US20120325452A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- US20120325452A1 US20120325452A1 US13/220,687 US201113220687A US2012325452A1 US 20120325452 A1 US20120325452 A1 US 20120325452A1 US 201113220687 A US201113220687 A US 201113220687A US 2012325452 A1 US2012325452 A1 US 2012325452A1
- Authority
- US
- United States
- Prior art keywords
- fin
- heat sink
- protrusion
- fins
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates to heat sinks in electronics, and more particularly to a heat sink with a plurality of fins.
- a large amount of heat is often produced.
- the heat must be quickly removed from the CPU to prevent it from becoming unstable or being damaged.
- a heat sink is attached to an outer surface of the CPU to absorb the heat from the CPU.
- a heat sink includes a plurality of fins to dissipate the heat from the CPU to an ambient atmosphere.
- the fins are spaced from each other to define channels therebetween.
- the fins are manufactured thinner for easily dissipating the heat.
- the heat sink will be struck in operation and outmost fins of the heat sink will be easily damaged.
- FIG. 1 is an assembled, isometric view of a heat sink in accordance with an embodiment of the disclosure.
- FIG. 2 is a partly assembled view of the heat sink of FIG. 1 .
- FIG. 3 is a view similar FIG. 1 , but showing the heat sink in another view.
- the heat sink 100 includes a number of fins 10 arranged together. Every two adjacent fins 10 define a channel 20 therebetween.
- Each of the fins 10 includes a body 11 and two flanges 13 .
- the flanges 13 extend from top and bottom sides of the body 11 respectively and perpendicularly to the body 11 along a same direction, respectively.
- Each of the flanges 13 abuts against the body 11 of the adjacent fin 10 .
- the body 11 includes a first part 110 and a second part 113 extending from a left end of the first part 110 .
- the first part 110 is substantially rectangular.
- the second part 113 is irregular.
- a bottom of the first part 110 and a bottom of the second part 113 are coplanar.
- a height of the second part 113 is larger than that of the first part 110 .
- the outmost fins 10 of the heat sink 100 include a first fin 10 a and a second fin 10 b at opposite ends of the heat sink 100 , respectively.
- the heat sink 100 includes a third fin 10 c adjacent to the first fin 10 a and a fourth fin 10 d adjacent to the second fin 10 b.
- the first fin 10 a includes a protrusion 15 extending therefrom to the third fin 10 c and abutting against the third fin 10 c.
- the fourth fin 10 d includes a protrusion 16 extending therefrom to the second fin 10 b and abutting against the second fin 10 b.
- Each of the protrusions 15 , 16 is punched respectively from a middle of an outer edge of the second part 113 of the first fin 10 a and the fourth fin 10 d.
- Each of the protrusions 15 , 16 has a trapezoid-shaped cross section.
- the protrusion 15 and the flanges 13 of the first fin 10 a are located at opposite sides of the body 11 of the first fin 10 a.
- the protrusion 16 and the flanges 13 of the fourth fin 10 d are located at opposite sides of the body 11 of the fourth fin 10 d.
- the protrusion 15 includes a narrow portion 151 and two inclined portions 152 interconnecting the first fin 10 a and the narrow portion 151 .
- the narrow portion 151 abuts against the third fin 10 c.
- the protrusion 16 includes a narrow portion 161 and two inclined portions 162 interconnecting the fourth fin 10 d and the narrow portion 161 .
- the narrow portion 161 abuts against the second fin 10 b.
- the bodies 11 of middle fins 10 between the third fin 10 c and the fourth fin 10 d are flat with no protrusion.
- the protrusion 15 can extend from the third fin 10 c to the first fin 10 a, or the protrusion 16 can extend from the second fin 10 b to the fourth fin 10 d.
- An amount of the protrusions 15 , 16 can be two or more.
- the protrusions 15 , 16 can be designed at a weak portion of the fins 10 for need to intensify the heat sink 10 .
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The disclosure relates to heat sinks in electronics, and more particularly to a heat sink with a plurality of fins.
- 2. Description of Related Art
- During operation of an electronic device such as a computer central processing unit (CPU), a large amount of heat is often produced. The heat must be quickly removed from the CPU to prevent it from becoming unstable or being damaged. Typically, a heat sink is attached to an outer surface of the CPU to absorb the heat from the CPU.
- Conventionally, a heat sink includes a plurality of fins to dissipate the heat from the CPU to an ambient atmosphere. The fins are spaced from each other to define channels therebetween. In order to improve a thermal capability of the heat sink, the fins are manufactured thinner for easily dissipating the heat. However, the heat sink will be struck in operation and outmost fins of the heat sink will be easily damaged.
- What is needed, therefore, is a heat sink which can overcome the limitations described.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of a heat sink in accordance with an embodiment of the disclosure. -
FIG. 2 is a partly assembled view of the heat sink ofFIG. 1 . -
FIG. 3 is a view similarFIG. 1 , but showing the heat sink in another view. - Referring to
FIG. 1 , aheat sink 100 in accordance with an exemplary embodiment of the disclosure is shown. Theheat sink 100 includes a number offins 10 arranged together. Every twoadjacent fins 10 define achannel 20 therebetween. - Each of the
fins 10 includes abody 11 and twoflanges 13. Theflanges 13 extend from top and bottom sides of thebody 11 respectively and perpendicularly to thebody 11 along a same direction, respectively. Each of theflanges 13 abuts against thebody 11 of theadjacent fin 10. Thebody 11 includes afirst part 110 and asecond part 113 extending from a left end of thefirst part 110. Thefirst part 110 is substantially rectangular. Thesecond part 113 is irregular. A bottom of thefirst part 110 and a bottom of thesecond part 113 are coplanar. A height of thesecond part 113 is larger than that of thefirst part 110. - Referring to
FIGS. 2-3 , theoutmost fins 10 of theheat sink 100 include afirst fin 10 a and asecond fin 10 b at opposite ends of theheat sink 100, respectively. Theheat sink 100 includes athird fin 10 c adjacent to thefirst fin 10 a and afourth fin 10 d adjacent to thesecond fin 10 b. Thefirst fin 10 a includes aprotrusion 15 extending therefrom to thethird fin 10 c and abutting against thethird fin 10 c. Thefourth fin 10 d includes aprotrusion 16 extending therefrom to thesecond fin 10 b and abutting against thesecond fin 10 b. Each of the 15, 16 is punched respectively from a middle of an outer edge of theprotrusions second part 113 of thefirst fin 10 a and thefourth fin 10 d. Each of the 15, 16 has a trapezoid-shaped cross section. Theprotrusions protrusion 15 and theflanges 13 of thefirst fin 10 a are located at opposite sides of thebody 11 of thefirst fin 10 a. Theprotrusion 16 and theflanges 13 of thefourth fin 10 d are located at opposite sides of thebody 11 of thefourth fin 10 d. Theprotrusion 15 includes a narrow portion 151 and twoinclined portions 152 interconnecting thefirst fin 10 a and the narrow portion 151. The narrow portion 151 abuts against thethird fin 10 c. Theprotrusion 16 includes anarrow portion 161 and twoinclined portions 162 interconnecting thefourth fin 10 d and thenarrow portion 161. Thenarrow portion 161 abuts against thesecond fin 10 b. Thebodies 11 ofmiddle fins 10 between thethird fin 10 c and thefourth fin 10 d are flat with no protrusion. - Since the
first fin 10 a abut against thethird fin 10 c by theprotrusion 15, thesecond fin 10 b abut against thefourth fin 10 d by theprotrusion 16, middle portions of the 10 a, 10 b of theoutmost fins heat sink 100 are supported and protected to avoid a damage from an outer object. Therefore, a robust structure of theheat sink 100 is provided. - Alternatively, in another embodiment, the
protrusion 15 can extend from thethird fin 10 c to thefirst fin 10 a, or theprotrusion 16 can extend from thesecond fin 10 b to thefourth fin 10 d. An amount of the 15, 16 can be two or more. Theprotrusions 15, 16 can be designed at a weak portion of theprotrusions fins 10 for need to intensify theheat sink 10. - It is to be understood, however, that even though numerous characteristics and advantages of certain embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (15)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110174309.9 | 2011-06-27 | ||
| CN2011101743099A CN102858132A (en) | 2011-06-27 | 2011-06-27 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20120325452A1 true US20120325452A1 (en) | 2012-12-27 |
Family
ID=47360725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/220,687 Abandoned US20120325452A1 (en) | 2011-06-27 | 2011-08-30 | Heat sink |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120325452A1 (en) |
| CN (1) | CN102858132A (en) |
| TW (1) | TWI513950B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1063052S1 (en) * | 2022-01-18 | 2025-02-18 | Delta Electronics, Inc. | Cooling fin |
| USD1063053S1 (en) * | 2022-01-18 | 2025-02-18 | Delta Electronics, Inc. | Cooling fin |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020056544A1 (en) * | 1999-07-23 | 2002-05-16 | Kaveh Azar | Heat sink with radial shape |
| US20020139515A1 (en) * | 1999-07-02 | 2002-10-03 | Kaveh Azar | Heat sink with textured regions |
| US6595275B1 (en) * | 2002-07-02 | 2003-07-22 | Waffer Technology Corp. | Heat sink assembly |
| US20030213582A1 (en) * | 2002-05-16 | 2003-11-20 | Hai-Ching Lin | Radiator with heat dissipation pieces connected in series |
| US20080017349A1 (en) * | 2006-07-21 | 2008-01-24 | Foxconn Technology Co., Ltd. | Heat sink |
| US20080023176A1 (en) * | 2006-07-31 | 2008-01-31 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US20080135215A1 (en) * | 2006-12-06 | 2008-06-12 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US7414842B2 (en) * | 2005-11-02 | 2008-08-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US20080295994A1 (en) * | 2007-05-28 | 2008-12-04 | Delta Electronics, Inc. | Heat-dissipating fin assembly and assembling method thereof |
| US7561417B2 (en) * | 2007-08-17 | 2009-07-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module and fin assembly thereof |
| US20110005728A1 (en) * | 2009-07-07 | 2011-01-13 | Furui Precise Component (Kunshan) Co., Ltd. | Heat dissipation module |
| US20110048680A1 (en) * | 2009-08-31 | 2011-03-03 | Foxconn Technology Co., Ltd. | Heat dissipation module |
| US20110048675A1 (en) * | 2009-08-28 | 2011-03-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2429859Y (en) * | 2000-06-12 | 2001-05-09 | 富准精密工业(深圳)有限公司 | Radiator assembly |
| TWM269700U (en) * | 2004-12-29 | 2005-07-01 | Chao-Chuan Chen | Fin set of heat sink |
| TWM346778U (en) * | 2008-07-10 | 2008-12-11 | Lian Cherng Entpr Co Ltd | Heat sinking fin set |
-
2011
- 2011-06-27 CN CN2011101743099A patent/CN102858132A/en active Pending
- 2011-06-28 TW TW100122520A patent/TWI513950B/en not_active IP Right Cessation
- 2011-08-30 US US13/220,687 patent/US20120325452A1/en not_active Abandoned
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020139515A1 (en) * | 1999-07-02 | 2002-10-03 | Kaveh Azar | Heat sink with textured regions |
| US20020056544A1 (en) * | 1999-07-23 | 2002-05-16 | Kaveh Azar | Heat sink with radial shape |
| US20030213582A1 (en) * | 2002-05-16 | 2003-11-20 | Hai-Ching Lin | Radiator with heat dissipation pieces connected in series |
| US6595275B1 (en) * | 2002-07-02 | 2003-07-22 | Waffer Technology Corp. | Heat sink assembly |
| US7414842B2 (en) * | 2005-11-02 | 2008-08-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US20080017349A1 (en) * | 2006-07-21 | 2008-01-24 | Foxconn Technology Co., Ltd. | Heat sink |
| US20080023176A1 (en) * | 2006-07-31 | 2008-01-31 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US20080135215A1 (en) * | 2006-12-06 | 2008-06-12 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US20080295994A1 (en) * | 2007-05-28 | 2008-12-04 | Delta Electronics, Inc. | Heat-dissipating fin assembly and assembling method thereof |
| US7561417B2 (en) * | 2007-08-17 | 2009-07-14 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module and fin assembly thereof |
| US20110005728A1 (en) * | 2009-07-07 | 2011-01-13 | Furui Precise Component (Kunshan) Co., Ltd. | Heat dissipation module |
| US20110048675A1 (en) * | 2009-08-28 | 2011-03-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
| US20110048680A1 (en) * | 2009-08-31 | 2011-03-03 | Foxconn Technology Co., Ltd. | Heat dissipation module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1063052S1 (en) * | 2022-01-18 | 2025-02-18 | Delta Electronics, Inc. | Cooling fin |
| USD1063053S1 (en) * | 2022-01-18 | 2025-02-18 | Delta Electronics, Inc. | Cooling fin |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI513950B (en) | 2015-12-21 |
| CN102858132A (en) | 2013-01-02 |
| TW201300721A (en) | 2013-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHANG, WEI-HSIANG;CAI, YU-CHAO;REEL/FRAME:026824/0853 Effective date: 20110822 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHANG, WEI-HSIANG;CAI, YU-CHAO;REEL/FRAME:026824/0853 Effective date: 20110822 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |