US2728321A - Apparatus for gas plating - Google Patents
Apparatus for gas plating Download PDFInfo
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- US2728321A US2728321A US313738A US31373852A US2728321A US 2728321 A US2728321 A US 2728321A US 313738 A US313738 A US 313738A US 31373852 A US31373852 A US 31373852A US 2728321 A US2728321 A US 2728321A
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- chamber
- metal
- plating
- carbonyl
- liquid
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- 238000007747 plating Methods 0.000 title description 27
- 229910052751 metal Inorganic materials 0.000 description 33
- 239000002184 metal Substances 0.000 description 33
- 239000007789 gas Substances 0.000 description 27
- 239000007788 liquid Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 19
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 17
- 238000000354 decomposition reaction Methods 0.000 description 14
- 239000007921 spray Substances 0.000 description 13
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 12
- 239000011261 inert gas Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 238000000151 deposition Methods 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- -1 nitrosyl carbonyls Chemical class 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000001569 carbon dioxide Substances 0.000 description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 5
- 229910002091 carbon monoxide Inorganic materials 0.000 description 5
- 229940105305 carbon monoxide Drugs 0.000 description 5
- 229910017052 cobalt Inorganic materials 0.000 description 5
- 239000010941 cobalt Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 150000004678 hydrides Chemical class 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 238000005422 blasting Methods 0.000 description 3
- 150000002739 metals Chemical group 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000074 antimony hydride Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- OUULRIDHGPHMNQ-UHFFFAOYSA-N stibane Chemical compound [SbH3] OUULRIDHGPHMNQ-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- DMERAQVOEMBXQU-UHFFFAOYSA-N carbonyl dibromide;osmium Chemical compound [Os].BrC(Br)=O DMERAQVOEMBXQU-UHFFFAOYSA-N 0.000 description 1
- ADGFUTSPEKVFKD-UHFFFAOYSA-N carbonyl dichloride;rhodium Chemical compound [Rh].ClC(Cl)=O ADGFUTSPEKVFKD-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910001320 chromium hydride Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- VURKTKHHTUWVPW-UHFFFAOYSA-N copper nitroxyl Chemical group [Cu].N=O VURKTKHHTUWVPW-UHFFFAOYSA-N 0.000 description 1
- 238000005202 decontamination Methods 0.000 description 1
- 230000003588 decontaminative effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000013023 gasketing Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012263 liquid product Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 150000004681 metal hydrides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- ODUCDPQEXGNKDN-UHFFFAOYSA-N nitroxyl Chemical class O=N ODUCDPQEXGNKDN-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- KXCAEQNNTZANTK-UHFFFAOYSA-N stannane Chemical compound [SnH4] KXCAEQNNTZANTK-UHFFFAOYSA-N 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910000059 tellane Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910000083 tin tetrahydride Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
Definitions
- Claim. (Cl. 11849) This invention relates to the art of deposition of metals. More particularly it relates to coating of metal bases. Still more particularly it relates to the plating of objects by the deposition of metal from readily decomposed volatile metal bearing compounds and apparatus for carrying out the process.
- Depositing of thin film of metals, such as iron, nickel, cobalt, upon metal bases has been accomplished in the past by enclosing an object to be plated in a chamber sealed against entry of air.
- the chamber was purged with carbon dioxide and the object heated to a temperature at which volatile metal carbonyls decompose.
- the deposition rate is very slow and the process requires hours to build up an appreciable depth of metal coating.
- the coatings are brittle and adhered poorly to the base metal.
- lt is another object of this invention to produce thicker adhering coatings than have been produced heretofore. It is another object of this invention to provide an improved apparatus for carrying out the process wherein the metal carbonyl is not brought into the reaction zone in a dilute weak plating vapor state.
- the atomsphere in the neighborhood of the surface to be coated is thus made up merely of fresh liquid propelled with force by the gas blast into which deposition zone and encountering mainly the hot gaseous decomposition products which are being removed as, for example, by suc tion' or vacuum drawn on the chamber.
- metal carbonyls also nitroxyl compounds, nitrosyl carbonyls, metal hydrides, metal alkyls, metal halides, metal carbonyl halogens, and the like, which are either liquids at normal temperature and pressure conditions, or gases compressible to liquid under any commercial feasible tem perature conditions or solids convertible to liquids at temperatures below the decomposition temperature of the compound, or to utilize solutions of carbonyls in volatile solvents such as petroleum ether.
- Useful metals which may be deposited from the metallic carbonyl compounds are nickel, iron, chromium, molybdenum, tungsten, cobalt, telluriurn, rhenium, and the like.
- Illustrative compounds of the other groups are nitroxyls, such as copper nitroxyl, nitrosyl carbonyls, for example, cobalt nitrosyl carbonyl, hydrides, such as tellurium hydride, gelenium hydride, antimony hydride, tin hydride, chromium hydride, the mixed organo metallo hydrides such as dimethyl alumino hydride, metal alkyls such as tetraethyl, lead, metal halides such as rhodium carbonyl chloride, osmium carbonyl bromide, rhuthenium carbonyl chloride, and the like.
- hydrides such as tellurium hydride, gelenium hydride, antimony hydride, tin hydride, chromium hydride, the mixed organo metallo hydrides such as dimethyl alumino hydride, metal alkyls such as tetrae
- Apparatus of this type usually delivers the liquid to the orifice through a central pipe.
- the inert gas is usually fed to the mixing point through an annular chamber surrounding the central pipe.
- the quantity of liquid atomized is controlled by adjustment of the orifice area.
- Commercial equipment such as fog nozzles or fine spray nozzles, such as the DeVilbis paint spray gun, can be readily adapted for use as the spraying means.
- gas held under pressure of between 30 and 90 pounds per square inch for blasting, but the pressure range is subject to much wider variation, depending upon the quantity of liquid being sprayed, the throw required from the nozzle to the plating surface, and so forth.
- the throw distance between nozzle and plating surface is somewhat critical in order to convert the liquid to a gas at a point in close proximity to the plating surface. What this distance may be is readily determinable for any particular combination of liquid, temperature of the blasting gas and temperature of the plating object, fineness of the spray, and so forth. However, in view of the many ways in which the conditions may be varied, it will be seen that an exact number of inches would only apply to specific conditions, and that the critical thing really is that the liquid not impinge on the plating surface as a strong liquid spray.
- Each material from which a metal may be plated has a temperature at which decompositions is complete. However, decomposition may take place slowly at a lower temperature or while the vapors are being raised in temperature through some particular range. For example, nickel carbonyl completely decomposes at a temperature in the range of 375 F. to 400 F. However, nickel carbonyl starts to decompose slowly at about 175 F., and therefore, decomposition continues during the time of heating from 200 F. to 380 F. A large number of the metal carbonyls and hydrides may be efiectively and efficiently decomposed at a temperature in the range of 350 F. to 450 F. When working with most carbonyls we prefer to operate in a temperature range of 375 F. to 425 F.
- the present invention is marl:- edly superior to the processes utilized heretofore, because it accomplishes all of its decomposition quickly in close proximity to the heated surface area and because the liquid when converted to a vapor is then decomposed without delay as the carbonyl or uitrosyl or hydride compounds come in contact with the hot object to be plated.
- the material to be decomposed is readily brought to the decomposition temperature by atomizing the liquid with hot inert gas.
- the fine spray of liquid can thus be transformed from say 100 F. to temperatures of between 200 F. and 300 F. in a fraction of a second and the liquid converted to a gas.
- Preparatory to coating base material he metal strip or object to be plated may be cleaned by employing the conventional methods used in the art, comprising electrochemically cleaning by moving the same through a bath of alkali or acid electrolyte, wherein the strip is made to cathode or anode.
- Pickling of the metal with hydrochloric, sulfuric, or nitric acid, or a combination of acids, may also be made as a part of the cleaning process and the strip thoroughly rised or washed and dried prior to introduction into the plating apparatus of this invention.
- Figure 1 is a vertical sectional view showing diagram- 4 matically one embodiment of the apparatus of this invention.
- Figure 2 is a vertical section view of the apparatus taken substantially on the line 2-2 of Figure 1 and looking in the direction of the arrows;
- Figure 3 is a vertical sectional view along the line 3-3 of Figure 1.
- an object 10 which may be a stationary positioned object or a moving sheet or the like.
- the object here shown is illustrated as stationary and suspended from a support 11. Adjacent the object is a support 12 from which is suspended suitable heating means 13, suclias an electrical resistance coil masked with a suitable covering 14 which prevents plating on the heating element.
- Supports 11 and 12 are secured in the wall of an air tight chamber 15.
- This chamber is provided with an aperture 16 for introduction and removal of objects to be plated.
- the aperture 16 is fitted with releasable closure means 17 rendered air tight by a suitable gasket 18.
- a metal jacket 19 Surrounding the chamber 15 is a metal jacket 19 having therein a closed space 20 through which a suitable medium, such as water, may be circulated.
- the space 20 is shown in communication with an inlet 21 and an outlet 22.
- an inert gas may be introduced by suitable means 25, such as a fan or blower.
- Blower 25 is shown taking suction on a surge tank supplied with gas from a storage tank as indicated and introducing the gas at the chamber inlet 27.
- the chamber outlet pipe 26a communicating with the chamber through outlet 26 may be connected at the point indicated at 26b with a vacuum pump or exhaust fan.
- the exhausted gases which are a mixture of inert gas and carbon monoxide may, if desired, be scrubbed to remove inert gas such as carbon-dioxide, and the purified carbon monoxide returned to a metal carbonyl generator to conserve carbon monoxide.
- Spray means 30 consists of a central liquid tube 31 connected to a source of liquid 32.
- the tube 31 is surrounded by a tube 33 mounted with a laterally adjustable head 34, adapted with an external gear 35.
- Gear 35 is actuated by a gear 36 attached to a rod 37 which extends through a sealed bushing 38 to a manually operable position outside the chamber 15.
- Tube 33 is connected to a suitable source of inert gas 39 through pipe 40.
- Chamber 15 is provided with a suitable window 42 more completely shown in Figure 3.
- This window comprises an inner pane 43 of glass or clear resin joined in air tight seal to the chamber 15 by suitable gasket means 44.
- the gasketing also seals tightly to an outer glass pane 45 to form between said panes an air pocket 46.
- This arrangement provides a clear view of the plating and spray adjustment apparatus without danger of carbonmonoxide leakage to the area where operators might be stationed.
- thermometer 48 suitably sealed in the wall of chamber 15 and the jacket t9 and extending outside the plating chamber for visual observation.
- Example 1 Aluminum discs may be suspended from the support 11. The chamber may then be sealed and purged of air by passing carbon dioxide gas therethrough. When the chamber 15 is purged the discs may be heated by conduction due to intimate contact with resistance heater 13. At this time the water may be started circulating in jacket 19 to maintain the chamber at a cool non-plating temperature.
- nickel carbonyl may be introduced into the chamber by spray means 30. This nickel carbonyl may be under a pressure of about 50 pounds per square inch and sprayed at the rate of about 2 pounds of nickel carbonyl per minute.
- the spraying means may be carbon dioxide maintained under pressure of about 75 pounds per square inch.
- the decomposition of nickel carbonyl produces 4 volumes of carbon monoxide gas for each molecular weight of liquid introduced.
- the gases may be removed by an exhaust fan which maintains a pressure in the chamber of between 1 and 2 inches of H vacuum.
- small discs may be plated to a thickness of many hundredths of an inch in a matter of seconds with a smooth coating.
- Example II A lead pattern may be introduced into the apparatus of Example I in place of the aluminum disc.
- the operation may be carried out in a similar manner, using nicke carbonyl sprayed into the chamber at a rate of about 2 /2 pounds of liquid per minute.
- the inert atmosphere may be hydrogen gas.
- the liquid may be sprayed using hydrogen as the blasting gas, which gas is under a pressure of 90 pounds per square inch and at a temperature of 200 F.
- the lead pattern may be heated to a temperature of approximately 375 F. and in the presence of hydrogen the nickel carbonyl plated to a bright metallic clean surface.
- Example III A carbon steel plate AlSl-1020 may be introduced into the chamber of Example I and the process run under the following conditions:
- the liquid supplied to the spray apparatus may be cobalt carbonyl.
- the inert gas circulated in the chamber may be nitrogen from a source maintained under a pressure slightly above atmospheric.
- Temperature of the steel plate may be maintained at approximately 410 F.
- the cobalt carbonyl may be introduced at a liquid flow rate of approximately 4 pounds of carbonyl per minute.
- the gases are exhausted utilizing vacuum equipment capable of maintaining a pressure within the chamber of approximately 3 inches of water vacuum.
- a smooth coating of cobalt may be thus deposited on large plates in a matter of minutes.
- Example IV Copper discs may be introduced into the chamber explained in conjunction with Example I and the process operated under the following conditions:
- Copper discs may be heated to approximately 380 F.
- the chamber may be purged with hydrogen, and hydrogen gas may be used as the spraying medium.
- Antimony hydride may be introduced into the chamber through the spray apparatus at a rate of approximately 3 pounds per minute. These copper discs of 3 inch diameter may be plated to a depth of .025 inch with metallic antimony in a fraction of a minute.
- Apparatus for plating objects by gaseous metal deposition comprising an airtight chamber, a liquid atomizing means disposed in said chamber, said means including a nozzle comprising a tubular member through which liquid to be atomized is introduced into said chamber, said tubular member being surrounded by an outer end for discharging gas to propel a fine spray of liquid metal carbonyl into said chamber, means for supporting materials in said chamber and spaced from said nozzle for positioning material to be plated, means for heating said material which is arranged adjacent said material support and remote from said nozzle, an inlet to said chamber for introducing inert gas and disposed at one end thereof, an outlet from said chamber for removing inert gas and decomposition products from the chamber disposed at the opposite end thereof, and blower means connected with said inlet for circulating inert gas through said chamber and at a pressure above atmospheric.
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Description
Dec. 27, 1955 o. F. DAVIS ETAL APPARATUS FOR GAS PLATING 2 Sheets-Sheet 1 Original Filed July 14, 1949 am LP QV mm .msmmss INVENTORS OL/VER F DAV/5 HANS G. BEL/7'2 ATTORNEYS 1955 o. F. DAVIS ETAL 2,728,321
APPARATUS FOR GAS PLATING Original Filed July 14, 1949 2 Sheets-Sheet 2 INVENTORS OL/VER F DAV/5 HANS 6. BEL/7'2 l I 3 m N w T u x I T15 a M 6 4 n n u n 2 2r Q s m v C F: o L w l.
ATTORNEYS United States Patent O APPARATUS FOR GAS PLATING Oliver F. Davis, Troy, and Hans G. Belitz, Dayton, Ohio, assignors to The Commonwealth Engineering Company of Ohio, Dayton, Ohio, a corporation of Ohio Original application July 14, 1949, Serial No. 104,754. Divided and this application October 8, 1952, Serial No. 313,738
1 Claim. (Cl. 11849) This invention relates to the art of deposition of metals. More particularly it relates to coating of metal bases. Still more particularly it relates to the plating of objects by the deposition of metal from readily decomposed volatile metal bearing compounds and apparatus for carrying out the process. 1
Depositing of thin film of metals, such as iron, nickel, cobalt, upon metal bases has been accomplished in the past by enclosing an object to be plated in a chamber sealed against entry of air. a
The chamber was purged with carbon dioxide and the object heated to a temperature at which volatile metal carbonyls decompose.
Following this a metal carbonyl gas was carbureted into a stream of carbon dioxide to form a dilute carbonyl medium which was metered into the chamber. Upon coming in contact with the hot metal the carbonyl was decomposed and the metal component deposited.
This application is a division of Serial No. 104,754 of Davis et al., filed July 14, 1949, now U. S. Patent No. 2,619,433.
This process has many'disadvantages which limit its usefulness. While the chamber isfilled with a mixture of inert gas and metal carbonyl vapors, plating only occurs when the carbonyl vapor contacts the hot object and general decomposition may take place, with the result that powdered metal accumulates in the bottom of the chamber.
Further, the deposition rate is very slow and the process requires hours to build up an appreciable depth of metal coating. In addition, the coatings are brittle and adhered poorly to the base metal.
In another process, utilizing quite similar equipment, the brittleness and poor adhesion has been largely overcome. In this process the metal deposition is carried out in two stages.
After a thin layer of metal subjected to heat treatment at a temperature of between 500 and 800 F. to expel the occluded gases. The object was then returned to the chamber and a second coating of the desired thickness over the first layer deposited thereon.
This process, while producing adhering metal coatings, is still a time consuming one. It also requires that the plating cycle be interrupted with consequent loss of materials due to purging the equipment to avoid formation of exposives mixtures of carbonyl gases with air.
It is an object of this invention to overcome the limitations and disadvantages of the above described apparatus and processes. 7
it is another object of this invention to provide an apparatus for gaseous plating processes in which the time is deposited the object is for depositing any thickness of coating is markedly shorter than heretofore.
lt is another object of this invention to produce thicker adhering coatings than have been produced heretofore. It is another object of this invention to provide an improved apparatus for carrying out the process wherein the metal carbonyl is not brought into the reaction zone in a dilute weak plating vapor state.
It is another object to provide an apparatus wherein the gaseous plating process may be operated under either positive or negative pressure conditions.
It is a further object of this invention to provide an apparatus for effecting gaseous plating wherein the decomposition gases are quickly removed from the plating area to eliminate contamination of the deposited metal film.
It is a still further object of this invention to provide an apparatus andprocess for continuous and rapid deposition of bright metal coatings by directing the decomposable metal material to the metal surface.
It is still a further object of this invention to provide a simplified method and apparatus for depositing metal from a volatile metal compound by continuously decomposing the compound an conducting the gaseous product resultant from the decomposition away from contact with hot metal in order to avoid decontamination and dulling of the bright deposit.
It is still another object of this invention to provide an apparatus for gaseous plating wherein the decomposable material is not brought up to a decomposition temperature before it is in the direct plating zone.
Other and more specific objects and advantages will be apparent to one skilled in the art as the following description proceeds:
In this new apparatus provision is made whereby the plating composition is introduced into the deposition chamber as a liquid instead of a gas. In this way it is possible to concentrate the stream of metal bearing material at the heated surface.
The atomsphere in the neighborhood of the surface to be coated is thus made up merely of fresh liquid propelled with force by the gas blast into which deposition zone and encountering mainly the hot gaseous decomposition products which are being removed as, for example, by suc tion' or vacuum drawn on the chamber.
This invention makes it possible to utilize metal carbonyls, also nitroxyl compounds, nitrosyl carbonyls, metal hydrides, metal alkyls, metal halides, metal carbonyl halogens, and the like, which are either liquids at normal temperature and pressure conditions, or gases compressible to liquid under any commercial feasible tem perature conditions or solids convertible to liquids at temperatures below the decomposition temperature of the compound, or to utilize solutions of carbonyls in volatile solvents such as petroleum ether.
Useful metals which may be deposited from the metallic carbonyl compounds are nickel, iron, chromium, molybdenum, tungsten, cobalt, telluriurn, rhenium, and the like.
Illustrative compounds of the other groups are nitroxyls, such as copper nitroxyl, nitrosyl carbonyls, for example, cobalt nitrosyl carbonyl, hydrides, such as tellurium hydride, gelenium hydride, antimony hydride, tin hydride, chromium hydride, the mixed organo metallo hydrides such as dimethyl alumino hydride, metal alkyls such as tetraethyl, lead, metal halides such as rhodium carbonyl chloride, osmium carbonyl bromide, rhuthenium carbonyl chloride, and the like.
When introducing the liquid products into the closed chamber, the liquid is broken up into a fine spray by a blast of inert gas. Apparatus of this type usually delivers the liquid to the orifice through a central pipe.
The inert gas is usually fed to the mixing point through an annular chamber surrounding the central pipe. The quantity of liquid atomized is controlled by adjustment of the orifice area. Commercial equipment, such as fog nozzles or fine spray nozzles, such as the DeVilbis paint spray gun, can be readily adapted for use as the spraying means.
Carbon dioxide, helium, nitrogen, hydrogen, the gaseous product of controlled burning of hydrocarbon gases free of oxygen, mixtures of these gases, and the like, have been utilized as the gas blast.
We prefer to utilize gas held under pressure of between 30 and 90 pounds per square inch for blasting, but the pressure range is subject to much wider variation, depending upon the quantity of liquid being sprayed, the throw required from the nozzle to the plating surface, and so forth.
The throw distance between nozzle and plating surface is somewhat critical in order to convert the liquid to a gas at a point in close proximity to the plating surface. What this distance may be is readily determinable for any particular combination of liquid, temperature of the blasting gas and temperature of the plating object, fineness of the spray, and so forth. However, in view of the many ways in which the conditions may be varied, it will be seen that an exact number of inches would only apply to specific conditions, and that the critical thing really is that the liquid not impinge on the plating surface as a strong liquid spray.
Each material from which a metal may be plated has a temperature at which decompositions is complete. However, decomposition may take place slowly at a lower temperature or while the vapors are being raised in temperature through some particular range. For example, nickel carbonyl completely decomposes at a temperature in the range of 375 F. to 400 F. However, nickel carbonyl starts to decompose slowly at about 175 F., and therefore, decomposition continues during the time of heating from 200 F. to 380 F. A large number of the metal carbonyls and hydrides may be efiectively and efficiently decomposed at a temperature in the range of 350 F. to 450 F. When working with most carbonyls we prefer to operate in a temperature range of 375 F. to 425 F.
It will be seen thus that the present invention is marl:- edly superior to the processes utilized heretofore, because it accomplishes all of its decomposition quickly in close proximity to the heated surface area and because the liquid when converted to a vapor is then decomposed without delay as the carbonyl or uitrosyl or hydride compounds come in contact with the hot object to be plated.
Maintenance of the metal objects at temperatures in the general operating range is easily accomplished with numerous heating means, such as radiant heating, electrical resistance heating, induction, and the like.
The material to be decomposed is readily brought to the decomposition temperature by atomizing the liquid with hot inert gas. The fine spray of liquid can thus be transformed from say 100 F. to temperatures of between 200 F. and 300 F. in a fraction of a second and the liquid converted to a gas.
This transformation to a gas takes place in the vicinity of the hot object to be plated, giving the process excellent integration for obtaining efficient operation.
Preparatory to coating base material he metal strip or object to be plated may be cleaned by employing the conventional methods used in the art, comprising electrochemically cleaning by moving the same through a bath of alkali or acid electrolyte, wherein the strip is made to cathode or anode.
Pickling of the metal with hydrochloric, sulfuric, or nitric acid, or a combination of acids, may also be made as a part of the cleaning process and the strip thoroughly rised or washed and dried prior to introduction into the plating apparatus of this invention.
The apparatus of the invention and its use will be more readily understood from a description of the process with reference to the apparatus and the specific examples.
in the drawings:
Figure 1 is a vertical sectional view showing diagram- 4 matically one embodiment of the apparatus of this invention;
Figure 2 is a vertical section view of the apparatus taken substantially on the line 2-2 of Figure 1 and looking in the direction of the arrows; and
Figure 3 is a vertical sectional view along the line 3-3 of Figure 1.
Referring to the drawings in detail, there is shown an object 10 which may be a stationary positioned object or a moving sheet or the like. The object here shown is illustrated as stationary and suspended from a support 11. Adjacent the object is a support 12 from which is suspended suitable heating means 13, suclias an electrical resistance coil masked with a suitable covering 14 which prevents plating on the heating element.
Surrounding the chamber 15 is a metal jacket 19 having therein a closed space 20 through which a suitable medium, such as water, may be circulated. The space 20 is shown in communication with an inlet 21 and an outlet 22.
It" pressure above atmospheric pressure is to be maintained in the chamber 15, an inert gas may be introduced by suitable means 25, such as a fan or blower.
If pressures below atmospheric are to be maintained the chamber outlet pipe 26a communicating with the chamber through outlet 26 may be connected at the point indicated at 26b with a vacuum pump or exhaust fan. The exhausted gases which are a mixture of inert gas and carbon monoxide may, if desired, be scrubbed to remove inert gas such as carbon-dioxide, and the purified carbon monoxide returned to a metal carbonyl generator to conserve carbon monoxide.
Liquid is introduced into the chamber through the rightwardly wall 28 of chamber 15 by suitable spray means 30. Spray means 30 consists of a central liquid tube 31 connected to a source of liquid 32.
The tube 31 is surrounded by a tube 33 mounted with a laterally adjustable head 34, adapted with an external gear 35. Gear 35 is actuated by a gear 36 attached to a rod 37 which extends through a sealed bushing 38 to a manually operable position outside the chamber 15.
This arrangement provides a clear view of the plating and spray adjustment apparatus without danger of carbonmonoxide leakage to the area where operators might be stationed.
In Figure 2 there is also shown a thermometer 48 suitably sealed in the wall of chamber 15 and the jacket t9 and extending outside the plating chamber for visual observation.
Conditions of operation of the apparatus in carrying out the process during specific plating operations will be more readily understood from the following examples:
Example 1 Aluminum discs may be suspended from the support 11. The chamber may then be sealed and purged of air by passing carbon dioxide gas therethrough. When the chamber 15 is purged the discs may be heated by conduction due to intimate contact with resistance heater 13. At this time the water may be started circulating in jacket 19 to maintain the chamber at a cool non-plating temperature.
When the thermometer 48 records temperature in the vicinity of the discs at approximately 390 F., nickel carbonyl may be introduced into the chamber by spray means 30. This nickel carbonyl may be under a pressure of about 50 pounds per square inch and sprayed at the rate of about 2 pounds of nickel carbonyl per minute.
The spraying means may be carbon dioxide maintained under pressure of about 75 pounds per square inch. The decomposition of nickel carbonyl produces 4 volumes of carbon monoxide gas for each molecular weight of liquid introduced. The gases may be removed by an exhaust fan which maintains a pressure in the chamber of between 1 and 2 inches of H vacuum.
Under these conditions small discs may be plated to a thickness of many hundredths of an inch in a matter of seconds with a smooth coating.
Example II A lead pattern may be introduced into the apparatus of Example I in place of the aluminum disc.
The operation may be carried out in a similar manner, using nicke carbonyl sprayed into the chamber at a rate of about 2 /2 pounds of liquid per minute.
In this operation the inert atmosphere may be hydrogen gas. The liquid may be sprayed using hydrogen as the blasting gas, which gas is under a pressure of 90 pounds per square inch and at a temperature of 200 F.
The lead pattern may be heated to a temperature of approximately 375 F. and in the presence of hydrogen the nickel carbonyl plated to a bright metallic clean surface.
Example III A carbon steel plate AlSl-1020 may be introduced into the chamber of Example I and the process run under the following conditions:
The liquid supplied to the spray apparatus may be cobalt carbonyl. The inert gas circulated in the chamber may be nitrogen from a source maintained under a pressure slightly above atmospheric.
Temperature of the steel plate may be maintained at approximately 410 F. The cobalt carbonyl may be introduced at a liquid flow rate of approximately 4 pounds of carbonyl per minute.
In order to remove the decomposition products and the circulating nitrogen, the gases are exhausted utilizing vacuum equipment capable of maintaining a pressure within the chamber of approximately 3 inches of water vacuum.
A smooth coating of cobaltmay be thus deposited on large plates in a matter of minutes.
Example IV Copper discs may be introduced into the chamber explained in conjunction with Example I and the process operated under the following conditions:
Copper discs may be heated to approximately 380 F. The chamber may be purged with hydrogen, and hydrogen gas may be used as the spraying medium. Antimony hydride may be introduced into the chamber through the spray apparatus at a rate of approximately 3 pounds per minute. These copper discs of 3 inch diameter may be plated to a depth of .025 inch with metallic antimony in a fraction of a minute.
It will be understood that while there have been given herein certain specific examples of the apparatus and method of this invention, it is not intended thereby to have this invention limited to or circumscribed by the specific details herein specified, in view of the fact that the apparatus of this invention may be modified according to individual preference or conditions without necessarily departing from the spirit of this disclosure and the scope of the appended claim.
We claim:
Apparatus for plating objects by gaseous metal deposition, said apparatus comprising an airtight chamber, a liquid atomizing means disposed in said chamber, said means including a nozzle comprising a tubular member through which liquid to be atomized is introduced into said chamber, said tubular member being surrounded by an outer end for discharging gas to propel a fine spray of liquid metal carbonyl into said chamber, means for supporting materials in said chamber and spaced from said nozzle for positioning material to be plated, means for heating said material which is arranged adjacent said material support and remote from said nozzle, an inlet to said chamber for introducing inert gas and disposed at one end thereof, an outlet from said chamber for removing inert gas and decomposition products from the chamber disposed at the opposite end thereof, and blower means connected with said inlet for circulating inert gas through said chamber and at a pressure above atmospheric.
References Cited in the file of this patent UNITED STATES PATENTS 2,332,309 Drummond Oct. 19, 1943 2,453,141 Lange Nov. 9, 1948 2,508,509 Germer et al. May 23, 1950 2,522,531 Mochel Sept. 19, 1950 2,576,289 Fink Nov. 27, 1951 2,602,033 Lander July 1, 1952 2,619,433 Davis et a1 Nov. 25, 1952 2,649,754 Davis et al. Aug. 25, 1953
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US313738A US2728321A (en) | 1949-07-14 | 1952-10-08 | Apparatus for gas plating |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US104754A US2619433A (en) | 1949-07-14 | 1949-07-14 | Method of gas plating |
| US313738A US2728321A (en) | 1949-07-14 | 1952-10-08 | Apparatus for gas plating |
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| Publication Number | Publication Date |
|---|---|
| US2728321A true US2728321A (en) | 1955-12-27 |
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ID=26801893
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US313738A Expired - Lifetime US2728321A (en) | 1949-07-14 | 1952-10-08 | Apparatus for gas plating |
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| Country | Link |
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| US (1) | US2728321A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3326178A (en) * | 1963-09-12 | 1967-06-20 | Angelis Henry M De | Vapor deposition means to produce a radioactive source |
| WO1998014633A1 (en) * | 1996-10-03 | 1998-04-09 | Emcore Corporation | Liquid vaporizer system and method |
| US5835677A (en) * | 1996-10-03 | 1998-11-10 | Emcore Corporation | Liquid vaporizer system and method |
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| US2332309A (en) * | 1940-05-20 | 1943-10-19 | Ohio Commw Eng Co | Gaseous metal deposition |
| US2453141A (en) * | 1945-08-07 | 1948-11-09 | Lange Werner | Holding fixture for coating optical elements |
| US2508509A (en) * | 1945-01-13 | 1950-05-23 | Bell Telephone Labor Inc | Apparatus for coating hollow objects |
| US2522531A (en) * | 1947-11-03 | 1950-09-19 | Corning Glass Works | Method of producing electrically conducting coatings on glass and mica sheets |
| US2576289A (en) * | 1949-12-02 | 1951-11-27 | Ohio Commw Eng Co | Dynamic pyrolytic plating process |
| US2602033A (en) * | 1950-01-18 | 1952-07-01 | Bell Telephone Labor Inc | Carbonyl process |
| US2619433A (en) * | 1949-07-14 | 1952-11-25 | Ohio Commw Eng Co | Method of gas plating |
| US2649754A (en) * | 1949-07-14 | 1953-08-25 | Ohio Commw Eng Co | Apparatus for plating metal objects |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2332309A (en) * | 1940-05-20 | 1943-10-19 | Ohio Commw Eng Co | Gaseous metal deposition |
| US2508509A (en) * | 1945-01-13 | 1950-05-23 | Bell Telephone Labor Inc | Apparatus for coating hollow objects |
| US2453141A (en) * | 1945-08-07 | 1948-11-09 | Lange Werner | Holding fixture for coating optical elements |
| US2522531A (en) * | 1947-11-03 | 1950-09-19 | Corning Glass Works | Method of producing electrically conducting coatings on glass and mica sheets |
| US2619433A (en) * | 1949-07-14 | 1952-11-25 | Ohio Commw Eng Co | Method of gas plating |
| US2649754A (en) * | 1949-07-14 | 1953-08-25 | Ohio Commw Eng Co | Apparatus for plating metal objects |
| US2576289A (en) * | 1949-12-02 | 1951-11-27 | Ohio Commw Eng Co | Dynamic pyrolytic plating process |
| US2602033A (en) * | 1950-01-18 | 1952-07-01 | Bell Telephone Labor Inc | Carbonyl process |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3326178A (en) * | 1963-09-12 | 1967-06-20 | Angelis Henry M De | Vapor deposition means to produce a radioactive source |
| WO1998014633A1 (en) * | 1996-10-03 | 1998-04-09 | Emcore Corporation | Liquid vaporizer system and method |
| US5835677A (en) * | 1996-10-03 | 1998-11-10 | Emcore Corporation | Liquid vaporizer system and method |
| US5835678A (en) * | 1996-10-03 | 1998-11-10 | Emcore Corporation | Liquid vaporizer system and method |
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