US20080122966A1 - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- US20080122966A1 US20080122966A1 US11/681,723 US68172307A US2008122966A1 US 20080122966 A1 US20080122966 A1 US 20080122966A1 US 68172307 A US68172307 A US 68172307A US 2008122966 A1 US2008122966 A1 US 2008122966A1
- Authority
- US
- United States
- Prior art keywords
- lenses
- camera module
- area
- container
- aperture plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention generally relates to camera modules and, especially, to a camera module with a low profile.
- digital camera modules are in widespread use in a variety of portable electronic devices.
- digital camera modules are now widely available as a special feature for mobile phones, and since the mobile phones have become smaller and smaller, the digital camera modules used in the mobile phones are also becoming correspondingly reduced in size.
- a camera module includes an image sensor, a lens module, an aperture plate, and a signal processor.
- the image senor includes a base and a sensor area located in the center of the base.
- the lens module includes a plurality of lenses and a container configured (i.e., structured and arranged) for containing/carrying the lenses, and the lenses are distributed in an array within the container.
- the aperture plate includes a plurality of light permeable portions located at positions corresponding to the respective lenses.
- the signal processor is electronically connected with the image sensor and is configured for processing the signals from the image sensor.
- the lens module and the aperture plate respectively, corresponded to the sensor area.
- the area of the container corresponds to the area of the aperture plate.
- FIG. 1 is an assembled, isometric view of a camera module, in accordance with a preferred embodiment
- FIG. 2 is an exploded, isometric view of the camera module in FIG. 1 ;
- FIG. 3 is a cross-sectional view of a spacer, taken along line III-III within FIG. 2 .
- a preferred embodiment of a camera module 100 includes, from bottom to top, an image sensor 10 , a spacer 12 , a lens module 14 , and an aperture plate 16 .
- the camera module 100 further includes a signal processor (not shown) electronically connected with the image sensor 10 .
- the image sensor 10 is at least one item selected from the group consisting of a complementary metal oxide semiconductor (CMOS) image sensor and a charge coupled device (CCD) image sensor.
- CMOS complementary metal oxide semiconductor
- CCD charge coupled device
- the image sensor 10 includes a base 102 and a sensor area/region 104 in the center of the base 102 (i.e., centered upon the base 102 ).
- the sensor area 104 it is advantageous for the sensor area 104 to occupy a major portion (e.g., ⁇ 70% or more) of the total area available on the base 102 .
- the spacer 12 has a similar shape to the sensor area 104 .
- a plurality of light holes 120 is defined through the spacer 12 .
- the image sensor 10 receives light through the light holes 120 .
- Each of the plurality of light holes 120 is a bell-mouthed hole. That is, a cross-sectional plane of each of the plurality of light holes 120 is trapezoidal in shape, wherein the wider end of the trapezoid is located towards (i.e., proximate or adjacent) the image sensor 10 .
- There is a near zero-distance between the corresponding larger ends of each pair of neighboring light holes 120 so that the negative optical effect caused by an interval between the neighboring light holes 120 can be avoided or at least greatly minimized.
- the lens module 14 includes a plurality of lenses 140 and a tray 142 configured for carrying/containing the lenses 140 .
- Each of the lenses 140 is a spherical or aspherical optical lens.
- a plurality of containing holes (not labeled) is defined through the tray 142 .
- the plurality of containing holes is arranged in an array.
- the containing holes are used for containing/holding the respective lenses 140 .
- the size of each containing hole corresponds to that of the lenses 140 .
- the aperture plate 16 has a plurality of through holes 160 defined therethrough.
- the distribution of the through holes 160 is essentially identical to that of the lenses 140 and, thus, corresponds to the layout of the containing holes in the tray 142 .
- the lenses 140 can receive light through the through holes 160 .
- Each of the through holes 160 is a bell-mouthed hole opening outwardly.
- the size of each of the through holes 160 corresponds to the size of the optical part of a lens 140 .
- the through holes 160 can be omitted and be replaced with a transparent material. In either case, the through holes 160 or the transparent material serves as a light permeable portion. Through such light permeable portions, the lenses 140 are able to receive light.
- the area of the spacer 12 , the tray 142 , and the aperture 16 is about the same.
- the light holes 120 , the containing holes, and the through holes 160 are arranged in the same pattern/configuration.
- the area of the light hole 120 is larger than that of the light permeable portion, so that the camera module 100 can better receive light.
- the aperture plate 16 , the lens module 14 , and the spacer 12 are deposited on the sensor area 104 of the image sensor 10 .
- Each of the light holes 120 is positioned corresponding to a respective lens 140 , positioned in the corresponding containing hole, and to a respective through hole 160 .
- the image sensor 10 receives the outer light 10 through the plurality of lenses 140 and processes the light to form image signals.
- the image signals are sent to a signal processor (not shown) by the image sensor 10 .
- the signal processor consolidates the respective images from each of the lenses 140 to remove any alignment errors, so that a final image can be reconstructed.
- the signal processor can be replaced with a program used in the image sensor 10 .
- the program can be used for image consolidation and correction.
- each of the through holes 160 may be staggered a little with respect to each of the corresponding light holes 120 , so that different view fields can be sufficiently covered.
- the spacer 12 , tray 142 , and the aperture plate 16 are, advantageously, made of plastic and connected together by epoxy resin or another suitable adhesive.
- the lenses 140 and the tray 142 can, alternatively, be formed as a single-piece unit, and, thus, the containing holes in the tray 142 can be omitted.
- the spacer 12 can be omitted. In an instance where the spacer 12 is omitted, the thickness of the tray 142 is larger than that of the lenses 140 , so that the lens module 14 can be positioned directly on the sensor area 104 of the image sensor 10 . With the lenses 140 distributed in an array in the manner of the present system, the camera module 100 is thinner than the traditional camera module.
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Abstract
A camera module (100) includes an image sensor (10), a lens module (14), and an aperture plate (16). The image senor includes a base (102) and a sensor area/region (104) located in the center of the base. The lens module (14) incorporates a plurality of lenses (140) and a container (142) for holding the lenses, the lenses being distributed in an array within the container. The aperture plate has a plurality of light permeable portions located at positions corresponding to the respective lenses. The lens module and the aperture plate correspond to the sensor area of the image sensor. The area of the container corresponds to the area of the aperture plate.
Description
- 1. Field of the Invention
- The present invention generally relates to camera modules and, especially, to a camera module with a low profile.
- 2. Description of Related Art
- Nowadays, digital camera modules are in widespread use in a variety of portable electronic devices. For example, digital camera modules are now widely available as a special feature for mobile phones, and since the mobile phones have become smaller and smaller, the digital camera modules used in the mobile phones are also becoming correspondingly reduced in size.
- To achieve ultra small cameras or “card cameras”, various efforts have be made to improve such camera technology, but, due to technical difficulties and performance limitations, the development of the ultra small camera is still suffering problems.
- Accordingly, what is needed is a low profile camera module.
- In one aspect thereof, a camera module includes an image sensor, a lens module, an aperture plate, and a signal processor. The image senor includes a base and a sensor area located in the center of the base. The lens module includes a plurality of lenses and a container configured (i.e., structured and arranged) for containing/carrying the lenses, and the lenses are distributed in an array within the container. The aperture plate includes a plurality of light permeable portions located at positions corresponding to the respective lenses. The signal processor is electronically connected with the image sensor and is configured for processing the signals from the image sensor. The lens module and the aperture plate, respectively, corresponded to the sensor area. The area of the container corresponds to the area of the aperture plate.
- Other advantages and novel features will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
- Many aspects of the present camera module can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present camera module. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled, isometric view of a camera module, in accordance with a preferred embodiment; -
FIG. 2 is an exploded, isometric view of the camera module inFIG. 1 ; and -
FIG. 3 is a cross-sectional view of a spacer, taken along line III-III withinFIG. 2 . - Referring to
FIG. 1 andFIG. 2 , a preferred embodiment of acamera module 100 includes, from bottom to top, animage sensor 10, aspacer 12, alens module 14, and anaperture plate 16. Thecamera module 100 further includes a signal processor (not shown) electronically connected with theimage sensor 10. - The
image sensor 10 is at least one item selected from the group consisting of a complementary metal oxide semiconductor (CMOS) image sensor and a charge coupled device (CCD) image sensor. Theimage sensor 10 includes abase 102 and a sensor area/region 104 in the center of the base 102 (i.e., centered upon the base 102). To maximize the image sensing ability of theimage sensor 10, it is advantageous for thesensor area 104 to occupy a major portion (e.g., ˜70% or more) of the total area available on thebase 102. - Referring also to
FIG. 3 , thespacer 12 has a similar shape to thesensor area 104. A plurality oflight holes 120 is defined through thespacer 12. Theimage sensor 10 receives light through thelight holes 120. Each of the plurality oflight holes 120 is a bell-mouthed hole. That is, a cross-sectional plane of each of the plurality oflight holes 120 is trapezoidal in shape, wherein the wider end of the trapezoid is located towards (i.e., proximate or adjacent) theimage sensor 10. There is a near zero-distance between the corresponding larger ends of each pair of neighboringlight holes 120, so that the negative optical effect caused by an interval between the neighboringlight holes 120 can be avoided or at least greatly minimized. - The
lens module 14 includes a plurality oflenses 140 and atray 142 configured for carrying/containing thelenses 140. Each of thelenses 140 is a spherical or aspherical optical lens. A plurality of containing holes (not labeled) is defined through thetray 142. The plurality of containing holes is arranged in an array. The containing holes are used for containing/holding therespective lenses 140. The size of each containing hole corresponds to that of thelenses 140. When thelenses 140 are put in thetray 14, there is no negative effect on the optics of thelenses 140. - The
aperture plate 16 has a plurality of throughholes 160 defined therethrough. The distribution of thethrough holes 160 is essentially identical to that of thelenses 140 and, thus, corresponds to the layout of the containing holes in thetray 142. Thelenses 140 can receive light through the throughholes 160. Each of thethrough holes 160 is a bell-mouthed hole opening outwardly. The size of each of thethrough holes 160 corresponds to the size of the optical part of alens 140. It should be understood that thethrough holes 160 can be omitted and be replaced with a transparent material. In either case, the throughholes 160 or the transparent material serves as a light permeable portion. Through such light permeable portions, thelenses 140 are able to receive light. - The area of the
spacer 12, thetray 142, and theaperture 16 is about the same. Thelight holes 120, the containing holes, and the throughholes 160 are arranged in the same pattern/configuration. The area of thelight hole 120 is larger than that of the light permeable portion, so that thecamera module 100 can better receive light. Theaperture plate 16, thelens module 14, and thespacer 12 are deposited on thesensor area 104 of theimage sensor 10. Each of thelight holes 120 is positioned corresponding to arespective lens 140, positioned in the corresponding containing hole, and to a respective throughhole 160. Theimage sensor 10 receives theouter light 10 through the plurality oflenses 140 and processes the light to form image signals. The image signals are sent to a signal processor (not shown) by theimage sensor 10. The signal processor consolidates the respective images from each of thelenses 140 to remove any alignment errors, so that a final image can be reconstructed. Of course, the signal processor can be replaced with a program used in theimage sensor 10. The program can be used for image consolidation and correction. - It should be understood that each of the
through holes 160 may be staggered a little with respect to each of thecorresponding light holes 120, so that different view fields can be sufficiently covered. Thespacer 12,tray 142, and theaperture plate 16 are, advantageously, made of plastic and connected together by epoxy resin or another suitable adhesive. Thelenses 140 and thetray 142 can, alternatively, be formed as a single-piece unit, and, thus, the containing holes in thetray 142 can be omitted. Thespacer 12 can be omitted. In an instance where thespacer 12 is omitted, the thickness of thetray 142 is larger than that of thelenses 140, so that thelens module 14 can be positioned directly on thesensor area 104 of theimage sensor 10. With thelenses 140 distributed in an array in the manner of the present system, thecamera module 100 is thinner than the traditional camera module. - It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (9)
1. A camera module, comprising:
an image sensor including a base and a sensor area located in the center of the base;
a lens module including a plurality of lenses and a container for holding the lenses, the lenses being distributed in an array within the container; and
an aperture plate including a plurality of light permeable portions located corresponding to respective lens positions;
wherein the lens module and the aperture plate respectively correspond to the sensor area, and the area of the container corresponds to the area of the aperture plate.
2. The camera module as claimed in claim 1 , wherein the camera module further comprises a spacer provided between the image sensor and the lens module; the area of the spacer corresponds to the area of the container and the area of the aperture plate; a plurality of light holes are defined through the spacer; and the distribution of the light holes corresponds to the distribution of the lenses and the light permeable portions.
3. The camera module as claimed in claim 2 , wherein the plurality of light permeable portions is comprised of at least one of a plurality of through holes defined through the spacer and a transparent material.
4. The camera module as claimed in claim 3 , wherein each of the light permeable holes is a bell-mouthed-shaped hole, a cross-sectional plane of each such bell-mouthed-shaped hole being trapezoidal in shape, a larger end of the trapezoid being located towards the image sensor.
5. The camera module as claimed in claim 4 , wherein a near zero-distance exists between the corresponding larger ends of each pair of neighboring light holes.
6. The camera module as claimed in claim 1 , wherein the container is a tray with a plurality of containing holes defined therethrough, the size of each containing hole corresponding to a respective one of the lenses.
7. The camera module as claimed in claim 1 , wherein the lenses and the container are formed in a single unit, and a thickness of the container is larger than a respective thickness of each of the lenses.
8. The camera module as claimed in claim 2 , wherein the spacer, tray and the aperture plate are made of plastic and assembled together by epoxy resin.
9. The camera module as claimed in claim 1 , wherein each of the lenses is a spherical or aspherical optical lens.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610157034.7 | 2006-11-24 | ||
| CN2006101570347A CN101191885B (en) | 2006-11-24 | 2006-11-24 | Array type camera module group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20080122966A1 true US20080122966A1 (en) | 2008-05-29 |
Family
ID=39463277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/681,723 Abandoned US20080122966A1 (en) | 2006-11-24 | 2007-03-02 | Camera module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20080122966A1 (en) |
| CN (1) | CN101191885B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090050946A1 (en) * | 2004-07-25 | 2009-02-26 | Jacques Duparre | Camera module, array based thereon, and method for the production thereof |
| US20110026141A1 (en) * | 2009-07-29 | 2011-02-03 | Geoffrey Louis Barrows | Low Profile Camera and Vision Sensor |
| US20110204209A1 (en) * | 2009-07-29 | 2011-08-25 | Geoffrey Louis Barrows | Low profile camera and vision sensor |
| USD737362S1 (en) * | 2013-03-05 | 2015-08-25 | Hon Hai Precision Industry Co., Ltd. | Camera calibration board |
| US20150281601A1 (en) * | 2014-03-25 | 2015-10-01 | INVIS Technologies Corporation | Modular Packaging and Optical System for Multi-Aperture and Multi-Spectral Camera Core |
| USD921738S1 (en) * | 2016-11-10 | 2021-06-08 | Shafagh Bayat | Thin film camera |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101598844B (en) * | 2008-06-05 | 2011-11-30 | 鸿富锦精密工业(深圳)有限公司 | Camera module |
| CN101852908B (en) * | 2009-03-30 | 2013-03-27 | 鸿富锦精密工业(深圳)有限公司 | Wafer-level lens module array |
| CN102131043B (en) * | 2010-01-19 | 2013-11-06 | 鸿富锦精密工业(深圳)有限公司 | Camera module |
| CN102790849A (en) * | 2011-05-20 | 2012-11-21 | 英属开曼群岛商恒景科技股份有限公司 | Image sensor module |
| CN103822770A (en) * | 2012-11-16 | 2014-05-28 | 鸿富锦精密工业(深圳)有限公司 | Drop test device |
| CN103905713B (en) * | 2012-12-26 | 2018-02-27 | 联想(北京)有限公司 | Control method, control device and electronic equipment |
| CN106027861B (en) * | 2016-05-23 | 2019-06-04 | 西北工业大学 | Light field acquisition device and data processing method based on micro-camera array |
| TWI600321B (en) * | 2016-12-13 | 2017-09-21 | 財團法人工業技術研究院 | Composite array camera lens module |
| CN107450149A (en) * | 2017-08-31 | 2017-12-08 | 赣州光联电子科技有限公司 | A kind of lens fixing device for installing and installing and fixing method |
| CN109254379A (en) * | 2018-11-21 | 2019-01-22 | 中国科学院上海技术物理研究所 | A multi-lens integrated assembly for cryogenic applications |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020135825A1 (en) * | 2000-07-14 | 2002-09-26 | Chih-Kung Lee | High light-sensing efficiency image sensor apparatus and method |
| US20030102483A1 (en) * | 2001-12-04 | 2003-06-05 | Toshio Yamamoto | Method of manufacturing optical semiconductor device |
| US20040257441A1 (en) * | 2001-08-29 | 2004-12-23 | Geovantage, Inc. | Digital imaging system for airborne applications |
| US7009652B1 (en) * | 1999-08-20 | 2006-03-07 | Minolta Co. Ltd | Image input apparatus |
| US20070097249A1 (en) * | 2004-10-28 | 2007-05-03 | Tsuguhiro Korenaga | Camera module |
-
2006
- 2006-11-24 CN CN2006101570347A patent/CN101191885B/en not_active Expired - Fee Related
-
2007
- 2007-03-02 US US11/681,723 patent/US20080122966A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7009652B1 (en) * | 1999-08-20 | 2006-03-07 | Minolta Co. Ltd | Image input apparatus |
| US20020135825A1 (en) * | 2000-07-14 | 2002-09-26 | Chih-Kung Lee | High light-sensing efficiency image sensor apparatus and method |
| US20040257441A1 (en) * | 2001-08-29 | 2004-12-23 | Geovantage, Inc. | Digital imaging system for airborne applications |
| US20030102483A1 (en) * | 2001-12-04 | 2003-06-05 | Toshio Yamamoto | Method of manufacturing optical semiconductor device |
| US20070097249A1 (en) * | 2004-10-28 | 2007-05-03 | Tsuguhiro Korenaga | Camera module |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090050946A1 (en) * | 2004-07-25 | 2009-02-26 | Jacques Duparre | Camera module, array based thereon, and method for the production thereof |
| US8106979B2 (en) * | 2004-07-28 | 2012-01-31 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Camera module and array based thereon |
| US20110026141A1 (en) * | 2009-07-29 | 2011-02-03 | Geoffrey Louis Barrows | Low Profile Camera and Vision Sensor |
| WO2011014472A3 (en) * | 2009-07-29 | 2011-05-05 | Geoffrey Louis Barrows | Low profile camera and vision sensor |
| US20110204209A1 (en) * | 2009-07-29 | 2011-08-25 | Geoffrey Louis Barrows | Low profile camera and vision sensor |
| US8629389B2 (en) | 2009-07-29 | 2014-01-14 | Geoffrey Louis Barrows | Low profile camera and vision sensor |
| USD737362S1 (en) * | 2013-03-05 | 2015-08-25 | Hon Hai Precision Industry Co., Ltd. | Camera calibration board |
| US20150281601A1 (en) * | 2014-03-25 | 2015-10-01 | INVIS Technologies Corporation | Modular Packaging and Optical System for Multi-Aperture and Multi-Spectral Camera Core |
| USD921738S1 (en) * | 2016-11-10 | 2021-06-08 | Shafagh Bayat | Thin film camera |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101191885A (en) | 2008-06-04 |
| CN101191885B (en) | 2011-07-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FENG, CHEN;LEE, MING;REEL/FRAME:018955/0220;SIGNING DATES FROM 20061207 TO 20061219 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |