US20180219053A1 - Organic Light Emitting Diode Display Device - Google Patents
Organic Light Emitting Diode Display Device Download PDFInfo
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- US20180219053A1 US20180219053A1 US15/927,038 US201815927038A US2018219053A1 US 20180219053 A1 US20180219053 A1 US 20180219053A1 US 201815927038 A US201815927038 A US 201815927038A US 2018219053 A1 US2018219053 A1 US 2018219053A1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H01L27/3246—
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- H01L27/3262—
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- H01L51/0004—
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- H01L51/56—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
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- H01L27/1214—
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- H01L51/5012—
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
Definitions
- the present invention relates to an organic light emitting diode (OLED) display device.
- OLED organic light emitting diode
- the present invention relates to an OLED display device that has improved uniformity of thickness of an organic light emitting layer.
- the OLED display device is a self-luminescent device and can have a thin profile because the OLED display device does not need a backlight used for the LCD device.
- the OLED display device has advantages of excellent viewing angle and contrast ratio, low power consumption, operation in low DC voltage, fast response speed, being strong to an external impact because of its solid internal components, and wide operating temperature range.
- FIG. 1 is a plan view illustrating an OLED display device according to the related art.
- the related art OLED display device includes a plurality of pixel regions P, a first bank 30 a and 30 b separating the pixel regions P and located at a boundary portion of each pixel region P, and a second bank 50 a and 50 b exposing edges of the first bank 30 a and 30 b and located on the first bank 30 a and 30 b.
- the first bank 30 a and 30 b is divided into a first portion 30 a along a long side of the pixel region P and a second portion 30 b along a short side of the pixel region P
- the second bank 50 a and 50 b is divided into a third portion 50 a along the long side of the pixel region P and a fourth portion 50 b along the short side of the pixel region P.
- a width of the edge of the first portion 30 a is equal to that of the second portion 30 b.
- FIG. 2 is a cross-sectional view taken along a line II-II of FIG. 1
- FIG. 3 is a cross-sectional view taken along a line of FIG. 1
- FIG. 2 is a cross-sectional view of the pixel region P and the boundary portion thereof along a minor axis of the pixel region
- FIG. 3 is a cross-sectional view of the pixel region P and the boundary portion thereof along a major axis of the pixel region.
- the related art OLED display device includes a first electrode 20 in the pixel region P on a substrate 11 , the first bank 30 a and 30 b at the boundary portion of the pixel region P on the substrate 11 , the second bank 50 a and 50 b on the first bank 30 a and 30 b , and an organic light emitting layer 70 on the first electrode 20 .
- the first bank 30 a and 30 b is arranged to cover edges of the first electrode 20
- the second bank 50 a and 50 b is arranged to expose the edges of the first bank 30 a and 30 b.
- a width w 1 of an edge e 1 of the first portion 30 a is equal to a width w 2 of an edge e 2 of the second portion 30 b.
- the width w 1 of the edge e 1 of the first portion 30 a and the width w 2 of the edge e 2 of the second portion 30 b may be equally 1 um to 10 um.
- the OLED display device further includes a driving thin film transistor DTr located between the substrate 11 and the first electrode 20 and connected to the first electrode 20 .
- the organic light emitting layer 70 is laminated using a soluble process such as an inkjet printing method, a nozzle printing method or the like.
- the organic light emitting layer 70 is formed by dropping an organic light emitting material solution on the first electrode 20 and then drying the organic light emitting material solution.
- a phenomenon occurs that a thickness of an edge portion of the organic light emitting layer 70 is greater than a thickness of a center portion of the organic light emitting layer 70 in the drying process. This phenomenon is referred to as a pile-up phenomenon.
- the dropped organic light emitting material solution contacts top surfaces of the edges e 1 and e 2 of the first bank 30 a and 30 b.
- the first bank 30 a and 30 b is made of an hydrophilic inorganic material, the first bank 30 a and 30 b has a surface energy greater than that of the second bank 50 a and 50 b , and a surface tension of the organic light emitting material solution at the top surfaces of the edges e 1 and e 2 of the first bank 30 a and 30 b is reduced.
- a uniformity of thickness of the display region of the pixel region P can be improved to some extent.
- the second bank has long edge portions oriented along the long dimension of the pixel region and short edge portions oriented along the short dimension of the pixel region.
- An organic light emitting layer is on the electrode and on the first bank in the pixel region and on at least a portion of the second bank in the boundary region.
- An average height of short edge portions of the organic light emitting layer on the second bank is greater than an average height of long edge portions of the organic light emitting layer on the second bank.
- a display device comprises a plurality of pixel regions each comprising an area having a short dimension and a long dimension. Each of the pixel regions comprises an array of pixels to emit light. A plurality of boundary regions separates the pixel regions.
- the boundary regions comprise a first bank and a second bank.
- the first comprises a hydrophilic material around a perimeter of the pixel region.
- a second bank comprising a hydrophobic material on a portion of the first bank around the perimeter of the pixel region.
- the second bank has long edge portions along the long dimension and short edge portions along the short dimension. A first height of the short edge portions of the second bank is greater than a second height of the long edge portions of the second bank.
- FIG. 1 is a plan view illustrating an OLED display device according to the related art
- FIG. 2 is a cross-sectional view taken along a line II-II of FIG. 1 ;
- FIG. 3 is a cross-sectional view taken along a line of FIG. 1 ;
- FIG. 4 is a plan view illustrating an OLED display device according to an embodiment of the present invention.
- FIG. 5 is a cross-sectional view taken along a line V-V of FIG. 4 ;
- FIG. 6 is a cross-sectional view taken along a line VI-VI of FIG. 4 ;
- FIG. 7 is a cross-sectional view taken along a line VII-VII of FIG. 4 .
- FIG. 4 is a plan view illustrating an OLED display device according to an embodiment of the present invention.
- the OLED display device of the embodiment includes a plurality of pixel regions P, a first bank 130 a and 130 b in a boundary region separating the pixel regions P and located at a boundary portion of each pixel region P, and a second bank 150 a and 150 b in the boundary region not covering (e.g., exposing) edges of the first bank 130 a and 130 b and located on the first bank 130 a and 130 b .
- the edges of the first bank 130 a and 130 b not covered by the second bank 150 a and 150 b may be covered by a different layer, such as organic light emitting layer as described below.
- the first bank 130 a and 130 b and second bank 150 a and 150 b may be located around a perimeter of the pixel region P.
- the first bank 130 a and 130 b is divided into a first portion 130 a (e.g., a long edge portion) along a long side of the pixel region P and a second portion 130 b (e.g., a short edge portion) along a short side of the pixel region P, and the second bank 150 a and 150 b is divided into a third portion 150 a (e.g., a long edge portion) along the long side of the pixel region P and a fourth portion 150 b (e.g., a short edge portion) along the short side of the pixel region P.
- a width of the edge of the second portion 130 b is greater than that of the first portion 130 a.
- FIG. 5 is a cross-sectional view taken along a line V-V of FIG. 4
- FIG. 6 is a cross-sectional view taken along a line VI-VI of FIG. 4
- FIG. 7 is a cross-sectional view taken along a line VII-VII of FIG. 4
- FIG. 5 is a cross-sectional view of the pixel region P and the boundary portion thereof along a minor axis of the pixel region
- FIG. 6 is a cross-sectional view of the pixel region P and the boundary portion thereof along a major axis of the pixel region
- FIG. 7 is a cross-sectional view of the pixel region P and the boundary portion thereof with a driving thin film transistor.
- the OLED display device of the embodiment includes a first electrode 120 on or over the substrate 101 in the pixel region P and in a boundary region separating the pixel regions P, the first bank 130 a and 130 b covering edges of the first electrode 120 in the pixel region P and on the substrate 101 in a boundary region surrounding the pixel region P, the second bank 150 a and 150 b on a portion of the first bank 130 a and 130 b in the boundary region, and an organic light emitting layer 170 on the first electrode 120 and on the first bank 130 a and 130 b in the pixel region and on at least a portion of the second bank in the boundary region.
- the first bank 130 a and 130 b is arranged to cover edges of the first electrode 120
- the second bank 150 a and 150 b is arranged to not cover the edges e 1 and e 2 of the first bank 130 a and 130 b (which may be covered by a different layer such as the organic light emitting layer 170 ).
- a width w 1 of the edge e 1 of the first portion 130 a is different from a width w 2 of the edge e 2 of the second portion 130 b.
- the width w 2 of the edge e 2 of the second portion 130 b is greater than the width w 1 of the edge e 1 of the first portion 130 a.
- the width w 2 of the edge e 2 of the second portion 130 b may be about 7.5 um to about 10 um, and the width w 1 of the edge e 1 of the first portion 130 b may be about 5 um.
- the width w 2 of the edge e 2 of the second portion 130 b may be about 6 um to about 8 um, and the width w 1 of the edge e 1 of the first portion 130 b may be about 4 um.
- the width w 2 of the edge e 2 of the second portion 130 b may be about 4.5 um to about 6 um, and the width w 1 of the edge e 1 of the first portion 130 b may be about 3 um.
- the width w 2 may be in the range of 1.5-2 times the width w 1 .
- a height h 1 of the third portion 150 a is different from a height h 2 of the fourth portion 150 b.
- the height h 2 of the fourth portion 150 b is greater than the height h 1 of the third portion 150 a.
- the height h 2 of the fourth portion 150 b may be about 1.5 um to 2 um, and the height h 1 of the third portion 150 a may be about lum. In other example, the height h 2 of the fourth portion 150 b may be about 2.5 um to 3 um, and the height h 1 of the third portion 150 a may be about 2 um. Thus, for example, the height h 2 may be in the range of 1.25-2 times the height h 1 . Further, in an embodiment, the height h 2 of the fourth portion 150 b may be higher than the height h 1 of the third portion 150 a at least by 0.5 um, and the height of h 2 of the fourth portion 150 b may be 3 um or less.
- the heights h 1 and h 2 of the second bank 150 a and 150 b may be formed differently.
- the second bank 150 a and 150 b having the different heights h 1 and h 2 can be formed, and thus production process can be simplified.
- the first electrode 120 may be made of a transparent conductive material, for example, indium-tin-oxide (ITO) or indium-zinc-oxide (IZO), having a relatively greater work function to function as an anode.
- ITO indium-tin-oxide
- IZO indium-zinc-oxide
- the first bank 130 a and 130 b may be made of an inorganic material, for example, silicon oxide (SiO2) or silicon nitride (SiNx), having a hydrophilicity.
- the second bank 150 a and 150 b may be made of an organic material, for example, polyacryl, polyimide, polyamide (PA), benzocyclobutene (BCB), or phenol resin, having a hydrophobicity.
- the detailed structure of the driving thin film transistor DTr is explained with reference to FIG. 7 .
- a gate insulating layer 115 is located entirely on the substrate 101 and covers the semiconductor layer 113 .
- a gate electrode 125 is located on the gate insulating layer 115 corresponding to the first region 113 a .
- An inter-layered insulating layer 117 covers the gate electrode 125 and is entirely on the substrate 101 .
- a semiconductor contact hole 121 exposing each second region 113 b is formed in the gate insulating layer 115 and the inter-layered insulating layer 117 .
- Source and drain electrodes 133 and 136 are located on the inter-layered insulating layer 117 , are connected to the respective second regions 113 b through the respective semiconductor contact holes 121 , and are spaced apart from each other.
- the source and drain electrodes 133 and 136 , the semiconductor layer 113 , the gate electrode 125 form the driving thin film transistor DTr.
- a drain contact hole 143 exposing the drain electrode 136 is formed in the passivation layer 119 .
- the drain electrode 136 is connected to the first electrode 120 through the drain contact hole 143 .
- the organic light emitting layer 170 is located on the first electrode 120 .
- a second electrode (not shown) is located on the organic light emitting layer 170 and the second bank 150 a and 150 b.
- the organic light emitting layer 170 is laminated using a soluble process such as an inkjet printing method, a nozzle printing method or the like.
- the organic light emitting layer 170 is formed by dropping an organic light emitting material solution on the first electrode 120 and then drying the organic light emitting material solution.
- a phenomenon occurs that a thickness of an edge portion of the organic light emitting layer 170 is greater than a thickness of a center portion of the organic light emitting layer 170 in the drying process. This phenomenon is referred to as a pile-up phenomenon.
- the dropped organic light emitting material solution contacts top surfaces of the edges e 1 and e 2 of the first bank 130 a and 130 b.
- the first bank 130 a and 130 b is made of an hydrophilic inorganic material, the first bank 130 a and 130 b has a surface energy greater than that of the second bank 150 a and 150 b , and a surface tension of the organic light emitting material solution at the top surfaces of the edges e 1 and e 2 of the first bank 130 a and 130 b is reduced.
- the pile-up phenomenon is induced from the top surfaces of the edges e 1 and e 2 of the first bank 130 a and 130 b to side walls of the second bank 150 a and 150 b.
- the width w 2 of the edge e 2 of the second portion 130 b along the short side of the pixel region P is greater that the width w 1 of the edge e 1 of the first portion 130 a along the long side of the pixel region P.
- the pile-up phenomenon at the side wall of the fourth portion 150 b occurs relatively more while the pile-up phenomenon at the side wall of the third portion 150 a occurs relatively less.
- an average height of the organic light emitting layer along its short edge portions on the second bank is greater than an average height of the organic light emitting layer along the long edge portions on the second bank.
- a width of the organic light emitting layer along its short edge portions over the first bank is greater than a width of the organic light emitting layer along its long edge portions over the first bank.
- Having greater pile-up phenomenon along the short edge portions beneficially acts to stretch the organic light emitting material and improves a uniformity of thickness of the display region across the pixel region P and results in the reduced pile-up along the long edge portions which forms part of the viewable display. Furthermore, the increased pile-up phenomenon along the short edge does not significantly affect the viewable display area because the area above the driving thin film transistor DTr along the short edge is not used for display or represents a less significant portion of the display, in one embodiment.
- the driving thin film transistor DTr is arranged below the second portion 130 b and the fourth portion 150 b along the short side of the pixel region P.
- the driving thin film transistor DTr is arranged at the boundary portion of the lower side of the pixel region P.
- the driving thin film transistor DTr may be arranged at the boundary portion of the upper side of the pixel region P.
- at least a portion of the driving thin film transistor DTr is under the edge of the first bank 130 b along either one of the short sides in the pixel region P.
- the aperture ratio of the OLED display device can be further improved.
- the OLED can be configured with either, but not necessarily both, the width w 2 of the edge e 2 of the second portion 130 b being greater than the width w 1 of the edge e 1 of the first portion 130 a or the height h 2 of the fourth portion 150 b being greater than the height h 1 of the third portion 150 a , and this configuration can improve a uniformity of thickness sufficiently.
- the widths w 1 and w 2 of the first bank and/or the heights h 1 and h 2 of the second bank can be dimensioned to improve a uniformity of thickness.
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Abstract
Description
- The present application is a divisional application of U.S. patent application Ser. No. 15/183,727 filed on Jun. 15, 2016, which claims the priority benefit of Korean Patent Application No. 10-2015-0093651 filed in Republic of Korea on Jun. 30, 2015, each of which are hereby incorporated by reference in their entirety for all purposes as if fully set forth herein.
- The present invention relates to an organic light emitting diode (OLED) display device. In particular, the present invention relates to an OLED display device that has improved uniformity of thickness of an organic light emitting layer.
- Recently, flat display devices, such as a plasma display panel (PDP), a liquid crystal display (LCD) device, and an organic light emitting diode (OLED) display device, have been researched.
- Among the flat display devices, the OLED display device is a self-luminescent device and can have a thin profile because the OLED display device does not need a backlight used for the LCD device.
- Further, compared with the LCD device, the OLED display device has advantages of excellent viewing angle and contrast ratio, low power consumption, operation in low DC voltage, fast response speed, being strong to an external impact because of its solid internal components, and wide operating temperature range.
- Particularly, since processes of manufacturing the OLED display device are simple, production cost of the OLED display device can be reduced more that that of the LCD device.
-
FIG. 1 is a plan view illustrating an OLED display device according to the related art. - As shown in
FIG. 1 , the related art OLED display device includes a plurality of pixel regions P, a 30 a and 30 b separating the pixel regions P and located at a boundary portion of each pixel region P, and afirst bank 50 a and 50 b exposing edges of thesecond bank 30 a and 30 b and located on thefirst bank 30 a and 30 b.first bank - The
30 a and 30 b is divided into afirst bank first portion 30 a along a long side of the pixel region P and asecond portion 30 b along a short side of the pixel region P, and the 50 a and 50 b is divided into asecond bank third portion 50 a along the long side of the pixel region P and afourth portion 50 b along the short side of the pixel region P. - A width of the edge of the
first portion 30 a is equal to that of thesecond portion 30 b. -
FIG. 2 is a cross-sectional view taken along a line II-II ofFIG. 1 , andFIG. 3 is a cross-sectional view taken along a line ofFIG. 1 . In more detail,FIG. 2 is a cross-sectional view of the pixel region P and the boundary portion thereof along a minor axis of the pixel region, andFIG. 3 is a cross-sectional view of the pixel region P and the boundary portion thereof along a major axis of the pixel region. - As shown in
FIGS. 2 and 3 , the related art OLED display device includes afirst electrode 20 in the pixel region P on asubstrate 11, the 30 a and 30 b at the boundary portion of the pixel region P on thefirst bank substrate 11, the 50 a and 50 b on thesecond bank 30 a and 30 b, and an organicfirst bank light emitting layer 70 on thefirst electrode 20. - The
30 a and 30 b is arranged to cover edges of thefirst bank first electrode 20, and the 50 a and 50 b is arranged to expose the edges of thesecond bank 30 a and 30 b.first bank - A width w1 of an edge e1 of the
first portion 30 a is equal to a width w2 of an edge e2 of thesecond portion 30 b. - For example, the width w1 of the edge e1 of the
first portion 30 a and the width w2 of the edge e2 of thesecond portion 30 b may be equally 1 um to 10 um. - Further, a height h1 of the
third portion 50 a is equal to a height h2 of thefourth portion 50 b. - For example, the height h1 of the
third portion 50 a and the height h2 of thefourth portion 50 b may be equally 1 um to 10 um. - The
first electrode 20 may be made of a transparent conductive material having a relatively greater work function to function as an anode. The 30 a and 30 b may be made of an inorganic material having a hydrophilicity, and thefirst bank 50 a and 50 b may be made of an organic material having a hydrophobicity.second bank - The OLED display device further includes a driving thin film transistor DTr located between the
substrate 11 and thefirst electrode 20 and connected to thefirst electrode 20. - The organic
light emitting layer 70 is laminated using a soluble process such as an inkjet printing method, a nozzle printing method or the like. - In detail, the organic
light emitting layer 70 is formed by dropping an organic light emitting material solution on thefirst electrode 20 and then drying the organic light emitting material solution. - A phenomenon occurs that a thickness of an edge portion of the organic
light emitting layer 70 is greater than a thickness of a center portion of the organiclight emitting layer 70 in the drying process. This phenomenon is referred to as a pile-up phenomenon. - In this case, since the edges e1 and e2 of the
30 a and 30 b is exposed by thefirst bank 50 a and 50 b, the dropped organic light emitting material solution contacts top surfaces of the edges e1 and e2 of thesecond bank 30 a and 30 b.first bank - Further, since the
30 a and 30 b is made of an hydrophilic inorganic material, thefirst bank 30 a and 30 b has a surface energy greater than that of thefirst bank 50 a and 50 b, and a surface tension of the organic light emitting material solution at the top surfaces of the edges e1 and e2 of thesecond bank 30 a and 30 b is reduced.first bank - Accordingly, the pile-up phenomenon is induced from the top surfaces of the edges e1 and e2 of the
30 a and 30 b to side walls of thefirst bank 50 a and 50 b.second bank - Thus, the pile-up phenomenon at the boundary portion of a display region out of the pixel region P the can be relieved to some extent.
- In other words, a uniformity of thickness of the display region of the pixel region P can be improved to some extent.
- However, since the pile-up phenomenon at the boundary portion is not completely improved, a ununiformity of brightness still occurs due to reduction of a uniformity of thickness of the organic
light emitting layer 70 and light emission efficiency and lifetime of the OLED display device are reduced. - Further, since the dual banks of the
30 a and 30 b and thefirst bank 50 a and 50 b are arranged vertically, an aperture ratio of the OLED display device is reduced compared with the LCD device.second bank - Accordingly, the present invention is directed to an OLED display device that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
- An object of the present invention is to improve a uniformity of thickness of an organic light emitting layer and a ununiformity of brightness.
- Additional features and advantages of the disclosure will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the disclosure. The advantages of the disclosure will be realized and attained by the structure particularly pointed out in the written description and claims as well as the appended drawings.
- To achieve these and other advantages, and in accordance with the purpose of the present invention, as embodied and broadly described herein, an organic light emitting diode (OLED) display device includes pixel region and a boundary region outside the pixel region. The pixel region comprises an area having a short side and a long side. The pixel region comprises an array of pixels to emit light. The OLED display device includes a substrate in the pixel region and in the boundary region, a first electrode of a light emitting device in the pixel region over the substrate, a first bank covering edges of the first electrode in the pixel region on the substrate in the boundary region, and a second bank on a portion of the first bank in the boundary region, wherein a width of an edge of the first bank along the short side of the pixel region is different from a width of an edge of the first bank along the long side of the pixel region.
- In another embodiment, an organic light emitting display (OLED) device includes a pixel region and a boundary region outside the pixel region. The pixel region comprises an area having a short dimension and a long dimension. The pixel region comprises an array of pixels to emit light. A substrate is in the pixel region and in the boundary region. An electrode is on the substrate in the pixel region. The electrode has long edge portions oriented along the long dimension of the pixel region and the electrode has short edge portions oriented along the short dimension of the pixel region. A first bank is on the substrate in the boundary region and on the long and the short edge portions of the electrode in the pixel region. A second bank is on the first bank in the boundary region. The second bank has long edge portions oriented along the long dimension of the pixel region and short edge portions oriented along the short dimension of the pixel region. An organic light emitting layer is on the electrode and on the first bank in the pixel region and on at least a portion of the second bank in the boundary region. An average height of short edge portions of the organic light emitting layer on the second bank is greater than an average height of long edge portions of the organic light emitting layer on the second bank.
- In another embodiment, a display device comprises a plurality of pixel regions each comprising an area having a short dimension and a long dimension. Each of the pixel regions comprises an array of pixels to emit light. A plurality of boundary regions separates the pixel regions. The boundary regions comprise a first bank and a second bank. The first comprises a hydrophilic material around a perimeter of the pixel region. A second bank comprising a hydrophobic material on a portion of the first bank around the perimeter of the pixel region. The second bank has long edge portions along the long dimension and short edge portions along the short dimension. A first height of the short edge portions of the second bank is greater than a second height of the long edge portions of the second bank.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
- The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the principles of the disclosure. In the drawings:
-
FIG. 1 is a plan view illustrating an OLED display device according to the related art; -
FIG. 2 is a cross-sectional view taken along a line II-II ofFIG. 1 ; -
FIG. 3 is a cross-sectional view taken along a line ofFIG. 1 ; -
FIG. 4 is a plan view illustrating an OLED display device according to an embodiment of the present invention; -
FIG. 5 is a cross-sectional view taken along a line V-V ofFIG. 4 ; -
FIG. 6 is a cross-sectional view taken along a line VI-VI ofFIG. 4 ; and -
FIG. 7 is a cross-sectional view taken along a line VII-VII ofFIG. 4 . - Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. The same or like reference numbers may be used throughout the drawings to refer to the same or like parts.
-
FIG. 4 is a plan view illustrating an OLED display device according to an embodiment of the present invention. - As shown in
FIG. 4 , the OLED display device of the embodiment includes a plurality of pixel regions P, a 130 a and 130 b in a boundary region separating the pixel regions P and located at a boundary portion of each pixel region P, and afirst bank 150 a and 150 b in the boundary region not covering (e.g., exposing) edges of thesecond bank 130 a and 130 b and located on thefirst bank 130 a and 130 b. The edges of thefirst bank 130 a and 130 b not covered by thefirst bank 150 a and 150 b may be covered by a different layer, such as organic light emitting layer as described below. Thesecond bank 130 a and 130 b andfirst bank 150 a and 150 b may be located around a perimeter of the pixel region P.second bank - The
130 a and 130 b is divided into afirst bank first portion 130 a (e.g., a long edge portion) along a long side of the pixel region P and asecond portion 130 b (e.g., a short edge portion) along a short side of the pixel region P, and the 150 a and 150 b is divided into asecond bank third portion 150 a (e.g., a long edge portion) along the long side of the pixel region P and afourth portion 150 b (e.g., a short edge portion) along the short side of the pixel region P. - A width of the edge of the
second portion 130 b is greater than that of thefirst portion 130 a. -
FIG. 5 is a cross-sectional view taken along a line V-V ofFIG. 4 ,FIG. 6 is a cross-sectional view taken along a line VI-VI ofFIG. 4 , andFIG. 7 is a cross-sectional view taken along a line VII-VII ofFIG. 4 . In more detail,FIG. 5 is a cross-sectional view of the pixel region P and the boundary portion thereof along a minor axis of the pixel region,FIG. 6 is a cross-sectional view of the pixel region P and the boundary portion thereof along a major axis of the pixel region, andFIG. 7 is a cross-sectional view of the pixel region P and the boundary portion thereof with a driving thin film transistor. - As shown in
FIGS. 5-7 , the OLED display device of the embodiment includes afirst electrode 120 on or over thesubstrate 101 in the pixel region P and in a boundary region separating the pixel regions P, the 130 a and 130 b covering edges of thefirst bank first electrode 120 in the pixel region P and on thesubstrate 101 in a boundary region surrounding the pixel region P, the 150 a and 150 b on a portion of thesecond bank 130 a and 130 b in the boundary region, and an organicfirst bank light emitting layer 170 on thefirst electrode 120 and on the 130 a and 130 b in the pixel region and on at least a portion of the second bank in the boundary region.first bank - The
130 a and 130 b is arranged to cover edges of thefirst bank first electrode 120, and the 150 a and 150 b is arranged to not cover the edges e1 and e2 of thesecond bank 130 a and 130 b (which may be covered by a different layer such as the organic light emitting layer 170).first bank - A width w1 of the edge e1 of the
first portion 130 a is different from a width w2 of the edge e2 of thesecond portion 130 b. - In detail, the width w2 of the edge e2 of the
second portion 130 b is greater than the width w1 of the edge e1 of thefirst portion 130 a. - For example, the width w2 of the edge e2 of the
second portion 130 b may be about 7.5 um to about 10 um, and the width w1 of the edge e1 of thefirst portion 130 b may be about 5 um. In other example, the width w2 of the edge e2 of thesecond portion 130 b may be about 6 um to about 8 um, and the width w1 of the edge e1 of thefirst portion 130 b may be about 4 um. In other example, the width w2 of the edge e2 of thesecond portion 130 b may be about 4.5 um to about 6 um, and the width w1 of the edge e1 of thefirst portion 130 b may be about 3 um. Thus, in one embodiment, the width w2 may be in the range of 1.5-2 times the width w1. - Further, a height h1 of the
third portion 150 a is different from a height h2 of thefourth portion 150 b. - In detail, the height h2 of the
fourth portion 150 b is greater than the height h1 of thethird portion 150 a. - For example, the height h2 of the
fourth portion 150 b may be about 1.5 um to 2 um, and the height h1 of thethird portion 150 a may be about lum. In other example, the height h2 of thefourth portion 150 b may be about 2.5 um to 3 um, and the height h1 of thethird portion 150 a may be about 2 um. Thus, for example, the height h2 may be in the range of 1.25-2 times the height h1. Further, in an embodiment, the height h2 of thefourth portion 150 b may be higher than the height h1 of thethird portion 150 a at least by 0.5 um, and the height of h2 of thefourth portion 150 b may be 3 um or less. - In this case, using a half-tone mask or the like including a blocking region, a semi-transmissive region and a transmissive region, the heights h1 and h2 of the
150 a and 150 b may be formed differently.second bank - Accordingly, the
150 a and 150 b having the different heights h1 and h2 can be formed, and thus production process can be simplified.second bank - The
first electrode 120 may be made of a transparent conductive material, for example, indium-tin-oxide (ITO) or indium-zinc-oxide (IZO), having a relatively greater work function to function as an anode. - The
130 a and 130 b may be made of an inorganic material, for example, silicon oxide (SiO2) or silicon nitride (SiNx), having a hydrophilicity. Thefirst bank 150 a and 150 b may be made of an organic material, for example, polyacryl, polyimide, polyamide (PA), benzocyclobutene (BCB), or phenol resin, having a hydrophobicity.second bank - The OLED display device further includes the driving thin film transistor DTr located between the
substrate 101 and thefirst electrode 120 and connected to thefirst electrode 120. - The detailed structure of the driving thin film transistor DTr is explained with reference to
FIG. 7 . - A
semiconductor layer 113 is located on thesubstrate 101 and includes afirst region 113 a made of intrinsic polysilicon, and asecond region 113 b located at each of both sides of thefirst region 113 a and doped with highly concentrated impurities. - A
gate insulating layer 115 is located entirely on thesubstrate 101 and covers thesemiconductor layer 113. Agate electrode 125 is located on thegate insulating layer 115 corresponding to thefirst region 113 a. An inter-layeredinsulating layer 117 covers thegate electrode 125 and is entirely on thesubstrate 101. - A
semiconductor contact hole 121 exposing eachsecond region 113 b is formed in thegate insulating layer 115 and the inter-layeredinsulating layer 117. - Source and
133 and 136 are located on the inter-layereddrain electrodes insulating layer 117, are connected to the respectivesecond regions 113 b through the respective semiconductor contact holes 121, and are spaced apart from each other. - The source and drain
133 and 136, theelectrodes semiconductor layer 113, thegate electrode 125 form the driving thin film transistor DTr. - A
passivation layer 119 is located on the driving thin film transistor DTr over theentire substrate 101, and has a planarization property. - A
drain contact hole 143 exposing thedrain electrode 136 is formed in thepassivation layer 119. Thedrain electrode 136 is connected to thefirst electrode 120 through thedrain contact hole 143. - The organic
light emitting layer 170 is located on thefirst electrode 120. A second electrode (not shown) is located on the organiclight emitting layer 170 and the 150 a and 150 b.second bank - The organic
light emitting layer 170 is laminated using a soluble process such as an inkjet printing method, a nozzle printing method or the like. - The organic
light emitting layer 170 is formed by dropping an organic light emitting material solution on thefirst electrode 120 and then drying the organic light emitting material solution. - A phenomenon occurs that a thickness of an edge portion of the organic
light emitting layer 170 is greater than a thickness of a center portion of the organiclight emitting layer 170 in the drying process. This phenomenon is referred to as a pile-up phenomenon. - In this case, since the edges e1 and e2 of the
130 a and 130 b are exposed by thefirst bank 150 a and 150 b, the dropped organic light emitting material solution contacts top surfaces of the edges e1 and e2 of thesecond bank 130 a and 130 b.first bank - Further, since the
130 a and 130 b is made of an hydrophilic inorganic material, thefirst bank 130 a and 130 b has a surface energy greater than that of thefirst bank 150 a and 150 b, and a surface tension of the organic light emitting material solution at the top surfaces of the edges e1 and e2 of thesecond bank 130 a and 130 b is reduced.first bank - Accordingly, the pile-up phenomenon is induced from the top surfaces of the edges e1 and e2 of the
130 a and 130 b to side walls of thefirst bank 150 a and 150 b.second bank - Further, as shown in the drawings, the width w2 of the edge e2 of the
second portion 130 b along the short side of the pixel region P is greater that the width w1 of the edge e1 of thefirst portion 130 a along the long side of the pixel region P. - Accordingly, regarding areas that contact the dropped organic light emitting material solution, the area at the edge e2 of the
second portion 130 b is wider than the area at the edge dl of thefirst portion 130 a. - Further, as shown in the drawings, the height h2 of the
fourth portion 150 b along the short side of the pixel region P is greater the height h1 of thethird portion 150 a along the long side of the pixel region P. - Accordingly, in the drying process of the organic light emitting material solution, the pile-up phenomenon at the side wall of the
fourth portion 150 b occurs relatively more while the pile-up phenomenon at the side wall of thethird portion 150 a occurs relatively less. Thus, an average height of the organic light emitting layer along its short edge portions on the second bank is greater than an average height of the organic light emitting layer along the long edge portions on the second bank. Furthermore, due to the difference in pile-up phenomenon, a width of the organic light emitting layer along its short edge portions over the first bank is greater than a width of the organic light emitting layer along its long edge portions over the first bank. - Having greater pile-up phenomenon along the short edge portions beneficially acts to stretch the organic light emitting material and improves a uniformity of thickness of the display region across the pixel region P and results in the reduced pile-up along the long edge portions which forms part of the viewable display. Furthermore, the increased pile-up phenomenon along the short edge does not significantly affect the viewable display area because the area above the driving thin film transistor DTr along the short edge is not used for display or represents a less significant portion of the display, in one embodiment.
- Thus, the OLED display device of the embodiment can prevent a ununiformity of brightness caused by reduction of a uniformity of thickness, and can improve light emission efficiency and lifetime of an organic light emitting diode.
- Further, the driving thin film transistor DTr is arranged below the
second portion 130 b and thefourth portion 150 b along the short side of the pixel region P. - In the drawings, it is shown that the driving thin film transistor DTr is arranged at the boundary portion of the lower side of the pixel region P. Alternatively, the driving thin film transistor DTr may be arranged at the boundary portion of the upper side of the pixel region P. Thus, for example, at least a portion of the driving thin film transistor DTr is under the edge of the
first bank 130 b along either one of the short sides in the pixel region P. - Accordingly, since the driving thin film transistor DTr is arranged below the
second portion 130 b and thefourth portion 150 b along the short side of the pixel region P where the pile-up phenomenon occurs relatively more, an aperture ratio of the OLED display device can be improved. - Further, even though the dual banks of the
130 a and 130 b and thefirst bank 150 a and 150 b are arranged vertically, by adjusting the widths w1 and w2 of the first andsecond bank 130 a and 130 b along the short side and the long side of the pixel region P, the aperture ratio of the OLED display device can be further improved.second portions - In the above embodiment, it is described that, in order to improve a uniformity of thickness, the OLED display device is configured with the width w2 of the edge e2 of the
second portion 130 b being greater than the width w1 of the edge e1 of thefirst portion 130 a and the height h2 of thefourth portion 150 b being greater than the height h1 of thethird portion 150 a. In another embodiment, the OLED can be configured with either, but not necessarily both, the width w2 of the edge e2 of thesecond portion 130 b being greater than the width w1 of the edge e1 of thefirst portion 130 a or the height h2 of thefourth portion 150 b being greater than the height h1 of thethird portion 150 a, and this configuration can improve a uniformity of thickness sufficiently. In other words, the widths w1 and w2 of the first bank and/or the heights h1 and h2 of the second bank can be dimensioned to improve a uniformity of thickness. - It will be apparent to those skilled in the art that various modifications and variations can be made in a display device of the present invention without departing from the sprit or scope of the disclosure. Thus, it is intended that the present invention covers the modifications and variations of this disclosure provided they come within the scope of the appended claims and their equivalents.
Claims (6)
Priority Applications (1)
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|---|---|---|---|
| US15/927,038 US10297650B2 (en) | 2015-06-30 | 2018-03-20 | Organic light emitting diode display device |
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| KR1020150093651A KR102457536B1 (en) | 2015-06-30 | 2015-06-30 | Organic light emitting display device |
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| US15/183,727 US9947732B2 (en) | 2015-06-30 | 2016-06-15 | Organic light emitting diode display device |
| US15/927,038 US10297650B2 (en) | 2015-06-30 | 2018-03-20 | Organic light emitting diode display device |
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| US15/183,727 Division US9947732B2 (en) | 2015-06-30 | 2016-06-15 | Organic light emitting diode display device |
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| EP (2) | EP3113228B1 (en) |
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| CN109728030B (en) | 2017-10-31 | 2024-05-21 | 合肥鑫晟光电科技有限公司 | Display substrate, preparation method thereof and display panel |
| CN109801939B (en) | 2017-11-17 | 2021-11-16 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
| CN108010946B (en) * | 2017-11-27 | 2022-02-25 | 京东方科技集团股份有限公司 | Pixel defining layer, array substrate and display device |
| CN109860223B (en) | 2017-11-30 | 2021-01-22 | 京东方科技集团股份有限公司 | Pixel definition layer, display substrate, display device, inkjet printing method |
| KR102513383B1 (en) * | 2017-12-05 | 2023-03-22 | 엘지디스플레이 주식회사 | Electroluminescent Display Device |
| CN108010953B (en) * | 2017-12-06 | 2020-06-26 | 京东方科技集团股份有限公司 | Organic light-emitting display back plate, preparation method thereof and display device |
| KR102577043B1 (en) * | 2017-12-11 | 2023-09-08 | 엘지디스플레이 주식회사 | Electroluminescent display device |
| KR102657529B1 (en) * | 2018-11-02 | 2024-04-12 | 엘지디스플레이 주식회사 | Organic light-emitting display device |
| CN109546004B (en) * | 2018-12-05 | 2020-06-30 | 武汉华星光电半导体显示技术有限公司 | Light-emitting panel, manufacturing method of light-emitting panel and display device |
| KR20200071429A (en) | 2018-12-11 | 2020-06-19 | 엘지디스플레이 주식회사 | Organic light emitting display device and metho of fabricating thereof |
| KR102803958B1 (en) * | 2018-12-26 | 2025-05-07 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| KR102794930B1 (en) * | 2018-12-26 | 2025-04-10 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| CN109860422B (en) * | 2019-01-31 | 2021-06-04 | 武汉天马微电子有限公司 | Display panel and display device |
| CN110071157B (en) * | 2019-04-28 | 2021-01-22 | 京东方科技集团股份有限公司 | Pixel defining layer and method for fabricating the same, array substrate, display panel and device |
| JP7330779B2 (en) * | 2019-06-27 | 2023-08-22 | 住友化学株式会社 | Organic EL device and its manufacturing method |
| KR20210086170A (en) * | 2019-12-31 | 2021-07-08 | 엘지디스플레이 주식회사 | Organic light emitting display device |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20170005149A1 (en) | 2017-01-05 |
| EP3428969B1 (en) | 2025-09-10 |
| US10297650B2 (en) | 2019-05-21 |
| KR102457536B1 (en) | 2022-10-21 |
| EP3113228B1 (en) | 2018-07-04 |
| CN106328675A (en) | 2017-01-11 |
| EP3428969A1 (en) | 2019-01-16 |
| KR20170003845A (en) | 2017-01-10 |
| EP3113228A1 (en) | 2017-01-04 |
| PL3113228T3 (en) | 2019-03-29 |
| CN106328675B (en) | 2019-07-16 |
| US9947732B2 (en) | 2018-04-17 |
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