US3048914A - Process for making resistors - Google Patents
Process for making resistors Download PDFInfo
- Publication number
- US3048914A US3048914A US841317A US84131759A US3048914A US 3048914 A US3048914 A US 3048914A US 841317 A US841317 A US 841317A US 84131759 A US84131759 A US 84131759A US 3048914 A US3048914 A US 3048914A
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- caps
- casing
- silicone
- film
- resistor element
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- Expired - Lifetime
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- 238000000034 method Methods 0.000 title claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 34
- 239000000203 mixture Substances 0.000 claims description 18
- 239000003566 sealing material Substances 0.000 claims description 16
- 239000002966 varnish Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- -1 POLYSILOXANE Polymers 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920002050 silicone resin Polymers 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 7
- CCDWGDHTPAJHOA-UHFFFAOYSA-N benzylsilicon Chemical compound [Si]CC1=CC=CC=C1 CCDWGDHTPAJHOA-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 101100056293 Rattus norvegicus Akr7a2 gene Proteins 0.000 claims 1
- 239000010408 film Substances 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 239000000843 powder Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- 239000011253 protective coating Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical class C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49885—Assembling or joining with coating before or during assembling
Definitions
- the invention relates in general to resistors and more particularly to protective tubular casings for resistors and the process for making same.
- An object of my invention is to provide a resistor with a protective tubular casing.
- Another object of my invention is to provide a resistor With a protective coating and a protective tubular casing.
- Another object of my invention is to provide a means of sealing the open ends of the tubular casing containing a resistor element.
- FIGURE 1 shows a longitudinal view of a resistance unit embodying the features of my invention, partly in section;
- FIGURES 2 and 3 show the steps by which my invention is constructed; the coatings and end-caps are exaggerated in thickness;
- FIGURE 4 shows a section of a hollow tubular casing
- FIGURE 5 shows a convenient way of sealing the open ends of the tubular casing containing aresistor element.
- my invention comprises a non-conducting rod 26 preferably porcelain or steatite, a thin current-conducting film 21 deposited on the surface of the rod 20, end-caps 22 having terminal wires 23 electrically connected to the thin current-conducting film 21, a protective coating 25 mounted on the currentconducting surface, and a tubular casing 26 mounted around the protective coating 25.
- the rod 20 may be made of suitable material of a ceramic nature such as porcelain or steatite, upon which the film 21 may adhere.
- the film 21 is very thin and is exaggerated in thickness in the drawings.
- the thin current-conducting film 2-1 is preferably carbon, or metal, or it may be a mixture of carbon and metal, and may also include sulphur.
- the next general series of steps in my process is to connect the end-caps 22 to the end portions of the thin film 21 by depositing an electrical substance between the current-conducting film and the end-caps 22 and pressing the end-caps 22 over the electrical substance.
- the resistor element may or may not be spiraled at 24 depending upon the resistance value desired.
- the next general series of steps consist of providing a coating and a tubular casing for the resistor element, indicated respectively by the reference characters 25 and 26.
- the coating 25 is deposited on the resistor element and the casing 26 is mounted around the coating 25.
- the coating 25 comprises a silicone material preferably a silicone resin, and is referred to in the trade as a heat resistant, water-repellent silicone electrical varnish. More specifically, the varnish is a phenyl-methylsilicone resin. In the silicone molecular structure, the silicon alternates with an oxygen atom so that the silicon atoms are not bonded to each other. In a phenylmethyl-silicone resin, one methyl group and one phenyl group are bonded to each silicon atom. I find that a silicone resin made by Dow Corning Corporation, Midland, Michigan, and sold under a designation number 994 varnish is satisfactory for my invention. The
- coating 25 is preferably deposited on the current-conducting film 21 by spraying the phenyl-methyl-silicone thereon, and then baking the resistor element with the phenyl-methyl-silicone deposited thereon for a duration of approximately one-half hour at about 400 F. to provide a semi-cured coating.
- the casing 26 is in the form of a tube and may be made of a ceramic, steatite, porcelain, or a glass material.
- the tube 26 is slightly longer and slightly larger in diameter than the resistor element.
- the tube 26 may be slid easily over the resistor element and when completely slid over the resistor, it covers the resistor element as shown in FIGURE 1.
- the open end portions of the tube are extended farther than the end-caps 22, whereby a sealing material 28 may be deposited in the space provided between the end-caps 22 and the extended tube portions to completely enclose the resistor element.
- the sealing material 28 is made of a mixture of the following ingredients; a powder glass, a silicone resin and a silicone varnish.
- the powdered glass that I use in my invention is made by grinding broken scrap glass. The glass is ground so fine that a person can run his hand through it and will not receive any scratches.
- the silicone resin that I mix with the powdered glass is preferably a polysiloxane silicone resin and contains dimethylsiloxane, methylsiloxane, phenylsiloxane, and diphenylsiloxane, and is prepared by the co-hydrolysis and co-condensation of a mixture containing dimethyldichlorosilane, methyltrichlorosilane, phenyltrichlorosilane, and diphenyldichloroxosilane.
- a polysiloxane resin suitable for my invention may be obtained from Union Carbide Corporation, New York, N.Y., Silicone Division and sold under a designation number R-620.
- the silicone varnish that I use in mixing with powdered glass and silicone resin is a low temperature curing silicone varnish. It is a companion product to the polysiloxane resin designation number R620. It contains 60% silicone resin by weight in a solvent xylene. I find that a silicone varnish suitable for my invention may be obtained from Union Carbide Corporation, New York, N.Y., Silicone Division and sold under a designation number XR622.
- I generally mix in about 50% by volume of powdered glass with 50% by volume of polysiloxane resin. Then I generally mix in about 20% by volume of silicone varnish into about by volume of the glass-silicone mixture.
- the diagram shows a resistor carrier 30 constituting a convenient way of applying the sealing material 28 into an open end portion of the resistor element.
- the resistor carrier 30 may be made of any suitable material or any shape or size.
- the main purpose is to hold a resistance element with a ceramic tube 26 thereon and having the upper end of the tube extending farther than the end-caps 22.
- the resistor element may be held in place by extending the bottom lead terminals 23 into a hole 30.
- the reference character 3-1 shows a shoulder whereby the lower endcap of a resistance element may rest thereupon. Another use for the shoulder 31 is to provide a means of centering the resistor element inside of the tube, whereby both ends of the tube extend an equal distance from the end-caps 22.
- the sealing material 28 may be applied into the upper open end portion by means of any suitable tool, preferably a spatula. After I seal the upper end portions, I allow the resistor to set on the resistor carrier 30 anywhere from 2 to 24 hours. Then I bake the resistor element containing the sealed end portion for about one hour at approximately 400 F., with the resistor element still mounted on the carrier 30.
- I seal the lower end portion of the tube containing a resistor element in the same manner as I sealed the top end portion.
- the lower end portion of the resistor element that was holding it in place during the first operation, is the upper end during the second operation, and is sealed accordingly.
- a plurality of resistors carriers 30 are used in order to provide for an efficient and economical resistor sealing process.
- the polysiloxane resin R-620 and the silicone varnish 994 may be interchangeably used, as they both have similar chemical and physical properties.
- said end-caps having a larger external diameter than that of the film between said end caps, said process comprising the steps of providing a phenyl-methyl-silicone resin, spraying said silicone resin on said film between said end-caps to provide a coating thereon, then baking said resistor element with said coating thereon at approximately 400 F.
- a tubular casing having an internal diameter slightly larger than the external diameter of said end-caps and sliding said casing over said end-caps with the open end portions of said casing extending beyond said end-caps and with said end-caps fitting closely within the internal surface of said casing and concentrically supporting said internal surface of said casing around said film at a circumferential clearance space therefrom, sealing the open end portions of said casing to enclose said resistor element therein, the steps of sealing including the following method, providing a powder glass material, a polysiloxane resin, and a silicone varnish, mixing about fifty percent by volume of powder glass with about same amount of polysiloxane resin to obtain a glass-silicone mixture, mixing in 20 percent by volume of said silicone varnish with about percent by volume of said glass-silicone mixture to obtain a sealing material, applying said sealing material in said open end portions of said casing against said closely fitting end-caps so as to block said sealing material from contacting said film to en
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Adjustable Resistors (AREA)
Description
96 w. M. KQHRING 3,048,914
PROCESS FOR MAKING RESISTOR-S Filed Sept. 21, 1959 23 FIG. I
gm m; as m 22 E 4 \j 2 a F G 5 INVENTOR.
WILBUR M. KOHRING ATTORNEYS United States Patent Ofiice 3,048,914 Patented Aug. 14, 1962 3,048,914 PROCESS FUR MAKING RESISTORS Wilbur M. Kohring, 3318 W. 159th St., Cleveland 11, Ohio Filed Sept. 21, 1959, Ser. No. 841,317 1 Claim. (Cl. 29155.63)
The invention relates in general to resistors and more particularly to protective tubular casings for resistors and the process for making same.
An object of my invention is to provide a resistor with a protective tubular casing.
Another object of my invention is to provide a resistor With a protective coating and a protective tubular casing.
Another object of my invention is to provide a means of sealing the open ends of the tubular casing containing a resistor element.
Other objects and a fuller understanding of the invention may be had by referring to the following description and claim, taken in conjunction with the accompanying drawings, in which:
' FIGURE 1 shows a longitudinal view of a resistance unit embodying the features of my invention, partly in section;
FIGURES 2 and 3 show the steps by which my invention is constructed; the coatings and end-caps are exaggerated in thickness;
FIGURE 4 shows a section of a hollow tubular casing; and
FIGURE 5 shows a convenient way of sealing the open ends of the tubular casing containing aresistor element.
With reference to FIGURE 1, my invention comprises a non-conducting rod 26 preferably porcelain or steatite, a thin current-conducting film 21 deposited on the surface of the rod 20, end-caps 22 having terminal wires 23 electrically connected to the thin current-conducting film 21, a protective coating 25 mounted on the currentconducting surface, and a tubular casing 26 mounted around the protective coating 25.
The rod 20 may be made of suitable material of a ceramic nature such as porcelain or steatite, upon which the film 21 may adhere. The film 21 is very thin and is exaggerated in thickness in the drawings. The thin current-conducting film 2-1 is preferably carbon, or metal, or it may be a mixture of carbon and metal, and may also include sulphur.
The next general series of steps in my process is to connect the end-caps 22 to the end portions of the thin film 21 by depositing an electrical substance between the current-conducting film and the end-caps 22 and pressing the end-caps 22 over the electrical substance. The resistor element may or may not be spiraled at 24 depending upon the resistance value desired.
The next general series of steps consist of providing a coating and a tubular casing for the resistor element, indicated respectively by the reference characters 25 and 26. The coating 25 is deposited on the resistor element and the casing 26 is mounted around the coating 25.
The coating 25 comprises a silicone material preferably a silicone resin, and is referred to in the trade as a heat resistant, water-repellent silicone electrical varnish. More specifically, the varnish is a phenyl-methylsilicone resin. In the silicone molecular structure, the silicon alternates with an oxygen atom so that the silicon atoms are not bonded to each other. In a phenylmethyl-silicone resin, one methyl group and one phenyl group are bonded to each silicon atom. I find that a silicone resin made by Dow Corning Corporation, Midland, Michigan, and sold under a designation number 994 varnish is satisfactory for my invention. The
The casing 26 is in the form of a tube and may be made of a ceramic, steatite, porcelain, or a glass material.
The tube 26 is slightly longer and slightly larger in diameter than the resistor element. The tube 26 may be slid easily over the resistor element and when completely slid over the resistor, it covers the resistor element as shown in FIGURE 1. The open end portions of the tube are extended farther than the end-caps 22, whereby a sealing material 28 may be deposited in the space provided between the end-caps 22 and the extended tube portions to completely enclose the resistor element.
The sealing material 28 is made of a mixture of the following ingredients; a powder glass, a silicone resin and a silicone varnish. The powdered glass that I use in my invention is made by grinding broken scrap glass. The glass is ground so fine that a person can run his hand through it and will not receive any scratches.
The silicone resin that I mix with the powdered glass is preferably a polysiloxane silicone resin and contains dimethylsiloxane, methylsiloxane, phenylsiloxane, and diphenylsiloxane, and is prepared by the co-hydrolysis and co-condensation of a mixture containing dimethyldichlorosilane, methyltrichlorosilane, phenyltrichlorosilane, and diphenyldichloroxosilane. I find that a polysiloxane resin suitable for my invention may be obtained from Union Carbide Corporation, New York, N.Y., Silicone Division and sold under a designation number R-620.
' The silicone varnish that I use in mixing with powdered glass and silicone resin, is a low temperature curing silicone varnish. It is a companion product to the polysiloxane resin designation number R620. It contains 60% silicone resin by weight in a solvent xylene. I find that a silicone varnish suitable for my invention may be obtained from Union Carbide Corporation, New York, N.Y., Silicone Division and sold under a designation number XR622.
In making the sealing material, I mix the powder glass with the silicone resin R-620. In mixing the two together, I do not necessarily use a definite ratio to determine how much I should use of each, but instead I just mix enough polysiloxane resin to moisten each particle of powder glass to obtain a glass-silicone mixture. In order to make the glass-silicone mixture more appliable or workable, I mix XR622 into the glass-silicone mixture to obtain a workable sealing material. Here again I do not use any definite amount of silicone varnish, but I add just enough to make the glass-silicone mixture appliable.
Even though a definite amount of each is not required I generally mix in about 50% by volume of powdered glass with 50% by volume of polysiloxane resin. Then I generally mix in about 20% by volume of silicone varnish into about by volume of the glass-silicone mixture.
With reference to FIGURE 5, the diagram shows a resistor carrier 30 constituting a convenient way of applying the sealing material 28 into an open end portion of the resistor element. The resistor carrier 30 may be made of any suitable material or any shape or size. The main purpose is to hold a resistance element with a ceramic tube 26 thereon and having the upper end of the tube extending farther than the end-caps 22. The resistor element may be held in place by extending the bottom lead terminals 23 into a hole 30. The reference character 3-1 shows a shoulder whereby the lower endcap of a resistance element may rest thereupon. Another use for the shoulder 31 is to provide a means of centering the resistor element inside of the tube, whereby both ends of the tube extend an equal distance from the end-caps 22.
The sealing material 28 may be applied into the upper open end portion by means of any suitable tool, preferably a spatula. After I seal the upper end portions, I allow the resistor to set on the resistor carrier 30 anywhere from 2 to 24 hours. Then I bake the resistor element containing the sealed end portion for about one hour at approximately 400 F., with the resistor element still mounted on the carrier 30.
Next in the series of steps, I seal the lower end portion of the tube containing a resistor element in the same manner as I sealed the top end portion. The lower end portion of the resistor element that was holding it in place during the first operation, is the upper end during the second operation, and is sealed accordingly.
During the actual operation, a plurality of resistors carriers 30 are used in order to provide for an efficient and economical resistor sealing process. In this invention, the polysiloxane resin R-620 and the silicone varnish 994 may be interchangeably used, as they both have similar chemical and physical properties.
Although this invention has been described in its preferred form with a certain degree of particularity, it is understood that the present disclosure of the preferred form has been made only by way of example and that numerous changes in the details of construction and the combination and arrangement of parts may be resorted to without departing from the spirit and the scope of the invention as hereinafter claimed.
What is claimed is:
The process of providing a protective casing on the surface of a resistor element comprising a non-conductive element having a current conductive film thereon with hollow terminal end-caps surrounding and electrically connected to the film on the ends of said element,
said end-caps having a larger external diameter than that of the film between said end caps, said process comprising the steps of providing a phenyl-methyl-silicone resin, spraying said silicone resin on said film between said end-caps to provide a coating thereon, then baking said resistor element with said coating thereon at approximately 400 F. for about one-half hour to cure said coating, providing a tubular casing having an internal diameter slightly larger than the external diameter of said end-caps and sliding said casing over said end-caps with the open end portions of said casing extending beyond said end-caps and with said end-caps fitting closely within the internal surface of said casing and concentrically supporting said internal surface of said casing around said film at a circumferential clearance space therefrom, sealing the open end portions of said casing to enclose said resistor element therein, the steps of sealing including the following method, providing a powder glass material, a polysiloxane resin, and a silicone varnish, mixing about fifty percent by volume of powder glass with about same amount of polysiloxane resin to obtain a glass-silicone mixture, mixing in 20 percent by volume of said silicone varnish with about percent by volume of said glass-silicone mixture to obtain a sealing material, applying said sealing material in said open end portions of said casing against said closely fitting end-caps so as to block said sealing material from contacting said film to enclose said resistor element therein, air setting said sealing material for about twenty-four hours and then baking said sealing material in said end portions at approximately 400 F., for approximately one hour to seal said resistor element in said casing.
References Cited in the fileof this patent UNITED STATES PATENTS 2,397,568 Seaman Apr. 2, 1946 2,460,795 Warrick Feb. 1, 1949 2,660,653 Berkelhamer Nov. 24, 1953 2,742,551 Kohring Apr. 17, 1956
Claims (1)
1. THE PROCESS OF PROVIDING A PROTECTIVE CASING ON THE SURFACE OF A RESISTOR ELEMENT COMPRISING A NON-CONDUCTIVE ELEMENT HAVING A CURRENT CONDUCTIVE FILM THEREON WITH HOLLOW TERMINAL END-CAPS SURROUNDING AND ELECTRICALLY CONNECTED TO THE FILM ON THE ENDS OF SAID ELEMENT, SAID END-CAPS HAVING A LARGER EXTERNAL DIAMETER THAN THAT OF THE FILM BETWEEN SAID END CAPS, SAID PROCESS COMPRISIING THE STEPS OF PROVIDING A PHENYL-METHYL-SILICONE RESIN SPRAYING SAID SILICONE RESIN ON SAID FILM BETWEEN SAID END-CAPS TO PROVIDE A COATING THEREON, THEN BAKING SAID RESISTOR ELEMENT WITH SAID COATING THEREON AT APPROXIMATELY 400*CFL FOR ABOUT ONE-HALF HOUR TO CURE SAID COATING, PROVIDING A TUBULAR CASING HAVING AN INTERNAL DIAMETER SLIGHTLY LARGER THAN THE EXTERNAL DIAMETER OF SAID END-CAPS AND SLIDING SAID CASING OVER SAID END-CAPS WITH THE OPEN END PORTIONS OF SAID CASING EXTENDING BEYOUND SAID END-CAPS AND WITH SAID END-CAPS FITTING CLOSELY WITHIN THE INTERNAL SURFACE OF SAID CASING AND CONCENTRICALLY SUPPORTING SAID INTERNAL SURFCE OF SAID CASING AROUND SAID FILM AT A CIRCUMFERENTIAL CLEARANCE SPACE THEREFROM, SEALING THE OPEN END PORTIONS OF SAID CASING TO ENCLOSE SAID RESISTOR ELEMENT THEREIN, THE STEPS OF SEALING INCLUDING THE FOLLOWING METHOD , PROVIDING A POWDER GLASS MATERIAL, A POLYSILOXAE RESIN, AND A SILICONE VARNISH, MIXING ABOUT FIFTY PERCENT BY VOLUME OF POWDER GLASS WITH ABOUT SAME AMOUNT OF POLYSILOXANE RESIN TO OBTAIN A GLASS-SILICONE MIXTURE, MIXING IN 20 PERCENT BY VOLUME OF SAID SILICONE VARNISH WITH ABOUT 80 PERCENT BY BY VOLUME OF SAID GLASS-SILICONE MIXTURE TO OBTAIN A SEALING MATERIAL, APPLYING SAID SEALING MATERIAL IN SAID OPEN END PORTIONS OF SAID CASING AGAINST SAID CLOSLEY FITTING WND-CAPS SO AS TO BLOCK SAID SEALING MATERIAL FROM CONTACTING SAID FILM TO ENCLOSE SAID RESISTOR ELEMENT THEREIN AIAR SETTING SAID SEALING MATERIAL FOR ABOUT TWENTY-FOUR HOURS AND THEN BAKING SAID SEALING MATERIAL IN SAID END PORTIONS AT APPROXIMATELY 400*F., FOR APPROXIMATELY ONE HOUR TO SEAL SAID RESISTOR ELEMENT IN SAID CASING
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US841317A US3048914A (en) | 1959-09-21 | 1959-09-21 | Process for making resistors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US841317A US3048914A (en) | 1959-09-21 | 1959-09-21 | Process for making resistors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3048914A true US3048914A (en) | 1962-08-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US841317A Expired - Lifetime US3048914A (en) | 1959-09-21 | 1959-09-21 | Process for making resistors |
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| Country | Link |
|---|---|
| US (1) | US3048914A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3201855A (en) * | 1961-02-21 | 1965-08-24 | Dale Electronics | Electrical resistor and method of making same |
| US3249988A (en) * | 1962-02-27 | 1966-05-10 | Victory Engineering Corp | Method of covering resistor bead |
| US3264712A (en) * | 1962-06-04 | 1966-08-09 | Nippon Electric Co | Semiconductor devices |
| US3279038A (en) * | 1966-10-18 | Method of making glass capsules for electrical components | ||
| US3295090A (en) * | 1962-02-26 | 1966-12-27 | Dale Electronics | Electrical resistor having a core element with high heat dissipating properties |
| US3307134A (en) * | 1959-12-14 | 1967-02-28 | Corning Glass Works | Encapsulated impedance element |
| US3396357A (en) * | 1964-04-10 | 1968-08-06 | Gen Electric | Temperature sensing cable and method for making same |
| US3488767A (en) * | 1965-05-17 | 1970-01-06 | Air Reduction | Film resistor |
| US3919441A (en) * | 1972-12-20 | 1975-11-11 | Seinosuke Horiki | Panel-styled calorific devices and a process for manufacturing the same |
| US4306217A (en) * | 1977-06-03 | 1981-12-15 | Angstrohm Precision, Inc. | Flat electrical components |
| US20040219886A1 (en) * | 2000-03-04 | 2004-11-04 | Renishaw Plc | Probe signalling |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2397568A (en) * | 1944-03-11 | 1946-04-02 | Ellsworth F Seaman | Shockproof electrical resistor |
| US2460795A (en) * | 1944-10-03 | 1949-02-01 | Corning Glass Works | Method for making rubbery polymeric organo-siloxane compositions |
| US2660653A (en) * | 1950-04-05 | 1953-11-24 | David T Siegel | Resistor and method of manufacture |
| US2742551A (en) * | 1951-07-27 | 1956-04-17 | Wilbur M Kohring | Precision resistances |
-
1959
- 1959-09-21 US US841317A patent/US3048914A/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US2397568A (en) * | 1944-03-11 | 1946-04-02 | Ellsworth F Seaman | Shockproof electrical resistor |
| US2460795A (en) * | 1944-10-03 | 1949-02-01 | Corning Glass Works | Method for making rubbery polymeric organo-siloxane compositions |
| US2660653A (en) * | 1950-04-05 | 1953-11-24 | David T Siegel | Resistor and method of manufacture |
| US2742551A (en) * | 1951-07-27 | 1956-04-17 | Wilbur M Kohring | Precision resistances |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3279038A (en) * | 1966-10-18 | Method of making glass capsules for electrical components | ||
| US3307134A (en) * | 1959-12-14 | 1967-02-28 | Corning Glass Works | Encapsulated impedance element |
| US3201855A (en) * | 1961-02-21 | 1965-08-24 | Dale Electronics | Electrical resistor and method of making same |
| US3295090A (en) * | 1962-02-26 | 1966-12-27 | Dale Electronics | Electrical resistor having a core element with high heat dissipating properties |
| US3249988A (en) * | 1962-02-27 | 1966-05-10 | Victory Engineering Corp | Method of covering resistor bead |
| US3264712A (en) * | 1962-06-04 | 1966-08-09 | Nippon Electric Co | Semiconductor devices |
| US3396357A (en) * | 1964-04-10 | 1968-08-06 | Gen Electric | Temperature sensing cable and method for making same |
| US3488767A (en) * | 1965-05-17 | 1970-01-06 | Air Reduction | Film resistor |
| US3919441A (en) * | 1972-12-20 | 1975-11-11 | Seinosuke Horiki | Panel-styled calorific devices and a process for manufacturing the same |
| US4306217A (en) * | 1977-06-03 | 1981-12-15 | Angstrohm Precision, Inc. | Flat electrical components |
| US20040219886A1 (en) * | 2000-03-04 | 2004-11-04 | Renishaw Plc | Probe signalling |
| US7441707B2 (en) * | 2000-03-04 | 2008-10-28 | Renishaw Plc | Probe signalling |
| US20090130987A1 (en) * | 2000-03-04 | 2009-05-21 | Renishaw Plc | Probe signalling |
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