US2700628A - Soldering flux - Google Patents
Soldering flux Download PDFInfo
- Publication number
- US2700628A US2700628A US260574A US26057451A US2700628A US 2700628 A US2700628 A US 2700628A US 260574 A US260574 A US 260574A US 26057451 A US26057451 A US 26057451A US 2700628 A US2700628 A US 2700628A
- Authority
- US
- United States
- Prior art keywords
- weight
- ester type
- alcohol
- ammonium bromide
- rosin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title claims description 18
- 230000004907 flux Effects 0.000 title description 18
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 150000002148 esters Chemical class 0.000 claims description 14
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 claims description 13
- 229940072049 amyl acetate Drugs 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 230000009972 noncorrosive effect Effects 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 9
- 239000005028 tinplate Substances 0.000 claims description 9
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 claims description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 17
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 17
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 17
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229910001369 Brass Inorganic materials 0.000 description 8
- 239000010951 brass Substances 0.000 description 8
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- VUFOSBDICLTFMS-UHFFFAOYSA-M ethyl-hexadecyl-dimethylazanium;bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)CC VUFOSBDICLTFMS-UHFFFAOYSA-M 0.000 description 5
- -1 halide salts Chemical class 0.000 description 4
- LIAWOTKNAVAKCX-UHFFFAOYSA-N hydrazine;dihydrochloride Chemical compound Cl.Cl.NN LIAWOTKNAVAKCX-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 125000001453 quaternary ammonium group Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical compound Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 3
- 239000001096 (4-ethenyl-1-azabicyclo[2.2.2]octan-7-yl)-(6-methoxyquinolin-4-yl)methanol hydrochloride Substances 0.000 description 3
- NNKXWRRDHYTHFP-HZQSTTLBSA-N (r)-[(2s,4s,5r)-5-ethenyl-1-azabicyclo[2.2.2]octan-2-yl]-(6-methoxyquinolin-4-yl)methanol;hydron;dichloride Chemical compound Cl.Cl.C([C@H]([C@H](C1)C=C)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OC)C=C21 NNKXWRRDHYTHFP-HZQSTTLBSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 229960003707 glutamic acid hydrochloride Drugs 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 229960001811 quinine hydrochloride Drugs 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- LOUPRKONTZGTKE-WZBLMQSHSA-N Quinine Chemical compound C([C@H]([C@H](C1)C=C)C2)C[N@@]1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OC)C=C21 LOUPRKONTZGTKE-WZBLMQSHSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 235000001258 Cinchona calisaya Nutrition 0.000 description 1
- 208000035859 Drug effect increased Diseases 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- LOUPRKONTZGTKE-UHFFFAOYSA-N cinchonine Natural products C1C(C(C2)C=C)CCN2C1C(O)C1=CC=NC2=CC=C(OC)C=C21 LOUPRKONTZGTKE-UHFFFAOYSA-N 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- VCAVAURZPNANDQ-UHFFFAOYSA-N ethyl-hexadecyl-dimethylazanium Chemical compound CCCCCCCCCCCCCCCC[N+](C)(C)CC VCAVAURZPNANDQ-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229960000948 quinine Drugs 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Definitions
- This invention relates to soldering fluxes and more particularly to soldering fluxes adapted for use as active but non-corrosive fluxes for soft soldering on such metals as copper, brass, and tinplate.
- rosin modified maleic ester type rosins formed from the esterification of a rosinmaleic acid condensation product with a polyhydric alcohol such as glycerine, ethylene glycol, and the like, have been rendered very active for soft soldering on such metals as copper, brass, and tinplate by incorporating into a solution consisting of an organic solvent containing the aforementioned maleicised rosins, small percentages of the halide salts of quaternary ammonium bases and amine hydrohalides. It has also been found that the addition of amyl acetate has a beneficial effect The fluxes resulting are non-corrosive.
- halide salts of quaternary ammonium bases used to effect increased activity are ethyl dimethyl cetyl ammonium bromide and cetyl trimethyl ammonium bromide.
- amine hydrohalides used as activating additives are quinine hydrochloride, glutamic acid hydrochloride, and hydrazine dihydrochloride.
- organic solvents which can be used are ethyl and methyl alcohol.
- the spreading drop test is a method devised to measure the efiicacy of the soldering flux in question and it determines the area covered by the spreading of a fixed quantity of 50 Sn-50 Pb solder (about 0.5 gram) on a clean bright copper panel, on which the flux solution is brushed during seconds on a hot-plate kept at 276 C.
