US20250341017A1

US20250341017A1 - Gas atomized fluid clean of electroplating chuck in maintenance chamber

Info

Publication number: US20250341017A1
Application number: US18/656,091
Authority: US
Inventors: Benjamin Bradley; Kwan Wook Roh; Hokyung Lee; Joo Hyung Lee; Young Su Park; Gregory J. Wilson; Randy Harris
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2024-05-06
Filing date: 2024-05-06
Publication date: 2025-11-06
Also published as: US20250341018A1; WO2025235141A1

Abstract

A maintenance chamber configured to reduce contamination on an electroplating chuck, the maintenance chamber including a positioning system configured to rotate, axially move, or both rotate and axially move the electroplating chuck, and a gas atomizing nozzle, wherein the nozzle is configured to spray an atomized fluid onto the electroplating chuck, wherein the atomized fluid is configured to reduce contamination on the electroplating chuck. Further, a method for reducing contamination of an electroplating chuck inside a maintenance chamber, including placing the electroplating chuck inside the maintenance chamber, spraying the electroplating chuck with an atomized fluid from one or more nozzles, and dislodging or eroding contaminants on the electroplating chuck by mechanical interactions between atomized liquid droplets and the contaminants.

Description

BACKGROUND

Certain electroplating residues are difficult to remove from electroplating hardware and may degrade the useful life of electroplating hardware. The most common plating bath(s) chemistry which leaves a residue/contamination on chuck elastomer seals or other surfaces of chuck surfaces such as for polyether ether ketone (PEEK) retainers is Tin (Sn) or Tin-Silver (Sn/Ag). For example, Sn baths may leave residues or films on electroplating equipment. One consequence of residue (or film) is plate up onto the chuck surfaces. It is believed the residue creates a conductive film which can act as a seed layer to allow metal to plate on the chuck surfaces in addition to the wafer/workpiece. Also, if the chuck is exposed to other plating baths (i.e. copper (Cu)), the Sn bath residue can be etched off into the Cu bath causing contamination. Additionally, electroplating chemical residue can have negative impact on the electroplating process.
While methods and systems have been developed for cleaning electroplating residue, such as using a cloth or cleaning agent on an end effector of a maintenance chamber, electroplating residues may still remain, especially when the electroplating hardware has complicated geometry or components. For example, electroplating chucks may include seals, electrical contacts, or other components that are difficult to clean with conventional methods.
Accordingly, devices, systems, and methods of cleaning electroplating hardware, such as electroplating chucks, are needed.

SUMMARY

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
Disclosed herein is a maintenance chamber configured to reduce contamination on an electroplating chuck, the maintenance chamber including a positioning system configured to rotate, axially move, or both rotate and axially move the electroplating chuck, and a gas atomizing nozzle, configured to spray an atomized fluid onto the electroplating chuck, wherein the atomized fluid is configured to reduce and/or remove contamination on the electroplating chuck.
In some embodiments, the fluid comprises deionized (DI) water, a cleaning chemistry, or a combination thereof. In some embodiments, the fluid is atomized with a gas selected from dry nitrogen, compressed air, or carbon dioxide.
In some embodiments, the positioning system is configured to rotate the positioning system at a speed of about 1 RPM to 700 RPM. In some embodiments, the atomized fluid is sprayed at a volume flow rate of about 1 mL/min to about 1500 mL/min.
In some embodiments, the maintenance chamber further includes an end effector configured to carry the nozzle. In some embodiments, the nozzle is a first nozzle, and wherein the maintenance chamber further comprises a second nozzle. In some embodiments, the second nozzle is located on the end effector.
In some embodiments, the maintenance chamber includes a first wall and a second wall opposite the first wall, where the second nozzle is located on the second wall of the maintenance chamber.
In some embodiments, the nozzle is a first nozzle, and wherein the maintenance chamber further comprises a plurality of nozzles. In some embodiments, each nozzle of the plurality of nozzles is configured to target a predetermined location of the electroplating chuck.
In some embodiments, the predetermined location is selected from a seal of the chuck, a backside of the chuck, a body of the chuck, an electrical contact of the chuck, or a side of the chuck.
In some embodiments, the maintenance chamber further comprises a lid configured to prevent splash of the atomized fluid. In some embodiments, at least one nozzle of the plurality of nozzles is located on the lid. In some embodiments, the maintenance chamber is fully enclosed.
Also disclosed herein is a method for reducing contamination of an electroplating chuck inside a maintenance chamber, including placing the electroplating chuck inside the maintenance chamber, spraying the electroplating chuck with an atomized fluid from one or more nozzles, and dislodging or eroding contaminants on the electroplating chuck by mechanical interactions between atomized liquid droplets and the contaminants.
In some embodiments, the nozzle is configured to spray in a narrow spray pattern, a wide-angle spray pattern, a fan spring pattern, a ring spray pattern, or a combination thereof. In some embodiments, the nozzle is angled so that a direction of spray from the nozzle intersects with a plane of the chuck.
In some embodiments, the method further includes determining if the electroplating chuck is clean with one or more optical sensors, and, if it is determined that the electroplating chuck is not clean, directing the one or more nozzles to spray the atomized fluid toward the electroplating chuck.
In some embodiments, the method further includes repositioning the electroplating chuck inside the maintenance chamber with a positioning system. In some embodiments, the one or more nozzles are configured to dry one or more portions of the electroplating chuck after atomized fluid cleaning. In some embodiments, a separate nozzle (or tube) of the one or more nozzles is configured to deliver a high velocity stream of gas. The high velocity stream of gas may be used to dry the electroplating chuck.

DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the attendant advantages of this invention will become more readily appreciated as the same become better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

FIG. 1A is an example maintenance chamber, in accordance with the present technology;

FIG. 1B is an example electroplating chuck, in accordance with the present technology;

FIG. 1C is a cross section along line 1C of a first side of FIG. 1B, in accordance with the present technology;

FIGS. 2A-2C are example maintenance chambers, in accordance with the present technology;

FIG. 3 is an example maintenance chamber with a lid, in accordance with the present technology;

FIGS. 4A-4E are example nozzles, in accordance with the present technology;

FIG. 5 is an example method of reducing contamination of an electroplating chuck inside a maintenance chamber, in accordance with the present technology; and

FIG. 6 is another example method of reducing contamination of an electroplating chuck inside a maintenance chamber.

DETAILED DESCRIPTION

Illustrated and described herein are devices, systems, and methods for reducing contamination of an electroplating chuck inside a maintenance chamber. In some embodiments, the electroplating chuck may include multiple components, such as a body, an elastomer liquid seal (or “seal”), and electrical contacts. In some embodiments, the maintenance chamber includes one or more nozzles configured to apply fluid, gas, or gas atomized fluid to one or more components (“predetermined locations”) of the electroplating chuck. In some embodiments, the maintenance chamber further includes a positioning system, to position the electroplating chuck inside the maintenance chamber. Gas atomized fluid spray cleaning is advantageous to extend useful life of electroplating hardware due to efficacious cleaning efficiency without chemistry. Absence of chemistry may also reduce cost of equipment and cost of ownership. It also reduces risk of cleaning chemistries remaining on a chuck components and contaminating plating baths or etching subsequent workpiece seed layers. However, embodiments with a chemical fluid in the gas atomized fluid spray are feasible and appropriate if chemistry assists in cleaning efficacy.
Turning now to the figures, FIG. 1A is an example maintenance chamber 100, in accordance with the present technology. In some embodiments, the maintenance chamber 100 includes a space (or chamber) 105, a positioning system 107, a bottom 113, a first wall W1 and a second wall W2. In some embodiments, the maintenance chamber 100 further includes an end effector 111. In some embodiments, the end effector 111 holds one or more cleaning devices, such as nozzles, as described herein.
The maintenance chamber 100 is configured to hold an electroplating chuck 1000, as shown and described in detail in FIGS. 1B-1C. In some embodiments, the electroplating chuck 1000 includes a base 1011, and a holder 1005 configured to retain a wafer. In some embodiments, the electroplating chuck 1000 has a first side S1 and a second side S2 opposite the first side S1. The electroplating chuck 1000 also has a backside BS. In some embodiments, the maintenance chamber 100 is configured to open the wafer chuck into an upper half and a lower half. This may be used to place and remove a wafer into the chuck. By opening the electroplating chuck (as shown in FIGS. 1A-1C), the maintenance chamber may better access portions of the electroplating chuck to clean portions of the electroplating chuck.
In some embodiments, the positioning system 107 is a platform configured to hold the electroplating chuck 1000. The positioning system 107 may spin and/or move axially to position the electroplating chuck 1000 in proximity with the end effector 111. In some embodiments, the end effector 111 can be moved to different radial position.
FIG. 1B is an example electroplating chuck 1000, in accordance with the present technology. In some embodiments, the electroplating chuck 1000 includes a wafer backplate 1015 and a vacuum plate 1200 configured to hold a wafer, a seal 1005, a side S, and a backside BS. One skilled in the art should recognize that the first side S1 and the second side S2 of FIG. 1A represent orientations of the electroplating chuck 1000, but as the electroplating chuck 1000 is substantially cylindrical, both the first side S1 and the second side S2 may be two locations on a single, continuous side S of the electroplating chuck 1000. In some embodiments, the locations of the first side S1 and the second side S2 may be 180° apart.
In some embodiments, a wafer (such as wafer W in FIG. 1C) is retained by a wafer backplate 1015 and further held in place with the seal 1005. The chuck may retain the wafer by forming a vacuum seal between the wafer, the vacuum plate 1200, the seal 1005, and the wafer backplate 1015. In some embodiments, the seal 1005 is an elastomer liquid seal. In some embodiments, contamination may build up on the seal 1005, the backside BS, the holder 1015, and/or the side S of the electroplating chuck 1000.
FIG. 1C is a cross section along line 1C of a first side S1 of FIG. 1B, in accordance with the present technology. While only the first side S1 is shown, it should be understood that the first side S1 and the second side S2 may have similar or identical components. As is shown in FIG. 1C, in some embodiments, the electroplating chuck 1000 a seal 1005, a first side Sla backside BS, and one or more electrical contacts (or “contacts”) 1007. In some embodiments, the chuck 1000 further includes a first set of magnets 1010 a second set of magnets 1012. In some embodiments, the first set of magnets 1010 and the second set of magnets 1012 are configured to interact to hold the electroplating chuck 1000 together. In some embodiments, the electroplating chuck 1000 is configured to hold a wafer W.
In some embodiments, the contacts 1007 and the seal 1005 are configured to be in contact with the wafer W.
FIGS. 2A-2C are example maintenance chambers 200, in accordance with the present technology. In some embodiments, the maintenance chamber 200 includes an end effector 211, one or more optical sensors 219, a positioning system 207 configured to rotate, axially move, or both rotate and axially move an electroplating chuck 2000.
In some embodiments, the positioning system 207 is a platform configured to hold the electroplating chuck 2000. The positioning system 207 may spin and/or move axially to position the electroplating chuck 2000 in proximity with the end effector 211 and/or nozzle 203. In some embodiments, the positioning system 207 is configured to rotate the electroplating chuck as one or more nozzles (such as nozzle 203 in FIG. 2A, first nozzle 203A, second nozzle 203B in FIG. 2B, and/or plurality of nozzles 203A, 203B, 203C in FIG. 2C) sprays atomized fluid CF. In some embodiments, the positioning system 207 is configured to rotate the electroplating chuck 2000 at a speed of about 1 RPM to 700 RPM.
In some embodiments, the one or more nozzles ((such as nozzle 203 in FIG. 2A, first nozzle 203A, second nozzle 203B in FIG. 2B, and/or plurality of nozzles 203A, 203B, 203C in FIG. 2C) are configured to dry one or more portions of the electroplating chuck after atomized fluid cleaning. In some embodiments, a separate nozzle (or tube) of the one or more nozzles is configured to deliver a high velocity stream of gas. The high velocity stream of gas may be used to dry the electroplating chuck. Advantageously, drying the wafer after spraying the atomized cleaning fluid and especially wafer contacts prevents wetting a seed layer on the next wafer, and potentially etching the seed layer.
In some embodiments, the end effector 211 is configured to move to different radial positions. For example, the end effector 211 may reposition the one or more nozzles (such as nozzle 203 in FIG. 2A, first nozzle 203A, second nozzle 203B in FIG. 2B, and/or plurality of nozzles 203A, 203B, 203C in FIG. 2C) as the nozzle is rotated, to ensure that all surfaces of the electroplating chuck are cleaned. In some embodiments, the nozzle cleaning coverage is a path 2 mm wide so multiple rotations with the nozzle moved with the end effector 111 may be needed to clean the whole surface.
In some embodiments, the one or more optical sensors 219 are selected from one or more cameras, one or more light-emitting diode (LED) sensors, lasers including laser intensity detectors, or a combination thereof. In some embodiments, the one or more optical sensors 219 are configured to determine if the electroplating chuck 2000 has been cleaned. In some embodiments, if it is determined that the electroplating chuck is not clean, one or more nozzles (such as nozzle 203 in FIG. 2A, first nozzle 203A, second nozzle 203B in FIG. 2B, and/or plurality of nozzles 203A, 203B, 203C in FIG. 2C) to spray atomized fluid CF toward the electroplating chuck 2000. In some embodiments, the fluid includes deionized (DI) water. In some embodiments, the fluid includes a cleaning chemistry. As used herein, a cleaning chemistry is a cleaning composition such as sulfuric acid, carbonic acid, sulfamic acid, and the like. In some embodiments, the fluid is atomized with a gas selected from dry nitrogen, compressed air, or carbon dioxide. In some embodiments, the atomized fluid CF is sprayed at a volume flow rate of about 1 mL/min to about 1500 mL/min. In some embodiments, a wall (shown as a triangular shaped wall above W1 and W2 in FIGS. 2A-2C) is a movable wall that is lowered to allow placement of the electroplating chuck 2000. In some embodiments, the wall is raised during cleaning to contain mist/splash/etc.)
In some embodiments, the maintenance chamber 200 further includes a chamber 205, a bottom 213, a first wall W1, and a second wall W2 opposite the first wall W1.
In operation, the maintenance chamber 200 is configured to hold the electroplating chuck 2000. The electroplating chuck 2000 may include at least a first side S1, a second side S2 opposite the first side S1, a base 2011, a backside BS, and a seal 2005. It should be understood that electroplating chuck 2000 may be electroplating chuck 1000 as shown and described in FIGS. 1B-1C. One skilled in the art should understand components of electroplating chuck 2000 may be omitted for clarity. In some embodiments, the maintenance chamber 200 can have an exhaust of up to 200 CFM to help contain any spray from leaving the chamber area.
FIG. 2A is an example maintenance chamber having a nozzle 203. In some embodiments, the nozzle 203 is located on the end effector 211. In some embodiments, the nozzle 203 is configured to spray a fluid, gas, or gas atomized fluid (collectively, compressed fluid CF) onto the electroplating chuck 2000. In some embodiments, the nozzle 203 is configured to move about the end effector 211 (as shown by the arrow in FIG. 2A) so as to spray multiple predetermined locations of electroplating chuck 2000. In some embodiments, the positioning system 203 is configured to spin the electroplating chuck 2000 as the nozzle 203 sprays the electroplating chuck 2000. While an arrow is shown, it should be understood that in some embodiments, nozzle 203 is stationary.
In some embodiments, the maintenance chamber 200 further includes a first nozzle 203A and a second nozzle 203B, as shown in FIG. 2B. In some embodiments, both the first nozzle 203A and the second nozzle 203B are located on the end effector 211. In some embodiments, the first nozzle 203A is configured to spray the seal 2005 of the electroplating chuck 2000, while the second nozzle 203B is configured to spray a backside BS of the electroplating chuck 2000. It should be understood that the first nozzle 203A and the second nozzle 203B may be positioned to contact the same predetermined location or different predetermined locations of the electroplating chuck 2000. In some embodiments, the second nozzle 203B is located on the second wall W2 of the maintenance chamber from the end effector 211 (as shown by nozzle 203C in FIG. 2C). Predetermined locations of the electroplating chuck 2000 include, but are not limited to the first side S1, the second side S2, the backside, a holder (such as holder 1015), the seal 2005, one or more contacts (such as contacts 1007A, 1007B) or a combination thereof of the electroplating chuck 2000.
In some embodiments, the maintenance chamber 200 may include a plurality of nozzles 203A, 203B, 203C, as shown in FIG. 2C. In some embodiments, each nozzle of the plurality of nozzles 203A, 203B, 203C) is directed towards a different predetermined location of the electroplating chuck 2000. In some embodiments, a nozzle 203C of the plurality of nozzles 203A, 203B, 203C is located on the second wall W2 of the maintenance chamber 200 from the end effector 211.
FIG. 3 is an example maintenance chamber 300 with a lid 315, in accordance with the present technology. In some embodiments, the maintenance chamber 300 includes a chamber 305, a bottom 313, a first wall W1 a second wall W2 opposite the first wall W1, and a positioning system 307. In some embodiments, the maintenance chamber 300 further includes a lid 315. In some embodiments, the lid 315 includes one or more nozzles 303A, 303B, one or more optical sensors 319, and a handle 317.
In some embodiments, the one or more nozzles 303A, 303B are a first nozzle 303A and a second nozzle 303B. In some embodiments, the first nozzle 303A is directed towards a first side S1 of the electroplating chuck 3000 and the second nozzle 303B is directed towards a second side S2 of the electroplating chuck 3000.
In some embodiments, the positioning system 307 is a platform configured to hold the electroplating chuck 3000. The positioning system 307 may spin and/or move axially to position the electroplating chuck 3000 in proximity with the one or more nozzles 303A, 303B. In some embodiments, the positioning system 307 is configured to rotate the electroplating chuck as one or more nozzles 303A, 303B spray atomized fluid CF. In some embodiments, the positioning system 307 is configured to rotate the electroplating chuck 3000 at a speed of about 1 RPM to 700 RPM.
In some embodiments, the lid 315 is configured to rest on top of the maintenance chamber 300. In some embodiments, the lid 315 and the maintenance chamber 300 form a seal, so that the maintenance chamber 300 is fully enclosed by the lid 315. In some embodiments, “fully enclosed” means the maintenance chamber 300 and the lid 315 form an airtight seal. In operation, the lid 315 is configured to prevent splash of the atomized fluid.
FIGS. 4A-4E are example nozzles 403, in accordance with the present technology. In some embodiments, the one or more nozzle 403 may be configured to spray in a narrow spray pattern (FIG. 4A), a wide-angle spray pattern (FIG. 4B), a fan spray pattern (FIG. 4C), a ring spray pattern (FIGS. 4D-4E), or a combination thereof.
FIG. 4A shows a nozzle 403 spraying atomized fluid CF in a narrow spray pattern. In some embodiments, the narrow spray pattern includes angle A and distance B. In some embodiments, angle A is maintained throughout distance B. Beyond B, the spray may become turbulent and project out. In some embodiments, nozzle 403 includes a tip 404. As shown in FIG. 4A, the tip 404 may be rounded.
FIG. 4B shows a nozzle 403 spraying atomized fluid CF in a wide-angle spray pattern. In some embodiments, the tip 404 may be round and larger than tip 404 of FIG. 4A. In some embodiments, the atomized fluid CF extends outwards from tip 404.
FIG. 4C shows a nozzle 403 spraying atomized fluid CF in a fan spray pattern (of flat spray pattern). In some embodiments, the tip 404 may be shaped like a slit, as shown in FIG. 4C. In some embodiments, A and B are widths at distances from the tip 404. The width B is larger than width A of the spray of atomized fluid CF.
FIGS. 4D and 4E show a nozzle 403 configured to spray a ring spray pattern and spraying a ring spray pattern, respectively. In some embodiments, the nozzle 403 includes a tip 404 and a plug 406. FIG. 4E illustrates a front plan view of the nozzle 403. As shown in FIG. 4E, the spray of atomized fluid CF extends outwards from the tip 404, around the plug 406.
FIG. 5 is an example method 500 of reducing contamination of an electroplating chuck inside a maintenance chamber, in accordance with the present technology. In some embodiments, method 500 may be performed with a maintenance chamber (such as maintenance chamber 100, 200, 300). In some embodiments, the maintenance chamber includes a positioning system (such as positioning system 107, 207, 307) one or more optical sensors (such as optical sensors 219, 319), and one or more nozzles (such as nozzle 203, first nozzle 203A, second nozzle 203B, plurality of nozzles 203A, 203B, 203C, first nozzle 303A, and/or second nozzle 303B). In some embodiments, the maintenance chamber further includes a chamber (such as chamber 105, 205, 305) a first wall (such as first wall W1), and a second wall (W2). In some embodiments, the maintenance chamber may further include an end effector (such as end effector 111, 211) and/or a lid (such as lid 315).
In some embodiments, the maintenance chamber holds an electroplating chuck (such as electroplating chuck 1000, 2000, 3000). In some embodiments, the electroplating chuck includes a seal (such as seal 1005, 2005, 3005), a holder (such as holder 1015), a backside (such as backside BS), a first side (S1), a second side (S2), a base (such as base 1011, 2011, 3011), and/or one or more electrical contacts (such as contacts 1007A, 1007B).
In block 505, the electroplating chuck (or “chuck”) is placed into the maintenance chamber. In some embodiments, the electroplating chuck is placed inside the chamber and onto the positioning system.
Optionally, in block 510, the chuck is positioned with the positioning system. In some embodiments, positioning the chuck includes rotating or moving the chuck axially. In some embodiments, the positioning system is configured to spin (or rotate) the chuck, before, during, or after spraying the chuck. In some embodiments, the positioning system rotates the chuck at a speed of about 1 RPM to about 700 RPM.
In block 515, the chuck is sprayed with atomized fluid, fluid, or gas from one or more nozzles. In some embodiments, the fluid is DI water. In some embodiments, the fluid is a cleaning chemistry such as sulfuric acid, carbonic acid, sulfamic acid, and the like. In some embodiments, the atomized fluid is atomized with nitrogen, carbon dioxide, or compressed air. In some embodiments, the atomized fluid is sprayed at a volume flow rate of about 1 mL/min to about 1500 mL/min. In some embodiments, blocks 510 and 515 are performed simultaneously.
FIG. 6 is another example method 600 of reducing contamination of an electroplating chuck inside a maintenance chamber. In some embodiments, method 600 may be performed with a maintenance chamber (such as maintenance chamber 100, 200, 300). In some embodiments, the maintenance chamber includes one or more optical sensors (such as optical sensors 219, 319), and one or more nozzles (such as nozzle 203, first nozzle 203A, second nozzle 203B, plurality of nozzles 203A, 203B, 203C, first nozzle 303A, and/or second nozzle 303B). In some embodiments, the maintenance chamber further includes a chamber (such as chamber 105, 205, 305) a first wall (such as first wall W1), and a second wall (W2). In some embodiments, the maintenance chamber may further include an end effector (such as end effector 111, 211) and/or a lid (such as lid 315).
In some embodiments, the maintenance chamber holds an electroplating chuck (such as electroplating chuck 1000, 2000, 3000). In some embodiments, the electroplating chuck includes a seal (such as seal 1005, 2005, 3005), a holder (such as holder 1015), a backside (such as backside BS), a first side (S1), a second side (S2), a base (such as base 1011, 2011, 3011), and/or one or more electrical contacts (such as contacts 1007A, 1007B).
In block 605, the chuck is placed on (or in) the maintenance chamber. In some embodiments, the chuck is placed on the positioning system of the maintenance chamber.
In block 610, the chuck is positioned with the positioning system. In some embodiments, the positioning system rotates and/or moves the chuck axially.
In block 615, the chuck is sprayed with fluid, gas, or atomized fluid as described herein. In some embodiments, block 615 occurs simultaneously with block 610. In such embodiments, the chuck may be spun (or rotated) by the positioning system as the atomized fluid is sprayed onto it.
In block 620, it is determined if the chuck is clean with one or more optical sensors. In some embodiments, the one or more optical sensors are cameras, lasers, or light emitting diode (LED) optical sensors. In some embodiments, the one or more optical sensors are located on the end effector, the lid, or elsewhere on the maintenance chamber. In some embodiments, the one or more optical sensors include a laser source light and one or more light intensity sensors to detect plate up metal on the electroplating chuck.
At decision block 625, if the one or more optical sensors determine the chuck is not clean, the method returns to block 615. If the one or more optical sensors determine that the chuck is clean, the method proceeds to block 630.
In block 630, the one or more nozzles are turned off.
It should be understood that all methods 500, 600 should be interpreted as merely representative. In some embodiments, process blocks of all methods 500, 600 may be performed simultaneously, sequentially, in a different order, or even omitted, without departing from the scope of this disclosure.
The present application may reference quantities and numbers. Unless specifically stated, such quantities and numbers are not to be considered restrictive, but representative of the possible quantities or numbers associated with the present application. Also, in this regard, the present application may use the term “plurality” to reference a quantity or number. In this regard, the term “plurality” is meant to be any number that is more than one, for example, two, three, four, five, etc. The terms “about,” “approximately,” “near,” etc., mean plus or minus 5% of the stated value. For the purposes of the present disclosure, the phrase “at least one of A, B, and C,” for example, means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B, and C), including all further possible permutations when greater than three elements are listed.
Embodiments disclosed herein may utilize circuitry in order to implement technologies and methodologies described herein, operatively connect two or more components, generate information, determine operation conditions, control an appliance, device, or method, and/or the like. Circuitry of any type can be used. In an embodiment, circuitry includes, among other things, one or more computing devices such as a processor (e.g., a microprocessor), a central processing unit (CPU), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or the like, or any combinations thereof, and can include discrete digital or analog circuit elements or electronics, or combinations thereof.
An embodiment includes one or more data stores that, for example, store instructions or data. Non-limiting examples of one or more data stores include volatile memory (e.g., Random Access memory (RAM), Dynamic Random Access memory (DRAM), or the like), non-volatile memory (e.g., Read-Only memory (ROM), Electrically Erasable Programmable Read-Only memory (EEPROM), Compact Disc Read-Only memory (CD-ROM), or the like), persistent memory, or the like. Further non-limiting examples of one or more data stores include Erasable Programmable Read-Only memory (EPROM), flash memory, or the like. The one or more data stores can be connected to, for example, one or more computing devices by one or more instructions, data, or power buses.
In an embodiment, circuitry includes a computer-readable media drive or memory slot configured to accept signal-bearing medium (e.g., computer-readable memory media, computer-readable recording media, or the like). In an embodiment, a program for causing a system to execute any of the disclosed methods can be stored on, for example, a computer-readable recording medium (CRMM), a signal-bearing medium, or the like. Non-limiting examples of signal-bearing media include a recordable type medium such as any form of flash memory, magnetic tape, floppy disk, a hard disk drive, a Compact Disc (CD), a Digital Video Disk (DVD), Blu-Ray Disc, a digital tape, a computer memory, or the like, as well as transmission type medium such as a digital and/or an analog communication medium (e.g., a fiber optic cable, a waveguide, a wired communications link, a wireless communication link (e.g., transmitter, receiver, transceiver, transmission logic, reception logic, etc.). Further non-limiting examples of signal-bearing media include, but are not limited to, DVD-ROM, DVD-RAM, DVD+RW, DVD-RW, DVD-R, DVD+R, CD-ROM, Super Audio CD, CD-R, CD+R, CD+RW, CD-RW, Video Compact Discs, Super Video Discs, flash memory, magnetic tape, magneto-optic disk, MINIDISC, non-volatile memory card, EEPROM, optical disk, optical storage, RAM, ROM, system memory, web server, or the like.
The detailed description set forth above in connection with the appended drawings, where like numerals reference like elements, are intended as a description of various embodiments of the present disclosure and are not intended to represent the only embodiments. Each embodiment described in this disclosure is provided merely as an example or illustration and should not be construed as preferred or advantageous over other embodiments. The illustrative examples provided herein are not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Similarly, any steps described herein may be interchangeable with other steps, or combinations of steps, in order to achieve the same or substantially similar result. Generally, the embodiments disclosed herein are non-limiting, and the inventors contemplate that other embodiments within the scope of this disclosure may include structures and functionalities from more than one specific embodiment shown in the figures and described in the specification.
In the foregoing description, specific details are set forth to provide a thorough understanding of exemplary embodiments of the present disclosure. It will be apparent to one skilled in the art, however, that the embodiments disclosed herein may be practiced without embodying all the specific details. In some instances, well-known process steps have not been described in detail in order not to unnecessarily obscure various aspects of the present disclosure. Further, it will be appreciated that embodiments of the present disclosure may employ any combination of features described herein.
The present application may include references to directions, such as “vertical,” “horizontal,” “front,” “rear,” “left,” “right,” “top,” and “bottom,” etc. These references, and other similar references in the present application, are intended to assist in helping describe and understand the particular embodiment (such as when the embodiment is positioned for use) and are not intended to limit the present disclosure to these directions or locations.
The present application may also reference quantities and numbers. Unless specifically stated, such quantities and numbers are not to be considered restrictive, but exemplary of the possible quantities or numbers associated with the present application. Also, in this regard, the present application may use the term “plurality” to reference a quantity or number. In this regard, the term “plurality” is meant to be any number that is more than one, for example, two, three, four, five, etc. The term “about,” “approximately,” etc., means plus or minus 5% of the stated value. The term “based upon” means “based at least partially upon.”
The principles, representative embodiments, and modes of operation of the present disclosure have been described in the foregoing description. However, aspects of the present disclosure, which are intended to be protected, are not to be construed as limited to the particular embodiments disclosed. Further, the embodiments described herein are to be regarded as illustrative rather than restrictive. It will be appreciated that variations and changes may be made by others, and equivalents employed, without departing from the spirit of the present disclosure. Accordingly, it is expressly intended that all such variations, changes, and equivalents fall within the spirit and scope of the present disclosure as claimed.
While illustrative embodiments have been illustrated and described, it will be appreciated that various changes can be made therein without departing from the spirit and scope of the invention.

Claims

We claim:

1. A maintenance chamber configured to reduce contamination on at least a portion of an electroplating chuck, the maintenance chamber comprising:

a positioning system configured to rotate, axially move, or both rotate and axially move the electroplating chuck; and

a gas atomizing nozzle, configured to spray an atomized fluid onto the electroplating chuck, wherein the atomized fluid is configured to reduce contamination on the electroplating chuck.

2. The maintenance chamber of claim 1, wherein the fluid comprises deionized (DI) water, a cleaning chemistry, or a combination thereof.

3. The maintenance chamber of claim 1, wherein the fluid is atomized with a gas selected from dry nitrogen, compressed air, or carbon dioxide.

4. The maintenance chamber of claim 1, wherein the positioning system is configured to rotate the positioning system at a speed of about 1 RPM to 700 RPM.

5. The maintenance chamber of claim 1, wherein the atomized fluid is sprayed at a volume flow rate of about 1 mL/min to about 1500 mL/min.

6. The maintenance chamber of claim 1, further comprising an end effector configured to carry the nozzle.

7. The maintenance chamber of claim 1, wherein the nozzle is a first nozzle, and wherein the maintenance chamber further comprises a second nozzle.

8. The maintenance chamber of claim 7, wherein the second nozzle is located on the end effector.

9. The maintenance chamber of claim 8, wherein the maintenance chamber includes a first wall and a second wall opposite the first wall, and wherein the second nozzle is located on the second wall of the maintenance chamber.

10. The maintenance chamber of claim 1, wherein the nozzle is a first nozzle, and wherein the maintenance chamber further comprises a plurality of nozzles.

11. The maintenance chamber of claim 10, wherein each nozzle of the plurality of nozzles is configured to target a predetermined location of the electroplating chuck.

12. The maintenance chamber of claim 11, wherein the predetermined location is selected from a seal of the chuck, a backside of the chuck, a body of the chuck, an electrical contact of the chuck, or a side of the chuck.

13. The maintenance chamber of claim 10, wherein the maintenance chamber further comprises a lid configured to prevent splash of the atomized fluid.

14. The maintenance chamber of claim 13, wherein at least one nozzle of the plurality of nozzles is located on the lid.

15. The maintenance chamber of claim 13, wherein the maintenance chamber is fully enclosed.

16. A method for reducing contamination of an electroplating chuck inside a maintenance chamber, comprising:

placing the electroplating chuck inside the maintenance chamber;

spraying the electroplating chuck with an atomized fluid from one or more nozzles; and

dislodging or eroding contaminants on the electroplating chuck by mechanical interactions between atomized liquid droplets and the contaminants.

17. The method of claim 16, wherein the nozzle is configured to spray in a narrow spray pattern, a wide-angle spray pattern, a fan spring pattern, a ring spray pattern, or a combination thereof.

18. The method of claim 16, wherein the nozzle is angled so that a direction of spray from the nozzle intersects with a plane of the chuck.

19. The method of claim 16, wherein the method further comprises:

determining if the electroplating chuck is clean with one or more optical sensors; and

if it is determined that the electroplating chuck is not clean, directing the one or more nozzles to spray the atomized fluid toward the electroplating chuck.

20. The method of claim 16, further comprising:

drying the electroplating chuck.