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US20100187643A1 - Method for tuning the threshold voltage of a metal gate and high-k device - Google Patents

Method for tuning the threshold voltage of a metal gate and high-k device Download PDF

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US20100187643A1
US20100187643A1 US12/359,434 US35943409A US2010187643A1 US 20100187643 A1 US20100187643 A1 US 20100187643A1 US 35943409 A US35943409 A US 35943409A US 2010187643 A1 US2010187643 A1 US 2010187643A1
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layer
metal film
thickness
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metal
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US7754594B1 (en
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Michael P. Chudzik
Michael A. Gribelyuk
Rashmi Jha
Renee T. Mo
Naim Moumen
Keith Kwong Hon Wong
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GlobalFoundries Inc
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International Business Machines Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28079—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a single metal, e.g. Ta, W, Mo, Al
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28088—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a composite, e.g. TiN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/665—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of elemental metal contacting the insulator, e.g. tungsten or molybdenum
    • H10D64/666—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of elemental metal contacting the insulator, e.g. tungsten or molybdenum the conductor further comprising additional layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers

Definitions

  • the present invention relates generally to a semiconductor device and method of forming the same and, more specifically, to metal gate and high dielectric constant (high-k) devices.
  • achieving a desired work function of a gate material for n-FET and p-FET CMOS devices to meet an operating voltage requirement is achieved by heavy doping of poly-Si, an acceptor dopant for p-FET and a donor for n-FET.
  • a high-k dielectric/metal gate stack different metal gate materials which possess the desired work function are used for n-FET and p-FET devices. Since the work function of the metal gate material depends on the high-k gate dielectric and processing conditions, selection of suitable gate materials presents a challenge for process integration. Metal gate work function may also be adjusted by placing cap layers between the metal gate and the high-k gate dielectric.
  • the position of the cap layers after thermal processing determines the work function and threshold voltage (Vt) of the device. Diffusion of the cap layer through the thin high-k gate dielectric into an interfacial layer during anneals causes degradation of carrier mobility. Attempts to limit diffusion by nitridation of the high-k gate dielectric had limited success.
  • a method of forming a device includes depositing an interfacial layer on top of a substrate.
  • the method includes depositing a high-k dielectric layer on top of the interfacial layer.
  • the method includes depositing a metal film on top of the high-k dielectric layer.
  • the method includes depositing a cap layer on top of the metal film.
  • the method further includes depositing a metal gate layer on top of the cap layer.
  • the method also includes performing an activation anneal.
  • a device in a further aspect of the invention, includes a substrate.
  • the device includes an interfacial layer on top of the substrate.
  • the device includes a high-k dielectric layer on top of the interfacial layer.
  • the device includes a metal film on top of the high-k dielectric layer.
  • the device further includes a cap layer on top of the metal film.
  • the device also includes a metal gate layer on top of the cap layer.
  • FIG. 1 shows a starting structure and processing steps in accordance with an embodiment of the invention
  • FIGS. 2-4 show processing steps and intermediate structures in accordance with an embodiment of the invention.
  • FIG. 5 shows processing steps and a final structure in accordance with an embodiment of the invention.
  • FIG. 1 shows a starting structure and processing steps in accordance with an embodiment of the invention.
  • a substrate 100 is cleaned by conventional processes.
  • Substrate 100 may be a Si wafer.
  • An interfacial layer 110 is formed on substrate 100 .
  • Interfacial layer 110 may be formed by thermal oxidation or any known or later developed processes.
  • Interfacial layer 110 may include, but is not limited to: oxide, nitride and oxynitride.
  • Interfacial layer 110 may be formed with or without subsequent nitridation.
  • Interfacial layer 110 may have a thickness of approximately 1 nm to 7 nm.
  • a high-k dielectric layer 120 is deposited on top of interfacial layer 110 .
  • High-k dielectric layer 120 may be deposited by thermal oxidation or any known or later developed processes.
  • High-k dielectric layer 120 may include, but is not limited to: zirconium oxide (ZrO2), hafnium oxide (HfO2), zirconium silicate (ZrSiO4) and hafnium silicate (HfSiO4).
  • High-k dielectric layer 120 may be approximately 1 nm to 7 nm thick.
  • Metal film 130 is deposited on top of high-k dielectric layer 120 .
  • Metal film 130 may be deposited by physical vapor deposition (PVD), metalorganic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) or any known or later developed processes.
  • Metal film 130 may be approximately 0.1 nm to 10 nm thick.
  • Metal film 130 may include, but is not limited to: ruthenium (Ru), tungsten (W), tantalum (Ta), titanium (Ti), tantalum nitride (TaN) and titanium nitride (TiN).
  • Cap layer 140 is deposited on top of metal film 130 .
  • Cap layer 140 may be deposited by physical vapor deposition (PVD), metalorganic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) or any known or later developed processes.
  • Cap layer 140 may have a thickness of approximately 0.1 nm to 5 nm.
  • Cap layer 140 may include, but is not limited to metal oxides (MOx), metal nitrides (MNx) and pure metals.
  • MOx may include, but is not limited to: tantalum oxide (TaOx) and titanium oxide (TiOx).
  • MNx may include, but is not limited to tantalum nitride (TaNx) and titanium nitride (TiNx).
  • Pure metals may include, but are not limited to: tungsten (W), tantalum (Ta) and titanium (Ti).
  • FIG. 5 shows processing steps and a final structure in accordance with an embodiment of the invention.
  • a metal gate layer 150 is deposited on top of cap layer 140 .
  • Metal gate layer 150 may be deposited by physical vapor deposition (PVD), metalorganic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) or any known or later developed processes.
  • Metal gate layer 150 has a thickness of approximately 0.1 nm to 10 nm.
  • Metal film 130 and metal gate layer 150 may be the same or different.
  • a gate is comprised of metal film 130 , cap layer 140 and metal gate layer 150 .
  • Poly-Si may be deposited on top of the gate (not shown).
  • the gate may be patterned. Spacers 160 may be formed along with active device regions (not shown). Thermal processing leads to diffusion of cap layer 140 .
  • the optimum location of species of a cap layer with respect to gate dielectric leads to setting up a desired work function of the metal gate and thus desired threshold voltage (Vt) of the device
  • the thickness of metal film 130 and cap layer 140 may be tuned so that a target concentration of a cap layer material is present at an interface of metal film 130 and high-k dielectric layer 120 after activation anneal without allowing the cap layer material to diffuse close to the Si in substrate 100 .
  • the target concentration may be approximately 0.1% to 10%.
  • the former will lead to desired threshold voltage (Vt).
  • Vt threshold voltage
  • placing the cap layer 140 away from the interface of metal film 130 and high-k dielectric layer 120 allows for the deposition of thicker cap layers then currently employed, making the process more manufacturable.
  • the method as described above is used in the fabrication of integrated circuit chips.
  • the resulting integrated circuit chips can be distributed by the fabricator in raw wafer form (that is, as a single wafer that has multiple unpackaged chips), as a bare die, or in a packaged form.
  • the chip is mounted in a single chip package (such as a plastic carrier, with leads that are affixed to a motherboard or other higher level carrier) or in a multichip package (such as a ceramic carrier that has either or both surface interconnections or buried interconnections).
  • the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product.
  • the end product can be any product that includes integrated circuit chips, ranging from toys and other low-end applications to advanced computer products having a display, a keyboard or other input device, and a central processor.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

A metal gate and high-k dielectric device includes a substrate, an interfacial layer on top of the substrate, a high-k dielectric layer on top of the interfacial layer, a metal film on top of the high-k dielectric layer, a cap layer on top of the metal film and a metal gate layer on top of the cap layer. The thickness of the metal film and the thickness of the cap layer are tuned such that a target concentration of a cap layer material is present at an interface of the metal film and the high-k dielectric layer.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates generally to a semiconductor device and method of forming the same and, more specifically, to metal gate and high dielectric constant (high-k) devices.
  • In devices with poly-Si gates, achieving a desired work function of a gate material for n-FET and p-FET CMOS devices to meet an operating voltage requirement is achieved by heavy doping of poly-Si, an acceptor dopant for p-FET and a donor for n-FET. In a high-k dielectric/metal gate stack, different metal gate materials which possess the desired work function are used for n-FET and p-FET devices. Since the work function of the metal gate material depends on the high-k gate dielectric and processing conditions, selection of suitable gate materials presents a challenge for process integration. Metal gate work function may also be adjusted by placing cap layers between the metal gate and the high-k gate dielectric. The position of the cap layers after thermal processing determines the work function and threshold voltage (Vt) of the device. Diffusion of the cap layer through the thin high-k gate dielectric into an interfacial layer during anneals causes degradation of carrier mobility. Attempts to limit diffusion by nitridation of the high-k gate dielectric had limited success.
    • SUMMARY OF THE INVENTION
  • In a first aspect of the invention, a method of forming a device includes depositing an interfacial layer on top of a substrate. The method includes depositing a high-k dielectric layer on top of the interfacial layer. The method includes depositing a metal film on top of the high-k dielectric layer. The method includes depositing a cap layer on top of the metal film. The method further includes depositing a metal gate layer on top of the cap layer. The method also includes performing an activation anneal.
  • In a further aspect of the invention, a device includes a substrate. The device includes an interfacial layer on top of the substrate. The device includes a high-k dielectric layer on top of the interfacial layer. The device includes a metal film on top of the high-k dielectric layer. The device further includes a cap layer on top of the metal film. The device also includes a metal gate layer on top of the cap layer.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The present invention is described in the detailed description below, in reference to the accompanying drawings that depict non-limiting examples of exemplary embodiments of the present invention.
  • FIG. 1 shows a starting structure and processing steps in accordance with an embodiment of the invention;
  • FIGS. 2-4 show processing steps and intermediate structures in accordance with an embodiment of the invention; and
  • FIG. 5 shows processing steps and a final structure in accordance with an embodiment of the invention.
    •  DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 1 shows a starting structure and processing steps in accordance with an embodiment of the invention. A substrate 100 is cleaned by conventional processes. Substrate 100 may be a Si wafer. An interfacial layer 110 is formed on substrate 100. Interfacial layer 110 may be formed by thermal oxidation or any known or later developed processes. Interfacial layer 110 may include, but is not limited to: oxide, nitride and oxynitride. Interfacial layer 110 may be formed with or without subsequent nitridation. Interfacial layer 110 may have a thickness of approximately 1 nm to 7 nm.
  • Referring to FIG. 2, a high-k dielectric layer 120 is deposited on top of interfacial layer 110. High-k dielectric layer 120 may be deposited by thermal oxidation or any known or later developed processes. High-k dielectric layer 120 may include, but is not limited to: zirconium oxide (ZrO2), hafnium oxide (HfO2), zirconium silicate (ZrSiO4) and hafnium silicate (HfSiO4). High-k dielectric layer 120 may be approximately 1 nm to 7 nm thick.
  • Referring to FIG. 3, a metal film 130 is deposited on top of high-k dielectric layer 120. Metal film 130 may be deposited by physical vapor deposition (PVD), metalorganic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) or any known or later developed processes. Metal film 130 may be approximately 0.1 nm to 10 nm thick. Metal film 130 may include, but is not limited to: ruthenium (Ru), tungsten (W), tantalum (Ta), titanium (Ti), tantalum nitride (TaN) and titanium nitride (TiN).
  • Referring to FIG. 4, a cap layer 140 is deposited on top of metal film 130. Cap layer 140 may be deposited by physical vapor deposition (PVD), metalorganic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) or any known or later developed processes. Cap layer 140 may have a thickness of approximately 0.1 nm to 5 nm. Cap layer 140 may include, but is not limited to metal oxides (MOx), metal nitrides (MNx) and pure metals. MOx may include, but is not limited to: tantalum oxide (TaOx) and titanium oxide (TiOx). MNx may include, but is not limited to tantalum nitride (TaNx) and titanium nitride (TiNx). Pure metals may include, but are not limited to: tungsten (W), tantalum (Ta) and titanium (Ti).
  • FIG. 5 shows processing steps and a final structure in accordance with an embodiment of the invention. A metal gate layer 150 is deposited on top of cap layer 140. Metal gate layer 150 may be deposited by physical vapor deposition (PVD), metalorganic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) or any known or later developed processes. Metal gate layer 150 has a thickness of approximately 0.1 nm to 10 nm. Metal film 130 and metal gate layer 150 may be the same or different. A gate is comprised of metal film 130, cap layer 140 and metal gate layer 150. Poly-Si may be deposited on top of the gate (not shown). The gate may be patterned. Spacers 160 may be formed along with active device regions (not shown). Thermal processing leads to diffusion of cap layer 140. The optimum location of species of a cap layer with respect to gate dielectric leads to setting up a desired work function of the metal gate and thus desired threshold voltage (Vt) of the device without compromising carrier mobility.
  • The thickness of metal film 130 and cap layer 140 may be tuned so that a target concentration of a cap layer material is present at an interface of metal film 130 and high-k dielectric layer 120 after activation anneal without allowing the cap layer material to diffuse close to the Si in substrate 100. The target concentration may be approximately 0.1% to 10%. The former will lead to desired threshold voltage (Vt). The latter will eliminate degradation of carrier mobility. Additionally, placing the cap layer 140 away from the interface of metal film 130 and high-k dielectric layer 120 allows for the deposition of thicker cap layers then currently employed, making the process more manufacturable.
  • The method as described above is used in the fabrication of integrated circuit chips. The resulting integrated circuit chips can be distributed by the fabricator in raw wafer form (that is, as a single wafer that has multiple unpackaged chips), as a bare die, or in a packaged form. In the latter case the chip is mounted in a single chip package (such as a plastic carrier, with leads that are affixed to a motherboard or other higher level carrier) or in a multichip package (such as a ceramic carrier that has either or both surface interconnections or buried interconnections). In any case the chip is then integrated with other chips, discrete circuit elements, and/or other signal processing devices as part of either (a) an intermediate product, such as a motherboard, or (b) an end product. The end product can be any product that includes integrated circuit chips, ranging from toys and other low-end applications to advanced computer products having a display, a keyboard or other input device, and a central processor.
  • The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims (25)

1. A method of forming a device, comprising:
depositing an interfacial layer on top of a substrate;
depositing a high-k dielectric layer on top of the interfacial layer;
depositing a metal film on top of the high-k dielectric layer;
depositing a cap layer on top of the metal film;
depositing a metal gate layer on top of the cap layer; and
performing an activation anneal, wherein the thickness of the metal film and the thickness of the cap layer are tuned such that a target concentration of a cap layer material is present at an interface of the metal film and the high-k dielectric layer after the performing step without allowing the cap layer material to diffuse close to the substrate, wherein the target concentration is approximately 0.1% to 10%.
2. A method according to claim 1, wherein the interfacial layer is deposited by thermal oxidation.
3. A method according to claim 2, wherein the interfacial layer is selected from the group consisting of: oxide, nitride and oxynitride.
4. A method according to claim 3, wherein the interfacial layer has a thickness of approximately 1 nm to 7 nm.
5. A method according to claim 1, wherein the high-k dielectric layer is deposited by thermal oxidation.
6. A method according to claim 5, wherein the high-k dielectric layer is selected from the group consisting of: zirconium oxide (ZrO2), hafnium oxide (HfO2), zirconium silicate (ZrSiO4) and hafnium silicate (HfSiO4).
7. A method according to claim 6, wherein the high-k dielectric layer has a thickness of approximately 1 nm to 7 nm.
8. A method according to claim 1, wherein the metal film has a thickness of approximately 0.1 nm to 10 nm.
9. A method according to claim 8, wherein the metal film is deposited by physical vapor deposition (PVD), metalorganic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE).
10. A method according to claim 9, wherein the metal film is selected from the group consisting of: ruthenium (Ru), tungsten (W), tantalum (Ta), titanium (Ti), tantalum nitride (TaN) and titanium nitride (TiN).
11. A method according to claim 1, wherein the cap layer is deposited on top of the metal film by physical vapor deposition (PVD), metalorganic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE).
12. A method according to claim 11, wherein the cap layer is selected from the group consisting of: metal oxides (MOx), metal nitrides (MNx) and pure metals.
13. A method according to claim 12, wherein the cap layer has a thickness of approximately 0.1 nm to 5 nm.
14. A method according to claim 1, wherein the metal gate layer is deposited by physical vapor deposition (PVD), metalorganic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE).
15. A method according to claim 14, wherein the metal gate layer has thickness of approximately 0.1 nm to 10 nm.
16. A method according to claim 15, wherein the metal film and the metal gate layer are the same material.
17. (canceled)
18. A device, comprising:
a substrate;
an interfacial layer on top of the substrate;
a high-k dielectric layer on top of the interfacial layer;
a metal film on top of the high-k dielectric layer;
a cap layer on top of the metal film; and
a metal gate layer on top of the cap layer, wherein a target concentration of a cap layer material is present at an interface of the metal film and the high-k dielectric layer, wherein the target concentration is approximately 0.1% to 10%.
19. A device according to claim 18, wherein the interfacial layer is selected from the group consisting of: oxide, nitride and oxynitride.
20. A device according to claim 18, wherein the high-k dielectric layer is selected from the group consisting of: zirconium oxide (ZrO2), hafnium oxide (HfO2), zirconium silicate (ZrSiO4) and hafnium silicate (HfSiO4).
21. A device according to claim 18, wherein the metal film is selected from the group consisting of: ruthenium (Ru), tungsten (W), tantalum (Ta), titanium (Ti), tantalum nitride (TaN) and titanium nitride (TiN).
22. A device according to claim 18, wherein the cap layer is selected from the group consisting of: metal oxides (MOx), metal nitrides (MNx) and pure metals.
23. A device according to claim 18, wherein metal film and the metal gate layer are the same material.
24. A device according to claim 18, wherein the interfacial layer has a thickness of approximately 1 nm to 7 nm, the high-k dielectric layer has a thickness of approximately 1 nm to 7 nm, the metal film has a thickness of approximately 0.1 nm to 10 nm, the cap layer has a thickness of approximately 0.1 nm to 5 nm and the metal gate layer has thickness of approximately 0.1 nm to 10 nm.
25. (canceled)
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100320547A1 (en) * 2009-06-18 2010-12-23 International Business Machines Corporation Scavanging metal stack for a high-k gate dielectric
CN102842618A (en) * 2011-06-24 2012-12-26 中国科学院微电子研究所 Semiconductor structure and manufacturing method thereof
US8420473B2 (en) 2010-12-06 2013-04-16 International Business Machines Corporation Replacement gate devices with barrier metal for simultaneous processing
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