US2171697A - Alloy - Google Patents
Alloy Download PDFInfo
- Publication number
- US2171697A US2171697A US260745A US26074539A US2171697A US 2171697 A US2171697 A US 2171697A US 260745 A US260745 A US 260745A US 26074539 A US26074539 A US 26074539A US 2171697 A US2171697 A US 2171697A
- Authority
- US
- United States
- Prior art keywords
- alloy
- copper
- silver
- magnesium
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910045601 alloy Inorganic materials 0.000 title description 14
- 239000000956 alloy Substances 0.000 title description 14
- 229910052709 silver Inorganic materials 0.000 description 10
- 239000004332 silver Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052749 magnesium Inorganic materials 0.000 description 7
- 239000011777 magnesium Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 230000000171 quenching effect Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PXRFVGHEOSGZJN-UHFFFAOYSA-N [Ag].[Cu].[Mg] Chemical compound [Ag].[Cu].[Mg] PXRFVGHEOSGZJN-UHFFFAOYSA-N 0.000 description 2
- OWXLRKWPEIAGAT-UHFFFAOYSA-N [Mg].[Cu] Chemical compound [Mg].[Cu] OWXLRKWPEIAGAT-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 241000024109 Spiris Species 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- XUZMQAJCSKCCON-UHFFFAOYSA-N calcium;zinc Chemical compound [Ca+2].[Zn] XUZMQAJCSKCCON-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- -1 manga- (nese Chemical compound 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/222—Non-consumable electrodes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/027—Method or apparatus using magnesium
Definitions
- the object of the invention is to produce an improved copper base alloy.
- Another object is to produce a copper-magnesium alloy of comparatively low magnesium content, which can be hardened by means of the addition of a small percentage of silver, to a higher degree than has heretofore been possible.
- Another object is to produce a copper alloy which has an excellent combination of hardness, electrical conductivity, resistance to annealin and resistance to scaling.
- Specific objects are the provision of improved copper-silver-magnesium. alloys, especially suitable for fabrication into current carrying members, electrical contactors, welding eletrodes, current carrying bearings, soldering irons, retainer rings, pole shaders, collector rings, small gears,
- switch blades circuit breaker parts, internal combustion engine parts, turbine blades, parts which have to withstand oxidation and in general, parts which have to combine high thermal conductivity i with high strength.
- the present invention comprises a combination of elements, methods of manufacture and the product thereof, brought out and exemplified inthe disclosure hereinafter set forth, the scope of the invention being indicated in the appended claims.
- an alloy is made containing copper, silver and magnesium, in the following proportions:
- .tin, lead, thorium, uranium, lithium, phosphorus, vanadium, arsenic,.selen'ium, tellurium, manga- (nese, iron, cobalt, nickel, and chromium, can be improved by the addition of silver, in substantially the proportions indicated above.
- a coppermagnesium alloy may first be made according to the conventional alloy making procedure of the prior art, and then the silver may be added. After the alloy has been prepared according to such alloying methods as described above, also a heat treatment may be applied to the alloys, consisting either in a quenching and subsequent aging operation, with or without intermediate working, or in a quenching operation only, or in an aging operation only. The quenching operations may be carried out at temperatures above 500 degrees C. and the drawing operations at temperatures.
- Both magnesium and silver have a solid solubility in copper, which decreases with temperature and therefore the alloys of the present 1nticularly as far as thermal and electrical conductivity are concerned.
- Copper-magnesium-silver alloys provide new materials which'will' retain their properties even at elevated temperatures.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Contacts (AREA)
- Manufacture Of Switches (AREA)
Description
Patented Sept. 5, E939 LHLGQT ALLOY Franz it. Home! and Earl I. Larsen,'lndianapolis,
Inch, assignors to P. R. Mallory & 00., Inc., Indianapolis, Ind., a corporation of Delaware No Drawing. Application March 9, 1939, Serial No: 260,745
3 Claims.
This inventionrelates to alloys, and more particularly copper alloys of improved characteris= tics.
The object of the invention is to produce an improved copper base alloy.
Another object is to produce a copper-magnesium alloy of comparatively low magnesium content, which can be hardened by means of the addition of a small percentage of silver, to a higher degree than has heretofore been possible.
Another object is to produce a copper alloy which has an excellent combination of hardness, electrical conductivity, resistance to annealin and resistance to scaling. r Specific objects are the provision of improved copper-silver-magnesium. alloys, especially suitable for fabrication into current carrying members, electrical contactors, welding eletrodes, current carrying bearings, soldering irons, retainer rings, pole shaders, collector rings, small gears,
switch blades, circuit breaker parts, internal combustion engine parts, turbine blades, parts which have to withstand oxidation and in general, parts which have to combine high thermal conductivity i with high strength.
Other objects of the invention will be apparent from the following description, taken in connection with the appended claims.
The present invention comprises a combination of elements, methods of manufacture and the product thereof, brought out and exemplified inthe disclosure hereinafter set forth, the scope of the invention being indicated in the appended claims.
While a preferred embodiment of the invention is described herein, it is contemplated that considerable variation may be made inthe method of procedure and the combination of elements, without departing from the spirit of the invention.
According to the preferred method of carrying out the present invention, an alloy is made containing copper, silver and magnesium, in the following proportions:
Per cent Silver .05 to 15 Magnesium .05 to 3 Copper Substantially the balance It is likewise possible to improve the characteristics of other copper-magnesium alloys, containing small percentages of additionalingrediients, by the addition of silver. Thus, coppermagnesium alloys, containing small proportions of beryllium, calcium; zinc, cadmium, indium, boron, aluminum, silicon, titanium, zirconium,
.tin, lead, thorium, uranium, lithium, phosphorus, vanadium, arsenic,.selen'ium, tellurium, manga- (nese, iron, cobalt, nickel, and chromium, can be improved by the addition of silver, in substantially the proportions indicated above.
A number of preferred compositions are given below:
' The above compositions are given by way of example only and we have found that a large number of variations can be made, producing desirable results within the composition range specifled. 85 In carrying out the present invention, a coppermagnesium alloy may first be made according to the conventional alloy making procedure of the prior art, and then the silver may be added. After the alloy has been prepared according to such alloying methods as described above, also a heat treatment may be applied to the alloys, consisting either in a quenching and subsequent aging operation, with or without intermediate working, or in a quenching operation only, or in an aging operation only. The quenching operations may be carried out at temperatures above 500 degrees C. and the drawing operations at temperatures.
below 500,
Both magnesium and silver have a solid solubility in copper, which decreases with temperature and therefore the alloys of the present 1nticularly as far as thermal and electrical conductivity are concerned.
Copper-magnesium-silver alloys provide new materials which'will' retain their properties even at elevated temperatures. 1
If these materials are being used for contactor contacts, they will show a longer life than materials of the prior art andmore particularly copper, and they can be operated under more severe electrical loads, without causing fusing and stick-- ing. At the same time, the contactresistance will remain low. 's
While the present. invention as to its objects and advantages has been described herein, as carried out in specific embodiments thereof, it is not desired to be limited thereby, but it is intended to cover the inv'ention broadly, within the spiri and scope or the appended claims.
What is claimed is: 1. An alloy containing about .05 to 3% magnesium, .05 to 15% silver and the remainder cop- 2. An alloy containing about .5 to 2% magnesium, ;05 to 2% silver and the remainder copper.
3. An alloy containing about .1 to 2% magnesium, 1 to 6% silver and the remainder copper.
EARL I. LABBEN.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US260745A US2171697A (en) | 1939-03-09 | 1939-03-09 | Alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US260745A US2171697A (en) | 1939-03-09 | 1939-03-09 | Alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2171697A true US2171697A (en) | 1939-09-05 |
Family
ID=22990437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US260745A Expired - Lifetime US2171697A (en) | 1939-03-09 | 1939-03-09 | Alloy |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2171697A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2482423A (en) * | 1947-03-12 | 1949-09-20 | Chapman Valve Mfg Co | Copper base alloy |
| US3067027A (en) * | 1960-10-06 | 1962-12-04 | Owens Illinois Glass Co | Copper base alloy |
| US3250849A (en) * | 1962-08-14 | 1966-05-10 | Morgan Refractories Ltd | Electrical connection |
| DE977469C (en) * | 1949-11-16 | 1966-07-14 | Kurt Dr-Ing Dies | Use of copper and nickel alloys for sliding purposes |
| US3463892A (en) * | 1966-06-29 | 1969-08-26 | Allis Chalmers Mfg Co | Contact supporting stud and method for making the same |
| DE2007516A1 (en) * | 1969-02-24 | 1970-10-08 | ||
| US3988176A (en) * | 1973-08-04 | 1976-10-26 | Hitachi Shipbuilding And Engineering Co., Ltd. | Alloy for mold |
| US4305762A (en) * | 1980-05-14 | 1981-12-15 | Olin Corporation | Copper base alloy and method for obtaining same |
| DE3530736A1 (en) * | 1984-08-31 | 1986-03-06 | Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo | CONDUCTOR MATERIAL ON COPPER BASE FOR CONNECTIONS OF SEMICONDUCTOR DEVICES |
| US6241831B1 (en) | 1999-06-07 | 2001-06-05 | Waterbury Rolling Mills, Inc. | Copper alloy |
| US20140007412A1 (en) * | 2010-12-31 | 2014-01-09 | Korea Aerospace Research Institute | Method for manufacturing inner structure of regenerative cooling type combustion chamber |
-
1939
- 1939-03-09 US US260745A patent/US2171697A/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2482423A (en) * | 1947-03-12 | 1949-09-20 | Chapman Valve Mfg Co | Copper base alloy |
| DE977469C (en) * | 1949-11-16 | 1966-07-14 | Kurt Dr-Ing Dies | Use of copper and nickel alloys for sliding purposes |
| US3067027A (en) * | 1960-10-06 | 1962-12-04 | Owens Illinois Glass Co | Copper base alloy |
| US3250849A (en) * | 1962-08-14 | 1966-05-10 | Morgan Refractories Ltd | Electrical connection |
| US3463892A (en) * | 1966-06-29 | 1969-08-26 | Allis Chalmers Mfg Co | Contact supporting stud and method for making the same |
| DE2007516A1 (en) * | 1969-02-24 | 1970-10-08 | ||
| US3988176A (en) * | 1973-08-04 | 1976-10-26 | Hitachi Shipbuilding And Engineering Co., Ltd. | Alloy for mold |
| US4305762A (en) * | 1980-05-14 | 1981-12-15 | Olin Corporation | Copper base alloy and method for obtaining same |
| DE3530736A1 (en) * | 1984-08-31 | 1986-03-06 | Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo | CONDUCTOR MATERIAL ON COPPER BASE FOR CONNECTIONS OF SEMICONDUCTOR DEVICES |
| US6241831B1 (en) | 1999-06-07 | 2001-06-05 | Waterbury Rolling Mills, Inc. | Copper alloy |
| US6689232B2 (en) | 1999-06-07 | 2004-02-10 | Waterbury Rolling Mills Inc | Copper alloy |
| US20140007412A1 (en) * | 2010-12-31 | 2014-01-09 | Korea Aerospace Research Institute | Method for manufacturing inner structure of regenerative cooling type combustion chamber |
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