US20190221266A1 - Nand flash memory with wordline voltage compensation using compensated temperature coefficients - Google Patents
Nand flash memory with wordline voltage compensation using compensated temperature coefficients Download PDFInfo
- Publication number
- US20190221266A1 US20190221266A1 US15/871,133 US201815871133A US2019221266A1 US 20190221266 A1 US20190221266 A1 US 20190221266A1 US 201815871133 A US201815871133 A US 201815871133A US 2019221266 A1 US2019221266 A1 US 2019221266A1
- Authority
- US
- United States
- Prior art keywords
- wordlines
- wordline
- flash memory
- nand flash
- compensate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3436—Arrangements for verifying correct programming or erasure
- G11C16/3454—Arrangements for verifying correct programming or for detecting overprogrammed cells
- G11C16/3459—Circuits or methods to verify correct programming of nonvolatile memory cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/14—Word line organisation; Word line lay-out
Definitions
- the present application generally relates to the NAND flash memory technical field and, more particularly, to a NAND flash memory with wordline voltage compensate.
- Flash memory is an electronic (solid-state) non-volatile computer storage medium that can be electrically erased and reprogrammed.
- the NAND flash memory is a main type of flash memory named after the NAND logic gates, it has advantages of fast programming and short erasing time.
- the NAND flash array is composed of a plurality of memory cells. Each memory cell stores a binary code 0 or 1. Several memory cells form a “word”.
- An address decoder of the NAND flash array includes n address output lines A 0 ⁇ An ⁇ 1 and 2 n decoder output lines W 0 ⁇ W 2 n ⁇ 1.
- the decoder output line Wi is called a “wordline” and corresponds to a word in the storage array.
- Basic operations to the NAND flash memory includes erase operation, program operation and read operation.
- the erase operation is operated block by block, all the memory cells in the block are erased, and the data in the memory cells are 1 after erase.
- the program operation is operated page by page, whether to program the page is determined according to the input data 0 or 1. When the input data is “0”, program is performed; when the input data is “1”, program is not performed.
- Read operation is to apply a wordline voltage in the gate of the memory cell, and test the current on the memory cell, when the read current is less than a reference current, the data stored in the memory cell is determined to be “0”, and when the read current is larger than a reference current, the data stored in the memory cell is determined to be “1”.
- a threshold voltage of the memory cell of the NAND flash memory varies with temperature, which is around ⁇ 1.5 mV/° C.
- a constant voltage without varying with temperature is usually applied to the wordline. As a result, it may lead to read error, for example, “1” may be read as “0” under low temperature, and “0” may be read as “1” under high temperature.
- a temperature coefficient (Tco) describes the relative change of a physical property that is associated with a given change in temperature.
- Tco a compensate voltage with a temperature coefficient is applied to wordlines to compensate the read voltage and program verify voltage of a wordline.
- the temperature coefficient is fixed, and then the compensate voltage applied to the wordlines are fixed.
- the compensate voltage with the fixed temperature coefficient may not be suitable to all the wordlines, it may lead to over-compensate and under-compensate, which may generate error on the operation of wordlines.
- a NAND flash memory with wordline voltage compensate which may overcome or at least partially solve or mitigate above problems.
- a NAND flash memory with wordline voltage compensate comprising: a plurality of wordlines, wherein each of the plurality of wordlines corresponds to a wordline voltage with a compensated temperature coefficient, wherein the plurality of wordlines are divided into a plurality of groups, each group corresponds to the compensated temperature coefficient.
- the each wordline corresponds to a wordline address
- the groups of wordlines are divided by at least a border according to wordline addresses.
- the plurality of wordlines are divided into three groups by two borders, each of the three groups corresponds to the compensate temperature coefficient.
- the groups of wordlines are divided by zones, each zone includes at least one wordline.
- said each zone includes 16 wordlines, and four zones are applied.
- the NAND flash memory comprises power-on read blocks, the power-on read blocks store enable parameters for enabling or disabling the compensated temperature coefficient.
- the enable parameters include a border enable parameter and a zone enable parameter.
- the border enable parameter and the zone enable parameter are not enabled at a same time.
- the NAND flash memory with wordline voltage compensate are disclosed.
- the invention may achieve flexible compensate to different wordlines.
- the read voltage and program verify voltage may be more accurate, and then error may be avoided during operation of wordlines.
- FIG. 1 is a schematic diagram showing variable Tco borders according to an embodiment of the present invention.
- FIG. 2 is a schematic diagram showing variable Tco zones according to an embodiment of the present invention.
- FIG. 1 is a schematic diagram showing variable Tco borders according to an embodiment of the present invention.
- variable Tco borders which are VTCO_BD 1 and VTCO_BD 1 are disposed for setting flexible temperature coefficients.
- the two Tco borders are used to divide the wordlines into three areas according to wordline addresses.
- the wordlines under the VTCO_BD 1 which are WL 0 to WL 3 are in the first area; the wordlines between the VTCO_BD 1 and VTCO_BD 2 which are WL 4 to WL 56 are in the second area; and the wordlines above the VTCO_BD 2 which are WL 57 to WL 63 are in the third area.
- VTCO_BD 2 is large than VTCO_BD 1 .
- Which area is a wordline located may be determined by a determining procedure when the NAND flash memory is powered on. For example, in the determining procedure, a comparison is performed between the wordline address of the wordline and corresponding address scope of the border. After comparison, the area in which the wordline is located it is determined.
- Tco compensate parameter In the first area, Tco compensate parameter may be set as 0, and in the second area, Tco compensate parameter may be represented by “VTCO_SHIFT 1 ” and in the third rea, Tco compensate parameter may be represented by “VTCO_SHIFT 2 ”.
- VTCO_SHIFT 1 and VTCO_SHIFT 2 may be positive or negative, which are not limited. VTCO_SHIFT 1 and VTCO_SHIFT 2 may be determined in factory test. Hereinafter, an example for determining the Tco in factory test is illustrated.
- the Tco compensate parameter for read voltage and the Tco compensate parameter for program verify voltage of a wordline under different temperatures are tested.
- the optimum voltage V 2 at which the wordline works with best performance is tested.
- a certain temperature such as 85° C.
- a plurality of temperatures such as ⁇ 40° C., 25° C. and 85° C. are selected.
- the Tco compensate parameter under each selected temperature is calculated based on the optimum voltage V 2 and the initial voltage V 1 of the wordline.
- the function f is predetermined or fitted by parameters during test process.
- the value f(Tco) may be positive or negative, which is not illustrated thereto.
- each selected temperature corresponds to a read voltage and a program verify voltage.
- Table 1 herein below shows the parameters T 11 to T 31 under each selected temperature.
- Tco compensate parameter for parameter Program verify temperature for read voltage voltage ⁇ 40° C.
- Tco 11 Tco 12 25° C.
- Tco 21 Tco 22 85° C.
- Tco 31 Tco 32
- the Tco compensate parameters Tco 11 to Tco 32 represent the corresponding compensated temperature coefficients under each selected temperature to achieve the corresponding standard voltage.
- the Tco compensate parameter for read voltage may be the same as the Tco compensate parameter for program verify voltage.
- the Tco compensate parameters are stored in power-on read blocks 10 , which is used to store power-on boot code, of the NAND flash memory.
- the Tco compensate parameter is obtained.
- wordlines which are located close to each other have relatively less temperature coefficient difference, several wordlines may share a compensate temperature coefficient. As a result, in the embodiment wordlines within each boundary may share a compensate temperature coefficient.
- the invention achieves the function of flexible compensation, and obtains more accurate wordline voltages.
- variable Tco borders are just an example, a skilled person in the art may vary according to different situation, such as one Tco border, more than three Tco border et, al.
- the temperature coefficient compensate may be enabled or disabled.
- a border enable parameter may be stored in power-on read blocks 10 of the NAND flash memory. When it is detected the enable parameter is, for example, 0, it means the temperature coefficient compensate should be enabled. Whether to enable the temperature coefficient compensate may be set by manufacturers or users.
- variable Tco zones which are zone 0 , zone 1 , zone 2 and zone 3 are disposed for setting flexible temperature coefficients.
- Each zone is formed of 16 wordlines.
- the wordlines WL 0 to WL 15 are in zone 0 ; the wordlines WL 16 to WL 31 are in zone 1 ; the wordlines WL 32 to WL 47 are in zone 2 ; the wordlines WL 48 to WL 63 are in zone 3 .
- Tco compensate parameter may be set as 0, and in zone 2 , Tco compensate parameter may be represented by “VTCO_Z 1 ”, in zone 3 , Tco compensate parameter may be represented by “VTCO_Z 2 ”, in zone 4 , Tco compensate parameter may be represented by “VTCO_Z 3 ”.
- VTCO_Z 1 to VTCO_Z 3 may be positive or negative, which are not limited. VTCO_Z 1 and VTCO_Z 3 may be determined in factory test.
- the Tco compensate parameter for read voltage and the Tco compensate parameter for program verify voltage of a wordline under different temperatures are tested by the abovementioned way, which is not illustrated.
- Which area is a wordline located may be determined by a determining procedure when the NAND flash memory is powered on. For example, in the determining procedure, a comparison is performed between the wordline and corresponding scope of the zone. After comparison, the area in which the wordline is located it is determined.
- the temperature coefficient compensate may be enabled or disabled.
- a zone enable parameter may be stored in power-on read blocks 10 of the NAND flash memory. When it is detected the zone enable parameter is, for example, 0, it means the temperature coefficient compensate should be enabled. Whether to enable the temperature coefficient compensate may be set by manufacturers or users.
- both the zone enable parameter and the border enable parameter are stored in the power-on read blocks 10 , but they are not used at the same time.
- the invention achieves the function of flexible compensation, and obtains more accurate wordline voltages.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Read Only Memory (AREA)
Abstract
Description
- The present application generally relates to the NAND flash memory technical field and, more particularly, to a NAND flash memory with wordline voltage compensate.
- Flash memory is an electronic (solid-state) non-volatile computer storage medium that can be electrically erased and reprogrammed. The NAND flash memory is a main type of flash memory named after the NAND logic gates, it has advantages of fast programming and short erasing time.
- The NAND flash array is composed of a plurality of memory cells. Each memory cell stores a
binary code 0 or 1. Several memory cells form a “word”. An address decoder of the NAND flash array includes n address output lines A0˜An−1 and 2 n decoder output lines W0˜W2 n−1. The decoder output line Wi is called a “wordline” and corresponds to a word in the storage array. - Basic operations to the NAND flash memory includes erase operation, program operation and read operation. The erase operation is operated block by block, all the memory cells in the block are erased, and the data in the memory cells are 1 after erase. The program operation is operated page by page, whether to program the page is determined according to the
input data 0 or 1. When the input data is “0”, program is performed; when the input data is “1”, program is not performed. Read operation is to apply a wordline voltage in the gate of the memory cell, and test the current on the memory cell, when the read current is less than a reference current, the data stored in the memory cell is determined to be “0”, and when the read current is larger than a reference current, the data stored in the memory cell is determined to be “1”. - A threshold voltage of the memory cell of the NAND flash memory varies with temperature, which is around −1.5 mV/° C. In the conventional technology, when performing a read operation on the NAND flash memory, a constant voltage without varying with temperature is usually applied to the wordline. As a result, it may lead to read error, for example, “1” may be read as “0” under low temperature, and “0” may be read as “1” under high temperature.
- A temperature coefficient (Tco) describes the relative change of a physical property that is associated with a given change in temperature. In NAND flash memory, for the above reason, a compensate voltage with a temperature coefficient is applied to wordlines to compensate the read voltage and program verify voltage of a wordline. In the conventional technology, the temperature coefficient is fixed, and then the compensate voltage applied to the wordlines are fixed.
- However, the compensate voltage with the fixed temperature coefficient may not be suitable to all the wordlines, it may lead to over-compensate and under-compensate, which may generate error on the operation of wordlines.
- As an improvement, there is provided a NAND flash memory with wordline voltage compensate, which may overcome or at least partially solve or mitigate above problems.
- According to an aspect of the present invention, there is disclosed a NAND flash memory with wordline voltage compensate, comprising: a plurality of wordlines, wherein each of the plurality of wordlines corresponds to a wordline voltage with a compensated temperature coefficient, wherein the plurality of wordlines are divided into a plurality of groups, each group corresponds to the compensated temperature coefficient.
- According to an embodiment, the each wordline corresponds to a wordline address, and the groups of wordlines are divided by at least a border according to wordline addresses.
- According to an embodiment, the plurality of wordlines are divided into three groups by two borders, each of the three groups corresponds to the compensate temperature coefficient.
- According to an embodiment, the groups of wordlines are divided by zones, each zone includes at least one wordline.
- According to an embodiment, said each zone includes 16 wordlines, and four zones are applied.
- According to an embodiment, the NAND flash memory comprises power-on read blocks, the power-on read blocks store enable parameters for enabling or disabling the compensated temperature coefficient.
- According to an embodiment, the enable parameters include a border enable parameter and a zone enable parameter.
- According to an embodiment, the border enable parameter and the zone enable parameter are not enabled at a same time.
- As discussed above, in the present invention, the NAND flash memory with wordline voltage compensate are disclosed. By providing Tco border or Tco zone with respect to wordline addresses, the invention may achieve flexible compensate to different wordlines. The read voltage and program verify voltage may be more accurate, and then error may be avoided during operation of wordlines.
- The above description is merely an overview of technical solutions of the present application. In order to more clearly understand the technical solutions of the present application to implement in accordance with the contents of the description, and to make the foregoing and other objects, features and advantages of the application more apparent, detailed embodiments of the application will be provided below.
- Through reading the detailed description of the following preferred embodiments, various other advantages and benefits will become apparent to those of ordinary skills in the art. Accompanying drawings are merely included for the purpose of illustrating the preferred embodiments and should not be considered as limiting of the application. Further, throughout the drawings, like elements are indicated by like reference numbers.
-
FIG. 1 is a schematic diagram showing variable Tco borders according to an embodiment of the present invention. -
FIG. 2 is a schematic diagram showing variable Tco zones according to an embodiment of the present invention. - Exemplary embodiments of the present application will be described in detail with reference to the accompanying drawings hereinafter.
-
FIG. 1 is a schematic diagram showing variable Tco borders according to an embodiment of the present invention. - As shown in
FIG. 1 , with respect to 64 wordlines WL0 to WL63, two variable Tco borders, which are VTCO_BD1 and VTCO_BD1 are disposed for setting flexible temperature coefficients. - The two Tco borders are used to divide the wordlines into three areas according to wordline addresses. In the embodiment, the wordlines under the VTCO_BD1, which are WL0 to WL3 are in the first area; the wordlines between the VTCO_BD1 and VTCO_BD2 which are WL4 to WL56 are in the second area; and the wordlines above the VTCO_BD2 which are WL57 to WL63 are in the third area. As shown in
FIG. 2 , VTCO_BD2 is large than VTCO_BD1. - Which area is a wordline located may be determined by a determining procedure when the NAND flash memory is powered on. For example, in the determining procedure, a comparison is performed between the wordline address of the wordline and corresponding address scope of the border. After comparison, the area in which the wordline is located it is determined.
- In the first area, Tco compensate parameter may be set as 0, and in the second area, Tco compensate parameter may be represented by “VTCO_SHIFT1” and in the third rea, Tco compensate parameter may be represented by “VTCO_SHIFT2”.
- VTCO_SHIFT1 and VTCO_SHIFT2 may be positive or negative, which are not limited. VTCO_SHIFT1 and VTCO_SHIFT2 may be determined in factory test. Hereinafter, an example for determining the Tco in factory test is illustrated.
- In an embodiment, in the factory test period, the Tco compensate parameter for read voltage and the Tco compensate parameter for program verify voltage of a wordline under different temperatures are tested.
- As the first step, under a certain temperature such as 85° C., the optimum voltage V2 at which the wordline works with best performance is tested. After the optimum voltage V2 is obtained, in the second step, a plurality of temperatures, such as −40° C., 25° C. and 85° C. are selected. In the third step, the Tco compensate parameter under each selected temperature is calculated based on the optimum voltage V2 and the initial voltage V1 of the wordline. For example, the calculating formula may be: V2=V1+f(Tco). Wherein the function f is predetermined or fitted by parameters during test process. The value f(Tco) may be positive or negative, which is not illustrated thereto.
- That is, with respect to one wordline, each selected temperature corresponds to a read voltage and a program verify voltage. Table 1 herein below shows the parameters T11 to T31 under each selected temperature.
-
TABLE 1 Tco compensate Tco compensate parameter for parameter Program verify temperature for read voltage voltage −40° C. Tco11 Tco12 25° C. Tco21 Tco22 85° C. Tco31 Tco32 - The Tco compensate parameters Tco11 to Tco32 represent the corresponding compensated temperature coefficients under each selected temperature to achieve the corresponding standard voltage. To a certain temperature, the Tco compensate parameter for read voltage may be the same as the Tco compensate parameter for program verify voltage. After obtained, the Tco compensate parameters are stored in power-on read blocks 10, which is used to store power-on boot code, of the NAND flash memory.
- As a result, when the NAND flash memory is operated under certain temperature (such as 30° C. of environmental temperature), the Tco compensate parameter is obtained. As the initial voltage V1 is already obtained, the optimum V2 may be calculated according to the formula V2=V1+f(Tco) above.
- Since wordlines which are located close to each other have relatively less temperature coefficient difference, several wordlines may share a compensate temperature coefficient. As a result, in the embodiment wordlines within each boundary may share a compensate temperature coefficient.
- By compensating temperature coefficient with respect to a plurality of wordlines divided by borders, the invention achieves the function of flexible compensation, and obtains more accurate wordline voltages.
- It should be noted that, two variable Tco borders are just an example, a skilled person in the art may vary according to different situation, such as one Tco border, more than three Tco border et, al.
- Furthermore, the temperature coefficient compensate may be enabled or disabled. A border enable parameter may be stored in power-on read blocks 10 of the NAND flash memory. When it is detected the enable parameter is, for example, 0, it means the temperature coefficient compensate should be enabled. Whether to enable the temperature coefficient compensate may be set by manufacturers or users.
- As shown in
FIG. 2 , with respect to 64 wordlines WL0 to WL63, four variable Tco zones, which arezone 0, zone 1, zone 2 and zone3 are disposed for setting flexible temperature coefficients. - Each zone is formed of 16 wordlines. In the embodiment, the wordlines WL0 to WL15 are in
zone 0; the wordlines WL16 to WL31 are in zone 1; the wordlines WL32 to WL47 are in zone 2; the wordlines WL48 to WL63 are in zone 3. - In zone 1, Tco compensate parameter may be set as 0, and in zone 2, Tco compensate parameter may be represented by “VTCO_Z1”, in zone 3, Tco compensate parameter may be represented by “VTCO_Z2”, in
zone 4, Tco compensate parameter may be represented by “VTCO_Z3”. - VTCO_Z1 to VTCO_Z3 may be positive or negative, which are not limited. VTCO_Z1 and VTCO_Z3 may be determined in factory test.
- Similarly, in the factory test period, the Tco compensate parameter for read voltage and the Tco compensate parameter for program verify voltage of a wordline under different temperatures are tested by the abovementioned way, which is not illustrated.
- Which area is a wordline located may be determined by a determining procedure when the NAND flash memory is powered on. For example, in the determining procedure, a comparison is performed between the wordline and corresponding scope of the zone. After comparison, the area in which the wordline is located it is determined.
- Furthermore, the temperature coefficient compensate may be enabled or disabled. A zone enable parameter may be stored in power-on read blocks 10 of the NAND flash memory. When it is detected the zone enable parameter is, for example, 0, it means the temperature coefficient compensate should be enabled. Whether to enable the temperature coefficient compensate may be set by manufacturers or users.
- In some embodiments, both the zone enable parameter and the border enable parameter are stored in the power-on read blocks 10, but they are not used at the same time.
- As discussed above, by compensating temperature coefficient with respect to the wordlines divided by zones, the invention achieves the function of flexible compensation, and obtains more accurate wordline voltages.
- Many details are discussed in the specification provided herein. However, it should be understood that the embodiments of the disclosure may be implemented without these specific details. In some examples, the well-known methods, structures and technologies are not shown in detail so as to avoid an unclear understanding of the description.
- It should be noted that the above-described embodiments are intended to illustrate but not to limit the present application, and alternative embodiments may be devised by the person skilled in the art without departing from the scope of claims as appended. In the claims, any reference symbols between brackets form no limit of the claims. The wording “include” does not exclude the presence of elements or steps not listed in a claim. The wording “a” or “an” in front of an element does not exclude the presence of a plurality of such elements. The disclosure may be realized by means of hardware comprising a number of different components and by means of a suitably programmed computer. In the unit claim listing a plurality of devices, some of these devices may be embodied in the same hardware. The wordings “first”, “second”, and “third”, etc. do not denote any order. These wordings may be interpreted as a name.
- Also, it should be noticed that the language used in the present specification is chosen for the purpose of readability and teaching, rather than explaining or defining the subject matter of the present application. Therefore, it is obvious for an ordinary skilled person in the art that modifications and variations could be made without departing from the scope and spirit of the claims as appended. For the scope of the present application, the publication of the inventive disclosure is illustrative rather than restrictive, and the scope of the present application is defined by the appended claims.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/871,133 US10366760B1 (en) | 2018-01-15 | 2018-01-15 | NAND flash memory with worldline voltage compensation using compensated temperature coefficients |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/871,133 US10366760B1 (en) | 2018-01-15 | 2018-01-15 | NAND flash memory with worldline voltage compensation using compensated temperature coefficients |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20190221266A1 true US20190221266A1 (en) | 2019-07-18 |
| US10366760B1 US10366760B1 (en) | 2019-07-30 |
Family
ID=67213013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US15/871,133 Active US10366760B1 (en) | 2018-01-15 | 2018-01-15 | NAND flash memory with worldline voltage compensation using compensated temperature coefficients |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US10366760B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240061608A1 (en) * | 2022-08-17 | 2024-02-22 | Micron Technology, Inc. | Adaptive time sense parameters and overdrive voltage parameters for wordlines at corner temperatures in a memory sub-system |
| CN120853650A (en) * | 2025-09-22 | 2025-10-28 | 浪潮电子信息产业股份有限公司 | Firmware burning method and electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220072242A (en) | 2020-11-25 | 2022-06-02 | 삼성전자주식회사 | Method of writing data in nonvolatile memory device and nonvolatile memory device performing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7342831B2 (en) * | 2006-06-16 | 2008-03-11 | Sandisk Corporation | System for operating non-volatile memory using temperature compensation of voltages of unselected word lines and select gates |
| US9202579B2 (en) * | 2013-03-14 | 2015-12-01 | Sandisk Technologies Inc. | Compensation for temperature dependence of bit line resistance |
| US20170371559A1 (en) * | 2016-06-28 | 2017-12-28 | Sandisk Technologies Llc | Systems and Methods for Optimizing Media Read Times |
-
2018
- 2018-01-15 US US15/871,133 patent/US10366760B1/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240061608A1 (en) * | 2022-08-17 | 2024-02-22 | Micron Technology, Inc. | Adaptive time sense parameters and overdrive voltage parameters for wordlines at corner temperatures in a memory sub-system |
| US12026394B2 (en) * | 2022-08-17 | 2024-07-02 | Micron Technology, Inc. | Adaptive time sense parameters and overdrive voltage parameters for wordlines at corner temperatures in a memory sub-system |
| CN120853650A (en) * | 2025-09-22 | 2025-10-28 | 浪潮电子信息产业股份有限公司 | Firmware burning method and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| US10366760B1 (en) | 2019-07-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107452421B (en) | Solid state storage device and state prediction method thereof | |
| US7532520B2 (en) | Semiconductor memory device and control method of the same | |
| EP2471069B1 (en) | Methods, devices, and systems for dealing with threshold voltage change in memory devices | |
| US7652928B2 (en) | Semiconductor memory device and control method of the same | |
| US20090027967A1 (en) | Non-volatile memory device programming selection transistor and method of programming the same | |
| US7586790B2 (en) | Flash memory device and refresh method | |
| US7688634B2 (en) | Method of operating an integrated circuit having at least one memory cell | |
| JP2019160382A (en) | Nonvolatile semiconductor memory | |
| KR20210145073A (en) | A semiconductor device and reading method thereof | |
| KR20030009288A (en) | Flash memory with externally triggered detection and repair of leaky cells | |
| US7298654B2 (en) | Non-volatile memory device and associated method of erasure | |
| EP3244416B1 (en) | Memory and reference circuit calibration method thereof | |
| US10366760B1 (en) | NAND flash memory with worldline voltage compensation using compensated temperature coefficients | |
| US8982640B2 (en) | Method and apparatus for reducing erase disturb of memory by using recovery bias | |
| US10431312B2 (en) | Nonvolatile memory apparatus and refresh method thereof | |
| US20030016560A1 (en) | Semiconductor memory and method of driving semiconductor memory | |
| CN102110474A (en) | Device and method for erasing operation on memory integrated circuit | |
| US8385129B2 (en) | Semiconductor memory device and control method thereof | |
| US9208847B2 (en) | Memory devices with improved refreshing operations | |
| TWI740780B (en) | Semiconductor memory device and reading method | |
| US20150131374A1 (en) | Semiconductor device and operating method thereof | |
| US20120269003A1 (en) | Data decision method and memory | |
| US20080158982A1 (en) | Method and apparatus for adjusting a read reference level under dynamic power conditions | |
| JP2006294135A (en) | Semiconductor memory device | |
| JPH0863988A (en) | Semiconductor memory device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
| AS | Assignment |
Owner name: SHINE BRIGHT TECHNOLOGY LIMITED, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHEN, MINYI;REEL/FRAME:045072/0796 Effective date: 20171221 |
|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
| AS | Assignment |
Owner name: GIGADEVICE SEMICONDUCTOR (BEIJING) INC., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHINE BRIGHT TECHNOLOGY LIMITED;REEL/FRAME:049388/0882 Effective date: 20190222 Owner name: GIGADEVICE SEMICONDUCTOR (SHANGHAI) INC., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHINE BRIGHT TECHNOLOGY LIMITED;REEL/FRAME:049388/0882 Effective date: 20190222 Owner name: GIGADEVICE SEMICONDUCTOR (HEFEI) INC., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHINE BRIGHT TECHNOLOGY LIMITED;REEL/FRAME:049388/0882 Effective date: 20190222 |
|
| FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
| STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
| AS | Assignment |
Owner name: GIGADEVICE SEMICONDUCTOR INC., CHINA Free format text: CHANGE OF NAME & ADDRESS;ASSIGNOR:GIGADEVICE SEMICONDUCTOR (BEIJING) INC.;REEL/FRAME:061668/0819 Effective date: 20220729 |
|
| MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |