymerization of a vinyl compound in a distillation tower according to claim 1, wherein the polymerization inhibitor is included in the resin composition in an amount of 0.2 to 20% by weight based on said resin.
8. The packing for inhibiting polymerization of a vinyl compound in a distillation tower according to claim 1, wherein the polymerization inhibitor is included in the resin composition in an amount of 0.5 to 10% by weight based on said resin.
9. The packing for inhibiting polymerization of a vinyl compound in a distillation tower according to claim 1, wherein said thermoplastic resin is substantially inert to the vinyl compound.
10. The method for inhibiting polymerization of a vinyl compound according to claim 2, wherein said thermoplastic resin is substantially inert to the vinyl compound.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-283637 | 1997-10-16 | ||
| JP28363797A JP4022697B2 (en) | 1997-10-16 | 1997-10-16 | Method for preventing polymerization of vinyl compounds |
| JP10-070449 | 1998-03-19 | ||
| JP07044998A JP4206510B2 (en) | 1998-03-19 | 1998-03-19 | Distillation column packing for preventing polymerization of vinyl compound and method for preventing polymerization of vinyl compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US6239199B1 true US6239199B1 (en) | 2001-05-29 |
Family
ID=26411606
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/172,197 Expired - Lifetime US6239199B1 (en) | 1997-10-16 | 1998-10-14 | Resin composition resin molding and method for inhibiting polymerization of vinyl compound |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6239199B1 (en) |
| EP (1) | EP0909767B1 (en) |
| DE (1) | DE69821432T2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100390112C (en) * | 2004-05-17 | 2008-05-28 | 三菱化学株式会社 | Apparatus for handling easily polymerizable compound and apparatus for producing easily polymerizable compound |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB824521A (en) | 1957-12-20 | 1959-12-02 | Shell Res Ltd | Improvements in or relating to hydrocarbon compositions |
| DE2930757A1 (en) | 1978-07-31 | 1980-02-14 | Goodrich Co B F | Prevention of deposits inside polymerisation reactors - by coating with a complex of hydrophilic polymer and inhibitor |
| EP0172427A2 (en) | 1984-07-23 | 1986-02-26 | Shin-Etsu Chemical Co., Ltd. | Process for production of vinyl chloride polymer |
| EP0207161A1 (en) | 1984-11-27 | 1987-01-07 | Sumitomo Chemical Company, Limited | Process for producing ethylene copolymer |
| WO1992006799A1 (en) | 1990-10-23 | 1992-04-30 | E.I. Du Pont De Nemours And Company | Inhibition of polymerization on interior surfaces using paint containing phenothiazine |
| US5763545A (en) * | 1994-09-14 | 1998-06-09 | Shin-Etsu Chemical Co., Ltd. | Polymerization apparatus and a method for producing polymer using the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5298081A (en) * | 1976-02-14 | 1977-08-17 | Denki Kagaku Kogyo Kk | Polymerization of vinyl halide |
| JPS6018508A (en) * | 1983-07-11 | 1985-01-30 | Mitsubishi Chem Ind Ltd | Polymerization of vinyl chloride monomer |
| JP3058023B2 (en) * | 1994-09-27 | 2000-07-04 | 凸版印刷株式会社 | Decorative sheet and method for producing the same |
-
1998
- 1998-10-12 DE DE69821432T patent/DE69821432T2/en not_active Expired - Lifetime
- 1998-10-12 EP EP98119189A patent/EP0909767B1/en not_active Expired - Lifetime
- 1998-10-14 US US09/172,197 patent/US6239199B1/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB824521A (en) | 1957-12-20 | 1959-12-02 | Shell Res Ltd | Improvements in or relating to hydrocarbon compositions |
| DE2930757A1 (en) | 1978-07-31 | 1980-02-14 | Goodrich Co B F | Prevention of deposits inside polymerisation reactors - by coating with a complex of hydrophilic polymer and inhibitor |
| EP0172427A2 (en) | 1984-07-23 | 1986-02-26 | Shin-Etsu Chemical Co., Ltd. | Process for production of vinyl chloride polymer |
| EP0207161A1 (en) | 1984-11-27 | 1987-01-07 | Sumitomo Chemical Company, Limited | Process for producing ethylene copolymer |
| WO1992006799A1 (en) | 1990-10-23 | 1992-04-30 | E.I. Du Pont De Nemours And Company | Inhibition of polymerization on interior surfaces using paint containing phenothiazine |
| US5763545A (en) * | 1994-09-14 | 1998-06-09 | Shin-Etsu Chemical Co., Ltd. | Polymerization apparatus and a method for producing polymer using the same |
Non-Patent Citations (4)
| Title |
|---|
| "In hibition and retardation in radical polymerization", C.H. Bamford, pp. 1-21, in Aggarwal, et al., Comprehensive Polymer Science, 1st Supplement (XP002089478). |
| Patent Abstracts of Japan, Publication No. 08090740, Publication Date: Apr. 9, 1996, (for Application No. 06231355, Application Date: Sep. 27, 1994). |
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| Patent Abstracts of Japan, Publication No. 60018508, Publication Date: Jan. 30, 1885 (for Application No. 58125767, Application Date: Jul. 11, 1983). |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100390112C (en) * | 2004-05-17 | 2008-05-28 | 三菱化学株式会社 | Apparatus for handling easily polymerizable compound and apparatus for producing easily polymerizable compound |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69821432T2 (en) | 2004-12-30 |
| EP0909767A1 (en) | 1999-04-21 |
| EP0909767B1 (en) | 2004-02-04 |
| DE69821432D1 (en) | 2004-03-11 |
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