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US20050178004A1 - Heat absorber and its fabrication - Google Patents

Heat absorber and its fabrication Download PDF

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Publication number
US20050178004A1
US20050178004A1 US10/866,771 US86677104A US2005178004A1 US 20050178004 A1 US20050178004 A1 US 20050178004A1 US 86677104 A US86677104 A US 86677104A US 2005178004 A1 US2005178004 A1 US 2005178004A1
Authority
US
United States
Prior art keywords
heat
absorber
solder
absorber plate
liquid cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/866,771
Inventor
Jung Huang
Chih Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Forward Electronics Co Ltd
Original Assignee
Forward Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forward Electronics Co Ltd filed Critical Forward Electronics Co Ltd
Assigned to FORWARD ELECTRONICS CO., LTD. reassignment FORWARD ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, CHIH CHIEN, HUANG, JUNG FONG
Priority to US10/962,593 priority Critical patent/US20050178530A1/en
Publication of US20050178004A1 publication Critical patent/US20050178004A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49359—Cooling apparatus making, e.g., air conditioner, refrigerator
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49373—Tube joint and tube plate structure

Definitions

  • the present invention relates to a heat absorber and more particularly, to such a heat absorber, which is practical for use in a computer.
  • the invention relates also to the fabrication of such a heat absorber.
  • the main heat-generating electronic device is the CPU.
  • a cooling apparatus shall be used.
  • FIG. 1 illustrates a conventional water-cooling type cooling apparatus for this purpose.
  • This structure of water-cooling type cooling apparatus comprises a heat absorber 91 , a water tank 92 , and a heat sink 93 .
  • the heat absorber 91 is adapted to absorb heat from the CPU, for enabling absorbed heat energy to be transferred through a heat-transfer tube 94 to the heat sink 93 .
  • the water tank 92 is adapted to store a heat-transfer fluid.
  • the aforesaid heat absorber 91 is comprised of a heat-absorber plate 911 , a gasket 912 , and a top cover plate 913 .
  • the heat-absorber plate 911 has a detoured fluid passageway 910 formed in the top wall.
  • the gasket 912 seals the detoured fluid passageway 910 , preventing leakage.
  • This structure of heat absorber is complicated. Further, the gasket 912 wears quickly with use. When the gasket 912 starts to wear, the heat-transfer fluid will leaks out of the heat absorber 91 .
  • the present invention has been accomplished under the circumstances in view. It is therefore the main object of the present invention to provide a heat absorber, which is easy and inexpensive to manufacture and, which effectively prevents leakage. It is another object of the present invention to provide a heat absorber fabrication method, which is practical for making an inexpensive heat absorber that prevents leakage.
  • the heat absorber fabrication method comprises the steps of: a) placing a liquid cooled tube on the top surface of a heat-absorber plate, the liquid cooled tube being curved circuitously on a common plane that is closely attached to the top surface of the heat-absorber plate; b) providing a solder to the top surface of the heat-absorber plate and the liquid cooled tube; c) heating the heat-absorber plate and the liquid cooled tube and the solder to melt the solder and to let the molten solder fill up capillary gaps in between the heat-absorber plate and the liquid cooled tube; and d) cooling down the heat-absorber plate and the liquid cooled tube to harden the solder and to let the hardened solder be bonded to the heat-absorber plate and the liquid cooled tube.
  • a heat absorber structure made according to the present invention comprises a heat-absorber plate, and a liquid cooled tube.
  • the heat-absorber plate has a top surface.
  • the liquid cooled tube is welded to the top surface of the heat-absorber plate, having two distal ends respectively terminated in an inlet and an outlet. Further, the liquid cooled tube is curved circuitously on a common plane that is closely attached to the top surface of the heat-absorber plate.
  • FIG. 1 is an elevational view of a conventional water-cooling type cooling apparatus.
  • FIG. 2 is an exploded view of a heat accumulator according to the prior art.
  • FIG. 3 is a heat accumulator manufacturing flow chart according to the present invention.
  • FIG. 4 is an exploded view of a heat accumulator according to the present invention.
  • FIG. 5 is an elevational assembly view of the heat accumulator shown in FIG. 4 .
  • FIG. 3 is a heat accumulator manufacturing flow chart according to the present invention.
  • FIG. 4 is an exploded view of a heat accumulator according to the present invention.
  • FIG. 5 is an elevational assembly view of the heat accumulator shown in FIG. 4 . The fabrication of a heat absorber is described hereinafter.
  • a liquid cooled tube 1 on the top surface 21 of a heat-absorber plate 2 (SA).
  • SA heat-absorber plate 2
  • the liquid cooled tube 1 curves circuitously on a common plane 11 , which is closely attached to the top surface 21 of the heat-absorber plate 2 .
  • the liquid cooled tube 1 may be flattened by a press or the like to increase the contact area between the liquid cooled tube 1 and the top surface 21 of the heat-absorber plate 2 .
  • solder 3 that has a melting point lower than the liquid cooled tube 1 and the heat-absorber plate 2 .
  • the solder 3 is a weld rod of P/Cu.
  • the solder 3 weld rod of P/Cu is properly cut subject to the length of the liquid cooled tube 1 , and then put on the top surface 21 of the heat-absorber plate 2 and the liquid cooled tube 1 (SB).
  • the heat-absorber plate 2 and the liquid cooled tube 1 with the solder 3 are put in a furnace (not shown) and then heated (SC).
  • the furnace is a brazing furnace that can heat the liquid cooled tube 1 , the heat-absorber plate 2 and the solder 3 .
  • the melting point of the solder 3 is lower than the melting point of the liquid cooled tube 1 and the heat-absorber plate 2 , the solder 3 is melted at first, and the molten solder flows into capillary gaps between the top surface 21 of the heat-absorber plate 2 and the periphery of the liquid cooled tube 1 .
  • the desired heat absorber is thus made.
  • the heat absorber can be attached to a semiconductor heat-generating device, for example, a CPU 4 , to absorb heat from the CPU 4 .
  • a heat absorber structure made according to the aforesaid manufacturing process comprises a heat-absorber plate 2 , and a liquid cooled tube 1 .
  • the heat-absorber plate 2 has a top surface 21 .
  • the liquid cooled tube 1 had a flat shape in section and welded to the top surface 21 of the heat-absorber plate 2 with a solder 3 .
  • the liquid cooled tube 1 curves circuitously on a common plane 11 , which is closely attached to the top surface 21 of the heat-absorber plate 2 . Further, the liquid cooled tube 1 has two distal ends respectively terminated in an outlet 12 and an inlet 13 .
  • the liquid cooled tube 1 and the heat-absorber plate 2 are respectively made of copper for the advantage of good heat conductivity, i.e., the heat-absorber plate 2 is a copper plate and, the liquid cooled tube 1 is a copper tube.
  • Aluminum or other suitable metal may be used to make the liquid cooled tube 1 and the heat-absorber plate 2 .
  • the invention simply uses a heat-absorber plate 2 and a liquid cooled tube 1 to make a heat absorber, and therefore the manufacturing cost of the heat absorber is low. Further, because the invention uses the liquid cooled tube 1 to deliver heat-transfer fluid, no additional sealing gasket is necessary to prevent leakage.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat absorber is constructed to have a heat-absorber plate and a liquid cooled tube, the liquid cooled tube being curved circuitously on a common plane that is closely attached to the top surface of the heat-absorber plate, and then welded to the top surface of the heat-absorber plate. By means of the design of the liquid cooled tube, heat-transfer fluid can flow through the liquid cooled tube, and no additional sealing gasket is necessary to prevent leakage.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat absorber and more particularly, to such a heat absorber, which is practical for use in a computer. The invention relates also to the fabrication of such a heat absorber.
  • 2. Description of Related Art
  • In a computer, the main heat-generating electronic device is the CPU. In order to effectively dissipate heat from the CPU of a computer, a cooling apparatus shall be used.
  • FIG. 1 illustrates a conventional water-cooling type cooling apparatus for this purpose. This structure of water-cooling type cooling apparatus comprises a heat absorber 91, a water tank 92, and a heat sink 93. The heat absorber 91 is adapted to absorb heat from the CPU, for enabling absorbed heat energy to be transferred through a heat-transfer tube 94 to the heat sink 93. The water tank 92 is adapted to store a heat-transfer fluid.
  • The aforesaid heat absorber 91, as shown in FIG. 2, is comprised of a heat-absorber plate 911, a gasket 912, and a top cover plate 913. The heat-absorber plate 911 has a detoured fluid passageway 910 formed in the top wall. The gasket 912 seals the detoured fluid passageway 910, preventing leakage. This structure of heat absorber is complicated. Further, the gasket 912 wears quickly with use. When the gasket 912 starts to wear, the heat-transfer fluid will leaks out of the heat absorber 91.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished under the circumstances in view. It is therefore the main object of the present invention to provide a heat absorber, which is easy and inexpensive to manufacture and, which effectively prevents leakage. It is another object of the present invention to provide a heat absorber fabrication method, which is practical for making an inexpensive heat absorber that prevents leakage.
  • To achieve these and other objects of the present invention, the heat absorber fabrication method comprises the steps of: a) placing a liquid cooled tube on the top surface of a heat-absorber plate, the liquid cooled tube being curved circuitously on a common plane that is closely attached to the top surface of the heat-absorber plate; b) providing a solder to the top surface of the heat-absorber plate and the liquid cooled tube; c) heating the heat-absorber plate and the liquid cooled tube and the solder to melt the solder and to let the molten solder fill up capillary gaps in between the heat-absorber plate and the liquid cooled tube; and d) cooling down the heat-absorber plate and the liquid cooled tube to harden the solder and to let the hardened solder be bonded to the heat-absorber plate and the liquid cooled tube. Further, a heat absorber structure made according to the present invention comprises a heat-absorber plate, and a liquid cooled tube. The heat-absorber plate has a top surface. The liquid cooled tube is welded to the top surface of the heat-absorber plate, having two distal ends respectively terminated in an inlet and an outlet. Further, the liquid cooled tube is curved circuitously on a common plane that is closely attached to the top surface of the heat-absorber plate.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an elevational view of a conventional water-cooling type cooling apparatus.
  • FIG. 2 is an exploded view of a heat accumulator according to the prior art.
  • FIG. 3 is a heat accumulator manufacturing flow chart according to the present invention.
  • FIG. 4 is an exploded view of a heat accumulator according to the present invention.
  • FIG. 5 is an elevational assembly view of the heat accumulator shown in FIG. 4.
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • FIG. 3 is a heat accumulator manufacturing flow chart according to the present invention. FIG. 4 is an exploded view of a heat accumulator according to the present invention. FIG. 5 is an elevational assembly view of the heat accumulator shown in FIG. 4. The fabrication of a heat absorber is described hereinafter.
  • At first, place a liquid cooled tube 1 on the top surface 21 of a heat-absorber plate 2 (SA). The liquid cooled tube 1 curves circuitously on a common plane 11, which is closely attached to the top surface 21 of the heat-absorber plate 2. The liquid cooled tube 1 may be flattened by a press or the like to increase the contact area between the liquid cooled tube 1 and the top surface 21 of the heat-absorber plate 2.
  • Thereafter, provide to the heat-absorber plate 2 and the liquid cooled tube 1 a solder 3 that has a melting point lower than the liquid cooled tube 1 and the heat-absorber plate 2. According to the present preferred embodiment, the solder 3 is a weld rod of P/Cu. The solder 3 weld rod of P/Cu is properly cut subject to the length of the liquid cooled tube 1, and then put on the top surface 21 of the heat-absorber plate 2 and the liquid cooled tube 1 (SB).
  • After the solder 3 has been put on the top surface 21 of the heat-absorber plate 2 and the liquid cooled tube 1, the heat-absorber plate 2 and the liquid cooled tube 1 with the solder 3 are put in a furnace (not shown) and then heated (SC). According to the present preferred embodiment, the furnace is a brazing furnace that can heat the liquid cooled tube 1, the heat-absorber plate 2 and the solder 3. Because the melting point of the solder 3 is lower than the melting point of the liquid cooled tube 1 and the heat-absorber plate 2, the solder 3 is melted at first, and the molten solder flows into capillary gaps between the top surface 21 of the heat-absorber plate 2 and the periphery of the liquid cooled tube 1.
  • At final, cool down the liquid cooled tube 1 and the heat-absorber plate 2, thereby causing the solder 3 to be hardened and bonded to the heat-absorber plate 2 and the liquid cooled tube 1 (SD). The desired heat absorber is thus made. The heat absorber can be attached to a semiconductor heat-generating device, for example, a CPU 4, to absorb heat from the CPU 4.
  • Referring to FIGS. 4 and 5 again, a heat absorber structure made according to the aforesaid manufacturing process comprises a heat-absorber plate 2, and a liquid cooled tube 1. The heat-absorber plate 2 has a top surface 21. The liquid cooled tube 1 had a flat shape in section and welded to the top surface 21 of the heat-absorber plate 2 with a solder 3. The liquid cooled tube 1 curves circuitously on a common plane 11, which is closely attached to the top surface 21 of the heat-absorber plate 2. Further, the liquid cooled tube 1 has two distal ends respectively terminated in an outlet 12 and an inlet 13.
  • According to the present preferred embodiment, the liquid cooled tube 1 and the heat-absorber plate 2 are respectively made of copper for the advantage of good heat conductivity, i.e., the heat-absorber plate 2 is a copper plate and, the liquid cooled tube 1 is a copper tube. Aluminum or other suitable metal may be used to make the liquid cooled tube 1 and the heat-absorber plate 2.
  • As indicated above, the invention simply uses a heat-absorber plate 2 and a liquid cooled tube 1 to make a heat absorber, and therefore the manufacturing cost of the heat absorber is low. Further, because the invention uses the liquid cooled tube 1 to deliver heat-transfer fluid, no additional sealing gasket is necessary to prevent leakage.
  • Although the present invention has been explained in relation to its preferred embodiment, it is to be understood that many other possible modifications and variations can be made without departing from the spirit and scope of the invention as hereinafter claimed.

Claims (10)

1. A heat absorber fabrication method comprising the steps of:
a) placing a liquid cooled tube on the top surface of a heat-absorber plate, said liquid cooled tube being curved circuitously on a common plane;
b) providing a solder to the top surface of said heat-absorber plate and said liquid cooled tube;
c) heating said heat-absorber plate and said liquid cooled tube and said solder to melt said solder and to let the molten solder fill up capillary gaps in between said heat-absorber plate and said liquid cooled tube; and
d) cooling down said heat-absorber plate and said liquid cooled tube to harden said solder and to let the hardened solder be bonded to said heat-absorber plate and said liquid cooled tube;
wherein said solder is a weld rod of P/Cu that has a melting point lower than said heat-absorber plate and said liquid cooled tube.
2. The heat absorber fabrication method as claimed in claim 1, wherein said liquid cooled tube has a flat shape in section.
3. (canceled)
4. The heat absorber fabrication method as claimed in claim 1, wherein said step c) to heat said heat-absorber plate and said liquid cooled tube and said solder is performed in a furnace.
5. The heat absorber fabrication method as claimed in claim 4, wherein said furnace is a brazing furnace.
6-10. (canceled)
11. A heat absorber fabrication method for manufacturing a heat absorber for a computer processing unit comprising the steps of:
a) placing a liquid cooling tube on a top surface of a heat-absorber plate, said liquid cooling tube being curved circuitously on a common plane;
b) providing a solder to the top surface of said heat-absorber plate and said liquid cooling tube;
c) heating said heat-absorber plate and said liquid cooling tube and said solder to melt said solder and to let the molten solder fill up capillary gaps in between said heat-absorber plate and said liquid cooling tube; and
d) cooling down said heat-absorber plate and said liquid cooling tube to harden said solder and to let the hardened solder be bonded to said heat-absorber plate and said liquid cooling tube;
wherein said solder is a weld rod of P/Cu that has a melting point lower than said heat-absorber plate and said liquid cooling tube.
12. The heat absorber fabrication method as claimed in claim 11, wherein said liquid cooled tube has two flat and opposed surfaces in cross section.
13. The heat absorber fabrication method as claimed in claim 11, wherein said step c) to heat said heat-absorber plate and said liquid cooled tube and said solder is performed in a furnace.
14. The heat absorber fabrication method as claimed in claim 13, wherein said furnace is a brazing furnace.
US10/866,771 2004-02-16 2004-06-15 Heat absorber and its fabrication Abandoned US20050178004A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/962,593 US20050178530A1 (en) 2004-02-16 2004-10-13 Heat absorber and its fabrication

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW093103664 2004-02-16
TW093103664A TWI240061B (en) 2004-02-16 2004-02-16 Method for manufacturing heat collector

Related Child Applications (1)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201036527A (en) * 2009-03-19 2010-10-01 Acbel Polytech Inc Large-area liquid-cooled heat-dissipation device
EP3507871B1 (en) * 2016-08-31 2023-06-07 NLIGHT, Inc. Laser cooling system
WO2019166142A1 (en) 2018-03-01 2019-09-06 Jaguar Land Rover Limited Methods and apparatus for acquisition and tracking, object classification and terrain inference
WO2019178003A1 (en) 2018-03-12 2019-09-19 Nlight, Inc. Fiber laser having variably wound optical fiber
CN111402728B (en) * 2020-03-24 2022-05-31 京东方科技集团股份有限公司 Bent gasket component, flexible OLED module and OLED equipment

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US2290684A (en) * 1940-07-31 1942-07-21 Westinghouse Electric & Mfg Co Phosphorous copper alloy
US2306772A (en) * 1940-03-12 1942-12-29 Mullins Mfg Corp Sheet and tube evaporator
US2359926A (en) * 1939-08-22 1944-10-10 Bohn Aluminium & Brass Corp Method of forming refrigeration units
US2386889A (en) * 1940-08-02 1945-10-16 Outboard Marine & Mfg Co Coil assembly
US2782496A (en) * 1954-04-08 1957-02-26 Gen Electric Method for assembling refrigeration systems
US3120869A (en) * 1958-05-15 1964-02-11 Babcock & Wilcox Co Furnace wall of spaced tubes welded to contoured plate
US5429794A (en) * 1992-09-23 1995-07-04 Outokumpu Copper Radiator Strip Ab Alloys for brazing
US6761306B2 (en) * 2001-11-06 2004-07-13 Sumitomo Special Metals Co, Ltd. Phosphorus-copper brazing material, brazing sheet, methods of manufacturing the material and the sheet, and flow path structure for heat exchangers

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US2693939A (en) * 1949-05-06 1954-11-09 Marchant Lewis Heating and cooling system
US4299204A (en) * 1980-05-21 1981-11-10 Cotsworth John L Solar collector
DE3301858C2 (en) * 1983-01-21 1986-06-12 E. Cacarda GmbH, 8602 Strullendorf Method of manufacturing a solar collector board

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2359926A (en) * 1939-08-22 1944-10-10 Bohn Aluminium & Brass Corp Method of forming refrigeration units
US2306772A (en) * 1940-03-12 1942-12-29 Mullins Mfg Corp Sheet and tube evaporator
US2290684A (en) * 1940-07-31 1942-07-21 Westinghouse Electric & Mfg Co Phosphorous copper alloy
US2386889A (en) * 1940-08-02 1945-10-16 Outboard Marine & Mfg Co Coil assembly
US2782496A (en) * 1954-04-08 1957-02-26 Gen Electric Method for assembling refrigeration systems
US3120869A (en) * 1958-05-15 1964-02-11 Babcock & Wilcox Co Furnace wall of spaced tubes welded to contoured plate
US5429794A (en) * 1992-09-23 1995-07-04 Outokumpu Copper Radiator Strip Ab Alloys for brazing
US6761306B2 (en) * 2001-11-06 2004-07-13 Sumitomo Special Metals Co, Ltd. Phosphorus-copper brazing material, brazing sheet, methods of manufacturing the material and the sheet, and flow path structure for heat exchangers

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Publication number Publication date
US20050178530A1 (en) 2005-08-18
TW200528677A (en) 2005-09-01
TWI240061B (en) 2005-09-21

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AS Assignment

Owner name: FORWARD ELECTRONICS CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HUANG, JUNG FONG;HUANG, CHIH CHIEN;REEL/FRAME:015480/0696

Effective date: 20040202

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION