US4097283A - Water-soluble composition admixture of copolymer having ethylenic unsaturation in side chain and anthraquinone photosensitizer - Google Patents
Water-soluble composition admixture of copolymer having ethylenic unsaturation in side chain and anthraquinone photosensitizer Download PDFInfo
- Publication number
- US4097283A US4097283A US05/640,925 US64092575A US4097283A US 4097283 A US4097283 A US 4097283A US 64092575 A US64092575 A US 64092575A US 4097283 A US4097283 A US 4097283A
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- United States
- Prior art keywords
- water
- soluble
- unsaturated
- parts
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000203 mixture Substances 0.000 title claims description 21
- 229920001577 copolymer Polymers 0.000 title claims description 8
- 239000003504 photosensitizing agent Substances 0.000 title claims description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 title description 11
- 150000004056 anthraquinones Chemical class 0.000 title description 9
- 150000003839 salts Chemical class 0.000 claims abstract description 26
- -1 azide compound Chemical class 0.000 claims abstract description 22
- 229920003169 water-soluble polymer Polymers 0.000 claims abstract description 6
- 239000011342 resin composition Substances 0.000 claims abstract description 5
- POPBYCBXVLHSKO-UHFFFAOYSA-N 9,10-dioxoanthracene-1-carboxylic acid Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(=O)O POPBYCBXVLHSKO-UHFFFAOYSA-N 0.000 claims abstract description 3
- JAJIPIAHCFBEPI-UHFFFAOYSA-N 9,10-dioxoanthracene-1-sulfonic acid Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O JAJIPIAHCFBEPI-UHFFFAOYSA-N 0.000 claims abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 150000001875 compounds Chemical class 0.000 claims description 16
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 9
- 125000000466 oxiranyl group Chemical group 0.000 claims description 5
- 206010034972 Photosensitivity reaction Diseases 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 125000003368 amide group Chemical group 0.000 claims description 4
- 150000001540 azides Chemical class 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 4
- 230000036211 photosensitivity Effects 0.000 claims description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 125000005907 alkyl ester group Chemical group 0.000 claims description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims description 3
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- 229920002554 vinyl polymer Polymers 0.000 claims description 3
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- 238000012644 addition polymerization Methods 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 150000001408 amides Chemical class 0.000 claims 1
- 230000000087 stabilizing effect Effects 0.000 claims 1
- 229920000642 polymer Polymers 0.000 description 29
- 238000003860 storage Methods 0.000 description 16
- 239000000243 solution Substances 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 10
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- 230000035945 sensitivity Effects 0.000 description 8
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- 239000007788 liquid Substances 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052708 sodium Inorganic materials 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
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- 229920005989 resin Polymers 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
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- 239000002184 metal Substances 0.000 description 4
- 238000007645 offset printing Methods 0.000 description 4
- 150000003003 phosphines Chemical group 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- YWWDBCBWQNCYNR-UHFFFAOYSA-N trimethylphosphine Chemical compound CP(C)C YWWDBCBWQNCYNR-UHFFFAOYSA-N 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- ZXJXZNDDNMQXFV-UHFFFAOYSA-M crystal violet Chemical compound [Cl-].C1=CC(N(C)C)=CC=C1[C+](C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 ZXJXZNDDNMQXFV-UHFFFAOYSA-M 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- QMYCJCOPYOPWTI-UHFFFAOYSA-N 2-[(1-amino-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidamide;hydron;chloride Chemical compound Cl.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N QMYCJCOPYOPWTI-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- DZGUJOWBVDZNNF-UHFFFAOYSA-N azanium;2-methylprop-2-enoate Chemical compound [NH4+].CC(=C)C([O-])=O DZGUJOWBVDZNNF-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000005018 casein Substances 0.000 description 2
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 2
- 235000021240 caseins Nutrition 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- QPNXKOHYRKMDAP-UHFFFAOYSA-L disodium;9,10-dioxoanthracene-1,8-disulfonate Chemical compound [Na+].[Na+].O=C1C2=CC=CC(S([O-])(=O)=O)=C2C(=O)C2=C1C=CC=C2S(=O)(=O)[O-] QPNXKOHYRKMDAP-UHFFFAOYSA-L 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000008273 gelatin Substances 0.000 description 2
- 229920000159 gelatin Polymers 0.000 description 2
- 235000019322 gelatine Nutrition 0.000 description 2
- 235000011852 gelatine desserts Nutrition 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- DHZHIAADIFMROX-UHFFFAOYSA-M sodium;5-azido-2-(3-oxo-3-phenylprop-1-enyl)benzenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C1=CC(N=[N+]=[N-])=CC=C1C=CC(=O)C1=CC=CC=C1 DHZHIAADIFMROX-UHFFFAOYSA-M 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- HPTYXEVCYIOQNN-UHFFFAOYSA-N (2,3,4-trichlorophenyl)phosphane Chemical compound PC1=CC=C(Cl)C(Cl)=C1Cl HPTYXEVCYIOQNN-UHFFFAOYSA-N 0.000 description 1
- WLQXEFXDBYHMRG-OWOJBTEDSA-N (e)-4-(oxiran-2-ylmethoxy)-4-oxobut-2-enoic acid Chemical compound OC(=O)\C=C\C(=O)OCC1CO1 WLQXEFXDBYHMRG-OWOJBTEDSA-N 0.000 description 1
- BSSNZUFKXJJCBG-OWOJBTEDSA-N (e)-but-2-enediamide Chemical compound NC(=O)\C=C\C(N)=O BSSNZUFKXJJCBG-OWOJBTEDSA-N 0.000 description 1
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- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
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- HQCSZRIVJVOYSU-UHFFFAOYSA-N 2-(ethoxymethyl)oxirane Chemical compound CCOCC1CO1 HQCSZRIVJVOYSU-UHFFFAOYSA-N 0.000 description 1
