US2970064A - Masking material particularly for gas plating processes - Google Patents
Masking material particularly for gas plating processes Download PDFInfo
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- US2970064A US2970064A US658568A US65856857A US2970064A US 2970064 A US2970064 A US 2970064A US 658568 A US658568 A US 658568A US 65856857 A US65856857 A US 65856857A US 2970064 A US2970064 A US 2970064A
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- masking agent
- vehicle
- metal
- film
- deposit
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Links
- 230000000873 masking effect Effects 0.000 title claims description 44
- 238000000034 method Methods 0.000 title claims description 11
- 238000007747 plating Methods 0.000 title description 17
- 239000000463 material Substances 0.000 title description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 39
- 239000002184 metal Substances 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 230000008021 deposition Effects 0.000 claims description 15
- 229920002307 Dextran Polymers 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 49
- 235000011187 glycerol Nutrition 0.000 description 24
- 239000007789 gas Substances 0.000 description 11
- 238000005406 washing Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000001475 halogen functional group Chemical group 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 239000008149 soap solution Substances 0.000 description 2
- WWYNJERNGUHSAO-XUDSTZEESA-N (+)-Norgestrel Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](CC)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 WWYNJERNGUHSAO-XUDSTZEESA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 101100465000 Mus musculus Prag1 gene Proteins 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 235000010443 alginic acid Nutrition 0.000 description 1
- 229920000615 alginic acid Polymers 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000000721 bacterilogical effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 229940105329 carboxymethylcellulose Drugs 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
Definitions
- This invention relates to the metallizing of materials by"n'iear'is"-of'depos'ition of metal from the gaseous state is particularly concerned with the masking off of selected areas of a substrate to inhibit metallic deposition' thereon; further, the invention is specifically conclei'ned w'ith'masking agents which not only inhibit the nietallic deposition but which are readily removed from a substrate after completion'of metallizing and which provide a's'harp' line of demarcation between a metalliaed and a non-metallized area.
- a masking agent wlilehexhibits particular utility in gas plating applicatitiiisf, including the plating of printed circuits, comprises afilmfformer and a vehicle of low volatility.
- deposition inhibitor present d efpos'itior' may be substantially completely prevented or'ifit does'oc'cur, the deposition is of such adiscontinuotis nature or is soslight that penetration of the film bit' a subsequently applied washing liquid is" not preven a;
- Theffilm itself is preferably of such a nature that it may be removed, with anyresidual vehicle therein, from th substrate" without damage to the substrate by' corn in I washing-liquids, such as water, soap solutions; water and” alcohol solutions, and similar materials.
- film formers which are not reactive with the vehicle to produce material'sinsoluble in comtrion w'ashing liquids'are particularly effective; such film formers also are suitably water-soluble or water disp'ei-fsibl'e and are'not rendered insoluble by moderate tem pei'atures up to 400-500 F.
- film formers such as plant; vegetable and bacteriological gums; for example,
- celluloses such as carboxy methyl cellulose
- the vehicle for combination with the film former is suitably a polyhydroxy aliphatic, such as glycerin, ethylene glycol, propylene glycol and high analogues, and also including'theglycol ethers and mixed ethers, for example; butycarbitol is a useful ether.
- a polyhydroxy aliphatic such as glycerin, ethylene glycol, propylene glycol and high analogues, and also including'theglycol ethers and mixed ethers, for example; butycarbitol is a useful ether.
- Figure l is a schematic view illustrating apparatus useful in the practice of the invention.
- Figure 2 is a plan'view of a board of insulating material masked ofi for the formation of a printed circuit utilizingthe apparatus of Figure 1;
- Figure 3 is an enlarged and sectional view of the board' of Figure 2 taken substantially on line 3-3 of Figure 2;
- Figure 4 represents thestructure of Figures 2 and 3 in the course of the metallizing operation indicating sche matically the vaporization of vehicle from the'masking film;
- Figure 5 is a view similar to that of Figure 3 after metallizing and-before removal of the masking agent.
- Figure 6 is a plan view of the product of the operation in full scale and after removal of the masking agent.
- the numeral 1 designates a thin rectangular board of electric'al'insulating material such as a phenolic resin base board. Coated on the board 1 and outlininga configuration 3lfor a printed circuit which is to include terminals as at 5 is a masking agent 7 produced in accordance with the principles of this invention.
- An excellent masking agent comprises as the filmformer, dextran a high molecular weight gum glycerinas the vehicle of 10w volatility, and water as the dispersing agent; While the water content mayvarywith the molecular weight of the gum andmay be varied to aid ready disp er sibility a convenient formula well suited" to the purpose has been found to be approximately equal weights of glycerin and dextran together with water to the'extent of'about'IO'times the dextran weight; Thus a formula employing 10 grams of dextran (M.W. approx. 1,000,000), 10 gramsof glycerin' and cc.
- the board 1 prior to coating should 'be cleaned of oil or grease chemically and suitably the board is also roughened by sand-blasting or with a 320 grit emery.
- the dispersion is spread on the cleaned board 1 in any convenient manner to form the film and to outline the" and'then a secondcoat is applied and dried at the same temperature. Such is a most suitable procedure for the;
- the board with the film formed thereon is then placedin the apparatus of Figure 1, for example, where it is exposed to an atmosphere of a plating gas; such may suitably' be nickel carbonyl and the temperature of the board within the chamber is then brought up to 285 to 290 F. as will be noted hereinafter in connection with the specific description of the apparatus.
- a plating gas such as nickel carbonyl
- the masking agent is completely removable and it leaves a finely delineated circuit configuration (Figure 6).
- the numeral 13 designates a vaporizing chamber
- the numeral 15 indicates a conduit extending into the chamber, terminating in a nozzle 17. and which is adapted for the flow of nickel carbonyl to the chamber from a suitable source of liquid carbonyl indicated at 19.
- the numeral 21 designates a conduit which is connected to a source of helium
- the numeral 23 designates a conduit which is connected to a source of anhydrous ammonium gas.
- Valves 25, 27 are provided in the respective conduits for the control of gas fiow.
- the helium and ammonia mix together in the conduit 29 and flow to the chamber 13, where they mix and serve as a carrier for the nickel carbonyl gas formed by the flash vaporizing of the liquid nickel carbonyl.
- This plating gas then passes through conduit 31 to the plating chamber 33 which, in its lower portion, is provided with a platen 35 adapted to be heated electrically through leads 37, 39.
- the insulating board 1 is placed on and heated from the platen 35.
- Gases are exhausted from the plating chamber 33 through conduits as at 41, 43, 45. These exhaust gases may suitably be flowed to a burner or to a recovery apparatus as desired.
- the plating chamber be of sufficient size, such that no build-up of pressure of the vehicle will occur over the areas which are to be metallized. This is not a critical matter and obviously the volume should be such that no material amount of glycerin, for example, exists in the vapor pressure within the plating chamber, the primary vapor pressure of the vehicle existing only at the masked area as it emanates from the masking film.
- glycerin When dextran is used as the film former, glycerin may be present to the extent of about percent of the weight of the dextran, or glycerin may be present in considerable excess, for example, ten times that of the weight of the dextran.
- the glycerin be present in the masking agent to such an extent that under the conditions in which it is to be employed, some glycerin will remain in the film after the completion of the metallizing operation.
- glycerin While large amounts of glycerin are employable, it is preferable to operate on the side of the minimum of vapor pressure, and hence a small amount of glycerin, in order to avoid the formation of slight halos which tend to prevent sharp delineation of the metal deposits.
- the vehicle should be present in sufficient extent to havesome glycerin remaining in the film at the end of the operation, it should not be present to such an extent that undue halo formation occurs;
- the amount of glycerin exceeds the proportions set out in the ranges given hereinbefore, such halo formation may occur and affects the appearance of the article but does not deleteriously affect the utility.
- a process for the production of well delineated metallic deposits covering only a surface portion of an object which comprises applying to the object a masking agent to delineate on the object the contour of the deposit to be formed, said masking agent comprising a film former consisting of a viscous mass composed of dextran and a glycol vehicle releasable from the film former at temperatures below 500' F., said film former being water dispersible and capable of retaining its water dispersibility when subjected to heat, heating the object in an enclosed vessel to a temperature sufficiently high to decompose a metal-bearing heat decomposable gaseous compound and less than 500 F.
- a process for the production of well delineated metallic deposits covering only a surface portion of an object which comprises applying to the object a masking agent to delineate on the object the contour of the deposit to be formed, said masking agent comprising a film former consisting of a viscous mass composed of dextran and glycerine, heating the object in an enclosed vessel to a temperature sufficiently high to decompose a metalbearing heat-decomposable gaseous compound but to less than 500 F.
- a process for the production of well delineated metallic deposits covering only a surface portion of an object which comprises applying to the object a maskng agent to delineate on the object the contour of the deposit to be formed, said masking agent comprising a film former consisting of a viscous mass composed of dextran, glycerine and water, preparing the masking agent by heating a film thereof on the object to drive off water until the film is just tacky, heating the object in an enclosed.
- a process for the production of well delineated metallic deposits covering only a surface portion of an object which comprises applying to the object a masking agent to delineate on the object the contour of the deposit to be formed, said masking agent comprising a film former consisting of a viscous mass made up of d'extran and glycerine the same being in approximately equal amounts by weight dextran and glycerine, heating the object in an enclosed vessel to a temperature sufliciently high to decompose a metal-bearing heat-decompossble gaseous compound to induce volatilization of the glycerine and to create a vapor pressure of the vehicle over the masking agent, passing a said heat-decomposable gaseous compound to the object to be plated while the object is maintained at said decomposition temperature and while said vehicle is being volatilized to thereby deposit on the 6 delineated portion of the object metal while the deposition of metal on the masking agent is inhibited, While glycerine is retained in the mask
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Description
Jan. 31, 1961 w. M. BOLTON 2,970,064
MASKING MATERIAL PARTICULARLY FOR GAS PLATING PROCESSES Filed May 15, 1957 FIG. I
7 7 r1 II II II w ll I! II IN VEN TOR. W/LBUR M. BOLTON ATTORNEYS United States Patent 9 MASKING MATERIAL PARTICULARLY FOR'GAS PLATING PROCESSES M. Bolton, Piqua, Ohio, assignor, by mesne assignrneiits; to Union Carbide COT'POI'QUOHyNGW York, N.Y., a corporation of New York Filed May 13, 1957, Ser. No. 658,568
4 Claims. (Cll 117-55) 1 This invention relates to the metallizing of materials by"n'iear'is"-of'depos'ition of metal from the gaseous state is particularly concerned with the masking off of selected areas of a substrate to inhibit metallic deposition' thereon; further, the invention is specifically conclei'ned w'ith'masking agents which not only inhibit the nietallic deposition but which are readily removed from a substrate after completion'of metallizing and which provide a's'harp' line of demarcation between a metalliaed and a non-metallized area.
he invention has been found to be of considerable utility inIthe productionof printedcircuits wherein an electrically" conductive film of metal of relatively narrow u'fidth'and frequently serpentine configuration is provided oii'a substrate of insulating materiaL'such as a board of zf'phenolic' resin, for exam le.
li ac-c rdance with thisinvention a masking agent wlilehexhibits particular utility in gas plating applicatitiiisf, including the plating of printed circuits, comprises afilmfformer and a vehicle of low volatility. With such cfonib ination it appears that in the course of gas plating the ve'hicleis slowly released from the filmand'crea'tes over the film avapor pressure of the vehicle which inhibits deposition -of the metal from the gaseous'constituent on the film. With such deposition inhibitor present d efpos'itior' may be substantially completely prevented or'ifit does'oc'cur, the deposition is of such adiscontinuotis nature or is soslight that penetration of the film bit' a subsequently applied washing liquid is" not preven a; I
Theffilm itself is preferably of such a nature that it may be removed, with anyresidual vehicle therein, from th substrate" without damage to the substrate by' corn in I washing-liquids, such as water, soap solutions; water and" alcohol solutions, and similar materials.
I";hayefound that film formers which are not reactive with the vehicle to produce material'sinsoluble in comtrion w'ashing liquids'are particularly effective; such film formers also are suitably water-soluble or water disp'ei-fsibl'e and are'not rendered insoluble by moderate tem pei'atures up to 400-500 F. Particularly etfective for the pr'a'ctice of the invention are film formers such as plant; vegetable and bacteriological gums; for example,
aesaraat; celluloses such as carboxy methyl cellulose,
and alginates are useful. i
The vehicle for combination with the film former is suitably a polyhydroxy aliphatic, such as glycerin, ethylene glycol, propylene glycol and high analogues, and also including'theglycol ethers and mixed ethers, for example; butycarbitol is a useful ether.
For ease of practice of the invention I have found that'avehicle whichis readily miscible with water, that is gly'cerine, is to'b e preferred; Glycerine is readily retained by film formers such as dextran at normal temtui'e'sat sucha rate as to admirably perform the neces deposition-inhibitingfunction; In combination withice 2. dextran and water glycerine forms a convenient dispersion for film forming.
The invention will be more fully understood by reference to the following detailed description and accompanying drawings in which:
Figure l is a schematic view illustrating apparatus useful in the practice of the invention;
Figure 2 is a plan'view of a board of insulating material masked ofi for the formation of a printed circuit utilizingthe apparatus of Figure 1;
Figure 3 is an enlarged and sectional view of the board' of Figure 2 taken substantially on line 3-3 of Figure 2;
Figure 4 represents thestructure of Figures 2 and 3 in the course of the metallizing operation indicating sche matically the vaporization of vehicle from the'masking film;
Figure 5 is a view similar to that of Figure 3 after metallizing and-before removal of the masking agent; and
Figure 6 is a plan view of the product of the operation in full scale and after removal of the masking agent.
Referring to the drawings and initially particularly to Figure 2 the numeral 1 designates a thin rectangular board of electric'al'insulating material such as a phenolic resin base board. Coated on the board 1 and outlininga configuration 3lfor a printed circuit which is to include terminals as at 5 is a masking agent 7 produced in accordance with the principles of this invention.
An excellent masking agent comprises as the filmformer, dextran a high molecular weight gum glycerinas the vehicle of 10w volatility, and water as the dispersing agent; While the water content mayvarywith the molecular weight of the gum andmay be varied to aid ready disp er sibility a convenient formula well suited" to the purpose has been found to be approximately equal weights of glycerin and dextran together with water to the'extent of'about'IO'times the dextran weight; Thus a formula employing 10 grams of dextran (M.W. approx. 1,000,000), 10 gramsof glycerin' and cc. of water has been employed The board 1 prior to coating should 'be cleaned of oil or grease chemically and suitably the board is also roughened by sand-blasting or with a 320 grit emery. v The dispersion is spread on the cleaned board 1 in any convenient manner to form the film and to outline the" and'then a secondcoat is applied and dried at the same temperature. Such is a most suitable procedure for the;
specific formulation noted above. The drying in each instance shouldtake place until the exposed surface of the film is just tacky.
The board with the film formed thereon is then placedin the apparatus of Figure 1, for example, where it is exposed to an atmosphere of a plating gas; such may suitably' be nickel carbonyl and the temperature of the board within the chamber is then brought up to 285 to 290 F. as will be noted hereinafter in connection with the specific description of the apparatus.
As the board 1 and film 7 are heated glycerin slowly;
evolves as indicated at 9 in Figure 4 and-a vapor pressure of glycerin exists over the masked areas. This vaporpressure tends to prevent deposition of the metal of theni'ckel carbonyl on the masked areas but does not prepent the build-up of nickel in the unmasked areas as-at 11 (Figures 3, 4 and 5').
I With the masking agent specifically referred .to'above an exposure time of ten minutes to the plating'gas has Patented Jan. 31, 1961 which is desirable in aiding the final-washing. The wash-- ing may be effected with plain water and such is generally preferable; however, as already noted, was liquids which do not affect the insulating board 1 or the deposit of metal may be employed.
The masking agent is completely removable and it leaves a finely delineated circuit configuration (Figure 6). Referring now more particularly to the exemplary apparatus illustrated in Figure 1, the numeral 13 designates a vaporizing chamber, while the numeral 15 indicates a conduit extending into the chamber, terminating in a nozzle 17. and which is adapted for the flow of nickel carbonyl to the chamber from a suitable source of liquid carbonyl indicated at 19.
Leftwardly in Figure 1 the numeral 21 designates a conduit which is connected to a source of helium, while the numeral 23 designates a conduit which is connected to a source of anhydrous ammonium gas. Valves 25, 27 are provided in the respective conduits for the control of gas fiow.
The helium and ammonia mix together in the conduit 29 and flow to the chamber 13, where they mix and serve as a carrier for the nickel carbonyl gas formed by the flash vaporizing of the liquid nickel carbonyl. This plating gas then passes through conduit 31 to the plating chamber 33 which, in its lower portion, is provided with a platen 35 adapted to be heated electrically through leads 37, 39. As indicated in Figure 1 the insulating board 1 is placed on and heated from the platen 35.
Gases are exhausted from the plating chamber 33 through conduits as at 41, 43, 45. These exhaust gases may suitably be flowed to a burner or to a recovery apparatus as desired.
In connection with the plating operation it is desirable that the plating chamber be of sufficient size, such that no build-up of pressure of the vehicle will occur over the areas which are to be metallized. This is not a critical matter and obviously the volume should be such that no material amount of glycerin, for example, exists in the vapor pressure within the plating chamber, the primary vapor pressure of the vehicle existing only at the masked area as it emanates from the masking film.
When dextran is used as the film former, glycerin may be present to the extent of about percent of the weight of the dextran, or glycerin may be present in considerable excess, for example, ten times that of the weight of the dextran.
Similar considerations apply to the use of the other film forming agents with respect to proportions. However, as already noted, it is preferable that the glycerin be present in the masking agent to such an extent that under the conditions in which it is to be employed, some glycerin will remain in the film after the completion of the metallizing operation.
In some instances some slight deposition of metal has occurred on the masking agent, but in every case this deposition has been in such a state that it is readily permeable by water, and no difliculty has beenlexperienced in removing the films with water alone, although the speed of this operation may be increased by employing a slight alkali, such as a soap solution. Also, if desired, an alcohol-water mixture to the extent of about 50 percent alcohol, may be employed.
The success of this method of plating is attributed to the non-coherency of any metal deposit which occurs on the masking film, thus providing for the penetration of water, while the metal deposit itself which forms the conduction portion of the printed circuit is highly coherent.
While large amounts of glycerin are employable, it is preferable to operate on the side of the minimum of vapor pressure, and hence a small amount of glycerin, in order to avoid the formation of slight halos which tend to prevent sharp delineation of the metal deposits.
Accordingly, while the vehicle should be present in sufficient extent to havesome glycerin remaining in the film at the end of the operation, it should not be present to such an extent that undue halo formation occurs; When the amount of glycerin exceeds the proportions set out in the ranges given hereinbefore, such halo formation may occur and affects the appearance of the article but does not deleteriously affect the utility.
It will be understood that this invention is susceptible to modification in order to adapt it to difierent usages and conditions and accordingly, it is desired to comprehend such modifications within this invention as may fall within the scope of the appended claims.
I claim:
1. A process for the production of well delineated metallic deposits covering only a surface portion of an object which comprises applying to the object a masking agent to delineate on the object the contour of the deposit to be formed, said masking agent comprising a film former consisting of a viscous mass composed of dextran and a glycol vehicle releasable from the film former at temperatures below 500' F., said film former being water dispersible and capable of retaining its water dispersibility when subjected to heat, heating the object in an enclosed vessel to a temperature sufficiently high to decompose a metal-bearing heat decomposable gaseous compound and less than 500 F. to induce volatilization of the vehicle and to create a vapor pressure of the vehicle over the masking agent, passing a heat-decomposable gaseous compound which is decomposable at temperatures above 75 F. and below 500 F. to the object to be plated while the object is maintained at decomposition temperature and while said vehicle is being volatilized to thereby deposit on the delineated portion of the object metal while the deposition of metal on the masking agent is inhibited, removing the object from the vessel, and thereafter washing the masking agent from the object.
2. A process for the production of well delineated metallic deposits covering only a surface portion of an object which comprises applying to the object a masking agent to delineate on the object the contour of the deposit to be formed, said masking agent comprising a film former consisting of a viscous mass composed of dextran and glycerine, heating the object in an enclosed vessel to a temperature sufficiently high to decompose a metalbearing heat-decomposable gaseous compound but to less than 500 F. to induce volatilization of the glycerine and to create a vapor pressure of the vehicle over the masking agent, passing a said heat-decomposable gaseous compound to the object to be plated while the object is maintained at said decomposition temperature and while said vehicle is being volatilized to thereby deposit on the delineated portion of the object metal while the deposition of metal on the masking agent is inhibited, continuing the deposition to produce a desired plating thickness, removing the object from the vessel while some glycerine remains in the masking agent, and thereafter washing the masking agent from the object.
3. A process for the production of well delineated metallic deposits covering only a surface portion of an object which comprises applying to the object a maskng agent to delineate on the object the contour of the deposit to be formed, said masking agent comprising a film former consisting of a viscous mass composed of dextran, glycerine and water, preparing the masking agent by heating a film thereof on the object to drive off water until the film is just tacky, heating the object in an enclosed.
vessel to a temperature sufficiently high to decompose a metal-bearing heat-decomposable gaseous compound toto be plated while the object is maintained at said decomposition temperature and while said vehicle is being volatilized to thereby deposit on the delineated portion of the object metal while the deposition of metal on the masking agent is inhibited, continuing the deposition to produce a desired plating thickness, removing the object from the vessel while some glycerine remains in the masking agent, and thereafter washing the masking agent from the object.
4. A process for the production of well delineated metallic deposits covering only a surface portion of an object which comprises applying to the object a masking agent to delineate on the object the contour of the deposit to be formed, said masking agent comprising a film former consisting of a viscous mass made up of d'extran and glycerine the same being in approximately equal amounts by weight dextran and glycerine, heating the object in an enclosed vessel to a temperature sufliciently high to decompose a metal-bearing heat-decompossble gaseous compound to induce volatilization of the glycerine and to create a vapor pressure of the vehicle over the masking agent, passing a said heat-decomposable gaseous compound to the object to be plated while the object is maintained at said decomposition temperature and while said vehicle is being volatilized to thereby deposit on the 6 delineated portion of the object metal while the deposition of metal on the masking agent is inhibited, While glycerine is retained in the masking agent removing the object from the vessel, and thereafter washing the masking agent from the object.
References Cited in the file of this patent UNITED STATES PATENTS 1,656,265 Cosner Jan. 17, 1928 2,139,640 Mall Dec. 6, 1938 2,306,887 Klose Dec. 29, 1942 2,484,019 Devores Oct. 11, 1949 2,602,755 Silvermail July 8, 1952 2,653,108 Oakley Sept. 22, 1953 2,668,120 Leaf et a1. Feb. 2, 1954 2,674,584 Deniston Apr. 6, 1954 2,716,615 Voris Aug. 30, 1955 2,736,710 Nack et a1. Feb. 28, 1956 2,835,603 Swinehart et al May 20, 1958 2,847,330 Toulmin Aug. 12, 1958 OTHER REFERENCES Printed Circuit Technique, National Bureau of Standards Circular 468, issued Nov. 15, 1947, pages 25 and 26.
Claims (1)
1. A PROCESS FOR THE PRODUCTION OF WELL DELINEATED METALLIC DEPOSITS COVERING ONLY A SURFACE PORTION OF AN OBJECT WHICH COMPRISES APPLYING TO THE OBJECT A MASKING AGENT TO DELINEATE ON THE OBJECT THE CONTOUR OF THE DEPOSIT TO BE FORMED, SAID MASKING AGENT COMPRISING A FILM FORMER CONSISTING OF A VISCOUS MASS COMPOSED OF DEXTRAN AND A GLYCOL VEHICLE RELEASABLE FROM THE FILM FORMER AT TEMPERATURES BELOW 500*F., SAID FILM FORMER BEING WATER DISPERSIBLE AND CAPABLE OF RETAINING ITS WATER DISPERSIBILITY WHEN SUBJECT TO HEAT, HEATING THE OBJECT IN AN ENCLOSED VESSEL TO A TEMPERATURE SUFFICIENTLY HIGH TO DECOMPOSE A METAL-BEARING HEAT DECOMPOSABLE GASEOUS COMPOUND AND LESS THEN 500* F. TO INDUCE VOLATILIZATION OF THE VEHICLE AND TO CREATE A VAPOR PRESSURE OF THE VEHICLE OVER THE MASKING AGENT, PASSING A HEAT-DECOMPOSABLE GASEOUS COMPOUND WHICH IS DECOMPOSABLE AT TEMPERATURES ABOVE 75*F. AND BELOW 500*F. TO THE OBJECT TO BE PLATED WHILE THE OBJECT IS MAINTAINED AT DECOMPOSITION TEMPERATURE AND WHILE SAID VEHICLE IS BEING VOLATILIZED TO THEREBY DEPOSIT ON THE DELINEATED PORTION OF THE OBJECT METAL WHILE THE DEPOSITION OF METAL ON THE MASKING AGENT IS INHIBITIED, REMOVING THE OBJECT FROM THE VESSEL, AND THEREAFTER WASHING THE MASKING AGENT FROM THE OBJECT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US658568A US2970064A (en) | 1957-05-13 | 1957-05-13 | Masking material particularly for gas plating processes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US658568A US2970064A (en) | 1957-05-13 | 1957-05-13 | Masking material particularly for gas plating processes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2970064A true US2970064A (en) | 1961-01-31 |
Family
ID=24641780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US658568A Expired - Lifetime US2970064A (en) | 1957-05-13 | 1957-05-13 | Masking material particularly for gas plating processes |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2970064A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3113039A (en) * | 1959-08-05 | 1963-12-03 | Landis & Gyr Ag | Method of producing coatings on heatresisting supports |
| US3262900A (en) * | 1963-12-19 | 1966-07-26 | Schreiber Guldo | Masking compositions for printed circuits |
| US3303078A (en) * | 1962-05-18 | 1967-02-07 | David Wolf | Method of making electrical components |
| US3392052A (en) * | 1961-07-07 | 1968-07-09 | Davis Jesse | Method of forming a non-uniform metal coating on a ceramic body utilizing an abrasive erosion step |
| DE1286869B (en) * | 1964-01-14 | 1969-01-09 | Biebrach | Protective compound for workpieces that are only to be hardened in places on the surface |
| DE1289832B (en) * | 1964-08-21 | 1969-02-27 | Siemens Ag | Device for the production of flat surfaces of semiconductor crystal layers deposited from the gas phase |
| US3899339A (en) * | 1972-10-12 | 1975-08-12 | Ibm | Water soluble solder resist |
| US4022928A (en) * | 1975-05-22 | 1977-05-10 | Piwcyzk Bernhard P | Vacuum deposition methods and masking structure |
| US20100146777A1 (en) * | 2005-04-01 | 2010-06-17 | Samsung Electro-Mechanics Co., Ltd | Surface treatment method, circuit lines formation method, circuit lines formation apparatus, and printed circuit board formed thereby |
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| US1656265A (en) * | 1925-12-16 | 1928-01-17 | Stenpho Company | Sign |
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| US2736710A (en) * | 1951-06-29 | 1956-02-28 | Chadeloid Corp | Varnish remover |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3113039A (en) * | 1959-08-05 | 1963-12-03 | Landis & Gyr Ag | Method of producing coatings on heatresisting supports |
| US3392052A (en) * | 1961-07-07 | 1968-07-09 | Davis Jesse | Method of forming a non-uniform metal coating on a ceramic body utilizing an abrasive erosion step |
| US3303078A (en) * | 1962-05-18 | 1967-02-07 | David Wolf | Method of making electrical components |
| US3262900A (en) * | 1963-12-19 | 1966-07-26 | Schreiber Guldo | Masking compositions for printed circuits |
| DE1286869B (en) * | 1964-01-14 | 1969-01-09 | Biebrach | Protective compound for workpieces that are only to be hardened in places on the surface |
| DE1289832B (en) * | 1964-08-21 | 1969-02-27 | Siemens Ag | Device for the production of flat surfaces of semiconductor crystal layers deposited from the gas phase |
| US3899339A (en) * | 1972-10-12 | 1975-08-12 | Ibm | Water soluble solder resist |
| US4022928A (en) * | 1975-05-22 | 1977-05-10 | Piwcyzk Bernhard P | Vacuum deposition methods and masking structure |
| US20100146777A1 (en) * | 2005-04-01 | 2010-06-17 | Samsung Electro-Mechanics Co., Ltd | Surface treatment method, circuit lines formation method, circuit lines formation apparatus, and printed circuit board formed thereby |
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