US20020105714A1

US20020105714A1 - Low-loss electrode structures for optical modulation applications

Info

Publication number: US20020105714A1
Application number: US09/778,712
Authority: US
Inventors: Ganesh Gopalakrishnan; Kevin Donovan; Richard Blanchard
Original assignee: Codeon Corp
Current assignee: Thorlabs Quantum Electronics Inc; Square 1 Bank
Priority date: 2000-11-03
Filing date: 2001-02-08
Publication date: 2002-08-08
Anticipated expiration: 2021-02-08
Also published as: AU2002213514A1; WO2002037149A1; US6429959B1

Abstract

An optical device includes a grounded base and an optical modulator chip having a top surface, a back surface and side surfaces. The optical modulator chip is positioned on the grounded base with the back surface facing the grounded base. The optical modulator chip includes a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip. The first and second ground electrodes of the optical modulator chip are interconnected on a surface of the optical modulator chip.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an optical modulation system, and more particularly, to the interconnection of external electrodes to an optical modulator so as to minimize loss of signal energy and to prevent the introduction of spurious modes into the signal within the optical modulator.

2. Discussion of the Related Art

In a general fiber optical communication system, optical signals are sent along an optical fiber communication line to a desired location. Optical modulators with performance in the 40 GHz frequency range and beyond, are critical components in optical communication systems.

To achieve high-frequency operation in LiNbO ₃, the electrical and optical velocity of the modulating and modulated signal must be matched. This is achieved by employing thick (>10 μm) electrodes in conjunction with a buffer layer (typically SiO₂). The buffer layer is deposited directly on the LiNbO₃and the electrode structure is delineated on the buffer layer. While the buffer layer facilitates velocity matching, it also results in decreased modulation efficiency because the applied voltage is partially dropped across the buffer layer. LiNbO₃is an anisotropic material, with the following dielectric constants:

ε_{extra-ordinary}≈26, ε_ordinary≈43

Thus, planar and uni-planar transmission lines such as microstrip, coplanar waveguide (CPW) and coplanar strip (CPS) tend to be very dispersive when built directly on LiNbO ₃. As the frequency increases, the fields become more concentrated in the regions below the metal strips, where the substrate permittivity has already resulted in a relatively larger electric displacement since the fields are forced into the LiNbO₃to an increasing extent as the frequency increases. Therefore, a frequency-dependent effective permittivity can be defined for the transmission line.

FIG. 1 illustrates an optical modulator of the prior art. The modulator has a

mounting base

1 that is typically conductive or a non-conductive material covered with a conductive layer. The mounting base 1 is typically at the ground potential of the device and will herein be referred to as the grounded base 1. The optical modulator has an optical modulator chip 2, for example a LiNbO₃chip covered with an insulating buffer layer, mounted on the grounded base 1. The grounded base 1 includes input/output optical terminals 345 and input/output electrical terminals 71. The optical modulator chip 2 has two ground electrodes 3/3′ and a signal electrode 4 mounted on top of the buffer layer above the waveguide 34 of the optical modulator chip 2. This electrode configuration is known as the coplanar-waveguide (CPW). When the electrode structure of the optical modulator chip 2 comprises just one signal electrode, and one ground plane, it is known as the coplanar-strips (CPS) configuration.

The

optical modulator chip

2 is comprised of active 6 and non-active sections 5. The active section 6 of the device is the section of the optical modulator chip 2 wherein the electrical and optical signals interact to cause optical modulation. Typically, the electrode dimensions, such as the width of the signal electrode 4, and the electrode gap tend to be very narrow (5-25 microns) in the active section 6. These dimensions are prohibitively small to facilitate direct connection of the device to standard electrical connectors. Hence, the electrodes 3/4/3′ for the active section 6 are flared 31/41/31′ in the non-active section 5 to facilitate external connection to the signal electrode line 4 and the ground electrodes 3/3′. The flared electrodes 31/41/31′ do not take part in the process of optical modulation, but are required to facilitate connection of the active section of the modulator to standard electrical interface media. External electrical connection to the flared electrodes 31/41/31′ of the optical modulator chip 2 is facilitated by either a transition chip 7 having leads 23/24/23′ connected to the flared electrodes 31/41/31′ of the optical modulator chip 2 via wires or a direct external connection to the flared electrodes 31/41/31′ of the optical modulator chip 2 via wires from the electrical terminals 71.

FIG. 2 illustrates a side view of the optical modulator in the direction shown as A-A in FIG. 1. FIG. 2 shows

electrodes

31/41/31′ on a buffer layer 8 terminating on the top surface edge of the optical modulator chip 2 and the grounded base 1 underlying the optical modulator chip 2. Although the ground electrodes 31/31 ′ of FIGS. 1 and 2 are shown as single lines, the ground electrodes may be ground planes which cover most of the top surface of the optical modulator chip 2 except for the signal electrode 4 and an area just outside the signal electrode 4. For example, there can be ground planes that cover most of the top surface of the optical modulator chip 2 but are no closer to the signal electrode than the ground electrodes 3/3′ shown.

The intended electrical guided mode for an optical modulator contains the frequency of an input or frequencies of input on the optical modulator for operating the optical modulator. Typically, an optical modulator has a range of sets of frequencies that can be used as electrical inputs to modulate an optical signal. For proper operation of the modulator, the intended electrical guided mode of the device must be such that the electric fields originating on the signal electrode must properly terminate on the adjacent ground electrodes without straying elsewhere in the modulator chip or package. The intended electrical guided mode of the optical modulator will herein after be referred to as the dominant CPW mode of the optical modulator.

Once the electric fields of the signal electrode penetrate through the buffer layer into the optical modulator chip, several other effects could occur. Depending on frequency, a CPW mode may couple with other extraneous electrical modes that the structure of the optical modulator can support. These modes could either be highly dispersive slab modes, or could be zero-cut-off modes. Examples of extraneous modes are: transverse-electric (TE) or transverse magnetic slab modes, slot-line mode (that could occur between the two ground planes of the CPW structure), parallel-plate modes (that could be excited between the electrodes on the top surface and the grounded base), and microstrip mode (between the top electrodes and the grounded base). When coupling to extraneous modes occurs, there is a loss of power for the dominant CPW mode. Such a power loss degrades the optical modulator's modulation performance and the clarity of the output modulated optical signal is degraded. The amount of power lost to spurious or other extraneous modes depends on the field overlap between the dominant CPW mode and the other extraneous modes supported by the device.

One approach to avoid coupling to spurious or other extraneous modes in CPW structures is by reducing the cross-sectional dimension of the CPW transmission line. Referring to FIG. 1, by decreasing (S+2D), which is the width of

electrode

4 plus twice the distance that one of the optical modulator grounds 3/3′ is located from the signal electrode 4, there is less field penetration into the optical modulator chip 2 and hence less of an opportunity for overlap between the guided CPW mode and other extraneous modes that can be supported by the device. Since there is less overlap in structures with smaller (S+2D), between the CPW mode and other extraneous modes, there is less of a power loss from the CPW mode and hence less degradation of the outputted modulated optical signal.

However, a CPW transmission line with a smaller cross-sectional dimension is not very practical because the device still requires external electrical connection. Typically, in the

non-active sections

5 of the optical modulator chip, the electrodes 3/4/3′ for the active section 6 are respective flared electrodes 31/41/31′ in the non-active section 5 to facilitate connection to the signal electrode line and the ground electrodes. The connection is facilitated by the use of a transition chip 7 having leads connected to the flared electrodes 31/41/31′ of the optical modulator chip 2 or a direct external connection to the flared electrodes 31/41/31′ of the optical modulator chip 2. Although FIG. 1 shows two transition chips 7, a single transition chip for external connection to the optical modulator chip can extend down the side of the optical modulator chip and contain both sets of the electrodes 31/41/31′. Alternately, the modulator electrode can also be terminated with an appropriate resistance or a resistance-capacitance combination at the end of the electrode. Due to the relatively wider dimensions of the flared electrodes 31/41/31′ in the non-active sections 5 compared to the electrodes 3/4/3′ in the active section 6, there is significant field penetration into the optical modulator chip 2 (i.e. LiNbO₃) through the buffer layer 8 in the non-active sections 5. This penetration increases the opportunity for extraneous mode coupling into substrate slab modes or zero-cutoff modes that the structure (i.e. the optical modulator chip, the CPW transmission line and the grounded base) can support in both the active 6 and non-active 5 sections.

Ground plane integrity between the ground and the signal is important for satisfactory operation of the optical modulator. Otherwise, high-speed optical modulation in the

active sections

6 of the optical modulator chip will be seriously hampered. This is because over the frequency range of interest, the electrical velocity and hence impedance varies at the input to the modulator (i.e. the flared electrodes), and coupling to spurious modes occurs. As a result, the optical modulation in the active section 6 will not be in concert with the inputted electrical signal to the optical modulator.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to an optical modulator that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.

The present invention provides an optical modulator with enhanced ground plane integrity to minimize loss of signal energy and to prevent the introduction of extraneous modes into the modulated optical signal.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described, an optical device of the present invention includes a grounded base; an optical modulator chip having a top surface, a back surface and side surfaces, wherein the optical modulator chip is positioned on the grounded base with the back surface of the optical modulator chip facing the grounded base; and a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip, wherein the first and second ground electrodes are respectively connected to first and second extended ground electrodes that extend down at least one side of the optical modulator chip and connect to the grounded base.

In another aspect, an optical device of the present invention includes: a grounded base; a transition chip for interconnecting an optical modulator chip having a top surface, a back surface and side surfaces, wherein the transition chip is positioned on the grounded base with the back surface of the transition chip facing the grounded base; and a first ground connection lead, a signal connection lead and a second ground connection lead located over the top surface of the transition chip, wherein the first and second ground connection leads are interconnected to first and second extended ground connection leads that extend down at least one side of the transition chip and connect to the grounded base.

In another aspect, an optical device of the present invention includes: a grounded base; an optical modulator chip positioned on the grounded base having a top surface, a back surface and side surfaces; a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip; a transition chip for interconnecting the optical modulator chip having a top surface, a back surface and side surfaces, wherein the transition chip is positioned on the grounded base with the back surface of the transition chip facing the grounded base; and a first ground connection lead, a signal connection lead and a second ground connection lead located on the top surface of the transition chip, wherein the first and second ground connection leads are connected to first and second extended ground connection leads that extend down at least one side of the transition chip and connect to the grounded base.

In another aspect, an optical device of the present invention includes: a grounded base; an optical modulator chip having a top surface, a back surface and side surfaces, wherein the optical modulator chip is positioned on the grounded base with the back surface of the optical modulator chip facing the grounded base; at least one ground electrode and a signal electrode located over the top surface of the optical modulator chip, wherein the at least one ground electrode is connected to an extended ground electrode that extends down one side of the optical modulator chip and connects to the grounded base; and a transition chip for interconnecting the optical modulator chip having a top surface, a back surface and side surfaces, wherein the transition chip is positioned on the grounded base with the back surface of the transition chip facing the grounded base.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the principles of the invention. [0022]
FIG. 1 shows a top view of a prior art optical modulation device. [0023]
FIG. 2 shows the side view of prior art optical [0024] modulator chip electrodes 31/41/31′ terminating on the top surface of the optical modulator chip.
FIG. 3 shows a side view of an optical modulator chip on a grounded base illustrating a first exemplary embodiment of the present invention. [0025]
FIG. 4 shows a bottom view of an optical modulator chip on a grounded base illustrating a second exemplary embodiment of the present invention. [0026]
FIG. 5 shows a side view of an optical modulator chip illustrating a third exemplary embodiment of the present invention. [0027]
FIG. 6 shows a side view of an optical modulator chip illustrating a fourth exemplary embodiment of the present invention. [0028]
FIG. 7 illustrates a top view of a prior art device using a transition chip for interconnecting the optical modulator chip to external connections. [0029]
FIG. 8 illustrates a side view of prior art transition chip connection leads [0030] 23/24/23′ terminating on the top surface of the transition chip.
FIG. 9 shows a side view of a transition chip on a grounded base illustrating a fifth exemplary embodiment of the present invention. [0031]
FIG. 10 illustrates a bottom view of a transition chip illustrating a sixth exemplary embodiment of the present invention. [0032]
FIG. 11 shows a side view of a transition chip on a grounded base illustrating a seventh exemplary embodiment of the present invention. [0033]
FIG. 12 shows a side view of a transition chip on a grounded base illustrating an eighth exemplary embodiment of the present invention. [0034]
FIG. 13 illustrates three ways in which the ground connection leads can extend down sides of a transition chip in accordance with the present invention. [0035]
FIG. 14 illustrates a modulator device having only single ground electrode that can be modified in accordance with the present invention. [0036]
FIG. 15 illustrates a modulator device having planar ground electrodes that can be modified in accordance with the present invention.[0037]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. The present invention is particularly useful in optical modulators and switches for optical telecommunications network systems that carry optical communications signals, such as wavelength division multiplexed (WDM) signals, over optical fibers. [0038]
FIG. 3 illustrates a first exemplary embodiment of the invention, as incorporated into an optical modulation device like shown in FIG. 1, viewed in the direction A-A of FIG. 1. As shown in FIG. 3, the [0039] ground electrodes 31/31′ of the optical modulator chip 2 extend down the side surface of the optical modulator chip as extended ground electrodes 32/32′. FIG. 3 also shows the buffer layer 8 terminating at the edge of the top surface of the optical modulator chip 2. In the alternative, the buffer layer 8 may be omitted from the device. The extended ground electrodes 32/32′ contact the grounded base 1 near the back surface of the optical modulator chip 2. Therefore, the extended ground electrodes 32/32′ are connected by the grounded base 1 on the back surface of the optical modulator chip 2. In the alternative, the grounded base 1 can be close to the side surface of the optical modulator chip 2 shown in FIG. 3 as a result of the optical modulating chip residing in a well of the grounded base 1 with the lengths of sides of the extended ground electrodes 32/32′ along the sides of the optical modulator chip directly in contact to the inner sidewall of the well in the grounded base.
FIG. 4 illustrates a second exemplary embodiment of the invention, as incorporated into an optical modulation device like shown in FIG. 1, with a bottom view of the back surface of an [0040] optical modulator chip 2 which is the surface opposite to the surface having electrodes 31/41/31′. As shown in FIG. 4, the ground electrodes 31/31′ are extended from the top surface of the optical modulator chip 2, across the side surface of the optical modulator chip 2 and on to the back surface of the optical modulator chip 2 as extended ground electrodes 32/32′. The extended ground electrodes 32/32′ are interconnected 10 on the back surface of the optical modulator chip and directly connected to the grounded base 1 which lies directly underneath the optical modulator chip 2. FIG. 4 also shows that the buffer layer 8 extends down the side surface of the optical modulator chip 2. In the alternative, the buffer layer 8 may be omitted from the side surface of the optical modulator chip 2.
FIG. 5 illustrates a third exemplary embodiment of the invention, as incorporated into an optical modulation device like shown in FIG. 1, viewed in the direction A-A of FIG. 1. As shown in FIG. 3, the [0041] ground electrodes 31/31′ of the optical modulator chip 2 are extend down the side surface of the optical modulator chip and are interconnected 11 on the side surface of the optical modulator chip 2 as extended ground electrodes 32/32′ and contact the grounded base 1. In the alternative, the grounded base 1 can be close to the side surface of the chip shown in FIG. 5 as a result of the optical modulating chip residing in a well of the grounded base 1 with the lengths of sides of the extended ground electrodes 32/32′ along the sides of the optical modulator chip directly in contact to the inner sidewall of the well in the grounded base.
Although FIGS. 4 and 5 respectively show interconnecting the ground electrodes on the [0042] side 11 and back 10 surfaces of the optical modulator chip, the extended ground electrodes 32/32′ may also, or in the alternative, be interconnected on any of the surfaces of the optical modulator chip. For example, as shown in FIG. 6, the ground electrodes are interconnected 9 on the top surface of the optical modulator chip 2. This fourth exemplary embodiment shows an interconnect 9 that forms a bridge connection of the first and second ground electrodes 31/31′ over the signal electrode 41. Such a bridge connection can accomplished with a wire/ribbon bonded to the flared ground electrodes 31/31 ′ (i.e. an air bridge), a wrap-around metallization from the first ground electrode 3 to the second ground electrode 3′ or both. FIG. 6 also illustrates that the extended ground electrodes 32/32′ contact the grounded base 1 near the back surface of the optical modulator chip 2. Therefore, the extended ground electrodes 32/32′ are also connected by the grounded base 1 on the back surface of the optical modulator chip 2.
The [0043] ground electrode extensions 32/32′ in FIGS. 3, 4, 5 and 6 and/or interconnections 10/11 shown in FIGS. 4 and 5, can be additional conductive layers to the ground electrodes of 31/31′, the same conductive layers which formed ground electrodes 31/31′, conductive paste applied to the optical modulator chip so as to connect to the ground electrodes 31/31′, or other conductive means. Furthermore, different types of conductive means can be used in resultant combinations of the first through fourth exemplary embodiments above. By extending the ground electrodes down the side surface of the optical modulator chip to connect to the grounded base and/or connecting the ground electrodes on a side of the optical modulator chip, the opportunity for extraneous mode coupling into parallel plate modes or other spurious modes is decreased.
In the alternative to extended ground electrodes on the optical modulator chip, the same advantages can be realized with a transition chip having extended ground connection leads, if a transition chip is used for interconnection to the optical modulator chip. Furthermore, a transition chip with extended ground connection leads can be used with a optical modulator chip having extended ground connection leads or a conventional transition chip can be used with an optical modulator chip having extended ground connection leads. [0044]
FIG. 7 discloses the prior art structure for connecting an [0045] optical modulating chip 2 with a transition chip 7. The transition chip 7 has a first ground connection lead 23, a signal connection lead 24 and a second ground connection lead 23′ on the top surface of the transition chip 7. The ground connection leads 23/23′ of the transition chip 7 are respectively connected to the flared ground electrodes 31/31′ with wires 311/311′ and the signal connection lead 24 of the transition chip 7 is connected to the flared signal electrode 41 with a wire 411.
FIG. 8 shows a side view of the [0046] transition chip 7 in the direction shown as B-B in FIG. 7. The prior art transition chip leads 23/24/23′, as shown in FIG. 7, terminate at the edge of the transition chip 7. The body of the transition chip 7 is usually comprised of an insulating material. In addition or in the alternative to the first, second and third embodiments disclosed above in FIGS. 3, 4, 5 and 6, the ground plane integrity can be enhanced by extending the ground connection leads down the side surfaces of the transition chips used for interconnection to an optical modulator.
FIG. 9 illustrates a fifth exemplary embodiment of the invention, as incorporated into an optical modulation device like shown in FIG. 7, viewed in the direction B-B of FIG. 7. As shown in FIG. 9, the ground connection leads [0047] 23/23′ of the transition chip 2 extend down the side surface of the transition chip 7 as extended ground connection leads 33/33′. The extended ground connection leads 33/33′ contact the grounded base 1 near the back surface of the transition chip 7. Therefore, the extended ground connection leads 33/33′ are connected by the grounded base 1 on the back surface of the transition chip 7. In the alternative, the grounded base 1 can be close to the side surface of the transition chip 7 shown in FIG. 9 as a result of the transition chip residing in a well of the grounded base 1 with the lengths of sides of the extended ground connection leads along the sides of the transition chip directly in contact to the inner sidewall of the well in the grounded base.
FIG. 10 illustrates a sixth exemplary embodiment of the invention, as incorporated into an optical modulation device like shown in FIG. 7, with a bottom view of the back surface of a [0048] transition chip 7 which is the surface opposite to the surface having leads 23/24/23′. As shown in FIG. 10, the ground connection leads 23/23′ on the top surface extend across the side surface 33/33′ and onto the back surface of the transition chip 7. The extended ground connection leads 33/33′ are interconnected 10 a on the back surface of the transition chip 7 and connected to the grounded base 1 which lies beneath the transition chip 7.
FIG. 11 illustrates a seventh exemplary embodiment of the invention, as incorporated into an optical modulation device like shown in FIG. 7, viewed in the direction B-B of FIG. 7. As shown in FIG. 11, the ground connection leads [0049] 23/23′ on the top surface of the transition chip 7 extend down the side surface of the transition chip 7 as extended ground connection leads and are interconnected 11 a. The extended ground connection leads 33/33′ extend down the side surface of the transition chip to the bottom edge of the side surface in order to contact the grounded base 1. In the alternative, the grounded base 1 can be close to the side surface of the transition chip shown in FIG. 11 as a result of the transition chips residing in a wells of the grounded base 1 with the lengths of sides of the extended ground electrodes 33/33′ along the sides of the optical modulator chip directly in contact to the inner sidewalls of the wells in the grounded base.
Although FIGS. 10 and 11 respectively show interconnecting the extended ground connection leads on the [0050] side 11 a and back 10 a surfaces of the transition chip, the ground connection leads 23/23′ may also, or in the alternative, be interconnected on any of the surfaces of the transition chip. For example, as shown in FIG. 12, the ground connection leads are interconnected 12 on the top surface of the transition chip 7. This eighth exemplary embodiment shows an interconnect 12 forming a bridge connection of the first and second ground connection leads 23/23′ over the signal connection lead 4. For example, such a bridge connection can accomplished with a wire bonded to the connection leads 23/23′ (i.e. an air bridge), a wraparound metallization from the first ground connection lead 23 to the second ground connection lead 23′ or both. Alternately, vias with thru metallization from the front to the back surface can be patterned on the ground plane of the transitions, and be connected to the grounded base on the back side. FIG. 12 also illustrates that the extended ground electrodes 32/32′ contact the grounded base 1 near the back surface of the transition chip 7. Therefore, the extended ground electrodes 32/32′ are also connected by the grounded base 1 on the back surface of the transition chip 2.
The extended ground connection leads [0051] 33/33′ in FIGS. 9, 10, 11 and 12 and/or interconnections 10 a/11 a shown in FIGS. 10 and 11, can be additional conductive layers to the ground connection leads of 23/23′, the same conductive layers which formed ground electrodes 23/23′, conductive paste applied to the optical modulator chip so as to connect to the ground electrodes 23/23′, or other conductive means. Furthermore, different types of conductive means can be used together in resultant combinations of the fifth through eighth exemplary embodiments above as well as in any combination of the above embodiments. By extending the ground electrodes down the side surface of the transition chip to connect to the grounded base and/or connecting the ground connection leads on a side of the transition chip, the opportunity for extraneous mode coupling into parallel plate modes or other spurious modes is decreased.
FIG. 13 illustrates other examples of how the ground connection leads [0052] 23/23′ of the transition chip 7 can be interconnected by extended ground connection leads 33/33′ extending over side surface AA that would be next to the optical modulator chip 2, opposing side surfaces BB for interconnection on the back surface of the transition chip 7 or side surface CC near where the signal is initially inputted. FIG. 13 also illustrates how in the alternative or in addition to the extended ground connection leads, conductive vias 43 can be formed in the transition chip 7 so as to interconnect the connection leads 23/23′ to the grounded base underneath the transition chip 7 by conductive means going through the transition chip 7. There can be one or more conductive vias in the transition chip for each of the connection leads 23/23′. Although the transition chip 7 is shown as trapezoidal-shaped, the transition chip can be any polygonal shape that facilitates external interconnection to the optical modulator chip 2. Furthermore, instead of two transition chips being used to interconnect the optical modulator chip 2, a single transition chip that extends along the length of the optical modulator chip can be used for external interconnection to the optical modulator chip 2. When using a single transition chip, the extended ground connection leads will be on either or both of the sides like AA and CC in FIG. 13.
In addition, it is within the scope of the present invention, that side surfaces of both the optical modulator chip and the transition chip can have ground extensions that are interconnected on the side surfaces of each respective chip and to one another. Also, both the optical modulator chip and the transition chip can have ground extensions on side surfaces of the chips and on the back surfaces of the chips, wherein ground extensions of each chip on the sides of each chip are interconnected. Furthermore, one of the optical modulator chip and the transition chip can have a bridge connection of the grounds while the other has an embodiment with ground extensions. [0053]
In addition, the present invention can be used in other types of modulator devices. For example, as shown in FIG. 14, a [0054] modulator device 200 having a single ground electrode 3 can have extended ground electrodes extending down the side D that contact the grounded base underneath and may also be interconnected like the second and third embodiments. The device in FIG. 14 is a Mach-Zehnder interferometer with waveguide 34 and a signal electrode 4 with flared ends 41 in addition to the ground electrode 3 with flared ends 31. However, the present invention can be used in other single ground electrode modulators.
FIG. 15 illustrates how the present invention can be used in a [0055] modulator device 300 having planar ground electrodes. The modulator device in FIG. 15 has a first planar ground electrode 3, a second planar ground electrode 3′, a waveguide 34 and signal electrode 4 with flared ends 41. The planar ground electrodes 3/3′ can have extended ground electrodes extending down the sides as shown by E, down adjoining sides as shown by F1/F2, or down all four sides that contact the grounded base underneath and may also be interconnected like the second and third embodiments. It is also within the scope of the present invention that the exemplary embodiments can be used to modify optical modulators having more than two ground electrodes.
It will be apparent to those skilled in the art that various modifications and variations can be made in the optical modulator of the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. [0056]

Claims

What is claimed is:

1. An optical device comprising:

a grounded base;

an optical modulator chip having a top surface, a back surface and side surfaces, wherein the optical modulator chip is positioned on the grounded base with the back surface of the optical modulator chip facing the grounded base; and

a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip, wherein the first and second ground electrodes are connected to first and second extended ground electrodes that extend down at least one side of the optical modulator chip and connect to the grounded base.

2. The optical device of claim 1, wherein the first and second extended ground electrodes are connected to each other on the back surface of the optical modulator chip.

3. The optical device of claim 2, wherein the extended ground electrodes and the connection of the extended ground electrodes are additional conductive layers connected to the ground electrodes, same conductive layers as the ground electrodes, conductive paste applied to the optical modulator chip so as to connect to the ground electrodes, or other conductive means.

4. The optical device of claim 1, wherein lengths of the extended ground electrodes on a side of the optical modulator chip abut against the grounded base as a result of the optical modulator chip residing in a well within the grounded base.

5. The optical device of claim 1, where in the first and second ground electrodes are connected to each other on the top surface of the optical modulator chip.

6. The optical device of claim 1, wherein the first and second extended ground electrodes are connected to each other on a side surface of the optical modulator chip.

7. The optical device of claim 6, wherein the extended ground electrodes and the connection of the extended ground electrodes are additional conductive layers connected to the ground electrodes, same conductive layers as ground electrodes, conductive paste applied to the optical modulator chip so as to connect to the ground electrodes, or other conductive means.

8. The optical device of claim 1, wherein the extended ground electrodes are additional conductive layers connected to the ground electrodes, same conductive layers as ground electrodes, conductive paste applied to the optical modulator chip so as to connect to the ground electrodes, or other conductive means.

9. The optical device of claim 1, wherein an insulating buffer layer is on the top and side surfaces between the electrodes and the optical modulator chip.

10. The optical device of claim 1, wherein the first and second ground electrodes are connected on the top surface of the optical modulator chip.

11. An optical device comprising:

a grounded base;

a transition chip for interconnecting an optical modulator chip having a top surface, a back surface and side surfaces, wherein the transition chip is positioned on the grounded base with the back surface of the transition chip facing the grounded base; and

a first ground connection lead, a signal connection lead and a second ground connection lead located over the top surface of the transition chip, wherein the first and second ground connection leads are interconnected to first and second extended ground connection leads that extend down at least one side of the transition chip and connect to the grounded base.

12. The optical device of claim 11, wherein the first and second extended ground connection leads are connected to each other on the back surface of the transition chip.

13. The optical device of claim 12, wherein the extended ground connection leads and the connection of the extended ground connection leads are additional conductive layers connected to the ground connection leads, same conductive layers as ground connection leads, conductive paste applied to the transition chip so as to connect to the ground connection leads, or other conductive means.

14. The optical device of claim 11, wherein lengths of the extended ground connection leads on a side of the transition chip abut against the grounded base as a result of the transition chip residing in a well within the grounded base.

15. The optical device of claim 11, wherein the extended ground connection leads are additional conductive layers connected to the ground connection leads, same conductive layers as ground connection leads, conductive paste applied to the transition chip so as to connect to the ground connection leads, or other conductive means.

16. The optical device of claim 11, wherein the first and second ground connection leads are interconnected on the top surface of the transition chip.

17. The optical device of claim 11, wherein only one transition chip runs along a side of the optical modulator and is used for external interconnection to the optical modulator chip.

18. The optical device of claim 11, wherein the first and second extended ground connection leads extend down opposing side surfaces of the transition chip.

19. The optical device of claim 11, wherein conductive vias interconnect the ground connection leads to the grounded base through the transition chip.

20. An optical device comprising:

a grounded base;

an optical modulator chip positioned on the grounded base having a top surface, a back surface and side surfaces;

a first ground electrode, a signal electrode and a second ground electrode located over the top surface of the optical modulator chip;

a transition chip for interconnecting the optical modulator chip having a top surface, a back surface and side surfaces, wherein the transition is positioned on the grounded base with the back surface of the transition chip facing the grounded base; and

a first ground connection lead, a signal connection lead and a second ground connection lead located on the top surface of the transition chip, wherein the first and second extended ground connection leads are connected to first and second extended ground connection leads that extend down at least one side of the transition chip and connect to the grounded base.

21. The optical device of claim 20, wherein the first and second ground electrodes are connected to first and second extended ground electrodes that extend down at least one side of the optical modulator chip and connect to the grounded base.

22. The optical device of claim 21, wherein the first and second extended ground electrodes are connected to each other on the back surface of the optical modulator chip.

23. The optical device of claim 21, wherein the first and second extended ground connection leads are connected to each other on the back surface of the transition chip.

24. The optical device of claim 22, wherein the extended ground electrodes and the connection of the extended ground electrodes are additional conductive layers connected to the ground electrodes, same conductive layers as the ground electrodes, conductive paste applied to the optical modulator chip so as to connect to the ground electrodes, or other conductive means.

25. The optical device of claim 23, wherein the extended ground connection leads and interconnection of the extended ground connection leads are additional conductive layers connected to the ground connection leads, same conductive layers as the ground connection leads, conductive paste applied to the transition chip so as to connect to the ground connection leads, or other conductive means.

26. An optical device comprising:

a grounded base;

an optical modulator chip having a top surface, a back surface and side surfaces, wherein the optical modulator chip is positioned on the grounded base with the back surface of the optical modulator chip facing the grounded base;

at least one ground electrode and a signal electrode located over the top surface of the optical modulator chip, wherein the at least one ground electrode is connected to an extended ground electrode that extends down one side of the optical modulator chip and connects to the grounded base;

a transition chip for interconnecting the optical modulator chip having a top surface, a back surface and side surfaces, wherein the transition chip is positioned on the grounded base with the back surface of the transition chip facing the grounded base; and

at least one connection lead located on the top surface of the transition chip.

27. The optical device of claim 26, wherein the at least one ground electrode is a planar electrode.

28. The optical device of claim 26, wherein the at least one ground electrode is comprised of two or more ground electrodes each having extended ground electrodes that connect to the grounded base.

29. The optical device of claim 28, wherein the extended ground electrodes are connected to each other on a side of the optical modulator chip.

30. The optical device of claim 28, wherein the extended ground electrodes are connected to each other on the back surface of the optical modulator chip.

31. The optical device of claim 28, wherein the extended ground electrodes extend down different sides of the optical modulator chip.

32. The optical device of claim 28, wherein more than one extended ground electrode is connected to a ground electrode.

33. The optical device of claim 31, wherein the extended ground electrodes extend down different sides of the optical modulator chip.

34. An optical device comprising:

a grounded base;

at least one ground electrode and a signal electrode located over the top surface of the optical modulator chip;

at least one connection lead located on the top surface of the transition chip, wherein a conductive via through the transition chip interconnects the at least one ground connection lead with the grounded base.

35. The optical device according to claim 34, wherein there are one or more conductive vias for each connection.

36. An optical device comprising:

a grounded base on which an optical modulator chip is positioned;

a first ground electrode, a signal electrode and a second ground electrode located on the optical modulator chip; and

wherein the first and second ground electrodes are directly connected to each other and the grounded base on a side of the optical modulator chip.

37. An optical device comprising:

a grounded base on which an optical modulator chip is positioned;

a first ground electrode, a signal electrode and a second ground electrode located on the optical modulator chip;

a transition chip having a first connection lead connected to the first ground electrode, a signal connection lead connected to the signal electrode and a second connection lead connected to the second ground electrode; and

wherein the first and second connection leads are directly connected to each other and the grounded base on a side of the transition chip.