- the percentage figure following each ingredient refers to the weight in grams contained in 100 ml. of solution.
- the activities of maleicised 1 rosin and rosin alone are given for comparison.
- These fluxes are generally prepared as follows.
- the rosin modified maleic ester type resin is dissolved in a volume of hot alcohol of about three fourths the final volume of solution.
- the halide salts of the quaternary ammonium bases and the amine hydrohalides are added.
- the amyl acetate is added, if it is not already part of the original solvent.
- the resulting solution is made up to the desired volume with additional cold solvent.
- An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 25% by weight of a rosin modified maleic ester type resin, 1% by weight of cetyl trimethyl ammonium bromide, 10% by weight of amyl acetate and 64% by weight of alcohol.
- An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 25% by weight of a rosin modified maleic ester type resin, 1% by weight of ethyl dimethyl cetyl ammonium bromide, 10% by weight of amyl acetate and 64% by weight of alcohol.
- An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 23% by weight of a rosin modified maleic ester type resin, 2% by weight of quinine hydrochloride, 0.1% by weight of cetyl trimethyl ammonium bromide, said ingredients being dissolved in a solution comprised of alcohol and amyl acetate in a ratio of 1:1 by volume.
- An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 23% by weight of a rosin modified maleic ester type resin, 2% by weight of glutamic acid hydrochloride, 0.1% by weight of cetyl trimethyl ammonium bromide, said ingredients being dissolved in Patented Jan. 25, 1955 a solutionficomprised'of alcohol ahd amyl acetate in a ratio of, l.: 1,,by volume.
- An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 24% by weight of a rosin modified maleic ester type resin, 1% by weight of hydrazine dihydrochloride, 0.2% by weight of ethyl dimethyl cetyl ammonium bromide, 10% by weight of amyl acetate and 64.8% by weight of methyl alcohol.
- An active substantially non-corrosive soft soldering fiux for such metals as copper, brass and tin plate consisting essentially of about 2325% by weight of a rosin modified maleic ester type; resin, 0.1% to 1% by Weight of a halide salt of a quaternary ammonium base selected-from the-group-consisting -ofcetyl trimethyl-am- A monium,.br.omide and ethyl dimethyl cetyl ammonium bromidc,; 1-% :to 2%,,by weight of an aminehydrochloride w :1
- quinine hydrochloride selected efrom the group consisting of quinine hydrochloride; glutarnic acid hydrochloride and hydrazine dihydrochloride,
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
. on the fluxing activity of these compositions.
United States Patent SOLDERING. FLUX No Drawing. Application December 7, 1951, Serial No. 260,574
6 Claims. (Cl. 14823) This invention relates to soldering fluxes and more particularly to soldering fluxes adapted for use as active but non-corrosive fluxes for soft soldering on such metals as copper, brass, and tinplate.
In many instances such as in electrical instruments and appliances, there are delicate metal surfaces which require a soldering flux that will not leave a detrimentally corrosive residue.
Heretofore, it has been found that fluxes used for soft soldering in such situations have been rosin or rosin plus active additives. Alkyd resins such as rosin modified maleic ester type resins, of which the commercially made Teglac resins are examples, have been found to be the most suitable in this respect. However, these rosin fluxes leave much to be desired as far as ease in soldering is concerned.
It is an object of this invention to provide a non-corrosive flux which is more active than rosin.
It is a further object of this invention to increase the soldering activity of maleicised rosins without leaving a detrimentally corrosive residue.
Other objects and advantages of this invention will become apparent from the following specification.
In the present invention, rosin modified maleic ester type rosins, formed from the esterification of a rosinmaleic acid condensation product with a polyhydric alcohol such as glycerine, ethylene glycol, and the like, have been rendered very active for soft soldering on such metals as copper, brass, and tinplate by incorporating into a solution consisting of an organic solvent containing the aforementioned maleicised rosins, small percentages of the halide salts of quaternary ammonium bases and amine hydrohalides. It has also been found that the addition of amyl acetate has a beneficial effect The fluxes resulting are non-corrosive.
Examples of halide salts of quaternary ammonium bases used to effect increased activity are ethyl dimethyl cetyl ammonium bromide and cetyl trimethyl ammonium bromide. Examples of amine hydrohalides used as activating additives are quinine hydrochloride, glutamic acid hydrochloride, and hydrazine dihydrochloride. Examples of organic solvents which can be used are ethyl and methyl alcohol.
In the following table, instances of the compositions covered by this invention are given and there is also included therein, relative fluxing activities as determined by the spreading drop test. The spreading drop test is a method devised to measure the efiicacy of the soldering flux in question and it determines the area covered by the spreading of a fixed quantity of 50 Sn-50 Pb solder (about 0.5 gram) on a clean bright copper panel, on which the flux solution is brushed during seconds on a hot-plate kept at 276 C. The percentage figure following each ingredient refers to the weight in grams contained in 100 ml. of solution. The activities of maleicised 1 rosin and rosin alone are given for comparison.
I Area of g}? Composition Solvent 853:; (sq. in.)
I Rosin modified maleic ester type Alcohol 0.56
resin, 25%; Cetyl trimethyl ammonium bromide, 1%; Amyl acetate, 10%. H Rosinmodifiedmaleicestertype do 0.55
resin, 25%; Ethyl dimethyl cetyl ammonium bromide, 1%; Amyl acetate, 10%. III. Rosin modified maleic ester type AlcohoH-Amyl 0. 55 resin, 23%; Quinine hydroacetate (1:1 chloride, 2%; Cetyl trimethyl by vol.). ammonium bromide, 0.1%. IV Rosinmodifiedmaleicestertype do 0.44
resin, 23%; Glutamic acid hydrochloride, 2%; Cetyl triamlehyl ammonium bromide,
- 0- V Rosinmodified maleic ester type Methyl alcohoL- 0.45
resin, 24%; Hydrazine dihydrochloride, 1%; Ethyl dimethyl cetyl ammonium bromide, 0.2%; Amyl acetate,
VI Rosinmodifledmaleic ester type Alcohol 0.25
resin, 25%. VII- Rosin, 25% .-d0 0.18
These fluxes are generally prepared as follows. The rosin modified maleic ester type resin is dissolved in a volume of hot alcohol of about three fourths the final volume of solution. After the resin solution has cooled somewhat, the halide salts of the quaternary ammonium bases and the amine hydrohalides are added. Lastly, the amyl acetate is added, if it is not already part of the original solvent. The resulting solution is made up to the desired volume with additional cold solvent.
While there have been here described what at present are considered to be the preferred embodiments of the invention, it will be understood by those skilled in the art that various changes and modifications may be made herein without departing from the invention, and it is therefore aimed in the hereinafter appended claims to cover all such modifications and changes as fall within the spirit and scope of the invention.
What is claimed is:
1. An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 25% by weight of a rosin modified maleic ester type resin, 1% by weight of cetyl trimethyl ammonium bromide, 10% by weight of amyl acetate and 64% by weight of alcohol.
2. An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 25% by weight of a rosin modified maleic ester type resin, 1% by weight of ethyl dimethyl cetyl ammonium bromide, 10% by weight of amyl acetate and 64% by weight of alcohol.
An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 23% by weight of a rosin modified maleic ester type resin, 2% by weight of quinine hydrochloride, 0.1% by weight of cetyl trimethyl ammonium bromide, said ingredients being dissolved in a solution comprised of alcohol and amyl acetate in a ratio of 1:1 by volume.
4. An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 23% by weight of a rosin modified maleic ester type resin, 2% by weight of glutamic acid hydrochloride, 0.1% by weight of cetyl trimethyl ammonium bromide, said ingredients being dissolved in Patented Jan. 25, 1955 a solutionficomprised'of alcohol ahd amyl acetate in a ratio of, l.: 1,,by volume.
5. An active, substantially non-corrosive soft soldering flux for such metals as copper, brass, and tinplate consisting essentially of about 24% by weight of a rosin modified maleic ester type resin, 1% by weight of hydrazine dihydrochloride, 0.2% by weight of ethyl dimethyl cetyl ammonium bromide, 10% by weight of amyl acetate and 64.8% by weight of methyl alcohol.
6. An active substantially non-corrosive soft soldering fiux for such metals as copper, brass and tin plate consisting essentially of about 2325% by weight of a rosin modified maleic ester type; resin, 0.1% to 1% by Weight of a halide salt of a quaternary ammonium base selected-from the-group-consisting -ofcetyl trimethyl-am- A monium,.br.omide and ethyl dimethyl cetyl ammonium bromidc,; 1-% :to 2%,,by weight of an aminehydrochloride w :1
selected efrom the group consisting of quinine hydrochloride; glutarnic acid hydrochloride and hydrazine dihydrochloride,
the group consisting, of. alcohol .and .a mixture .of. alcohol 0.,
and the remainder a solvent selected from and amyl acetate.
McBride Oct. 10, McQuaid Mar. 6, Boyle J an. 31, Silman et al. Oct. 14, Strader May 24, Willard et al. Sept. 30,
FOREIGN PATENTS Great Britains Aug. 31, Great Britain Nov. 3,
Great Britainl: -Dec. 7, Great Britain Mar. 22,
Claims (1)
1. AN ACTIVE, SUBSTANTIALLY NON-CORROSIVE SOFT SOLDERING FLUX FOR SUCH METALS AS COPPER, BRASS, AND TINPLATE CONSISTING ESSENTIALLY OF ABOUT 25% BY WEIGHT OF A ROSIN MODIFIED MALEIC ESTER TYPE RESIN, 1% BY WEIGHT OF CETYL TRIMETHYL AMMONIUM BROMIDE, 10% BY WEIGHT OF AMYL ACETATE AND 64% BY WEIGHT OF ALCOHOL.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US260574A US2700628A (en) | 1951-12-07 | 1951-12-07 | Soldering flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US260574A US2700628A (en) | 1951-12-07 | 1951-12-07 | Soldering flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2700628A true US2700628A (en) | 1955-01-25 |
Family
ID=22989715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US260574A Expired - Lifetime US2700628A (en) | 1951-12-07 | 1951-12-07 | Soldering flux |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2700628A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3925112A (en) * | 1974-02-19 | 1975-12-09 | Hercules Chemical Co Inc | Solder fluxes |
| US3960614A (en) * | 1975-01-31 | 1976-06-01 | Chevron Research Company | Wax-flux composition containing a diester of sulfomaleic acid for soldering |
| US3975216A (en) * | 1975-01-31 | 1976-08-17 | Chevron Research Company | Wax-flux composition containing a diester of sulfomalic acid for soldering |
| US4092182A (en) * | 1976-06-11 | 1978-05-30 | Multicore Solders Limited | Soldering flux composition |
| US4151015A (en) * | 1977-12-02 | 1979-04-24 | Lake Chemical Company | Flux for use in soldering |
| US4194931A (en) * | 1977-05-16 | 1980-03-25 | Western Electric Co. | Soldering flux |
| US4342607A (en) * | 1981-01-05 | 1982-08-03 | Western Electric Company, Inc. | Solder flux |
| US4496098A (en) * | 1982-03-25 | 1985-01-29 | Ichiro Kawakatsu | Process for producing a tin/lead alloy solder joint with less wetting agent residue |
| US20130098506A1 (en) * | 2010-06-01 | 2013-04-25 | Yoshitaka Toyoda | Lead-free solder paste |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1929895A (en) * | 1932-02-24 | 1933-10-10 | Berry Solder Co Inc | Soldering flux |
| US1949916A (en) * | 1929-12-26 | 1934-03-06 | Grasselli Chemical Co | Soldering flux |
| GB471202A (en) * | 1936-03-03 | 1937-08-31 | Courtenay Harold Wish Edmonds | Improvements in or relating to fluxes for soldering |
| GB494906A (en) * | 1937-05-04 | 1938-11-03 | John Barnett | Improvements relating to soldering fluxes |
| US2145292A (en) * | 1936-04-01 | 1939-01-31 | Clete L Boyle | Soldering solution |
| GB557816A (en) * | 1942-05-30 | 1943-12-07 | Lucas Ltd Joseph | Improvements relating to soldering fluxes |
| US2429033A (en) * | 1942-05-30 | 1947-10-14 | Lucas Ltd Joseph | Soldering flux |
| GB599805A (en) * | 1944-11-17 | 1948-03-22 | H J Enthoven & Sons Ltd | Improvements relating to soldering |
| US2470957A (en) * | 1945-08-27 | 1949-05-24 | Battelle Memorial Institute | Soft soldering flux |
| US2612459A (en) * | 1950-06-20 | 1952-09-30 | Mccord Corp | Soldering flux |
-
1951
- 1951-12-07 US US260574A patent/US2700628A/en not_active Expired - Lifetime
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1949916A (en) * | 1929-12-26 | 1934-03-06 | Grasselli Chemical Co | Soldering flux |
| US1929895A (en) * | 1932-02-24 | 1933-10-10 | Berry Solder Co Inc | Soldering flux |
| GB471202A (en) * | 1936-03-03 | 1937-08-31 | Courtenay Harold Wish Edmonds | Improvements in or relating to fluxes for soldering |
| US2145292A (en) * | 1936-04-01 | 1939-01-31 | Clete L Boyle | Soldering solution |
| GB494906A (en) * | 1937-05-04 | 1938-11-03 | John Barnett | Improvements relating to soldering fluxes |
| GB557816A (en) * | 1942-05-30 | 1943-12-07 | Lucas Ltd Joseph | Improvements relating to soldering fluxes |
| US2429033A (en) * | 1942-05-30 | 1947-10-14 | Lucas Ltd Joseph | Soldering flux |
| GB599805A (en) * | 1944-11-17 | 1948-03-22 | H J Enthoven & Sons Ltd | Improvements relating to soldering |
| US2470957A (en) * | 1945-08-27 | 1949-05-24 | Battelle Memorial Institute | Soft soldering flux |
| US2612459A (en) * | 1950-06-20 | 1952-09-30 | Mccord Corp | Soldering flux |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3925112A (en) * | 1974-02-19 | 1975-12-09 | Hercules Chemical Co Inc | Solder fluxes |
| US3960614A (en) * | 1975-01-31 | 1976-06-01 | Chevron Research Company | Wax-flux composition containing a diester of sulfomaleic acid for soldering |
| US3975216A (en) * | 1975-01-31 | 1976-08-17 | Chevron Research Company | Wax-flux composition containing a diester of sulfomalic acid for soldering |
| US4092182A (en) * | 1976-06-11 | 1978-05-30 | Multicore Solders Limited | Soldering flux composition |
| USRE30696E (en) * | 1976-06-11 | 1981-08-04 | Multicore Solders Limited | Soldering flux composition |
| US4194931A (en) * | 1977-05-16 | 1980-03-25 | Western Electric Co. | Soldering flux |
| US4151015A (en) * | 1977-12-02 | 1979-04-24 | Lake Chemical Company | Flux for use in soldering |
| US4342607A (en) * | 1981-01-05 | 1982-08-03 | Western Electric Company, Inc. | Solder flux |
| US4496098A (en) * | 1982-03-25 | 1985-01-29 | Ichiro Kawakatsu | Process for producing a tin/lead alloy solder joint with less wetting agent residue |
| US20130098506A1 (en) * | 2010-06-01 | 2013-04-25 | Yoshitaka Toyoda | Lead-free solder paste |
| US9770786B2 (en) * | 2010-06-01 | 2017-09-26 | Senju Metal Industry Co., Ltd. | Lead-free solder paste |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102825398B (en) | A kind of flux used in conjunction with lead-free solder | |
| JP3026510B2 (en) | Rosin-free, low-VOC, flux-free soldering flux and its use | |
| US3925112A (en) | Solder fluxes | |
| US2700628A (en) | Soldering flux | |
| US3740831A (en) | Soldering fluxes | |
| CN109429491A (en) | Scaling powder and welding material | |
| US4194931A (en) | Soldering flux | |
| CN107442970A (en) | Low temperature No-clean Flux Used for Making Solder Paste and preparation method thereof | |
| US5074928A (en) | Water-soluble soldering flux | |
| US2880126A (en) | Fluxes for soldering and metal coating | |
| CN102198567A (en) | Sn-Zn-based lead-free solder paste | |
| US2733168A (en) | Tin-zinc base alloys | |
| US2238068A (en) | Solder flux | |
| US3746620A (en) | Water soluble flux composition | |
| CN110328466B (en) | Halogen-free cleaning-free soldering flux | |
| US6193812B1 (en) | Flux solution for soldering containing borneol | |
| US2291400A (en) | Solder flux | |
| TWI276703B (en) | Surface treating agent and surface treating method for tin alloy | |
| US3158120A (en) | Core solder | |
| US4180419A (en) | Solder flux | |
| US2522937A (en) | Solder flux | |
| US2978369A (en) | Soldering fluxes | |
| JPS6333196A (en) | Flux for cream solder | |
| US4496098A (en) | Process for producing a tin/lead alloy solder joint with less wetting agent residue | |
| Zhu et al. | Preparation and performance evaluation of Sn-Bi solder paste |