- JKGNYCIRDYSCQF-UHFFFAOYSA-N 2-[3-(4-azidophenyl)prop-2-enoyl]benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1C(=O)C=CC1=CC=C(N=[N+]=[N-])C=C1 JKGNYCIRDYSCQF-UHFFFAOYSA-N 0.000 description 1
- QYVVXYNXJQERRN-UHFFFAOYSA-N 2-hydroxyethyl 2-methylprop-2-enoate;2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C.CC(=C)C(=O)OCCO QYVVXYNXJQERRN-UHFFFAOYSA-N 0.000 description 1
- NMSZFQAFWHFSPE-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxycarbonyl)but-3-enoic acid Chemical compound OC(=O)CC(=C)C(=O)OCC1CO1 NMSZFQAFWHFSPE-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
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- XHPWRTXYJFNZAW-UHFFFAOYSA-N [[4-[2-(4-diazonioimino-2-sulfocyclohexa-2,5-dien-1-ylidene)ethylidene]-3-sulfocyclohexa-2,5-dien-1-ylidene]hydrazinylidene]azanide Chemical compound OS(=O)(=O)C1=CC(N=[N+]=[N-])=CC=C1C=CC1=CC=C(N=[N+]=[N-])C=C1S(O)(=O)=O XHPWRTXYJFNZAW-UHFFFAOYSA-N 0.000 description 1
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- YOTZYFSGUCFUKA-UHFFFAOYSA-N dimethylphosphine Chemical compound CPC YOTZYFSGUCFUKA-UHFFFAOYSA-N 0.000 description 1
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- HYYYTIDWAIQGHI-UHFFFAOYSA-L disodium;5-azido-2-[2-(4-azido-2-sulfonatophenyl)ethenyl]benzenesulfonate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)C1=CC(N=[N+]=[N-])=CC=C1C=CC1=CC=C(N=[N+]=[N-])C=C1S([O-])(=O)=O HYYYTIDWAIQGHI-UHFFFAOYSA-L 0.000 description 1
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- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- WUOIAOOSKMHJOV-UHFFFAOYSA-N ethyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(CC)C1=CC=CC=C1 WUOIAOOSKMHJOV-UHFFFAOYSA-N 0.000 description 1
- JLHMVTORNNQCRM-UHFFFAOYSA-N ethylphosphine Chemical compound CCP JLHMVTORNNQCRM-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 229920002717 polyvinylpyridine Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 235000018102 proteins Nutrition 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- IGNTWNVBGLNYDV-UHFFFAOYSA-N triisopropylphosphine Chemical compound CC(C)P(C(C)C)C(C)C IGNTWNVBGLNYDV-UHFFFAOYSA-N 0.000 description 1
- RMZAYIKUYWXQPB-UHFFFAOYSA-N trioctylphosphane Chemical compound CCCCCCCCP(CCCCCCCC)CCCCCCCC RMZAYIKUYWXQPB-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
- C08K5/08—Quinones
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/008—Azides
- G03F7/012—Macromolecular azides; Macromolecular additives, e.g. binders
- G03F7/0125—Macromolecular azides; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the macromolecular azides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Definitions
- the present invention relates to a water-soluble, photosensitive resin composition with good storage stability, which does not contain bichromates and which is rendered insoluble upon irradiation with light, in particular with ultraviolet rays. More concretely, it relates to a photoresist composition obtained by adding a water-soluble anthraquinone compound serving as a photosensitizer to a water-soluble polymer having an ethylenic unsaturated bond incorporated into the side chain.
- Water-soluble, photosensitive compositions hitherto widely used as photoresists contain water-soluble resins and bichromates as their main components. As is well known, these compositions have, however, such disadvantages as extremely low storage stability or environmental pollution with hexavalent chromium. For this reason, compositions containing water-soluble diazo resins as sensitizers instead of bichromates have recently appeared, especially for the use in litho-printing. However, they also have defects, such as poor storage stability, low sensitivity, etc.
- the storage stability is extremely low. This is assumed to be due to the reactivity of the azide group and double bond. A similar phenomenon can be observed, for example, when an azide compound is added to a cinnamic acid ester photosensitive resin.
- the present inventors have carried out intensive investigations to overcome the above-mentioned shortcomings of water-soluble photoresists and completed the present invention by discovering the unexpected fact that the presence of a certain kind of water-soluble anthraquinone compound results in the quick cross-linking and curing of polymers having an ethylenic unsaturated bond incorporated into the side chain, when irradiated with light.
- the present invention relates to a water-soluble, photosensitive resin composition which contains, as its main components, a water-soluble polymer having an ethylenic unsaturated bond in the side chain (hereinafter usually called the water-soluble unsaturated polymer) and anthraquinone sulfonic acid or anthraquinone carboxylic acid, or salts thereof (hereinafter called water-soluble anthraquinone).
- a water-soluble unsaturated polymer a water-soluble polymer having an ethylenic unsaturated bond in the side chain
- anthraquinone sulfonic acid or anthraquinone carboxylic acid, or salts thereof hereinafter called water-soluble anthraquinone
- An especially useful embodiment of the invention is a composition consisting of a water-soluble unsaturated polymer, a water-soluble anthraquinone, and a water-soluble azide compound, which also contains organic tertiary phosphin
- the water-soluble anthraquinone absorbs energy from the rays of light which irradiate it. This energy is transmitted to the ethylenic unsaturated group. Upon receipt of this energy, the unsaturated group is activated and converted into a free radical, which is believed to participate in cross-linking, which takes place as a chain reaction.
- this appears to be a photopolymerization reaction the composition of the present invention can be sufficiently insolubilized even in the absence of a photopolymerizable monomer (cross-linking agent).
- cross-linking agent causes cross-linking by the insertion of nitrene formed upon photolysis of the azide group into the unsaturated bond. Also the thermal decomposition of the azide group into nitrene proceeds smoothly. This results in poor storage stability.
- the water-soluble anthraquinone sensitizer of the present invention is believed to be merely a medium for energy transfer without causing material change, i.e. structural changes in the material.
- a reaction is influenced very little by heat and hence the storage stability of the composition is enhanced.
- the photosensitivity of this sensitizer gradually decreased during storage. This is a reverse reaction to an ordinary darkening reaction, i.e., fogging phenomenon. This may be due to the effect of oxygen as in the case of an ordinary photopolymerization system.
- This process comprises the steps of polymerizing an unsaturated amide compound and an unsaturated carboxylic acid or salts thereof and, if occasion demands, one or more kinds of vinyl monomers which are co-polymerizable with them in a conventional manner to provide a polymer hereinafter referred to as the prepolymer, and reacting the prepolymer with ethylenic unsaturated compounds having an oxirane ring.
- Effective unsaturated amide compounds include acrylamide, methacrylamide, diacetoneacrylamide, maleic diamide, crotonamide, itacondiamide and fumaric diamide.
- Suitable unsaturated carboxylic acids or salts thereof include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid and salts thereof with K, Na, Li, NH 4 , and organic amines.
- the vinyl monomers which are co-polymerizable with the above described unsaturated compounds include vinyl acetate, vinyl propionate, styrene and alkyl esters, hydroxyalkyl esters or aminoalkyl esters of unsaturated carboxylic acids, preferably, methyl, ethyl, propyl, butyl, octyl, hydroxyethyl, hydroxypropyl, and dimethyl aminoethyl acrylates or methacrylates.
- the composition of the prepolymer preferably contains at least one unsaturated amide compound in a 40 - 95 mol % range, and preferably 50 - 80 mol %, at least one unsaturated carboxylic acid or salt thereof in the range of 5 - 10 mol % and may contain one of more alkyl esters of unsaturated carboxylic acid in the range of 0 - 30 mol % and one or more hydroxyalkyl esters of unsaturated carboxylic acid in a range of 0 - 30 mol %.
- the ethylenic unsaturated compound having an oxirane ring may be added to the prepolymer by heating the ethylenic unsaturated compound having an oxirane ring, for example, an unsaturated epoxy compound such as glycidyl methacrylate, allyl glycidyl ether, ⁇ -ethyl glycidyl ether, crotonyl glycidyl ether, glycidyl crotonate, monoalkyl monoglycidyl itaconate, monoalkyl monoglycidyl fumarate, monoalkyl monoglycidyl maleate, etc., at 0.1 - 0.6 molar equivalents to the amide group and carboxylic group contained in the prepolymer at 50° - 90° C in the presence of an ordinary polymerization inhibitor such as hydroquinone, benzoquinone and the like for 2 - 10 hours.
- an ordinary polymerization inhibitor such as hydroquinon
- the water-soluble copolymer obtained by the above mentioned reaction process is remarkably superior in properties such as sensitivity, adhesion, developability and etch-resistance. It can be also purified by precipitating the polymer in a water-soluble organic solvent, if desired.
- Anthraquinone-1, 8-disulfonic acid (or salts thereof)
- the amount added can be less than 1% by weight to the water-soluble unsaturated polymer.
- the addition of a larger amount should be avoided, because a darkening reaction then occurs during storage.
- Water-soluble anthraquinone is added in an amount having a weight equal to 0.5 ⁇ 20% of that of the water-soluble unsaturated polymer.
- anthraquinone alone is used as sensitizer, the photosensitivity decreases gradually during storage.
- the addition of a water-soluble azide compound is also effective in reducing the decrease in storage stability presumably caused by the influence of oxygen.
- the following compounds can be used as organic tertiary phosphines:
- Phosphine trimethylphosphine, ethylphosphine, phenylphosphine, diphenylphosphine, dimethylphosphine, ethyldiphenylphosphine, triphenylphosphine, triisopropylphosphine, trichlorophenylphosphine, triaminophenylphosphine, tris(n-octyl)-phosphine, etc.
- the above mentioned compounds have the ability to stabilize, in particular, the azide compounds and also to thermally stabilize the unsaturated groups. Many of them show poor water solubility, but a sufficient effect can be attained by completely dispersing them. It is sufficient to add an amount having a weight which is less than 1% of that of the water-soluble unsaturated polymer.
- binder resins may be made in dependence on the particular application so as to change the various physical properties to provide compositions which are suitable for different purposes.
- the following polymers can be employed as binder resins suitable for the above purpose:
- the present invention offers lower priced water-soluble, photosensitive resin compositions which are easy to manufacture and which have very high storage stability, practical sensitivity and degree of hardening, and which do not cause heavy metal pollution. They can be applied, for instance, as weak alkaline, aqueous solutions (water-soluble organic solvents can be added in an amount of less than 20%) to plate making of metal relief plate, i.e., deep-etch, litho-plate, multi-metal plate printing, etc., and photoetching processing of metal in place of the conventional bichromated photoresists. Furthermore, these compositions can be used in making so-called presensitized plates (PS plates), by applying as a sensitive layer to printing plates or metal plates to be processed beforehand.
- PS plates presensitized plates
- the laminate was etched with a 45° Be ferric chloride solution.
- the film was removed with a 10% aqueous solution of sodium hydroxide to prepare printed circuits.
- This pre-sensitized (PS) plate can be preserved in a cold and dark place for more than 3 months without degrading the quality.
- the plate was sensitized and inked up to complete the preparation of the trimetal plate for offset printing.
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polymerisation Methods In General (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
A water-soluble, photosensitive resin composition containing a water-soluble polymer having an ethylenic unsaturated bond in its side-chains, a water-soluble anthraquinone sulfonic acid or anthraquinone carboxylic acid sensitizer, or salts thereof, and if desired, a water-soluble azide compound.
Description
The present invention relates to a water-soluble, photosensitive resin composition with good storage stability, which does not contain bichromates and which is rendered insoluble upon irradiation with light, in particular with ultraviolet rays. More concretely, it relates to a photoresist composition obtained by adding a water-soluble anthraquinone compound serving as a photosensitizer to a water-soluble polymer having an ethylenic unsaturated bond incorporated into the side chain.
Water-soluble, photosensitive compositions hitherto widely used as photoresists contain water-soluble resins and bichromates as their main components. As is well known, these compositions have, however, such disadvantages as extremely low storage stability or environmental pollution with hexavalent chromium. For this reason, compositions containing water-soluble diazo resins as sensitizers instead of bichromates have recently appeared, especially for the use in litho-printing. However, they also have defects, such as poor storage stability, low sensitivity, etc.
Attempts which have been made to use water-soluble bisazide compounds as sensitizers, have encountered some difficult problems in obtaining a practical degree of sensitivity and hardening. For instance only an insufficient photosensitivity has been obtained from any combination of a polymer containing an amide group, such as natural proteins (casein, gelatin, albumin and the like), or polyacrylamide, with water-soluble bisazide compounds or the combination of acrylamide or methacrylamide copolymers with water-soluble bisazide compounds as described in the Japanese Patent Laying Open Sho 47-30404. On the other hand, Japanese Patent Laying Open sho 47-19901 describes combinations of water-soluble bisazide compounds and water-soluble polymers of acrylic acids having an unsaturated bond incorporated into the side chain. Although a practical degree of photosenitivity can be obtained in this case, the storage stability is extremely low. This is assumed to be due to the reactivity of the azide group and double bond. A similar phenomenon can be observed, for example, when an azide compound is added to a cinnamic acid ester photosensitive resin.
The present inventors have carried out intensive investigations to overcome the above-mentioned shortcomings of water-soluble photoresists and completed the present invention by discovering the unexpected fact that the presence of a certain kind of water-soluble anthraquinone compound results in the quick cross-linking and curing of polymers having an ethylenic unsaturated bond incorporated into the side chain, when irradiated with light.
Specifically, the present invention relates to a water-soluble, photosensitive resin composition which contains, as its main components, a water-soluble polymer having an ethylenic unsaturated bond in the side chain (hereinafter usually called the water-soluble unsaturated polymer) and anthraquinone sulfonic acid or anthraquinone carboxylic acid, or salts thereof (hereinafter called water-soluble anthraquinone). An especially useful embodiment of the invention is a composition consisting of a water-soluble unsaturated polymer, a water-soluble anthraquinone, and a water-soluble azide compound, which also contains organic tertiary phosphines and, if desired, resinous binders.
The present invention will now be explained in more detail as follows:
To summarize the photochemical reaction involved in the present invention, the water-soluble anthraquinone absorbs energy from the rays of light which irradiate it. This energy is transmitted to the ethylenic unsaturated group. Upon receipt of this energy, the unsaturated group is activated and converted into a free radical, which is believed to participate in cross-linking, which takes place as a chain reaction. Although this appears to be a photopolymerization reaction, the composition of the present invention can be sufficiently insolubilized even in the absence of a photopolymerizable monomer (cross-linking agent). The well known bis-azide sensitizer (cross-linking agent) causes cross-linking by the insertion of nitrene formed upon photolysis of the azide group into the unsaturated bond. Also the thermal decomposition of the azide group into nitrene proceeds smoothly. This results in poor storage stability.
On the contrary, the water-soluble anthraquinone sensitizer of the present invention is believed to be merely a medium for energy transfer without causing material change, i.e. structural changes in the material. Such a reaction is influenced very little by heat and hence the storage stability of the composition is enhanced. However, it was found that the photosensitivity of this sensitizer gradually decreased during storage. This is a reverse reaction to an ordinary darkening reaction, i.e., fogging phenomenon. This may be due to the effect of oxygen as in the case of an ordinary photopolymerization system.
It was also found that the sensitivity and degree of hardening are markedly increased by adding a trace amount of a water-soluble azide compound to the above sensitizer. (Normally bis-azide compounds are used as cross-linking agents, but the scope of this invention is not limited to them). The amount of this azide required to be added may be only 1/10 - 1/100 that specified in the Japanese Patent Laying Open Sho 47-19901, an amount that would scarcely cause hardening if used alone.
Moreover, the addition of such a small amount exerts only a slight negative influence on the storage stability and if the amount is properly selected, the above mentioned darkening in the presence of oxygen can be almost eliminated. Furthermore, organic tertiary phosphines stabilize the azide group by forming chelates. Although the phosphines assist in improving storage stabilization to a certain extent after the addition of water-soluble azide compounds, it is not always necessary to employ them, because their water solubility and compatibility with other ingredients are poor. Consequently, it is preferred to use them only when long-term storage is required.
It is possible to synthesize the water-soluble unsaturated polymer by various well known processes. In the following one example of a process for the manufacture of the water-soluble unsaturated polymer suitable for use in the present invention will be described in detail. This process comprises the steps of polymerizing an unsaturated amide compound and an unsaturated carboxylic acid or salts thereof and, if occasion demands, one or more kinds of vinyl monomers which are co-polymerizable with them in a conventional manner to provide a polymer hereinafter referred to as the prepolymer, and reacting the prepolymer with ethylenic unsaturated compounds having an oxirane ring.
Effective unsaturated amide compounds include acrylamide, methacrylamide, diacetoneacrylamide, maleic diamide, crotonamide, itacondiamide and fumaric diamide. Suitable unsaturated carboxylic acids or salts thereof include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid and salts thereof with K, Na, Li, NH4, and organic amines.
In addition, the vinyl monomers which are co-polymerizable with the above described unsaturated compounds include vinyl acetate, vinyl propionate, styrene and alkyl esters, hydroxyalkyl esters or aminoalkyl esters of unsaturated carboxylic acids, preferably, methyl, ethyl, propyl, butyl, octyl, hydroxyethyl, hydroxypropyl, and dimethyl aminoethyl acrylates or methacrylates.
Applicants have examined various practical, characteristic properties such as water-solubility, film-forming ability, adhesion, flexibility and strength of film and etch-resistance as a resist-film, and found as a result that the composition of the prepolymer preferably contains at least one unsaturated amide compound in a 40 - 95 mol % range, and preferably 50 - 80 mol %, at least one unsaturated carboxylic acid or salt thereof in the range of 5 - 10 mol % and may contain one of more alkyl esters of unsaturated carboxylic acid in the range of 0 - 30 mol % and one or more hydroxyalkyl esters of unsaturated carboxylic acid in a range of 0 - 30 mol %.
When less than 40 mol % of the unsaturated amide compound is used, not only does the water-solubility decrease, but so does the amount of ethylenic unsaturated compound having an oxylane ring to be added, thereby markedly lowering the cross-linking density produced by the light-exposure. Hence, no satisfactory sensitivity can be attained.
When the proportion of the unsaturated carboxylic acid or the salts thereof exceeds 10 mol %, it appears to have an undesirable influence upon storage stability, flexibility of film, etc. and also upon the water-resistance of the sensitized film. On the other hand, with less than 5 mol % of unsaturated carboxylic acid, the adhesion to the substrate is not sufficient and the sensitivity decreases.
The ethylenic unsaturated compound having an oxirane ring may be added to the prepolymer by heating the ethylenic unsaturated compound having an oxirane ring, for example, an unsaturated epoxy compound such as glycidyl methacrylate, allyl glycidyl ether, α-ethyl glycidyl ether, crotonyl glycidyl ether, glycidyl crotonate, monoalkyl monoglycidyl itaconate, monoalkyl monoglycidyl fumarate, monoalkyl monoglycidyl maleate, etc., at 0.1 - 0.6 molar equivalents to the amide group and carboxylic group contained in the prepolymer at 50° - 90° C in the presence of an ordinary polymerization inhibitor such as hydroquinone, benzoquinone and the like for 2 - 10 hours. The amount of the above mentioned unsaturated epoxy compound to be added is preferably 0.1 ˜ 0.6 molar equivalents against amide group and carboxylic group in view of sensitivity and storage stability.
The water-soluble copolymer obtained by the above mentioned reaction process is remarkably superior in properties such as sensitivity, adhesion, developability and etch-resistance. It can be also purified by precipitating the polymer in a water-soluble organic solvent, if desired.
The following compounds can be used as water-soluble anthraquinone sensitizers which feature the present invention:
Anthraquinone-1, 8-disulfonic acid (or salts thereof)
Anthraquinone-1, 5-disulfonic acid (or salts thereof)
Anthraquinone-2, 6-disulfonic acid (or salts thereof)
Anthraquinone-2, 7-disulfonic acid (or salts thereof)
Anthraquinone-α-sulfonic acid (or salts thereof)
Anthraquinone-β-sulfonic acid (or salts thereof)
Anthraquinone-α-carboxylic acid (or salts thereof)
Anthraquinone-β-carboxylic acid (or salts thereof)
The following water soluble azide compouns can be use:
4, 4'-Diazidostilbene-2, 2'-disulfonic acid (or salts thereof)
4-Azidobenzalmethyl-oxide-2-sulfonic acid (or salts thereof)
4, 4'-Diazidobenzalacetone-2, 2'-disulfonic acid (or salts thereof)
2, 5-(p, p'-Diazidobenzal)cyclohexanone-m, m'-disulfonic acid (or salts thereof)
4, 4'-Diazidostilbene-γ-carboxylic acid (or salts thereof)
4-Azidochalcone-2-sulfonic acid (or salts thereof)
4-Azidochalcone-2'-sulfonic acid (or salts thereof)
4-Azidochalcone-2', 4'-disulfonic acid (or salts thereof)
Since the water-soluble azide compound employed in the present invention is used for the purpose of strengthening the sensitization effect of the water-soluble anthraquinone sensitizer, the amount added can be less than 1% by weight to the water-soluble unsaturated polymer. The addition of a larger amount should be avoided, because a darkening reaction then occurs during storage. Water-soluble anthraquinone is added in an amount having a weight equal to 0.5 ˜ 20% of that of the water-soluble unsaturated polymer. When anthraquinone alone is used as sensitizer, the photosensitivity decreases gradually during storage. The addition of a water-soluble azide compound is also effective in reducing the decrease in storage stability presumably caused by the influence of oxygen. The following compounds can be used as organic tertiary phosphines:
Phosphine, trimethylphosphine, ethylphosphine, phenylphosphine, diphenylphosphine, dimethylphosphine, ethyldiphenylphosphine, triphenylphosphine, triisopropylphosphine, trichlorophenylphosphine, triaminophenylphosphine, tris(n-octyl)-phosphine, etc.
The above mentioned compounds have the ability to stabilize, in particular, the azide compounds and also to thermally stabilize the unsaturated groups. Many of them show poor water solubility, but a sufficient effect can be attained by completely dispersing them. It is sufficient to add an amount having a weight which is less than 1% of that of the water-soluble unsaturated polymer.
The addition of other binder resins may be made in dependence on the particular application so as to change the various physical properties to provide compositions which are suitable for different purposes. The following polymers can be employed as binder resins suitable for the above purpose:
Gum arabic, shellac, casein, gelatin, glue, cellulose and derivatives thereof, starch, polyvinylalcohol, polyvinylpyrrolidone, polyvinylpyridine, polyvinylether, polyethylene oxide, water-soluble polymers like water-soluble acrylic resin and aqueous emulsions of polyvinyl acetate, silicone resin, acrylic resin, etc.
The present invention offers lower priced water-soluble, photosensitive resin compositions which are easy to manufacture and which have very high storage stability, practical sensitivity and degree of hardening, and which do not cause heavy metal pollution. They can be applied, for instance, as weak alkaline, aqueous solutions (water-soluble organic solvents can be added in an amount of less than 20%) to plate making of metal relief plate, i.e., deep-etch, litho-plate, multi-metal plate printing, etc., and photoetching processing of metal in place of the conventional bichromated photoresists. Furthermore, these compositions can be used in making so-called presensitized plates (PS plates), by applying as a sensitive layer to printing plates or metal plates to be processed beforehand.
The following examples will show the present invention in more detail. The present invention is not, however, limited to such examples. The term "part," when used herein, means "part by weight."
44.7 Parts of acrylamide, 6.02 parts of methacrylic acid, 8.6 parts of methyl acrylate and 23.2 parts of 2-hydroxylethylacrylate were dissolved in a mixture of 222.7 parts of water and 24.7 parts of 2-propanol. This solution was polymerized in the presence of 0.25 parts of 2, 2'-azobis (2-amidinopropane) hydrochloride as a polymerization initiator in a stream of nitrogen at 80° C for 10 hrs. The 2-propanol was removed under reduced pressure. Subsequently, 0.005 parts of hydroquinone and 14 parts of glycidyl methacrylate were added and the reaction was continued at 75° C for 4 hrs.
35.5 Parts of acrylamide, 5.88 parts of (pure) ammonium acrylate, 13 parts of ethyl acrylate, and 39 parts of 2-hydroxyethylmethacrylate hydroxylethylacrylate were dissolved in a mixture of 224.5 parts of water with 56.1 parts of methanol. This solution was polymerized with 0.56 parts of ammonium azobiscyanovaleate as a polymerization initiator in a stream of nitrogen at 75° C for 9 hrs. Then, 0.075 parts of benzoquinone and 24.2 parts of glycidyl methacrylate were added and the reaction was continued at 85° C for 3 hrs. The copolymer having an ethylenic unsaturated bond in its side chain (hereinafter called the addition copolymer) obtained by the above method as purified by precipitation in 2-propanol.
42.6 Parts of acrylamide, 7.74 parts of (pure) ammonium methacrylate, 16.5 parts of ethyl acrylate and 16.8 parts of 2-hydroxylethylacrylate were dissolved into 251 parts of water. This solution was polymerized by adding 0.33 parts of 2, 2'-azobis (2-amidinopropane) hydrochloride in a stream of nitrogen at 80° C for 8 hrs. Then, 0.008 parts of hydroquinone and 25 parts of glycidyl methacrylate were added and the reaction was continued at 75° C for 3 hrs. The addition copolymer obtained was purified by precipitation in acetone.
56.8 Parts of acrylamide, 8.6 parts of ammonium methacrylate (pure) and 10 parts of ethyl acrylate were dissolved in a mixture of 203.5 parts of water with 22.6 parts of 2-propanol. The solution was polymerized in the presence of 0.37 part of potassium persulfate in a stream of nitrogen at 80° C for 9 hrs. Then, 0.015 part of hydroquinone and 51.1 parts of glycidyl methacrylate were added and the reaction was continued at 85° C for 2 hrs. The addition copolymer obtained as above was purified by precipitation in acetone.
49.7 Parts of acrylamide, 5.76 parts of acrylic acid, 11.4 parts of ethylmethacrylate and 17.28 parts of hydroxypropyl methacrylate were dissolved in 220.2 parts of water together with 50.5 parts of methanol. The solution was polymerized in the presence of 0.43 part of ammonium azobiscyanovaleate as a polymerization initiator in a nitrogen stream at 75° C for 9 hrs. Then, 0.005 part of hydroquinone and 22.15 parts of glycidyl methacrylate were added and the reaction was continued at 80° C for 3 hrs.
21 Parts of the aqueous solution of water-soluble unsaturated polymer obtained in Polymer Example 1 and 1.2 parts of sodium anthraquinone-1.8-disulfonate were dissolved in 72 parts of water. The solution was filtered and used as a sensitive liquid. This was applied onto an iron plate for a shadow mask through immersion, and dried at 70° C for 10 min. The plate was exposed in contact with a negative film by using a perfecting machine (2 kw mercury lamp, for 30 sec.) and showered with water for development. After post-baking at 120° C for 15 min., etching was effected bifacially with 45° Be ferric chloride solution. The plate was soaked in a 15% aqueous solution of sodium hydroxide at 60° C to obtain a shadow mask after removing the resist film.
6 Parts of the water-soluble unsaturated polymer obtained in Polymer Example 2, 0.4 parts of sodium anthraquinone-β-sulfonate, 0.05 parts of sodium 4, 4'-diazidostilbene-2, 2'-disulfonate, 0.06 parts of trimethylphosphine and 0.05 parts of crystal violet dye were dissolved in 94 parts of water. The solution was filtered and used as a sensitive liquid.
This was applied onto a copper-clad laminate for printed circuits by means of a whirler. The laminate was dried, exposed in contact with a negative film with the carbon arc lamp (100 V, 30 Amp, at a distance of 50 cm) for 1 min., and washed with a spray of water for development.
After drying, the laminate was etched with a 45° Be ferric chloride solution. The film was removed with a 10% aqueous solution of sodium hydroxide to prepare printed circuits.
7 Parts of the water-soluble unsaturated polymer obtained in Polymer Example 3, 0.4 parts of sodium anthraquinone-β-sulfonate, 0.08 parts of sodium 4-azidochalcone-2-sulfonate and 0.05 parts of methyl violet (dye) were dissolved in 93 parts of water. The solution was filtered and used as a sensitive liquid. This was applied onto a mechanically grained aluminum plate for offset printing by using a whirler. The plate was dried, exposed in contact with a positive film, and washed with water to obtain a negative image. After stopping out, lacquering and tincturing, a positive image was obtained upon removing the film with a 5% aqueous solution of sodium metasilicate. As mentioned above, the application of this sensitive liquid to a deep-etch process offers many advantages as compared with the conventional bichromated sensitive materials, for example, easy removal of the lacquer at exposed areas and simplifying of the film removing process.
This pre-sensitized (PS) plate can be preserved in a cold and dark place for more than 3 months without degrading the quality.
6 Parts of the water-soluble unsaturated polymer of Polymer Example 3 was dissolved into 94 parts of water together with 0.8 part of sodium 2, 5-(p,p'-diazidobenzal) cyclo-hexanone-m, m'-disulfonate, 0.06 part of triphenyl phosphine and 0.05 part of methyl violet. The solution was used as a sensitive liquid after filtration. This was applied onto an anodized aluminum plate for offset printing to obtain a PS plate to be used for deep-etching as described in Example 3.
12 Parts of the water-soluble unsaturated polymer obtained in Polymer Example 4 was dissolved in 88 parts of water together with 0.8 parts of sodium anthraquinone-1, 8-disulfonate, 0.09 parts of sodium 4, 4'-diazidobenzalacetone-2, 2'-disulfonate and 0.1 part of triphenylphosphine. The solution was mixed with 60 parts of vinyl acetate emulsion to prepare a sensitive emulsion for screen printing. The sensitive emulsion was applied onto screen fabrics (of polyethylene terephthalate fiber, 200 mesh) and dried. The screen was exposed in contact with a positive film for 3 min. by means of a carbon arc lamp and washed with water to remove the unexposed areas. The image of the screen printing plate obtained was very sharp.
22 Parts of the water-soluble unsaturated polymer obtained in Polymer Example 5 was dissolved into 70 parts of water together with 0.8 parts of sodium anthraquinone-β-sulfonate, 0.06 parts of sodium 4-azidochalcone-2-sulfonate and 0.05 parts of methyl violet. The solution was used as a sensitive liquid after filtration. This was applied onto a trimetal plate for offset printing composed of iron, copper and chromium. The plate was dried, exposed in contact with a positive film and washed with water for development. Subsequently, the chromium layer at nonimage areas was removed by etching with an etching liquid for trimetal plate making containing a saturated aqueous solution of calcium chloride as its main component.
After the film was removed with a 5% aqueous caustic soda, the plate was sensitized and inked up to complete the preparation of the trimetal plate for offset printing.
Claims (7)
1. A water-soluble, photosensitive resin composition comprising a mixture of
(a) a water-soluble unsaturated copolymer having an ethylenic unsaturated bond in the side chain obtained by reacting a prepolymer which is formed by addition polymerization of 40-95 mol% of an unsaturated amide compound, 5-10 mol% of an unsaturated carboxylic acid or salts thereof and each 0-30 mol% of at least one vinyl monomer which is co-polymerizable with the unsaturated amide and unsaturated carboxylic acid or salts thereof selected from the group consisting of vinyl acetate, vinyl propionate, styrene and alkyl-, hydroxyalkyl- or aminoalkylesters of unsaturated carboxylic acid, with an ethylenic unsaturated compound having an oxirane ring under heating in the presence of a polymerization inhibitor, and
(b) a water soluble anthraquinone sulfonic acid, anthraquinone carboxylic acid or salts thereof as photosensitizer, the amount of the ingredient (b) being 0.5 - 20% with respect to the weight of the ingredient a).
2. The composition of claim 1, in which the molar ratio of said ethylenic unsaturated compound having an oxirane ring to the total of the amide groups and the carboxylic groups contained in the prepolymer of 0.1 - 0.6:1.
3. The composition of claim 1 in which said unsaturated amide compound constitutes 50 - 80 mol % of said prepolymer.
4. The composition of claim 1, in which said prepolymer contains 0 - 30 mol % alkyl esters or hydroxyalkyl esters of unsaturated carboxylic acids.
5. The composition of claim 1, which contains a photosensitivity and hardness increasing amount of a water-soluble azide.
6. The composition of claim 5, which contains an azide stabilizing amount of an organic tertiary phosphine.
7. The composition of claim 5, wherein the quantity of said water-soluble azide compound has a weight equal to less than 1% of that of said water-soluble polymer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JA50-1418 | 1974-12-28 | ||
| JP50001418A JPS51149021A (en) | 1974-12-28 | 1974-12-28 | Water soluble photosensitive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US4097283A true US4097283A (en) | 1978-06-27 |
Family
ID=11500907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US05/640,925 Expired - Lifetime US4097283A (en) | 1974-12-28 | 1975-12-15 | Water-soluble composition admixture of copolymer having ethylenic unsaturation in side chain and anthraquinone photosensitizer |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4097283A (en) |
| JP (1) | JPS51149021A (en) |
| DE (1) | DE2558527A1 (en) |
| FR (1) | FR2296206A1 (en) |
| GB (1) | GB1516746A (en) |
| NL (1) | NL7515072A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4279986A (en) * | 1977-06-01 | 1981-07-21 | Nippon Electric Co., Ltd. | Negative resist and radical scavenger composition with capability of preventing post-irradiation polymerization |
| EP0049504A1 (en) * | 1980-10-06 | 1982-04-14 | E.I. Du Pont De Nemours And Company | Improved aqueous developable photopolymerizable elements |
| US4505794A (en) * | 1979-05-18 | 1985-03-19 | Ciba-Geigy Corporation | Thioxanthonecarboxylic acid esters, thioesters and amides |
| US4657842A (en) * | 1982-11-25 | 1987-04-14 | Ciba-Geigy Corporation | Photosensitive compositions of matter comprising epoxide compounds and functional anthraquinones |
| US4783391A (en) * | 1983-08-17 | 1988-11-08 | Toray Industries, Inc. | Radiation-sensitive polyamide polymer composition with anthraquinone monoazide |
| US4842984A (en) * | 1986-04-30 | 1989-06-27 | Nitto Boseki Co., Ltd. | Water soluble photosensitive resin compositions with bisazide compound |
| US5561194A (en) * | 1995-03-29 | 1996-10-01 | International Business Machines Corporation | Photoresist composition including polyalkylmethacrylate co-polymer of polyhydroxystyrene |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6534618B1 (en) | 2000-11-27 | 2003-03-18 | Corning Incorporated | Methods of drying optical fiber coatings |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2687958A (en) * | 1949-05-14 | 1954-08-31 | Azoplate Corp | Light-sensitive layers for the printing industry |
| US3357831A (en) * | 1965-06-21 | 1967-12-12 | Harris Intertype Corp | Photopolymer |
| US3418295A (en) * | 1965-04-27 | 1968-12-24 | Du Pont | Polymers and their preparation |
| US3684516A (en) * | 1969-10-17 | 1972-08-15 | Mitsui Mining & Smelting Co | Photo-sensitive resin composition |
| US3715210A (en) * | 1971-02-19 | 1973-02-06 | Howson Algraphy Ltd | Lithographic printing plates |
| US3721566A (en) * | 1969-12-23 | 1973-03-20 | Agfa Gevaert Nv | Increasing the light sensitivity of polymeric compositions comprising azido groups |
| US3733200A (en) * | 1970-02-19 | 1973-05-15 | Hydron Chemical Co Ltd | Printing plate |
| US3776736A (en) * | 1972-08-07 | 1973-12-04 | Rca Corp | Stabilized photoresist composition |
| US3795640A (en) * | 1971-01-07 | 1974-03-05 | Powers Chemco Inc | Furfuryl,allyl and methylol acrylamide esters of polymeric acids |
| US3822235A (en) * | 1971-04-30 | 1974-07-02 | Philips Corp | Method of producing light-sensitive epoxy resins |
| US3884703A (en) * | 1972-04-17 | 1975-05-20 | Hitachi Ltd | Bisazide sensitized photoresistor composition with diacetone acrylamide |
| US3989610A (en) * | 1973-02-14 | 1976-11-02 | Hitachi Chemical Company, Ltd. | Photosensitive epoxy-acrylate resin compositions |
| US4065430A (en) * | 1973-02-13 | 1977-12-27 | Fuji Photo Film Co., Ltd. | Functional group containing polymer and method of preparing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5240577B2 (en) * | 1972-08-11 | 1977-10-13 |
-
1974
- 1974-12-28 JP JP50001418A patent/JPS51149021A/en active Granted
-
1975
- 1975-12-15 US US05/640,925 patent/US4097283A/en not_active Expired - Lifetime
- 1975-12-18 GB GB51928/75A patent/GB1516746A/en not_active Expired
- 1975-12-24 DE DE19752558527 patent/DE2558527A1/en not_active Ceased
- 1975-12-24 NL NL7515072A patent/NL7515072A/en not_active Application Discontinuation
- 1975-12-26 FR FR7539828A patent/FR2296206A1/en not_active Withdrawn
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2687958A (en) * | 1949-05-14 | 1954-08-31 | Azoplate Corp | Light-sensitive layers for the printing industry |
| US3418295A (en) * | 1965-04-27 | 1968-12-24 | Du Pont | Polymers and their preparation |
| US3357831A (en) * | 1965-06-21 | 1967-12-12 | Harris Intertype Corp | Photopolymer |
| US3684516A (en) * | 1969-10-17 | 1972-08-15 | Mitsui Mining & Smelting Co | Photo-sensitive resin composition |
| US3721566A (en) * | 1969-12-23 | 1973-03-20 | Agfa Gevaert Nv | Increasing the light sensitivity of polymeric compositions comprising azido groups |
| US3733200A (en) * | 1970-02-19 | 1973-05-15 | Hydron Chemical Co Ltd | Printing plate |
| US3795640A (en) * | 1971-01-07 | 1974-03-05 | Powers Chemco Inc | Furfuryl,allyl and methylol acrylamide esters of polymeric acids |
| US3715210A (en) * | 1971-02-19 | 1973-02-06 | Howson Algraphy Ltd | Lithographic printing plates |
| US3822235A (en) * | 1971-04-30 | 1974-07-02 | Philips Corp | Method of producing light-sensitive epoxy resins |
| US3884703A (en) * | 1972-04-17 | 1975-05-20 | Hitachi Ltd | Bisazide sensitized photoresistor composition with diacetone acrylamide |
| US3776736A (en) * | 1972-08-07 | 1973-12-04 | Rca Corp | Stabilized photoresist composition |
| US4065430A (en) * | 1973-02-13 | 1977-12-27 | Fuji Photo Film Co., Ltd. | Functional group containing polymer and method of preparing the same |
| US3989610A (en) * | 1973-02-14 | 1976-11-02 | Hitachi Chemical Company, Ltd. | Photosensitive epoxy-acrylate resin compositions |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4279986A (en) * | 1977-06-01 | 1981-07-21 | Nippon Electric Co., Ltd. | Negative resist and radical scavenger composition with capability of preventing post-irradiation polymerization |
| US4505794A (en) * | 1979-05-18 | 1985-03-19 | Ciba-Geigy Corporation | Thioxanthonecarboxylic acid esters, thioesters and amides |
| EP0049504A1 (en) * | 1980-10-06 | 1982-04-14 | E.I. Du Pont De Nemours And Company | Improved aqueous developable photopolymerizable elements |
| US4657842A (en) * | 1982-11-25 | 1987-04-14 | Ciba-Geigy Corporation | Photosensitive compositions of matter comprising epoxide compounds and functional anthraquinones |
| US4849533A (en) * | 1982-11-25 | 1989-07-18 | Ciba-Geigy Corporation | Photosensitive compositions of matter which are capable of undergoing condensation or additional reactions and may or may not be crosslinkable, reaction products which can be prepared therefrom and their use |
| US4783391A (en) * | 1983-08-17 | 1988-11-08 | Toray Industries, Inc. | Radiation-sensitive polyamide polymer composition with anthraquinone monoazide |
| US4842984A (en) * | 1986-04-30 | 1989-06-27 | Nitto Boseki Co., Ltd. | Water soluble photosensitive resin compositions with bisazide compound |
| US5561194A (en) * | 1995-03-29 | 1996-10-01 | International Business Machines Corporation | Photoresist composition including polyalkylmethacrylate co-polymer of polyhydroxystyrene |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2296206A1 (en) | 1976-07-23 |
| NL7515072A (en) | 1976-06-30 |
| DE2558527A1 (en) | 1976-07-15 |
| JPS51149021A (en) | 1976-12-21 |
| GB1516746A (en) | 1978-07-05 |
| JPS5412331B2 (en) | 1979-05-22 |
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