US1901531A - Electrodeposition of platinum - Google Patents
Electrodeposition of platinum Download PDFInfo
- Publication number
- US1901531A US1901531A US588235A US58823532A US1901531A US 1901531 A US1901531 A US 1901531A US 588235 A US588235 A US 588235A US 58823532 A US58823532 A US 58823532A US 1901531 A US1901531 A US 1901531A
- Authority
- US
- United States
- Prior art keywords
- platinum
- bath
- sodium
- per cent
- alkali metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title description 31
- 229910052697 platinum Inorganic materials 0.000 title description 15
- 238000004070 electrodeposition Methods 0.000 title description 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- 239000000243 solution Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 6
- 229910052783 alkali metal Inorganic materials 0.000 description 5
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 description 4
- 229940039790 sodium oxalate Drugs 0.000 description 4
- 239000001117 sulphuric acid Substances 0.000 description 4
- 235000011149 sulphuric acid Nutrition 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000001464 adherent effect Effects 0.000 description 3
- -1 alkali metal oxalate Chemical class 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BLRHXYOZUHSROE-UHFFFAOYSA-N O=[Pt](=O)=O Chemical group O=[Pt](=O)=O BLRHXYOZUHSROE-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229940039748 oxalate Drugs 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical class ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ZSWXBIJLMOBGSP-UHFFFAOYSA-M [Na].Cl[Pt] Chemical compound [Na].Cl[Pt] ZSWXBIJLMOBGSP-UHFFFAOYSA-M 0.000 description 1
- YKIOKAURTKXMSB-UHFFFAOYSA-N adams's catalyst Chemical compound O=[Pt]=O YKIOKAURTKXMSB-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- LDMNYTKHBHFXNG-UHFFFAOYSA-H disodium;platinum(4+);hexahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Na+].[Na+].[Pt+4] LDMNYTKHBHFXNG-UHFFFAOYSA-H 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- NFOHLBHARAZXFQ-UHFFFAOYSA-L platinum(2+);dihydroxide Chemical compound O[Pt]O NFOHLBHARAZXFQ-UHFFFAOYSA-L 0.000 description 1
- BYFKUSIUMUEWCM-UHFFFAOYSA-N platinum;hexahydrate Chemical compound O.O.O.O.O.O.[Pt] BYFKUSIUMUEWCM-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
Definitions
- e present invention has for its principal object to overcome these dificulties and to provide stable baths from which bright platmum deposits may be obtained, of almost any desired thichess.
- an alkali metal oxalate as'for example sodium oxalate which prevents the formation of platinum trioxide. or compounds thereof on the anode, and retards or prevents the development of'a flocchlent precipitate in the bath, thus rendering it stable over long periods.
- sodium chloride formed by the reaction of the sodium hydroxide with the sodium chloroplatinate and the sodium sulphate, formed by the subsequent partial neutralization with sulphuric acid, act 'as conducting salts and increase the conductivity and throwing power of the plating bath.
- Example 2 alkalinity of less than 2.5 per cent and preferably of from 0.2 to 1.0 per cent, therequisite quantity of sodium oxalate, for example 0.5 per cent and suflicient sodium sulphate, for example 3 per cent to give a good throwing power.
- any other alkali metal hydroxide maybe usedin place of sodium hydroxide and any other soluble compound of tetravalent platinum, except-cyanide complexes, may beused in place of the sodium hexahydroxyplatinate.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Patented llrlar. 14, I233 UNITED STATES PATENT/OFFICE ALAN RICHARD POWELL AN'D ARTHUR WILLIAM SCOTT, OF LONDON, ENGLAND, AS-
SIGNORS'TO JOHNSON-MITRE! & COMPANY LIMITED, OF LONDON, ENGLAND mnc'monrzeo srrron or PLATINUM Ho Drawing. Application filed .Tanuary 22, 1932, Serial Ni). 588,235, and in Great Britain Hatch 12, 1931;
This invention relates to the electrolytic deposition of platinum from .aqueous solutions and to the preparation of suitable plating salts for this purpose.
It has already been proposed to deposit platinum electrolytically as a bright plate from baths consisting of a solution of platinum hydroxide (hexahydroxyplatinic acid) in caustic alkalies. This type of bath usually contains about 4 er cent of free alkali metal hydroxide and 1S operated at temperatures below centigrade with a current supplied at 2 volts. Although a bath prepared in this manner may yield good bright deposits for some time after being freshly made'up, it rapidly becomes turbid and a deposit of hydrated platinum trioxide forms on the anode; with more prolonged use a. heavy flocculent. precipitate of various platinum com ounds is formed, whereby the efiective platinum content of the bath is reduced and the deposits'become dull, patchy and loosely adherent.
It has also been proposed to employ neutral solutions containing potassium platmate and magnesium borocitrate as baths for plating purposes, but these baths'have found no commercial application. If these baths are rendered even slightly alkaline a grey tloceulent de sit of metallic platinum is produced.
e present invention has for its principal object to overcome these dificulties and to provide stable baths from which bright platmum deposits may be obtained, of almost any desired thichess. I
According to this invention we utillze an alkali metal platinate bath to which is added a stabilizer and which is then rendered almost neutral by the addition of a. mineral acid. This bath gives no deposit of platinum on the cathode when operated at temperatures below 40 centi rade, but at higher temperatures especially a ve about 65 centigrade a brilliant, white, smooth and firmly adherent deposit is obtained.
As a stabilizer we prefer to use substances which form soluble complexes with platinum,
such, for example, as oxalic, phosphoric or nitrous acids, or salts thereof. We have obtained particularly good results by the use of with water.
an alkali metal oxalate, as'for example sodium oxalate which prevents the formation of platinum trioxide. or compounds thereof on the anode, and retards or prevents the development of'a flocchlent precipitate in the bath, thus rendering it stable over long periods.
In order to obtain good results withthis bath we have found it necessary to keep the free alkalinity corresponding with a sodium hydroxide content of less than 2.5 per cent and advantageously between 0.2 and 1 per cent. As the platinum is removed from the electrolyte by plating, the free alkalinity of the bath will increase and consequently it is necessary to keep this increase within the limits just mentioned by occasional neutraliza- 100 ounces 'of sodium chloroplatin'ate (NagPtClo,6HgO) are dissolved in 6 gallons of hot water and 100 ounces of sodium hydroxide in solid form are then added to the hot solution. The liquid boils vigorously so that cold water must be added as required to keep the boiling under control. When all the sodium hydroxide has been added, the
solution is diluted to 12 gallons with hot water and boiling is continued for from 3 to 4 hours until the-colour of the liquid changes from orange to pale yellow; when the liquid has cooled slightly, a solution of 16 ounces of oxalic acid is added to form 17 ounces of sodium oxalate in the mixture and this is followed by 37 ounces of sulphuric acid diluted The platinum solution will now contain 17 ounces of free sodium hydroxide and after dilution to 24 gallons it contains approximately 1 per cent of latinum and v 0.5 per cent of free sodium hy ro xide. The
sodium chloride, formed by the reaction of the sodium hydroxide with the sodium chloroplatinate and the sodium sulphate, formed by the subsequent partial neutralization with sulphuric acid, act 'as conducting salts and increase the conductivity and throwing power of the plating bath.
Example 2 alkalinity of less than 2.5 per cent and preferably of from 0.2 to 1.0 per cent, therequisite quantity of sodium oxalate, for example 0.5 per cent and suflicient sodium sulphate, for example 3 per cent to give a good throwing power. y In the aforesaid examples any other alkali metal hydroxide maybe usedin place of sodium hydroxide and any other soluble compound of tetravalent platinum, except-cyanide complexes, may beused in place of the sodium hexahydroxyplatinate.
These baths are operated above 40 centirade and preferably at 65 to 85 centigrade with a current density of upto 20 amperes per square foot at 1.5 volts or higher;there is no evolution of hydrogen at the cathode and the current efiiciency is practically 100 i per cent. Bright adherent deposits of platinum are obtained with these baths on polished gold, silver, copper, brass, bronze and nickel-silver surfaces, but nickel, iron and steel surfaces must first be coatedwith copper and/or silver from an alkali metal cyanide I bath.
Satisfactory plates are produced until the platinum content of the bath falls to about. 0.4 per: cent; replenishment of the bath with platinum is then efiected by adding the req- I uisite quantity of platinic hydroxide prepared as hereinbefore described. This. may be added as a wet sludge, but is preferably previously dissolved in the minimum quantity of alkali metalhydroxide solution. In
. the latter case sulphuric acid equivalent to this alkali metal hydroxide must be added to the plating bath after the replenishing solution has been added so as to maintain the al- 'kalinity at approximately constant value.
What weclaim is -1. A process for the electrodeposition of platinum in the form of a bright plate in which the electrolyte comprises a .solution containing an alkali metal platinate, a con- I ducting salt, a stabilizing salt and an. alkali metal hydroxide in an amount equivalent to less than25 percent of free sodium hj- I droxide.
2. In the process as claimed in claim 1 employing as the stabilizing salt an alkali metal oxalate, preferably sodium oxalate.
' 3. In the process as claimed in claim 1 maintaining the free alkalinity at the equivalent of 0.2 to 1 per cent of sodium hydroxide.
4. In the process as claimed in claim 1 0perating the bath at a temperature above 40 centigrade and preferably at to 85 centigrade. 1 a
5. In the process as claimed in claim I replenishing the bath by the addition of a solution of hydrated platinicoxide in an alkaline solution.
6; In the process as claimed in claim 1 controlling iJlN alkalinity Within the limit specified-in claim 1 by the occasional addition of an acid and preferably sulphuric acid.
7*. In the process as claimed in claim 1, controlling the alkalinity at the equivalent of 0.2 to 1% of sodium hydroxide by the occasional adddition ofan acid and preferably sulphuric 301' Y 1- In testimony, we have signed our names to this specification at, London, England, this 4th day of J anuary,- 1932.
ALAN RICHARD POWELL.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7600/31A GB363569A (en) | 1931-03-12 | 1931-03-12 | Improvements in or relating to the electro-deposition of platinum |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US1901531A true US1901531A (en) | 1933-03-14 |
Family
ID=9836227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US588235A Expired - Lifetime US1901531A (en) | 1931-03-12 | 1932-01-22 | Electrodeposition of platinum |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US1901531A (en) |
| DE (1) | DE606052C (en) |
| GB (1) | GB363569A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5549738A (en) * | 1990-06-29 | 1996-08-27 | Electroplating Engineers Of Japan, Limited | Platinum electroforming bath |
| US6306277B1 (en) | 2000-01-14 | 2001-10-23 | Honeywell International Inc. | Platinum electrolyte for use in electrolytic plating |
-
1931
- 1931-03-12 GB GB7600/31A patent/GB363569A/en not_active Expired
-
1932
- 1932-01-22 US US588235A patent/US1901531A/en not_active Expired - Lifetime
- 1932-02-14 DE DEM118768D patent/DE606052C/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5549738A (en) * | 1990-06-29 | 1996-08-27 | Electroplating Engineers Of Japan, Limited | Platinum electroforming bath |
| US6306277B1 (en) | 2000-01-14 | 2001-10-23 | Honeywell International Inc. | Platinum electrolyte for use in electrolytic plating |
| US6521113B2 (en) | 2000-01-14 | 2003-02-18 | Honeywell International Inc. | Method of improving the oxidation resistance of a platinum modified aluminide diffusion coating |
Also Published As
| Publication number | Publication date |
|---|---|
| GB363569A (en) | 1931-12-24 |
| DE606052C (en) | 1934-11-23 |
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