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US20050051305A1 - Heat pipe - Google Patents

Heat pipe Download PDF

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Publication number
US20050051305A1
US20050051305A1 US10/729,062 US72906203A US2005051305A1 US 20050051305 A1 US20050051305 A1 US 20050051305A1 US 72906203 A US72906203 A US 72906203A US 2005051305 A1 US2005051305 A1 US 2005051305A1
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US
United States
Prior art keywords
screen mesh
support
heat pipe
wick structure
internal wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/729,062
Inventor
Hul Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of US20050051305A1 publication Critical patent/US20050051305A1/en
Abandoned legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Definitions

  • the present invention relates to a heat pipe, and especially to a spiral support structure for providing a support force to press the wick structure of screen mesh tightly to an internal wall of a pipe body.
  • a heat pipe provides excellent heat-dissipation and high conductivity while being light, simple in structure and multifunctional.
  • the heat pipe can thus dissipate a great amount of heat without using power and is adapted to electronic products.
  • the heat pipe of the prior art has a wick structure of screen mesh that allows the work fluid to flow smoothly in the heat pipe by means of capillary action.
  • the wick structure of screen mesh of the heat pipe of the prior art is tightly stuck to an internal wall of the pipe body by a sintering process.
  • the sintering process will soften the wick structure of screen mesh, and the wick structure of screen mesh consequently cannot provide sufficient support to allow the wick structure of screen mesh to adhere tightly to the internal wall of the pipe body. This in turn reduces the capillary action of the heat pipe as well as the function thereof.
  • the primary object of the present invention is to provide a heat pipe.
  • the heat pipe has a spiral support structure for providing a support force to the internal wall of the wick structure of screen mesh.
  • the wick structure of screen mesh will provide an enough support force to press the wick structure of screen mesh tightly to an internal wall of a pipe body of the heat pipe. As a result, the heat pipe will provide capillary action.
  • the present invention provides a heat pipe comprising a hollow pipe body, a wick structure of screen mesh assembled on an internal wall of the pipe body, and at least one support structure spirally formed by a continuous board and inserted into the pipe body for outwardly extending to press tightly to the internal wall of the wick structure of screen mesh.
  • the support structure provides a support force to support the wick structure of screen mesh on the internal wall of the wick structure of screen mesh by a surface of the spiral board.
  • FIG. 1 is a perspective view of the present invention
  • FIG. 2 is a cross-sectional view of according to a partial side of the present invention.
  • FIG. 3 is a side cross-sectional view of the present invention.
  • the present invention provides a heat pipe 1 which comprises a pipe body 10 , a wick structure of screen mesh 11 and a support structure 12 .
  • the pipe body 10 is hollow and receives therein the wick structure of screen mesh 11 and the support structure 12 and further includes an internal wall 100 formed therein.
  • the wick structure of screen mesh 11 is made of screen mesh, and is assembled between the pipe body 10 and the support structure 12 .
  • the wick structure of screen mesh 11 is pressed tightly to the internal wall 100 of the pipe body 10 because of the support structure 12 .
  • the support structure 12 is disposed inside the pipe body 10 to press the wick structure of screen mesh 11 tightly to the internal wall 100 of the pipe body 10 .
  • the support structure 12 is spiral in shape, and is formed by a continuous board in a right spiral or a left spiral direction.
  • the support structure 12 provides a support force to support the wick structure of screen mesh 11 on the internal wall 100 of the wick structure of screen mesh 11 by a surface of the spiral board. Although a sintering process will soften the wick structure of screen mesh 11 , the support structure 12 can still provide enough support to press the wick structure of screen mesh 11 tightly to the internal wall 100 of a pipe body 10 .
  • the heat pipe 1 will provide capillary action.
  • the support structure 12 comprises a plurality of groove holes 120 to allow the working fluid to flow though the groove holes 120 in the heat pipe 1 to enhance the thermal performance.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat pipe has a hollow pipe body, a wick structure of screen mesh disposed on an internal wall of the pipe body and at least one support structure extended to press the wick structure of screen mesh tightly to the internal wall of the pipe wall. The support structure spiral in shape, and is formed by a continuous board. The support structure provides a support force to support the wick structure of screen mesh on the internal wall of the wick structure of screen mesh by a surface of the spiral board. The heat pipe provides capillary action.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a heat pipe, and especially to a spiral support structure for providing a support force to press the wick structure of screen mesh tightly to an internal wall of a pipe body.
  • BACKGROUND OF THE INVENTION
  • A heat pipe provides excellent heat-dissipation and high conductivity while being light, simple in structure and multifunctional. The heat pipe can thus dissipate a great amount of heat without using power and is adapted to electronic products. The heat pipe of the prior art has a wick structure of screen mesh that allows the work fluid to flow smoothly in the heat pipe by means of capillary action.
  • However, the wick structure of screen mesh of the heat pipe of the prior art is tightly stuck to an internal wall of the pipe body by a sintering process. The sintering process will soften the wick structure of screen mesh, and the wick structure of screen mesh consequently cannot provide sufficient support to allow the wick structure of screen mesh to adhere tightly to the internal wall of the pipe body. This in turn reduces the capillary action of the heat pipe as well as the function thereof.
  • With the employment of unique considerations and application of theories, and based on several years experience in specialized production of all flexible assembly systems and mechanisms, the inventor has come up with an innovative heat pipe.
  • SUMMARY OF THE INVENTION
  • The primary object of the present invention is to provide a heat pipe. The heat pipe has a spiral support structure for providing a support force to the internal wall of the wick structure of screen mesh. The wick structure of screen mesh will provide an enough support force to press the wick structure of screen mesh tightly to an internal wall of a pipe body of the heat pipe. As a result, the heat pipe will provide capillary action.
  • In order to achieve the above objects, the present invention provides a heat pipe comprising a hollow pipe body, a wick structure of screen mesh assembled on an internal wall of the pipe body, and at least one support structure spirally formed by a continuous board and inserted into the pipe body for outwardly extending to press tightly to the internal wall of the wick structure of screen mesh. The support structure provides a support force to support the wick structure of screen mesh on the internal wall of the wick structure of screen mesh by a surface of the spiral board.
  • BRIEF DESCRIPTION OF DRAWING
  • The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing, in which:
  • FIG. 1 is a perspective view of the present invention;
  • FIG. 2 is a cross-sectional view of according to a partial side of the present invention; and
  • FIG. 3 is a side cross-sectional view of the present invention.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 1 to 3, the present invention provides a heat pipe 1 which comprises a pipe body 10, a wick structure of screen mesh 11 and a support structure 12. The pipe body 10 is hollow and receives therein the wick structure of screen mesh 11 and the support structure 12 and further includes an internal wall 100 formed therein.
  • The wick structure of screen mesh 11 is made of screen mesh, and is assembled between the pipe body 10 and the support structure 12. The wick structure of screen mesh 11 is pressed tightly to the internal wall 100 of the pipe body 10 because of the support structure 12.
  • Moreover, the support structure 12 is disposed inside the pipe body 10 to press the wick structure of screen mesh 11 tightly to the internal wall 100 of the pipe body 10. The support structure 12 is spiral in shape, and is formed by a continuous board in a right spiral or a left spiral direction. The support structure 12 provides a support force to support the wick structure of screen mesh 11 on the internal wall 100 of the wick structure of screen mesh 11 by a surface of the spiral board. Although a sintering process will soften the wick structure of screen mesh 11, the support structure 12 can still provide enough support to press the wick structure of screen mesh 11 tightly to the internal wall 100 of a pipe body 10. The heat pipe 1 will provide capillary action.
  • Furthermore, the support structure 12 comprises a plurality of groove holes 120 to allow the working fluid to flow though the groove holes 120 in the heat pipe 1 to enhance the thermal performance.
  • Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modification have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.

Claims (4)

1. A structure used in heat pipes, comprising:
a hollow pipe body;
a wick structure of screen mesh assembled on an internal wall of the pipe body; and
at least one support structure spirally formed by a continuous board and inserted into the pipe body for outwardly extending to press the wick structure of screen mesh tightly to the inner wall of the pipe body, wherein the support structure provides a support force to support the wick structure of screen mesh on the internal wall of the pipe body by a surface of the spiral board.
2. The heat pipe as claimed in claim 1, wherein the support body is a right spiral.
3. The heat pipe as claimed in claim 1, wherein the support body is a left spiral.
4. The heat pipe as claimed in claim 1, wherein the support body has a plurality of groove holes formed therein.
US10/729,062 2002-12-06 2003-12-05 Heat pipe Abandoned US20050051305A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW091219850U TW582540U (en) 2002-12-06 2002-12-06 Internal composing structure of heat pipe
TW91219850 2002-12-06

Publications (1)

Publication Number Publication Date
US20050051305A1 true US20050051305A1 (en) 2005-03-10

Family

ID=32960655

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/729,062 Abandoned US20050051305A1 (en) 2002-12-06 2003-12-05 Heat pipe

Country Status (2)

Country Link
US (1) US20050051305A1 (en)
TW (1) TW582540U (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060157229A1 (en) * 2005-01-14 2006-07-20 Foxconn Technology Co., Ltd. Heat pipe
US20060213646A1 (en) * 2005-03-28 2006-09-28 Jaffe Limited Wick structure of heat pipe
US20080029249A1 (en) * 2006-08-01 2008-02-07 Inventec Corporation Supporting column having porous structure
US20080105405A1 (en) * 2006-11-03 2008-05-08 Hul-Chun Hsu Heat Pipe Multilayer Capillary Wick Support Structure
KR100913358B1 (en) 2008-12-24 2009-08-20 주식회사 정진멀티테크놀로지 Heat transfer device with capillary wick spring with composite groove
US20100065255A1 (en) * 2008-09-18 2010-03-18 Pegatron Corporation Vapor Chamber
US20110088874A1 (en) * 2009-10-20 2011-04-21 Meyer Iv George Anthony Heat pipe with a flexible structure
US20120325440A1 (en) * 2011-06-27 2012-12-27 Toshiba Home Technology Corporation Cooling device
US20130014919A1 (en) * 2011-07-15 2013-01-17 Foxconn Technology Co., Ltd. Heat pipe
JP2013242098A (en) * 2012-05-22 2013-12-05 Showa Denko Kk Wick material for heat pipe
US20150211803A1 (en) * 2014-01-28 2015-07-30 Phononic Devices, Inc. Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser
US11371783B2 (en) * 2017-06-23 2022-06-28 Ricoh Company, Ltd. Loop heat pipe, cooling device, and electronic device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106863530B (en) * 2017-03-01 2022-05-17 浙江洪利竹木业有限公司 A bamboo straightening equipment
CN114046680B (en) * 2021-11-23 2023-07-21 联想(北京)有限公司 Heat pipe and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3789920A (en) * 1970-05-21 1974-02-05 Nasa Heat transfer device
US3857441A (en) * 1970-03-06 1974-12-31 Westinghouse Electric Corp Heat pipe wick restrainer
US4043387A (en) * 1976-11-26 1977-08-23 Hughes Aircraft Company Water heat pipe with improved compatability
US5275232A (en) * 1993-03-15 1994-01-04 Sandia National Laboratories Dual manifold heat pipe evaporator
US6427765B1 (en) * 1998-09-29 2002-08-06 Korea Electronics Telecomm Heat-pipe having woven-wired wick and method for manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857441A (en) * 1970-03-06 1974-12-31 Westinghouse Electric Corp Heat pipe wick restrainer
US3789920A (en) * 1970-05-21 1974-02-05 Nasa Heat transfer device
US4043387A (en) * 1976-11-26 1977-08-23 Hughes Aircraft Company Water heat pipe with improved compatability
US5275232A (en) * 1993-03-15 1994-01-04 Sandia National Laboratories Dual manifold heat pipe evaporator
US6427765B1 (en) * 1998-09-29 2002-08-06 Korea Electronics Telecomm Heat-pipe having woven-wired wick and method for manufacturing the same

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060157229A1 (en) * 2005-01-14 2006-07-20 Foxconn Technology Co., Ltd. Heat pipe
US20060213646A1 (en) * 2005-03-28 2006-09-28 Jaffe Limited Wick structure of heat pipe
US20080029249A1 (en) * 2006-08-01 2008-02-07 Inventec Corporation Supporting column having porous structure
US20080105405A1 (en) * 2006-11-03 2008-05-08 Hul-Chun Hsu Heat Pipe Multilayer Capillary Wick Support Structure
US20100065255A1 (en) * 2008-09-18 2010-03-18 Pegatron Corporation Vapor Chamber
KR100913358B1 (en) 2008-12-24 2009-08-20 주식회사 정진멀티테크놀로지 Heat transfer device with capillary wick spring with composite groove
US20110088874A1 (en) * 2009-10-20 2011-04-21 Meyer Iv George Anthony Heat pipe with a flexible structure
US20120325440A1 (en) * 2011-06-27 2012-12-27 Toshiba Home Technology Corporation Cooling device
US20130014919A1 (en) * 2011-07-15 2013-01-17 Foxconn Technology Co., Ltd. Heat pipe
JP2013242098A (en) * 2012-05-22 2013-12-05 Showa Denko Kk Wick material for heat pipe
US20150211803A1 (en) * 2014-01-28 2015-07-30 Phononic Devices, Inc. Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser
US9746247B2 (en) * 2014-01-28 2017-08-29 Phononic Devices, Inc. Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser
US11371783B2 (en) * 2017-06-23 2022-06-28 Ricoh Company, Ltd. Loop heat pipe, cooling device, and electronic device

Also Published As

Publication number Publication date
TW582540U (en) 2004-04-01

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STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION