US20050051305A1 - Heat pipe - Google Patents
Heat pipe Download PDFInfo
- Publication number
- US20050051305A1 US20050051305A1 US10/729,062 US72906203A US2005051305A1 US 20050051305 A1 US20050051305 A1 US 20050051305A1 US 72906203 A US72906203 A US 72906203A US 2005051305 A1 US2005051305 A1 US 2005051305A1
- Authority
- US
- United States
- Prior art keywords
- screen mesh
- support
- heat pipe
- wick structure
- internal wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000009471 action Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Definitions
- the present invention relates to a heat pipe, and especially to a spiral support structure for providing a support force to press the wick structure of screen mesh tightly to an internal wall of a pipe body.
- a heat pipe provides excellent heat-dissipation and high conductivity while being light, simple in structure and multifunctional.
- the heat pipe can thus dissipate a great amount of heat without using power and is adapted to electronic products.
- the heat pipe of the prior art has a wick structure of screen mesh that allows the work fluid to flow smoothly in the heat pipe by means of capillary action.
- the wick structure of screen mesh of the heat pipe of the prior art is tightly stuck to an internal wall of the pipe body by a sintering process.
- the sintering process will soften the wick structure of screen mesh, and the wick structure of screen mesh consequently cannot provide sufficient support to allow the wick structure of screen mesh to adhere tightly to the internal wall of the pipe body. This in turn reduces the capillary action of the heat pipe as well as the function thereof.
- the primary object of the present invention is to provide a heat pipe.
- the heat pipe has a spiral support structure for providing a support force to the internal wall of the wick structure of screen mesh.
- the wick structure of screen mesh will provide an enough support force to press the wick structure of screen mesh tightly to an internal wall of a pipe body of the heat pipe. As a result, the heat pipe will provide capillary action.
- the present invention provides a heat pipe comprising a hollow pipe body, a wick structure of screen mesh assembled on an internal wall of the pipe body, and at least one support structure spirally formed by a continuous board and inserted into the pipe body for outwardly extending to press tightly to the internal wall of the wick structure of screen mesh.
- the support structure provides a support force to support the wick structure of screen mesh on the internal wall of the wick structure of screen mesh by a surface of the spiral board.
- FIG. 1 is a perspective view of the present invention
- FIG. 2 is a cross-sectional view of according to a partial side of the present invention.
- FIG. 3 is a side cross-sectional view of the present invention.
- the present invention provides a heat pipe 1 which comprises a pipe body 10 , a wick structure of screen mesh 11 and a support structure 12 .
- the pipe body 10 is hollow and receives therein the wick structure of screen mesh 11 and the support structure 12 and further includes an internal wall 100 formed therein.
- the wick structure of screen mesh 11 is made of screen mesh, and is assembled between the pipe body 10 and the support structure 12 .
- the wick structure of screen mesh 11 is pressed tightly to the internal wall 100 of the pipe body 10 because of the support structure 12 .
- the support structure 12 is disposed inside the pipe body 10 to press the wick structure of screen mesh 11 tightly to the internal wall 100 of the pipe body 10 .
- the support structure 12 is spiral in shape, and is formed by a continuous board in a right spiral or a left spiral direction.
- the support structure 12 provides a support force to support the wick structure of screen mesh 11 on the internal wall 100 of the wick structure of screen mesh 11 by a surface of the spiral board. Although a sintering process will soften the wick structure of screen mesh 11 , the support structure 12 can still provide enough support to press the wick structure of screen mesh 11 tightly to the internal wall 100 of a pipe body 10 .
- the heat pipe 1 will provide capillary action.
- the support structure 12 comprises a plurality of groove holes 120 to allow the working fluid to flow though the groove holes 120 in the heat pipe 1 to enhance the thermal performance.
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat pipe has a hollow pipe body, a wick structure of screen mesh disposed on an internal wall of the pipe body and at least one support structure extended to press the wick structure of screen mesh tightly to the internal wall of the pipe wall. The support structure spiral in shape, and is formed by a continuous board. The support structure provides a support force to support the wick structure of screen mesh on the internal wall of the wick structure of screen mesh by a surface of the spiral board. The heat pipe provides capillary action.
Description
- The present invention relates to a heat pipe, and especially to a spiral support structure for providing a support force to press the wick structure of screen mesh tightly to an internal wall of a pipe body.
- A heat pipe provides excellent heat-dissipation and high conductivity while being light, simple in structure and multifunctional. The heat pipe can thus dissipate a great amount of heat without using power and is adapted to electronic products. The heat pipe of the prior art has a wick structure of screen mesh that allows the work fluid to flow smoothly in the heat pipe by means of capillary action.
- However, the wick structure of screen mesh of the heat pipe of the prior art is tightly stuck to an internal wall of the pipe body by a sintering process. The sintering process will soften the wick structure of screen mesh, and the wick structure of screen mesh consequently cannot provide sufficient support to allow the wick structure of screen mesh to adhere tightly to the internal wall of the pipe body. This in turn reduces the capillary action of the heat pipe as well as the function thereof.
- With the employment of unique considerations and application of theories, and based on several years experience in specialized production of all flexible assembly systems and mechanisms, the inventor has come up with an innovative heat pipe.
- The primary object of the present invention is to provide a heat pipe. The heat pipe has a spiral support structure for providing a support force to the internal wall of the wick structure of screen mesh. The wick structure of screen mesh will provide an enough support force to press the wick structure of screen mesh tightly to an internal wall of a pipe body of the heat pipe. As a result, the heat pipe will provide capillary action.
- In order to achieve the above objects, the present invention provides a heat pipe comprising a hollow pipe body, a wick structure of screen mesh assembled on an internal wall of the pipe body, and at least one support structure spirally formed by a continuous board and inserted into the pipe body for outwardly extending to press tightly to the internal wall of the wick structure of screen mesh. The support structure provides a support force to support the wick structure of screen mesh on the internal wall of the wick structure of screen mesh by a surface of the spiral board.
- The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawing, in which:
-
FIG. 1 is a perspective view of the present invention; -
FIG. 2 is a cross-sectional view of according to a partial side of the present invention; and -
FIG. 3 is a side cross-sectional view of the present invention. - Referring to FIGS. 1 to 3, the present invention provides a
heat pipe 1 which comprises apipe body 10, a wick structure ofscreen mesh 11 and asupport structure 12. Thepipe body 10 is hollow and receives therein the wick structure ofscreen mesh 11 and thesupport structure 12 and further includes aninternal wall 100 formed therein. - The wick structure of
screen mesh 11 is made of screen mesh, and is assembled between thepipe body 10 and thesupport structure 12. The wick structure ofscreen mesh 11 is pressed tightly to theinternal wall 100 of thepipe body 10 because of thesupport structure 12. - Moreover, the
support structure 12 is disposed inside thepipe body 10 to press the wick structure ofscreen mesh 11 tightly to theinternal wall 100 of thepipe body 10. Thesupport structure 12 is spiral in shape, and is formed by a continuous board in a right spiral or a left spiral direction. Thesupport structure 12 provides a support force to support the wick structure ofscreen mesh 11 on theinternal wall 100 of the wick structure ofscreen mesh 11 by a surface of the spiral board. Although a sintering process will soften the wick structure ofscreen mesh 11, thesupport structure 12 can still provide enough support to press the wick structure ofscreen mesh 11 tightly to theinternal wall 100 of apipe body 10. Theheat pipe 1 will provide capillary action. - Furthermore, the
support structure 12 comprises a plurality ofgroove holes 120 to allow the working fluid to flow though thegroove holes 120 in theheat pipe 1 to enhance the thermal performance. - Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modification have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Claims (4)
1. A structure used in heat pipes, comprising:
a hollow pipe body;
a wick structure of screen mesh assembled on an internal wall of the pipe body; and
at least one support structure spirally formed by a continuous board and inserted into the pipe body for outwardly extending to press the wick structure of screen mesh tightly to the inner wall of the pipe body, wherein the support structure provides a support force to support the wick structure of screen mesh on the internal wall of the pipe body by a surface of the spiral board.
2. The heat pipe as claimed in claim 1 , wherein the support body is a right spiral.
3. The heat pipe as claimed in claim 1 , wherein the support body is a left spiral.
4. The heat pipe as claimed in claim 1 , wherein the support body has a plurality of groove holes formed therein.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW091219850U TW582540U (en) | 2002-12-06 | 2002-12-06 | Internal composing structure of heat pipe |
| TW91219850 | 2002-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20050051305A1 true US20050051305A1 (en) | 2005-03-10 |
Family
ID=32960655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/729,062 Abandoned US20050051305A1 (en) | 2002-12-06 | 2003-12-05 | Heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20050051305A1 (en) |
| TW (1) | TW582540U (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060157229A1 (en) * | 2005-01-14 | 2006-07-20 | Foxconn Technology Co., Ltd. | Heat pipe |
| US20060213646A1 (en) * | 2005-03-28 | 2006-09-28 | Jaffe Limited | Wick structure of heat pipe |
| US20080029249A1 (en) * | 2006-08-01 | 2008-02-07 | Inventec Corporation | Supporting column having porous structure |
| US20080105405A1 (en) * | 2006-11-03 | 2008-05-08 | Hul-Chun Hsu | Heat Pipe Multilayer Capillary Wick Support Structure |
| KR100913358B1 (en) | 2008-12-24 | 2009-08-20 | 주식회사 정진멀티테크놀로지 | Heat transfer device with capillary wick spring with composite groove |
| US20100065255A1 (en) * | 2008-09-18 | 2010-03-18 | Pegatron Corporation | Vapor Chamber |
| US20110088874A1 (en) * | 2009-10-20 | 2011-04-21 | Meyer Iv George Anthony | Heat pipe with a flexible structure |
| US20120325440A1 (en) * | 2011-06-27 | 2012-12-27 | Toshiba Home Technology Corporation | Cooling device |
| US20130014919A1 (en) * | 2011-07-15 | 2013-01-17 | Foxconn Technology Co., Ltd. | Heat pipe |
| JP2013242098A (en) * | 2012-05-22 | 2013-12-05 | Showa Denko Kk | Wick material for heat pipe |
| US20150211803A1 (en) * | 2014-01-28 | 2015-07-30 | Phononic Devices, Inc. | Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser |
| US11371783B2 (en) * | 2017-06-23 | 2022-06-28 | Ricoh Company, Ltd. | Loop heat pipe, cooling device, and electronic device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106863530B (en) * | 2017-03-01 | 2022-05-17 | 浙江洪利竹木业有限公司 | A bamboo straightening equipment |
| CN114046680B (en) * | 2021-11-23 | 2023-07-21 | 联想(北京)有限公司 | Heat pipe and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3789920A (en) * | 1970-05-21 | 1974-02-05 | Nasa | Heat transfer device |
| US3857441A (en) * | 1970-03-06 | 1974-12-31 | Westinghouse Electric Corp | Heat pipe wick restrainer |
| US4043387A (en) * | 1976-11-26 | 1977-08-23 | Hughes Aircraft Company | Water heat pipe with improved compatability |
| US5275232A (en) * | 1993-03-15 | 1994-01-04 | Sandia National Laboratories | Dual manifold heat pipe evaporator |
| US6427765B1 (en) * | 1998-09-29 | 2002-08-06 | Korea Electronics Telecomm | Heat-pipe having woven-wired wick and method for manufacturing the same |
-
2002
- 2002-12-06 TW TW091219850U patent/TW582540U/en not_active IP Right Cessation
-
2003
- 2003-12-05 US US10/729,062 patent/US20050051305A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3857441A (en) * | 1970-03-06 | 1974-12-31 | Westinghouse Electric Corp | Heat pipe wick restrainer |
| US3789920A (en) * | 1970-05-21 | 1974-02-05 | Nasa | Heat transfer device |
| US4043387A (en) * | 1976-11-26 | 1977-08-23 | Hughes Aircraft Company | Water heat pipe with improved compatability |
| US5275232A (en) * | 1993-03-15 | 1994-01-04 | Sandia National Laboratories | Dual manifold heat pipe evaporator |
| US6427765B1 (en) * | 1998-09-29 | 2002-08-06 | Korea Electronics Telecomm | Heat-pipe having woven-wired wick and method for manufacturing the same |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060157229A1 (en) * | 2005-01-14 | 2006-07-20 | Foxconn Technology Co., Ltd. | Heat pipe |
| US20060213646A1 (en) * | 2005-03-28 | 2006-09-28 | Jaffe Limited | Wick structure of heat pipe |
| US20080029249A1 (en) * | 2006-08-01 | 2008-02-07 | Inventec Corporation | Supporting column having porous structure |
| US20080105405A1 (en) * | 2006-11-03 | 2008-05-08 | Hul-Chun Hsu | Heat Pipe Multilayer Capillary Wick Support Structure |
| US20100065255A1 (en) * | 2008-09-18 | 2010-03-18 | Pegatron Corporation | Vapor Chamber |
| KR100913358B1 (en) | 2008-12-24 | 2009-08-20 | 주식회사 정진멀티테크놀로지 | Heat transfer device with capillary wick spring with composite groove |
| US20110088874A1 (en) * | 2009-10-20 | 2011-04-21 | Meyer Iv George Anthony | Heat pipe with a flexible structure |
| US20120325440A1 (en) * | 2011-06-27 | 2012-12-27 | Toshiba Home Technology Corporation | Cooling device |
| US20130014919A1 (en) * | 2011-07-15 | 2013-01-17 | Foxconn Technology Co., Ltd. | Heat pipe |
| JP2013242098A (en) * | 2012-05-22 | 2013-12-05 | Showa Denko Kk | Wick material for heat pipe |
| US20150211803A1 (en) * | 2014-01-28 | 2015-07-30 | Phononic Devices, Inc. | Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser |
| US9746247B2 (en) * | 2014-01-28 | 2017-08-29 | Phononic Devices, Inc. | Mechanism for mitigating high heat-flux conditions in a thermosiphon evaporator or condenser |
| US11371783B2 (en) * | 2017-06-23 | 2022-06-28 | Ricoh Company, Ltd. | Loop heat pipe, cooling device, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW582540U (en) | 2004-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |