US20140141211A1 - Method for self-assembly of arbitrary metal patterns on DNA scaffolds - Google Patents
Method for self-assembly of arbitrary metal patterns on DNA scaffolds Download PDFInfo
- Publication number
- US20140141211A1 US20140141211A1 US11/978,219 US97821907A US2014141211A1 US 20140141211 A1 US20140141211 A1 US 20140141211A1 US 97821907 A US97821907 A US 97821907A US 2014141211 A1 US2014141211 A1 US 2014141211A1
- Authority
- US
- United States
- Prior art keywords
- scaffold
- dna
- metal
- plating
- act
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 109
- 239000002184 metal Substances 0.000 title claims abstract description 109
- 238000000034 method Methods 0.000 title claims abstract description 87
- 238000001338 self-assembly Methods 0.000 title abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 62
- 239000002086 nanomaterial Substances 0.000 claims abstract description 52
- 150000007523 nucleic acids Chemical group 0.000 claims abstract description 38
- 230000008569 process Effects 0.000 claims abstract description 15
- 238000007772 electroless plating Methods 0.000 claims abstract description 14
- 108020004414 DNA Proteins 0.000 claims description 107
- 239000002105 nanoparticle Substances 0.000 claims description 80
- 238000007747 plating Methods 0.000 claims description 30
- 102000053602 DNA Human genes 0.000 claims description 26
- 102000039446 nucleic acids Human genes 0.000 claims description 25
- 108020004707 nucleic acids Proteins 0.000 claims description 25
- 108020004682 Single-Stranded DNA Proteins 0.000 claims description 23
- YBJHBAHKTGYVGT-ZKWXMUAHSA-N (+)-Biotin Chemical compound N1C(=O)N[C@@H]2[C@H](CCCCC(=O)O)SC[C@@H]21 YBJHBAHKTGYVGT-ZKWXMUAHSA-N 0.000 claims description 12
- 239000002070 nanowire Substances 0.000 claims description 12
- 150000003141 primary amines Chemical class 0.000 claims description 9
- 229940127073 nucleoside analogue Drugs 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 7
- 229960002685 biotin Drugs 0.000 claims description 6
- 235000020958 biotin Nutrition 0.000 claims description 6
- 239000011616 biotin Substances 0.000 claims description 6
- 150000003573 thiols Chemical class 0.000 claims description 6
- 230000000295 complement effect Effects 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 5
- 125000002091 cationic group Chemical group 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 25
- 229910052737 gold Inorganic materials 0.000 description 20
- 239000010931 gold Substances 0.000 description 20
- 150000002739 metals Chemical class 0.000 description 15
- 239000000872 buffer Substances 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 238000000151 deposition Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910021645 metal ion Inorganic materials 0.000 description 7
- 239000002082 metal nanoparticle Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 238000004630 atomic force microscopy Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 230000009870 specific binding Effects 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052770 Uranium Inorganic materials 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 239000011133 lead Chemical group 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000010936 titanium Chemical group 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical group [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Chemical group 0.000 description 3
- JKMHFZQWWAIEOD-UHFFFAOYSA-N 2-[4-(2-hydroxyethyl)piperazin-1-yl]ethanesulfonic acid Chemical compound OCC[NH+]1CCN(CCS([O-])(=O)=O)CC1 JKMHFZQWWAIEOD-UHFFFAOYSA-N 0.000 description 2
- 108020004635 Complementary DNA Proteins 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000027455 binding Effects 0.000 description 2
- 238000010804 cDNA synthesis Methods 0.000 description 2
- 239000002299 complementary DNA Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- QYFRTHZXAGSYGT-UHFFFAOYSA-L hexaaluminum dipotassium dioxosilane oxygen(2-) difluoride hydrate Chemical compound O.[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[K+].[K+].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O QYFRTHZXAGSYGT-UHFFFAOYSA-L 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 2
- 239000011654 magnesium acetate Substances 0.000 description 2
- 235000011285 magnesium acetate Nutrition 0.000 description 2
- 229940069446 magnesium acetate Drugs 0.000 description 2
- 229910001629 magnesium chloride Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229940078494 nickel acetate Drugs 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- PIEPQKCYPFFYMG-UHFFFAOYSA-N tris acetate Chemical compound CC(O)=O.OCC(N)(CO)CO PIEPQKCYPFFYMG-UHFFFAOYSA-N 0.000 description 2
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 239000007995 HEPES buffer Substances 0.000 description 1
- 108091036060 Linker DNA Proteins 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 108091028043 Nucleic acid sequence Proteins 0.000 description 1
- 240000004001 Physalis peruviana Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 235000011148 calcium chloride Nutrition 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002408 directed self-assembly Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910001425 magnesium ion Inorganic materials 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 239000006174 pH buffer Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004416 surface enhanced Raman spectroscopy Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- RWQNBRDOKXIBIV-UHFFFAOYSA-N thymine Chemical class CC1=CNC(=O)NC1=O RWQNBRDOKXIBIV-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
Definitions
- the present invention relates to DNA-based nanotechnology. More specifically, the present invention relates to a method for the creation of arbitrarily-shaped metal nanostructures using DNA and other nucleic acid scaffolds.
- DNA-based nanotechnology is a growing field.
- the specificity and combinatorial programmability of the Watson-Crick binding interactions between the subunits of DNA makes the molecule an ideal candidate for creating nanostructures of set patterns.
- the nanometer scale structural geometry of the DNA self-assembled nanostructures also provides an ideal building block for directed self-assembly of nanometer-scale materials with sub-nanometer precision and programmability.
- the resulting nanostructures created from nanometer-scale materials such as metals may be used to construct devices in the fields of nanoelectronics and nanophotonics.
- the ability to form patterns upon a scaffold upon which electro-less metal plating can be directed allows for higher precision in the formation of specifically-shaped metal nanostructures.
- Methods with controlled-growth processes allow for active selection of the dimensions, positions, and alignments of patterns on scaffolds to create the different shapes of the metal nanostructures.
- Such metal nanostructures may provide for novel uses in the field of nanoelectronics and nanophotonics.
- Other applications include quantum electronic devices based on quantized conductance, control of electronic properties of patterned materials, plasmonic materials for concentration of light, plasmonic materials for waveguiding, plasmonic materials for nonlinear optics, X-ray and short-wavelength optics, including waveguides and gratings, semiconductor metrology standards, nanometer-scale non-local energy transport, microwave and terahertz applications including field effect transistors and emitters, coupling to quantum dots to make composite materials and/or circuits and/or luminescence enhancement, bright tags through plasmon enhancement of dies or q-dots, plasmonic circuits for light manipulation, and surface adsorption chemical sensors, surface enhanced raman scattering, etc.
- the present invention overcomes the aforementioned limitations and fills the aforementioned needs by providing methods for assembly of arbitrarily-shaped metal nanostructures.
- the method comprises acts of fabricating a scaffold, patterning a first material on a scaffold, and plating a metal on the first material, whereby an arbitrarily-shaped metal nanostructure is created based on a pattern formed by the first material on the scaffold and whereby the metal nanostructure is not constrained by a shape of the scaffold itself.
- the scaffold is fabricated from a material selected from a group consisting of a plurality of nucleic acids, DNA origami, DNA ribbons, two-dimensional DNA crystals, and three-dimensional DNA constructions.
- the plurality of nucleic acids is selected from a group consisting of a charged nucleic acid strands, an uncharged nucleic acid strands, DNA, PNA, RNA, LNA, chemically modified DNA, nucleoside analogues, and combinations thereof.
- the act of plating comprises an electro-less plating process.
- the first material comprises a single-stranded material selected from a group consisting of single-stranded forms of DNA, RNA, LNA, PNA, a nucleoside analogue, a polymer, and combinations thereof.
- the first material has a first end and second end.
- the act of patterning the first material on the scaffold further comprises an act of attaching the first material with the scaffold so that the first material projects from the scaffold.
- the act of attaching the first material to the scaffold comprises an attachment mechanism selected from a group consisting of attaching the first end of the first material with the scaffold, attaching the first end and the second end of the first material with the scaffold, and a combination thereof, whereby a plurality of conformations of the first material are projected from the scaffold.
- the plurality of conformations is selected from a group consisting of single open strands, loops, closed rings, a series of interlocking rings, and locked knotted topologies.
- the electro-less plating process further comprises using a 2+ cationic solution whereby the solution blocks the plating of metal on the scaffold and thereby allows plating of metal on the first material.
- the method further comprises an act of placing the scaffold on a negatively charged surface.
- the negatively charged surface comprises a material selected from a group consisting of muscovite mica, cleaned silicon dioxide, and a surface that has been modified to display negatively charged groups at a specific surface density.
- the first material is a nanowire.
- the nanowire comprises metal
- the first material comprises a plurality of nanoparticles.
- the nanoparticle comprises a metal nanoparticle selected from a group consisting of gold, silver, molybdenum, nickel, copper, and commercially-available nanoparticles.
- the nanoparticle further comprises a nucleic acid strand, wherein the nucleic acid strand further comprises a linker, whereby the linker will bind to a complementary nucleic acid pattern on the scaffold.
- the act of fabricating the scaffold further comprises the act of incorporating a plurality of nanoparticle attachment linker sites on the scaffold.
- the plurality of nanoparticle attachment linker sites is selected from a group consisting of biotin, primary amines, thiols, and commercially-available nanoparticle attachment linker sites.
- the act of patterning the first material on the scaffold further comprises the act of attaching the first material with the plurality of nanoparticle attachment linker sites.
- the metal is selected from a group consisting of gold, silver, platinum, copper, titanium, nickel, zinc, lead, uranium, iron, palladium, and a metal structure.
- Another method according to the present invention comprises the acts of fabricating a DNA scaffold, selecting a sequence-specific DNA hook projecting from the DNA scaffold, fabricating a single-stranded DNA lantern strand, attaching one or more single-stranded DNA lantern strands with two or more sequence-specific DNA hooks projecting from the DNA scaffold and plating a metal on the single stranded DNA lantern strand whereby an arbitrarily-shaped metal nanostructure may be created based on a pattern formed by the nanoparticles attached with the single-stranded DNA lantern strands and whereby the metal nanostructure is not constrained by a shape of the scaffold itself.
- the single-stranded DNA lantern strand further comprises one or more nanoparticle attachment linker sites.
- the method comprises the acts of attaching one or more nanoparticles with the nanoparticle attachment linker sites and plating a metal on the nanoparticles whereby an arbitrarily-shaped metal nanostructure may be created based on a pattern formed by the nanoparticles attached with the nanoparticle attachment linker sites and whereby the metal nanostructure is not constrained by the shape of the scaffold itself.
- the method comprises the acts of attaching one or more nanowires with the nanoparticle attachment linker sites and plating a metal on the nanowires whereby an arbitrarily-shaped metal nanostructure may be created based on a pattern formed by the nanowires attached with the nanoparticle attachment linker sites and whereby the metal nanostructure is not constrained by the shape of the scaffold itself.
- the scaffold is fabricated by a material selected from a group consisting of a plurality of nucleic acids, DNA origami, DNA ribbons, two-dimensional DNA crystals, and three-dimensional DNA constructions.
- the plurality of nucleic acids is selected from a group consisting of a charged nucleic acid strands, an uncharged nucleic acid strands, DNA, PNA, RNA, LNA, chemically modified DNA, nucleoside analogues, and combinations thereof.
- the act of plating comprises an electro-less plating process.
- the nanoparticle comprises a metal nanoparticle selected from a group consisting of gold, silver, molybdenum, nickel, copper, and commercially-available nanoparticles.
- the plurality of nanoparticle attachment linker sites is selected from a group consisting of biotin, primary amines, thiols, and commercially-available nanoparticle attachment linker sites.
- the metal is selected from a group consisting of gold, silver, platinum, copper, titanium, nickel, zinc, lead, uranium, iron, palladium, and a metal structure.
- the present invention includes an arbitrarily-shaped metal nanostructures formed according to all methods described herein.
- FIG. 1A is an illustration a method for self-assembly of arbitrarily shaped metal nanostructures using single-stranded molecules patterned on nucleic acid scaffolds according to the present invention
- FIG. 1B is an illustration of a conformation formed by a single-stranded material on a scaffold according to the present invention
- FIGS. 2A and 2B are illustrations of a method for self-assembly of arbitrarily shaped metal nanostructures using metal nanoparticles patterned on nucleic acid scaffolds according to the present invention
- FIGS. 3A-3C are illustrations of a method for self-assembly of arbitrarily shaped metal nanostructures using sequence-specific DNA hooks patterned on nucleic acid scaffolds according to the present invention
- FIGS. 4A and 4B are illustrations of attachments of single-stranded DNA lantern strands with sequence-specific DNA hooks according to the present invention.
- FIGS. 5-8 are images of atomic force microscopy (AFM) scans of gold nanowire structures created according to the present invention.
- the present invention relates to methods for creating self-assembled arbitrarily-shaped metal nanostructures. More specifically, the present invention relates to methods for self-assembly of arbitrarily-shaped metal nanostructure using patterns placed upon a nucleic acid scaffold.
- the following description, taken in conjunction with the referenced drawings, is presented to enable one of ordinary skill in the art to make and use the invention and to incorporate it in the context of particular applications. Various modifications, as well as a variety of uses in different applications, will be readily apparent to those skilled in the art, and the general principles, defined herein, may be applied to a wide range of aspects. Thus, the present invention is not intended to be limited to the aspects presented, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. Furthermore, it should be noted that unless explicitly stated otherwise, the figures included herein are illustrated diagrammatically and without any specific scale, as they are provided as qualitative illustrations of the concept of the present invention.
- any element in a claim that does not explicitly state “means for” performing a specified function, or “step for” performing a specific function, is not to be interpreted as a “means” or “step” clause as specified in 35 U.S.C. Section 112, Paragraph 6.
- the use of “step of or “act of in the claims herein is not intended to invoke the provisions of 35 U.S.C. 112, Paragraph 6.
- the description outlined below sets forth methods for self-assembly of arbitrarily-shaped metal nanostructure patterned on nucleic acid scaffolds.
- the methods herein use controlled-growth processes to actively select the dimensions, positions, and alignments of patterns to create different shapes of metal nanostructures.
- Three methods according to the present invention are individually addressable.
- This method creates a specifically-designed pattern by placing a single-stranded material 102 upon a scaffold 104 and plating a metal 106 on the single-stranded material 102 to self-assemble arbitrarily-shaped metal nanostructures 108 .
- the scaffold 104 used in the method according to the present invention is best as a nucleic acid scaffold.
- DNA origami, DNA ribbons, two-dimensional DNA crystals, and three-dimensional DNA constructions such as DNA tetrahedrals can be used as the scaffold 104 to either arbitrarily design a pattern or algorithmically grow a pattern with single-stranded material 102 upon.
- the scaffold 104 could also be made of PNA, RNA, LNA, chemically modified DNA such as methylated DNA, or the scaffold 104 could have portions that consist of other nucleoside analogues such as universal bases.
- the single-stranded material 102 for example, single-stranded DNA
- first end 110 and a second end 112 can be attached to the scaffold 104 by the first end 110 , leaving the second end 112 free from the scaffold 104 .
- both the first end 110 and the second end 112 of the single-stranded material 102 can be attached to the scaffold 104 to create a loop 114 , as illustrated in FIG. 1B .
- Other shapes may be formed, including a closed ring, or a series of interlocking rings. The strand could be locked into knotted topologies to create differently shaped nanostructures when plated.
- the strand could be free or under some sort of tension that either pulls the two ends apart or sets the two ends at a certain distance that is closer than statistically typical for free single stranded DNA.
- Other single-stranded nucleic acids may be used, including RNA, LNA, PNA, a different nucleoside analogue or a type of polymer such as polyethylene.
- the single-stranded material 102 of the specifically-designed pattern act as seed nuclei upon a scaffold 104 to which metal 106 may be plated to create the arbitrarily-shaped metal nanostructures 108 that are not constrained by the structure of the scaffold 104 .
- a metal 106 may be plated on the single-stranded material 102 using an electro-less metal plating technique.
- the definition of electro-less plating is the deposition of metal from metal ions dissolved in aqueous solution without use of electrodes.
- the metal begins as an ion in solution, but when it is deposited, it gains the missing electrons and becomes a metal.
- the chemistry for reduction of the positive metal ions on an existing metal surface or a seed nucleus is the mechanism that deposits the metal on the surface.
- the plating metal could be a variety of metals, including gold, silver, platinum, copper, titanium, nickel, zinc, lead, uranium, iron, palladium, and a metal structure.
- a metal structure can be an alloy, a mixture of metals, or a layered composition of metal.
- the electro-less plating process is performed in a solution containing a source of metal ions, a reducing agent, a surfactant, and a buffer (to create the proper pH).
- a pH buffer with an approximate pH of 5 prevents denaturing and provides for optimal performance.
- the buffer comprise of a mixture of a salt species to generate cations, for example, sodium chloride to generate sodium ions, magnesium acetate or magnesium chloride to generate magnesium ions, and nickel acetate to generate nickel ions, etc.
- the buffer could also contain a metal ion chelator, such as ethylenediamine tetraacetic acid, to act as a buffer for metal concentrations.
- a typical buffer used with nucleic acid-based scaffolds is magnesium acetate or magnesium chloride with a tris acetate base to buffer the pH and optional ethylenediamine tetraacetic acid to buffer ion concentrations.
- Different monovalent, divalent, or multi-valent cationic species such as sodium chloride, nickel acetate, ammonium acetate, potassium chloride, calcium chloride, lithium chloride, organic zwitterions such as 4-(2-hydroxyethyl)-1-piperazineethanesulfonic acid (HEPES), and ionic liquids could be used as buffers to control the rate and specificity of deposition.
- organic zwitterions such as 4-(2-hydroxyethyl)-1-piperazineethanesulfonic acid (HEPES), and ionic liquids
- HEPES 4-(2-hydroxyethyl)-1-piperazineethanesulfonic acid
- ionic liquids could be used as buffers to control the rate and specificity of deposition.
- the pH, salt concentrations, and concentrations of the metal ion species during plating can be used to adjust the rate of deposition.
- gold preferentially nucleates on single-stranded DNA versus double stranded.
- the method is most effective when the scaffold is deposited on Muskovite mica using a 2+ cation as a salt bridge.
- the use of a multi-valent solution allows for selective deposition of metal on the single stranded DNA during electro-less plating because the monovalent (+) or multivalent (2+) cations in the solution form a charged layer that acts as diffusion barrier covering the scaffold, preventing access by metal ions used in the electro-less metal plating process from attaching to the scaffold itself
- the metal ions can then selectively attach on the single-stranded material or on other projected materials that have a lower charge concentration in its vicinity.
- the scaffold can be also placed on a negatively charged surface such as muscovite mica, cleaned silicon dioxide, or some other surface that has been modified to display negatively charged groups at some specific surface density, which can be adjusted to control the rate and the selectivity of metal deposition.
- one or more additional metals may be used to plate existing metallic structures. As many additional layers of metal may be plated as needed.
- the buffer used during the depositing of the first metal as seed nuclei on the single-stranded material can be different from the buffer used in the subsequent plating of metal upon the seed nuclei.
- a layer of another metal may be placed in between the two metals to stop the alloying reaction.
- This method uses a pattern of nanoparticles 200 attached to the scaffold 104 , as seed nuclei, for the subsequent deposition of metal 106 to create a metal nanostructures 108 .
- the metal nanoparticles 200 are prefabricated and are attached with the scaffold 104 by specifically placed nanoparticle attachment linker sites 202 such as biotin, primary amines, thiols, or commercially-available nanoparticle attachment linker sites.
- nanoparticle attachment linker sites 202 such as biotin, primary amines, thiols, or commercially-available nanoparticle attachment linker sites.
- Nanoparticles 200 are attached to nanoparticle attachment linker sites 202 on a scaffold 104 in specific two-dimensional shapes. This creates the pattern of nanoparticles 200 as seed nuclei for electro-less metal plating.
- nanowires may be attached to the nanoparticle attachment linker sites 202 .
- electro-less metal plating is a technique used to create contiguous patterns originating from the nanoparticles 200 .
- the nanoparticle patterns are expanded in a controlled manner by the addition of metal 106 using an electro-less metal plating technique to create contiguous shapes on the nanoparticles 200 .
- metal nanoparticles there are a number of commercially-available metal nanoparticles. More commonly used metal nanoparticles are gold, silver, iron, molybdenum, nickel, and copper. Many other nanoparticles are suitable as long as the nanoparticle is small enough to reproduce a desired pattern with accuracy and there exists a suitable linker chemistry.
- Another option is to coat the nanoparticles 200 first with a DNA strand that has a linker, as illustrated in FIG. 2B .
- the linker DNA 204 will bind to complementary DNA patterns 206 on the DNA scaffold 104 .
- Advantages to using this process include the ability to control the interaction strength via the number of complementary bases and the ability to coat several different types of nanoparticles with different DNA sequences so that each can attach to a specific location on the scaffold that has the particular complementary DNA.
- the nanoparticle can be coated with DNA strands with different sequences to prevent the nanoparticle from attaching to more than one part of the scaffold.
- Another method may be used for the arrangement of nanoparticle linker sites upon a DNA scaffold with reduced constraints from the shape and structure of the scaffold itself, for example, the dimensions of scaffolds such as DNA tiles in DNA ribbons.
- strands of DNA 300 within the DNA scaffold 104 that are projecting out and away from the DNA scaffold 104 are selected. These selected strands of DNA 300 are sequence-specific DNA hooks 300 .
- nanoparticle attachment linker sites 202 are incorporated into specific positions on single-stranded DNA strands 302 .
- One or more of these single-stranded DNA strands 302 are attached with two or more of the sequence-specific DNA hooks 300 attached to the scaffold 104 .
- the single-stranded DNA strands 302 have sequence-specific binding regions 304 that attach to complementary sequence-specific binding regions 306 on the sequence-specific DNA hooks 300 .
- the single-stranded DNA strands 302 are called “lantern strands,” because when nanoparticles 200 attach with the nanoparticle attachment linker sites 202 on the lantern strands 302 , the nanoparticles 200 resemble Chinese lanterns hanging on a line.
- nanowires may be attached to the nanoparticle attachment linker sites 202 .
- this method allows lantern strands 302 to be drawn across sequence-specific DNA hooks 300 defined by any two anchor points on the DNA scaffold 104 .
- this method allows lantern strands 302 to be drawn across sequence-specific DNA hooks 300 defined by any two anchor points on the DNA scaffold 104 .
- this method can be used to create gold nanowires on DNA ribbon.
- three nanoparticle attachment linker sites 202 for example, three modified thymine bases, were incorporated in 28 nm long DNA lantern strands 302 .
- the nanoparticle attachment linker sites 202 were separated by approximately 2 nm, in this case, each having a primary amine available as the covalent linkage site, for attachment of nanoparticles 200 .
- the single-stranded DNA lantern strands 302 attach to the sequence-specific DNA hooks 300 via complementary sequence-specific binding regions 304 on the single-stranded DNA lantern strands 302 and sequence-specific binding regions 306 on the sequence-specific DNA hooks 300 .
- two different sequence-specific single-stranded DNA hooks i.e., having different sequences
- nanoparticles 200 for example, commercially-bought 0.8 nm gold nanoparticles consisting of 11 gold atoms (Undecagold from Nanoprobes, Incorporated, 95 Horse Block Road, Unit 1, Yaphank, N.Y. 11980-9710, USA) are attached to the nanoparticle attachment linker sites 202 .
- each nanoparticle 200 can have a single sulfo-N-Hydroxysuccinimide-ester group on its surface, which covalently links to the primary amine of the nanoparticle attachment linker site 202 that is incorporated into the DNA lantern strand 302 assembled on the DNA scaffold 104 , for example, a ribbon.
- This attachment proceeds in a buffer free of competing primary amine sites, such as a buffer containing tris acetate.
- a buffer containing tris acetate This is one non-limiting example of the many different linkage chemistries available for attachment of various nanoparticles to specific bases of a DNA strand.
- the DNA scaffold 104 with or without docked nanoparticles 200 can be deposited on a negatively charged surface 312 , for example, a mica substrate, as illustrated in FIG. 3C .
- a negatively charged surface 312 for example, a mica substrate
- Deposition of the scaffold 104 to silicon dioxide, gold, and other surfaces is also possible.
- a commercially available gold deposition process (Gold Enhance LM from Nanoprobes, Incorporated, 95 Horse Block Road, Unit 1, Yaphank, N.Y. 11980-9710, USA) can be used to deposit metal 106 , in this example, gold, for two and a half minutes, at which time, deposition was stopped by washing the substrate with buffer.
- a metal nanostructure 108 is formed after the metal 106 is continuously added by an electro-less metal plating process.
- FIGS. 5-8 are images of atomic force microscopy (AFM) scans of gold nanowire structures created according to the present invention.
- AFM atomic force microscopy
- nanoparticles were not attached to the lantern strands.
- Gold deposition nucleated directly on the single stranded portions of the lantern strands.
- the images are taken on an atomically flat mica surface and are colored according to the height of the structures above the surface.
- the structure consists of a continuous gold wire composed of ⁇ 28 nm lantern segments that merged together after deposition.
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to methods for self-assembly of arbitrarily-shaped metal nanostructures using specifically-designed patterns on nucleic acid scaffolds. The methods involve using the nucleic acid scaffolds as templates on which a second material patterned, as seed nuclei. The patterns are then selectively plated with metal using an electro-less plating process to create arbitrarily-shaped metal nanostructures that are not constrained by the structure of the scaffold. The methods herein use controlled-growth processes to actively select the dimensions, positions, and alignments of the patterns to create different arbitrary shapes of metal nanostructures.
Description
- The present application claims the benefit of priority of U.S. Provisional Patent Application No. 60/854,595, filed Oct. 26, 2006, entitled “Method for self assembly of arbitrary contiguous metal patterns on DNA Scaffolds” and U.S. Provisional Patent Application No. 60/922,919, filed Apr. 11, 2007, entitled “Method for self assembly of arbitrary contiguous metal patterns on DNA scaffolds.”
- The Unites States Government has certain rights in this invention pursuant to Grant No. FA9550-04-1-0434 awarded by the Air Force Office of Scientific Research (AFOSR).
- (1) Technical Field
- The present invention relates to DNA-based nanotechnology. More specifically, the present invention relates to a method for the creation of arbitrarily-shaped metal nanostructures using DNA and other nucleic acid scaffolds.
- (2) Description of Related Art
- DNA-based nanotechnology is a growing field. The specificity and combinatorial programmability of the Watson-Crick binding interactions between the subunits of DNA makes the molecule an ideal candidate for creating nanostructures of set patterns. The nanometer scale structural geometry of the DNA self-assembled nanostructures also provides an ideal building block for directed self-assembly of nanometer-scale materials with sub-nanometer precision and programmability. The resulting nanostructures created from nanometer-scale materials such as metals may be used to construct devices in the fields of nanoelectronics and nanophotonics.
- Previously in the field, those of ordinary skill in the art have used electroless plating techniques to plate metal upon the self-assembled DNA nanostructures. However, the metal plating is uncontrolled and results in metallization of the entire DNA nanostructure scaffold. More recently, nanowires have been fabricated using DNA scaffolds. However, no other specific shapes of metal nanostructures have been created upon DNA scaffolds that are not constrained by the structure of the scaffold itself.
- Additionally, those of ordinary skill in the art have only plated metal upon double-stranded DNA scaffolds. Previous methods have not incorporated arranging seed nuclei such as nanoparticles, single-stranded DNA or any other single-stranded nucleic acid in specific patterns upon a scaffold prior to plating a metal on the scaffold and thus create arbitrarily-shaped metal nanostructures that are not constrained by the DNA scaffold itself.
- The ability to form patterns upon a scaffold upon which electro-less metal plating can be directed allows for higher precision in the formation of specifically-shaped metal nanostructures. Methods with controlled-growth processes allow for active selection of the dimensions, positions, and alignments of patterns on scaffolds to create the different shapes of the metal nanostructures. Such metal nanostructures may provide for novel uses in the field of nanoelectronics and nanophotonics. Other applications include quantum electronic devices based on quantized conductance, control of electronic properties of patterned materials, plasmonic materials for concentration of light, plasmonic materials for waveguiding, plasmonic materials for nonlinear optics, X-ray and short-wavelength optics, including waveguides and gratings, semiconductor metrology standards, nanometer-scale non-local energy transport, microwave and terahertz applications including field effect transistors and emitters, coupling to quantum dots to make composite materials and/or circuits and/or luminescence enhancement, bright tags through plasmon enhancement of dies or q-dots, plasmonic circuits for light manipulation, and surface adsorption chemical sensors, surface enhanced raman scattering, etc.
- Therefore, a need exists in the art for a method for self-assembly of arbitrarily-shaped metal nanostructures that uses a specifically-placed pattern of a material upon a nucleic acid scaffold as a template for plating metal.
- The present invention overcomes the aforementioned limitations and fills the aforementioned needs by providing methods for assembly of arbitrarily-shaped metal nanostructures.
- In one aspect, the method comprises acts of fabricating a scaffold, patterning a first material on a scaffold, and plating a metal on the first material, whereby an arbitrarily-shaped metal nanostructure is created based on a pattern formed by the first material on the scaffold and whereby the metal nanostructure is not constrained by a shape of the scaffold itself.
- In another aspect, the scaffold is fabricated from a material selected from a group consisting of a plurality of nucleic acids, DNA origami, DNA ribbons, two-dimensional DNA crystals, and three-dimensional DNA constructions.
- In another aspect, the plurality of nucleic acids is selected from a group consisting of a charged nucleic acid strands, an uncharged nucleic acid strands, DNA, PNA, RNA, LNA, chemically modified DNA, nucleoside analogues, and combinations thereof.
- In another aspect, the act of plating comprises an electro-less plating process.
- In another aspect, the first material comprises a single-stranded material selected from a group consisting of single-stranded forms of DNA, RNA, LNA, PNA, a nucleoside analogue, a polymer, and combinations thereof.
- In another aspect, the first material has a first end and second end.
- In another aspect, the act of patterning the first material on the scaffold further comprises an act of attaching the first material with the scaffold so that the first material projects from the scaffold.
- In another aspect, the act of attaching the first material to the scaffold comprises an attachment mechanism selected from a group consisting of attaching the first end of the first material with the scaffold, attaching the first end and the second end of the first material with the scaffold, and a combination thereof, whereby a plurality of conformations of the first material are projected from the scaffold.
- In another aspect, the plurality of conformations is selected from a group consisting of single open strands, loops, closed rings, a series of interlocking rings, and locked knotted topologies.
- In another aspect, the electro-less plating process further comprises using a 2+ cationic solution whereby the solution blocks the plating of metal on the scaffold and thereby allows plating of metal on the first material.
- In another aspect, the method further comprises an act of placing the scaffold on a negatively charged surface.
- In another aspect, the negatively charged surface comprises a material selected from a group consisting of muscovite mica, cleaned silicon dioxide, and a surface that has been modified to display negatively charged groups at a specific surface density.
- In another aspect, the first material is a nanowire.
- In another aspect, the nanowire comprises metal.
- In another aspect, the first material comprises a plurality of nanoparticles.
- In another aspect, the nanoparticle comprises a metal nanoparticle selected from a group consisting of gold, silver, molybdenum, nickel, copper, and commercially-available nanoparticles.
- In another aspect, the nanoparticle further comprises a nucleic acid strand, wherein the nucleic acid strand further comprises a linker, whereby the linker will bind to a complementary nucleic acid pattern on the scaffold.
- In another aspect, the act of fabricating the scaffold further comprises the act of incorporating a plurality of nanoparticle attachment linker sites on the scaffold.
- In another aspect, the plurality of nanoparticle attachment linker sites is selected from a group consisting of biotin, primary amines, thiols, and commercially-available nanoparticle attachment linker sites.
- In another aspect, the act of patterning the first material on the scaffold further comprises the act of attaching the first material with the plurality of nanoparticle attachment linker sites.
- In another aspect, the metal is selected from a group consisting of gold, silver, platinum, copper, titanium, nickel, zinc, lead, uranium, iron, palladium, and a metal structure.
- Another method according to the present invention comprises the acts of fabricating a DNA scaffold, selecting a sequence-specific DNA hook projecting from the DNA scaffold, fabricating a single-stranded DNA lantern strand, attaching one or more single-stranded DNA lantern strands with two or more sequence-specific DNA hooks projecting from the DNA scaffold and plating a metal on the single stranded DNA lantern strand whereby an arbitrarily-shaped metal nanostructure may be created based on a pattern formed by the nanoparticles attached with the single-stranded DNA lantern strands and whereby the metal nanostructure is not constrained by a shape of the scaffold itself.
- In another aspect, the single-stranded DNA lantern strand further comprises one or more nanoparticle attachment linker sites.
- In another aspect, the method comprises the acts of attaching one or more nanoparticles with the nanoparticle attachment linker sites and plating a metal on the nanoparticles whereby an arbitrarily-shaped metal nanostructure may be created based on a pattern formed by the nanoparticles attached with the nanoparticle attachment linker sites and whereby the metal nanostructure is not constrained by the shape of the scaffold itself.
- In another aspect, the method comprises the acts of attaching one or more nanowires with the nanoparticle attachment linker sites and plating a metal on the nanowires whereby an arbitrarily-shaped metal nanostructure may be created based on a pattern formed by the nanowires attached with the nanoparticle attachment linker sites and whereby the metal nanostructure is not constrained by the shape of the scaffold itself.
- In another aspect, the scaffold is fabricated by a material selected from a group consisting of a plurality of nucleic acids, DNA origami, DNA ribbons, two-dimensional DNA crystals, and three-dimensional DNA constructions.
- In another aspect, the plurality of nucleic acids is selected from a group consisting of a charged nucleic acid strands, an uncharged nucleic acid strands, DNA, PNA, RNA, LNA, chemically modified DNA, nucleoside analogues, and combinations thereof.
- In another aspect, the act of plating comprises an electro-less plating process.
- In another aspect, the nanoparticle comprises a metal nanoparticle selected from a group consisting of gold, silver, molybdenum, nickel, copper, and commercially-available nanoparticles.
- In another aspect, the plurality of nanoparticle attachment linker sites is selected from a group consisting of biotin, primary amines, thiols, and commercially-available nanoparticle attachment linker sites.
- In another aspect, the metal is selected from a group consisting of gold, silver, platinum, copper, titanium, nickel, zinc, lead, uranium, iron, palladium, and a metal structure.
- Finally, the present invention includes an arbitrarily-shaped metal nanostructures formed according to all methods described herein.
- The objects, features and advantages of the present invention will be apparent from the following detailed descriptions of the preferred aspects of the invention in conjunction with reference to the following drawings, where:
-
FIG. 1A is an illustration a method for self-assembly of arbitrarily shaped metal nanostructures using single-stranded molecules patterned on nucleic acid scaffolds according to the present invention; -
FIG. 1B is an illustration of a conformation formed by a single-stranded material on a scaffold according to the present invention; -
FIGS. 2A and 2B are illustrations of a method for self-assembly of arbitrarily shaped metal nanostructures using metal nanoparticles patterned on nucleic acid scaffolds according to the present invention; -
FIGS. 3A-3C are illustrations of a method for self-assembly of arbitrarily shaped metal nanostructures using sequence-specific DNA hooks patterned on nucleic acid scaffolds according to the present invention; -
FIGS. 4A and 4B are illustrations of attachments of single-stranded DNA lantern strands with sequence-specific DNA hooks according to the present invention; and -
FIGS. 5-8 are images of atomic force microscopy (AFM) scans of gold nanowire structures created according to the present invention. - The present invention relates to methods for creating self-assembled arbitrarily-shaped metal nanostructures. More specifically, the present invention relates to methods for self-assembly of arbitrarily-shaped metal nanostructure using patterns placed upon a nucleic acid scaffold. The following description, taken in conjunction with the referenced drawings, is presented to enable one of ordinary skill in the art to make and use the invention and to incorporate it in the context of particular applications. Various modifications, as well as a variety of uses in different applications, will be readily apparent to those skilled in the art, and the general principles, defined herein, may be applied to a wide range of aspects. Thus, the present invention is not intended to be limited to the aspects presented, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein. Furthermore, it should be noted that unless explicitly stated otherwise, the figures included herein are illustrated diagrammatically and without any specific scale, as they are provided as qualitative illustrations of the concept of the present invention.
- (1) Introduction
- In the following detailed description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to one skilled in the art that the present invention may be practiced without necessarily being limited to these specific details. In other instances, well-known structures and devices are shown in block diagram form, rather than in detail, in order to avoid obscuring the present invention.
- The reader's attention is directed to all papers and documents which are filed concurrently with this specification and which are open to public inspection with this specification, and the contents of all such papers and documents are incorporated herein by reference. All the features disclosed in this specification, (including any accompanying claims, abstract, and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Thus, unless expressly stated otherwise, each feature disclosed is one example only of a generic series of equivalent or similar features.
- Furthermore, any element in a claim that does not explicitly state “means for” performing a specified function, or “step for” performing a specific function, is not to be interpreted as a “means” or “step” clause as specified in 35 U.S.C.
Section 112, Paragraph 6. In particular, the use of “step of or “act of in the claims herein is not intended to invoke the provisions of 35 U.S.C. 112, Paragraph 6. - The description outlined below sets forth methods for self-assembly of arbitrarily-shaped metal nanostructure patterned on nucleic acid scaffolds. The methods herein use controlled-growth processes to actively select the dimensions, positions, and alignments of patterns to create different shapes of metal nanostructures. Three methods according to the present invention are individually addressable.
- (2) Method for self-assembly of arbitrarily shaped metal nanostructures using single-stranded molecules patterned on nucleic acid scaffolds.
- This method, as illustrated in
FIG. 1A , creates a specifically-designed pattern by placing a single-strandedmaterial 102 upon ascaffold 104 and plating ametal 106 on the single-strandedmaterial 102 to self-assemble arbitrarily-shapedmetal nanostructures 108. Thescaffold 104 used in the method according to the present invention is best as a nucleic acid scaffold. DNA origami, DNA ribbons, two-dimensional DNA crystals, and three-dimensional DNA constructions such as DNA tetrahedrals can be used as thescaffold 104 to either arbitrarily design a pattern or algorithmically grow a pattern with single-strandedmaterial 102 upon. Thescaffold 104 could also be made of PNA, RNA, LNA, chemically modified DNA such as methylated DNA, or thescaffold 104 could have portions that consist of other nucleoside analogues such as universal bases. - As shown in
FIG. 1A , the single-strandedmaterial 102, for example, single-stranded DNA, with afirst end 110 and asecond end 112 can be attached to thescaffold 104 by thefirst end 110, leaving thesecond end 112 free from thescaffold 104. Or, both thefirst end 110 and thesecond end 112 of the single-strandedmaterial 102 can be attached to thescaffold 104 to create a loop 114, as illustrated inFIG. 1B . Other shapes may be formed, including a closed ring, or a series of interlocking rings. The strand could be locked into knotted topologies to create differently shaped nanostructures when plated. Additionally, the strand could be free or under some sort of tension that either pulls the two ends apart or sets the two ends at a certain distance that is closer than statistically typical for free single stranded DNA. Other single-stranded nucleic acids may be used, including RNA, LNA, PNA, a different nucleoside analogue or a type of polymer such as polyethylene. - Referring again to
FIG. 1A , the single-strandedmaterial 102 of the specifically-designed pattern act as seed nuclei upon ascaffold 104 to whichmetal 106 may be plated to create the arbitrarily-shapedmetal nanostructures 108 that are not constrained by the structure of thescaffold 104. Ametal 106 may be plated on the single-strandedmaterial 102 using an electro-less metal plating technique. - In this method, the definition of electro-less plating is the deposition of metal from metal ions dissolved in aqueous solution without use of electrodes. During the electro-less plating process, the metal begins as an ion in solution, but when it is deposited, it gains the missing electrons and becomes a metal. The chemistry for reduction of the positive metal ions on an existing metal surface or a seed nucleus is the mechanism that deposits the metal on the surface. The plating metal could be a variety of metals, including gold, silver, platinum, copper, titanium, nickel, zinc, lead, uranium, iron, palladium, and a metal structure. A metal structure can be an alloy, a mixture of metals, or a layered composition of metal.
- The electro-less plating process is performed in a solution containing a source of metal ions, a reducing agent, a surfactant, and a buffer (to create the proper pH). When using a DNA scaffold, a pH buffer with an approximate pH of 5 prevents denaturing and provides for optimal performance. The buffer comprise of a mixture of a salt species to generate cations, for example, sodium chloride to generate sodium ions, magnesium acetate or magnesium chloride to generate magnesium ions, and nickel acetate to generate nickel ions, etc. The buffer could also contain a metal ion chelator, such as ethylenediamine tetraacetic acid, to act as a buffer for metal concentrations. A typical buffer used with nucleic acid-based scaffolds is magnesium acetate or magnesium chloride with a tris acetate base to buffer the pH and optional ethylenediamine tetraacetic acid to buffer ion concentrations.
- Different monovalent, divalent, or multi-valent cationic species such as sodium chloride, nickel acetate, ammonium acetate, potassium chloride, calcium chloride, lithium chloride, organic zwitterions such as 4-(2-hydroxyethyl)-1-piperazineethanesulfonic acid (HEPES), and ionic liquids could be used as buffers to control the rate and specificity of deposition. The pH, salt concentrations, and concentrations of the metal ion species during plating can be used to adjust the rate of deposition.
- As a non-limiting example, during electro-less plating of gold using gold chloride in a magnesium solution, gold preferentially nucleates on single-stranded DNA versus double stranded. The method is most effective when the scaffold is deposited on Muskovite mica using a 2+ cation as a salt bridge. The use of a multi-valent solution allows for selective deposition of metal on the single stranded DNA during electro-less plating because the monovalent (+) or multivalent (2+) cations in the solution form a charged layer that acts as diffusion barrier covering the scaffold, preventing access by metal ions used in the electro-less metal plating process from attaching to the scaffold itself The metal ions can then selectively attach on the single-stranded material or on other projected materials that have a lower charge concentration in its vicinity. The scaffold can be also placed on a negatively charged surface such as muscovite mica, cleaned silicon dioxide, or some other surface that has been modified to display negatively charged groups at some specific surface density, which can be adjusted to control the rate and the selectivity of metal deposition.
- Once the metal is deposited upon a single-stranded material as seed nuclei, one or more additional metals may be used to plate existing metallic structures. As many additional layers of metal may be plated as needed. The buffer used during the depositing of the first metal as seed nuclei on the single-stranded material can be different from the buffer used in the subsequent plating of metal upon the seed nuclei. Also, if using two metals that like to alloy, such as gold and silver, a layer of another metal may be placed in between the two metals to stop the alloying reaction.
- (3) Method for self-assembly of arbitrarily shaped metal nanostructures using metal nanoparticles patterned on nucleic acid scaffolds.
- This method, as illustrated in
FIG. 2A , uses a pattern ofnanoparticles 200 attached to thescaffold 104, as seed nuclei, for the subsequent deposition ofmetal 106 to create ametal nanostructures 108. In this method, themetal nanoparticles 200 are prefabricated and are attached with thescaffold 104 by specifically placed nanoparticleattachment linker sites 202 such as biotin, primary amines, thiols, or commercially-available nanoparticle attachment linker sites. By using modified bases with attachment chemistries such as thiol, biotin, or primary amine modifications, patterning of thescaffold 104 with nanoparticles, proteins, gold, or other materials is possible. Nanoparticles 200 (for example, gold nanoparticles) are attached to nanoparticleattachment linker sites 202 on ascaffold 104 in specific two-dimensional shapes. This creates the pattern ofnanoparticles 200 as seed nuclei for electro-less metal plating. In addition, nanowires may be attached to the nanoparticleattachment linker sites 202. As in the previous method described, electro-less metal plating is a technique used to create contiguous patterns originating from thenanoparticles 200. Thus, the nanoparticle patterns are expanded in a controlled manner by the addition ofmetal 106 using an electro-less metal plating technique to create contiguous shapes on thenanoparticles 200. - There are a number of commercially-available metal nanoparticles. More commonly used metal nanoparticles are gold, silver, iron, molybdenum, nickel, and copper. Many other nanoparticles are suitable as long as the nanoparticle is small enough to reproduce a desired pattern with accuracy and there exists a suitable linker chemistry.
- Another option is to coat the
nanoparticles 200 first with a DNA strand that has a linker, as illustrated inFIG. 2B . Thelinker DNA 204 will bind tocomplementary DNA patterns 206 on theDNA scaffold 104. Advantages to using this process include the ability to control the interaction strength via the number of complementary bases and the ability to coat several different types of nanoparticles with different DNA sequences so that each can attach to a specific location on the scaffold that has the particular complementary DNA. Also, if the nanoparticle is large and may attach to several different parts of the scaffold, then the nanoparticle can be coated with DNA strands with different sequences to prevent the nanoparticle from attaching to more than one part of the scaffold. - (4) Method for self-assembly of arbitrarily shaped metal nanostructures using sequence-specific DNA hooks patterned on nucleic acid scaffolds.
- Another method may be used for the arrangement of nanoparticle linker sites upon a DNA scaffold with reduced constraints from the shape and structure of the scaffold itself, for example, the dimensions of scaffolds such as DNA tiles in DNA ribbons. As illustrated in
FIG. 3A , strands ofDNA 300 within theDNA scaffold 104 that are projecting out and away from theDNA scaffold 104 are selected. These selected strands ofDNA 300 are sequence-specific DNA hooks 300. In a separate step of the method, nanoparticleattachment linker sites 202 are incorporated into specific positions on single-strandedDNA strands 302. One or more of these single-strandedDNA strands 302 are attached with two or more of the sequence-specific DNA hooks 300 attached to thescaffold 104. The single-strandedDNA strands 302 have sequence-specificbinding regions 304 that attach to complementary sequence-specificbinding regions 306 on the sequence-specific DNA hooks 300. Thus, the single-strandedDNA strands 302 are called “lantern strands,” because whennanoparticles 200 attach with the nanoparticleattachment linker sites 202 on thelantern strands 302, thenanoparticles 200 resemble Chinese lanterns hanging on a line. In addition, nanowires may be attached to the nanoparticleattachment linker sites 202. - As illustrated in
FIGS. 4A and 4B , this method allowslantern strands 302 to be drawn across sequence-specific DNA hooks 300 defined by any two anchor points on theDNA scaffold 104. Along eachlantern strand 302, there is almost complete freedom to incorporate one-dimensional patterns of nanoparticleattachment linker sites 202 that accommodate one or more types ofnanoparticles 200, upon whichmetals 106 can be plated to allow for arbitrary design freedom ofmetal nanostructures 108 on thescaffolds 104. - As a non-limiting example, this method can be used to create gold nanowires on DNA ribbon. As illustrated in
FIG. 3B , three nanoparticleattachment linker sites 202, for example, three modified thymine bases, were incorporated in 28 nm longDNA lantern strands 302. The nanoparticleattachment linker sites 202 were separated by approximately 2 nm, in this case, each having a primary amine available as the covalent linkage site, for attachment ofnanoparticles 200. - The single-stranded
DNA lantern strands 302 attach to the sequence-specific DNA hooks 300 via complementary sequence-specificbinding regions 304 on the single-strandedDNA lantern strands 302 and sequence-specificbinding regions 306 on the sequence-specific DNA hooks 300. This creates a string of binding regions down thescaffold 104 with approximately 2 nm inter-site spacing. To prevent spurious attachment, two different sequence-specific single-stranded DNA hooks (i.e., having different sequences) can be projected from two different tiles on the DNA ribbon (the tiles repeat periodically down the length of the ribbon). - Optionally, as illustrated in
FIG. 3B nanoparticles 200, for example, commercially-bought 0.8 nm gold nanoparticles consisting of 11 gold atoms (Undecagold from Nanoprobes, Incorporated, 95 Horse Block Road, Unit 1, Yaphank, N.Y. 11980-9710, USA) are attached to the nanoparticleattachment linker sites 202. As an example, eachnanoparticle 200 can have a single sulfo-N-Hydroxysuccinimide-ester group on its surface, which covalently links to the primary amine of the nanoparticleattachment linker site 202 that is incorporated into theDNA lantern strand 302 assembled on theDNA scaffold 104, for example, a ribbon. This attachment proceeds in a buffer free of competing primary amine sites, such as a buffer containing tris acetate. This is one non-limiting example of the many different linkage chemistries available for attachment of various nanoparticles to specific bases of a DNA strand. - After incubating using standard procedures known in the art, the
DNA scaffold 104 with or without dockednanoparticles 200 can be deposited on a negatively chargedsurface 312, for example, a mica substrate, as illustrated inFIG. 3C . Deposition of thescaffold 104 to silicon dioxide, gold, and other surfaces is also possible. A commercially available gold deposition process (Gold Enhance LM from Nanoprobes, Incorporated, 95 Horse Block Road, Unit 1, Yaphank, N.Y. 11980-9710, USA) can be used to depositmetal 106, in this example, gold, for two and a half minutes, at which time, deposition was stopped by washing the substrate with buffer. When gold nanoparticles are present, because the electro-less plating step enlarges the gold nanoparticles uniformly, the size and shape of gold nanoparticles and the achievable inter-particle spacing creates the lower bound for the smallest achievable feature size in the method. Ametal nanostructure 108 is formed after themetal 106 is continuously added by an electro-less metal plating process. -
FIGS. 5-8 are images of atomic force microscopy (AFM) scans of gold nanowire structures created according to the present invention. In the images shown, nanoparticles were not attached to the lantern strands. Gold deposition nucleated directly on the single stranded portions of the lantern strands. The images are taken on an atomically flat mica surface and are colored according to the height of the structures above the surface. In the example shown, the structure consists of a continuous gold wire composed of ˜28 nm lantern segments that merged together after deposition.
Claims (25)
1. A method for assembly of arbitrarily-shaped metal nanostructures, the method comprising acts of:
fabricating a scaffold;
patterning a first material on a scaffold; and
plating a metal on the first material whereby an arbitrarily-shaped metal nanostructure is created based on a pattern formed by the first material on the scaffold and whereby the metal nanostructure is not constrained by a shape of the scaffold itself.
2. The method of claim 1 , wherein the scaffold is fabricated from a material selected from a group consisting of a plurality of nucleic acids, DNA origami, DNA ribbons, two-dimensional DNA crystals, and three-dimensional DNA constructions.
3. The method of claim 2 , wherein the plurality of nucleic acids is selected from a group consisting of a charged nucleic acid strands, an uncharged nucleic acid strands, DNA, PNA, RNA, LNA, chemically modified DNA, nucleoside analogues, and combinations thereof.
4. The method of claim 3 , wherein the act of plating comprises an electro-less plating process.
5. The method of claim 4 , wherein the first material comprises a single-stranded material selected from a group consisting of single-stranded forms of DNA, RNA, LNA, PNA, a nucleoside analogue, a polymer, and combinations thereof.
6. The method of claim 5 , wherein the act of patterning the first material on the scaffold further comprises an act of attaching the first material with the scaffold so that the first material projects from the scaffold.
7. The method of claim 6 , wherein the first material has a first end and second end, and wherein the act of attaching the first material to the scaffold comprises an attachment mechanism selected from a group consisting of attaching the first end of the first material with the scaffold, attaching the first end and the second end of the first material with the scaffold, and a combination thereof, whereby a plurality of conformations of the first material are projected from the scaffold.
8. The method of claim 7 , wherein the plurality of conformations is selected from a group consisting of single open strands, loops, closed rings, a series of interlocking rings, and locked knotted topologies.
9. The method of claim 8 , wherein the electro-less plating process further comprises using a 2+ cationic solution whereby the solution blocks the plating of metal on the scaffold and thereby allows plating of metal on the first material.
10. The method of claim 5 , wherein the method further comprises an act of placing the scaffold on a negatively charged surface.
11. The method of claim 4 , wherein the first material is a nanowire.
12. The method of claim 4 , wherein the first material comprises a plurality of nanoparticles.
13. The method of claim 12 , wherein the nanoparticle further comprises a nucleic acid strand, wherein the nucleic acid strand further comprises a linker, whereby the linker will bind to a complementary nucleic acid pattern on the scaffold.
14. The method of claim 12 , wherein the act of fabricating the scaffold further comprises the act of incorporating a plurality of nanoparticle attachment linker sites on the scaffold.
15. The method of claim 14 , wherein the plurality of nanoparticle attachment linker sites is selected from a group consisting of biotin, primary amines, thiols, and commercially-available nanoparticle attachment linker sites.
16. The method of claim 14 , wherein the act of patterning the first material on the scaffold further comprises the act of attaching the first material with the plurality of nanoparticle attachment linker sites.
17. An arbitrarily-shaped metal nanostructure formed according to the method of claim 1 .
18. A method for assembly of arbitrarily-shaped metal nanostructures, the method comprising acts of:
fabricating a DNA scaffold;
selecting a sequence-specific DNA hook projecting from the DNA scaffold;
fabricating a single-stranded DNA lantern strand;
attaching one or more single-stranded DNA lantern strands with two or more sequence-specific DNA hooks projecting from the DNA scaffold; and
plating a metal on the single stranded DNA lantern strand whereby an arbitrarily-shaped metal nanostructure may be created based on a pattern formed by the nanoparticles attached with the single-stranded DNA lantern strands and whereby the metal nanostructure is not constrained by a shape of the scaffold itself.
19. The method of claim 18 , wherein the single-stranded DNA lantern strand further comprises one or more nanoparticle attachment linker sites.
20. The method of claim 19 , further comprising the acts of:
attaching one or more nanoparticles with the nanoparticle attachment linker sites; and
plating a metal on the nanoparticles whereby an arbitrarily-shaped metal nanostructure may be created based on a pattern formed by the nanoparticles attached with the nanoparticle attachment linker sites and whereby the metal nanostructure is not constrained by the shape of the scaffold itself.
21. The method of claim 19 , further comprising the acts of:
attaching one or more nanowires with the nanoparticle attachment linker sites; and
plating a metal on the nanowires whereby an arbitrarily-shaped metal nanostructure may be created based on a pattern formed by the nanowires attached with the nanoparticle attachment linker sites and whereby the metal nanostructure is not constrained by the shape of the scaffold itself.
22. The method of claim 18 , wherein the scaffold is fabricated by a material selected from a group consisting of a plurality of nucleic acids, DNA origami, DNA ribbons, two-dimensional DNA crystals, and three-dimensional DNA constructions.
23. The method of claim 18 , wherein the plurality of nucleic acids is selected from a group consisting of a charged nucleic acid strands, an uncharged nucleic acid strands, DNA, PNA, RNA, LNA, chemically modified DNA, nucleoside analogues, and combinations thereof.
24. The method of claim 18 , wherein the act of plating comprises an electro-less plating process.
25. The method of claim 19 , wherein the nanoparticle attachment linker site is selected from a group consisting of biotin, primary amines, thiols, and commercially-available nanoparticle attachment linker sites.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/978,219 US20140141211A1 (en) | 2006-10-26 | 2007-10-26 | Method for self-assembly of arbitrary metal patterns on DNA scaffolds |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85459506P | 2006-10-26 | 2006-10-26 | |
| US92291907P | 2007-04-11 | 2007-04-11 | |
| US11/978,219 US20140141211A1 (en) | 2006-10-26 | 2007-10-26 | Method for self-assembly of arbitrary metal patterns on DNA scaffolds |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20140141211A1 true US20140141211A1 (en) | 2014-05-22 |
Family
ID=50728216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/978,219 Abandoned US20140141211A1 (en) | 2006-10-26 | 2007-10-26 | Method for self-assembly of arbitrary metal patterns on DNA scaffolds |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US20140141211A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150050428A1 (en) * | 2013-07-30 | 2015-02-19 | Commissariat A L'energie Atomique Et Aux Ene Alt | Method for producing a metal layer on a surface |
| US20160342592A1 (en) * | 2014-02-12 | 2016-11-24 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method for defining a self-assembling unit of a block copolymer |
| CN111617097A (en) * | 2020-06-17 | 2020-09-04 | 福州大学 | A preparation method of [2]-reticular catenane DNA monolayer array and its application |
| CN114045283A (en) * | 2021-11-02 | 2022-02-15 | 四川大学 | DNA nano structure, construction method and application |
| EP4148130A1 (en) | 2021-09-09 | 2023-03-15 | Uniwersytet Jagiellonski | Topogami and method for making interlocked single stranded dna rings |
| WO2024233947A1 (en) * | 2023-05-11 | 2024-11-14 | Digital Biotechnologies, Inc. | Nucleic acid scaffolds and related devices and methods |
-
2007
- 2007-10-26 US US11/978,219 patent/US20140141211A1/en not_active Abandoned
Non-Patent Citations (10)
| Title |
|---|
| Braun et al. Nature. 1998. 391:775-778. * |
| Cai et al. Analytica Chimica Acta (2002) 469: 165-172. * |
| Ford et al. Adv. Mater. (2001) 13(23): 1793-1797. * |
| Foultier. IEE Proc.-Nanbiotechnol., Vol. 152, No. 1, February 2005, p. 3-12. * |
| Gu et al. Nanotechnology (2005) 16:1358-1363. * |
| Gu. Nanotechnology 17 (2006) R14-R25. * |
| Park et al. Nano Letters. 2005. 5(4):693-696 and Supporting Information. * |
| Patterning Definition (retrieved on 9/23/2014 from the internet: https://www.google.com/search?q=patterning+definition&spell=1&sa=X&ei=AxobVI_sC8bCsASInICwDw&ved=0CBwQvwUoAA). * |
| Song. Chem. Eur. J. 2005, 11, 910-916. * |
| Wang. Langmuir 2001, 17, 5739-5741. * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150050428A1 (en) * | 2013-07-30 | 2015-02-19 | Commissariat A L'energie Atomique Et Aux Ene Alt | Method for producing a metal layer on a surface |
| US20160342592A1 (en) * | 2014-02-12 | 2016-11-24 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method for defining a self-assembling unit of a block copolymer |
| US10255298B2 (en) * | 2014-02-12 | 2019-04-09 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method for defining a self-assembling unit of a block copolymer |
| CN111617097A (en) * | 2020-06-17 | 2020-09-04 | 福州大学 | A preparation method of [2]-reticular catenane DNA monolayer array and its application |
| CN111617097B (en) * | 2020-06-17 | 2021-06-29 | 福州大学 | A preparation method of [2]-reticular catenane DNA monolayer array and its application |
| EP4148130A1 (en) | 2021-09-09 | 2023-03-15 | Uniwersytet Jagiellonski | Topogami and method for making interlocked single stranded dna rings |
| WO2023036902A1 (en) | 2021-09-09 | 2023-03-16 | Uniwersytet Jagielloński | Topogami and method for making interlocked single stranded dna rings |
| CN114045283A (en) * | 2021-11-02 | 2022-02-15 | 四川大学 | DNA nano structure, construction method and application |
| WO2024233947A1 (en) * | 2023-05-11 | 2024-11-14 | Digital Biotechnologies, Inc. | Nucleic acid scaffolds and related devices and methods |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Mbindyo et al. | DNA‐directed assembly of gold nanowires on complementary surfaces | |
| Tapio et al. | The potential of DNA origami to build multifunctional materials | |
| Lewis et al. | Single-crystal Winterbottom constructions of nanoparticle superlattices | |
| Tan et al. | Building plasmonic nanostructures with DNA | |
| Becerril et al. | DNA-templated nanofabrication | |
| Ding et al. | DNA-templated self-assembly of protein arrays and highly conductive nanowires | |
| Alivisatos et al. | Organization of'nanocrystal molecules' using DNA | |
| Storhoff et al. | Programmed materials synthesis with DNA | |
| Schreiber et al. | Hierarchical assembly of metal nanoparticles, quantum dots and organic dyes using DNA origami scaffolds | |
| Tang et al. | One‐dimensional assemblies of nanoparticles: preparation, properties, and promise | |
| KR101974577B1 (en) | Template for manufacturing nanoparticle and method for preparing nanoparticle using the same | |
| US20140141211A1 (en) | Method for self-assembly of arbitrary metal patterns on DNA scaffolds | |
| US20050151126A1 (en) | Methods of producing carbon nanotubes using peptide or nucleic acid micropatterning | |
| Uprety et al. | Site-specific metallization of multiple metals on a single DNA origami template | |
| Gates et al. | DNA‐templated lithography and nanofabrication for the fabrication of nanoscale electronic circuitry | |
| US9751758B2 (en) | Rational assembly of nanoparticle superlattices with designed lattice symmetries | |
| Xie et al. | DNA nanotechnology-enabled fabrication of metal nanomorphology | |
| Joshi et al. | Fabrication of high aspect ratio gold nanowires within the microtubule lumen | |
| CN103562124A (en) | A Biodesignable Crystallization Approach for Multicomponent Functionalized Nanoparticle Systems | |
| Luo et al. | Tracking the growth of chiral plasmonic nanocrystals at molybdenum disulfide heterostructural interfaces | |
| TWI458673B (en) | Method of manufacturing a nanoparticle chain | |
| Sharma | Finite‐Sized One‐Dimensional Silica Microstructures (Rods): Synthesis, Assembly, and Applications | |
| US20070275394A1 (en) | Nucleic acid nanostructure and method of manufacturing the same | |
| Gong et al. | Growth and Morphology Control of Silver Halide Nanoparticles in Templated Ag (I)-Coordinated Langmuir− Schaefer Films | |
| US20150246942A1 (en) | Alignment of nanomaterials and micromaterials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: CALIFORNIA INSTITUTE OF TECHNOLOGY, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MAUNE, HAREEM;HAN, SI-PING;VYAWAHARE, SAURABH;AND OTHERS;SIGNING DATES FROM 20080401 TO 20080730;REEL/FRAME:021352/0146 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE |