US2887367A - Resist etching - Google Patents
Resist etching Download PDFInfo
- Publication number
- US2887367A US2887367A US621505A US62150556A US2887367A US 2887367 A US2887367 A US 2887367A US 621505 A US621505 A US 621505A US 62150556 A US62150556 A US 62150556A US 2887367 A US2887367 A US 2887367A
- Authority
- US
- United States
- Prior art keywords
- metal
- silk screen
- pattern
- resin
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 title claims description 14
- 239000002253 acid Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 description 32
- 229910052751 metal Inorganic materials 0.000 description 32
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 229910000831 Steel Inorganic materials 0.000 description 11
- 239000010959 steel Substances 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000010965 430 stainless steel Substances 0.000 description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
- C23F1/04—Chemical milling
Definitions
- This application relates to novel compositions and processes for the precision etching of acid resistant metals par ticularly the stainless steels.
- Chemicalforming of metals is carried out by partially masking the piece to be etched with a resistant coating then submerging the piece in a corrosive medium which removes the metal in the unprotected areas.
- a resistant coating attack the metal uniformly, at a constant rate, and at a rate rapid enough to be practical.
- the resistant coating must form a continuous film on the metal which adheres tenaciously during the etch, which is impervious to the corrosive medium, and which is easily stripped off the metal after the etching is complete.
- resist compositions for the etching of corrosion resistant steels which compositions withstand the corrosive action of the acid solution used to etch the steel and may be precisely deposited upon the steel so that a clear sharp etch pattern is obtained.
- Another object is to provide an acid solution which attacks stainless steel quickly and uniformly and a method of employing this solution as a precision etch bath.
- Concentrated sulfuric acid rapidly attacks stainless steels at elevated temperatures, however, the attack is too violent for close control and is not even over the exposed surface but leaves a very rough surface at the etched portions. If the temperature of the acid is lowered it is found that the rate of attack is decreased to controllable limits but ceases altogether after a short time due to the formation of a passive coating on the metal which inhibits further reaction. While this acid is suitable for use in the process it is not the preferred acid because the control of the process is difiicult.
- Acids such as phosphoric acid appear to attack the resist coating and loosen it from the metal when the acids are heated to a temperature at which they attack the steel.
- the demarcation between the etched and unetched surface is therefore not sharp and the etch pattern is rather blurred and uneven.
- a concentrated solution of hydrochloric acid is a preferred etchant. It attacks the stainless steels rapidly but uniformly and does not form a passive coating upon prolonged contact with the metal. For example, a bath comprising a solution of about 37% hydrochloric acid at a temperature of about 67 C., was found to erode 430 stainless steel at a lineal rate of .0375 inch per hour. Examination of the etched surface showed it to be smooth and free from objectionable pits.
- Cured epoxy type resins resist attack by hydrochloric acid and are useful as a resist coating. These resins make excellent resists not only because-of their acid resistant properties but also because they adhere well to the steel during the etching and yet are easily stripped 01f the completed etched piece. On the otherhand, resins of the polyvinylchloride or nitrocellulose types do not adhere as tenaciously to the metal nor are they as resistant to the strong acids which mustbe usedin order to corrode the metal.
- an activator such as pyridine, diethyl amine, piperidine or diethylene triamine, which are commonly used to catalyze the heat curing of the epoxy resins; all appear to be satisfactory.
- the resin is cured by heating to temperatures of about F., to 450 F, for periods which vary from one minute to about two hours, depending on the cure temperature;
- the resist may be deposited upon theworkpiece' by any convenient method, however, for the more intricate patterns and close tolerance work it is preferable to use a modified silk screen process for depositing the resist pattern on the metal and then to cure the resin in situ.
- Conventional silk screen techniques are employed, that is the acid resist is squeegeed onto the metal through a silk screen having portions of its mesh plugged or stopped off in the form of the pattern by processes known in the art.
- Small percentages of a suitable solvent such as xylene or tolulene are added to the uncured epoxy to increase its fiowability during the coating process.
- the metal in the bath When etching the pattern it is desirable to place the metal in the bath so that the plane of the pattern is substantially parallel to the surface of the bath. If the pattern is normal to the etchant surface, the hydrogen bubbles evolved by the reaction tend to agitate the solution unevenly and thereby promote localized overetching. The reasons for this is that the lines of the pattern which are approximately normal to the surface tend to channel the bubbles to the liquid surface thereby agitating the corrosive bath adjacent to these lines While the more nearly horizontal lines prevent this channeling effect. Maintain ing the plane of the etch pattern parallel to the surface eliminates these effects.
- Example A silk screen pattern treated with a GE. SRSI silicone was placed against the metal to be etched.
- An epoxy resin having about 225-290 grams of resin per gram equivalent of epoxide and containing about 10% methylethyl ketone solvent, 1% GE. SR82 silicone to prevent balling up of the resin as it lay on the steel and a small percentage of diethylene triamine was employed as the resist composition. This was squeegeed on apiece of 430 stainless steel through the screen and was then heated to volatilize the solvent and to cure the epoxide coating. The metal carrying the epoxy resin mask was then placed in the etch bath of concentrated hydrochloric acid at 67 C.
- the plane of the surface to be etched was positioned parallel to the liquid surface to minimize the effect of the geometry of the etch pattern on the agitation caused by the evolution of hydrogen. After the metal was cut to the desired depth, it was removed from the bath and the resist was stripped off. The finished piece was observed to have an extremely accurate etch pattern with a minimum of side etch.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Description
United States Patent RESIST ETCHING Steve Eisner, Detroit, Mich assignor to Ford Motor Company, Dearborn, Mich., a corporation of Delaware No Drawing. Application November 13, 1956 Serial No. 621,505
3, Claims. (Cl. 41-.43)
This application relates to novel compositions and processes for the precision etching of acid resistant metals par ticularly the stainless steels.
Chemicalforming of metals is carried out by partially masking the piece to be etched with a resistant coating then submerging the piece in a corrosive medium which removes the metal in the unprotected areas. To successfully apply the process to the formation of highly complex configurations or intricate designs having close tolerances requires that the corrosive medium attack the metal uniformly, at a constant rate, and at a rate rapid enough to be practical. At the same time the resistant coating must form a continuous film on the metal which adheres tenaciously during the etch, which is impervious to the corrosive medium, and which is easily stripped off the metal after the etching is complete.
While certain etching solutions and resists have long been known and used in the etching of copper and mild steels, methods of etching the stainless steels have been unsuccessful because the strong acids required to etch the steel also attacked and loosened the resist coating so that the etch pattern could not be maintained. Furthermore, many strong acids attack the steel unevenly forming rough and pitted surfaces while others form a passive coating on the steel so that the rate of reaction becomes very slow after the initial attack.
Having these defects in mind it is an object of this invention to provide resist compositions for the etching of corrosion resistant steels which compositions withstand the corrosive action of the acid solution used to etch the steel and may be precisely deposited upon the steel so that a clear sharp etch pattern is obtained.
Another object is to provide an acid solution which attacks stainless steel quickly and uniformly and a method of employing this solution as a precision etch bath.
Concentrated sulfuric acid rapidly attacks stainless steels at elevated temperatures, however, the attack is too violent for close control and is not even over the exposed surface but leaves a very rough surface at the etched portions. If the temperature of the acid is lowered it is found that the rate of attack is decreased to controllable limits but ceases altogether after a short time due to the formation of a passive coating on the metal which inhibits further reaction. While this acid is suitable for use in the process it is not the preferred acid because the control of the process is difiicult.
Acids such as phosphoric acid appear to attack the resist coating and loosen it from the metal when the acids are heated to a temperature at which they attack the steel. The demarcation between the etched and unetched surface is therefore not sharp and the etch pattern is rather blurred and uneven.
A concentrated solution of hydrochloric acid is a preferred etchant. It attacks the stainless steels rapidly but uniformly and does not form a passive coating upon prolonged contact with the metal. For example, a bath comprising a solution of about 37% hydrochloric acid at a temperature of about 67 C., was found to erode 430 stainless steel at a lineal rate of .0375 inch per hour. Examination of the etched surface showed it to be smooth and free from objectionable pits.
Cured epoxy type resins resist attack by hydrochloric acid and are useful as a resist coating. These resins make excellent resists not only because-of their acid resistant properties but also because they adhere well to the steel during the etching and yet are easily stripped 01f the completed etched piece. On the otherhand, resins of the polyvinylchloride or nitrocellulose types do not adhere as tenaciously to the metal nor are they as resistant to the strong acids which mustbe usedin order to corrode the metal.
It is advisable to add small percentages of an activator to the epoxy resin to promote cross linkage in the cured polymer. Activator-s such as pyridine, diethyl amine, piperidine or diethylene triamine, which are commonly used to catalyze the heat curing of the epoxy resins; all appear to be satisfactory. The resin is cured by heating to temperatures of about F., to 450 F, for periods which vary from one minute to about two hours, depending on the cure temperature;
The resist may be deposited upon theworkpiece' by any convenient method, however, for the more intricate patterns and close tolerance work it is preferable to use a modified silk screen process for depositing the resist pattern on the metal and then to cure the resin in situ. Conventional silk screen techniques are employed, that is the acid resist is squeegeed onto the metal through a silk screen having portions of its mesh plugged or stopped off in the form of the pattern by processes known in the art. Small percentages of a suitable solvent such as xylene or tolulene are added to the uncured epoxy to increase its fiowability during the coating process. It was found that in order to adapt the silk screen process for use in depositing the epoxy onto the steel, it is necessary to pre coat the silk screen with a solution of a suitable silicone to prevent formation of objectionable streamers of the resin caused by adhesion of the resin to the silk screen pattern. By eliminating these streamers it is possible to produce a resist pattern on the metal which has sharp, clear edges.
When etching the pattern it is desirable to place the metal in the bath so that the plane of the pattern is substantially parallel to the surface of the bath. If the pattern is normal to the etchant surface, the hydrogen bubbles evolved by the reaction tend to agitate the solution unevenly and thereby promote localized overetching. The reasons for this is that the lines of the pattern which are approximately normal to the surface tend to channel the bubbles to the liquid surface thereby agitating the corrosive bath adjacent to these lines While the more nearly horizontal lines prevent this channeling effect. Maintain ing the plane of the etch pattern parallel to the surface eliminates these effects.
Example A silk screen pattern treated with a GE. SRSI silicone was placed against the metal to be etched. An epoxy resin having about 225-290 grams of resin per gram equivalent of epoxide and containing about 10% methylethyl ketone solvent, 1% GE. SR82 silicone to prevent balling up of the resin as it lay on the steel and a small percentage of diethylene triamine was employed as the resist composition. This was squeegeed on apiece of 430 stainless steel through the screen and was then heated to volatilize the solvent and to cure the epoxide coating. The metal carrying the epoxy resin mask was then placed in the etch bath of concentrated hydrochloric acid at 67 C. The plane of the surface to be etched was positioned parallel to the liquid surface to minimize the effect of the geometry of the etch pattern on the agitation caused by the evolution of hydrogen. After the metal was cut to the desired depth, it was removed from the bath and the resist was stripped off. The finished piece was observed to have an extremely accurate etch pattern with a minimum of side etch.
It will be understood that the invention is not to be limited to the exact examples shown anddescribed, but that various changes and modifications may be made without departing from the spirit and scope of the invention, as defined in the appended claims.
I claim:
1. The process of producing a precision etched pattern on a metal surface which comprises coating a silk screen with a silicone, placing the silk screen over the metal to be etched, selectively depositing an acid resistant resin on a portion only of the metal surface through said silk screen and etching that portion of the metal surface that is unprotected by the resin with a strong acid.
2. The process of producing a precision etched pattern on a metal surface which comprises placing a silk screen over the surface of the metal to be etched, selectively depositing upon the metal surface a potentially thermosetting epoxy type resin mixed with small amounts of silicone through said silk screen, curing the resin to form an acid resistant coating on selected portions of the metal surface and etching that portion of the metal that is unprotected by the cured resin with a strong acid.
3. The process of producing a precision etched pattern on a metal surface which comprises coating a silk screen with a silicone, placing the silk screen over the metal surface to be etched, selectively depositing a potentially thermosetting epoxy type resin mixed with small amounts of silicone on the metal surface through said silk screen, curing the resin to form an acid resistant coating on selected portions of the metal surface, etching that portion of the metal that is unprotected with a strong acid.
References Cited in the file of this patent UNITED STATES PATENTS 2,107,294 Griswold Feb. 8, 1938 2,535,794 Hempel Dec. 26, 1954 2,699,424 Nieter Jan. 11, 1955 OTHER REFERENCES Dow Corning Silicanes, pub. by Dow Corning Corp, 1947, page 7.
British Plastics, November 1948, pages 521-527.
The Silicone Story, publ. by General Electric, July 1952, pages 5 and 6.
Modern Plastics, September 1954, pages 155-157, 160,
161 and 240442.
Claims (1)
1. THE PROCESS OF PRODUCING A PRECISION ETCHED PATTERN ON A METAL SURFACE WHICH COMPRISES COATING A SILK SCREEN WITH A SILICONE, PLACING THE SILK SCREEN OVER THE METAL TO BE ETCHED, SELECTIVELY DEPOSITING AN ACID RESISTANT RESIN ON A PORTION ONLY OF THE METAL SURFACE THROUGH SAID SILK SCREEN AND ETCHING THAT PORTION OF THE METAL SURFACE THAT IS UNPROTECTED BY THE RESIN WITH A STRONG ACID.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US621505A US2887367A (en) | 1956-11-13 | 1956-11-13 | Resist etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US621505A US2887367A (en) | 1956-11-13 | 1956-11-13 | Resist etching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2887367A true US2887367A (en) | 1959-05-19 |
Family
ID=24490436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US621505A Expired - Lifetime US2887367A (en) | 1956-11-13 | 1956-11-13 | Resist etching |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2887367A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3419441A (en) * | 1964-11-17 | 1968-12-31 | Thiokol Chemical Corp | Tungsten oxide coated rocket motor throat insert |
| US4009660A (en) * | 1974-03-29 | 1977-03-01 | Xerox Corporation | Inking in litho printing through a non-imaged screen |
| US4137842A (en) * | 1977-03-02 | 1979-02-06 | Miller Screen & Design, Inc. | Method and apparatus for applying decorative imprints to the surfaces of plastic workpieces |
| US4253910A (en) * | 1978-11-24 | 1981-03-03 | Colonial Mirror & Glass Corp. | Ornamental mirror and apparatus and method for making same |
| US5120396A (en) * | 1991-06-04 | 1992-06-09 | Chen Kuo C | Process for forming a figure on a product of stainless steel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2107294A (en) * | 1936-06-30 | 1938-02-08 | Wade E Griswold | Printing member and method of producing same |
| US2535794A (en) * | 1947-01-24 | 1950-12-26 | Heresite & Chemical Company | Method of preparing ferrous metal objects for the application of synthetic resins |
| US2699424A (en) * | 1949-10-07 | 1955-01-11 | Motorola Inc | Electroplating process for producing printed circuits |
-
1956
- 1956-11-13 US US621505A patent/US2887367A/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2107294A (en) * | 1936-06-30 | 1938-02-08 | Wade E Griswold | Printing member and method of producing same |
| US2535794A (en) * | 1947-01-24 | 1950-12-26 | Heresite & Chemical Company | Method of preparing ferrous metal objects for the application of synthetic resins |
| US2699424A (en) * | 1949-10-07 | 1955-01-11 | Motorola Inc | Electroplating process for producing printed circuits |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3419441A (en) * | 1964-11-17 | 1968-12-31 | Thiokol Chemical Corp | Tungsten oxide coated rocket motor throat insert |
| US4009660A (en) * | 1974-03-29 | 1977-03-01 | Xerox Corporation | Inking in litho printing through a non-imaged screen |
| US4137842A (en) * | 1977-03-02 | 1979-02-06 | Miller Screen & Design, Inc. | Method and apparatus for applying decorative imprints to the surfaces of plastic workpieces |
| US4253910A (en) * | 1978-11-24 | 1981-03-03 | Colonial Mirror & Glass Corp. | Ornamental mirror and apparatus and method for making same |
| US5120396A (en) * | 1991-06-04 | 1992-06-09 | Chen Kuo C | Process for forming a figure on a product of stainless steel |
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