US20130114251A1 - Illiminant device and manufacturing method of lamp holder - Google Patents
Illiminant device and manufacturing method of lamp holder Download PDFInfo
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- US20130114251A1 US20130114251A1 US13/347,858 US201213347858A US2013114251A1 US 20130114251 A1 US20130114251 A1 US 20130114251A1 US 201213347858 A US201213347858 A US 201213347858A US 2013114251 A1 US2013114251 A1 US 2013114251A1
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- United States
- Prior art keywords
- light
- illuminant
- housing
- mcpcb
- circuit board
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
- F21V3/0625—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics the material diffusing light, e.g. translucent plastics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
- F21V5/045—Refractors for light sources of lens shape the lens having discontinuous faces, e.g. Fresnel lenses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0091—Reflectors for light sources using total internal reflection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Definitions
- the present invention relates to an illuminant device, especially to an illuminant device with high thermal conductivity coefficient and insulating property and uses light emitting diodes as light source.
- LEDs Light emitting diodes
- LEDs have the advantages of small volume, long lifetime, difficulty damage, without mercury and lower power consumption. They are gradually replacing the fluorescent tubes and incandescent lamps and widely used in indoor or outdoor lighting and decorative lighting.
- FIG. 1 is a cross-sectional view of a conventional LED lamp.
- the LED lamp includes a housing 50 , a circuit board 52 , a plurality of LEDs 54 , a conductive connector 56 , a shell 58 and a power driving unit 59 .
- the housing 50 is a hollow body and has a plurality of fins 51 radially extended from a circumferential wall and physically connected thereon, thereby the heat-dissipation area of the housing 50 is increased and can quickly remove heat generated by the LEDs 54 to the air.
- the circuit board 52 is disposed on the housing 50 and electrically connected to the power circuit unit 59 through multiple wires 53 .
- the LEDs 54 are disposed on the circuit board 52 and electrically connected thereto.
- the conductive connector 56 is physically connected to the housing 50 at the location opposite to the circuit board 52 , and electrically connected to the power driving circuit 59 through two power lines 57 .
- the shell 58 is disposed on the housing 50 at the side disposed the LEDs 54 such that the LEDs 54 are arranged between the shell 58 and the housing 50 .
- circuit board 52 and the conductive connector 56 are electrically connected to the power driving unit 59 through the wires 53 and the power lines 57 , respectively. This increases productive processes, the difficulty of manufacturing and cost.
- the illuminant device has advantages of easily manufacture, lower manufacturing cost, light and high insulating property.
- the illuminant device comprises at least an illuminant element and a lamp holder.
- the lamp holder includes a housing, a metal core printed circuit board (MCPCB) and a power driving circuit.
- the housing has a first side and a second side opposite to the first side.
- the MCPCB is disposed on the first side and includes a base and a plurality of extending parts extended from a circumference of base in a bending forming manner and spaced from each other.
- the base has a plurality of holes, the extending parts are embedded within the housing, and the illuminant element is mounted on the base.
- the power-driving unit includes a circuit board, and a first end of the circuit board has a plurality of posts. The posts are respectively penetrating the holes and electrically connected to the MCPCB.
- the manufacturing method of a lamp holder comprises: assembling a plurality of holes of a MCPCB and a plurality of posts of a circuit board of a power driving unit, respectively, and electrically connecting the MCPCB and the circuit board; forming a housing outside the MCPCB and the power driving unit and partially covering the MCPCB and the power driving unit.
- the circuit board of the power driving unit is directly assembled to the MCPCB, thereby can effectively easily productive processes and lower manufacturing cost.
- FIG. 1 is a cross-sectional view of a conventional light emitting diode (LED) lamp.
- LED light emitting diode
- FIG. 2 is a partially exploded of an illuminant device according to a first preferred embodiment of the present invention.
- FIG. 3 is a partially assembled view of the illuminant device according to the first preferred embodiment of the present invention.
- FIG. 4 is a cross-sectional view of the illuminant device according to the first preferred embodiment of the present invention.
- FIG. 5 is an exploded view of the illuminant device according to the first preferred embodiment of the present invention.
- FIG. 6 is an exploded view of an illuminant device according to a second preferred embodiment of the present invention.
- FIG. 7 is a cross-sectional view of the illuminant device according to the second preferred embodiment of the present invention.
- FIG. 8 is a partially exploded view of an illuminant device according to a third preferred embodiment of the present invention.
- FIG. 9 is a partially assembled view of the illuminant device according to the third preferred embodiment of the present invention.
- FIG. 10 is an exploded view of the illuminant device according to the third preferred embodiment of the present invention.
- FIG. 11 is a cross-sectional view of the illuminant device according to the third preferred embodiment of the present invention.
- FIG. 12 is a partially exploded view of an illuminant device according to a fourth preferred embodiment of the present invention.
- FIG. 13 is a partially assembled view of the illuminant device according to the fourth preferred embodiment of the present invention.
- FIG. 14 is cross-sectional view of the illuminant device according to the fourth preferred embodiment of the present invention.
- FIG. 15 is a partially exploded view of the illuminant device according to a fifth preferred embodiment of the present invention.
- FIG. 16 is a partially assembled view of an illuminant device according to the fifth preferred embodiment of the present invention.
- FIG. 17 is a cross-sectional view of the illuminant device according to the fifth preferred embodiment of the present invention.
- FIG. 2 , FIG. 3 and FIG. 4 are respectively a partially exploded view, a partially assembled view and a cross-sectional view of an illuminant device according to a first preferred embodiment of present invention.
- the illuminant 10 is, for example, a GU10 lamp.
- the illuminant device 10 may be PAR series lamp, A19, A20, A60, G30 or other type lamps.
- the illuminant device 10 includes a lamp holder 11 and at least an illuminant element 12 .
- the lamp holder 11 includes a metal core printed circuit board (MCPCB) 110 , a power driving unit 130 and a housing 140 .
- MCPCB metal core printed circuit board
- the MCPCB 110 has better thermal conductive and is provided with conductive traces (not shown) and soldering pads (not shown).
- the MCPCB 110 includes a base 112 and a plurality of extending parts 114 extended from a circumference of base 112 in a bending forming manner and spaced from each other.
- the base 112 includes a plurality of holes 116 , and in this embodiment, the holes 116 are, for example, two.
- the MCPCB 110 is provided with a plurality of slots 115 by stamping process and then bended along the slots 115 such that the profile of the MCPCB 110 is of poculiform shape (cup-shaped).
- the illuminant element 12 is mounted on the MCPCB 110 , and in more particularly, the illuminant element 12 is mounted on an upper surface 113 of the base 112 and electrically connected to the MCPCB 110 .
- the number of the illuminant element 12 may be one or more, and in this embodiment, the number of the illuminant element 12 is, for example, one, and preferably high power light emitting diode (LED).
- the power driving unit 130 includes a circuit board 132 and at least an electronic element 134 mounted on the at least a plate 1326 of the circuit board 132 .
- the circuit board 132 is preferably a printed circuit board (PCB) and provided with conductive traces 1325 and soldering pads (not shown). In this embodiment, the conductive traces 1325 are, for example, two.
- the circuit board 132 includes a first end 1320 and a second end 1322 opposite to the first end 1320 .
- the first end 1320 has a plurality of posts 1321 corresponding to the holes 116 . In this embodiment, the posts 1321 are, for example, two, and corresponding to two holes 116 , respectively.
- the posts 1321 are protruded the holes 116 such that the plate 1326 is substantially perpendicular to the upper surface 113 of the MCPCB 110 , and the conductive traces 1325 is electrically connected to the MCPCB 110 through the posts 1321 .
- the MCPCB 110 and the circuit board 132 may electrically connect through welding process or coating with conductive adhesive.
- the conductive traces 1325 may just dispose on a plane 1326 of the circuit board 132 , or simultaneously dispose on two planes 1326 of the circuit board 132 and the conductive traces 1325 at one of the planes 1326 is insulated by an insulating element, such as insulating tape, thereby to prevent from short.
- the second end 1322 of the circuit board 132 includes a plurality of concaves 1323 used for disposing two conductive pins 150 of the illuminant device 10 .
- the conductive pins 150 are electrically connected to the power driving unit 130 .
- the housing 140 is made of polymer material with high thermal conductivity, such as thermoset plastic or thermoplasticity plastic, and is integrally-formed by injection molding.
- the housing 140 has advantages of light, easily manufacturing and high insulating effect.
- the polymer material includes a plurality of thermal conductive particles 141 , such as metallic oxide powder, graphite powder or ceramic powder, which can effectively remove heat generated by the illuminant element 12 .
- the housing 140 has a first side 142 and a second side 144 opposite to the first side 142 .
- the first side 142 is substantially of poculiform profile and has a circumferential wall 1420 .
- An inner surface 1421 of the circumferential well 1420 has a plurality of grooves 1422
- an external surface 1423 of the circumferential wall 1420 has a plurality of fins 1424 radially extended therefrom and physically connected thereon to increase the effect of heat-dissipation.
- the fins 1424 are integrally-formed on the circumferential wall 140 and also have the thermal conductive particles 141 .
- the fins 1424 are used to increase the heat-dissipation area so as to increase the effect of heat-dissipation.
- the MCPCB 110 is disposed on the first side 142 and the extending parts 114 are embedded within the housing 140 .
- the second side 144 is physically connected to the first side 142 and is substantially of pipe shape.
- the conductive pins 150 pass through the bottom of the second side 144 and adapted to the external socket (not shown).
- the process of manufacturing the illuminant device 10 is described as below: first, forming a plurality of slots 115 spaced from each other on the MCPCB 110 by stamping process and bending the MCPCB along the slots 115 to form a base 112 and a plurality extending parts 114 , and forming a plurality of holes 116 on the base 112 in the meanwhile. Moreover, assembling a plurality of posts 1321 of a circuit board 132 of a power driving unit 130 with the holes 116 of a MCPCB 110 and electrically connected the MCPCB 110 and the circuit board 132 .
- the housing 140 can directly cover the extending parts 114 of the MCPCB 110 and the power driving unit 130 , such that the joining force is increased to prevent break from compression, and the heat generated by the illuminant element 12 is quickly transmitting to the housing 140 through the extending parts 114 and then dissipating to the air.
- the illuminant element 12 may be mounted on the housing 140 by welding process first, and then embedding the assembled MCPCB 110 mounted on the illuminant element 12 and the power driving unit 130 into an injection mold and forming the housing 140 covering the extending parts 114 of the MCPCB 110 and the power driving unit 130 .
- the thickness of the circuit board 132 is far smaller than its width.
- a filling member 160 (as shown in FIG. 5 ) is disposed on both side of the circuit board 132 before injection.
- the filling member 160 may be, for example, a plastic member, silicone or epoxy. After that, the thickness of the housing 140 is uniform and can effectively prevent the housing 140 from deforming and lower the manufacturing cost.
- the illuminant device 10 further includes a diffusing element 170 , the diffusing element 170 is disposed on the first side 142 of the housing 110 and covers the illuminant element 12 .
- the diffusing element 170 includes a plurality of buckles 172 , the buckles 172 are engaged with the grooves 1422 , respectively, such that the diffusing element 170 is above the illuminant element 12 .
- the diffusing element 170 diffuses light passing through and improves the uniformity of light, therefore the illuminant device 10 can obtain optimal flare quality.
- FIG. 6 and FIG. 7 are respectively an exploded view and a cross-sectional view of an illuminant device according to the second preferred embodiment of the present invention.
- the illuminant device 10 a is similar to that of first preferred embodiment mentioned above, but the different is that the illuminant device 10 a further includes an optical lens 180 .
- the optical lens 180 is disposed on the first side 142 of the housing 140 and between the illuminant element 12 and the diffusing element 170 and covers the illuminant element 12 to change the light intensity distribution of light passing therethrough.
- the optical lens 180 may have functions of light-convergence or light-divergence according to light-emitting effect of the illuminant device 10 a.
- the optical lens 180 has an optical axis I coincided to a light-emitting axis of the illuminant element 12 .
- the optical lens 180 includes a permeable main body 181 made of glass, plastic or other light permeable material.
- the main body 181 has a light-incident part 182 , a first light-emitting part 184 and a second light-emitting part 186 .
- the light-incident part 182 has a bottom surface 1820 and a reflecting surface 1822 .
- the bottom surface 1820 has a recess 1821 , and the illuminant element 12 is disposed on the recess 1821 .
- the reflecting surface 1822 is physically connected to the bottom surface 1820 and the first light-emitting part 184 , and the distance located between the reflecting surface 1822 and the optical axis I is increased when the reflecting surface 1822 is gradually far away from the bottom surface 1820 .
- the first light-emitting part 184 is physically connected to the reflecting surface 1822 and has a top surface 185 .
- the top surface 185 is gradually close to the optical axis I when the top surface 185 is gradually close to the bottom surface 1820 .
- the top surface 185 includes a plurality of first light-emitting surfaces 1842 and second light-emitting surfaces 1844 arranged in an interlaced manner.
- the first light-emitting surface 1842 is substantially parallel to the bottom surface 1820
- the second light-emitting surface 1822 is substantially perpendicular to the bottom surface 1820 such that the first light-emitting part 184 is of stepwise.
- the length of the second light-emitting surfaces 1844 perpendicular to the bottom surface 1820 are progressively decreased when the second light-emitting surfaces 1844 are gradually close to the optical axis I. Therefore, the distance of light transmitting to the first light-emitting part 184 can be decreased to lower the losses of light transmitting inner the optical lens 180 and can further reduce the thickness and weight of the optical lens 180 .
- changing the tilted angle located between a plane perpendicular to the optical axis I and the first light-emitting surface 1842 of the first light emitting part 184 of the optical lens 180 can effectively control travelling route of light emitted from the illuminant element 12 .
- the second light-emitting part 186 is physically connected to the top surface 185 and substantially located above the recess 1821 .
- the second light-emitting part 186 is a Fresnel lens and may have the function of light-convergence or light-divergence.
- FIG. 8 , FIG. 9 , FIG. 10 and FIG. 11 are respectively a partially exploded view, a partially assembled view, an exploded view and a cross-sectional view of an illuminant device according to a third preferred embodiment of the present invention.
- the illuminant device 20 includes a lamp holder 21 , a plurality of illuminant elements 22 , an optical element 280 and a wedging element 290 .
- the lamp holder 21 includes a MCPCB 210 , a power driving unit 230 and a housing 240 .
- the MCPCB 210 is provided with conductive traces (not shown) and soldering pads (not shown) and includes a base 212 and a plurality of extending parts 214 extended from a circumference of base 212 in a bending forming manner and spaced from each other.
- the base 212 includes a plurality of holes 216 , and in this embodiment, the number of the holes 216 are, for example, two.
- the MCPCB 110 is provides with a plurality of slots 215 by stamping process and then bending along the slots 215 such that the extending parts 214 are substantially perpendicular to the base 212 .
- the illuminant element 22 is mounted on an upper surface 213 of the base 212 and electrically connected to the MCPCB 210 .
- the number of the illuminant element 22 are, but not limited to, four, and preferably high power light emitting diodes (LEDs).
- the power driving unit 230 includes a circuit board 232 and at least an electronic element 234 mounted on at least a plane 2326 of the circuit board 232 .
- the circuit board 232 may be PCB and provided with conductive traces 2325 and soldering pads (not shown). In this embodiment, the conductive traces 2325 are, for example, two.
- the circuit board 232 includes a first end 2320 and a second end 2322 opposite to the first end 2320 .
- the first end 2320 has a plurality of posts 2321 corresponding to the holes 216 . In this embodiment, the posts 2321 are, for example, two.
- the posts 2321 are respectively penetrating the holes 216 such that an upper surface 213 of the MCPCB 210 are substantially perpendicular to the plane 2326 and the conductive traces 2325 are electrically connected to the MCPCB 230 through the posts 2321 .
- the second end 2322 of the circuit board 232 includes a plurality of concaves 2323 used for disposed two conductive pins 250 of the illuminant device 20 , the conductive pins 250 are electrically connected to the power driving unit 230 .
- the housing 240 is made of polymer material with high thermal conductivity and integrally-formed by injection molding.
- the housing 240 has advantages of light, easily manufacturing and high insulating effect.
- the polymer material includes a plurality of thermal conductive particles 241 .
- the housing 240 has a first side 242 and a second side 244 opposite to the first side 242 , the first side 242 is substantially of poculiform profile and has a circumferential wall 2420 .
- An inner surface 2421 of the circumferential wall 2420 has a plurality of grooves 2422 , and an external surface 2423 of the circumferential wall 2420 has a plurality of fins 2424 radially extended therefrom and physically connected thereon to increase effect of heat-dissipation.
- the MCPCB 210 is disposed on the first side 242 and the extending parts 214 are embedded within the housing 240 .
- the second side 244 is physically connected to the first side 242 and is substantially of pipe shape, and the conductive pins 250 pass through the bottom of the second side 244 and adapted to the external socket (not shown).
- the housing 240 covers the extending parts 214 of the MCPCB 210 and the power driving unit 230 such that the joining force between the MCPCB 210 and the house 240 is increased to prevent break from compression.
- the optical element 280 is disposed on the first side 242 of the housing 240 and covers the illuminant elements 22 .
- the optical element 280 includes a plurality of light-incident parts 282 and a light-emitting part 284 .
- the number of the light-incident parts 282 is equal to the number of the illuminant elements 22 .
- the light-incident parts 282 are physically connected to the light-emitting part 284 and protruding toward a direction opposite to the light-emitting part 284 .
- Each light-incident part 282 has a cavity 2820 and the illuminant elements 22 are disposed within the cavities 2820 .
- the optical lens 280 further includes a plurality of supporting elements 286 , the supporting elements 286 touch the MCPCB 210 and support the optical element 280 above the illuminant elements 22 .
- FIG. 12 , FIG. 13 and FIG. 14 are respectively a partially exploded view, a assembled view and a cross-sectional view of an illuminant device according to a fourth preferred embodiment of the present invention.
- the illuminant device 30 is, for example, a MR 16 lamp.
- the illuminant device 30 includes a lamp holder 31 and at least an illuminant element 32 .
- the lamp holder 31 includes a MCPCB 310 , a power driving unit 330 , a housing 340 and an optical element 380 .
- the MCPCB 310 includes a base 312 and a plurality of extending parts 314 extended from a circumference of base 312 in a bending forming manner and spaced from each other.
- the extending parts 314 are substantially perpendicular to the base 312 .
- the base 312 includes a plurality of holes 316 and openings 318 .
- the holes 316 are, for example, two, and the openings 318 are, for example, four.
- the illuminant element 32 is mounted on an upper surface 313 of the base 312 and electrically connected to the MCPCB 310 .
- the number of the illuminant elements 32 is, but not limited to, seven, and preferably high power LEDs.
- the power driving unit 330 includes a circuit board 332 and at least an electronic element 334 mounted on at least a plane 3326 of the circuit board 332 .
- the electronic element 334 is, for example, power converter, active element or passive element.
- the circuit board 332 is preferably PCB and provided with conductive traces 3325 and soldering pads (not shown). In this embodiment, the conductive traces 3325 are, for example, two.
- a first end 3320 of the circuit board 332 includes a plurality of the posts 3321 , and in this embodiment, the number of the posts 3321 are, for example, two.
- the posts 3321 penetrates the holes 316 , such that the plane 3326 is substantially perpendicular to an upper surface 313 of the MCPCB 310 , and the conductive traces 3325 are electrically connected to the MCPCB 310 through the posts 3321 .
- the optical element 380 includes a plurality of light-incident parts 382 , a light-emitting part 384 and a plurality of wedging parts 386 .
- the light-incident parts 382 are physically connected to the light-emitting part 384 and arc-protruded toward a direction opposite to the light-emitting part 384 .
- Each light-emitting part 382 has a cavity 3820 , and the illuminant elements 32 are disposed within the cavities 3820 , respectively.
- the number of the light-emitting parts 382 is equal to the number of the illuminant elements 32 .
- the wedging parts 386 are respectively corresponding to the openings 318 and number of the wedging parts 386 is equal to number of the openings 318 . In this embodiment, the number of the wedging parts 386 are, for example, four.
- the wedging parts 386 are engaged with the openings 318 such that the optical element 380 is assembled with the MCPCB 310 .
- the housing 340 is made of polymer material with high thermal conductivity and integrally-formed by injection molding.
- the housing 340 has advantages of light, easily manufacturing and high insulating effect.
- the polymer material includes a plurality of thermal conductive particles 341 .
- the housing 340 covers the extending parts 314 , the power driving unit 330 and the optical element 380 such that the joining force between the MCPCB 310 , the optical lens 380 and the house 340 is increased to prevent break from compression.
- a first side 342 of the housing 340 is substantially of poculiform profile and has a circumferential wall 3420 , an external surface 3423 of the circumferential wall 3420 has a plurality of fins 3424 radially extended therefrom and physically connected thereon to increase effect of heat-dissipation.
- the MCPCB 310 is disposed on the first side 342 and the extending parts 314 are embedded within the housing 340 .
- the optical element 380 is also disposed on the first side 342 and covers the illuminant elements 32 .
- a second side 344 of the housing 340 is opposite to the first side 342 and physically connected to the first side 342 and is substantially of pipe-shape.
- a plurality of conductive pins 350 pass through the bottom of the second side 344 and electrically connected to the circuit board 332 . In this embodiment, the conductive pins 350 are corresponding to connecting pins of MR 16 lamp.
- the process of manufacturing the illuminant device 30 is described as below: first, forming a plurality of slots 315 spaced from each other on the MCPCB 310 by stamping process and bending the MCPCB 310 to form a base 312 and a plurality extending parts 314 , and forming a plurality of holes 316 and openings 318 on the base 312 in the meanwhile. After that, assembling a plurality of posts 3321 of a circuit board 332 of a power driving unit 330 with the holes 316 of a MCPCB 310 and electrically connected the MCPCB 310 and the circuit board 332 .
- the housing 340 can directly cover the extending parts 314 of the MCPCB 310 , the power driving unit 330 and the optical lens 380 .
- FIG. 15 , FIG. 16 and FIG. 17 are respectively a partially exploded view, a partially assembled view and a cross-sectional view of an illuminant device according to a fifth preferred embodiment of the present invention.
- the illuminant device 30 a is similar to that of fourth preferred embodiment mentioned above, but the different is that the conductive pins 350 a of the illuminant device 30 a are corresponding to conductive pins of GU10 lamp for adapting into socket of GU5.3 or GX5.3.
- the sockets mentioned above are used for demonstration and is not limitation of the claim scope of the present invention.
- circuit board of the power driving unit is directly assembled with and electrically connected to the MCPCB such that can easily manufacturing process and lower manufacturing cost.
- the housing is made of polymer material with thermal conductive particle can effectively remove heat generated by the illuminant element and has advantages of easily manufacturing, light and high insulating effect.
- the housing can quickly remove heat generated by the illuminant element to prevent from intensity decreased, short life-time, wavelength drift or damage cause by operating with high temperature.
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- Geometry (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to an illuminant device, especially to an illuminant device with high thermal conductivity coefficient and insulating property and uses light emitting diodes as light source.
- 2. Description of Prior Art
- Light emitting diodes (LEDs) have the advantages of small volume, long lifetime, difficulty damage, without mercury and lower power consumption. They are gradually replacing the fluorescent tubes and incandescent lamps and widely used in indoor or outdoor lighting and decorative lighting.
- Reference is made to
FIG. 1 , which is a cross-sectional view of a conventional LED lamp. The LED lamp includes ahousing 50, acircuit board 52, a plurality ofLEDs 54, aconductive connector 56, ashell 58 and apower driving unit 59. Thehousing 50 is a hollow body and has a plurality offins 51 radially extended from a circumferential wall and physically connected thereon, thereby the heat-dissipation area of thehousing 50 is increased and can quickly remove heat generated by theLEDs 54 to the air. Thecircuit board 52 is disposed on thehousing 50 and electrically connected to thepower circuit unit 59 throughmultiple wires 53. TheLEDs 54 are disposed on thecircuit board 52 and electrically connected thereto. Theconductive connector 56 is physically connected to thehousing 50 at the location opposite to thecircuit board 52, and electrically connected to thepower driving circuit 59 through twopower lines 57. Theshell 58 is disposed on thehousing 50 at the side disposed theLEDs 54 such that theLEDs 54 are arranged between theshell 58 and thehousing 50. - However, the
circuit board 52 and theconductive connector 56 are electrically connected to thepower driving unit 59 through thewires 53 and thepower lines 57, respectively. This increases productive processes, the difficulty of manufacturing and cost. - It is an object of the present invention to provide an illuminant device, the illuminant device has advantages of easily manufacture, lower manufacturing cost, light and high insulating property.
- It is another object of the present invention to provide a manufacturing method of a lamp holder which can easily productive processes and lower manufacturing cost.
- Accordingly, the illuminant device according to one aspect of the present invention comprises at least an illuminant element and a lamp holder. The lamp holder includes a housing, a metal core printed circuit board (MCPCB) and a power driving circuit. The housing has a first side and a second side opposite to the first side. The MCPCB is disposed on the first side and includes a base and a plurality of extending parts extended from a circumference of base in a bending forming manner and spaced from each other. The base has a plurality of holes, the extending parts are embedded within the housing, and the illuminant element is mounted on the base. The power-driving unit includes a circuit board, and a first end of the circuit board has a plurality of posts. The posts are respectively penetrating the holes and electrically connected to the MCPCB.
- Accordingly, the manufacturing method of a lamp holder according to another aspect of the present invention comprises: assembling a plurality of holes of a MCPCB and a plurality of posts of a circuit board of a power driving unit, respectively, and electrically connecting the MCPCB and the circuit board; forming a housing outside the MCPCB and the power driving unit and partially covering the MCPCB and the power driving unit.
- In the present invention, the circuit board of the power driving unit is directly assembled to the MCPCB, thereby can effectively easily productive processes and lower manufacturing cost.
- The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:
-
FIG. 1 is a cross-sectional view of a conventional light emitting diode (LED) lamp. -
FIG. 2 is a partially exploded of an illuminant device according to a first preferred embodiment of the present invention. -
FIG. 3 is a partially assembled view of the illuminant device according to the first preferred embodiment of the present invention. -
FIG. 4 is a cross-sectional view of the illuminant device according to the first preferred embodiment of the present invention. -
FIG. 5 is an exploded view of the illuminant device according to the first preferred embodiment of the present invention. -
FIG. 6 is an exploded view of an illuminant device according to a second preferred embodiment of the present invention. -
FIG. 7 is a cross-sectional view of the illuminant device according to the second preferred embodiment of the present invention. -
FIG. 8 is a partially exploded view of an illuminant device according to a third preferred embodiment of the present invention. -
FIG. 9 is a partially assembled view of the illuminant device according to the third preferred embodiment of the present invention. -
FIG. 10 is an exploded view of the illuminant device according to the third preferred embodiment of the present invention. -
FIG. 11 is a cross-sectional view of the illuminant device according to the third preferred embodiment of the present invention. -
FIG. 12 is a partially exploded view of an illuminant device according to a fourth preferred embodiment of the present invention. -
FIG. 13 is a partially assembled view of the illuminant device according to the fourth preferred embodiment of the present invention. -
FIG. 14 is cross-sectional view of the illuminant device according to the fourth preferred embodiment of the present invention. -
FIG. 15 is a partially exploded view of the illuminant device according to a fifth preferred embodiment of the present invention. -
FIG. 16 is a partially assembled view of an illuminant device according to the fifth preferred embodiment of the present invention. -
FIG. 17 is a cross-sectional view of the illuminant device according to the fifth preferred embodiment of the present invention. - Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
- Reference is made to
FIG. 2 ,FIG. 3 andFIG. 4 , which are respectively a partially exploded view, a partially assembled view and a cross-sectional view of an illuminant device according to a first preferred embodiment of present invention. In this embodiment, the illuminant 10 is, for example, a GU10 lamp. However, in the practical application, theilluminant device 10 may be PAR series lamp, A19, A20, A60, G30 or other type lamps. Theilluminant device 10 includes alamp holder 11 and at least anilluminant element 12. Thelamp holder 11 includes a metal core printed circuit board (MCPCB) 110, apower driving unit 130 and ahousing 140. - The MCPCB 110 has better thermal conductive and is provided with conductive traces (not shown) and soldering pads (not shown). The MCPCB 110 includes a
base 112 and a plurality of extendingparts 114 extended from a circumference ofbase 112 in a bending forming manner and spaced from each other. Thebase 112 includes a plurality ofholes 116, and in this embodiment, theholes 116 are, for example, two. In the practical application, the MCPCB 110 is provided with a plurality ofslots 115 by stamping process and then bended along theslots 115 such that the profile of the MCPCB 110 is of poculiform shape (cup-shaped). - The
illuminant element 12 is mounted on the MCPCB 110, and in more particularly, theilluminant element 12 is mounted on anupper surface 113 of thebase 112 and electrically connected to the MCPCB 110. The number of theilluminant element 12 may be one or more, and in this embodiment, the number of theilluminant element 12 is, for example, one, and preferably high power light emitting diode (LED). - The
power driving unit 130 includes acircuit board 132 and at least anelectronic element 134 mounted on the at least aplate 1326 of thecircuit board 132. Thecircuit board 132 is preferably a printed circuit board (PCB) and provided withconductive traces 1325 and soldering pads (not shown). In this embodiment, theconductive traces 1325 are, for example, two. Thecircuit board 132 includes afirst end 1320 and asecond end 1322 opposite to thefirst end 1320. Thefirst end 1320 has a plurality ofposts 1321 corresponding to theholes 116. In this embodiment, theposts 1321 are, for example, two, and corresponding to twoholes 116, respectively. - The
posts 1321 are protruded theholes 116 such that theplate 1326 is substantially perpendicular to theupper surface 113 of theMCPCB 110, and theconductive traces 1325 is electrically connected to theMCPCB 110 through theposts 1321. TheMCPCB 110 and thecircuit board 132 may electrically connect through welding process or coating with conductive adhesive. In addition, theconductive traces 1325 may just dispose on aplane 1326 of thecircuit board 132, or simultaneously dispose on twoplanes 1326 of thecircuit board 132 and theconductive traces 1325 at one of theplanes 1326 is insulated by an insulating element, such as insulating tape, thereby to prevent from short. In this embodiment, thesecond end 1322 of thecircuit board 132 includes a plurality ofconcaves 1323 used for disposing twoconductive pins 150 of theilluminant device 10. Theconductive pins 150 are electrically connected to thepower driving unit 130. - The
housing 140 is made of polymer material with high thermal conductivity, such as thermoset plastic or thermoplasticity plastic, and is integrally-formed by injection molding. Thehousing 140 has advantages of light, easily manufacturing and high insulating effect. In addition, the polymer material includes a plurality of thermalconductive particles 141, such as metallic oxide powder, graphite powder or ceramic powder, which can effectively remove heat generated by theilluminant element 12. - With reference to
FIG. 4 andFIG. 5 , thehousing 140 has afirst side 142 and asecond side 144 opposite to thefirst side 142. Thefirst side 142 is substantially of poculiform profile and has acircumferential wall 1420. Aninner surface 1421 of thecircumferential well 1420 has a plurality ofgrooves 1422, and anexternal surface 1423 of thecircumferential wall 1420 has a plurality offins 1424 radially extended therefrom and physically connected thereon to increase the effect of heat-dissipation. Thefins 1424 are integrally-formed on thecircumferential wall 140 and also have the thermalconductive particles 141. Thefins 1424 are used to increase the heat-dissipation area so as to increase the effect of heat-dissipation. TheMCPCB 110 is disposed on thefirst side 142 and the extendingparts 114 are embedded within thehousing 140. Thesecond side 144 is physically connected to thefirst side 142 and is substantially of pipe shape. Theconductive pins 150 pass through the bottom of thesecond side 144 and adapted to the external socket (not shown). - The process of manufacturing the
illuminant device 10 is described as below: first, forming a plurality ofslots 115 spaced from each other on theMCPCB 110 by stamping process and bending the MCPCB along theslots 115 to form abase 112 and aplurality extending parts 114, and forming a plurality ofholes 116 on the base 112 in the meanwhile. Moreover, assembling a plurality ofposts 1321 of acircuit board 132 of apower driving unit 130 with theholes 116 of aMCPCB 110 and electrically connected theMCPCB 110 and thecircuit board 132. - After that, embedding the assembled
MCPCB 110 and thepower driving unit 130 into an injection mold, and forming ahousing 140 outside theMCPCB 110 and thepower driving unit 130. Therefore thehousing 140 can directly cover the extendingparts 114 of theMCPCB 110 and thepower driving unit 130, such that the joining force is increased to prevent break from compression, and the heat generated by theilluminant element 12 is quickly transmitting to thehousing 140 through the extendingparts 114 and then dissipating to the air. Finally, mounting at least anilluminant element 12 on theMCPCB 110 and electrically connecting to theMCPCB 110 by welding process. Alternatively, theilluminant element 12 may be mounted on thehousing 140 by welding process first, and then embedding the assembledMCPCB 110 mounted on theilluminant element 12 and thepower driving unit 130 into an injection mold and forming thehousing 140 covering the extendingparts 114 of theMCPCB 110 and thepower driving unit 130. - In addition, the thickness of the
circuit board 132 is far smaller than its width. In order to prevent the thickness ofhousing 140 over-thick, a filling member 160 (as shown inFIG. 5 ) is disposed on both side of thecircuit board 132 before injection. The fillingmember 160 may be, for example, a plastic member, silicone or epoxy. After that, the thickness of thehousing 140 is uniform and can effectively prevent thehousing 140 from deforming and lower the manufacturing cost. - The
illuminant device 10 further includes a diffusingelement 170, the diffusingelement 170 is disposed on thefirst side 142 of thehousing 110 and covers theilluminant element 12. The diffusingelement 170 includes a plurality ofbuckles 172, thebuckles 172 are engaged with thegrooves 1422, respectively, such that the diffusingelement 170 is above theilluminant element 12. The diffusingelement 170 diffuses light passing through and improves the uniformity of light, therefore theilluminant device 10 can obtain optimal flare quality. - Reference is made to
FIG. 6 andFIG. 7 , which are respectively an exploded view and a cross-sectional view of an illuminant device according to the second preferred embodiment of the present invention. Theilluminant device 10 a is similar to that of first preferred embodiment mentioned above, but the different is that theilluminant device 10 a further includes anoptical lens 180. Theoptical lens 180 is disposed on thefirst side 142 of thehousing 140 and between theilluminant element 12 and the diffusingelement 170 and covers theilluminant element 12 to change the light intensity distribution of light passing therethrough. Theoptical lens 180 may have functions of light-convergence or light-divergence according to light-emitting effect of theilluminant device 10 a. - In this embodiment, the
optical lens 180 has an optical axis I coincided to a light-emitting axis of theilluminant element 12. Theoptical lens 180 includes a permeablemain body 181 made of glass, plastic or other light permeable material. Themain body 181 has a light-incident part 182, a first light-emittingpart 184 and a second light-emittingpart 186. The light-incident part 182 has abottom surface 1820 and a reflectingsurface 1822. Thebottom surface 1820 has arecess 1821, and theilluminant element 12 is disposed on therecess 1821. The reflectingsurface 1822 is physically connected to thebottom surface 1820 and the first light-emittingpart 184, and the distance located between the reflectingsurface 1822 and the optical axis I is increased when the reflectingsurface 1822 is gradually far away from thebottom surface 1820. The first light-emittingpart 184 is physically connected to the reflectingsurface 1822 and has atop surface 185. Thetop surface 185 is gradually close to the optical axis I when thetop surface 185 is gradually close to thebottom surface 1820. Thetop surface 185 includes a plurality of first light-emittingsurfaces 1842 and second light-emittingsurfaces 1844 arranged in an interlaced manner. In this embodiment, the first light-emittingsurface 1842 is substantially parallel to thebottom surface 1820, and the second light-emittingsurface 1822 is substantially perpendicular to thebottom surface 1820 such that the first light-emittingpart 184 is of stepwise. In addition, the length of the second light-emittingsurfaces 1844 perpendicular to thebottom surface 1820 are progressively decreased when the second light-emittingsurfaces 1844 are gradually close to the optical axis I. Therefore, the distance of light transmitting to the first light-emittingpart 184 can be decreased to lower the losses of light transmitting inner theoptical lens 180 and can further reduce the thickness and weight of theoptical lens 180. In the practical application, changing the tilted angle located between a plane perpendicular to the optical axis I and the first light-emittingsurface 1842 of the firstlight emitting part 184 of theoptical lens 180 can effectively control travelling route of light emitted from theilluminant element 12. - The second light-emitting
part 186 is physically connected to thetop surface 185 and substantially located above therecess 1821. The second light-emittingpart 186 is a Fresnel lens and may have the function of light-convergence or light-divergence. - Reference is made to
FIG. 8 ,FIG. 9 ,FIG. 10 andFIG. 11 , which are respectively a partially exploded view, a partially assembled view, an exploded view and a cross-sectional view of an illuminant device according to a third preferred embodiment of the present invention. Theilluminant device 20 includes alamp holder 21, a plurality ofilluminant elements 22, anoptical element 280 and awedging element 290. Thelamp holder 21 includes aMCPCB 210, apower driving unit 230 and ahousing 240. - The
MCPCB 210 is provided with conductive traces (not shown) and soldering pads (not shown) and includes abase 212 and a plurality of extendingparts 214 extended from a circumference ofbase 212 in a bending forming manner and spaced from each other. Thebase 212 includes a plurality ofholes 216, and in this embodiment, the number of theholes 216 are, for example, two. In the practical application, theMCPCB 110 is provides with a plurality ofslots 215 by stamping process and then bending along theslots 215 such that the extendingparts 214 are substantially perpendicular to thebase 212. - The
illuminant element 22 is mounted on anupper surface 213 of thebase 212 and electrically connected to theMCPCB 210. In this embodiment, the number of theilluminant element 22 are, but not limited to, four, and preferably high power light emitting diodes (LEDs). - The
power driving unit 230 includes acircuit board 232 and at least anelectronic element 234 mounted on at least aplane 2326 of thecircuit board 232. Thecircuit board 232 may be PCB and provided withconductive traces 2325 and soldering pads (not shown). In this embodiment, theconductive traces 2325 are, for example, two. Thecircuit board 232 includes afirst end 2320 and asecond end 2322 opposite to thefirst end 2320. Thefirst end 2320 has a plurality ofposts 2321 corresponding to theholes 216. In this embodiment, theposts 2321 are, for example, two. Theposts 2321 are respectively penetrating theholes 216 such that anupper surface 213 of theMCPCB 210 are substantially perpendicular to theplane 2326 and theconductive traces 2325 are electrically connected to theMCPCB 230 through theposts 2321. Thesecond end 2322 of thecircuit board 232 includes a plurality ofconcaves 2323 used for disposed twoconductive pins 250 of theilluminant device 20, theconductive pins 250 are electrically connected to thepower driving unit 230. - The
housing 240 is made of polymer material with high thermal conductivity and integrally-formed by injection molding. Thehousing 240 has advantages of light, easily manufacturing and high insulating effect. In addition, the polymer material includes a plurality of thermalconductive particles 241. Thehousing 240 has afirst side 242 and asecond side 244 opposite to thefirst side 242, thefirst side 242 is substantially of poculiform profile and has acircumferential wall 2420. Aninner surface 2421 of thecircumferential wall 2420 has a plurality ofgrooves 2422, and anexternal surface 2423 of thecircumferential wall 2420 has a plurality offins 2424 radially extended therefrom and physically connected thereon to increase effect of heat-dissipation. TheMCPCB 210 is disposed on thefirst side 242 and the extendingparts 214 are embedded within thehousing 240. Thesecond side 244 is physically connected to thefirst side 242 and is substantially of pipe shape, and theconductive pins 250 pass through the bottom of thesecond side 244 and adapted to the external socket (not shown). - The
housing 240 covers the extendingparts 214 of theMCPCB 210 and thepower driving unit 230 such that the joining force between theMCPCB 210 and thehouse 240 is increased to prevent break from compression. - The
optical element 280 is disposed on thefirst side 242 of thehousing 240 and covers theilluminant elements 22. Theoptical element 280 includes a plurality of light-incident parts 282 and a light-emittingpart 284. In this embodiment, the number of the light-incident parts 282 is equal to the number of theilluminant elements 22. The light-incident parts 282 are physically connected to the light-emittingpart 284 and protruding toward a direction opposite to the light-emittingpart 284. Each light-incident part 282 has acavity 2820 and theilluminant elements 22 are disposed within thecavities 2820. - The
optical lens 280 further includes a plurality of supportingelements 286, the supportingelements 286 touch theMCPCB 210 and support theoptical element 280 above theilluminant elements 22. - The wedging
element 290 having a plurality oftenons 292, thetenons 292 are respectively engaged with thegrooves 2422 of thehousing 240 to fasten thehousing 240 and theoptical lens 280. - Reference is made to
FIG. 12 ,FIG. 13 andFIG. 14 , which are respectively a partially exploded view, a assembled view and a cross-sectional view of an illuminant device according to a fourth preferred embodiment of the present invention. In this embodiment, theilluminant device 30 is, for example, a MR 16 lamp. Theilluminant device 30 includes alamp holder 31 and at least anilluminant element 32. Thelamp holder 31 includes aMCPCB 310, apower driving unit 330, ahousing 340 and anoptical element 380. - The
MCPCB 310 includes abase 312 and a plurality of extendingparts 314 extended from a circumference ofbase 312 in a bending forming manner and spaced from each other. In this embodiment, the extendingparts 314 are substantially perpendicular to thebase 312. Thebase 312 includes a plurality ofholes 316 andopenings 318. In this embodiment, theholes 316 are, for example, two, and theopenings 318 are, for example, four. - The
illuminant element 32 is mounted on anupper surface 313 of thebase 312 and electrically connected to theMCPCB 310. In this embodiment, the number of theilluminant elements 32 is, but not limited to, seven, and preferably high power LEDs. - The
power driving unit 330 includes acircuit board 332 and at least anelectronic element 334 mounted on at least aplane 3326 of thecircuit board 332. Theelectronic element 334 is, for example, power converter, active element or passive element. Thecircuit board 332 is preferably PCB and provided withconductive traces 3325 and soldering pads (not shown). In this embodiment, theconductive traces 3325 are, for example, two. - A
first end 3320 of thecircuit board 332 includes a plurality of theposts 3321, and in this embodiment, the number of theposts 3321 are, for example, two. Theposts 3321 penetrates theholes 316, such that theplane 3326 is substantially perpendicular to anupper surface 313 of theMCPCB 310, and theconductive traces 3325 are electrically connected to theMCPCB 310 through theposts 3321. - The
optical element 380 includes a plurality of light-incident parts 382, a light-emittingpart 384 and a plurality of wedgingparts 386. The light-incident parts 382 are physically connected to the light-emittingpart 384 and arc-protruded toward a direction opposite to the light-emittingpart 384. Each light-emittingpart 382 has acavity 3820, and theilluminant elements 32 are disposed within thecavities 3820, respectively. In this embodiment, the number of the light-emittingparts 382 is equal to the number of theilluminant elements 32. The wedgingparts 386 are respectively corresponding to theopenings 318 and number of the wedgingparts 386 is equal to number of theopenings 318. In this embodiment, the number of the wedgingparts 386 are, for example, four. The wedgingparts 386 are engaged with theopenings 318 such that theoptical element 380 is assembled with theMCPCB 310. - The
housing 340 is made of polymer material with high thermal conductivity and integrally-formed by injection molding. Thehousing 340 has advantages of light, easily manufacturing and high insulating effect. The polymer material includes a plurality of thermalconductive particles 341. Thehousing 340 covers the extendingparts 314, thepower driving unit 330 and theoptical element 380 such that the joining force between theMCPCB 310, theoptical lens 380 and thehouse 340 is increased to prevent break from compression. Afirst side 342 of thehousing 340 is substantially of poculiform profile and has acircumferential wall 3420, an external surface 3423 of thecircumferential wall 3420 has a plurality offins 3424 radially extended therefrom and physically connected thereon to increase effect of heat-dissipation. TheMCPCB 310 is disposed on thefirst side 342 and the extendingparts 314 are embedded within thehousing 340. Theoptical element 380 is also disposed on thefirst side 342 and covers theilluminant elements 32. Asecond side 344 of thehousing 340 is opposite to thefirst side 342 and physically connected to thefirst side 342 and is substantially of pipe-shape. A plurality ofconductive pins 350 pass through the bottom of thesecond side 344 and electrically connected to thecircuit board 332. In this embodiment, theconductive pins 350 are corresponding to connecting pins of MR 16 lamp. - The process of manufacturing the
illuminant device 30 is described as below: first, forming a plurality ofslots 315 spaced from each other on theMCPCB 310 by stamping process and bending theMCPCB 310 to form abase 312 and aplurality extending parts 314, and forming a plurality ofholes 316 andopenings 318 on the base 312 in the meanwhile. After that, assembling a plurality ofposts 3321 of acircuit board 332 of apower driving unit 330 with theholes 316 of aMCPCB 310 and electrically connected theMCPCB 310 and thecircuit board 332. - After that, mounting a plurality of
illuminant elements 32 on thebase 312 and electrically connecting to theMCPCB 310. Engaging wedgingparts 386 of anoptical element 380 with theopenings 318, respectively, such that theoptical lens 380 is fastened on thebase 312 of theMCPCB 310. - Finally, embedding the assembled
MCPCB 310 and thepower driving unit 330 into an injection mold and forming ahousing 340 outside the extendingparts 314 of theMCPCB 310, thepower driving unit 130 and theoptical lens 380. Therefore thehousing 340 can directly cover the extendingparts 314 of theMCPCB 310, thepower driving unit 330 and theoptical lens 380. - Reference is made to
FIG. 15 ,FIG. 16 andFIG. 17 , which are respectively a partially exploded view, a partially assembled view and a cross-sectional view of an illuminant device according to a fifth preferred embodiment of the present invention. Theilluminant device 30 a is similar to that of fourth preferred embodiment mentioned above, but the different is that theconductive pins 350 a of theilluminant device 30 a are corresponding to conductive pins of GU10 lamp for adapting into socket of GU5.3 or GX5.3. However, the sockets mentioned above are used for demonstration and is not limitation of the claim scope of the present invention. - To sum up, in the present invention, circuit board of the power driving unit is directly assembled with and electrically connected to the MCPCB such that can easily manufacturing process and lower manufacturing cost. In addition, the housing is made of polymer material with thermal conductive particle can effectively remove heat generated by the illuminant element and has advantages of easily manufacturing, light and high insulating effect. Furthermore, through bending the MCPCB and embedding the extending parts within the housing such that the housing can quickly remove heat generated by the illuminant element to prevent from intensity decreased, short life-time, wavelength drift or damage cause by operating with high temperature.
- Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Claims (18)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100140616 | 2011-11-07 | ||
| TW100140616A | 2011-11-07 | ||
| TW100140616A TWI435026B (en) | 2011-11-07 | 2011-11-07 | Illiminant device and lamp thereof and manufacturing method of the of the lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20130114251A1 true US20130114251A1 (en) | 2013-05-09 |
| US8500301B2 US8500301B2 (en) | 2013-08-06 |
Family
ID=48129031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/347,858 Expired - Fee Related US8500301B2 (en) | 2011-11-07 | 2012-01-11 | Illuminant device and manufacturing method of lamp holder |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8500301B2 (en) |
| DE (1) | DE102012100838A1 (en) |
| TW (1) | TWI435026B (en) |
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| US20140168507A1 (en) * | 2012-12-17 | 2014-06-19 | Integrated Micro-Electronics, Inc. | Camera Module With Enhanced Heat Dissipation |
| US20140301080A1 (en) * | 2013-04-04 | 2014-10-09 | Lg Innotek Co., Ltd. | Lighting device |
| US20140369039A1 (en) * | 2012-01-20 | 2014-12-18 | Koninklijke Philips N.V. | Heat transferring arrangement |
| US20150043212A1 (en) * | 2013-03-13 | 2015-02-12 | Smartbotics Inc. | Led light bulb construction and manufacture |
| US20150241048A1 (en) * | 2012-09-14 | 2015-08-27 | Osram Gmbh | Illuminating Device |
| WO2015136151A1 (en) * | 2014-03-08 | 2015-09-17 | Lighttherm Ltd | Led lamp with embedded circuitry |
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| US20110101841A1 (en) * | 2009-11-02 | 2011-05-05 | Yue Qin | LED lamp |
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| EP3770495A1 (en) * | 2019-07-24 | 2021-01-27 | Ellego Powertec OY | Led lamp |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI435026B (en) | 2014-04-21 |
| TW201319456A (en) | 2013-05-16 |
| US8500301B2 (en) | 2013-08-06 |
| DE102012100838A1 (en) | 2013-05-08 |
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