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US2171697A - Alloy - Google Patents

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Publication number
US2171697A
US2171697A US260745A US26074539A US2171697A US 2171697 A US2171697 A US 2171697A US 260745 A US260745 A US 260745A US 26074539 A US26074539 A US 26074539A US 2171697 A US2171697 A US 2171697A
Authority
US
United States
Prior art keywords
alloy
copper
silver
magnesium
alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US260745A
Inventor
Franz R Hensel
Earl I Larsen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Duracell Inc USA
Original Assignee
PR Mallory and Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PR Mallory and Co Inc filed Critical PR Mallory and Co Inc
Priority to US260745A priority Critical patent/US2171697A/en
Application granted granted Critical
Publication of US2171697A publication Critical patent/US2171697A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/222Non-consumable electrodes
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00Metal working
    • Y10S29/027Method or apparatus using magnesium

Definitions

  • the object of the invention is to produce an improved copper base alloy.
  • Another object is to produce a copper-magnesium alloy of comparatively low magnesium content, which can be hardened by means of the addition of a small percentage of silver, to a higher degree than has heretofore been possible.
  • Another object is to produce a copper alloy which has an excellent combination of hardness, electrical conductivity, resistance to annealin and resistance to scaling.
  • Specific objects are the provision of improved copper-silver-magnesium. alloys, especially suitable for fabrication into current carrying members, electrical contactors, welding eletrodes, current carrying bearings, soldering irons, retainer rings, pole shaders, collector rings, small gears,
  • switch blades circuit breaker parts, internal combustion engine parts, turbine blades, parts which have to withstand oxidation and in general, parts which have to combine high thermal conductivity i with high strength.
  • the present invention comprises a combination of elements, methods of manufacture and the product thereof, brought out and exemplified inthe disclosure hereinafter set forth, the scope of the invention being indicated in the appended claims.
  • an alloy is made containing copper, silver and magnesium, in the following proportions:
  • .tin, lead, thorium, uranium, lithium, phosphorus, vanadium, arsenic,.selen'ium, tellurium, manga- (nese, iron, cobalt, nickel, and chromium, can be improved by the addition of silver, in substantially the proportions indicated above.
  • a coppermagnesium alloy may first be made according to the conventional alloy making procedure of the prior art, and then the silver may be added. After the alloy has been prepared according to such alloying methods as described above, also a heat treatment may be applied to the alloys, consisting either in a quenching and subsequent aging operation, with or without intermediate working, or in a quenching operation only, or in an aging operation only. The quenching operations may be carried out at temperatures above 500 degrees C. and the drawing operations at temperatures.
  • Both magnesium and silver have a solid solubility in copper, which decreases with temperature and therefore the alloys of the present 1nticularly as far as thermal and electrical conductivity are concerned.
  • Copper-magnesium-silver alloys provide new materials which'will' retain their properties even at elevated temperatures.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Contacts (AREA)
  • Manufacture Of Switches (AREA)

Description

Patented Sept. 5, E939 LHLGQT ALLOY Franz it. Home! and Earl I. Larsen,'lndianapolis,
Inch, assignors to P. R. Mallory & 00., Inc., Indianapolis, Ind., a corporation of Delaware No Drawing. Application March 9, 1939, Serial No: 260,745
3 Claims.
This inventionrelates to alloys, and more particularly copper alloys of improved characteris= tics.
The object of the invention is to produce an improved copper base alloy.
Another object is to produce a copper-magnesium alloy of comparatively low magnesium content, which can be hardened by means of the addition of a small percentage of silver, to a higher degree than has heretofore been possible.
Another object is to produce a copper alloy which has an excellent combination of hardness, electrical conductivity, resistance to annealin and resistance to scaling. r Specific objects are the provision of improved copper-silver-magnesium. alloys, especially suitable for fabrication into current carrying members, electrical contactors, welding eletrodes, current carrying bearings, soldering irons, retainer rings, pole shaders, collector rings, small gears,
switch blades, circuit breaker parts, internal combustion engine parts, turbine blades, parts which have to withstand oxidation and in general, parts which have to combine high thermal conductivity i with high strength.
Other objects of the invention will be apparent from the following description, taken in connection with the appended claims.
The present invention comprises a combination of elements, methods of manufacture and the product thereof, brought out and exemplified inthe disclosure hereinafter set forth, the scope of the invention being indicated in the appended claims.
While a preferred embodiment of the invention is described herein, it is contemplated that considerable variation may be made inthe method of procedure and the combination of elements, without departing from the spirit of the invention.
According to the preferred method of carrying out the present invention, an alloy is made containing copper, silver and magnesium, in the following proportions:
Per cent Silver .05 to 15 Magnesium .05 to 3 Copper Substantially the balance It is likewise possible to improve the characteristics of other copper-magnesium alloys, containing small percentages of additionalingrediients, by the addition of silver. Thus, coppermagnesium alloys, containing small proportions of beryllium, calcium; zinc, cadmium, indium, boron, aluminum, silicon, titanium, zirconium,
.tin, lead, thorium, uranium, lithium, phosphorus, vanadium, arsenic,.selen'ium, tellurium, manga- (nese, iron, cobalt, nickel, and chromium, can be improved by the addition of silver, in substantially the proportions indicated above.
A number of preferred compositions are given below:
' The above compositions are given by way of example only and we have found that a large number of variations can be made, producing desirable results within the composition range specifled. 85 In carrying out the present invention, a coppermagnesium alloy may first be made according to the conventional alloy making procedure of the prior art, and then the silver may be added. After the alloy has been prepared according to such alloying methods as described above, also a heat treatment may be applied to the alloys, consisting either in a quenching and subsequent aging operation, with or without intermediate working, or in a quenching operation only, or in an aging operation only. The quenching operations may be carried out at temperatures above 500 degrees C. and the drawing operations at temperatures.
below 500,
Both magnesium and silver have a solid solubility in copper, which decreases with temperature and therefore the alloys of the present 1nticularly as far as thermal and electrical conductivity are concerned.
Copper-magnesium-silver alloys provide new materials which'will' retain their properties even at elevated temperatures. 1
If these materials are being used for contactor contacts, they will show a longer life than materials of the prior art andmore particularly copper, and they can be operated under more severe electrical loads, without causing fusing and stick-- ing. At the same time, the contactresistance will remain low. 's
While the present. invention as to its objects and advantages has been described herein, as carried out in specific embodiments thereof, it is not desired to be limited thereby, but it is intended to cover the inv'ention broadly, within the spiri and scope or the appended claims.
What is claimed is: 1. An alloy containing about .05 to 3% magnesium, .05 to 15% silver and the remainder cop- 2. An alloy containing about .5 to 2% magnesium, ;05 to 2% silver and the remainder copper.
3. An alloy containing about .1 to 2% magnesium, 1 to 6% silver and the remainder copper.
EARL I. LABBEN.
US260745A 1939-03-09 1939-03-09 Alloy Expired - Lifetime US2171697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US260745A US2171697A (en) 1939-03-09 1939-03-09 Alloy

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Application Number Priority Date Filing Date Title
US260745A US2171697A (en) 1939-03-09 1939-03-09 Alloy

Publications (1)

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US2171697A true US2171697A (en) 1939-09-05

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482423A (en) * 1947-03-12 1949-09-20 Chapman Valve Mfg Co Copper base alloy
US3067027A (en) * 1960-10-06 1962-12-04 Owens Illinois Glass Co Copper base alloy
US3250849A (en) * 1962-08-14 1966-05-10 Morgan Refractories Ltd Electrical connection
DE977469C (en) * 1949-11-16 1966-07-14 Kurt Dr-Ing Dies Use of copper and nickel alloys for sliding purposes
US3463892A (en) * 1966-06-29 1969-08-26 Allis Chalmers Mfg Co Contact supporting stud and method for making the same
DE2007516A1 (en) * 1969-02-24 1970-10-08
US3988176A (en) * 1973-08-04 1976-10-26 Hitachi Shipbuilding And Engineering Co., Ltd. Alloy for mold
US4305762A (en) * 1980-05-14 1981-12-15 Olin Corporation Copper base alloy and method for obtaining same
DE3530736A1 (en) * 1984-08-31 1986-03-06 Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo CONDUCTOR MATERIAL ON COPPER BASE FOR CONNECTIONS OF SEMICONDUCTOR DEVICES
US6241831B1 (en) 1999-06-07 2001-06-05 Waterbury Rolling Mills, Inc. Copper alloy
US20140007412A1 (en) * 2010-12-31 2014-01-09 Korea Aerospace Research Institute Method for manufacturing inner structure of regenerative cooling type combustion chamber

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2482423A (en) * 1947-03-12 1949-09-20 Chapman Valve Mfg Co Copper base alloy
DE977469C (en) * 1949-11-16 1966-07-14 Kurt Dr-Ing Dies Use of copper and nickel alloys for sliding purposes
US3067027A (en) * 1960-10-06 1962-12-04 Owens Illinois Glass Co Copper base alloy
US3250849A (en) * 1962-08-14 1966-05-10 Morgan Refractories Ltd Electrical connection
US3463892A (en) * 1966-06-29 1969-08-26 Allis Chalmers Mfg Co Contact supporting stud and method for making the same
DE2007516A1 (en) * 1969-02-24 1970-10-08
US3988176A (en) * 1973-08-04 1976-10-26 Hitachi Shipbuilding And Engineering Co., Ltd. Alloy for mold
US4305762A (en) * 1980-05-14 1981-12-15 Olin Corporation Copper base alloy and method for obtaining same
DE3530736A1 (en) * 1984-08-31 1986-03-06 Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo CONDUCTOR MATERIAL ON COPPER BASE FOR CONNECTIONS OF SEMICONDUCTOR DEVICES
US6241831B1 (en) 1999-06-07 2001-06-05 Waterbury Rolling Mills, Inc. Copper alloy
US6689232B2 (en) 1999-06-07 2004-02-10 Waterbury Rolling Mills Inc Copper alloy
US20140007412A1 (en) * 2010-12-31 2014-01-09 Korea Aerospace Research Institute Method for manufacturing inner structure of regenerative cooling type combustion chamber

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