US20120019322A1 - Low dropout current source - Google Patents
Low dropout current source Download PDFInfo
- Publication number
- US20120019322A1 US20120019322A1 US13/155,556 US201113155556A US2012019322A1 US 20120019322 A1 US20120019322 A1 US 20120019322A1 US 201113155556 A US201113155556 A US 201113155556A US 2012019322 A1 US2012019322 A1 US 2012019322A1
- Authority
- US
- United States
- Prior art keywords
- fet
- current
- source
- drain
- coupled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000005669 field effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 8
- 230000001419 dependent effect Effects 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 4
- 239000008186 active pharmaceutical agent Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005094 computer simulation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
- G05F1/10—Regulating voltage or current
- G05F1/46—Regulating voltage or current wherein the variable actually regulated by the final control device is DC
- G05F1/56—Regulating voltage or current wherein the variable actually regulated by the final control device is DC using semiconductor devices in series with the load as final control devices
- G05F1/575—Regulating voltage or current wherein the variable actually regulated by the final control device is DC using semiconductor devices in series with the load as final control devices characterised by the feedback circuit
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/447—Indexing scheme relating to amplifiers the amplifier being protected to temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/555—A voltage generating circuit being realised for biasing different circuit elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/78—A comparator being used in a controlling circuit of an amplifier
Definitions
- Embodiments of the present disclosure relate to current sources that are usable to provide bias currents to circuits such as power amplifiers.
- FIG. 1 depicts a related art current source 10 having a first field effect transistor (FET) M 1 that is coupled between a battery input VBATT and a typical current reference 12 that provides a reference current IREF.
- the typical current reference 12 is usually a bandgap type reference.
- the current reference is coupled between a drain of the first FET M 1 and a fixed voltage node such as ground GND.
- the current source 10 also includes a second FET M 2 that is coupled between the battery input VBATT and a PA bias network 14 that is modeled with a resistor R L coupled in series with a first diode D 1 , which is coupled in series with a second diode D 2 .
- the PA bias network 14 is coupled between a drain of the second FET M 2 and ground GND.
- a gate of the first FET M 1 is coupled to a gate of the second FET M 2 .
- the second FET M 2 is typically N times a physical size of the FET M 1 , wherein N is a natural number.
- the gate and drain of the first FET M 1 are coupled together, so that the first FET M 1 and the second FET M 2 are configured as a current mirror.
- the reference current IREF is mirrored as an output current IOUT that flows through the second FET M 2 .
- the output current IOUT is N times larger than the reference current IREF.
- the reference current IREF is typically within a range of microamperes ( ⁇ A)
- the output current IOUT is typically within a range of milliamperes (mA).
- the output current IOUT flows from the second FET M 2 and through the PA bias network 14 .
- An output voltage VOUT can be measured across the PA bias network 14 with respect to ground GND.
- the second FET M 2 In order to maintain an accurate output current IOUT, the second FET M 2 should remain biased in a saturation region for all expected operating conditions such as supply voltage variations and temperature extremes.
- minimum voltage headroom available for the current source 10 is around 250 mV.
- this minimum voltage headroom can occur when a voltage at the VBATT terminal is 3.0V and the output voltage VOUT is 2.75V.
- the second FET M 2 must be made sufficiently large so that the second FET M 2 remains in saturation for all expected operating conditions such as supply voltage variations and temperature extremes.
- the die area required is on the order of 9600 micrometers ( ⁇ m) by 2 ⁇ m, which occupies 0.19 mm 2 . This amount of die area taken up by the second FET M 2 is undesirable.
- a reduced voltage specification for the voltage applied to the VBATT terminal, a change in a PA biasing network to increase a maximum VOUT, or an increase in the output current specification typically necessitates a complete re-design of a schematic and physical layout of a conventional current source such as the current source 10 . Any of these changes would result in reduced voltage headroom available across the second FET M 2 , thereby preventing operation of the second FET M 2 in the saturation region over all conditions. Operation outside the saturation region of the second FET M 2 and inside the triode region of the second FET M 2 causes the output current IOUT to be detrimentally sensitive to variations in voltage headroom. A fluctuating output current IOUT does not allow generation of stable and accurate bias currents needed for properly biasing PAs. Thus, there is a need for a low dropout current source that enables accurate operation of the low dropout current source down to approximately 75 mV of voltage headroom.
- the present disclosure provides a low dropout current source.
- the present disclosure also provides a method of supplying a constant current to a circuit such as a power amplifier of a mobile terminal.
- the low dropout current source includes a first field effect transistor (FET), a second FET having a drain that is an output for an output voltage and an output current, and a third FET, wherein a gate of the first FET is coupled to both a gate of the second FET and a drain of the third FET, and wherein a drain of the first FET is coupled to a source of the third FET.
- a differential amplifier has an inverting input coupled to the drain of the first FET, a non-inverting input coupled to the drain of the second FET and an amplifier output coupled to the gate of the third FET.
- a current reference is coupled between the drain of the third FET and a fixed voltage node.
- the current reference includes a temperature independent current source that is derived from a band-gap reference. Alternately, the current reference includes a temperature dependent current source that is derived from proportional to absolute temperature (PTAT) current sources.
- PTAT proportional to absolute temperature
- the differential amplifier drives the gate of the third FET such that the voltage on the inverting terminal and an output voltage on the non-inverting terminal are equal.
- the output voltage can be measured across the PA bias network with respect to a fixed voltage node, which can be ground GND.
- V DS drain-to-source voltage
- the first FET and the second FET are matched so that the gate-to-source voltage (V GS ) of each of the first FET and the second FET are equal during operation of the low dropout current source. Consequently, an output current flowing through the second FET is proportional to the reference current.
- the output current that flows through the second FET remains at a constant current level as the second FET transitions from a saturation region operating point to a triode region operation point.
- FIG. 1 is a schematic of a typical related art current source.
- FIG. 2 is a schematic of a low dropout current source in accordance with the present disclosure.
- FIG. 3 is a graph that compares the required voltage headroom between the typical related art current source and the low dropout current source of the present disclosure.
- FIG. 4 is a graph that compares the required voltage headroom between the typical related art current source and the low dropout current source of the present disclosure after the physical size of an output FET is scaled down by a factor of twelve.
- FIG. 5 is a block diagram depicting a mobile terminal that incorporates the low dropout current source of the present disclosure.
- FIG. 2 is a schematic of a low dropout current source 16 that is in accordance with the present disclosure.
- the low dropout current source 16 includes the first FET M 1 , the second FET M 2 and the PA bias network 14 .
- the source (S) of the first FET M 1 and the source (S) of the second FET M 2 are both coupled to a power source input, which can be the battery terminal VBATT.
- the PA bias network 14 is coupled between the drain of the second FET M 2 and a fixed voltage node such as ground GND.
- the low dropout current source 16 differs from the related art current source 10 ( FIG.
- the low dropout current source 16 adds a differential amplifier 18 , a third FET M 3 , and replaces the typical current reference 12 ( FIG. 1 ) with a current reference 20 .
- the differential amplifier 18 is powered via a power terminal VCC and ground GND.
- the differential amplifier 18 has an inverting input 22 coupled to the drain (D) of the first FET M 1 .
- the differential amplifier 18 also includes a non-inverting input 24 that is coupled to the drain (D) of the second FET M 2 .
- An output 26 of the differential amplifier 18 drives a gate of the third FET M 3 , which has a source (S) that is coupled to the drain (D) of the first FET M 1 .
- the current reference 20 is coupled between a drain (D) of the third FET M 3 and the fixed voltage node that is depicted as ground GND in FIG. 2 .
- the drain (D) of the third FET M 3 is also coupled to the gate (G) of the first FET M 1 , which in-turn is coupled to the gate (G) of the second FET M 2 .
- the current reference 20 includes a temperature independent current source that is derived from a band-gap reference (not shown). Alternately, the current reference 20 includes a temperature dependent current source that is derived from proportional to absolute temperature (PTAT) current sources (not shown). The current reference 20 provides a constant current IREF_PTAT that flows through the first FET M 1 and the third FET M 3 .
- the differential amplifier 18 drives the gate (G) of the third FET M 3 such that the voltage on the inverting terminal 22 and the voltage VOUT on the non-inverting terminal 24 are equal.
- the output voltage VOUT can be measured across the PA bias network 14 with respect to the fixed voltage node, which as depicted in FIG. 2 can be ground GND.
- V DS drain-to-source voltage
- the first FET M 1 and the second FET M 2 are matched so that the gate-to-source voltage (V GS ) each of the first FET M 1 and the second FET M 2 are equal during operation of the low dropout current source 16 . Consequently, the current IOUT is a constant current that flows through the second FET M 2 , and is a multiple of a current level of the reference current IREF_PTAT flowing through the first FET M 1 . This current multiplication holds true even when the voltage V DS across the second FET M 2 is relatively small causing the second FET M 2 to operate in the triode region.
- FIG. 3 shows computer simulation results for the operation of the low dropout current source 16 .
- FIG. 3 is a graph that compares the required voltage headroom between the typical related art current source 10 ( FIG. 1 ) and the low dropout current source 16 ( FIG. 2 ).
- the graph shows that a die area of the second FET M 2 may be sized relative to the area of the first FET M 1 to maintain a proportional relationship between the reference current IREF_PTAT provided by the current reference 20 and an output current flowing through the second FET M 2 operating under a voltage headroom of around 75 mV.
- FIG. 4 shows a computer simulation in a case in which a specified voltage headroom will not fall below a range of about 200 mV to about 250 mV.
- the particular configuration of the low dropout current source 16 allows a die area of the second FET M 2 to be at least twelve times smaller than the die area needed for the second FET M 2 as used in the typical related art current source 10 ( FIG. 1 ).
- FIG. 5 depicts the basic architecture of user equipment (UE) in the form of a mobile terminal 28 that incorporates an embodiment of the low dropout current source 16 of FIG. 2 .
- the low dropout current source 16 is usable to bias a power amplifier 30 in the mobile terminal 28 .
- the mobile terminal 28 may include a receiver front end 32 , a radio frequency (RF) transmitter section 34 , an antenna 36 , a multi-band duplexer/switch 38 , a baseband processor 40 , a control system 42 , a frequency synthesizer 44 , and an interface 46 .
- the receiver front end 32 receives information bearing radio frequency signals from one or more remote transmitters provided by a base station (not shown).
- a low noise amplifier (LNA) 48 amplifies the signal.
- LNA low noise amplifier
- a filter circuit 50 minimizes broadband interference in the received signal, while down conversion and digitization circuitry 52 down converts the filtered, received signal to an intermediate or baseband frequency signal, which is then digitized into one or more digital streams.
- the receiver front end 32 typically uses one or more mixing frequencies generated by the frequency synthesizer 44 .
- the baseband processor 40 processes the digitized received signal to extract the information or data bits conveyed in the received signal. This processing typically comprises demodulation, decoding, and error correction operations. As such, the baseband processor 40 is generally implemented in one or more digital signal processors (DSPs).
- DSPs digital signal processors
- the baseband processor 40 receives digitized data, which may represent voice, data, or control information, from the control system 42 , which it encodes for transmission.
- the encoded data is output to the RF transmitter section 34 , where it is used by a modulator 54 to modulate a carrier signal that is at a desired transmit frequency.
- the power amplifier 30 amplifies the modulated carrier signal to a level appropriate for transmission, and delivers the amplified and modulated carrier signal to the antenna 36 through the a power amplifier 30 .
- the control system 42 controls an ENABLE signal that activates and deactivates the low dropout current source 16 as needed. For example, the control system 42 may activate the low dropout current source 16 in anticipation of a transmission event. Alternately, the control system 42 may deactivate the low dropout current source 16 to conserve energy.
- a user may interact with the mobile terminal 28 via the interface 46 , which may include interface circuitry 56 associated with a microphone 58 , a speaker 60 , a keypad 62 , and a display 64 .
- the interface circuitry 56 typically includes analog-to-digital converters, digital-to-analog converters, amplifiers, and the like. Additionally, it may include a voice encoder/decoder, in which case it may communicate directly with the baseband processor 40 .
- the microphone 58 will typically convert audio input, such as the user's voice, into an electrical signal, which is then digitized and passed directly or indirectly to the baseband processor 40 .
- Audio information encoded in the received signal is recovered by the baseband processor 40 , and converted by the interface circuitry 56 into an analog signal suitable for driving the speaker 60 .
- the keypad 62 and the display 64 enable the user to interact with the mobile terminal 28 , input numbers to be dialed, address book information, or the like, as well as monitor call progress information.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Automation & Control Theory (AREA)
- Analogue/Digital Conversion (AREA)
- Amplifiers (AREA)
Abstract
Description
- This application claims the benefit of provisional patent application Ser. No. 61/367,244, filed Jul. 23, 2010, the disclosure of which is hereby incorporated herein by reference in its entirety.
- Embodiments of the present disclosure relate to current sources that are usable to provide bias currents to circuits such as power amplifiers.
- A complementary metal oxide semiconductor (CMOS) design for a power amplifier (PA) often includes an array of output current sources that supply a bias current for biasing a PA such that the PA operates within a desired operating region.
FIG. 1 depicts a related artcurrent source 10 having a first field effect transistor (FET) M1 that is coupled between a battery input VBATT and a typicalcurrent reference 12 that provides a reference current IREF. The typicalcurrent reference 12 is usually a bandgap type reference. The current reference is coupled between a drain of the first FET M1 and a fixed voltage node such as ground GND. Thecurrent source 10 also includes a second FET M2 that is coupled between the battery input VBATT and aPA bias network 14 that is modeled with a resistor RL coupled in series with a first diode D1, which is coupled in series with a second diode D2. ThePA bias network 14 is coupled between a drain of the second FET M2 and ground GND. A gate of the first FET M1 is coupled to a gate of the second FET M2. The second FET M2 is typically N times a physical size of the FET M1, wherein N is a natural number. Moreover, the gate and drain of the first FET M1 are coupled together, so that the first FET M1 and the second FET M2 are configured as a current mirror. In this way, the reference current IREF is mirrored as an output current IOUT that flows through the second FET M2. The output current IOUT is N times larger than the reference current IREF. For example, the reference current IREF is typically within a range of microamperes (μA), whereas the output current IOUT is typically within a range of milliamperes (mA). The output current IOUT flows from the second FET M2 and through thePA bias network 14. An output voltage VOUT can be measured across thePA bias network 14 with respect to ground GND. - In order to maintain an accurate output current IOUT, the second FET M2 should remain biased in a saturation region for all expected operating conditions such as supply voltage variations and temperature extremes. Typically, minimum voltage headroom available for the
current source 10 is around 250 mV. For example, this minimum voltage headroom can occur when a voltage at the VBATT terminal is 3.0V and the output voltage VOUT is 2.75V. As a result, the second FET M2 must be made sufficiently large so that the second FET M2 remains in saturation for all expected operating conditions such as supply voltage variations and temperature extremes. For example, with an output current IOUT requirement of 3 mA, the die area required is on the order of 9600 micrometers (μm) by 2 μm, which occupies 0.19 mm2. This amount of die area taken up by the second FET M2 is undesirable. - In addition, a reduced voltage specification for the voltage applied to the VBATT terminal, a change in a PA biasing network to increase a maximum VOUT, or an increase in the output current specification typically necessitates a complete re-design of a schematic and physical layout of a conventional current source such as the
current source 10. Any of these changes would result in reduced voltage headroom available across the second FET M2, thereby preventing operation of the second FET M2 in the saturation region over all conditions. Operation outside the saturation region of the second FET M2 and inside the triode region of the second FET M2 causes the output current IOUT to be detrimentally sensitive to variations in voltage headroom. A fluctuating output current IOUT does not allow generation of stable and accurate bias currents needed for properly biasing PAs. Thus, there is a need for a low dropout current source that enables accurate operation of the low dropout current source down to approximately 75 mV of voltage headroom. - The present disclosure provides a low dropout current source. The present disclosure also provides a method of supplying a constant current to a circuit such as a power amplifier of a mobile terminal.
- In general, the low dropout current source includes a first field effect transistor (FET), a second FET having a drain that is an output for an output voltage and an output current, and a third FET, wherein a gate of the first FET is coupled to both a gate of the second FET and a drain of the third FET, and wherein a drain of the first FET is coupled to a source of the third FET. A differential amplifier has an inverting input coupled to the drain of the first FET, a non-inverting input coupled to the drain of the second FET and an amplifier output coupled to the gate of the third FET. A current reference is coupled between the drain of the third FET and a fixed voltage node. The current reference includes a temperature independent current source that is derived from a band-gap reference. Alternately, the current reference includes a temperature dependent current source that is derived from proportional to absolute temperature (PTAT) current sources. The current reference provides a constant current that flows through the first FET and the third FET.
- In operation of the low dropout current source, the differential amplifier drives the gate of the third FET such that the voltage on the inverting terminal and an output voltage on the non-inverting terminal are equal. The output voltage can be measured across the PA bias network with respect to a fixed voltage node, which can be ground GND. As a result, the drain-to-source voltage (VDS) for each of the first FET and the second FET are equal. Also, the first FET and the second FET are matched so that the gate-to-source voltage (VGS) of each of the first FET and the second FET are equal during operation of the low dropout current source. Consequently, an output current flowing through the second FET is proportional to the reference current. Moreover, the output current that flows through the second FET remains at a constant current level as the second FET transitions from a saturation region operating point to a triode region operation point. Those skilled in the art will appreciate the scope of the present disclosure and realize additional aspects thereof after reading the following detailed description of the preferred embodiments in association with the accompanying drawing figures.
- The accompanying drawing figures incorporated in and forming a part of this specification illustrate several aspects of the disclosure, and together with the description serve to explain the principles of the disclosure.
-
FIG. 1 is a schematic of a typical related art current source. -
FIG. 2 is a schematic of a low dropout current source in accordance with the present disclosure. -
FIG. 3 is a graph that compares the required voltage headroom between the typical related art current source and the low dropout current source of the present disclosure. -
FIG. 4 is a graph that compares the required voltage headroom between the typical related art current source and the low dropout current source of the present disclosure after the physical size of an output FET is scaled down by a factor of twelve. -
FIG. 5 is a block diagram depicting a mobile terminal that incorporates the low dropout current source of the present disclosure. - The embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.
-
FIG. 2 is a schematic of a low dropoutcurrent source 16 that is in accordance with the present disclosure. The low dropoutcurrent source 16 includes the first FET M1, the second FET M2 and thePA bias network 14. The source (S) of the first FET M1 and the source (S) of the second FET M2 are both coupled to a power source input, which can be the battery terminal VBATT. ThePA bias network 14 is coupled between the drain of the second FET M2 and a fixed voltage node such as ground GND. However, the low dropoutcurrent source 16 differs from the related art current source 10 (FIG. 1 ) in that the low dropoutcurrent source 16 adds adifferential amplifier 18, a third FET M3, and replaces the typical current reference 12 (FIG. 1 ) with acurrent reference 20. Thedifferential amplifier 18 is powered via a power terminal VCC and ground GND. Thedifferential amplifier 18 has an invertinginput 22 coupled to the drain (D) of the first FET M1. Thedifferential amplifier 18 also includes anon-inverting input 24 that is coupled to the drain (D) of the second FET M2. Anoutput 26 of thedifferential amplifier 18 drives a gate of the third FET M3, which has a source (S) that is coupled to the drain (D) of the first FET M1. Thecurrent reference 20 is coupled between a drain (D) of the third FET M3 and the fixed voltage node that is depicted as ground GND inFIG. 2 . The drain (D) of the third FET M3 is also coupled to the gate (G) of the first FET M1, which in-turn is coupled to the gate (G) of the second FET M2. - The
current reference 20 includes a temperature independent current source that is derived from a band-gap reference (not shown). Alternately, thecurrent reference 20 includes a temperature dependent current source that is derived from proportional to absolute temperature (PTAT) current sources (not shown). Thecurrent reference 20 provides a constant current IREF_PTAT that flows through the first FET M1 and the third FET M3. - In operation of the low dropout
current source 16, thedifferential amplifier 18 drives the gate (G) of the third FET M3 such that the voltage on the invertingterminal 22 and the voltage VOUT on thenon-inverting terminal 24 are equal. The output voltage VOUT can be measured across thePA bias network 14 with respect to the fixed voltage node, which as depicted inFIG. 2 can be ground GND. As a result, the drain-to-source voltage (VDS) for each of the first FET M1 and the second FET M2 are equal. Also, the first FET M1 and the second FET M2 are matched so that the gate-to-source voltage (VGS) each of the first FET M1 and the second FET M2 are equal during operation of the low dropoutcurrent source 16. Consequently, the current IOUT is a constant current that flows through the second FET M2, and is a multiple of a current level of the reference current IREF_PTAT flowing through the first FET M1. This current multiplication holds true even when the voltage VDS across the second FET M2 is relatively small causing the second FET M2 to operate in the triode region. -
FIG. 3 shows computer simulation results for the operation of the low dropoutcurrent source 16. In particular,FIG. 3 is a graph that compares the required voltage headroom between the typical related art current source 10 (FIG. 1 ) and the low dropout current source 16 (FIG. 2 ). Indirectly, the graph shows that a die area of the second FET M2 may be sized relative to the area of the first FET M1 to maintain a proportional relationship between the reference current IREF_PTAT provided by thecurrent reference 20 and an output current flowing through the second FET M2 operating under a voltage headroom of around 75 mV. -
FIG. 4 shows a computer simulation in a case in which a specified voltage headroom will not fall below a range of about 200 mV to about 250 mV. In this case, the particular configuration of the low dropout current source 16 (FIG. 2 ) allows a die area of the second FET M2 to be at least twelve times smaller than the die area needed for the second FET M2 as used in the typical related art current source 10 (FIG. 1 ). -
FIG. 5 depicts the basic architecture of user equipment (UE) in the form of amobile terminal 28 that incorporates an embodiment of the low dropoutcurrent source 16 ofFIG. 2 . In particular, the low dropoutcurrent source 16 is usable to bias apower amplifier 30 in themobile terminal 28. Themobile terminal 28 may include a receiverfront end 32, a radio frequency (RF) transmitter section 34, anantenna 36, a multi-band duplexer/switch 38, abaseband processor 40, acontrol system 42, afrequency synthesizer 44, and aninterface 46. The receiverfront end 32 receives information bearing radio frequency signals from one or more remote transmitters provided by a base station (not shown). A low noise amplifier (LNA) 48 amplifies the signal. Afilter circuit 50 minimizes broadband interference in the received signal, while down conversion anddigitization circuitry 52 down converts the filtered, received signal to an intermediate or baseband frequency signal, which is then digitized into one or more digital streams. The receiverfront end 32 typically uses one or more mixing frequencies generated by thefrequency synthesizer 44. Thebaseband processor 40 processes the digitized received signal to extract the information or data bits conveyed in the received signal. This processing typically comprises demodulation, decoding, and error correction operations. As such, thebaseband processor 40 is generally implemented in one or more digital signal processors (DSPs). - On the transmit side, the
baseband processor 40 receives digitized data, which may represent voice, data, or control information, from thecontrol system 42, which it encodes for transmission. The encoded data is output to the RF transmitter section 34, where it is used by amodulator 54 to modulate a carrier signal that is at a desired transmit frequency. Thepower amplifier 30 amplifies the modulated carrier signal to a level appropriate for transmission, and delivers the amplified and modulated carrier signal to theantenna 36 through the apower amplifier 30. Thecontrol system 42 controls an ENABLE signal that activates and deactivates the low dropoutcurrent source 16 as needed. For example, thecontrol system 42 may activate the low dropoutcurrent source 16 in anticipation of a transmission event. Alternately, thecontrol system 42 may deactivate the low dropoutcurrent source 16 to conserve energy. - A user may interact with the
mobile terminal 28 via theinterface 46, which may includeinterface circuitry 56 associated with amicrophone 58, aspeaker 60, akeypad 62, and a display 64. Theinterface circuitry 56 typically includes analog-to-digital converters, digital-to-analog converters, amplifiers, and the like. Additionally, it may include a voice encoder/decoder, in which case it may communicate directly with thebaseband processor 40. Themicrophone 58 will typically convert audio input, such as the user's voice, into an electrical signal, which is then digitized and passed directly or indirectly to thebaseband processor 40. Audio information encoded in the received signal is recovered by thebaseband processor 40, and converted by theinterface circuitry 56 into an analog signal suitable for driving thespeaker 60. Thekeypad 62 and the display 64 enable the user to interact with themobile terminal 28, input numbers to be dialed, address book information, or the like, as well as monitor call progress information. - Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims that follow.
Claims (20)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/155,556 US20120019322A1 (en) | 2010-07-23 | 2011-06-08 | Low dropout current source |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36724410P | 2010-07-23 | 2010-07-23 | |
| US13/155,556 US20120019322A1 (en) | 2010-07-23 | 2011-06-08 | Low dropout current source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20120019322A1 true US20120019322A1 (en) | 2012-01-26 |
Family
ID=45493129
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/155,556 Abandoned US20120019322A1 (en) | 2010-07-23 | 2011-06-08 | Low dropout current source |
| US13/161,742 Active 2031-10-06 US8410966B2 (en) | 2010-07-23 | 2011-06-16 | Current DAC |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/161,742 Active 2031-10-06 US8410966B2 (en) | 2010-07-23 | 2011-06-16 | Current DAC |
Country Status (1)
| Country | Link |
|---|---|
| US (2) | US20120019322A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107479612A (en) * | 2017-10-16 | 2017-12-15 | 佛山科学技术学院 | A Fast Response LDO Circuit |
| US20210124386A1 (en) * | 2019-10-24 | 2021-04-29 | Nxp Usa, Inc. | Voltage reference generation with compensation for temperature variation |
| CN119376480A (en) * | 2024-10-25 | 2025-01-28 | 上海川土微电子有限公司 | Low voltage difference linear voltage stabilizing circuit, voltage stabilizing method and voltage stabilizer |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5684080B2 (en) * | 2011-09-22 | 2015-03-11 | 株式会社東芝 | Analog / digital converter |
| KR102023439B1 (en) | 2013-02-22 | 2019-09-23 | 삼성전자주식회사 | Analog baseband filter for radio transciever |
| KR102130452B1 (en) | 2013-07-26 | 2020-07-06 | 삼성전자주식회사 | Analog baseband filter apparatus for multi-band and multi-mode wireless transceiver and controlling method therefor |
| US9797959B2 (en) * | 2013-11-19 | 2017-10-24 | Qualcomm Incorporated | Battery fuel gauges using FET segment control to increase low current measurement accuracy |
| CN106155164B (en) * | 2015-04-20 | 2017-11-28 | 扬智科技股份有限公司 | Electronic device and integrated circuit thereof |
| US10073167B2 (en) * | 2015-05-22 | 2018-09-11 | Texas Instruments Incorporated | High speed illumination driver for TOF applications |
| US10581446B1 (en) * | 2019-02-28 | 2020-03-03 | Nxp Usa, Inc. | Current controlled MDAC for time-interleaved ADCS and related methods |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5014017A (en) * | 1988-08-12 | 1991-05-07 | Sanyo Electric Co., Ltd. | Power-saving low-frequency power amplifier |
| US6633198B2 (en) * | 2001-08-27 | 2003-10-14 | Analog Devices, Inc. | Low headroom current mirror |
| US6998831B2 (en) * | 2002-09-09 | 2006-02-14 | Koninklijke Philips Electronics N.V. | High output impedance current mirror with superior output voltage compliance |
| US7479822B2 (en) * | 2003-12-08 | 2009-01-20 | Rohm Co., Ltd. | Current drive circuit reducing VDS dependency |
| US7576574B2 (en) * | 2007-03-14 | 2009-08-18 | Ricoh Company, Ltd. | Constant current circuit and light emitting diode drive circuit |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5001484A (en) | 1990-05-08 | 1991-03-19 | Triquint Semiconductor, Inc. | DAC current source bias equalization topology |
| US6507304B1 (en) | 2002-05-02 | 2003-01-14 | National Semiconductor Corporation | Current steering segmented DAC system |
| US6927714B1 (en) | 2004-03-31 | 2005-08-09 | Maxim Integrated Products, Inc. | Current steering digital-to-analog (DAC) converter with improved dynamic performance |
| US7764210B2 (en) * | 2006-12-20 | 2010-07-27 | Texas Instruments Incorporated | System and method for converting an input signal |
| DE102008014425B4 (en) * | 2008-03-13 | 2012-03-29 | Atmel Automotive Gmbh | Driver circuit with a snubber network using a current mirror |
| US7928784B2 (en) * | 2009-06-26 | 2011-04-19 | Texas Instruments Incorporated | Method and apparatus to improve and control the propagation delay in a current slewing circuit |
| US8502597B2 (en) * | 2009-10-21 | 2013-08-06 | Qualcomm, Incorporated | Low-pass filter design |
-
2011
- 2011-06-08 US US13/155,556 patent/US20120019322A1/en not_active Abandoned
- 2011-06-16 US US13/161,742 patent/US8410966B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5014017A (en) * | 1988-08-12 | 1991-05-07 | Sanyo Electric Co., Ltd. | Power-saving low-frequency power amplifier |
| US6633198B2 (en) * | 2001-08-27 | 2003-10-14 | Analog Devices, Inc. | Low headroom current mirror |
| US6998831B2 (en) * | 2002-09-09 | 2006-02-14 | Koninklijke Philips Electronics N.V. | High output impedance current mirror with superior output voltage compliance |
| US7479822B2 (en) * | 2003-12-08 | 2009-01-20 | Rohm Co., Ltd. | Current drive circuit reducing VDS dependency |
| US7576574B2 (en) * | 2007-03-14 | 2009-08-18 | Ricoh Company, Ltd. | Constant current circuit and light emitting diode drive circuit |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107479612A (en) * | 2017-10-16 | 2017-12-15 | 佛山科学技术学院 | A Fast Response LDO Circuit |
| US20210124386A1 (en) * | 2019-10-24 | 2021-04-29 | Nxp Usa, Inc. | Voltage reference generation with compensation for temperature variation |
| US11774999B2 (en) * | 2019-10-24 | 2023-10-03 | Nxp Usa, Inc. | Voltage reference generation with compensation for temperature variation |
| CN119376480A (en) * | 2024-10-25 | 2025-01-28 | 上海川土微电子有限公司 | Low voltage difference linear voltage stabilizing circuit, voltage stabilizing method and voltage stabilizer |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120019405A1 (en) | 2012-01-26 |
| US8410966B2 (en) | 2013-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20120019322A1 (en) | Low dropout current source | |
| US7696826B2 (en) | Temperature compensation of collector-voltage control RF amplifiers | |
| CN102170270B (en) | High frequency power amplifier and method of work thereof | |
| JP4139329B2 (en) | Amplifier power detection circuit | |
| CN101015119B (en) | Systems and methods for current mode amplitude modulation | |
| US7639081B2 (en) | Biasing scheme for low-voltage MOS cascode current mirrors | |
| US8970300B2 (en) | Apparatus and method for transimpedance amplifiers with wide input current ranges | |
| KR101521186B1 (en) | Power detector with temperature compensation | |
| US6785521B2 (en) | System and method for current-mode amplitude modulation | |
| US8902002B2 (en) | Adaptive biasing scheme for an amplifier | |
| KR101408592B1 (en) | Circuit and method for biasing a gallium arsenide (GAAS) power amplifier | |
| WO2015002294A1 (en) | Power amplification module | |
| US8027279B2 (en) | Echo cancellation | |
| US8791760B2 (en) | Closed loop bias control | |
| US8497668B2 (en) | Power control system and power amplification system using the same | |
| KR101214752B1 (en) | Bias controlling apparatus | |
| US10637401B2 (en) | Current output circuit | |
| CN108900167B (en) | Impedance compensation circuit and power amplification compensation circuit | |
| US10432154B2 (en) | Regulation of an RF amplifier | |
| US7782133B2 (en) | Power amplifier with output power control | |
| US20130321081A1 (en) | Regulated cascode current mirror scheme for transconductance amplifiers | |
| US7233195B2 (en) | Generator for supplying reference voltage and reference current of stable level regardless of temperature variation | |
| US8193859B1 (en) | Dual FET detector | |
| KR101894664B1 (en) | Cmos differential amplifier with offset voltage calibration function | |
| KR102023439B1 (en) | Analog baseband filter for radio transciever |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: RF MICRO DEVICES, INC., NORTH CAROLINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SILVA, PRADEEP CHARLES;NADIMPALLI, PRAVEEN VARMA;COLLES, JOSEPH HUBERT;SIGNING DATES FROM 20110606 TO 20110608;REEL/FRAME:026408/0148 |
|
| AS | Assignment |
Owner name: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT, TE Free format text: NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS;ASSIGNOR:RF MICRO DEVICES, INC.;REEL/FRAME:030045/0831 Effective date: 20130319 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
|
| AS | Assignment |
Owner name: RF MICRO DEVICES, INC., NORTH CAROLINA Free format text: TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS (RECORDED 3/19/13 AT REEL/FRAME 030045/0831);ASSIGNOR:BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:035334/0363 Effective date: 20150326 |