US20170038154A1 - Vapor chamber structure having stretchable heated part - Google Patents
Vapor chamber structure having stretchable heated part Download PDFInfo
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- US20170038154A1 US20170038154A1 US14/820,179 US201514820179A US2017038154A1 US 20170038154 A1 US20170038154 A1 US 20170038154A1 US 201514820179 A US201514820179 A US 201514820179A US 2017038154 A1 US2017038154 A1 US 2017038154A1
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- Prior art keywords
- plate
- stretchable
- vapor chamber
- heated
- chamber structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F5/00—Elements specially adapted for movement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4332—Bellows
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent
Definitions
- the present invention relates to a plate type heat exchanger, in particular, to a vapor chamber structure having at least one stretchable heated part.
- the design of heat dissipation or heat transfer for numerous heat sources to meet the requirements of heat dissipation and heat transfer is a necessary and important technique.
- the heated contact surface of each of the heat dissipation or heat transfer devices is also adjusted to fit the different elevations accordingly.
- a tailor-made way is used. That is, the heat dissipation or heat transfer device with a single specification is used, which can only fit the corresponding electronic product. Once the elevation of any heat generating device in the electronic product is changed or adjusted, the heat dissipation or heat transfer device with the single specification is not valid any more. A new one has to be tailored.
- the heat exchange task such as heat dissipation or heat transfer can be performed for the numerous heat generating devices, sometimes the working fluid inside cannot be ensured to flow back due to a variety of applicable conditions. As a result, the vapor chamber will dry out easily, affecting the heat transfer efficiency or operation stability thereof and worse, losing the effect of heat transfer.
- the present invention provides a vapor chamber structure, which comprises a plate-shaped shell and at least one stretchable heated member.
- the plate-shaped shell has a hollow interior to form a cavity.
- the plate-shaped shell has a base on which at least one throughhole is disposed and the throughhole communicates with the cavity.
- the at least one stretchable heated member is disposed on the base of the plate-shaped shell.
- the at least one stretchable heated member comprises a heated plate and a hollow stretchable tube. The heated plate is sealedly connected to one end of the stretchable tube and the at least one throughhole of the plate-shaped shell is sealedly connected to the other end of the stretchable tube.
- the present invention also provides a vapor chamber structure having at least one stretchable heated part which further comprises a capillary structure assembly having a plurality of capillary structures which are floatingly connected to one another and are in turn connected between the at least one stretchable heated member and the plate-shaped shell.
- FIG. 1 is a perspective schematic view of the present invention
- FIG. 2 is a local cross-sectional view of the internal structure of the present invention.
- FIG. 3 is a magnifying view of area A in FIG. 2 ;
- FIG. 4 is an internal cross-sectional view of the present invention in vertical operation
- FIG. 5 is a detailed magnifying view of area B in FIG. 4 ;
- FIG. 6 is a detailed local magnifying view according to another embodiment of the present invention.
- FIGS. 1 and 2 are the perspective schematic view of the present invention and the local cross-sectional view of the internal structure of the present invention, respectively.
- the present invention provides a vapor chamber structure having a stretchable heated part which helps perform heat exchange for heat generating devices 4 (shown in FIG. 4 ) such as the CPUs of the computers or the GPUs of the graphic cards.
- the present invention is also applicable to a plurality of heat generating devices 4 with the contact surfaces located at different elevations or to a single heat generating device in which the heating generating is not easily to be contacted due to the elevations of the electronic devices surrounding the heat generating device.
- the vapor chamber structure comprises a plate-shaped shell 1 and at least one stretchable heated member 2 .
- the plate-shaped shell 1 has a hollow interior which is sealed.
- the plate-shaped shell 1 is formed by stacking a lower plate 10 and an upper plate 11 .
- the hollow interior of the plate-shaped shell 1 forms a cavity 12 between the lower plate 10 and the upper plate 11 .
- the cavity 12 is used to be filled with adequate working fluid (now shown) and then sealed.
- the internal wall of the cavity 12 is covered with a wick structure layer 120 which can be made of metal mesh or sintered powder.
- FIGS. 4 and 5 The present invention mainly provides at least one stretchable heated member 2 on the vapor chamber in which the stretchable heated member 2 can deform flexibly to fit the elevation of the heat generating device 4 .
- the number and locations of the stretchable heated members 2 can be disposed depending on those of the heat generating devices 4 in a real situation, but the minimal number of stretchable heated members 2 is one.
- the stretchable heated member 2 is disposed on the base 100 of the plate-shaped shell 1 .
- the stretchable heated member 2 comprises a heated plate 20 and a hollow stretchable tube 21 .
- the external surface of the heated plate 20 is used to contact the upper surface of the heat generating device 4 .
- a preferred way is to apply adequate heat conduction media such as thermal grease between the heated plate 20 and the heat generating device 4 .
- a wick structure layer 200 can be disposed on the internal surface of the heated plate 20 .
- the wick structure layer 200 can be made of metal mesh or sintered powder.
- the stretchable tube 21 can be a flexible or an elastic tube body with an enclosed edge.
- the flexible tube body with the enclosed edge can be a bellow.
- the elastic tube body with the enclosed edge can be a spring tube.
- the stretchable tube 21 has a deformed segment 210 to be stretchable to change its length (lengthen or shorten), a first end opening 211 , and a second end opening 212 .
- the first end opening 211 and the second end opening 212 are individually formed at two ends of the deformed segment 210 .
- the first end opening 211 is for disposing the heated plate 20 of the stretchable heated member 2 such that the heated plate 20 is sealed to the first end opening 211 .
- At least one throughhole 101 is disposed on the base 100 of the lower plate 10 of the plate-shaped shell 1 and communicates with the cavity 12 .
- the second end opening 212 is sealedly connected to the at least one throughhole 101 .
- the number of the at least one throughhole 101 corresponds to that of the at least one stretchable heated member 2 .
- the stretchable heated member 2 of the present invention can deform through the flexibility or elasticity of the stretchable tube 21 such that the heated plate 20 of each individual stretchable heated member 2 can fit and contact the heat generating devices 4 , 4 ′, 4 ′′ at different elevations.
- a single vapor chamber can perform heat exchange for many heat generating devices 4 , 4 ′, 4 ′′ at the same time.
- the stretchable tube 21 of the stretchable heated member 2 can be extended downward to successfully contact the surface of the heat generating device 4 ′ with the plate-shaped shell 1 remaining at the original elevation of installation.
- the vapor chamber of the present invention not only provides the stretchable heated member 2 to fit the elevation of the heat generating device 4 by means of flexible deformation, but also further comprises at least one capillary structure assembly 3 to ensure the working fluid in the vapor chamber can flow back efficiently.
- the present invention in vertical operation is shown in FIG. 4 .
- the number and locations of the stretchable heated members 2 can be disposed depending on those of the heat generating devices 4 in a real situation, but the minimal number of stretchable heated members 2 is one.
- the capillary structure assembly 3 is disposed in the stretchable heated member 2 correspondingly and particularly disposed between the stretchable heated member 2 and the plate-shaped shell 1 .
- the capillary structure assembly 3 comprises a plurality of capillary structures 30 , 31 which are floatingly connected to one another and are in turn connected between the stretchable heated member 2 and the plate-shaped shell 1 in which when the length of the stretchable heated member 2 changes, the capillary structure assembly 3 can move to fit the corresponding connection location by means of the mutual connection of capillary structures 30 , 31 .
- the capillary structures 30 , 31 are grouped into a first capillary structure 30 and a second capillary structure 31 .
- a connecting hole 300 is disposed in the first capillary structure 30 .
- the connecting hole 300 can be a throughhole penetrating through the first capillary structure 30 or a blind hole penetrating into the first capillary structure 30 .
- the connecting hole 300 is used for the second capillary structure 31 to be sleeved into the connecting hole 300 such that the first capillary structure 30 and the second capillary structure 31 are floatingly connected to each other.
- the first capillary structure 30 is disposed on the internal surface of the heated plate 20 of the stretchable heated member 2 and is connected to the wick structure layer 200 on the internal surface of the heated plate 20 .
- the second capillary structure 31 is disposed on the internal wall of the upper plate 11 . In this way, as shown in FIG.
- the vapor chamber of the present invention in non-horizontal operation can also be connected indeed between the stretchable heated member 2 and the plate-shaped shell 1 through the capillary structure assembly 3 in combination with the stretchable heated member 2 to ensure the working fluid in the vapor chamber can flow back efficiently to the wick structure layer 200 on the heated plate 20 of the stretchable heated member 2 . Therefore, the present invention can avoid the working fluid from failing to flow back due to some external factor such as the weight of the working fluid and prevent the vapor chamber from drying out to affect the heat transfer efficiency.
- an elastic device 22 is disposed in the stretchable heated member 2 to push against the heated plate 20 outward.
- the elastic device 22 can be a compressed spring. One end of the compressed spring pushes against the internal surface of the heated plate 20 or the wick structure layer 200 of the heated plate 20 . The other end of the compressed spring pushes against the internal wall of the cavity 12 of the plate-shaped shell 1 , like in the upper plate 11 . In this way, the contact effect between the heated plate 20 and the surface of the heat generating device 4 can be further enhanced by the spring force provided by the elastic device 22 .
- the present invention can really achieve the expected objective and overcome the disadvantages of the prior art. Also, the present invention is indeed novel, useful, and non-obvious to be patentable. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
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- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
A vapor chamber structure includes a plate-shaped shell and at least one stretchable heated member. The plate-shaped shell has a hollow interior to form a cavity and has a base on which at least one throughhole is disposed. The throughhole communicates with the cavity. The stretchable heated member is disposed on the base of the plate-shaped shell. The stretchable heated member includes a heated plate and a hollow stretchable tube. The heated plate is sealedly connected to one end of the stretchable tube and the throughhole of the plate-shaped shell is sealedly connected to the other end of the stretchable tube.
Description
- Field of the Invention
- The present invention relates to a plate type heat exchanger, in particular, to a vapor chamber structure having at least one stretchable heated part.
- Description of Related Art
- With the rapid development in the computer industry, many heat generating electronic devices applied in the computer such as the CPUs of the computers or the GPUs of the graphic cards have enhanced processing capability and consequently suffer the issue of overheating, which has been becoming a topic to be solved in the modern heat dissipation technology.
- Thus, the design of heat dissipation or heat transfer for numerous heat sources to meet the requirements of heat dissipation and heat transfer is a necessary and important technique. In particular, when the numerous heat generating devices are located at different elevations, the heated contact surface of each of the heat dissipation or heat transfer devices is also adjusted to fit the different elevations accordingly. As for the traditional remedy for the above issue, in general, a tailor-made way is used. That is, the heat dissipation or heat transfer device with a single specification is used, which can only fit the corresponding electronic product. Once the elevation of any heat generating device in the electronic product is changed or adjusted, the heat dissipation or heat transfer device with the single specification is not valid any more. A new one has to be tailored. Further, though the heat exchange task such as heat dissipation or heat transfer can be performed for the numerous heat generating devices, sometimes the working fluid inside cannot be ensured to flow back due to a variety of applicable conditions. As a result, the vapor chamber will dry out easily, affecting the heat transfer efficiency or operation stability thereof and worse, losing the effect of heat transfer.
- In view of this, the inventor pays special attention to research with the application of related theory and tries to overcome the above disadvantages regarding the above related art. Finally, the inventor proposes the invention which is a reasonable design and overcomes the above disadvantages.
- It is a main objective of the present invention to provide a vapor chamber structure having at least one stretchable heated part, which can adjust the heated contact surface with each individual heat generating device depending on the elevation of each individual heat generating device. Further, the applicable scope of the vapor chamber with a single specification is widened and the contact effect between each heated surface and each heat generating device is also increased. Accordingly, a single vapor chamber can perform heat exchange for many heat generating devices at the same time. Also, the present invention can be applied to a single heat generating device in which the heating generating device is awkward to be contacted due to the elevations of the electronic devices surrounding the heat generating device.
- It is another objective of the present invention to provide a vapor chamber structure having at least one stretchable heated part, which can adjust the heated contact surface with each individual heat generating device depending on the elevation of each individual heat generating device to ensure the working fluid in the vapor chamber can flow back efficiently to prevent the vapor chamber from drying out and being damaged.
- In order to achieve the above main objective, the present invention provides a vapor chamber structure, which comprises a plate-shaped shell and at least one stretchable heated member. The plate-shaped shell has a hollow interior to form a cavity. The plate-shaped shell has a base on which at least one throughhole is disposed and the throughhole communicates with the cavity. The at least one stretchable heated member is disposed on the base of the plate-shaped shell. The at least one stretchable heated member comprises a heated plate and a hollow stretchable tube. The heated plate is sealedly connected to one end of the stretchable tube and the at least one throughhole of the plate-shaped shell is sealedly connected to the other end of the stretchable tube.
- In order to achieve the above another objective, the present invention also provides a vapor chamber structure having at least one stretchable heated part which further comprises a capillary structure assembly having a plurality of capillary structures which are floatingly connected to one another and are in turn connected between the at least one stretchable heated member and the plate-shaped shell.
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FIG. 1 is a perspective schematic view of the present invention; -
FIG. 2 is a local cross-sectional view of the internal structure of the present invention; -
FIG. 3 is a magnifying view of area A inFIG. 2 ; -
FIG. 4 is an internal cross-sectional view of the present invention in vertical operation; -
FIG. 5 is a detailed magnifying view of area B inFIG. 4 ; and -
FIG. 6 is a detailed local magnifying view according to another embodiment of the present invention. - To further disclose the characteristics and technical details of the present invention, please refer to the following detailed description and accompanying figures. However, the accompanying figures are only for reference and explanation, but not to limit the scope of the present invention.
- Please refer to
FIGS. 1 and 2 , which are the perspective schematic view of the present invention and the local cross-sectional view of the internal structure of the present invention, respectively. The present invention provides a vapor chamber structure having a stretchable heated part which helps perform heat exchange for heat generating devices 4 (shown inFIG. 4 ) such as the CPUs of the computers or the GPUs of the graphic cards. The present invention is also applicable to a plurality of heat generatingdevices 4 with the contact surfaces located at different elevations or to a single heat generating device in which the heating generating is not easily to be contacted due to the elevations of the electronic devices surrounding the heat generating device. The vapor chamber structure comprises a plate-shaped shell 1 and at least one stretchable heatedmember 2. - Please also refer to
FIG. 3 . The plate-shaped shell 1 has a hollow interior which is sealed. In the current embodiment of the present invention, the plate-shaped shell 1 is formed by stacking alower plate 10 and anupper plate 11. The hollow interior of the plate-shaped shell 1 forms acavity 12 between thelower plate 10 and theupper plate 11. Thecavity 12 is used to be filled with adequate working fluid (now shown) and then sealed. The internal wall of thecavity 12 is covered with awick structure layer 120 which can be made of metal mesh or sintered powder. Please also refer toFIGS. 4 and 5 . The present invention mainly provides at least one stretchable heatedmember 2 on the vapor chamber in which the stretchable heatedmember 2 can deform flexibly to fit the elevation of theheat generating device 4. The number and locations of the stretchable heatedmembers 2 can be disposed depending on those of the heat generatingdevices 4 in a real situation, but the minimal number of stretchable heatedmembers 2 is one. The stretchable heatedmember 2 is disposed on thebase 100 of the plate-shaped shell 1. The stretchable heatedmember 2 comprises a heatedplate 20 and a hollowstretchable tube 21. The external surface of the heatedplate 20 is used to contact the upper surface of theheat generating device 4. A preferred way is to apply adequate heat conduction media such as thermal grease between the heatedplate 20 and theheat generating device 4. Besides, awick structure layer 200 can be disposed on the internal surface of the heatedplate 20. Thewick structure layer 200 can be made of metal mesh or sintered powder. - The
stretchable tube 21 can be a flexible or an elastic tube body with an enclosed edge. The flexible tube body with the enclosed edge can be a bellow. The elastic tube body with the enclosed edge can be a spring tube. In the current embodiment of the present invention, thestretchable tube 21 has adeformed segment 210 to be stretchable to change its length (lengthen or shorten), a first end opening 211, and a second end opening 212. The first end opening 211 and the second end opening 212 are individually formed at two ends of thedeformed segment 210. The first end opening 211 is for disposing theheated plate 20 of the stretchable heatedmember 2 such that theheated plate 20 is sealed to the first end opening 211. At least onethroughhole 101 is disposed on thebase 100 of thelower plate 10 of the plate-shaped shell 1 and communicates with thecavity 12. The second end opening 212 is sealedly connected to the at least onethroughhole 101. The number of the at least onethroughhole 101 corresponds to that of the at least one stretchableheated member 2. - Therefore, by means of the above assembled structure, a vapor chamber structure having a stretchable heated part of the present invention is obtained.
- As shown in
FIGS. 4 and 5 , the stretchableheated member 2 of the present invention can deform through the flexibility or elasticity of thestretchable tube 21 such that theheated plate 20 of each individual stretchableheated member 2 can fit and contact the 4, 4′, 4″ at different elevations. As a result, a single vapor chamber can perform heat exchange for manyheat generating devices 4, 4′, 4″ at the same time. Also, as for the case of a singleheat generating devices heat generating device 4′ (e.g., the elevation of theheat generating device 4′ is too low and the plate-shapedshell 1 of the vapor chamber is awkward to lower its elevation to fit due to the surrounding electronic devices.), thestretchable tube 21 of the stretchableheated member 2 can be extended downward to successfully contact the surface of theheat generating device 4′ with the plate-shapedshell 1 remaining at the original elevation of installation. - Besides, the vapor chamber of the present invention not only provides the stretchable
heated member 2 to fit the elevation of theheat generating device 4 by means of flexible deformation, but also further comprises at least onecapillary structure assembly 3 to ensure the working fluid in the vapor chamber can flow back efficiently. For example, the present invention in vertical operation is shown inFIG. 4 . The number and locations of the stretchableheated members 2 can be disposed depending on those of theheat generating devices 4 in a real situation, but the minimal number of stretchableheated members 2 is one. Thecapillary structure assembly 3 is disposed in the stretchableheated member 2 correspondingly and particularly disposed between the stretchableheated member 2 and the plate-shapedshell 1. Thecapillary structure assembly 3 comprises a plurality of 30, 31 which are floatingly connected to one another and are in turn connected between the stretchablecapillary structures heated member 2 and the plate-shapedshell 1 in which when the length of the stretchableheated member 2 changes, thecapillary structure assembly 3 can move to fit the corresponding connection location by means of the mutual connection of 30, 31. In the current embodiment of the present invention, thecapillary structures 30, 31 are grouped into acapillary structures first capillary structure 30 and asecond capillary structure 31. A connecting hole 300 is disposed in thefirst capillary structure 30. The connecting hole 300 can be a throughhole penetrating through thefirst capillary structure 30 or a blind hole penetrating into thefirst capillary structure 30. The connecting hole 300 is used for thesecond capillary structure 31 to be sleeved into the connecting hole 300 such that thefirst capillary structure 30 and thesecond capillary structure 31 are floatingly connected to each other. Further, thefirst capillary structure 30 is disposed on the internal surface of theheated plate 20 of the stretchableheated member 2 and is connected to thewick structure layer 200 on the internal surface of theheated plate 20. Thesecond capillary structure 31 is disposed on the internal wall of theupper plate 11. In this way, as shown inFIG. 5 , the vapor chamber of the present invention in non-horizontal operation can also be connected indeed between the stretchableheated member 2 and the plate-shapedshell 1 through thecapillary structure assembly 3 in combination with the stretchableheated member 2 to ensure the working fluid in the vapor chamber can flow back efficiently to thewick structure layer 200 on theheated plate 20 of the stretchableheated member 2. Therefore, the present invention can avoid the working fluid from failing to flow back due to some external factor such as the weight of the working fluid and prevent the vapor chamber from drying out to affect the heat transfer efficiency. - Moreover, as shown in
FIG. 6 , to further enhance the surface contact between theheated plate 20 of the stretchableheated member 2 and the surface of theheat generating device 4, anelastic device 22 is disposed in the stretchableheated member 2 to push against theheated plate 20 outward. Theelastic device 22 can be a compressed spring. One end of the compressed spring pushes against the internal surface of theheated plate 20 or thewick structure layer 200 of theheated plate 20. The other end of the compressed spring pushes against the internal wall of thecavity 12 of the plate-shapedshell 1, like in theupper plate 11. In this way, the contact effect between theheated plate 20 and the surface of theheat generating device 4 can be further enhanced by the spring force provided by theelastic device 22. - In summary, the present invention can really achieve the expected objective and overcome the disadvantages of the prior art. Also, the present invention is indeed novel, useful, and non-obvious to be patentable. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
- The embodiments described above are only preferred ones of the present invention and not to limit the claimed scope of the present invention. Therefore, all the equivalent modifications and variations applying the specification and figures of the present invention should be embraced by the claimed scope of the present invention.
Claims (12)
1. A vapor chamber structure comprising:
a plate-shaped shell (1) having a hollow interior to form a cavity (12), wherein the plate-shaped shell (1) has a base (100) on which at least one throughhole (101) is disposed and the at least one throughhole (101) communicates with the cavity (12); and
at least one stretchable heated member (2) disposed on the base (100) of the plate-shaped shell (1), wherein the at least one stretchable heated member (2) comprises a heated plate (20) and a hollow stretchable tube (21), wherein the heated plate (20) is sealedly connected to one end of the stretchable tube (21), wherein the at least one throughhole (101) of the plate-shaped shell (1) is sealedly connected to the other end of the stretchable tube (21).
2. The vapor chamber structure according to claim 1 , wherein the plate-shaped shell (1) is formed by stacking a lower plate (10) and an upper plate (11), wherein the cavity (12) is formed between the lower plate (10) and the upper plate (11).
3. The vapor chamber structure according to claim 1 , wherein an internal wall of the cavity (12) is provided with a wick structure layer (120).
4. The vapor chamber structure according to claim 1 , wherein the stretchable tube (21) is a flexible or an elastic tube body with an enclosed edge.
5. The vapor chamber structure according to claim 4 , wherein the flexible tube body with the enclosed edge is a bellow.
6. The vapor chamber structure according to claim 4 , wherein the elastic tube body with the enclosed edge is a spring tube.
7. The vapor chamber structure according to claim 1 , wherein the stretchable tube (21) has a deformed segment (210), a first end opening (211), and a second end opening (212), wherein the first end opening (211) and the second end opening (212) are individually formed at two ends of the deformed segment (210), wherein the first end opening (211) is for sealing the heated plate (20) and the second end opening (212) is sealedly connected to the at least one throughhole (101).
8. The vapor chamber structure according to claim 1 , wherein an elastic device (22) is disposed in the at least one stretchable heated member (2) to push against the heated plate (20) outward.
9. The vapor chamber structure according to claim 1 , further comprising a capillary structure assembly (3) having a plurality of capillary structures (30, 31) which are floatingly connected to one another and are in turn connected between the at least one stretchable heated member (2) and the plate-shaped shell (1).
10. The vapor chamber structure according to claim 9 , wherein the capillary structures (30, 31) are grouped into a first capillary structure (30) and a second capillary structure (31), wherein a connecting hole (300) is disposed in the first capillary structure (30), wherein the second capillary structure (31) is sleeved into the connecting hole (300) such that the first capillary structure (30) and the second capillary structure (31) are floatingly connected to each other.
11. The vapor chamber structure according to claim 10 , wherein a wick structure layer (200) is disposed on an internal surface of the heated plate (20), wherein the first capillary structure (30) is disposed on the internal surface of the heated plate (20) and is connected to the wick structure layer (200) on the internal surface of the heated plate (20).
12. The vapor chamber structure according to claim 10 , wherein the connecting hole (300) is a throughhole or a blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/820,179 US20170038154A1 (en) | 2015-08-06 | 2015-08-06 | Vapor chamber structure having stretchable heated part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/820,179 US20170038154A1 (en) | 2015-08-06 | 2015-08-06 | Vapor chamber structure having stretchable heated part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20170038154A1 true US20170038154A1 (en) | 2017-02-09 |
Family
ID=58052496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/820,179 Abandoned US20170038154A1 (en) | 2015-08-06 | 2015-08-06 | Vapor chamber structure having stretchable heated part |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US20170038154A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10157814B1 (en) * | 2017-06-27 | 2018-12-18 | International Business Machines Corporation | Compliant heat sink |
| WO2020191473A1 (en) * | 2019-03-28 | 2020-10-01 | Huawei Technologies Co., Ltd. | Heat transfer structure and electronic assembly comprising such a heat transfer structure |
| US11076503B2 (en) * | 2019-01-21 | 2021-07-27 | Aptiv Technologies Limited | Thermally conductive insert element for electronic unit |
| US11415370B2 (en) * | 2019-09-04 | 2022-08-16 | Toyota Motor Engineering & Manutacturing North America, Inc. | Cooling systems comprising passively and actively expandable vapor chambers for cooling power semiconductor devices |
| US20230032004A1 (en) * | 2020-01-06 | 2023-02-02 | Lg Electronics Inc. | Display device |
| US12262509B2 (en) | 2020-03-04 | 2025-03-25 | Transport Phenomena Technologies, Llc | Compliant thermal management devices, systems, and methods of fabrication thereof |
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| US4712158A (en) * | 1985-03-28 | 1987-12-08 | Fujitsu Limited | Cooling system for electronic circuit components |
| US20040052052A1 (en) * | 2002-09-18 | 2004-03-18 | Rivera Rudy A. | Circuit cooling apparatus |
| US20090166005A1 (en) * | 2007-12-29 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Vapor chamber |
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| US4712158A (en) * | 1985-03-28 | 1987-12-08 | Fujitsu Limited | Cooling system for electronic circuit components |
| US20040052052A1 (en) * | 2002-09-18 | 2004-03-18 | Rivera Rudy A. | Circuit cooling apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10157814B1 (en) * | 2017-06-27 | 2018-12-18 | International Business Machines Corporation | Compliant heat sink |
| US11076503B2 (en) * | 2019-01-21 | 2021-07-27 | Aptiv Technologies Limited | Thermally conductive insert element for electronic unit |
| WO2020191473A1 (en) * | 2019-03-28 | 2020-10-01 | Huawei Technologies Co., Ltd. | Heat transfer structure and electronic assembly comprising such a heat transfer structure |
| US11415370B2 (en) * | 2019-09-04 | 2022-08-16 | Toyota Motor Engineering & Manutacturing North America, Inc. | Cooling systems comprising passively and actively expandable vapor chambers for cooling power semiconductor devices |
| US20220341668A1 (en) * | 2019-09-04 | 2022-10-27 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling systems comprising passively and actively expandable vapor chambers for cooling power semiconductor devices |
| US11879686B2 (en) * | 2019-09-04 | 2024-01-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Cooling systems comprising passively and actively expandable vapor chambers for cooling power semiconductor devices |
| US20230032004A1 (en) * | 2020-01-06 | 2023-02-02 | Lg Electronics Inc. | Display device |
| US12262509B2 (en) | 2020-03-04 | 2025-03-25 | Transport Phenomena Technologies, Llc | Compliant thermal management devices, systems, and methods of fabrication thereof |
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|---|---|---|---|
| AS | Assignment |
Owner name: CHAUN-CHOUNG TECHNOLOGY CORP., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:WANG, SHIH-MING;LIN, CHIA-HSUN;REEL/FRAME:036271/0604 Effective date: 20150701 |
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| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |