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US20140367081A1 - Cooling system - Google Patents

Cooling system Download PDF

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Publication number
US20140367081A1
US20140367081A1 US14/472,743 US201414472743A US2014367081A1 US 20140367081 A1 US20140367081 A1 US 20140367081A1 US 201414472743 A US201414472743 A US 201414472743A US 2014367081 A1 US2014367081 A1 US 2014367081A1
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US
United States
Prior art keywords
porous body
cooling
cooling system
electronic device
supply pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/472,743
Inventor
Yoichi Takasu
Tomoyuki Abe
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Fujitsu Ltd
Original Assignee
Fujitsu Ltd
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Filing date
Publication date
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Assigned to FUJITSU LIMITED reassignment FUJITSU LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ABE, TOMOYUKI, TAKASU, YOICHI
Publication of US20140367081A1 publication Critical patent/US20140367081A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/16—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the technique disclosed in the present application relates to a cooling system.
  • cooling devices having an electronic device, a supply pipe that supplies a cooling fluid to the electronic device, and a discharge pipe that discharges cooling fluid from the electronic device. Further, as such a cooling device, there is a cooling device that, in order to suppress condensation, maintains the temperature of the cooling fluid, that is supplied to the electronic device, higher than the temperature of the environment in which the electronic device is set.
  • a cooling system includes: an electronic device; a supply pipe that supplies a cooling fluid to the electronic device; a discharge pipe that discharges the cooling fluid from the electronic device; and a heat exchange portion that exchanges heat between the supply pipe and the discharge pipe in a case in which a temperature of the cooling fluid that flows through the supply pipe is lower than a dew point of an environment in which the electronic device is set.
  • FIG. 1 is a plan view of a cooling system relating to a first embodiment.
  • FIG. 2 is a cross-sectional view of a substrate.
  • FIG. 3 is a cross-sectional view of a heat exchange portion and the peripheral portion thereof.
  • FIG. 4 is a plan view of a cooling system relating to a second embodiment.
  • FIG. 5 is a plan view of a cooling system relating to a third embodiment.
  • FIG. 6 is a block diagram of a temperature detector, a humidity detector and a control section in the third embodiment.
  • FIG. 7 is a cross-sectional view illustrating a modified example of the heat exchange portion.
  • a cooling system 10 relating to a first embodiment of the technique disclosed in the present application has an electronic device 12 , a supply pipe 14 , a discharge pipe 16 , and a heat exchange portion 18 .
  • the electronic device 12 has a blowing portion 20 and a substrate 22 .
  • the blowing portion 20 is a fan for example, and forms a flow of cooling wind W at the interior of a housing 24 of the electronic device 12 .
  • the substrate 22 is accommodated within the housing 24 , and is disposed further toward the downstream side, of the flow of the cooling wind W, than the blowing portion 20 .
  • This substrate 22 has plural heat-generating bodies 31 , 32 , 33 , 34 , and a cooling section 40 .
  • the respective heat-generating bodies 31 through 34 are, for example, computing units (CPUs) or electronic parts or the like that are mounted to the substrate 22 , and consume electric power and generate heat.
  • other heat-generating bodies 35 , 36 , 37 such as memory modules (DIMMs) or the like for example are mounted to the substrate 22 .
  • DIMMs memory modules
  • the cooling section 40 has plural cooling members 41 , 42 , 43 , 44 .
  • the cooling member 41 is a cooling plate for example, and is formed in a hollow shape.
  • Plural fins 46 stand erect from the inner wall surface of this cooling member 41 .
  • the cooling member 41 is superposed on the heat-generating body 31 .
  • the other cooling members 42 through 44 also have structures that are similar to that of the cooling member 41 , and are superposed on the heat-generating bodies 32 through 34 respectively.
  • the supply pipe 14 is connected to the exit of an unillustrated cooling fluid circulating device and to the entrance of the cooling member 41 (the entrance of the cooling section 40 ).
  • the discharge pipe 16 is connected to the exit of the cooling member 44 (the exit of the cooling section 40 ) and to the entrance of the aforementioned cooling fluid circulating device.
  • the exit of the cooling member 41 and the entrance of the cooling member 42 are connected by a connecting pipe 51 .
  • the exit of the cooling member 42 and the entrance of the cooling member 43 are connected by a connecting pipe 52 .
  • the exit of the cooling member 43 and the entrance of the cooling member 44 are connected by a cooling pipe 53 .
  • cooling fluid when cooling fluid is sent-out from the unillustrated cooling fluid circulating device, this cooling fluid is supplied through the supply pipe 14 to the electronic device 12 , and returns from the electronic device 12 through the discharge pipe 16 to the aforementioned cooling fluid circulating device.
  • the cooling fluid that flows through the supply pipe 14 passes through the cooling member 41 , the connecting pipe 51 , the cooling member 42 , the connecting pipe 52 , the cooling member 43 , and the connecting pipe 53 , and reaches the cooling member 44 . Further, the cooling fluid that has reached the cooling members 41 through 44 passes-through the discharge pipe 16 and returns to the cooling fluid circulating device.
  • the heat-generating bodies 31 through 34 are cooled due to the cooling members 41 through 44 (the cooling section 40 ), through which the cooling fluid flows, and the heat-generating bodies 31 through 34 exchanging heat respectively.
  • the cooling fluid for example, water or the like is used as the cooling fluid in this case.
  • supply pipe 14 and discharge pipe 16 have parallel portions 14 A, 16 A that are provided parallel to one another.
  • the heat exchange portion 18 is provided at these parallel portions 14 A, 16 A.
  • the heat exchange portion 18 has a first porous body 62 and a second porous body 64 .
  • the first porous body 62 and the second porous body 64 are accommodated within the housing 24 .
  • the first porous body 62 is formed in an annular shape in cross-section, and is provided at the periphery of the supply pipe 14 .
  • the second porous body 64 is provided between the discharge pipe 16 and the first porous body 62 , and connects the discharge pipe 16 and the first porous body 62 .
  • the first porous body 62 and the second porous body 64 are formed of; for example, polyimide-based or fluorine-based resins.
  • first porous body 62 including the inner peripheral surfaces of the plural pores thereof, is subjected to a water-repelling treatment.
  • a Freon-based or silicone-based processing agent or the like for example is used in this water-repelling treatment.
  • the entire second porous body 64 including the inner peripheral surfaces of the plural pores thereof; is subjected to a hydrophilic treatment.
  • An acrylamide-based processing agent or the like for example is used in this hydrophilic treatment.
  • a pan 66 that is formed of a heat insulating material is provided beneath the first porous body 62 and the second porous body 64 .
  • flow of the cooling wind W is formed within the housing 24 by the above-described blowing portion 20 . Due to flow of the cooling wind W being formed within the housing 24 of the electronic device 12 in this way, the atmosphere of an environment 70 in which the electronic device 12 is set is supplied to the first porous body 62 and the second porous body 64 .
  • this cooling system 10 when cooling fluid is supplied from the unillustrated cooling fluid circulating device, the cooling fluid is supplied to the respective cooling members 41 through 44 . Then, the heat-generating bodies 31 through 34 are cooled due to the cooling members 41 through 44 , through which the cooling fluid flows, and the heat-generating bodies 31 through 34 exchanging heat respectively.
  • condensation does not occur at the supply pipe 14 .
  • the humidity of the periphery of the electronic device 12 becomes high locally and the dew point of the environment 70 becomes higher than the temperature of the cooling fluid because, for example, an operator enters into the computer room, condensation arises at the supply pipe 14 at the region of heat exchange by the heat exchange portion 18 .
  • the entire first porous body 62 including the inner peripheral surfaces of the plural pores thereof, is subjected to a water-repelling treatment
  • the entire second porous body 64 including the inner peripheral surfaces of the plural pores thereof, is subjected to a hydrophilic treatment. Accordingly, condensed water that is generated at the supply pipe 14 is absorbed by the first porous body 62 , and thereafter moves to the second porous body 64 .
  • thermal resistance between the supply pipe 14 and the discharge pipe 16 decreases, and heat moves from the high-temperature cooling fluid that flows through the discharge pipe 16 to the low-temperature cooling fluid that flows through the supply pipe 14 , and the temperature of the cooling fluid that flows through the supply pipe 14 rises.
  • cooling fluid in a case in which the temperature of the cooling fluid flowing through the supply pipe 14 is lower than the dew point of the environment 70 in which the electronic device 12 is set, heat is exchanged between the supply pipe 14 and the discharge pipe 16 by the heat exchange portion 18 . Accordingly, even in cases in which the humidity of the environment 70 in which the electronic device 12 is set rises locally, condensation on the substrate 22 can be suppressed. Accordingly, cooling fluid, whose temperature is lower than the temperature of the environment 70 , can be supplied to the electronic device 12 without providing an excess margin.
  • first porous body 62 and the second porous body 64 are used at the heat exchange portion 18 , heat can be exchanged by a simple structure.
  • a water-repelling treatment is carried out on the first porous body 62
  • a hydrophilic treatment is carried out on the second porous body 64 . Therefore, movement of condensed water can be carried out smoothly. Due thereto, heat exchange between the supply. pipe 14 and the discharge pipe 16 can be carried out rapidly.
  • the atmosphere of the environment 70 in which the electronic device 12 is set is supplied to the first porous body 62 and the second porous body 64 , rapid heat exchange that corresponds to the atmosphere of the environment 70 can be carried out.
  • first porous body 62 and the second porous body 64 are accommodated within the housing 24 of the electronic device 12 . Accordingly, the first porous body 62 and the second porous body 64 can be protected by the housing 24 while the atmosphere of the environment 70 in which the electronic device 12 is set is supplied to the first porous body 62 and the second porous body 64 by the blowing portion 20 .
  • the structure of a cooling system 80 that relates to a second embodiment of the technique disclosed in the present application and that is illustrated in FIG. 4 , is changed as follows as compared with the above-described cooling system 10 relating to the first embodiment.
  • a bent portion 14 B that is bent in a substantial U-shape as seen in plan view, is formed at a region further toward the upstream side than the region of heat exchange by the heat exchange portion 18 at the supply pipe 14 (the parallel portion 14 A), A radiator 82 is provided at this bent portion 14 B.
  • the bent portion 14 B and the radiator 82 are disposed further toward the downstream side, of the flow of the cooling wind W, than the substrate 22 .
  • this cooling wind can be cooled by the radiator 82 . Due thereto, a rise in the temperature of the environment 70 in which the electronic device 12 is set can be suppressed.
  • the structure of a cooling system 90 that relates to a third embodiment of the technique disclosed in the present. application and that is illustrated in FIG. 5 , is changed as follows as compared with the above-described cooling system 80 relating to the second embodiment.
  • a bypass pipe is added to this cooling system 90 .
  • This bypass pipe 92 is connected to a region that is further toward the upstream side than the region of heat exchange by the heat exchange portion 18 at the supply pipe 14 (the parallel portion 14 A) so as to bypass the parallel portion 14 A, and to a region that is further toward the downstream side than the region of heat exchange by the heat exchange portion 18 at the discharge pipe 16 (the parallel portion 16 A) so as to bypass the parallel portion 16 A.
  • a flow quantity adjusting portion 94 such as a flow quantity adjusting valve or the like for example, is provided at the fork between the bypass pipe 92 and the parallel portion 14 A. This flow quantity adjusting portion 94 adjusts the proportion of the quantity of flow of the cooling fluid that flows through the supply pipe 14 and the quantity of flow of the cooling fluid that flows through the bypass pipe 92 .
  • this cooling system 90 has a temperature detector 96 , a humidity detector 98 and a control section 100 .
  • the temperature detector 96 is provided in a vicinity of the entrance of the cooling section 40 , and detects the temperature of the cooling fluid that is supplied to the cooling section 40 .
  • the humidity detector 98 is set in the environment 70 , and detects the humidity (the relative humidity) of the environment 70 .
  • the control section 100 is, for example, an electronic circuit or the like that has a computing element (a CPU) and a storage device.
  • the flow quantity adjusting portion 94 is controlled by the control section 100 on the basis of the results of detection of the temperature detector 96 and the humidity detector 98 , such that the temperature of the cooling fluid that is supplied to the cooling section 40 becomes higher than the dew point of the environment 70 .
  • the flow quantity adjusting portion 94 is controlled such that the quantity of flow of the cooling fluid that is supplied to the cooling section 40 decreases. Due thereto, the temperature of the cooling fluid that flows through the discharge pipe 16 rises, and therefore, the temperature of the cooling fluid that flows through the supply pipe 14 also rises. As a result, condensation on the substrate 22 can be suppressed.
  • the flow quantity adjusting portion 94 is controlled such that the quantity of flow of the cooling fluid that is supplied to the cooling section 40 increases.
  • the control section 100 controls the flow quantity adjusting portion 94 on the basis of the results of detection of the temperature detector 96 and the humidity detector 98 , such that the temperature of the cooling fluid that is supplied to the cooling section 40 is kept within a given temperature range that is higher than the dew point of the environment 70 .
  • This given temperature range is set to temperatures that are higher than the dew point of the environment 70 and that can cool the heat-generating bodies 31 through 34 appropriately.
  • the temperature of the cooling fluid that is supplied to the cooling section 40 can be maintained at an appropriate value that is needed for cooling of the heat-generating bodies 31 through 34 , while being maintained higher than the dew point of the environment 70 . Due thereto, the heat-generating bodies 31 through 34 can be cooled appropriately.
  • condensed water is moved from the first porous body 62 to the second porous body 64 due to the first porous body 62 having been subjected to a water-repelling treatment and the second porous body 64 having been subjected to a hydrophilic treatment
  • the pore diameter of the respective pores of the first porous body 62 may be set to be larger than the pore diameter of the respective pores of the second porous body 64 .
  • condensed water may be moved from the first porous body 62 to the second porous body 64 by utilizing capillary action due to this difference in the pore diameters.
  • the pore diameter in this case is the average pore diameter of plural pores.
  • first porous body 62 may be subjected to a water-repelling treatment and the second porous body 64 may be subjected to a hydrophilic treatment, and in addition thereto, the pore diameter of the respective pores of the first porous body 62 may also be set to be larger than the pore diameter of the respective pores of the second porous body 64 .
  • the first porous body 62 and the second porous body 64 are accommodated within the housing 24 of the electronic device 12 .
  • the first porous body 62 and the second porous body 64 may be provided at the exterior of the housing 24 of the electronic device 12 .
  • the atmosphere of the environment 70 in which the electronic device 12 is set may be supplied to the first porous body 62 and the second porous body 64 .
  • the heat exchange portion 18 has first porous body 62 and the second porous body 64 in the above-described respective embodiments, the heat exchange portion 18 may have a water-repellant member 102 and a hydrophilic member 104 as illustrated in FIG. 7 .
  • the water-repellant member 102 is formed in an annular shape in cross-section, and is provided at the periphery of the supply pipe 14 .
  • This water-repellant member 102 is water-repellant due to, for example, the surface of a resin member being subjected to a water-repelling treatment, or the like.
  • the hydrophilic member 104 is provided between the discharge pipe 16 and the water-repellant member 102 , and connects the discharge pipe 16 and the water-repellant member 102 .
  • This hydrophilic member 104 is hydrophilic due to, for example, the surface of a resin member being subjected to a hydrophilic treatment, or the like.
  • the technique disclosed in the present application is not limited to the above, and, other than the above, may of course he implemented by being modified in various ways within a scope that does not depart from the gist thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An object in one aspect is to supply, to an electronic device, cooling fluid of a temperature lower than a temperature of an environment in which the electronic device is set. A cooling system has an electronic device, a supply pipe, a discharge pipe, and a heat exchange portion. The supply pipe supplies cooling fluid to the electronic device, and the discharge pipe discharges cooling fluid from the electronic device. The heat exchange portion exchanges heat between the supply pipe and the discharge pipe in a case in which a temperature of cooling fluid flowing through the supply pipe is lower than a dew point of an environment in which the electronic device is set.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This application is a continuation application of International Application No. PCT/JP/2012/056592, filed on Mar. 14, 2012, the disclosure of which is incorporated herein by reference in its entirety.
    • FIELD
  • The technique disclosed in the present application relates to a cooling system.
    • BACKGROUND
  • There are known cooling devices having an electronic device, a supply pipe that supplies a cooling fluid to the electronic device, and a discharge pipe that discharges cooling fluid from the electronic device. Further, as such a cooling device, there is a cooling device that, in order to suppress condensation, maintains the temperature of the cooling fluid, that is supplied to the electronic device, higher than the temperature of the environment in which the electronic device is set.
    • Related Patent Documents
  • Japanese Laid-Open Patent Publication No. H7-218075
    • SUMMARY
  • According to an aspect of the embodiments, a cooling system includes: an electronic device; a supply pipe that supplies a cooling fluid to the electronic device; a discharge pipe that discharges the cooling fluid from the electronic device; and a heat exchange portion that exchanges heat between the supply pipe and the discharge pipe in a case in which a temperature of the cooling fluid that flows through the supply pipe is lower than a dew point of an environment in which the electronic device is set.
  • The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
  • It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive invention.
    • BRIEF DESCRIPTION OF DRAWINGS
  • FIG. 1 is a plan view of a cooling system relating to a first embodiment.
  • FIG. 2 is a cross-sectional view of a substrate.
  • FIG. 3 is a cross-sectional view of a heat exchange portion and the peripheral portion thereof.
  • FIG. 4 is a plan view of a cooling system relating to a second embodiment.
  • FIG. 5 is a plan view of a cooling system relating to a third embodiment.
  • FIG. 6 is a block diagram of a temperature detector, a humidity detector and a control section in the third embodiment.
  • FIG. 7 is a cross-sectional view illustrating a modified example of the heat exchange portion.
    •  DESCRIPTION OF EMBODIMENTS First Embodiment
  • A first embodiment of the technique disclosed in the present application is described first.
  • As illustrated in FIG. 1, a cooling system 10 relating to a first embodiment of the technique disclosed in the present application has an electronic device 12, a supply pipe 14, a discharge pipe 16, and a heat exchange portion 18.
  • The electronic device 12 has a blowing portion 20 and a substrate 22. The blowing portion 20 is a fan for example, and forms a flow of cooling wind W at the interior of a housing 24 of the electronic device 12. The substrate 22 is accommodated within the housing 24, and is disposed further toward the downstream side, of the flow of the cooling wind W, than the blowing portion 20.
  • This substrate 22 has plural heat-generating bodies 31, 32, 33, 34, and a cooling section 40. The respective heat-generating bodies 31 through 34 are, for example, computing units (CPUs) or electronic parts or the like that are mounted to the substrate 22, and consume electric power and generate heat. Further, in addition to the beat-generating bodies 31 through 34, other heat-generating bodies 35, 36, 37 such as memory modules (DIMMs) or the like for example are mounted to the substrate 22.
  • The cooling section 40 has plural cooling members 41, 42, 43, 44. As illustrated in FIG. 2, the cooling member 41 is a cooling plate for example, and is formed in a hollow shape. Plural fins 46 stand erect from the inner wall surface of this cooling member 41. The cooling member 41 is superposed on the heat-generating body 31. The other cooling members 42 through 44 also have structures that are similar to that of the cooling member 41, and are superposed on the heat-generating bodies 32 through 34 respectively.
  • The supply pipe 14 is connected to the exit of an unillustrated cooling fluid circulating device and to the entrance of the cooling member 41 (the entrance of the cooling section 40). The discharge pipe 16 is connected to the exit of the cooling member 44 (the exit of the cooling section 40) and to the entrance of the aforementioned cooling fluid circulating device.
  • Further, the exit of the cooling member 41 and the entrance of the cooling member 42 are connected by a connecting pipe 51. The exit of the cooling member 42 and the entrance of the cooling member 43 are connected by a connecting pipe 52. Further, the exit of the cooling member 43 and the entrance of the cooling member 44 are connected by a cooling pipe 53.
  • Further, when cooling fluid is sent-out from the unillustrated cooling fluid circulating device, this cooling fluid is supplied through the supply pipe 14 to the electronic device 12, and returns from the electronic device 12 through the discharge pipe 16 to the aforementioned cooling fluid circulating device.
  • Namely, more concretely, the cooling fluid that flows through the supply pipe 14 passes through the cooling member 41, the connecting pipe 51, the cooling member 42, the connecting pipe 52, the cooling member 43, and the connecting pipe 53, and reaches the cooling member 44. Further, the cooling fluid that has reached the cooling members 41 through 44 passes-through the discharge pipe 16 and returns to the cooling fluid circulating device.
  • Further, at this time, the heat-generating bodies 31 through 34 are cooled due to the cooling members 41 through 44 (the cooling section 40), through which the cooling fluid flows, and the heat-generating bodies 31 through 34 exchanging heat respectively. For example, water or the like is used as the cooling fluid in this case.
  • Further, the above-described supply pipe 14 and discharge pipe 16 have parallel portions 14A, 16A that are provided parallel to one another. The heat exchange portion 18 is provided at these parallel portions 14A, 16A.
  • As illustrated in FIG. 3, the heat exchange portion 18 has a first porous body 62 and a second porous body 64. The first porous body 62 and the second porous body 64 are accommodated within the housing 24.
  • The first porous body 62 is formed in an annular shape in cross-section, and is provided at the periphery of the supply pipe 14. On the other hand, the second porous body 64 is provided between the discharge pipe 16 and the first porous body 62, and connects the discharge pipe 16 and the first porous body 62. The first porous body 62 and the second porous body 64 are formed of; for example, polyimide-based or fluorine-based resins.
  • Further, the entire first porous body 62, including the inner peripheral surfaces of the plural pores thereof, is subjected to a water-repelling treatment. A Freon-based or silicone-based processing agent or the like for example is used in this water-repelling treatment. On the other hand, the entire second porous body 64, including the inner peripheral surfaces of the plural pores thereof; is subjected to a hydrophilic treatment. An acrylamide-based processing agent or the like for example is used in this hydrophilic treatment. A pan 66 that is formed of a heat insulating material is provided beneath the first porous body 62 and the second porous body 64.
  • Further, as illustrated in FIG. 1, flow of the cooling wind W is formed within the housing 24 by the above-described blowing portion 20. Due to flow of the cooling wind W being formed within the housing 24 of the electronic device 12 in this way, the atmosphere of an environment 70 in which the electronic device 12 is set is supplied to the first porous body 62 and the second porous body 64.
  • Operation and effects of the first embodiment of the technique disclosed in the present application are described next.
  • In this cooling system 10, when cooling fluid is supplied from the unillustrated cooling fluid circulating device, the cooling fluid is supplied to the respective cooling members 41 through 44. Then, the heat-generating bodies 31 through 34 are cooled due to the cooling members 41 through 44, through which the cooling fluid flows, and the heat-generating bodies 31 through 34 exchanging heat respectively.
  • At this time, if, for exam , the atmosphere of the environment 70 is sufficiently dry and the dew point of this environment 70 is lower than the temperature of the cooling fluid, condensation does not occur at the supply pipe 14. On the other hand, if the humidity of the periphery of the electronic device 12 becomes high locally and the dew point of the environment 70 becomes higher than the temperature of the cooling fluid because, for example, an operator enters into the computer room, condensation arises at the supply pipe 14 at the region of heat exchange by the heat exchange portion 18.
  • Here, as described above, the entire first porous body 62, including the inner peripheral surfaces of the plural pores thereof, is subjected to a water-repelling treatment, and the entire second porous body 64, including the inner peripheral surfaces of the plural pores thereof, is subjected to a hydrophilic treatment. Accordingly, condensed water that is generated at the supply pipe 14 is absorbed by the first porous body 62, and thereafter moves to the second porous body 64. As a result, thermal resistance between the supply pipe 14 and the discharge pipe 16 decreases, and heat moves from the high-temperature cooling fluid that flows through the discharge pipe 16 to the low-temperature cooling fluid that flows through the supply pipe 14, and the temperature of the cooling fluid that flows through the supply pipe 14 rises.
  • In this way, in accordance with the cooling system 10, in a case in which the temperature of the cooling fluid flowing through the supply pipe 14 is lower than the dew point of the environment 70 in which the electronic device 12 is set, heat is exchanged between the supply pipe 14 and the discharge pipe 16 by the heat exchange portion 18. Accordingly, even in cases in which the humidity of the environment 70 in which the electronic device 12 is set rises locally, condensation on the substrate 22 can be suppressed. Accordingly, cooling fluid, whose temperature is lower than the temperature of the environment 70, can be supplied to the electronic device 12 without providing an excess margin.
  • Moreover, because the first porous body 62 and the second porous body 64 are used at the heat exchange portion 18, heat can be exchanged by a simple structure.
  • Further, a water-repelling treatment is carried out on the first porous body 62, and a hydrophilic treatment is carried out on the second porous body 64. Therefore, movement of condensed water can be carried out smoothly. Due thereto, heat exchange between the supply. pipe 14 and the discharge pipe 16 can be carried out rapidly.
  • Further, because the atmosphere of the environment 70 in which the electronic device 12 is set is supplied to the first porous body 62 and the second porous body 64, rapid heat exchange that corresponds to the atmosphere of the environment 70 can be carried out.
  • Further, the first porous body 62 and the second porous body 64 are accommodated within the housing 24 of the electronic device 12. Accordingly, the first porous body 62 and the second porous body 64 can be protected by the housing 24 while the atmosphere of the environment 70 in which the electronic device 12 is set is supplied to the first porous body 62 and the second porous body 64 by the blowing portion 20.
    • Second Embodiment
  • A second embodiment of the technique disclosed in the present application is described next.
  • The structure of a cooling system 80, that relates to a second embodiment of the technique disclosed in the present application and that is illustrated in FIG. 4, is changed as follows as compared with the above-described cooling system 10 relating to the first embodiment.
  • Namely, a bent portion 14B, that is bent in a substantial U-shape as seen in plan view, is formed at a region further toward the upstream side than the region of heat exchange by the heat exchange portion 18 at the supply pipe 14 (the parallel portion 14A), A radiator 82 is provided at this bent portion 14B. The bent portion 14B and the radiator 82 are disposed further toward the downstream side, of the flow of the cooling wind W, than the substrate 22.
  • Accordingly, in accordance with the cooling system 10, even if the temperature of the cooling wind rises due to the heat-generating bodies 31 through 34 that are mounted to the substrate 22 or due to the other heat-generating bodies 35 through 37, this cooling wind can be cooled by the radiator 82. Due thereto, a rise in the temperature of the environment 70 in which the electronic device 12 is set can be suppressed.
    • Third Embodiment
  • A third embodiment of the technique disclosed in the present application is described next.
  • The structure of a cooling system 90, that relates to a third embodiment of the technique disclosed in the present. application and that is illustrated in FIG. 5, is changed as follows as compared with the above-described cooling system 80 relating to the second embodiment.
  • Namely, a bypass pipe is added to this cooling system 90. This bypass pipe 92 is connected to a region that is further toward the upstream side than the region of heat exchange by the heat exchange portion 18 at the supply pipe 14 (the parallel portion 14A) so as to bypass the parallel portion 14A, and to a region that is further toward the downstream side than the region of heat exchange by the heat exchange portion 18 at the discharge pipe 16 (the parallel portion 16A) so as to bypass the parallel portion 16A.
  • Further, a flow quantity adjusting portion 94, such as a flow quantity adjusting valve or the like for example, is provided at the fork between the bypass pipe 92 and the parallel portion 14A. This flow quantity adjusting portion 94 adjusts the proportion of the quantity of flow of the cooling fluid that flows through the supply pipe 14 and the quantity of flow of the cooling fluid that flows through the bypass pipe 92.
  • Moreover, as illustrated in FIG. 6, this cooling system 90 has a temperature detector 96, a humidity detector 98 and a control section 100.
  • The temperature detector 96 is provided in a vicinity of the entrance of the cooling section 40, and detects the temperature of the cooling fluid that is supplied to the cooling section 40, The humidity detector 98 is set in the environment 70, and detects the humidity (the relative humidity) of the environment 70. The control section 100 is, for example, an electronic circuit or the like that has a computing element (a CPU) and a storage device.
  • Further, in this cooling system 90, the flow quantity adjusting portion 94 is controlled by the control section 100 on the basis of the results of detection of the temperature detector 96 and the humidity detector 98, such that the temperature of the cooling fluid that is supplied to the cooling section 40 becomes higher than the dew point of the environment 70.
  • Accordingly, for example, in a case such as when the temperature of the cooling fluid supplied to the cooling section 40 becomes less than or equal to the dew point of the environment 70, the flow quantity adjusting portion 94 is controlled such that the quantity of flow of the cooling fluid that is supplied to the cooling section 40 decreases. Due thereto, the temperature of the cooling fluid that flows through the discharge pipe 16 rises, and therefore, the temperature of the cooling fluid that flows through the supply pipe 14 also rises. As a result, condensation on the substrate 22 can be suppressed.
  • Further, for example, in a case in which the temperature of the cooling fluid supplied to the cooling section 40 is sufficiently higher than the dew point of the environment 70, the flow quantity adjusting portion 94 is controlled such that the quantity of flow of the cooling fluid that is supplied to the cooling section 40 increases. Namely, the control section 100 controls the flow quantity adjusting portion 94 on the basis of the results of detection of the temperature detector 96 and the humidity detector 98, such that the temperature of the cooling fluid that is supplied to the cooling section 40 is kept within a given temperature range that is higher than the dew point of the environment 70. This given temperature range is set to temperatures that are higher than the dew point of the environment 70 and that can cool the heat-generating bodies 31 through 34 appropriately.
  • Accordingly, the temperature of the cooling fluid that is supplied to the cooling section 40 can be maintained at an appropriate value that is needed for cooling of the heat-generating bodies 31 through 34, while being maintained higher than the dew point of the environment 70. Due thereto, the heat-generating bodies 31 through 34 can be cooled appropriately.
  • Modified examples of the above-described respective embodiments are described next.
  • In the above-described respective embodiments, condensed water is moved from the first porous body 62 to the second porous body 64 due to the first porous body 62 having been subjected to a water-repelling treatment and the second porous body 64 having been subjected to a hydrophilic treatment, However, other than this, for example, the pore diameter of the respective pores of the first porous body 62 may be set to be larger than the pore diameter of the respective pores of the second porous body 64. Then, condensed water may be moved from the first porous body 62 to the second porous body 64 by utilizing capillary action due to this difference in the pore diameters. Note that the pore diameter in this case is the average pore diameter of plural pores.
  • Even with such a structure, movement of condensed water, that is generated at the supply pipe 14, from the first porous body 62 to the second porous body 64 can be carried out smoothly. Due thereto, the thermal resistance between the supply pipe 14 and the discharge pipe 16 falls, and therefore, as a result, heat exchange between the supply pipe 14 and the discharge pipe 16 can be carried out rapidly in the same way as in the above-described embodiments.
  • Further, the first porous body 62 may be subjected to a water-repelling treatment and the second porous body 64 may be subjected to a hydrophilic treatment, and in addition thereto, the pore diameter of the respective pores of the first porous body 62 may also be set to be larger than the pore diameter of the respective pores of the second porous body 64.
  • Further, in the above-described respective embodiments, the first porous body 62 and the second porous body 64 are accommodated within the housing 24 of the electronic device 12. However, the first porous body 62 and the second porous body 64 may be provided at the exterior of the housing 24 of the electronic device 12. Further, due thereto, the atmosphere of the environment 70 in which the electronic device 12 is set may be supplied to the first porous body 62 and the second porous body 64.
  • Although the heat exchange portion 18 has first porous body 62 and the second porous body 64 in the above-described respective embodiments, the heat exchange portion 18 may have a water-repellant member 102 and a hydrophilic member 104 as illustrated in FIG. 7.
  • The water-repellant member 102 is formed in an annular shape in cross-section, and is provided at the periphery of the supply pipe 14. This water-repellant member 102 is water-repellant due to, for example, the surface of a resin member being subjected to a water-repelling treatment, or the like. On the other hand, the hydrophilic member 104 is provided between the discharge pipe 16 and the water-repellant member 102, and connects the discharge pipe 16 and the water-repellant member 102. This hydrophilic member 104 is hydrophilic due to, for example, the surface of a resin member being subjected to a hydrophilic treatment, or the like.
  • Even with such a structure, movement of condensed water, that is generated at the supply pipe 14, from the water-repellant member 102 to the hydrophilic member 104 can be carried out smoothly. Due thereto, the thermal resistance between the supply pipe 14 and the discharge pipe 16 falls, and therefore, as a result, heat exchange between the supply pipe 14 and the discharge pipe 16 can be carried out rapidly in the same way as in the above-described embodiments.
  • Although an aspect of the technique disclosed in the present application s been described above, the technique disclosed in the present application is not limited to the above, and, other than the above, may of course he implemented by being modified in various ways within a scope that does not depart from the gist thereof
  • All cited documents, patent applications and technical standards mentioned in the present specification are incorporated by reference in the present specification to the same extent as if the individual cited documents, patent applications and technical standards were specifically and individually incorporated by reference in the present specification.
  • All examples and conditional language provided herein are intended for the pedagogical purposes of aiding the reader in understanding. the invention and the concepts contributed by the inventor to further the art, and are not to be construed as limitations to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although one or more embodiments of the present invention have been described in detail, it should be understood that various changes, substitutions and alterations could be made hereto without departing from the spirit and scope of the invention.

Claims (18)

What is claimed is:
1. A cooling system comprising:
an electronic device;
a supply pipe that supplies a cooling fluid to the electronic device;
a discharge pipe that discharges the cooling fluid from the electronic device; and
a heat exchange portion that exchanges heat between the supply pipe and the discharge pipe in a case in which a temperature of the cooling fluid that flows through the supply pipe is lower than a dew point of an environment in which the electronic device is set.
2. The cooling system of claim 1, wherein the heat exchange portion has
a first porous body that is provided at the supply pipe, and
a second porous body that connects the discharge pipe and the first porous body.
3. The cooling system of claim 2, wherein
the first porous body is subjected to a water-repelling treatment, and
the second porous body is subjected to a hydrophilic treatment,
4. The cooling system of claim 3, wherein a Freon-based or a silicone-based processing agent is us d in the water-repelling treatment.
5. The cooling system of claim 3, wherein an acrylamide-based processing agent is used in the hydrophilic treatment.
6. The cooling system of claim 2, wherein a pore diameter of the first porous body is set to be larger than a pore diameter of the second porous body.
7. The cooling system of claim 2, wherein atmosphere of the environment is supplied to the first porous body and the second porous body.
8. The cooling system of claim 7, wherein
the first porous body and the second porous body are accommodated within a housing of the electronic device, and
the atmosphere of the environment is supplied to the first porous body and the second porous body by a flow of cooling wind being formed within the housing by a blowing portion.
9. The cooling system of claim 2, wherein the first porous body is provided at a periphery of the supply pipe.
10. The cooling system of claim 2, wherein the first porous body and the second porous body are formed of polyimide-based or fluorine-based resins.
11. The cooling system of claim 1, wherein the heat exchange portion has
a water-repellant member that is provided at the supply pipe, and
a hydrophilic member that connects the discharge pipe and the water-repellant member.
12. The cooling system of claim 1, wherein
the supply pipe and the discharge pipe have parallel portions that are provided parallel to one another, and
the heat exchange portion is provided at the parallel portions.
13. The cooling system of claim 1, wherein
the electronic device has a substrate to which a heat-generating body is mounted, and a cooling section that exchanges heat with the heat-generating body, and
the supply pipe supplies the cooling fluid to the cooling section.
14. The cooling system of claim 1, further comprising:
a blowing portion that forms a flow of cooling wind within a housing of the electronic device; and
a radiator that is provided at the supply pipe and that is disposed further toward a downstream side, of the flow of the cooling wind, than a substrate that is accommodated within the housing and to which a heat-generating body is mounted.
15. The cooling system of claim 14, wherein
a bent portion, that is bent in a substantial U-shape as seen in plan view, is formed at a region of the supply pipe which region is further toward an upstream side than a region of heat exchange by the heat exchange portion, and
the radiator is provided at the bent portion.
16. The cooling system of claim 1, further comprising:
a bypass pipe that connects a region that is further toward an upstream side than a region of beat exchange by the heat exchange portion at the supply pipe, and a region that is further toward a downstream side than a region of heat exchange by the heat exchange portion at the discharge pipe; and
a flow quantity adjusting portion that adjusts a proportion of a quantity of flow of the cooling fluid that flows through the supply pipe and a quantity of flow of the cooling fluid that flows through the bypass pipe.
17. The cooling system of claim 16, further comprising:
a temperature detector that detects a temperature of the cooling fluid supplied to the electronic device;
a humidity detector that detects a humidity of the environment; and
a control section that controls the flow quantity adjusting portion on the basis of results of detection of the temperature detector and the humidity detector, such that the temperature of the cooling fluid supplied to the electronic device becomes higher than a dew point of the environment.
18. The cooling system of claim 17, wherein the control section controls the flow quantity adjusting portion on the basis of the results of detection of the temperature detector and the humidity detector, such that the temperature of the cooling fluid supplied to the electronic device is kept within a given temperature range that is higher than the dew point of the environment.
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