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US2399773A - Method of making electrical rectifiers and the like - Google Patents

Method of making electrical rectifiers and the like Download PDF

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Publication number
US2399773A
US2399773A US500959A US50095943A US2399773A US 2399773 A US2399773 A US 2399773A US 500959 A US500959 A US 500959A US 50095943 A US50095943 A US 50095943A US 2399773 A US2399773 A US 2399773A
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Prior art keywords
copper
oxide
mold
powder
layer
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US500959A
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Sidney J Waintrob
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02614—Transformation of metal, e.g. oxidation, nitridation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/01—Manufacture or treatment
    • H10D48/07—Manufacture or treatment of devices having bodies comprising cuprous oxide [Cu2O] or cuprous iodide [CuI]
    • H10D48/071—Preparation of the foundation plate, preliminary treatment oxidation of the foundation plate or reduction treatment
    • H10D48/074—Oxidation and subsequent heat treatment of the foundation plate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12146—Nonmetal particles in a component

Definitions

  • This invention relates to the production of electrical rectiers, resistances, and other Velements adapted for use in various environments in electrical devices.
  • One of the well-known types of electrical vrectiers consists of several dry metal disks of unlike metals. on'e of which has the unidirectional low-resistance path, and the other is conductive in either direction.
  • the desired oxide coating may be provided integrally with the body of the disk, thereby becoming an inseparable part of it, and may be regulated as to thickness.
  • An object of the invention is to provide means by which an oxide coating or layer may be effectively applied to the surface of a copper disk or other copper body in such a mandisk;
  • Fig. 3 is a face view of the disk, with the oxide face uppermost;
  • Fig. 4 is a sectional view through a multi-layered rectifier or resistance
  • Fig. 5 is a sectional viewrin which two of the disks are united,vwith a lead spacer interposed between them;
  • Fig. 6 shows a number of the disks united with lead spacers interposed between them.
  • a mold In the formation of a disk or other element of the character described, a mold, a simple illustrative form of which is shown at l, ls employed. Into this mold is placed copper powder in sufficient quantity to make the copper portion 2 of the disk of the required thickness. This copper powder is then tamped down lightly within the mold, and then a mixture of cupric oxide powder and copper powder, in sufficient quantity to provide an oxide layer of the requisite thickness, as indicated at 3, is placed into the mold on top of the tamped copper powder already therein. The entire mass is now compacted to conform to the interior shape of the mold or die and is heat treated in an inert atmosphere, dry nitrogen, or in a vacuum or partial vacuum, to diffuse the thereby form a bond between the layers and to sinter the copper.
  • the resultant article is as shown' in Fig. 2, where it will be seen that the same consists of a copper base layer 2 and an oxide layer 3 fused to the copper layer, and forming an integral part thereof, and extending over and completely covering one face of the base ⁇ layer, whereby an extremely satisfactory rectifier disk is the result.
  • the proportions of the cupric oxide powder and the copper powder used in said layer were approximately 55.2% cupric oxide powder, and 44.8% copper powder, to produce a cuprous oxide upon the diffusion of the two.
  • these proportions are not critical, and I have secured entirely satisfactory results with a. mixture of '10% cupric oxide powder and 30% copper-powder to produce the cuprous oxide layer, the resultant disk produced'giving extremely good rectification on tests made with an oscilloscope set at 35 volts.
  • cupric oxide powder In the production of a disk of copper provided with an integral cuprous oxide layer, I employed for the production of said layer 55.2 grams cupric oxide powder mixed with 44.8 grams copper powder. This was placed in a mold on top of copper powder previously tamped down therein, and the mold contents were then compressed at a pressure of thirty tons per square inch. The mold contents were heat treated at approximately 1025* C. for fifteen minutes in a dry nitrogen atmosphere. The specimen produced was almost homogeneous and gave good rectication. Very similar results were secured when a mixture of 70 grams of cupric oxide powder and 30 grams of copper powder were mixed and employed to l Dproduce the cuprous oxide layer.
  • the layers 2 and 3 of thev resultant product are intimately bonded into an integral whole. Due to the intimate bonding of the cuprous oxide layer with the copper layer, a much better electrical contact is secured than is possible with the employment of mechanical means for attaching the oxide disks to the copper disks. Since the thickness of the oxide layer is governed by the amount of oxideforming powder employed in the mold, the oxide layer can be made in any reasonable thickness.
  • Fig. 2 of the drawing is lllustratively shown a disk composed of a layer of copper and a layer of the oxide, the two layers being bonded as described. Since the product is produced by molding or compressing in a die and the application of heat,it will be obvious that the production of a multi-layered rod or bar adapted for use, for example, as a full-wave rectifier, is relatively simple. Such a multi-layered rod or bar is shown in Fig.
  • Fig. 5 wherein two bi-layered disks are placed with the oxide layers of each facing toward one another, with a layer of lead 4 fused between and separating the oxide layers.
  • Fig. 6 Another example is shown in Fig. 6, wherein the lead layers l are shown as being interposed between the oxide layers 3 and the copper layers 2, the entire block or rod thus formed, being fused into an integral whole.
  • a resistor consisting of a bar or rod of cuprous oxide

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)

Description

May 7, 1945A s. J. wAlNTRoB 2,399,773
METHOD OF MAKING ELECTRICAL RECTIFIERS AND THE LIKE Fi1easept-2, 194s 129.1. 1 l -Y T:LQE.
'Big5 Ncwbbm INVENToR.
Patente ay 7, i946 Sidney J. Waintrob, New York, N. Y.
Application September 2, 1943, Serial No. 500,959
(Cl. F75-366) cupric oxide and copper to cuprous oxide, to
4 Claims.
This invention relates to the production of electrical rectiers, resistances, and other Velements adapted for use in various environments in electrical devices.
One of the well-known types of electrical vrectiers consists of several dry metal disks of unlike metals. on'e of which has the unidirectional low-resistance path, and the other is conductive in either direction. One of these disks consists chiefly of copper provided on one of its faces with an oxide coating. 'Ihe present invention relates to the production of a disk of this character, and
particularly to one in which the desired oxide coating may be provided integrally with the body of the disk, thereby becoming an inseparable part of it, and may be regulated as to thickness.
An object of the invention, therefore, is to provide means by which an oxide coating or layer may be effectively applied to the surface of a copper disk or other copper body in such a mandisk;
Fig. 3 is a face view of the disk, with the oxide face uppermost;
Fig. 4 is a sectional view through a multi-layered rectifier or resistance;
Fig. 5 is a sectional viewrin which two of the disks are united,vwith a lead spacer interposed between them; and
Fig. 6 shows a number of the disks united with lead spacers interposed between them.
In the formation of a disk or other element of the character described, a mold, a simple illustrative form of which is shown at l, ls employed. Into this mold is placed copper powder in sufficient quantity to make the copper portion 2 of the disk of the required thickness. This copper powder is then tamped down lightly within the mold, and then a mixture of cupric oxide powder and copper powder, in sufficient quantity to provide an oxide layer of the requisite thickness, as indicated at 3, is placed into the mold on top of the tamped copper powder already therein. The entire mass is now compacted to conform to the interior shape of the mold or die and is heat treated in an inert atmosphere, dry nitrogen, or in a vacuum or partial vacuum, to diffuse the thereby form a bond between the layers and to sinter the copper.
The resultant article is as shown' in Fig. 2, where it will be seen that the same consists of a copper base layer 2 and an oxide layer 3 fused to the copper layer, and forming an integral part thereof, and extending over and completely covering one face of the base` layer, whereby an extremely satisfactory rectifier disk is the result.
vIn the' formation of the oxide layer 3, the proportions of the cupric oxide powder and the copper powder used in said layer were approximately 55.2% cupric oxide powder, and 44.8% copper powder, to produce a cuprous oxide upon the diffusion of the two. However, these proportions are not critical, and I have secured entirely satisfactory results with a. mixture of '10% cupric oxide powder and 30% copper-powder to produce the cuprous oxide layer, the resultant disk produced'giving extremely good rectification on tests made with an oscilloscope set at 35 volts.
In the production of a disk of copper provided with an integral cuprous oxide layer, I employed for the production of said layer 55.2 grams cupric oxide powder mixed with 44.8 grams copper powder. This was placed in a mold on top of copper powder previously tamped down therein, and the mold contents were then compressed at a pressure of thirty tons per square inch. The mold contents were heat treated at approximately 1025* C. for fifteen minutes in a dry nitrogen atmosphere. The specimen produced was almost homogeneous and gave good rectication. Very similar results were secured when a mixture of 70 grams of cupric oxide powder and 30 grams of copper powder were mixed and employed to l Dproduce the cuprous oxide layer.
By the formation of the entire disk from powder in the manner described, the layers 2 and 3 of thev resultant productare intimately bonded into an integral whole. Due to the intimate bonding of the cuprous oxide layer with the copper layer, a much better electrical contact is secured than is possible with the employment of mechanical means for attaching the oxide disks to the copper disks. Since the thickness of the oxide layer is governed by the amount of oxideforming powder employed in the mold, the oxide layer can be made in any reasonable thickness.
In Fig. 2 of the drawing is lllustratively shown a disk composed of a layer of copper and a layer of the oxide, the two layers being bonded as described. Since the product is produced by molding or compressing in a die and the application of heat,it will be obvious that the production of a multi-layered rod or bar adapted for use, for example, as a full-wave rectifier, is relatively simple. Such a multi-layered rod or bar is shown in Fig. 4, wherein layers of oxide 3 alternate with the copper layers 2, the entire `rod or bar being integral and being produced by placing copper powder in the mold and tamping it; then placing therein a mixture of cupric oxide and copper powder in the proportions described and tampingit; then placing a second quantity of copper powder in the mold and tamping it; and then another layer of the mixture of cupric powder and copper powder. This continues until the requisite number of layers have been placed in the mold. The batch therein is then heated, as previously described, and the result is a rod or bar, as shown in Fig. 4.
In certain types of rectiilers or resistances, it l may be found desirable to interpose separators between the'copper-oxide disks. An example is shown in Fig. 5, wherein two bi-layered disks are placed with the oxide layers of each facing toward one another, with a layer of lead 4 fused between and separating the oxide layers. Another example is shown in Fig. 6, wherein the lead layers l are shown as being interposed between the oxide layers 3 and the copper layers 2, the entire block or rod thus formed, being fused into an integral whole.
While I have herein set forth the product formed by following the process herein described as being especially adapted for use as a rectifier or resistance, it is understood that the product may be capable of many additional uses, and particularly in the electrical industry. I therefore do not wish to be understood as limiting the article to the use set forth, but wish-the invention to comprehend any uses to which an oxide-coated element of this character may be successfully adapted.
For example, in making a resistor consisting of a bar or rod of cuprous oxide, it is merely necessary to compress and heat in the manner described a mixture of the cupric oxide and copper powder, and the result is a cuprous oxide bar or rod of the desired shape and size according to the mold in which the mixture is compressed.
What I claim is:
1. The method of making asolid oxide-coated copper disk consisting in placing copper powder in a. mold and compacting the same, placing a mixture' of copper powder and cupric oxide powder in the mold on top of the rst layer, compacting the mixture, and then heating the mold contents under non-oxidizing conditions.
2. The method of making a bi-layered solid, one-piece disk consisting in placing a quantity of copper powder in a mold, compacting the same therein, placing a quantity of a mixture of cupric oxide powder and copper powder into the mold on top of the compacted copper powder previously placed therein, compressing the mold contents, and heating the mold contents ata temperature of approximately 1025 C. in a non-oxidizing atmospnere.
3. The method of making a multilayered onepiece rectifier,r resistor or the like, consisting in placing alternate layers of copper powder and mixtures of cupric oxide powder and copper powder in a'. mold, compressing the mold contents, and heating said contents under non-oxidizing conditions to thereby produce an element composed of alternate copper layers and cuprous oxide layers.
4. The method of making a solid oxide-coated body of copper consisting in placing copper powder in' a mold, placing a layer consisting of a mixture .of copper powder and cupric oxide in the mold and in contact with the powder therein, compacting the mixture, and then heating the mold contents under non-oxidizing conditions.
SIDNEY J. WAINIROB.
US500959A 1943-09-02 1943-09-02 Method of making electrical rectifiers and the like Expired - Lifetime US2399773A (en)

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2433752A (en) * 1943-01-19 1947-12-30 Hartford Nat Bank & Trust Co Blocking-layer cell
US2460334A (en) * 1946-03-27 1949-02-01 Owens Illinois Glass Co Process of making bonded structures
US2508161A (en) * 1945-11-13 1950-05-16 Westinghouse Electric Corp Rectifier element
US2559370A (en) * 1947-12-16 1951-07-03 Reidel Moises Process for the manufacture of oxide of copper rectifiers
US2725265A (en) * 1951-11-26 1955-11-29 Thompson Prod Inc Valve stem guides
US2809407A (en) * 1955-02-11 1957-10-15 Gen Motors Corp Method of making a composite metal article
US2903666A (en) * 1955-08-23 1959-09-08 Speer Carbon Company Resistors with integral molded metal terminals
US2913812A (en) * 1954-06-16 1959-11-24 Csf Manufacture of sintered cathodes
US2931966A (en) * 1955-01-14 1960-04-05 Charles F Rockey Alternating current rectifier
US3041209A (en) * 1955-06-28 1962-06-26 Gen Electric Method of making a thermionic cathode
US3087814A (en) * 1956-07-06 1963-04-30 Gen Motors Corp Friction element
US3091581A (en) * 1958-03-03 1963-05-28 Martin Marietta Corp Fissionable fuel capsules and method of manufacturing same
US3324543A (en) * 1965-03-26 1967-06-13 Charles I Mcvey Pressure bonded ceramic-to-metal gradient seals
US3762266A (en) * 1970-11-09 1973-10-02 Gould Inc Bimetal fastener
US4839138A (en) * 1987-03-16 1989-06-13 Miba Sintermetall Aktiengesellschaft Process of making a sintered molding

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2433752A (en) * 1943-01-19 1947-12-30 Hartford Nat Bank & Trust Co Blocking-layer cell
US2508161A (en) * 1945-11-13 1950-05-16 Westinghouse Electric Corp Rectifier element
US2460334A (en) * 1946-03-27 1949-02-01 Owens Illinois Glass Co Process of making bonded structures
US2559370A (en) * 1947-12-16 1951-07-03 Reidel Moises Process for the manufacture of oxide of copper rectifiers
US2725265A (en) * 1951-11-26 1955-11-29 Thompson Prod Inc Valve stem guides
US2913812A (en) * 1954-06-16 1959-11-24 Csf Manufacture of sintered cathodes
US2931966A (en) * 1955-01-14 1960-04-05 Charles F Rockey Alternating current rectifier
US2809407A (en) * 1955-02-11 1957-10-15 Gen Motors Corp Method of making a composite metal article
US3041209A (en) * 1955-06-28 1962-06-26 Gen Electric Method of making a thermionic cathode
US2903666A (en) * 1955-08-23 1959-09-08 Speer Carbon Company Resistors with integral molded metal terminals
US3087814A (en) * 1956-07-06 1963-04-30 Gen Motors Corp Friction element
US3091581A (en) * 1958-03-03 1963-05-28 Martin Marietta Corp Fissionable fuel capsules and method of manufacturing same
US3324543A (en) * 1965-03-26 1967-06-13 Charles I Mcvey Pressure bonded ceramic-to-metal gradient seals
US3762266A (en) * 1970-11-09 1973-10-02 Gould Inc Bimetal fastener
US4839138A (en) * 1987-03-16 1989-06-13 Miba Sintermetall Aktiengesellschaft Process of making a sintered molding

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