US3042550A - Solid delay line improvements - Google Patents
Solid delay line improvements Download PDFInfo
- Publication number
- US3042550A US3042550A US737389A US73738958A US3042550A US 3042550 A US3042550 A US 3042550A US 737389 A US737389 A US 737389A US 73738958 A US73738958 A US 73738958A US 3042550 A US3042550 A US 3042550A
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- US
- United States
- Prior art keywords
- delay line
- layer
- transducer
- back electrode
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
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- C—CHEMISTRY; METALLURGY
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- H03H9/133—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials for electromechanical delay lines or filters
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Definitions
- the present invention relates to solid delay line improvements and particularly to the production of ferroelectric ceramic transducers that may be readily bonded in known manner for operation in the shear mode to a non-crystalline solid delay line medium and to a back electrode, such for example as a delay line composed of glass or fused silica, and a back electrode composed of a tin-lead alloy.
- a polarized ferroelectric ceramic transducer having a shear mode of vibration is obtained by slicing it from a block of ceramic material previously polarized in a direction parallel to its poling axis. This then presents the remaining problem of soldering the ceramic to the delay line facet with indium and soldering the back electrode to the back of the ceramic with tin-indium solder at temperatures which will not impair its polarity.
- the problem is solved by the low temperature application to both broad surfaces of a ceramic transducer a thin, welladhered, solderable, four-layer coating, comprising a base layer of platinum or of silver, which preferably is baked in at a temperature of approximately 200 C., a second 2 layer of chromium, a layer of an alloy which is approximately 80% Ni and about 20% Cr laid down in a manner that produces a gradient coating in which the Cr content is the highest at the start and lowest at the end of the coating period respectively, and finally depositing a layer of Au thereon.
- FIG. 1 is a perspective representation of a polarized block of ferroelectric ceramic material.
- FIG. 2 is an exploded view, in side elevation, diagrammatically depicting the ceramic transducer and its respective coatings arranged between a back electrode and the coating of a facet of a delay line; the bonding materials for effecting union of the transducer with the back electrode and with the facet coating also being shown.
- the block of material 11 has conductive coatings 12 and 13 on its upper and lower surfaces respectively which have previously been connected to the terminals of a high volt-age direct current source to impart to it a poling axis transversely therethrough, as indicated by the arrows A, so that when a slice such as 15 is removed therefrom for use as a transducer and one of its broad sides mated with a delay line surface, it will be in shear mode relation thereto.
- the first or base layer of about 300 angstroms of platinum or silver is deposited on both sides of the slice 15 of the ceramic by vacuum evaporation at room temperature.
- This coating is preferably baked in an open atmosphere at a temperature of approximately 200 C. for from one to eighteen hours to provide good. adherence.
- the second layer of about 500 angstroms of chromium is then deposited by vacuum evaporation at room temperature.
- This metal which is insoluble in solder, is to serve as a barrier between the solder and the platinum, which is soluble.
- the third layer of about 500 angstroms of a nickelchrome alloy containing approximately Ni and 20% Cr is also applied at room temperature by the evaporation process in the vacuum maintained during application of the second layer.
- the fourth or final layer of about 500 angstroms of gold is applied in the vacuum maintained during application of the third layer to preserve the nickel-chromes metallic surface.
- the final layers of gold are almost instantly dissolvable by the solders employed.
- the solder penetrates the multi-layer coatings until it is stopped either at the high Cr part of the nickel-chrome layer or at the nickel-chrome Cr interface.
- the delay line bears a layer of platinum on its transducer mating facet 20. Fusion of its surface to the gold surface of 15 is effected by directing heat into the mating surfaces until they reach a temperature of 200 C. or thereabout and puddling pure indium thereon. Such surfaces are then swabbed with a vibrating fibre glass brush, tinned with pure indium from an auxiliary molten puddle thereof and the indium slowly spread over the respective mating surfaces substantially as described in the French patent. The respective surfaces are then permitted to cool down to a stabilized temperature of between 165 175 C. and after a final skin removal from such surfaces they are brought together into aligned contact and subjected to gradually increased pressure until cooled to approximately C.
- the mating surface of the transducer and the back electrode are swabbed with a fibre glass brush tinned with 65% In35% Sn solder, mated, and then 3 allowed to cool.
- the back electrode preferably is a preformed block of 60% tin-% lead, as in the referred-to patent and application.
- the method of preparing surfaces of a transducer for solder-able union with a solid delay line and its back electrode which comprises application to each of its two broad surfaces a base coat of a noble metal by vacuum deposition, depositing a layer of chromium on said base coat, overlaying the chromium with a gradient coating containing approximately Ni and 20% Cr with the content of Cr being highest at the chromium interface and lowest at the exposed surface, and finally overlaying the...
- the method of coating a transducer with a material solderable at a temperature of approximately 200 C. which comprises applying by vapor deposition in a vacuum successively and at temperatures under 200 C., films of the followin gmctallic materials: a ndble metal, chroa nickel-chromium alloy containing approximately 80% Ni and 20% Cr laid down in graded composition in which the Cr content is highest at the start and lowest at the completion of evaporation and gold.
- a method such as defined by the preceding claim which includes baking the noble metal coating at a temperature of approximately 200 C. for a substantial time period.
- a ferroelectric ceramic transducer having on a surface thereof parallel to its poling axis a coating through the medium of which it is solder-able to an indiumized mating facet of a delay line and a back electrode at a temperature below that at which the polarization of such transducer would be adversely affected said coating comprising layers of a noble metal, chromium, nickelch'rome and gold arranged thereon in the order named.
- a ferroelectric ceramic transducer such as defined by claim 4 wherein the noble metal comprises silver.
- a ferroelectric ceramic transducer such as defined by claim 4 wherein the noble metal comprises platinum.
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Description
United States Patent 3,042,550 SOLID DELAY LINE IMPROVEMENTS Richard E. Allen and George M. Deegan, Corning, N.Y., assignors to Corning Glass Works, Corning, N.Y., a corporation of New York Filed May 23, 1953, Ser. No. 737,389 6 Claims. (Cl. 117--217) The present invention relates to solid delay line improvements and particularly to the production of ferroelectric ceramic transducers that may be readily bonded in known manner for operation in the shear mode to a non-crystalline solid delay line medium and to a back electrode, such for example as a delay line composed of glass or fused silica, and a back electrode composed of a tin-lead alloy.
The industry has for some time employed ferroelectric ceramic transducers mounted for longitudinal mode of vibration on delay lines designed for short delay time periods. On longer lines such transducers have been similarly mounted, and in the absence of knowledge as to how to directly mount the ceramic transducers for shear mode vibration, have resorted to the use of mode conversion prisms. In general, for longer lines with many reflection paths only the thickness shear mode of vibration of quartz has been found satisfactory. Some of the advantages gained by use of ferroelectric ceramic transducers operating in the thickness shear mode, however, are low attenuation of the main signal, high attenuation of the unwanted third time spurious signal, and utilization of low cost optical glass for short delay lines instead of the'high cost silica required when quartz transducers are employed. Moreover, ceramic transducer assemblies are thermally stable and more readily reproducible than are quartz transducers. They also have the further advantage of low insertion loss compared to quartz.
The fact that ceramic transducers must not be subjected to temperatures exceeding 200 C. for any appreciable time after their polarization, has heretofore prevented their employment in the shear mode for lack of a low temperature method of applying a solderable coating thereto. Although such a temperature is exceeded by application thereto of a solderable film by conventional methods, this has been no handicap in the production of transducers polarized for the longitudinal mode. Under these circumstances the surface to be united with the delay line and the oppositely disposed surface for connection to a back electrode are simply coated before polarization of the transducer which is thereafter polarized by connecting the respective films to the terminal of a suitable high potential direct current source for' a short time. The transducer can then be bonded to the delay line by a known method. One such method is taught by the French Patent No. 1,140,481 (US. application Serial No. 475,062, filed December 14, 1954), and now Patent No. 2,964,839 but by restricting temperatures to values insufficient to have a deleterious efiect on the polarization of the transducer.
According to the invention a polarized ferroelectric ceramic transducer having a shear mode of vibration is obtained by slicing it from a block of ceramic material previously polarized in a direction parallel to its poling axis. This then presents the remaining problem of soldering the ceramic to the delay line facet with indium and soldering the back electrode to the back of the ceramic with tin-indium solder at temperatures which will not impair its polarity. According to the invention the problem is solved by the low temperature application to both broad surfaces of a ceramic transducer a thin, welladhered, solderable, four-layer coating, comprising a base layer of platinum or of silver, which preferably is baked in at a temperature of approximately 200 C., a second 2 layer of chromium, a layer of an alloy which is approximately 80% Ni and about 20% Cr laid down in a manner that produces a gradient coating in which the Cr content is the highest at the start and lowest at the end of the coating period respectively, and finally depositing a layer of Au thereon.
For a more detailed description of the invention reference is made to the accompanying drawing wherein:
FIG. 1 is a perspective representation of a polarized block of ferroelectric ceramic material.
FIG. 2 is an exploded view, in side elevation, diagrammatically depicting the ceramic transducer and its respective coatings arranged between a back electrode and the coating of a facet of a delay line; the bonding materials for effecting union of the transducer with the back electrode and with the facet coating also being shown.
Referring to the drawing in detail, the block of material 11 has conductive coatings 12 and 13 on its upper and lower surfaces respectively which have previously been connected to the terminals of a high volt-age direct current source to impart to it a poling axis transversely therethrough, as indicated by the arrows A, so that when a slice such as 15 is removed therefrom for use as a transducer and one of its broad sides mated with a delay line surface, it will be in shear mode relation thereto.
Specifically, the first or base layer of about 300 angstroms of platinum or silver is deposited on both sides of the slice 15 of the ceramic by vacuum evaporation at room temperature. This coating is preferably baked in an open atmosphere at a temperature of approximately 200 C. for from one to eighteen hours to provide good. adherence.
The second layer of about 500 angstroms of chromium is then deposited by vacuum evaporation at room temperature. The purpose of this metal, which is insoluble in solder, is to serve as a barrier between the solder and the platinum, which is soluble.
The third layer of about 500 angstroms of a nickelchrome alloy containing approximately Ni and 20% Cr is also applied at room temperature by the evaporation process in the vacuum maintained during application of the second layer.
The fourth or final layer of about 500 angstroms of gold is applied in the vacuum maintained during application of the third layer to preserve the nickel-chromes metallic surface.
In effecting unions with the delay line medium and with the back electrode respectively, the final layers of gold are almost instantly dissolvable by the solders employed. During such a soldering operation the solder penetrates the multi-layer coatings until it is stopped either at the high Cr part of the nickel-chrome layer or at the nickel-chrome Cr interface.
As indicated in FIG. 2, the delay line bears a layer of platinum on its transducer mating facet 20. Fusion of its surface to the gold surface of 15 is effected by directing heat into the mating surfaces until they reach a temperature of 200 C. or thereabout and puddling pure indium thereon. Such surfaces are then swabbed with a vibrating fibre glass brush, tinned with pure indium from an auxiliary molten puddle thereof and the indium slowly spread over the respective mating surfaces substantially as described in the French patent. The respective surfaces are then permitted to cool down to a stabilized temperature of between 165 175 C. and after a final skin removal from such surfaces they are brought together into aligned contact and subjected to gradually increased pressure until cooled to approximately C.
At this point, the mating surface of the transducer and the back electrode are swabbed with a fibre glass brush tinned with 65% In35% Sn solder, mated, and then 3 allowed to cool. The back electrode preferably is a preformed block of 60% tin-% lead, as in the referred-to patent and application.
Surplus solder is removed from the finished assembly with a sharp knife or razor blade. Any of the evaporated coating material on the external surfaces is readily removed by dental sand blasting equipment.
Although union between applicants ferroelectric transducer with a delay line and a tin-lead back electrode is substantially in accordance with the teaching of the referred-to French patent, as briefly described above, quite obviously similar unions may be'effected by use of any solder having a high indium content. The ferroelectric ceramic material employed by applicants is approximately PbT-iO PbZrO but it is believed applicants techniques are equally applicable to other ferroelectric ceramic compositions.
What is claimed is: v
1. The method of preparing surfaces of a transducer for solder-able union with a solid delay line and its back electrode which comprises application to each of its two broad surfaces a base coat of a noble metal by vacuum deposition, depositing a layer of chromium on said base coat, overlaying the chromium with a gradient coating containing approximately Ni and 20% Cr with the content of Cr being highest at the chromium interface and lowest at the exposed surface, and finally overlaying the...
gradient coating with a layer of gold.
2. The method of coating a transducer with a material solderable at a temperature of approximately 200 C., which comprises applying by vapor deposition in a vacuum successively and at temperatures under 200 C., films of the followin gmctallic materials: a ndble metal, chroa nickel-chromium alloy containing approximately 80% Ni and 20% Cr laid down in graded composition in which the Cr content is highest at the start and lowest at the completion of evaporation and gold.
3. A method such as defined by the preceding claim which includes baking the noble metal coating at a temperature of approximately 200 C. for a substantial time period. I
4. In a ferroelectric ceramic transducer ,having on a surface thereof parallel to its poling axis a coating through the medium of which it is solder-able to an indiumized mating facet of a delay line and a back electrode at a temperature below that at which the polarization of such transducer would be adversely affected said coating comprising layers of a noble metal, chromium, nickelch'rome and gold arranged thereon in the order named.
5. A ferroelectric ceramic transducer such as defined by claim 4 wherein the noble metal comprises silver.
6. A ferroelectric ceramic transducer such as defined by claim 4 wherein the noble metal comprises platinum.
References Cited in the file of this patent UNITED STATES PATENTS 2,672,590 McSkimin Mar. 16, 1954 2,702,427 Roberts Feb. 22, 1955 2,731,573 Hansen et al Ian. 17, 1956 2,767,336 Arenberg Oct. 16, 1956 2,777,997 Arenberg et a1 Ian. 15, 1957 2,787,520 Meincrs et al Apr. 2, 1957 2,859,415 Fagen Nov. 4, 1958 OTHER REFERENCES Belser: Review of Scientific Instruments," vol. 25, No. 2, February 1954, pages 180-183.
Claims (1)
1. THE METHOD OF PREPARING SURFACES OF A TRANSDUCER FOR SOLDERABLE UNION WITH A SOLID DELAY LINE AND ITS BACK ELECTRODE WHICH COMPRISES APPLICATION TO EACH OF ITS TWO BROAD SURFACES A BASE COAT OF A NOBLE METAL BY VACUUM DEPOSITION, DEPOSITING A LAYER OF CHREMIUM ON SAID BASE COAT, OVERLAYING THE CHROMIUM WITH A GRADIENT COATING CONTAINING APPROXIMATELY 80% NI AND 20% CR WITH THE CONTENT OF CR HIGHEST AT THE CHROMIUM INTERFACE AND LOWEST OF THE EXPOSED SURFACE, AND FINALLY OVERLAYING THE GRADIENT COATING WITH A LAYER OF GOLD.
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US737389A US3042550A (en) | 1958-05-23 | 1958-05-23 | Solid delay line improvements |
| GB17199/59A GB890813A (en) | 1958-05-23 | 1959-05-20 | Ultrasonic delay line improvements |
| FR795267A FR1224785A (en) | 1958-05-23 | 1959-05-22 | Improvements to solid delay lines |
| DE19591416028 DE1416028B2 (en) | 1958-05-23 | 1959-05-22 | Process for the production of a transducer acting as a thickness shear transducer |
| BE578941A BE578941A (en) | 1958-05-23 | 1959-05-22 | Improvements to solid delay lines. |
| NL239431A NL124189C (en) | 1958-05-23 | 1959-05-22 | |
| US85944A US3111741A (en) | 1958-05-23 | 1960-10-27 | Solid delay line improvements |
| US83605A US3206698A (en) | 1958-05-23 | 1961-01-11 | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US737389A US3042550A (en) | 1958-05-23 | 1958-05-23 | Solid delay line improvements |
| US85944A US3111741A (en) | 1958-05-23 | 1960-10-27 | Solid delay line improvements |
| US83605A US3206698A (en) | 1958-05-23 | 1961-01-11 | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US3042550A true US3042550A (en) | 1962-07-03 |
Family
ID=33314085
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US737389A Expired - Lifetime US3042550A (en) | 1958-05-23 | 1958-05-23 | Solid delay line improvements |
| US85944A Expired - Lifetime US3111741A (en) | 1958-05-23 | 1960-10-27 | Solid delay line improvements |
| US83605A Expired - Lifetime US3206698A (en) | 1958-05-23 | 1961-01-11 | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US85944A Expired - Lifetime US3111741A (en) | 1958-05-23 | 1960-10-27 | Solid delay line improvements |
| US83605A Expired - Lifetime US3206698A (en) | 1958-05-23 | 1961-01-11 | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US3042550A (en) |
| BE (1) | BE578941A (en) |
| DE (1) | DE1416028B2 (en) |
| FR (1) | FR1224785A (en) |
| GB (1) | GB890813A (en) |
| NL (1) | NL124189C (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3131459A (en) * | 1959-11-09 | 1964-05-05 | Corning Glass Works | Method of bonding absorbing material to a delay line |
| US3173201A (en) * | 1961-08-23 | 1965-03-16 | James F Motson | Method of sealing a glass element within a metal member |
| US3178271A (en) * | 1960-02-26 | 1965-04-13 | Philco Corp | High temperature ohmic joint for silicon semiconductor devices and method of forming same |
| US3206698A (en) * | 1958-05-23 | 1965-09-14 | Corning Glass Works | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
| US3247473A (en) * | 1959-11-09 | 1966-04-19 | Corning Glass Works | Cold diffusion bond between acoustic delay line and back electrode or acoustic absorber |
| US3252722A (en) * | 1959-11-09 | 1966-05-24 | Corning Glass Works | Delay line bond |
| US3276097A (en) * | 1963-12-19 | 1966-10-04 | Bell Telephone Labor Inc | Semiconductor device and method of making |
| US3590467A (en) * | 1968-11-15 | 1971-07-06 | Corning Glass Works | Method for bonding a crystal to a solid delay medium |
| US3599123A (en) * | 1969-09-24 | 1971-08-10 | Bell Telephone Labor Inc | High temperature ultrasonic device |
| US3857161A (en) * | 1973-02-09 | 1974-12-31 | T Hutchins | Method of making a ductile hermetic indium seal |
| US3999263A (en) * | 1974-11-14 | 1976-12-28 | Litton Systems, Inc. | Method of forming a micro-array multibeam grid assembly for a cathode ray tube |
| US4726507A (en) * | 1984-08-29 | 1988-02-23 | The United States Of America As Represented By The Secretary Of The Air Force | Cryogenic glass-to-metal seal |
| DE3638342A1 (en) * | 1986-11-10 | 1988-05-19 | Siemens Ag | Electrical component, made of ceramic and having multilayer metallisation, and a method for its production |
| US4837928A (en) * | 1986-10-17 | 1989-06-13 | Cominco Ltd. | Method of producing a jumper chip for semiconductor devices |
| US6188162B1 (en) * | 1999-08-27 | 2001-02-13 | Product Systems Incorporated | High power megasonic transducer |
| US6222305B1 (en) | 1999-08-27 | 2001-04-24 | Product Systems Incorporated | Chemically inert megasonic transducer system |
| US20020190608A1 (en) * | 2001-04-23 | 2002-12-19 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3187412A (en) * | 1963-04-26 | 1965-06-08 | Gen Electric | Method of mounting and aligning transducers on delay lines |
| US3391447A (en) * | 1964-06-10 | 1968-07-09 | Agriculture Usa | Soldering nonmetals to metals |
| US3367755A (en) * | 1965-02-26 | 1968-02-06 | Gen Dynamics Corp | Laminar conductive material having coats of gold and indium |
| US3846649A (en) * | 1973-06-18 | 1974-11-05 | Rca Corp | Piezoelectric transducer comprising oriented zinc oxide film and method of manufacture |
| US3867108A (en) * | 1973-10-10 | 1975-02-18 | Rca Corp | Acousto-optic devices and process for making same |
| US4033503A (en) * | 1976-08-27 | 1977-07-05 | Nasa | Method for attaching a fused-quartz mirror to a conductive metal substrate |
| US4077558A (en) * | 1976-12-06 | 1978-03-07 | International Business Machines Corporation | Diffusion bonding of crystals |
| WO1983003266A1 (en) * | 1982-03-15 | 1983-09-29 | Gsp Metals Chemicals Corp | Chelating metals |
| US4582240A (en) * | 1984-02-08 | 1986-04-15 | Gould Inc. | Method for low temperature, low pressure metallic diffusion bonding of piezoelectric components |
| US5076486A (en) * | 1989-02-28 | 1991-12-31 | Rockwell International Corporation | Barrier disk |
| US5476726A (en) * | 1992-01-22 | 1995-12-19 | Hitachi, Ltd. | Circuit board with metal layer for solder bonding and electronic circuit device employing the same |
| WO1998024296A2 (en) * | 1996-11-20 | 1998-06-11 | The Regents Of The University Of California | Multilaminate piezoelectric high voltage stack |
| CN111844215B (en) * | 2019-04-25 | 2021-10-08 | 旭泰精密机械股份有限公司 | Ultrasonic knife handle |
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| US2672590A (en) * | 1950-03-22 | 1954-03-16 | Bell Telephone Labor Inc | Delay line |
| US2702427A (en) * | 1948-03-13 | 1955-02-22 | Roberts Shepard | Method of making electromechanically sensitive material |
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| US3042550A (en) * | 1958-05-23 | 1962-07-03 | Corning Glass Works | Solid delay line improvements |
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- 1959-05-22 FR FR795267A patent/FR1224785A/en not_active Expired
- 1959-05-22 BE BE578941A patent/BE578941A/en unknown
- 1959-05-22 NL NL239431A patent/NL124189C/xx active
- 1959-05-22 DE DE19591416028 patent/DE1416028B2/en active Pending
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| US2702427A (en) * | 1948-03-13 | 1955-02-22 | Roberts Shepard | Method of making electromechanically sensitive material |
| US2672590A (en) * | 1950-03-22 | 1954-03-16 | Bell Telephone Labor Inc | Delay line |
| US2767336A (en) * | 1951-05-22 | 1956-10-16 | David L Arenberg | Cement for bonding elements of a delay line with low transmission losses using mixtures of inorganic salts |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3206698A (en) * | 1958-05-23 | 1965-09-14 | Corning Glass Works | Electro-mechanical delay line having ferroelectric transducer bonded to solid delay medium |
| US3131459A (en) * | 1959-11-09 | 1964-05-05 | Corning Glass Works | Method of bonding absorbing material to a delay line |
| US3247473A (en) * | 1959-11-09 | 1966-04-19 | Corning Glass Works | Cold diffusion bond between acoustic delay line and back electrode or acoustic absorber |
| US3252722A (en) * | 1959-11-09 | 1966-05-24 | Corning Glass Works | Delay line bond |
| US3178271A (en) * | 1960-02-26 | 1965-04-13 | Philco Corp | High temperature ohmic joint for silicon semiconductor devices and method of forming same |
| US3173201A (en) * | 1961-08-23 | 1965-03-16 | James F Motson | Method of sealing a glass element within a metal member |
| US3276097A (en) * | 1963-12-19 | 1966-10-04 | Bell Telephone Labor Inc | Semiconductor device and method of making |
| US3590467A (en) * | 1968-11-15 | 1971-07-06 | Corning Glass Works | Method for bonding a crystal to a solid delay medium |
| US3599123A (en) * | 1969-09-24 | 1971-08-10 | Bell Telephone Labor Inc | High temperature ultrasonic device |
| US3857161A (en) * | 1973-02-09 | 1974-12-31 | T Hutchins | Method of making a ductile hermetic indium seal |
| US3999263A (en) * | 1974-11-14 | 1976-12-28 | Litton Systems, Inc. | Method of forming a micro-array multibeam grid assembly for a cathode ray tube |
| US4726507A (en) * | 1984-08-29 | 1988-02-23 | The United States Of America As Represented By The Secretary Of The Air Force | Cryogenic glass-to-metal seal |
| US4837928A (en) * | 1986-10-17 | 1989-06-13 | Cominco Ltd. | Method of producing a jumper chip for semiconductor devices |
| DE3638342A1 (en) * | 1986-11-10 | 1988-05-19 | Siemens Ag | Electrical component, made of ceramic and having multilayer metallisation, and a method for its production |
| US6188162B1 (en) * | 1999-08-27 | 2001-02-13 | Product Systems Incorporated | High power megasonic transducer |
| US6222305B1 (en) | 1999-08-27 | 2001-04-24 | Product Systems Incorporated | Chemically inert megasonic transducer system |
| US6722379B2 (en) | 1999-08-27 | 2004-04-20 | Product Systems Incorporated | One-piece cleaning tank with indium bonded megasonic transducer |
| US20020190608A1 (en) * | 2001-04-23 | 2002-12-19 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
| US6904921B2 (en) | 2001-04-23 | 2005-06-14 | Product Systems Incorporated | Indium or tin bonded megasonic transducer systems |
Also Published As
| Publication number | Publication date |
|---|---|
| BE578941A (en) | 1959-11-23 |
| US3111741A (en) | 1963-11-26 |
| US3206698A (en) | 1965-09-14 |
| GB890813A (en) | 1962-03-07 |
| DE1416028A1 (en) | 1970-01-22 |
| FR1224785A (en) | 1960-06-27 |
| DE1416028B2 (en) | 1970-08-13 |
| NL124189C (en) | 1968-05-15 |
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