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US20020068161A1 - Wood-based composite board and method of manufacture - Google Patents

Wood-based composite board and method of manufacture Download PDF

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Publication number
US20020068161A1
US20020068161A1 US09/905,169 US90516901A US2002068161A1 US 20020068161 A1 US20020068161 A1 US 20020068161A1 US 90516901 A US90516901 A US 90516901A US 2002068161 A1 US2002068161 A1 US 2002068161A1
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Prior art keywords
resin
wood
filler
thermal conductivity
wood composite
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Abandoned
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US09/905,169
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English (en)
Inventor
Laurent Matuana
Julia King
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Michigan Technological University
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Michigan Technological University
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Priority to US09/905,169 priority Critical patent/US20020068161A1/en
Assigned to BOARD OF CONTROL OF MICHIGAN TECHNOLOGICAL UNIVERSITY reassignment BOARD OF CONTROL OF MICHIGAN TECHNOLOGICAL UNIVERSITY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KING, JULIA A., MATUANA, LAURENT MALANDA
Publication of US20020068161A1 publication Critical patent/US20020068161A1/en
Priority to US10/352,481 priority patent/US6702969B2/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/249925—Fiber-containing wood product [e.g., hardboard, lumber, or wood board, etc.]

Definitions

  • the present invention relates generally to wood-based composite boards or panels such as particle board, oriented strand board, waferboard, fiberboard and the like. More particularly, the present invention relates to a method and the composite board product made from using materials having high thermal conductivity, such as carbons, metals, carbides and nitrides, as fillers in the manufacturing of such particle boards.
  • Wood-based composite board is typically a panel manufactured from wood materials, primarily in the form of particles (particleboard), flakes (oriented strand board (OSB) or waferboard (random-orientation of flakes)), and fibers (medium density fiberboard, MDF), combined with a thermoset resin and bonded at an elevated temperature and an elevated pressure typically in a hot press.
  • the process is sometimes referred to as hot pressing.
  • the productivity or throughput of a plant or a production line depends heavily on the major production steps including wood drying, resin application, and hot pressing. Hot pressing is considered a costly unit operation. A reduced pressing time, therefore, will have positive impacts on lowering the production costs and increasing wood board output capacity.
  • the wood-based composite industry is constantly looking for strategies to reduce the pressing time.
  • the pressing time which is defined as the time it takes to compress a mat made of wood pieces and resins to the final board thickness once the press platens make contact with the mat surfaces, must be sufficiently long to allow proper curing of the thermoset resin present in the mat.
  • the heat transfer from the mat faces to the core is a critical factor in determining the curing rate of the resin, thus the final press time. Because of the low heat conductivity of wood and wood pieces, the cure of the resin takes place first in the faces when the hot platens are in contact with the mat during pressing while the core of the board is still cold. Consequently, a fairly long time will be needed for sufficient heat to reach the core of the board, which will allow the middle (core) of the board to cure.
  • the thickness swelling of wood-based composite panels depends on both the nature of their constituents and the manufacturing process. As already discussed, the panels are made up of small pieces of wood bonded together with adhesives or thermoset resins at elevated temperature and elevated pressure to develop adequate mechanical strength properties. During this process, the wood is typically densified by a factor up to 1.3 times higher than its original density. Internal stresses are induced and built-up within and between flakes/particles during densification. When the panel absorbs water, these internal stresses are relieved and the compressed wood springs back to regain its natural form and density. As a result, the panel swells in the thickness direction.
  • the present invention relates to a wood composite for making board or panel and the like comprising a plurality of wood pieces; a thermoset resin capable of binding the wood pieces; and a filler having a high thermal conductivity.
  • the wood pieces are in a form selected from particles, flakes, fibers or mixtures thereof.
  • the wood pieces or the product board (or panel) also may be acetylated.
  • the filler may be selected from a group consisting of metals such as aluminum, iron, tungsten, zinc, copper, tin, titanium and mixtures thereof; carbon filler such as natural graphite, synthetic graphite, scrap graphite, carbon black, carbon fiber, metal (such as nickel) coated carbon fiber, carbon nanotubes, coke and mixtures thereof; a nitride such as silicon nitride, carbon nitride, boron nitride; a carbide such as silicon carbide; conducting polymers; and mixtures thereof.
  • metals such as aluminum, iron, tungsten, zinc, copper, tin, titanium and mixtures thereof
  • carbon filler such as natural graphite, synthetic graphite, scrap graphite, carbon black, carbon fiber, metal (such as nickel) coated carbon fiber, carbon nanotubes, coke and mixtures thereof
  • a nitride such as silicon nitride, carbon nitride, boron nitride
  • a carbide such
  • thermoset resin is selected from the group consisting of phenolic resin, MDI resin, urea resin, melamine resin, epoxy resin, urethane resin, particularly non-foaming urethane resins and mixtures thereof.
  • a catalyst may also be added to the composition to accelerate curing of the thermoset resin and/or reducing the hot-pressing time.
  • the present invention also relates to a method for manufacturing wood composite board (including panels), the method comprises mixing a thermoset resin and a plurality of wood pieces to form a blend; adding a filler having a high thermal conductivity to the blend to form a mixture; placing the mixture in a shaped container; and applying an elevated temperature and an elevated pressure to the mixture in the shaped container to form the wood composite board.
  • FIG. 1 is a graphic illustration of the present invention and its effect on pressing time and bond strength.
  • FIG. 2 is a graphic illustration of a preferred embodiment of the invention and its effect of pressing time on thickness swelling after 24 hours in cold water.
  • FIG. 3 is a graphic illustration of the invention and effect of pressing time on the density of particleboard.
  • FIG. 4A is a graphic illustration of the temperature profile of the invention.
  • FIG. 4B is a graphic illustration of FIG. 4a where the x-axis is shortened.
  • the present invention provides a new and improved wood-based composite board or panels and a method of producing such.
  • the present invention combines a high thermal conductivity filler such as carbon fillers with wood flakes, particles, or fibers as a means to promote resin cure and reduce water absorption and thickness swelling of the composite wood board or panel.
  • a filler with relatively high thermal conductivity reduces press times, water absorption, and/or thickness swelling.
  • a further object of the present invention is to provide a new and improved wood-based composite board or panel product and method thereof which reduces the water absorption of the board or panel.
  • Still another object of the present invention is to provide a new and improved wood-based composite board or panel product and method thereof which reduces the thickness swelling.
  • Wood pieces may come from various trees such as coniferous trees, broadleaf trees, softwood, hardwood, aspen, fast-growing trees, poplar, birch, waste wood products, extracted or treated (for example with a solvent) wood pieces and mixtures thereof. They can be in a form selected from particles, flakes, fibers and mixtures thereof. The wood pieces or strands or board/panel may be further acetylated with known chemistry/methods to further increase water/moisture resistance and/or improve dimensional stability of the final product.
  • Thermoset resin also may be referred to as adhesive or binder, includes, but is not limited to phenolic resin, urea resin, melamine resin, epoxy resin, urethane resin and mixtures thereof.
  • a common and preferred phenolic resin is phenol-formaldehyde (PF) resin. Both slow curing and fast curing PF resins may be used.
  • Urethane resins such as MDI (methylene diphenyl diisocyanate) or TDI (toluene diisocyanate) based resins, may be foaming, non-foaming or mixtures thereof.
  • Non-foaming urethane resins are preferred urethane resins.
  • Foaming urethane resins may be used to impart desired properties either alone or with other thermoset resins disclosed here. A foaming agent may be needed.
  • a suitable filler should have a thermal conductivity that is higher than the thermal conductivity of the wood pieces or the thermoset resin.
  • Such filler having high thermal conductivity includes, but is not limited to, a material selected from the group consisting of carbon filler, carbides, nitrides, metals, conducting polymers and mixtures thereof.
  • a carbon filler may be selected from carbon fiber, metal (such as nickel) coated carbon fiber, carbon nanotubes, natural graphite, synthetic graphite (including high purity synthetic graphite), scrap graphite, various forms of coke, carbon black, and mixtures thereof.
  • Carbides may be selected from the group consisting of silicon carbide, tungsten carbide, and mixtures thereof.
  • nitrides include boron nitride, various forms of silicon nitride and mixtures thereof.
  • Suitable metals include, but are not limited to, aluminum, zinc, tungsten, iron, copper, titanium, tin, metal alloys and mixtures thereof.
  • Many different types of known conducting polymers also may be used as the filler for the present invention.
  • Non-limiting examples include doped or non-doped polyaniline, polypyrrole, and mixtures thereof.
  • the wood composite may further comprise a “catalyst.”
  • a catalyst here means a small amount of a material which can be used to increase curing of the thermoset resin, increase forming of the board or panel under the conditions, or both. Accordingly, any catalyst that is known to accelerate curing of any type of the thermoset resins disclosed herein is included, such as acid, base, etc. It should be understood that not every catalyst will work for all of the disclosed thermoset resins.
  • the wood composite has a general composition, by weight percent, as follows:
  • wood pieces 40 to 99.5; thermoset resins, 0.5 to 50; filler, 0.05 to 50; and catalyst, 0 to 5.
  • the filler may be about 5% by weight of the resin.
  • a wood composite board or panels such as but not limited to particle board, oriented strand board, waferboard, fiberboard, and the like is formed with the addition of a carbon filler.
  • a carbon filler such as but not limited to carbon fillers available from Conoco, Inc. with the trademark THERMOCARB®.
  • THERMOCARB® is a high purity synthetic graphite, which has the general properties as listed in Table 1 below: TABLE 1 Ash ⁇ 0.1 wt % Sulfur 0.02 wt % Vibrated Bulk Density 0.66 g/cc Density 2.24 g/cc Particle Sizing, vol % (by Sieve Method) +48 Tyler Mesh* 4 ⁇ 48/+80 Tyler Mesh 22 ⁇ 80/+200 Tyler Mesh 48 ⁇ 200/+325 Tyler Mesh 16 ⁇ 325 Tyler Mesh 10 Thermal Conductivity at 23° C. 600. W/mK on a 1 ⁇ 4′′ particle Electrical Resistivity 10 ⁇ 4 ohm-cm (approximate) Particle Aspect Ratio 2.0 Particle Shape Irregular
  • Typical thermal conductivity values for some common materials are 0.2 for wood, 10 0.2 for thermosetting resins, 1 for carbon black, 10 for carbonized polyacrylonitrile (PAN) based carbon fibers, 234 for aluminum, 400 for copper, and 600 for graphite (all values in W/mK).
  • a preferred embodiment to improving thermal conductivity of a wood composite is through the addition of a thermally conductive filler material, such as carbon.
  • carbon fillers will act as heat transfer medium by transferring heat from the faces to the core of the panel quicker and more efficiently. This faster heat transfer will shorten the press time during particle board, oriented strand board, waferboard, fiberboard, and the like during manufacturing.
  • Carbon is also less hygroscopic than wood; therefore, improving the dimensional stability, reducing water absorption, reducing linear expansion, and reducing thickness swelling of wood-based composites.
  • particle board is bonded and produced by incorporating THERMOCARB® in fast curing phenol formaldehyde (PF) core resin.
  • Particle board panel manufacture generally involved three different steps: 1) resin application, 2) mat formation, and 3) hot pressing.
  • the dried furnish (5 wt % moisture content furnish) was placed in a rotating-drum blender and sprayed with 5 percent liquid PF (based on oven dry weight of the furnish) core resin on the dried wood particle.
  • the liquid PF resin used was Georgia Pacific GPTM 167C09 ResiStran® core resin. Table 2 lists the properties of this resin. TABLE 2 pH approx. 11.5 Specific Gravity @ 25° C., g/cc 1.23 Wt % Volatile Matter 50
  • the wood particles used were 1 ⁇ 4′′ in size. They were produced from aspen flakes via grinding in a hammer mill. An atomization air pressure of 70 psig was used for the spray nozzles applying the liquid PF. The resin spraying time was 3 minutes but the retention-time of furnish in the blender was extended to an additional 2 minutes to achieve a better resin surface coverage.
  • Emulsion wax is typically used to reduce water absorption of the wood composite.
  • a single layer configuration mat was formed manually.
  • the blended materials were placed in a 12′′ by 12′′ forming mat box.
  • the formed mat was hot pressed in a laboratory press using the following press cycle. Press closing time: 10 seconds to press stops Pressing times at stops: 120, 240, and 360 seconds Decompression time: 20 seconds Total pressing time: 150, 270, and 390 seconds Press temperature: 375° F. (191° C.) Hence, three different pressing times (2, 4, and 6 min) were used.
  • Panel dimensions 12 inches by 12 inches (laboratory press)
  • Panel thickness ⁇ fraction (7/16) ⁇ in (11 mm)
  • Core resin type and content Liquid Core PF (Georgia Pacific), 5% (based on oven dry weight wood)
  • FIG. 1 shows that 2 minutes press time is too short for both the control and the THERMOCARB® synthetic graphite containing the particleboard. Not enough time transpired for the resin to cure.
  • FIG. 1 also shows that, at 4 and 6 minute press times, the internal bond (IB) strength of both the control particle board and the THERMOCARB® containing the particle board are similar. As seen by the brackets, 95% confidence intervals overlap. Thus, synthetic graphite does not inhibit the curing of the PF resin.
  • IB internal bond
  • Table 4 summarizes the results for thickness swelling of the particleboard bonded with PF and bonded with PF/THERMOCARB® resins. The thickness swelling is illustrated as a percentage. These results are also illustrated in FIG. 2.
  • FIG. 2 shows that for the 2 and 4-minute press times, the thickness swelling was lower for the particleboard containing the synthetic graphite as compared to the control. For the 6 minute press time, there is no significant difference. This result is significant since thickness swelling is a major problem in OSB in particular. With core resin, the synthetic graphite improves the thickness swelling of the board.
  • FIG. 3 shows that the density is similar for the control particleboard and the THERMOCARB® containing particleboard for all 3 pressing times.
  • IB is similar for the 4 and 6 minutes press times.
  • THERMOCARB® does not inhibit the curing of the PF resin.
  • thickness swelling is reduced for the 2 and 4 minutes press times as compared to the control (no THERMOCARB®).
  • board densities are similar for all three press times for the control and the THERMOCARB® synthetic graphite containing particleboard.
  • the synthetic graphite does not affect the board density.
  • Example 2 generally shows the cure rate and dimensional stability of particleboard bonded with PF/synthetic graphite resin with the use of a slower curing PF face resin.
  • Particleboard was produced using a PF face resin (slower curing) instead of the faster curing PF core resin used in Example 1. Press times between 2 and 4 minutes were used to try to identify the minimum time needed to cure the resin.
  • the board was manufactured as described in Example 1. 30 wt % THERMOCARB® was used based on weight of liquid PF resin.
  • the board property characterization included IB, thickness swelling, board density, maximum water absorption, linear expansion, flexural strength and modulus (ASTM D1037). Table 6, below, shows the internal bond properties of particleboard panels made with face resin.
  • Table 7 shows the density of particle board panels made with face resin and PF+ synthetic graphite.
  • TABLE 7 Density (g/cm 3 ) PF Control PF + Synthetic Graphite Press time (min) Press time (min) Samples 2 3 4 2 3 4 1 0.62 0.67 0.59 0.62 0.64 2 0.61 0.68 0.6 0.63 0.64 3 0.6 0.61 0.6 0.59 0.64 4 0.62 0.63 0.58 0.64 0.64 5 0.64 0.63 0.64 0.6 0.65 Average 0.62 0.64 0.60 0.62 0.64 Std. Dev 0.01 0.03 0.02 0.02 0.00
  • Table 8 shows the thickness swelling of particleboard made with face resin and PF+ synthetic graphite.
  • Example 3 generally shows synthetic graphite in oriented strand board (OSB) panels.
  • Target board density 40 lbs/ft3 (pcf)
  • Adhesive content 4 g solid PF/100 g dry flakes
  • Synthetic graphite contents 0, 0.5, 1, 2, and 3% (i.e., g of synthetic graphite/100 g dry flakes)
  • Press temperature 415° F. (temperature of platens).
  • Emulsion wax is used to reduce thickness swelling due to water absorption.
  • Table 9 shows the effect of synthetic graphite in various concentrations on the MOR, MOE, and density of OSB panels. Based on the results shown in Table 9, the inclusion of synthetic graphite does not degrade the flexural strength/stiffness of the OSB panels.
  • Thermocarb Content % is meant to refer to grams of Thermocarb/100 grams of dry flakes.
  • Table 10 shows the effect of various concentrations of synthetic graphite on the IB of OSB panels. TABLE 10 Sample Length Width Area Max. Load IB Thermocarb # (in) (in) (in2) (lbs) (psi) Note Content (%) 5A-0-1-B 1.988 1.958 3.893 49 13 5A-0-1-C 1.989 1.946 3.871 73 19 5A-0-2-B 1.988 1.953 3.883 65 17 0 5A-0-2-C 1.985 1.947 3.865 31 8 5A-0-3-B 1.987 1.947 3.869 61 16 5A-0-3-C 1.990 1.951 3.882 91 23 5A-0-4-B 1.994 1.946 3.880 84 22 5A-0-4-C 1.991 1.949 3.880 86 22 Average: 17 Std.
  • graphite still has a real heat transfer effect.
  • the optimum concentration of synthetic graphite appears to be below 1%, i.e., 1 g synthetic graphite/100 g dry flakes.
  • Table 11 shows the effect of synthetic graphite in various concentrations on the dimensional stability of OSB panels.
  • OSB panels were manufactured as described in Experiment 3. The thickness, however, of the board was increased to ⁇ fraction (23/32) ⁇ ′′, only 1% synthetic graphite was incorporated into the PF adhesive, and the temperature profile during hot pressing was the only property evaluated.
  • FIG. 4A shows the temperature profile for OSB panel ( ⁇ fraction (23/32) ⁇ ′′ thick) pressed at 400° F. (Platen temperature). The curves for pure PF and PF/1% synthetic graphite (1 g synthetic graphite/4 g PF) are illustrated. FIGS. 4A and 4B are the same, except the x-axis is shortened in FIG. 4B so that the heat conductivity enhancement can be observed.
  • Table 12 shows the curing kinetic parameters of PF (control) and PF/1% synthetic graphite resin. TABLE 12 Curing Kinetic Parameters EA ⁇ H Ln n-th Peak Temp. Samples (kJ/mol) (J/g) (k0) order (0° C.) PF control 128.2 ⁇ 271.7 31.9 ⁇ 1.95 152.5 0.9 0.3 PF + THERMOCARB ® 127.4 ⁇ 276.5 31.7 ⁇ 2.05 151.3 (1% THERMOCARB ®) 0.7 0.2
  • the results show that the synthetic graphite does not change the kinetics of the PF resin.
  • the synthetic graphite allows a faster cure by getting the heat into wood composite faster due to the high thermal conductivity of the synthetic graphite as compared to the low thermal conductivity (0.2 W/mk of the wood).
  • Example 5 entailed adding pitch based carbon fibers to oriented strandboard (OSB).
  • OSB oriented strandboard
  • the oriented strand boards were manufactured as described in Example 3 and tested accordingly. Carbon fibers used were 0.5 ′′ long, no sizing, with ozone surface treatment.
  • Carbon fiber contents % is meant to refer to grams of carbon fiber/100 grams of dry flakes. TABLE 13 Carbon Fiber Thickness Swell Water Absorption Contents (%) (%) (%) Average Std. Dev. Average Std. Dev. 0 36.6 3 75.3 4.3 0.2 39.7 4.4 76.4 6.6 0.3 38.4 3.8 80.3 3.8 0.4 36.1 3.5 75.8 6.6 0.5 36.4 2.9 74.7 4.1 1 42.9 4.2 81.8 4.6

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US7399438B2 (en) 2003-02-24 2008-07-15 Jeld-Wen, Inc. Thin-layer lignocellulose composites having increased resistance to moisture and methods of making the same
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CA2415929A1 (fr) 2002-01-24

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