US20070175614A1

US20070175614A1 - Loop heat exchange apparatus

Info

Publication number: US20070175614A1
Application number: US11/341,465
Authority: US
Inventors: Jia-Hao Li
Original assignee: Jaffe Ltd
Current assignee: Jaffe Ltd
Priority date: 2006-01-30
Filing date: 2006-01-30
Publication date: 2007-08-02

Abstract

A loop heat exchange apparatus for dissipating heat generated from a plurality of heat sources includes at least a first heat pipe having a heat reception portion, a plurality of second heat pipes each having a condensation portion, a plurality of evaporators disposed on the first heat pipe for contacting the heat source, and a connection mechanism. One end of the second heat pipes is inserted in the evaporator, while the other end of the second heat pipes is inserted to the connection mechanism of the first heat pipe. The evaporator and the connection mechanism are drilled, cleaned, filled with working fluid, evacuated and sealed. In this manner, the first heat pipe and the second heat pipes can form a tightly sealed loop heat exchange apparatus, which can perform heat exchange simultaneously with a plurality of heat sources.

Description

BACKGROUND OF THE INVENTION

The present invention relates generally to a loop heat exchange apparatus, and more particularly to a loop heat exchange apparatus that can perform heat exchange with a plurality of heat sources.
Modern computers have gained more and more computing power, and faster and faster operation speed. The computer industry has also revolutionized the way computers are made and designed. The new generation central processing unit provided the enhanced computing power. However, it also generates a huge amount of heat, which should be properly dissipated. It is important to use an efficient cooling system, such that the central processing unit can operate under a normal working temperature. Currently, a heat pipe that is highly thermal conductive, that can rapidly dissipate heat without consuming electricity, and that is light in weight, is used to satisfy the demand in electronic products.
Normally speaking, when the opening of a heat pipe is sealed, a circular disc on a processing machine is used. A plurality of clamps is disposed on the circular disc. The clamps are provided for holding and fastening the heat pipes. In addition, a plurality of work stations is disposed surrounding the edge of the circular disc. Each work station includes a sealing mechanism. The sealing mechanism includes a welding torch. The heat pipes are intermittently carried to the sealing mechanism by the rotation of the disc, which allows the torch to seal the heat pipe sequentially.
However, since the heat pipe does not rotate when one is sealing its opening, the welding bath will drain down due to gravity before solidification, which renders it difficult to seal the upper portion of the heat pipe, thereby inducing defects, such as being ripped or thinned. Thus, the opening of the heat pipe is not properly sealed. Particularly, the heat pipe fabricated for dissipating heat from a plurality of heat sources is even harder to manufacture.
Accordingly, the inventor of the present invention realized the drawbacks in the conventional art, and developed the present invention that can overcome the drawbacks described above.

BRIEF SUMMARY OF THE INVENTION

The present invention is to provide a loop heat exchange apparatus that can easily and quickly assemble a first heat pipe having a heat reception portion, a plurality of second heat pipes each having a condensation portion, such that the two heat pipes are communicably connected. The loop heat exchange apparatus of the present invention can perform heat exchange simultaneously with a plurality of heat sources.
One particular feature of the present invention is in that the loop heat exchange apparatus includes at least a first heat pipe having a heat reception portion, a plurality of second heat pipes each having a condensation portion, a plurality of evaporators disposed on the first heat pipe for contacting the heat source, and a connection mechanism. One end of the second heat pipes is inserted in the evaporator, while the other end of the second heat pipes is inserted to the connection mechanism of the first heat pipe. The evaporator and the connection mechanism are drilled, cleaned, filled with working fluid, evacuated and sealed. In this manner, the first heat pipe and the second heat pipes can form a tightly sealed loop heat exchange apparatus, which can perform heat exchange simultaneously with a plurality of heat sources.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a loop heat exchange apparatus of the present invention.
FIG. 2 is a sectional view illustrating two heat conductive pipes being disposed to an evaporator of the present invention.
FIG. 3 is a sectional view illustrating two heat conductive pipes being disposed to an evaporator of the present invention in another viewing angle.
FIG. 4 is a sectional view illustrating two heat conductive pipes being disposed to an connection mechanism of the present invention.
FIG. 5 is a sectional view illustrating two heat conductive pipes being disposed to a connection mechanism of the present invention in another viewing angle.
FIG. 6 illustrates a loop heat exchange system in accordance with another embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

In order to better understanding the features and technical contents of the present invention, the present invention is hereinafter described in detail by incorporating with the accompanying drawings. However, the accompanying drawings are only for the convenience of illustration and description, no limitation is intended thereto.
Referring to FIG. 1, a loop heat exchange apparatus of the present invention is illustrated. As shown, the loop heat exchange apparatus 10 can simultaneously dissipate heat generated from a plurality of heat sources 20. The loop heat exchange apparatus 10 includes at least a first heat pipe 1 having a heat accepting portion, a plurality of second heat pipes 2 each having a condensation portion, a plurality of evaporators 3 being disposed to the first heat pipe 1 corresponding to the heat sources 20, and a connection mechanism 4.
The first heat pipe 1 includes a working fluid or a capillary structure 11. The heat reception portion is disposed corresponding to the heat source 20, e.g. CPU, thereby allowing the heat generated from the operation of heat source 20 to transfer to the first heat pipe 1. The temperature of the working fluid will increase after the heat exchange is performed on the working fluid or the capillary structure 11. Then, the working fluid is transfer to the condensation portion of the second heat pipe 2 for further heat exchange. The condensation portion of the second heat pipe is composed of a plurality of cooling fins 21. The hot working fluid is condensed back to liquid phase by performing heat exchange with the cooling fins 21 and transported to the first heat pipe 1.
Referring again to FIG. 1, in this particular embodiment, the loop heat exchange apparatus of the present invention will dissipate heat on three heat sources 20. Therefore, a horizontally disposed first heat pipe 1 is provided. One pipe end of the first heat pipe 1 is not sealed. In addition, an evaporator 3 is disposed to the first heat pipe 1 corresponding to the heat sources 20. The unsealed pipe opening 12 is inserted into a connection mechanism 4.
Referring also to FIG. 2 and FIG. 3, the evaporator is made of a heat conductive material, such as copper. The evaporator 3 includes a connection body 31. One side of the connection body 31 includes a first through hole 32 and a second through hole 33 for inserting therein a first heat pipe 1 and a second heat pipe 2. In this particular embodiment, the first through hole is a penetrating hole for a sealed pipe opening 13 of the first heat pipe 2 to penetrate therethrough. The second through hole 33 is a blind hole. In addition, a communicable hole 34 is drilled from one side of the connection body 31 perpendicular to the first heat pipe 1 and the second heat pipe 2 to the other side of the first heat pipe 1 and the second heat pipe 2, thereby communicably connecting the heat pipes 1, 2.
Referring to FIG. 4 and FIG. 5, the structures of the connection mechanism 4 and the evaporator 3 are substantially the same, which also includes a connection body 41. One side surface of the connection body 41 includes a first through hole 42 and a plurality of second through holes 43 for the firs heat pipe 1 and the second heat pipes 2 to dispose therein. The first through hole 42 is a penetrating hole for the unsealed pipe opening 12 of the first heat pipe 1 to penetrated therethrough. The second through holes are blind holes, which do not necessarily penetrate the connection body 41. In addition, a communicable hole 44 is drilled from one side of the connection body 41 perpendicular to the first heat pipe 1 and the second heat pipes 2 to the other side of the first heat pipe 1 and the second heat pipes 2, thereby communicably connecting the heat pipes 1, 2.
In order to clean the inner part of the heat pipe, one needs to access the unsealed pipe opening 12 of the first heat pipe 1. A working fluid and a capillary structure 11 are disposed therein after the heat pipe 1 is cleaned. Then, the heat pipe 1 is evacuated. Next, the unsealed pipe opening 12, the evaporator 3, and the communicable holes 34, 44 on one side of the connection body 31, 41 of the connection mechanism 4 are sealed. In this particular embodiment, the unsealed pipe opening 12 of the first heat pipe 1 can be sealed by a soldering procedure. Sealing portions 35, 45 can be used to tightly seal the communicable holes 34, 44 on one side surface of the evaporator 3 and the connection structure 4. The sealing portion 35, 45 can be a plug. In this manner, a tightly sealed loop heat exchange apparatus 10 is obtained.
In addition, in this particular embodiment, the first pipe body 20 includes a flattened liquid seal region 14 adjacent the heat reception portion. The liquid seal region 14 allows the condensed working fluid to fill therein, thereby forming a liquid seal so as to form an evaporating region of largest possible area. Consequently, the heat pipe will have smaller thermal resistance, higher heat transfer rate, and better thermal conductivity.
In the present invention, the heat generated from the operation of the heat sources 20 is conducted to the first heat pipe 1 via the heat conductive evaporator 3. A heat exchange is performed with the working fluid and the capillary structure 11 of the first heat pipe 1. After the heat exchange, the working fluid of higher temperature is transferred to the condensation portion via the second heat pipe 2 of the evaporator 3 for further heat exchange. The working fluid is then condensed and flowed back to the other end of the second heat pipe, which is returned to the heat reception portion of the first heat pipe 1, thereby continuously performing the heat exchange process.
Moreover, referring to FIG. 6, the evaporators 3 can also be disposed corresponding the first heat pipe 1. A plurality of the first through holes 42 is formed on the connection body 41, such that the pipe opening 12 of the first heat pipe 1 protrudes the connection body 41. The communicable hole 44 is drilled to the side surface of each of the first and the second heat pipes 1, 2, thereby communicably connecting with each other. In addition, the liquid seal region 14 in this particular embodiment is formed by filling the capillary structure in the first heat pipe 20 adjacent the heat reception portion.
According to the descriptions given above, the loop heat exchange apparatus 10 of the present invention can easily and quickly connect the first heat pipe 1 having a heat reception portion and a plurality of second heat pipes 2 having a condensation portion, and can dissipate heat generated from a plurality of heat sources 20. The assembly and the usage of the loop heat exchange apparatus of the present invention become easier and more convenient.
In summary, the loop heat exchange apparatus of the present invention indeed satisfies the patentability requirements of the patent law, a grant of letters patent therefor is thus respectfully requested.
Since, any person having ordinary skill in the art may readily find various equivalent alterations or modifications in light of the features as disclosed above, it is appreciated that the scope of the present invention is defined in the following claims. Therefore, all such equivalent alterations or modifications without departing from the subject matter as set forth in the following claims is considered within the spirit and scope of the present invention.

Claims

1. A loop heat exchange apparatus for dissipating heat generated from a plurality of heat sources, the apparatus comprising:

at least a first heat pipe having a plurality of heat reception portions;

a plurality of evaporators, each being disposed to a heat reception portion of the first heat pipe, and being correspondingly adhered to each heat source;

a connection mechanism disposed to one end of the first heat pipe; and

a plurality of second heat pipes, each having a condensation portion, wherein one end of each second heat pipe is inserted to one evaporator, and the other end of each second heat pipe is inserted in the connection mechanism.

2. The apparatus as recited in claim 1, wherein a liquid seal region is formed on the first heat pipe adjacent the heat reception portion.

3. The apparatus as recited in claim 2, wherein the liquid seal region is formed by flattening a portion of the first heat pipe.

4. The apparatus as recited in claim 2, wherein the liquid seal region is formed by filling in the first heat pipe a capillary structure.

5. The apparatus as recited in claim 1, wherein the evaporator is made of a heat conductive material such as copper or aluminum.

6. The apparatus as recited in claim 1, wherein the evaporator includes a connection body, one side of the connection body having a first through hole and a second through hole formed thereon for inserting therein the first heat pipe and the second heat pipe, wherein a communicable hole is drilled from one side of the first heat pipe and the second heat pipe perpendicular to the connection body to the other side of the first heat pipe and the second heat pipe, thereby communicably connection the heat pipes.

7. The apparatus as recited in claim 6, wherein the first through hole is a penetrating hole providing a sealed pipe opening of the first heat pipe to protrude therethrough, while the second through hole is a blind hole.

8. The apparatus as recited in claim 1, wherein the connection mechanism includes a connection body, a first through hole and a plurality of second holes being formed on one side of the connection body for the first heat pipe and the second heat pipe to insert therein, a communicable hole being drilled from one side of the first heat pipe and the second heat pipes perpendicular to the connection body to the other side of the first heat pipe and the second heat pipes, thereby communicably connecting the heat pipes.

9. The apparatus as recited in claim 8, wherein the evaporators correspond to the first heat pipe, while a plurality of the first through holes is correspondingly formed on the connection body, a communicable hole being drilled between the first and the second heat pipes, thereby communicably connecting the heat pipes.