US20090071624A1 - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- US20090071624A1 US20090071624A1 US11/857,401 US85740107A US2009071624A1 US 20090071624 A1 US20090071624 A1 US 20090071624A1 US 85740107 A US85740107 A US 85740107A US 2009071624 A1 US2009071624 A1 US 2009071624A1
- Authority
- US
- United States
- Prior art keywords
- heat
- heat sink
- conducting
- fins
- arms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000007423 decrease Effects 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/42—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being both outside and inside the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/42—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being both outside and inside the tubular element
- F28F1/422—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being both outside and inside the tubular element with outside means integral with the tubular element and inside means integral with the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
Definitions
- the present invention relates to heat sinks, and particularly to a heat sink for removing heat from electronic components such as LED components.
- Electronic component includes numerous circuits operating at high speed and generating substantive heat.
- a heat sink to remove heat from heat-generating electronic components, for example, LED components in an LED lamp, to assure that the components function properly and reliably.
- An LED lamp is a type of solid-state lighting device that utilizes light-emitting diodes (LEDs) as a source of illumination.
- LEDs light-emitting diodes
- An LED is a device for converting electricity into light by using a theory that, if a current is made to flow in a forward direction through a junction region comprising two different types of semiconductor, electrons and holes are coupled at the junction region to generate a light beam.
- the LED has an advantage that it is resistant to shock, and has an almost eternal lifetime under a specific condition; thus, the LED lamp is intended to be a cost-effective yet high quality replacement for incandescent and fluorescent lamps.
- An LED lamp generally has a limited space therein and requires a plurality of LEDs. Most of the LEDs are driven at the same time, which results in a quick rise in temperature of the LED lamp. Since the limited space in the LED lamp, the heat sink has a restricted heat dissipating area and is unable to remove heat from the LEDs effectively. Operation of the conventional LED lamps thus has a problem of instability because of the rapid buildup of heat.
- a heat sink adapted for removing heat from a plurality of heat-generating components, such as LEDs, includes a cylindrical heat-conducting member, a plurality of conducting arms extending radially and outwardly from a periphery of the heat-conducting member and a plurality of outer fins perpendicularly extending from two lateral sides of each of the conductive arms.
- the outer fins are spaced from and surround the heat-conducting member.
- the outer fins has an outermost one which has an outer, flat surface adapted for thermally connecting with the heat-generating components, whereby heat generated by the heat-generating components is absorbed and dissipated to surrounding air by the heat sink.
- FIG. 1 is an isometric view of a heat sink in accordance with a preferred embodiment of the present invention.
- FIG. 2 is a top view of the heat sink of FIG. 1 .
- a heat sink for removing heat from heat-generating electronic components (not shown) such as LEDs in an LED lamp.
- the heat sink is integrally formed of a one-piece metal with good heat conductivity, such as aluminum or copper.
- the heat sink has a heat-conductive member at a center thereof.
- the heat-conductive member is an elongated cylinder 10 with a through hole (not labeled) defined therein.
- the cylinder 10 has a plurality of inner fins 12 extending inwardly from an inner wall thereof.
- the inner fins 12 are centrosymmetric relative to a central axis of the cylinder 10 and each have a thickness gradually decreasing inwardly.
- the heat sink has a plurality of conducting arms 14 extending radially and outwardly from an outer wall of the cylinder 10 .
- the conducting arms 14 are identical to each other and centrosymmetric relative to the central axis of the cylinder 10 .
- a quantity of the conducting arms 14 can be different in an alternative embodiment. In this embodiment, the quantity of the conducting arms 14 is designed to be six.
- a plurality of pairs of outer fins 140 are formed on two opposite lateral sides of each of the conducting arms 14 . Each pair of the outer fins 140 extend respectively and perpendicularly from the two opposite lateral sides of a corresponding conducting arm 14 and are symmetrical to each other relative to the corresponding conducting arm 14 . Lengths of the outer fins 140 at a lateral side of each of the conducting arms 14 increase along a direction from the cylinder 10 to a distal end of the corresponding conducting arm 14 . The distal end of the conducting arm 14 terminates at an inner face of an outermost one of the outer fins 140 . An outer face of each outermost outer fin 140 is flat and used for thermally contacting with the LEDs.
- Heat generated by the LEDs is first received by the outermost ones of the outer fins 140 . Then the heat is transferred to inner ones of the outer fins 140 and the elongated cylinder 10 and the inner fins 12 via the conducting arms 14 . The heat is dissipated to a plurality of spaces (not labeled) between the conducting arms 14 , the outer fins 140 , the elongated cylinder 10 and the inner fins 12 , wherein the spaces extend vertically through the heat sink. Air in the spaces and heated by the heat from the LEDs flows upwardly beyond a top of the heat sink, whereby cool air enters into the spaces from a bottom of the heat sink. Therefore, the heat is taken away from the heat sink to the surrounding air so that the heat generated by the LEDs can be effectively dissipated.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to heat sinks, and particularly to a heat sink for removing heat from electronic components such as LED components.
- 2. Description of related art
- Electronic component includes numerous circuits operating at high speed and generating substantive heat. In many applications, it is desirable to employ a heat sink to remove heat from heat-generating electronic components, for example, LED components in an LED lamp, to assure that the components function properly and reliably.
- An LED lamp is a type of solid-state lighting device that utilizes light-emitting diodes (LEDs) as a source of illumination. An LED is a device for converting electricity into light by using a theory that, if a current is made to flow in a forward direction through a junction region comprising two different types of semiconductor, electrons and holes are coupled at the junction region to generate a light beam. The LED has an advantage that it is resistant to shock, and has an almost eternal lifetime under a specific condition; thus, the LED lamp is intended to be a cost-effective yet high quality replacement for incandescent and fluorescent lamps.
- An LED lamp generally has a limited space therein and requires a plurality of LEDs. Most of the LEDs are driven at the same time, which results in a quick rise in temperature of the LED lamp. Since the limited space in the LED lamp, the heat sink has a restricted heat dissipating area and is unable to remove heat from the LEDs effectively. Operation of the conventional LED lamps thus has a problem of instability because of the rapid buildup of heat.
- What is needed, therefore, is a heat sink has a greater heat-transfer capability in a limited space.
- A heat sink adapted for removing heat from a plurality of heat-generating components, such as LEDs, includes a cylindrical heat-conducting member, a plurality of conducting arms extending radially and outwardly from a periphery of the heat-conducting member and a plurality of outer fins perpendicularly extending from two lateral sides of each of the conductive arms. The outer fins are spaced from and surround the heat-conducting member. The outer fins has an outermost one which has an outer, flat surface adapted for thermally connecting with the heat-generating components, whereby heat generated by the heat-generating components is absorbed and dissipated to surrounding air by the heat sink.
- Many aspects of the present heat sink can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present LED lamp. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an isometric view of a heat sink in accordance with a preferred embodiment of the present invention; and -
FIG. 2 is a top view of the heat sink ofFIG. 1 . - Referring to
FIGS. 1-2 , a heat sink is disclosed for removing heat from heat-generating electronic components (not shown) such as LEDs in an LED lamp. - The heat sink is integrally formed of a one-piece metal with good heat conductivity, such as aluminum or copper. The heat sink has a heat-conductive member at a center thereof. In this embodiment, the heat-conductive member is an
elongated cylinder 10 with a through hole (not labeled) defined therein. Thecylinder 10 has a plurality ofinner fins 12 extending inwardly from an inner wall thereof. Theinner fins 12 are centrosymmetric relative to a central axis of thecylinder 10 and each have a thickness gradually decreasing inwardly. The heat sink has a plurality of conductingarms 14 extending radially and outwardly from an outer wall of thecylinder 10. The conductingarms 14 are identical to each other and centrosymmetric relative to the central axis of thecylinder 10. A quantity of the conductingarms 14 can be different in an alternative embodiment. In this embodiment, the quantity of the conductingarms 14 is designed to be six. A plurality of pairs ofouter fins 140 are formed on two opposite lateral sides of each of the conductingarms 14. Each pair of theouter fins 140 extend respectively and perpendicularly from the two opposite lateral sides of a correspondingconducting arm 14 and are symmetrical to each other relative to thecorresponding conducting arm 14. Lengths of theouter fins 140 at a lateral side of each of the conductingarms 14 increase along a direction from thecylinder 10 to a distal end of thecorresponding conducting arm 14. The distal end of the conductingarm 14 terminates at an inner face of an outermost one of theouter fins 140. An outer face of each outermostouter fin 140 is flat and used for thermally contacting with the LEDs. - Heat generated by the LEDs is first received by the outermost ones of the
outer fins 140. Then the heat is transferred to inner ones of theouter fins 140 and theelongated cylinder 10 and theinner fins 12 via the conductingarms 14. The heat is dissipated to a plurality of spaces (not labeled) between the conductingarms 14, theouter fins 140, theelongated cylinder 10 and theinner fins 12, wherein the spaces extend vertically through the heat sink. Air in the spaces and heated by the heat from the LEDs flows upwardly beyond a top of the heat sink, whereby cool air enters into the spaces from a bottom of the heat sink. Therefore, the heat is taken away from the heat sink to the surrounding air so that the heat generated by the LEDs can be effectively dissipated. - It is believed that the present invention and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (20)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/857,401 US20090071624A1 (en) | 2007-09-18 | 2007-09-18 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/857,401 US20090071624A1 (en) | 2007-09-18 | 2007-09-18 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20090071624A1 true US20090071624A1 (en) | 2009-03-19 |
Family
ID=40453220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/857,401 Abandoned US20090071624A1 (en) | 2007-09-18 | 2007-09-18 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US20090071624A1 (en) |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886887A (en) * | 2009-05-14 | 2010-11-17 | 威兰德-沃克公开股份有限公司 | Metallic heat exchanger tube |
| US20110030920A1 (en) * | 2009-08-04 | 2011-02-10 | Asia Vital Components (Shen Zhen) Co., Ltd. | Heat Sink Structure |
| US20120285660A1 (en) * | 2010-05-04 | 2012-11-15 | Alexander Poltorak | Fractal heat transfer device |
| US20130269920A1 (en) * | 2012-04-17 | 2013-10-17 | Molex Incorporated | Cooling device |
| US20140352939A1 (en) * | 2011-12-21 | 2014-12-04 | Ronald Lutz | Evaporator tube having an optimised external structure |
| USD732730S1 (en) * | 2014-08-05 | 2015-06-23 | General Luminaire Co., Ltd. | Spliceable lamp panel |
| USD733959S1 (en) * | 2014-08-05 | 2015-07-07 | General Luminaire Co., Ltd. | Spliceable lamp panel |
| CN105377002A (en) * | 2015-12-04 | 2016-03-02 | 太仓陶氏电气有限公司 | Snowflake-shaped liquid radiator |
| US20160290571A1 (en) * | 2015-03-30 | 2016-10-06 | Linmore Led Labs, Inc. | Heat dissipating led light bar |
| US20180003444A1 (en) * | 2015-01-15 | 2018-01-04 | A Markussen Holding As | Heat exchanger |
| WO2019018446A1 (en) * | 2017-07-17 | 2019-01-24 | Fractal Heatsink Technologies, LLC | Multi-fractal heat sink system and method |
| US10415893B2 (en) * | 2017-01-04 | 2019-09-17 | Wieland-Werke Ag | Heat transfer surface |
| US10788163B2 (en) | 2015-09-21 | 2020-09-29 | Current Lighting Solutions, Llc | Solid state lamp for retrofit |
| US10826347B2 (en) * | 2018-06-22 | 2020-11-03 | Chicony Power Technology Co., Ltd. | Motor sleeve and motor device |
| US10830545B2 (en) | 2016-07-12 | 2020-11-10 | Fractal Heatsink Technologies, LLC | System and method for maintaining efficiency of a heat sink |
| US10852069B2 (en) | 2010-05-04 | 2020-12-01 | Fractal Heatsink Technologies, LLC | System and method for maintaining efficiency of a fractal heat sink |
| US11022340B2 (en) | 2016-08-01 | 2021-06-01 | Johnson Controls Technology Company | Enhanced heat transfer surfaces for heat exchangers |
| US11024558B2 (en) * | 2010-03-26 | 2021-06-01 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
| US11209220B2 (en) | 2010-05-04 | 2021-12-28 | Fractal Heatsink Technologies LLC | Fractal heat transfer device |
| WO2022148899A1 (en) | 2021-01-08 | 2022-07-14 | Thermal Channel Technologies Oy | Heat sink as well as associated devices and methods |
| WO2022207173A1 (en) * | 2021-03-29 | 2022-10-06 | Osram Gmbh | Lamp |
| US11521807B2 (en) * | 2018-07-13 | 2022-12-06 | Abb Schweiz Ag | Heat sink for a high voltage switchgear |
| US11633694B2 (en) * | 2018-11-06 | 2023-04-25 | Shenzhen Biteman Technology Co., Ltd. | Heat exchange device and freeze dryer |
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| US2055549A (en) * | 1934-05-18 | 1936-09-29 | Modine Mfg Co | Heat exchange device |
| US5803161A (en) * | 1996-09-04 | 1998-09-08 | The Babcock & Wilcox Company | Heat pipe heat exchanger for cooling or heating high temperature/high-pressure sub-sea well streams |
| US20030015316A1 (en) * | 2001-07-18 | 2003-01-23 | Kemal Burkay | Heat exchange tube having increased heat transfer area |
| US20060076128A1 (en) * | 2004-10-12 | 2006-04-13 | Veritas Ag | Fuel cooler, automotive vehicle comprising such a fuel cooler and method for producing such a fuel cooler |
| US20060113065A1 (en) * | 2004-12-01 | 2006-06-01 | International Business Machines Corp. | Heat sink made from a singly extruded heatpipe |
-
2007
- 2007-09-18 US US11/857,401 patent/US20090071624A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2055549A (en) * | 1934-05-18 | 1936-09-29 | Modine Mfg Co | Heat exchange device |
| US5803161A (en) * | 1996-09-04 | 1998-09-08 | The Babcock & Wilcox Company | Heat pipe heat exchanger for cooling or heating high temperature/high-pressure sub-sea well streams |
| US20030015316A1 (en) * | 2001-07-18 | 2003-01-23 | Kemal Burkay | Heat exchange tube having increased heat transfer area |
| US20060076128A1 (en) * | 2004-10-12 | 2006-04-13 | Veritas Ag | Fuel cooler, automotive vehicle comprising such a fuel cooler and method for producing such a fuel cooler |
| US20060113065A1 (en) * | 2004-12-01 | 2006-06-01 | International Business Machines Corp. | Heat sink made from a singly extruded heatpipe |
| US7195058B2 (en) * | 2004-12-01 | 2007-03-27 | International Business Machines Corporation | Heat sink made from a singly extruded heatpipe |
Cited By (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009021334A1 (en) * | 2009-05-14 | 2010-11-18 | Wieland-Werke Ag | Metallic heat exchanger tube |
| CN101886887A (en) * | 2009-05-14 | 2010-11-17 | 威兰德-沃克公开股份有限公司 | Metallic heat exchanger tube |
| US20110030920A1 (en) * | 2009-08-04 | 2011-02-10 | Asia Vital Components (Shen Zhen) Co., Ltd. | Heat Sink Structure |
| US11024558B2 (en) * | 2010-03-26 | 2021-06-01 | Hamilton Sundstrand Corporation | Heat transfer device with fins defining air flow channels |
| US20220120517A1 (en) * | 2010-05-04 | 2022-04-21 | Fractal Heatsink Technologies LLC | Fractal heat transfer device |
| US20120285660A1 (en) * | 2010-05-04 | 2012-11-15 | Alexander Poltorak | Fractal heat transfer device |
| US11598593B2 (en) | 2010-05-04 | 2023-03-07 | Fractal Heatsink Technologies LLC | Fractal heat transfer device |
| US11209220B2 (en) | 2010-05-04 | 2021-12-28 | Fractal Heatsink Technologies LLC | Fractal heat transfer device |
| US9228785B2 (en) * | 2010-05-04 | 2016-01-05 | Alexander Poltorak | Fractal heat transfer device |
| US10852069B2 (en) | 2010-05-04 | 2020-12-01 | Fractal Heatsink Technologies, LLC | System and method for maintaining efficiency of a fractal heat sink |
| US12345479B2 (en) * | 2010-05-04 | 2025-07-01 | Fractal Heatsink Technologies LLC | Fractal heat transfer device |
| US9618279B2 (en) * | 2011-12-21 | 2017-04-11 | Wieland-Werke Ag | Evaporator tube having an optimised external structure |
| US20140352939A1 (en) * | 2011-12-21 | 2014-12-04 | Ronald Lutz | Evaporator tube having an optimised external structure |
| US9909819B2 (en) | 2011-12-21 | 2018-03-06 | Wieland-Werke Ag | Evaporator tube having an optimised external structure |
| US20160081225A1 (en) * | 2012-04-17 | 2016-03-17 | Molex, Llc | Stackable rotated heat sink |
| US20130269920A1 (en) * | 2012-04-17 | 2013-10-17 | Molex Incorporated | Cooling device |
| USD732730S1 (en) * | 2014-08-05 | 2015-06-23 | General Luminaire Co., Ltd. | Spliceable lamp panel |
| USD733959S1 (en) * | 2014-08-05 | 2015-07-07 | General Luminaire Co., Ltd. | Spliceable lamp panel |
| US10739078B2 (en) * | 2015-01-15 | 2020-08-11 | A Markussen Holding As | Heat exchanger |
| US20180003444A1 (en) * | 2015-01-15 | 2018-01-04 | A Markussen Holding As | Heat exchanger |
| US10054296B2 (en) * | 2015-03-30 | 2018-08-21 | Linmore Led Labs, Inc. | Heat dissipating LED light bar |
| US20160290571A1 (en) * | 2015-03-30 | 2016-10-06 | Linmore Led Labs, Inc. | Heat dissipating led light bar |
| US10788163B2 (en) | 2015-09-21 | 2020-09-29 | Current Lighting Solutions, Llc | Solid state lamp for retrofit |
| US11112065B2 (en) | 2015-09-21 | 2021-09-07 | Current Lighting Solutions, Llc | Solid state lamp for retrofit |
| CN105377002A (en) * | 2015-12-04 | 2016-03-02 | 太仓陶氏电气有限公司 | Snowflake-shaped liquid radiator |
| US11346620B2 (en) | 2016-07-12 | 2022-05-31 | Fractal Heatsink Technologies, LLC | System and method for maintaining efficiency of a heat sink |
| US11609053B2 (en) | 2016-07-12 | 2023-03-21 | Fractal Heatsink Technologies LLC | System and method for maintaining efficiency of a heat sink |
| US12339078B2 (en) | 2016-07-12 | 2025-06-24 | Fractal Heatsink Technologies LLC | System and method for maintaining efficiency of a heat sink |
| US10830545B2 (en) | 2016-07-12 | 2020-11-10 | Fractal Heatsink Technologies, LLC | System and method for maintaining efficiency of a heat sink |
| US11913737B2 (en) | 2016-07-12 | 2024-02-27 | Fractal Heatsink Technologies LLC | System and method for maintaining efficiency of a heat sink |
| US11022340B2 (en) | 2016-08-01 | 2021-06-01 | Johnson Controls Technology Company | Enhanced heat transfer surfaces for heat exchangers |
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