[go: up one dir, main page]

US20080122966A1 - Camera module - Google Patents

Camera module Download PDF

Info

Publication number
US20080122966A1
US20080122966A1 US11/681,723 US68172307A US2008122966A1 US 20080122966 A1 US20080122966 A1 US 20080122966A1 US 68172307 A US68172307 A US 68172307A US 2008122966 A1 US2008122966 A1 US 2008122966A1
Authority
US
United States
Prior art keywords
lenses
camera module
area
container
aperture plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/681,723
Inventor
Chen Feng
Ming Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, MING, FENG, CHEN
Publication of US20080122966A1 publication Critical patent/US20080122966A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/804Containers or encapsulations
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention generally relates to camera modules and, especially, to a camera module with a low profile.
  • digital camera modules are in widespread use in a variety of portable electronic devices.
  • digital camera modules are now widely available as a special feature for mobile phones, and since the mobile phones have become smaller and smaller, the digital camera modules used in the mobile phones are also becoming correspondingly reduced in size.
  • a camera module includes an image sensor, a lens module, an aperture plate, and a signal processor.
  • the image senor includes a base and a sensor area located in the center of the base.
  • the lens module includes a plurality of lenses and a container configured (i.e., structured and arranged) for containing/carrying the lenses, and the lenses are distributed in an array within the container.
  • the aperture plate includes a plurality of light permeable portions located at positions corresponding to the respective lenses.
  • the signal processor is electronically connected with the image sensor and is configured for processing the signals from the image sensor.
  • the lens module and the aperture plate respectively, corresponded to the sensor area.
  • the area of the container corresponds to the area of the aperture plate.
  • FIG. 1 is an assembled, isometric view of a camera module, in accordance with a preferred embodiment
  • FIG. 2 is an exploded, isometric view of the camera module in FIG. 1 ;
  • FIG. 3 is a cross-sectional view of a spacer, taken along line III-III within FIG. 2 .
  • a preferred embodiment of a camera module 100 includes, from bottom to top, an image sensor 10 , a spacer 12 , a lens module 14 , and an aperture plate 16 .
  • the camera module 100 further includes a signal processor (not shown) electronically connected with the image sensor 10 .
  • the image sensor 10 is at least one item selected from the group consisting of a complementary metal oxide semiconductor (CMOS) image sensor and a charge coupled device (CCD) image sensor.
  • CMOS complementary metal oxide semiconductor
  • CCD charge coupled device
  • the image sensor 10 includes a base 102 and a sensor area/region 104 in the center of the base 102 (i.e., centered upon the base 102 ).
  • the sensor area 104 it is advantageous for the sensor area 104 to occupy a major portion (e.g., ⁇ 70% or more) of the total area available on the base 102 .
  • the spacer 12 has a similar shape to the sensor area 104 .
  • a plurality of light holes 120 is defined through the spacer 12 .
  • the image sensor 10 receives light through the light holes 120 .
  • Each of the plurality of light holes 120 is a bell-mouthed hole. That is, a cross-sectional plane of each of the plurality of light holes 120 is trapezoidal in shape, wherein the wider end of the trapezoid is located towards (i.e., proximate or adjacent) the image sensor 10 .
  • There is a near zero-distance between the corresponding larger ends of each pair of neighboring light holes 120 so that the negative optical effect caused by an interval between the neighboring light holes 120 can be avoided or at least greatly minimized.
  • the lens module 14 includes a plurality of lenses 140 and a tray 142 configured for carrying/containing the lenses 140 .
  • Each of the lenses 140 is a spherical or aspherical optical lens.
  • a plurality of containing holes (not labeled) is defined through the tray 142 .
  • the plurality of containing holes is arranged in an array.
  • the containing holes are used for containing/holding the respective lenses 140 .
  • the size of each containing hole corresponds to that of the lenses 140 .
  • the aperture plate 16 has a plurality of through holes 160 defined therethrough.
  • the distribution of the through holes 160 is essentially identical to that of the lenses 140 and, thus, corresponds to the layout of the containing holes in the tray 142 .
  • the lenses 140 can receive light through the through holes 160 .
  • Each of the through holes 160 is a bell-mouthed hole opening outwardly.
  • the size of each of the through holes 160 corresponds to the size of the optical part of a lens 140 .
  • the through holes 160 can be omitted and be replaced with a transparent material. In either case, the through holes 160 or the transparent material serves as a light permeable portion. Through such light permeable portions, the lenses 140 are able to receive light.
  • the area of the spacer 12 , the tray 142 , and the aperture 16 is about the same.
  • the light holes 120 , the containing holes, and the through holes 160 are arranged in the same pattern/configuration.
  • the area of the light hole 120 is larger than that of the light permeable portion, so that the camera module 100 can better receive light.
  • the aperture plate 16 , the lens module 14 , and the spacer 12 are deposited on the sensor area 104 of the image sensor 10 .
  • Each of the light holes 120 is positioned corresponding to a respective lens 140 , positioned in the corresponding containing hole, and to a respective through hole 160 .
  • the image sensor 10 receives the outer light 10 through the plurality of lenses 140 and processes the light to form image signals.
  • the image signals are sent to a signal processor (not shown) by the image sensor 10 .
  • the signal processor consolidates the respective images from each of the lenses 140 to remove any alignment errors, so that a final image can be reconstructed.
  • the signal processor can be replaced with a program used in the image sensor 10 .
  • the program can be used for image consolidation and correction.
  • each of the through holes 160 may be staggered a little with respect to each of the corresponding light holes 120 , so that different view fields can be sufficiently covered.
  • the spacer 12 , tray 142 , and the aperture plate 16 are, advantageously, made of plastic and connected together by epoxy resin or another suitable adhesive.
  • the lenses 140 and the tray 142 can, alternatively, be formed as a single-piece unit, and, thus, the containing holes in the tray 142 can be omitted.
  • the spacer 12 can be omitted. In an instance where the spacer 12 is omitted, the thickness of the tray 142 is larger than that of the lenses 140 , so that the lens module 14 can be positioned directly on the sensor area 104 of the image sensor 10 . With the lenses 140 distributed in an array in the manner of the present system, the camera module 100 is thinner than the traditional camera module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)

Abstract

A camera module (100) includes an image sensor (10), a lens module (14), and an aperture plate (16). The image senor includes a base (102) and a sensor area/region (104) located in the center of the base. The lens module (14) incorporates a plurality of lenses (140) and a container (142) for holding the lenses, the lenses being distributed in an array within the container. The aperture plate has a plurality of light permeable portions located at positions corresponding to the respective lenses. The lens module and the aperture plate correspond to the sensor area of the image sensor. The area of the container corresponds to the area of the aperture plate.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention generally relates to camera modules and, especially, to a camera module with a low profile.
  • 2. Description of Related Art
  • Nowadays, digital camera modules are in widespread use in a variety of portable electronic devices. For example, digital camera modules are now widely available as a special feature for mobile phones, and since the mobile phones have become smaller and smaller, the digital camera modules used in the mobile phones are also becoming correspondingly reduced in size.
  • To achieve ultra small cameras or “card cameras”, various efforts have be made to improve such camera technology, but, due to technical difficulties and performance limitations, the development of the ultra small camera is still suffering problems.
  • Accordingly, what is needed is a low profile camera module.
  • SUMMARY
  • In one aspect thereof, a camera module includes an image sensor, a lens module, an aperture plate, and a signal processor. The image senor includes a base and a sensor area located in the center of the base. The lens module includes a plurality of lenses and a container configured (i.e., structured and arranged) for containing/carrying the lenses, and the lenses are distributed in an array within the container. The aperture plate includes a plurality of light permeable portions located at positions corresponding to the respective lenses. The signal processor is electronically connected with the image sensor and is configured for processing the signals from the image sensor. The lens module and the aperture plate, respectively, corresponded to the sensor area. The area of the container corresponds to the area of the aperture plate.
  • Other advantages and novel features will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present camera module can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present camera module. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an assembled, isometric view of a camera module, in accordance with a preferred embodiment;
  • FIG. 2 is an exploded, isometric view of the camera module in FIG. 1; and
  • FIG. 3 is a cross-sectional view of a spacer, taken along line III-III within FIG. 2.
  • DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIG. 1 and FIG. 2, a preferred embodiment of a camera module 100 includes, from bottom to top, an image sensor 10, a spacer 12, a lens module 14, and an aperture plate 16. The camera module 100 further includes a signal processor (not shown) electronically connected with the image sensor 10.
  • The image sensor 10 is at least one item selected from the group consisting of a complementary metal oxide semiconductor (CMOS) image sensor and a charge coupled device (CCD) image sensor. The image sensor 10 includes a base 102 and a sensor area/region 104 in the center of the base 102 (i.e., centered upon the base 102). To maximize the image sensing ability of the image sensor 10, it is advantageous for the sensor area 104 to occupy a major portion (e.g., ˜70% or more) of the total area available on the base 102.
  • Referring also to FIG. 3, the spacer 12 has a similar shape to the sensor area 104. A plurality of light holes 120 is defined through the spacer 12. The image sensor 10 receives light through the light holes 120. Each of the plurality of light holes 120 is a bell-mouthed hole. That is, a cross-sectional plane of each of the plurality of light holes 120 is trapezoidal in shape, wherein the wider end of the trapezoid is located towards (i.e., proximate or adjacent) the image sensor 10. There is a near zero-distance between the corresponding larger ends of each pair of neighboring light holes 120, so that the negative optical effect caused by an interval between the neighboring light holes 120 can be avoided or at least greatly minimized.
  • The lens module 14 includes a plurality of lenses 140 and a tray 142 configured for carrying/containing the lenses 140. Each of the lenses 140 is a spherical or aspherical optical lens. A plurality of containing holes (not labeled) is defined through the tray 142. The plurality of containing holes is arranged in an array. The containing holes are used for containing/holding the respective lenses 140. The size of each containing hole corresponds to that of the lenses 140. When the lenses 140 are put in the tray 14, there is no negative effect on the optics of the lenses 140.
  • The aperture plate 16 has a plurality of through holes 160 defined therethrough. The distribution of the through holes 160 is essentially identical to that of the lenses 140 and, thus, corresponds to the layout of the containing holes in the tray 142. The lenses 140 can receive light through the through holes 160. Each of the through holes 160 is a bell-mouthed hole opening outwardly. The size of each of the through holes 160 corresponds to the size of the optical part of a lens 140. It should be understood that the through holes 160 can be omitted and be replaced with a transparent material. In either case, the through holes 160 or the transparent material serves as a light permeable portion. Through such light permeable portions, the lenses 140 are able to receive light.
  • The area of the spacer 12, the tray 142, and the aperture 16 is about the same. The light holes 120, the containing holes, and the through holes 160 are arranged in the same pattern/configuration. The area of the light hole 120 is larger than that of the light permeable portion, so that the camera module 100 can better receive light. The aperture plate 16, the lens module 14, and the spacer 12 are deposited on the sensor area 104 of the image sensor 10. Each of the light holes 120 is positioned corresponding to a respective lens 140, positioned in the corresponding containing hole, and to a respective through hole 160. The image sensor 10 receives the outer light 10 through the plurality of lenses 140 and processes the light to form image signals. The image signals are sent to a signal processor (not shown) by the image sensor 10. The signal processor consolidates the respective images from each of the lenses 140 to remove any alignment errors, so that a final image can be reconstructed. Of course, the signal processor can be replaced with a program used in the image sensor 10. The program can be used for image consolidation and correction.
  • It should be understood that each of the through holes 160 may be staggered a little with respect to each of the corresponding light holes 120, so that different view fields can be sufficiently covered. The spacer 12, tray 142, and the aperture plate 16 are, advantageously, made of plastic and connected together by epoxy resin or another suitable adhesive. The lenses 140 and the tray 142 can, alternatively, be formed as a single-piece unit, and, thus, the containing holes in the tray 142 can be omitted. The spacer 12 can be omitted. In an instance where the spacer 12 is omitted, the thickness of the tray 142 is larger than that of the lenses 140, so that the lens module 14 can be positioned directly on the sensor area 104 of the image sensor 10. With the lenses 140 distributed in an array in the manner of the present system, the camera module 100 is thinner than the traditional camera module.
  • It is to be understood, however, that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (9)

1. A camera module, comprising:
an image sensor including a base and a sensor area located in the center of the base;
a lens module including a plurality of lenses and a container for holding the lenses, the lenses being distributed in an array within the container; and
an aperture plate including a plurality of light permeable portions located corresponding to respective lens positions;
wherein the lens module and the aperture plate respectively correspond to the sensor area, and the area of the container corresponds to the area of the aperture plate.
2. The camera module as claimed in claim 1, wherein the camera module further comprises a spacer provided between the image sensor and the lens module; the area of the spacer corresponds to the area of the container and the area of the aperture plate; a plurality of light holes are defined through the spacer; and the distribution of the light holes corresponds to the distribution of the lenses and the light permeable portions.
3. The camera module as claimed in claim 2, wherein the plurality of light permeable portions is comprised of at least one of a plurality of through holes defined through the spacer and a transparent material.
4. The camera module as claimed in claim 3, wherein each of the light permeable holes is a bell-mouthed-shaped hole, a cross-sectional plane of each such bell-mouthed-shaped hole being trapezoidal in shape, a larger end of the trapezoid being located towards the image sensor.
5. The camera module as claimed in claim 4, wherein a near zero-distance exists between the corresponding larger ends of each pair of neighboring light holes.
6. The camera module as claimed in claim 1, wherein the container is a tray with a plurality of containing holes defined therethrough, the size of each containing hole corresponding to a respective one of the lenses.
7. The camera module as claimed in claim 1, wherein the lenses and the container are formed in a single unit, and a thickness of the container is larger than a respective thickness of each of the lenses.
8. The camera module as claimed in claim 2, wherein the spacer, tray and the aperture plate are made of plastic and assembled together by epoxy resin.
9. The camera module as claimed in claim 1, wherein each of the lenses is a spherical or aspherical optical lens.
US11/681,723 2006-11-24 2007-03-02 Camera module Abandoned US20080122966A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN200610157034.7 2006-11-24
CN2006101570347A CN101191885B (en) 2006-11-24 2006-11-24 Array type camera module group

Publications (1)

Publication Number Publication Date
US20080122966A1 true US20080122966A1 (en) 2008-05-29

Family

ID=39463277

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/681,723 Abandoned US20080122966A1 (en) 2006-11-24 2007-03-02 Camera module

Country Status (2)

Country Link
US (1) US20080122966A1 (en)
CN (1) CN101191885B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090050946A1 (en) * 2004-07-25 2009-02-26 Jacques Duparre Camera module, array based thereon, and method for the production thereof
US20110026141A1 (en) * 2009-07-29 2011-02-03 Geoffrey Louis Barrows Low Profile Camera and Vision Sensor
US20110204209A1 (en) * 2009-07-29 2011-08-25 Geoffrey Louis Barrows Low profile camera and vision sensor
USD737362S1 (en) * 2013-03-05 2015-08-25 Hon Hai Precision Industry Co., Ltd. Camera calibration board
US20150281601A1 (en) * 2014-03-25 2015-10-01 INVIS Technologies Corporation Modular Packaging and Optical System for Multi-Aperture and Multi-Spectral Camera Core
USD921738S1 (en) * 2016-11-10 2021-06-08 Shafagh Bayat Thin film camera

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101598844B (en) * 2008-06-05 2011-11-30 鸿富锦精密工业(深圳)有限公司 Camera module
CN101852908B (en) * 2009-03-30 2013-03-27 鸿富锦精密工业(深圳)有限公司 Wafer-level lens module array
CN102131043B (en) * 2010-01-19 2013-11-06 鸿富锦精密工业(深圳)有限公司 Camera module
CN102790849A (en) * 2011-05-20 2012-11-21 英属开曼群岛商恒景科技股份有限公司 Image sensor module
CN103822770A (en) * 2012-11-16 2014-05-28 鸿富锦精密工业(深圳)有限公司 Drop test device
CN103905713B (en) * 2012-12-26 2018-02-27 联想(北京)有限公司 Control method, control device and electronic equipment
CN106027861B (en) * 2016-05-23 2019-06-04 西北工业大学 Light field acquisition device and data processing method based on micro-camera array
TWI600321B (en) * 2016-12-13 2017-09-21 財團法人工業技術研究院 Composite array camera lens module
CN107450149A (en) * 2017-08-31 2017-12-08 赣州光联电子科技有限公司 A kind of lens fixing device for installing and installing and fixing method
CN109254379A (en) * 2018-11-21 2019-01-22 中国科学院上海技术物理研究所 A multi-lens integrated assembly for cryogenic applications

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020135825A1 (en) * 2000-07-14 2002-09-26 Chih-Kung Lee High light-sensing efficiency image sensor apparatus and method
US20030102483A1 (en) * 2001-12-04 2003-06-05 Toshio Yamamoto Method of manufacturing optical semiconductor device
US20040257441A1 (en) * 2001-08-29 2004-12-23 Geovantage, Inc. Digital imaging system for airborne applications
US7009652B1 (en) * 1999-08-20 2006-03-07 Minolta Co. Ltd Image input apparatus
US20070097249A1 (en) * 2004-10-28 2007-05-03 Tsuguhiro Korenaga Camera module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7009652B1 (en) * 1999-08-20 2006-03-07 Minolta Co. Ltd Image input apparatus
US20020135825A1 (en) * 2000-07-14 2002-09-26 Chih-Kung Lee High light-sensing efficiency image sensor apparatus and method
US20040257441A1 (en) * 2001-08-29 2004-12-23 Geovantage, Inc. Digital imaging system for airborne applications
US20030102483A1 (en) * 2001-12-04 2003-06-05 Toshio Yamamoto Method of manufacturing optical semiconductor device
US20070097249A1 (en) * 2004-10-28 2007-05-03 Tsuguhiro Korenaga Camera module

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090050946A1 (en) * 2004-07-25 2009-02-26 Jacques Duparre Camera module, array based thereon, and method for the production thereof
US8106979B2 (en) * 2004-07-28 2012-01-31 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Camera module and array based thereon
US20110026141A1 (en) * 2009-07-29 2011-02-03 Geoffrey Louis Barrows Low Profile Camera and Vision Sensor
WO2011014472A3 (en) * 2009-07-29 2011-05-05 Geoffrey Louis Barrows Low profile camera and vision sensor
US20110204209A1 (en) * 2009-07-29 2011-08-25 Geoffrey Louis Barrows Low profile camera and vision sensor
US8629389B2 (en) 2009-07-29 2014-01-14 Geoffrey Louis Barrows Low profile camera and vision sensor
USD737362S1 (en) * 2013-03-05 2015-08-25 Hon Hai Precision Industry Co., Ltd. Camera calibration board
US20150281601A1 (en) * 2014-03-25 2015-10-01 INVIS Technologies Corporation Modular Packaging and Optical System for Multi-Aperture and Multi-Spectral Camera Core
USD921738S1 (en) * 2016-11-10 2021-06-08 Shafagh Bayat Thin film camera

Also Published As

Publication number Publication date
CN101191885A (en) 2008-06-04
CN101191885B (en) 2011-07-27

Similar Documents

Publication Publication Date Title
US20080122966A1 (en) Camera module
US12100239B2 (en) Display component, display screen, and electronic device
US8289409B2 (en) Compact camera module with lens array
EP2259096A1 (en) Wafer-level lens module and image pickup module including the same
US20100032781A1 (en) Camera module and method of manufacturing the same
US8125720B2 (en) Miniature image capture lens
TW200404166A (en) Image pickup lens, image pickup unit and portable terminal
CN101888476B (en) Camera module
US20150116527A1 (en) Compact array camera modules having an extended field of view from which depth information can be extracted
US7563037B2 (en) Digital camera module and lens used therein
US7894143B2 (en) Image capture lens
US7697061B2 (en) Apparatus for increasing field of view of an optical system
CN110620861A (en) Image sensor, camera module and terminal
KR20120050427A (en) Lens and applications thereof
US20100110569A1 (en) Lens system
US8194334B2 (en) Image capture lens modules and image capture systems
KR100874628B1 (en) Imaging lens
US20050133689A1 (en) Image sensor with diffraction raster array
CN113777754A (en) Lens system, optical fingerprint identification device and terminal equipment
CN113325547A (en) Lens module, camera device and electronic equipment
US9429688B2 (en) Image capturing device having lens with low lens sag
CN206532016U (en) Camera lens module
US8289634B2 (en) Image capture lens modules
US7826154B2 (en) Portable electronic device
CN111142215B (en) Optical components, identification modules and mobile terminals

Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FENG, CHEN;LEE, MING;REEL/FRAME:018955/0220;SIGNING DATES FROM 20061207 TO 20061219

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION