[go: up one dir, main page]

US20100326629A1 - Vapor chamber with separator - Google Patents

Vapor chamber with separator Download PDF

Info

Publication number
US20100326629A1
US20100326629A1 US12/492,195 US49219509A US2010326629A1 US 20100326629 A1 US20100326629 A1 US 20100326629A1 US 49219509 A US49219509 A US 49219509A US 2010326629 A1 US2010326629 A1 US 2010326629A1
Authority
US
United States
Prior art keywords
separator
shell plate
vapor chamber
vapor
working fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/492,195
Inventor
George Anthony. Meyer IV
Chien-Hung Sun
Chieh-Ping Chen
Te-Hsuan Chin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celsia Technologies Taiwan Inc
Original Assignee
Celsia Technologies Taiwan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celsia Technologies Taiwan Inc filed Critical Celsia Technologies Taiwan Inc
Priority to US12/492,195 priority Critical patent/US20100326629A1/en
Assigned to Celsia Technologies Taiwan, Inc. reassignment Celsia Technologies Taiwan, Inc. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIEH-PING, CHIN, TE-HSUAN, MEYER IV, GEORGE ANTHONY, SUN, CHIEN-HUNG
Publication of US20100326629A1 publication Critical patent/US20100326629A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention in general relates to a vapor chamber, in particular, to a vapor chamber with separator.
  • a prior vapor chamber includes an upper shell plate, a lower shell plate, a capillary tissue, a supporting structure and a working fluid.
  • the upper shell plate and the lower shell plate are inter-sealed to each other, between which an accommodating space is formed.
  • the capillary tissue is arranged by distributing over the inner walls of the upper shell plate and the lower shell plate.
  • the supporting structure is accommodated in the accommodating space with upper and lower sides respectively abutted against the capillary tissue.
  • the working fluid is then filled into the accommodating space.
  • the lower shell plate contacts a heating element, while the upper shell plate is connected to cooling fins.
  • the working fluid is changed from liquid phase to vapor phase and flows up to the upper shell plate, where the temperature is lower, making the working fluid release heat to the cooling fins.
  • the working fluid is changed from vapor phase to liquid phase and flows down to the lower shell plate. And so on, the circulation is continued until the all waste heat generated from the heating element has been carried away.
  • the prior vapor chamber structure still has some drawbacks in terms of practical usage. Since the phase change between vapor and liquid occurs in a same accommodating space, it will substantially happen an interference between the working fluid in vapor phase flowing upwardly and the working fluid in liquid phase flowing downwardly, whereby an entire cooling performance of the vapor chamber is lowered down.
  • the invention is mainly to provide a vapor chamber with separator, in which the separator separates the working fluid in vapor phase from the working fluid in liquid phase in a way, such that they won't be interfered to each other and the cooling performance is boosted.
  • the invention is to provide a vapor chamber with separator, including a shell, a capillary tissue, a separator, a supporting structure and a working fluid.
  • the shell includes a lower shell plate and an upper shell plate sealing the lower shell plate. Partial section of the lower shell plate projects downwardly and forms an accommodating room therein.
  • the capillary tissue is arranged by distributing over inner wall of the lower shell plate.
  • the separator overlapped the capillary tissue is arranged a penetrating trough corresponding to the accommodating room.
  • a liquid passage is formed between the lower shell plate and the separator.
  • the supporting structure is accommodated in the shell with upper and lower sides respectively inter-abutted against the upper shell plate and the separator.
  • a vapor passage formed between the upper shell plate and the separator is communicated to the liquid passage.
  • the working fluid is filled into the shell.
  • the invention has following merits. Since the separator separates the working fluid in vapor phase from the working fluid in liquid phase, the working fluid of each phase has its own passage to avoid interfering to each other, reaching the function of boosting cooling performance significantly. In addition, by arranging folded pieces on the separator, it can further prevent the working fluid in vapor phase from flowing in reverse direction into the liquid passage to generate any interference with the working fluid in liquid phase.
  • FIG. 1 is a perspective explosive view of the present invention
  • FIG. 2 is a perspective outer view of the present invention
  • FIG. 3 is a cross-sectional view along the sectional line “ 3 - 3 ” in FIG. 2 ;
  • FIG. 4 is a locally enlarging illustration of “A” part in FIG. 3 .
  • FIG. 1 and FIG. 2 respectively showing a perspective explosive view and a perspective outer view of the invention.
  • the invention is to provide a vapor chamber 1 with separator 30 , including a shell 10 , a capillary tissue 20 , a separator 30 , a supporting structure 40 and a working fluid 50 (referring to FIG. 4 ).
  • the shell 10 includes a lower shell plate 11 and an upper shell plate 12 sealing the lower shell plate 11 . Partial section of the lower shell plate 11 is projected downwardly to form an accommodating room 111 therein.
  • the accommodating room 111 is shown as a rectangular configuration, however, not limited to this configuration only. The section of the lower shell plate 11 projected downwardly will contact closely onto an electronically heating element (not shown in the figures).
  • the capillary tissue 20 is distributed over inner walls of the lower shell plate 11 and the accommodating room 111 .
  • the capillary tissue 20 may be comprised of metallically woven net or made by powder sintering process, however, not limited to these only.
  • the separator 30 shown as a horizontal plate is partially overlapped onto the capillary tissue 20 .
  • Central portion of the separator 30 is arranged a penetrating trough 31 shown as a rectangular configuration corresponding to the accommodating room 111 in a way, such that the accommodating room 111 is communicated to the upper shell plate 12 .
  • a liquid passage b (referring to FIG. 4 ) is formed between the lower shell plate 11 and the separator 30 . More specifically, the liquid passage b is substantially the capillary tissue 20 distributed over the inner walls of the lower shell plate 11 .
  • the separator 30 is folded downwardly to form a plurality of folded pieces 32 at a position corresponding to the penetrating trough 31 .
  • the folded pieces 32 are located at two opposite sides of the penetrating trough 31 and are extended into the accommodating room 111 . Furthermore, end sides of the folded pieces 32 are all abutted against the capillary tissue 20 and a side face of the folded pieces 32 is also contacted closely onto the capillary tissue 20 .
  • the supporting structure 40 accommodated in the shell 10 includes a plurality of corrugated pieces 41 arrayed by intercrossing to one another. Two sides of the corrugated piece 41 are respectively formed into a plurality of through troughs 411 . Upper and lower sides of the supporting structure 40 (namely, the wave crest and the wave trough of the corrugated piece 41 ) are respectively inter-abutted against the upper shell plate 12 and the separator 30 . A vapor passage c formed between the upper shell plate 12 and the separator 30 is communicated to the liquid passage b. More specifically, the vapor passage c is a passage formed between the supporting structure 40 and each corrugated piece 41 .
  • the working fluid 50 (referring to FIG. 4 ) is filled into the shell 10 .
  • a connecting section d is respectively formed at two sides of the separator 30 in the shell 10 , making the vapor passage c communicated to the liquid passage b.
  • FIG. 3 and FIG. 4 respectively showing the cross-sectional view along “ 3 - 3 ” sectional line in FIG. 2 and the locally enlarging view of “A” part in FIG. 3 .
  • the working fluid 50 in liquid phase is accommodated in the accommodating room 111 .
  • the waste heat of the electronically heating element (not shown in the figures) is conducted to the lower shell plate 11 of the vapor chamber 1 , the working fluid 50 in liquid phase will be changed into the working fluid 50 in vapor phase because the working fluid 50 is heated, then the working fluid 50 in vapor phase flows up to the vapor passage c. Flowing through the vapor passage c, the working fluid 50 will release heat penetrating through the upper shell plate 12 and transferred to the outside.
  • the working fluid 50 When the working fluid 50 reaches two sides of the shell 10 , since the working fluid 50 has already released heat, the working fluid 50 will be changed from vapor phase to liquid phase. Due to the gravitation and the capillary tissue 20 , the working fluid 50 flows back to the accommodating room 111 via the liquid passage b. Therefore, there is no interference between the working fluids 50 respectively in vapor phase and liquid phase and the cooling performance of the vapor chamber 1 is not lowered either.
  • the operation of the folded pieces 32 is to prevent the working fluid 50 in vapor phase from flowing in reverse direction via the liquid passage b, so there is no interference phenomenon occurring to the working fluid 50 in liquid phase.
  • the side face and the end side of the folded piece 32 are respectively contacted to and abutted against the capillary tissue 20 , so the probability of the working fluid 50 in vapor phase flowing back to the liquid passage b is reduced significantly.
  • the vapor chamber with separator according to the invention is an indispensably design for cooling the electrically heating element of computer indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Separating Particles In Gases By Inertia (AREA)

Abstract

A vapor chamber with separator includes shell, capillary tissue, separator, supporting structure and working fluid. The shell includes inter-sealed lower and upper shell plates. Partial section of the lower shell plate projects downwardly and forms accommodating room therein. The capillary tissue is arranged by distributing over inner wall of the lower shell plate. The separator overlapped the capillary tissue is arranged penetrating trough corresponding to the accommodating room. Liquid passage is formed between the lower shell plate and the separator. The supporting structure is accommodated in the shell with upper and lower sides respectively inter-abutted against the upper shell plate and the separator. Vapor passage formed between the upper shell plate and the separator is communicated to the liquid passage. The working fluid is filled into the shell. Since the vapor and liquid working fluids are separated by the separator to avoid interference, the cooling performance is thus boosted.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention in general relates to a vapor chamber, in particular, to a vapor chamber with separator.
  • 2. Description of Prior Art
  • The quicker computing speed of a computer is, relatively the more waste heat of computing element (for example, CPU) in computer generates. How to remove the waste heat from the interior of computer chassis in time to make computing element operated under normal temperature has become an issue intended to be addressed urgently by each manufacturer.
  • In order to enhance the cooling performance of computer chassis, the use of vapor chamber can boost the cooling efficiency significantly. As a general rule, a prior vapor chamber includes an upper shell plate, a lower shell plate, a capillary tissue, a supporting structure and a working fluid. The upper shell plate and the lower shell plate are inter-sealed to each other, between which an accommodating space is formed. The capillary tissue is arranged by distributing over the inner walls of the upper shell plate and the lower shell plate. The supporting structure is accommodated in the accommodating space with upper and lower sides respectively abutted against the capillary tissue. The working fluid is then filled into the accommodating space.
  • Usually, the lower shell plate contacts a heating element, while the upper shell plate is connected to cooling fins. When the temperature raises because the lower shell plate contacts the heating element and the working fluid contained in the accommodating space absorbs sufficient heat, the working fluid is changed from liquid phase to vapor phase and flows up to the upper shell plate, where the temperature is lower, making the working fluid release heat to the cooling fins. Subsequently, the working fluid is changed from vapor phase to liquid phase and flows down to the lower shell plate. And so on, the circulation is continued until the all waste heat generated from the heating element has been carried away.
  • However, the prior vapor chamber structure still has some drawbacks in terms of practical usage. Since the phase change between vapor and liquid occurs in a same accommodating space, it will substantially happen an interference between the working fluid in vapor phase flowing upwardly and the working fluid in liquid phase flowing downwardly, whereby an entire cooling performance of the vapor chamber is lowered down.
  • Accordingly, after a substantially devoted study, in cooperation with the application of relative academic principles, the inventor has finally proposed the present invention that is designed reasonably to possess the capability to improve the drawbacks of the prior art significantly.
  • SUMMARY OF THE INVENTION
  • The invention is mainly to provide a vapor chamber with separator, in which the separator separates the working fluid in vapor phase from the working fluid in liquid phase in a way, such that they won't be interfered to each other and the cooling performance is boosted.
  • Secondly, the invention is to provide a vapor chamber with separator, including a shell, a capillary tissue, a separator, a supporting structure and a working fluid. The shell includes a lower shell plate and an upper shell plate sealing the lower shell plate. Partial section of the lower shell plate projects downwardly and forms an accommodating room therein. The capillary tissue is arranged by distributing over inner wall of the lower shell plate. The separator overlapped the capillary tissue is arranged a penetrating trough corresponding to the accommodating room. A liquid passage is formed between the lower shell plate and the separator. The supporting structure is accommodated in the shell with upper and lower sides respectively inter-abutted against the upper shell plate and the separator. A vapor passage formed between the upper shell plate and the separator is communicated to the liquid passage. The working fluid is filled into the shell.
  • Compared with prior arts, the invention has following merits. Since the separator separates the working fluid in vapor phase from the working fluid in liquid phase, the working fluid of each phase has its own passage to avoid interfering to each other, reaching the function of boosting cooling performance significantly. In addition, by arranging folded pieces on the separator, it can further prevent the working fluid in vapor phase from flowing in reverse direction into the liquid passage to generate any interference with the working fluid in liquid phase.
  • BRIEF DESCRIPTION OF DRAWING
  • The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes an exemplary embodiment of the invention, taken in conjunction with the accompanying drawings, in which:
  • FIG. 1 is a perspective explosive view of the present invention;
  • FIG. 2 is a perspective outer view of the present invention;
  • FIG. 3 is a cross-sectional view along the sectional line “3-3” in FIG. 2; and
  • FIG. 4 is a locally enlarging illustration of “A” part in FIG. 3.
  • DETAILED DESCRIPTION OF THE INVENTION
  • In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a preferable embodiment, not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.
  • Please refer to FIG. 1 and FIG. 2, respectively showing a perspective explosive view and a perspective outer view of the invention. The invention is to provide a vapor chamber 1 with separator 30, including a shell 10, a capillary tissue 20, a separator 30, a supporting structure 40 and a working fluid 50 (referring to FIG. 4).
  • The shell 10 includes a lower shell plate 11 and an upper shell plate 12 sealing the lower shell plate 11. Partial section of the lower shell plate 11 is projected downwardly to form an accommodating room 111 therein. In this embodiment, the accommodating room 111 is shown as a rectangular configuration, however, not limited to this configuration only. The section of the lower shell plate 11 projected downwardly will contact closely onto an electronically heating element (not shown in the figures).
  • The capillary tissue 20 is distributed over inner walls of the lower shell plate 11 and the accommodating room 111. The capillary tissue 20 may be comprised of metallically woven net or made by powder sintering process, however, not limited to these only.
  • The separator 30 shown as a horizontal plate is partially overlapped onto the capillary tissue 20. Central portion of the separator 30 is arranged a penetrating trough 31 shown as a rectangular configuration corresponding to the accommodating room 111 in a way, such that the accommodating room 111 is communicated to the upper shell plate 12. In addition, a liquid passage b (referring to FIG. 4) is formed between the lower shell plate 11 and the separator 30. More specifically, the liquid passage b is substantially the capillary tissue 20 distributed over the inner walls of the lower shell plate 11. In addition, the separator 30 is folded downwardly to form a plurality of folded pieces 32 at a position corresponding to the penetrating trough 31. The folded pieces 32 are located at two opposite sides of the penetrating trough 31 and are extended into the accommodating room 111. Furthermore, end sides of the folded pieces 32 are all abutted against the capillary tissue 20 and a side face of the folded pieces 32 is also contacted closely onto the capillary tissue 20.
  • The supporting structure 40 accommodated in the shell 10 includes a plurality of corrugated pieces 41 arrayed by intercrossing to one another. Two sides of the corrugated piece 41 are respectively formed into a plurality of through troughs 411. Upper and lower sides of the supporting structure 40 (namely, the wave crest and the wave trough of the corrugated piece 41) are respectively inter-abutted against the upper shell plate 12 and the separator 30. A vapor passage c formed between the upper shell plate 12 and the separator 30 is communicated to the liquid passage b. More specifically, the vapor passage c is a passage formed between the supporting structure 40 and each corrugated piece 41. The working fluid 50 (referring to FIG. 4) is filled into the shell 10. In addition, a connecting section d is respectively formed at two sides of the separator 30 in the shell 10, making the vapor passage c communicated to the liquid passage b.
  • Please refer to FIG. 3 and FIG. 4, respectively showing the cross-sectional view along “3-3” sectional line in FIG. 2 and the locally enlarging view of “A” part in FIG. 3. When the vapor chamber 1 is not heated, the working fluid 50 in liquid phase is accommodated in the accommodating room 111. When the waste heat of the electronically heating element (not shown in the figures) is conducted to the lower shell plate 11 of the vapor chamber 1, the working fluid 50 in liquid phase will be changed into the working fluid 50 in vapor phase because the working fluid 50 is heated, then the working fluid 50 in vapor phase flows up to the vapor passage c. Flowing through the vapor passage c, the working fluid 50 will release heat penetrating through the upper shell plate 12 and transferred to the outside.
  • When the working fluid 50 reaches two sides of the shell 10, since the working fluid 50 has already released heat, the working fluid 50 will be changed from vapor phase to liquid phase. Due to the gravitation and the capillary tissue 20, the working fluid 50 flows back to the accommodating room 111 via the liquid passage b. Therefore, there is no interference between the working fluids 50 respectively in vapor phase and liquid phase and the cooling performance of the vapor chamber 1 is not lowered either. In addition, the operation of the folded pieces 32 is to prevent the working fluid 50 in vapor phase from flowing in reverse direction via the liquid passage b, so there is no interference phenomenon occurring to the working fluid 50 in liquid phase. In addition, since the side face and the end side of the folded piece 32 are respectively contacted to and abutted against the capillary tissue 20, so the probability of the working fluid 50 in vapor phase flowing back to the liquid passage b is reduced significantly.
  • Accordingly, through the constitution of aforementioned assemblies, a vapor chamber with separator according to the invention is thus obtained.
  • Summarizing aforementioned description, the vapor chamber with separator according to the invention is an indispensably design for cooling the electrically heating element of computer indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
  • However, the aforementioned description is only a preferable embodiment according to the present invention, not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.

Claims (9)

1. A vapor chamber with separator, comprising:
a shell, which includes a lower shell plate and an upper shell plate sealing the lower shell plate, a partial section of the lower shell plate projecting downwardly and forming an accommodating room therein;
a capillary tissue, which is arranged by distributing over inner walls of the lower shell plate;
a separator, which is partially overlapped the capillary tissue and is arranged a penetrating trough corresponding to the accommodating room, a liquid passage being formed between the lower shell plate and the separator;
a supporting structure, which is accommodated in the shell with upper and lower sides respectively inter-abutted against the upper shell plate and the separator, a vapor passage formed between the upper shell plate and the separator being communicated to the liquid passage; and
a working fluid, which is filled into the shell.
2. The vapor chamber with separator according to claim 1, wherein the separator is folded downwardly to form a plurality of folded pieces at a position corresponding to the penetrating trough and the plural folded pieces are all extended into the accommodating room.
3. The vapor chamber with separator according to claim 2, wherein end sides of the folded pieces are all abutted against the capillary tissue.
4. The vapor chamber with separator according to claim 3, wherein a side face of the folded piece is contacted closely to the capillary tissue.
5. The vapor chamber with separator according to claim 4, wherein the penetrating trough is shown as a rectangular configuration.
6. The vapor chamber with separator according to claim 5, wherein the folded pieces are separately located at two opposite sides of the penetrating trough.
7. The vapor chamber with separator according to claim 1, wherein a connecting section formed at each of two sides of the separator in the shell makes the vapor passage and the liquid passage communicated to each other.
8. The vapor chamber with separator according to claim 1, wherein the supporting structure includes a plurality of corrugated pieces arrayed by intercrossing to one another.
9. The vapor chamber with separator according to claim 8, wherein a plurality of through troughs are formed at two sides of the corrugated piece respectively.
US12/492,195 2009-06-26 2009-06-26 Vapor chamber with separator Abandoned US20100326629A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/492,195 US20100326629A1 (en) 2009-06-26 2009-06-26 Vapor chamber with separator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/492,195 US20100326629A1 (en) 2009-06-26 2009-06-26 Vapor chamber with separator

Publications (1)

Publication Number Publication Date
US20100326629A1 true US20100326629A1 (en) 2010-12-30

Family

ID=43379454

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/492,195 Abandoned US20100326629A1 (en) 2009-06-26 2009-06-26 Vapor chamber with separator

Country Status (1)

Country Link
US (1) US20100326629A1 (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011015097B4 (en) * 2011-03-15 2013-10-24 Asia Vital Components Co., Ltd. Cooling unit with hydrophilic compound layer
US20170020026A1 (en) * 2015-07-14 2017-01-19 Celsia Technologies Taiwan, Inc. Vapor chamber structure
CN107588672A (en) * 2017-10-12 2018-01-16 锘威科技(深圳)有限公司 A kind of equalizing plate structure and its manufacture method
US20180292145A1 (en) * 2017-04-11 2018-10-11 Cooler Master Co., Ltd. Communication-type thermal conduction device
US10146275B2 (en) 2016-02-17 2018-12-04 Microsoft Technology Licensing, Llc 3D printed thermal management system
US20180372419A1 (en) * 2017-04-11 2018-12-27 Cooler Master Co., Ltd. Heat transfer device
US10410954B2 (en) * 2015-05-05 2019-09-10 Cooler Master Co., Ltd. Cooling module, water-cooled cooling module and cooling system
CN110542327A (en) * 2018-05-29 2019-12-06 佳世诠股份有限公司 Flat heat exchanger and freezer
US10731924B2 (en) * 2018-11-29 2020-08-04 Kunshan Jue-Chung Electronics Co., Ltd. Vapor chamber sealing method and structre using the same
DE102019134731A1 (en) * 2019-12-17 2021-06-17 Bayerische Motoren Werke Aktiengesellschaft Cooling device, motor vehicle with a cooling device and method for producing a cooling device
CN112996339A (en) * 2019-12-12 2021-06-18 王训忠 Temperature equalizing plate device
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11454454B2 (en) 2012-03-12 2022-09-27 Cooler Master Co., Ltd. Flat heat pipe structure
US20230012170A1 (en) * 2021-07-07 2023-01-12 Taiwan Microloops Corp. Heat conduction structure with liquid-gas split mechanism
US20230349644A1 (en) * 2022-04-28 2023-11-02 Taiwan Microloops Corp. Combination structure of vapor chamber and heat pipe
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
US11933543B2 (en) * 2021-03-09 2024-03-19 Furukawa Electric Co., Ltd. Heat sink
US12331997B2 (en) 2018-12-21 2025-06-17 Cooler Master Co., Ltd. Heat dissipation device having irregular shape

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543839A (en) * 1969-05-14 1970-12-01 Trw Inc Multi-chamber controllable heat pipe
US4315498A (en) * 1979-04-13 1982-02-16 Commissariat A L'energie Atomique Solar collector
US5117638A (en) * 1991-03-14 1992-06-02 Steve Feher Selectively cooled or heated seat construction and apparatus for providing temperature conditioned fluid and method therefor
US6082443A (en) * 1997-02-13 2000-07-04 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US20020134534A1 (en) * 2001-03-20 2002-09-26 Motorola, Inc. Press formed two-phase cooling module and method for making same
US20030024691A1 (en) * 2001-07-31 2003-02-06 Leu-Wen Tsay High efficiency heat sink
US6889756B1 (en) * 2004-04-06 2005-05-10 Epos Inc. High efficiency isothermal heat sink
US20060048919A1 (en) * 2004-09-03 2006-03-09 Hul-Chun Hsu Wick structure of heat pipe
US7011146B2 (en) * 2003-02-27 2006-03-14 Nationaltsing Hua University Microchannel heat pipe with parallel grooves for recycling coolant
US20060162905A1 (en) * 2005-01-27 2006-07-27 Hul-Chun Hsu Heat pipe assembly
US20060207751A1 (en) * 2005-03-18 2006-09-21 Foxconn Technology Co., Ltd. Heat pipe
US20060213646A1 (en) * 2005-03-28 2006-09-28 Jaffe Limited Wick structure of heat pipe
US20070227703A1 (en) * 2006-03-31 2007-10-04 Bhatti Mohinder S Evaporatively cooled thermosiphon
US20070240860A1 (en) * 2006-04-18 2007-10-18 Celsia Technologies Korea, Inc. Support structure for a planar cooling device
US20070295494A1 (en) * 2006-06-26 2007-12-27 Celsia Technologies Korea Inc. Flat Type Heat Transferring Device and Manufacturing Method of the Same
US7447027B2 (en) * 2005-12-19 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Hybrid heat dissipation device
US20080283222A1 (en) * 2007-05-18 2008-11-20 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and heat dissipation apparatus using the same
US20090032227A1 (en) * 2002-12-23 2009-02-05 Graftech International Holdings Inc. Flexible Graphite Thermal Management Devices
US20100071879A1 (en) * 2008-09-19 2010-03-25 Foxconn Technology Co., Ltd. Method for manufacturing a plate-type heat pipe and a plate-type heat pipe obtained thereby
US20100139894A1 (en) * 2008-12-08 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with vapor chamber
US7770631B2 (en) * 2008-03-19 2010-08-10 Chin-Wen Wang Method for manufacturing supporting body within an isothermal plate and product of the same

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3543839A (en) * 1969-05-14 1970-12-01 Trw Inc Multi-chamber controllable heat pipe
US4315498A (en) * 1979-04-13 1982-02-16 Commissariat A L'energie Atomique Solar collector
US5117638A (en) * 1991-03-14 1992-06-02 Steve Feher Selectively cooled or heated seat construction and apparatus for providing temperature conditioned fluid and method therefor
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US6082443A (en) * 1997-02-13 2000-07-04 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US6269866B1 (en) * 1997-02-13 2001-08-07 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US20020134534A1 (en) * 2001-03-20 2002-09-26 Motorola, Inc. Press formed two-phase cooling module and method for making same
US20030024691A1 (en) * 2001-07-31 2003-02-06 Leu-Wen Tsay High efficiency heat sink
US20090032227A1 (en) * 2002-12-23 2009-02-05 Graftech International Holdings Inc. Flexible Graphite Thermal Management Devices
US7011146B2 (en) * 2003-02-27 2006-03-14 Nationaltsing Hua University Microchannel heat pipe with parallel grooves for recycling coolant
US6889756B1 (en) * 2004-04-06 2005-05-10 Epos Inc. High efficiency isothermal heat sink
US20060048919A1 (en) * 2004-09-03 2006-03-09 Hul-Chun Hsu Wick structure of heat pipe
US20060162905A1 (en) * 2005-01-27 2006-07-27 Hul-Chun Hsu Heat pipe assembly
US20060207751A1 (en) * 2005-03-18 2006-09-21 Foxconn Technology Co., Ltd. Heat pipe
US20060213646A1 (en) * 2005-03-28 2006-09-28 Jaffe Limited Wick structure of heat pipe
US7447027B2 (en) * 2005-12-19 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Hybrid heat dissipation device
US20070227703A1 (en) * 2006-03-31 2007-10-04 Bhatti Mohinder S Evaporatively cooled thermosiphon
US20070240860A1 (en) * 2006-04-18 2007-10-18 Celsia Technologies Korea, Inc. Support structure for a planar cooling device
US20070295494A1 (en) * 2006-06-26 2007-12-27 Celsia Technologies Korea Inc. Flat Type Heat Transferring Device and Manufacturing Method of the Same
US20080283222A1 (en) * 2007-05-18 2008-11-20 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and heat dissipation apparatus using the same
US7770631B2 (en) * 2008-03-19 2010-08-10 Chin-Wen Wang Method for manufacturing supporting body within an isothermal plate and product of the same
US20100071879A1 (en) * 2008-09-19 2010-03-25 Foxconn Technology Co., Ltd. Method for manufacturing a plate-type heat pipe and a plate-type heat pipe obtained thereby
US20100139894A1 (en) * 2008-12-08 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with vapor chamber

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011015097B4 (en) * 2011-03-15 2013-10-24 Asia Vital Components Co., Ltd. Cooling unit with hydrophilic compound layer
US11454454B2 (en) 2012-03-12 2022-09-27 Cooler Master Co., Ltd. Flat heat pipe structure
US10410954B2 (en) * 2015-05-05 2019-09-10 Cooler Master Co., Ltd. Cooling module, water-cooled cooling module and cooling system
US20170020026A1 (en) * 2015-07-14 2017-01-19 Celsia Technologies Taiwan, Inc. Vapor chamber structure
US10146275B2 (en) 2016-02-17 2018-12-04 Microsoft Technology Licensing, Llc 3D printed thermal management system
US20180292145A1 (en) * 2017-04-11 2018-10-11 Cooler Master Co., Ltd. Communication-type thermal conduction device
US20180372419A1 (en) * 2017-04-11 2018-12-27 Cooler Master Co., Ltd. Heat transfer device
US10345049B2 (en) * 2017-04-11 2019-07-09 Cooler Master Co., Ltd. Communication-type thermal conduction device
US11320211B2 (en) * 2017-04-11 2022-05-03 Cooler Master Co., Ltd. Heat transfer device
CN107588672A (en) * 2017-10-12 2018-01-16 锘威科技(深圳)有限公司 A kind of equalizing plate structure and its manufacture method
US11131511B2 (en) 2018-05-29 2021-09-28 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US11680752B2 (en) 2018-05-29 2023-06-20 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
CN110542327A (en) * 2018-05-29 2019-12-06 佳世诠股份有限公司 Flat heat exchanger and freezer
US11448470B2 (en) 2018-05-29 2022-09-20 Cooler Master Co., Ltd. Heat dissipation plate and method for manufacturing the same
US10731924B2 (en) * 2018-11-29 2020-08-04 Kunshan Jue-Chung Electronics Co., Ltd. Vapor chamber sealing method and structre using the same
US11913725B2 (en) 2018-12-21 2024-02-27 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
US12331997B2 (en) 2018-12-21 2025-06-17 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
US12474126B2 (en) 2018-12-21 2025-11-18 Cooler Master Co., Ltd. Heat dissipation device having irregular shape
CN112996339A (en) * 2019-12-12 2021-06-18 王训忠 Temperature equalizing plate device
DE102019134731A1 (en) * 2019-12-17 2021-06-17 Bayerische Motoren Werke Aktiengesellschaft Cooling device, motor vehicle with a cooling device and method for producing a cooling device
US11933543B2 (en) * 2021-03-09 2024-03-19 Furukawa Electric Co., Ltd. Heat sink
US20230012170A1 (en) * 2021-07-07 2023-01-12 Taiwan Microloops Corp. Heat conduction structure with liquid-gas split mechanism
US20230349644A1 (en) * 2022-04-28 2023-11-02 Taiwan Microloops Corp. Combination structure of vapor chamber and heat pipe
US11892240B2 (en) * 2022-04-28 2024-02-06 Taiwan Microloops Corp. Combination structure of vapor chamber and heat pipe

Similar Documents

Publication Publication Date Title
US20100326629A1 (en) Vapor chamber with separator
US7599185B2 (en) Cooling device
US20130025829A1 (en) Vapor chamber having heated protrusion
US9939205B2 (en) Heat dissipater having capillary component
EP3572755B1 (en) Apparatus, system, and method for improving the efficiency of heatsinks
US10018427B2 (en) Vapor chamber structure
US9052147B2 (en) Loop heat pipe structure with low-profile evaporator
US20100139894A1 (en) Heat sink with vapor chamber
US20120043060A1 (en) Loop heat pipe
US10077945B2 (en) Heat dissipation device
US20130048251A1 (en) Heat dissipation device incorporating heat spreader
US11202390B2 (en) Heat dissipation unit connection reinforcement structure
US7316264B2 (en) Heat pipe
US20110232877A1 (en) Compact vapor chamber and heat-dissipating module having the same
US9273909B2 (en) Heat pipe structure, and thermal module and electronic device using same
US10451355B2 (en) Heat dissipation element
US20190331432A1 (en) Loop heat pipe having condensation segment partially filled with wick
US20100319881A1 (en) Heat spreader with vapor chamber and method for manufacturing the same
US8879261B2 (en) Heat-dissipating device for electronic apparatus
JP2016525671A (en) Evaporator for two-phase loop simple assembly
WO2007029125A2 (en) Heat transfer device
US11397057B2 (en) Vapor chamber structure
US20140060780A1 (en) Flat heat pipe and fabrication method thereof
US10240873B2 (en) Joint assembly of vapor chambers
US20150168078A1 (en) Vapor Chamber Structure

Legal Events

Date Code Title Description
AS Assignment

Owner name: CELSIA TECHNOLOGIES TAIWAN, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MEYER IV, GEORGE ANTHONY;SUN, CHIEN-HUNG;CHEN, CHIEH-PING;AND OTHERS;REEL/FRAME:022879/0627

Effective date: 20090513

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION