TWM619170U - Probe structure - Google Patents

Abstract

This creation discloses a probe structure, which includes a probe body and a functional layer. The probe body includes a central section, a first contact section and a second contact section. The first contact section is connected to one end of the central section, and the second contact section is connected to the other end of the central section relative to the first contact section. The functional layer is disposed on at least one of the first contact section or the second contact section, and includes an adhesion layer and an outer coating layer, and at least a part of the outer coating layer covers the adhesion layer. The probe structure of this creation can improve the durability of the probe to extend the service life of the probe.

Description

Probe structure

The present creation relates to a probe structure, in particular to a probe structure for integrated circuit testing.

In order to avoid unnecessary cost increase due to the continued packaging of defective products, probe cards are generally used to perform functional tests on the uncut die on the wafer before packaging, so as to pre-screen the defective products . Specifically, the probe card contains a plurality of metal probes. When testing, one end of each metal probe is abutted against the solder ball on the wafer to be tested, and the other end is coupled to the testing instrument, so that the die (component) of the wafer to be tested is electrically connected to the testing instrument. Sexual connection. The test instrument receives the signal and analyzes the quality of the wafer to be tested based on the measured signal, and screens out defective products.

Existing metal probes use copper (Cu) as a substrate, and a gold (Au) layer is plated on the outer surface of the substrate, so that the metal probe has better conductivity. However, how to improve the durability of the probe and extend the service life of the probe through the improvement of the structural design is still one of the important issues to be solved by this business.

The technical problem to be solved by this creation is to provide a probe structure in response to the shortcomings of the prior art, so as to improve the durability of the probe structure and extend the life of the probe structure.

In order to solve the above technical problems, the author provides a probe structure, which includes a probe body and a functional layer. The probe body includes a central section, a first contact section and a second contact section. The first contact section is connected to one end of the central section, and the second contact section is connected to the other end of the central section relative to the first contact section. The functional layer is disposed on at least one of the first contact section or the second contact section. The functional layer includes an adhesion layer and an outer covering layer, and at least a part of the outer covering layer covers the adhesion layer.

One of the beneficial effects of this creation is that the probe structure provided by this creation can pass through "the functional layer includes an adhesion layer and an outer covering layer" and "the functional layer is arranged in the first contact section or the second contact section" "At least one of the above" technical solutions to improve the adhesion of the functional layer to the probe body, thereby increasing the durability of the probe structure and prolonging the life of the probe structure.

In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation. However, the drawings provided are only for reference and explanation, and are not used to limit this creation.

The following is a specific embodiment to illustrate the implementation of the "probe structure" disclosed in this creation, and those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings of this creation are merely schematic illustrations, and are not depicted in actual size, and are stated in advance. The following implementations will further describe the related technical content of this creation in detail, but the disclosed content is not intended to limit the scope of protection of this creation. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Referring to FIG. 1 to FIG. 3, the first embodiment of the present creation provides a probe structure P, which includes a probe body 1 and a functional layer 2. The probe structure P provided by this creation can be installed on a probe card (not shown) to test the object under test (such as a wafer). In detail, the probe structure P of this embodiment can be a cobra pin, a cantilever pin, a micro cube pin, a tubeless pin, VI probe pin (VI probe pin), pogo pin (pogo pin) or MEMS pin (MEMS pin), etc., this creation is not limited. The probe structure P shown in FIG. 1 is only used as an example to illustrate the creation, and is not used as a limitation. In the probe structure P of the present invention, the probe body 1 may include a central section 11 and a first contact section 12 and a second contact section 13 respectively connected to two opposite ends of the central section 11. In other words, the first contact section 12 and the second contact section 13 respectively extend from two opposite ends of the central section 11 in opposite directions. In detail, the first contact section 12 is disposed at one end of the central section 11, and the second contact section 13 is connected to the other end of the central section 11 relative to the first contact section 12.

In actual use, multiple probe structures P can be fixed on the probe card, so that the first contact section 12 of each probe structure P can be used to contact the contact point on the surface of the object to be measured, and the second contact section 13 can be used It is connected to a contact point on a transfer carrier board, but this creation is not limited to this. In the embodiment of this creation, the diameter of the end of the first contact section 12 is tapered along the direction away from the central section 11 to form a tip, but this creation is not limited to this. In another embodiment, the first contact section 12 may also have a flat contact end. In yet another embodiment, the diameter of the first contact section 12 may also be consistent along the long axis direction of the probe body 1.

In addition, the length of the central section 11 may be greater than the lengths of the first contact section 12 and the second contact section 13, and the length of the first contact section 12 may be equal to the length of the second contact section 13. For example, the length of the central section 11 may be 40% to 60% of the total length of the probe body 1. In addition, the length of the first contact section 12 may be 20% to 40% of the total length of the probe body 1, and the length of the second contact section 13 may be 20% to 40% of the total length of the probe body 1. However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present creation.

As shown in FIG. 2, in this embodiment, the cross-sectional shape of the probe body 1 may be circular. However, the cross-sectional shape of the probe body 1 may also be an ellipse, a triangle, a quadrilateral, or other geometric shapes, and this creation is not limited to this. In addition, in this embodiment, the cross-sectional shape of the central section 11 is the same as the cross-sectional shape of the first contact section 11 (or the second contact section 12), but this creation is not limited.

In practical applications, the same probe structure P may need to be used repeatedly to detect bulk test objects. Therefore, the probe structure P of this embodiment further includes a functional layer 2, which can increase the durability, wear resistance and adhesion resistance of the probe structure P. In detail, the functional layer 2 covers at least one of the first contact section 12 and the second contact section 13 of the probe body 1. In this embodiment, the functional layer 2 is coated on the first contact section 12 of the probe body 1. In other embodiments, the functional layer 2 may also be coated on the second contact section 13 of the probe body 1.

Please refer to FIG. 2 and FIG. 3. In this embodiment, the functional layer 2 includes an adhesion layer 21 and an outer coating layer 22. The adhesion layer 21 can improve the adhesion of the functional layer 2 to the probe body 1, and the outer coating layer 22 can improve the wear resistance and adhesion resistance of the probe structure P.

In detail, the functional layer 2 is disposed on the first contact section 12 or the second contact section 13. After the probe structure P touches the surface of the object to be tested or the contact point of the transfer carrier board and performs measurement, the probe structure P needs to be separated from the contact point of the object to be tested or the transfer carrier board. When the probe structure P is separated from the contact point of the test object or the transfer carrier board, the functional layer 2 will be subjected to a relatively large external force. Therefore, in an embodiment of the present invention, the functional layer 2 further includes an adhesion layer 21 directly in contact with the probe body 1, so as to improve the adhesion between the functional layer 2 and the probe body 1. In this way, after detecting a large number of objects to be tested, the functional layer 2 is less likely to be peeled off due to repeated external force, which will contaminate the object to be tested or the contacts of the transfer carrier board, and affect the detection effect. In addition, improving the adhesion between the functional layer 2 and the probe body 1 can also improve the durability of the probe structure P.

In an embodiment, the thickness of the functional layer 2 may range from 10 nm to 400 nm, and the thickness of the adhesion layer 21 may be less than or equal to the thickness of the outer coating layer 22. In an embodiment, the thickness of the adhesion layer 21 may range from 1 nm to 10 nm. When the thickness of the adhesion layer 21 is less than 1 nm, it is not sufficient to increase the adhesion between the functional layer 2 and the probe body 1, and when the thickness of the adhesion layer 21 is greater than 10 nm, the manufacturing cost of the adhesion layer 21 may increase.

In addition, in a preferred embodiment, the thickness of the outer coating layer 22 may range from 10 nm to 400 nm, preferably from 10 nm to 200 nm. Furthermore, when the thickness of the outer coating layer 22 is less than 10 nm, it is difficult to significantly improve the abrasion resistance and adhesion resistance of the functional layer 2. When the thickness of the outer coating layer 22 is greater than 400 nm, the resistance is likely to increase, which affects the test performance of the probe structure P.

In addition, the material of the adhesion layer 21 can be a low-resistance (high-conductivity) material, such as metal. In an embodiment, the material of the adhesion layer 21 can be selected from zirconium (Zr), titanium (Ti), silver (Ag), gold (Au), palladium (Pd), platinum (Pt), nickel (Ni), copper (Cu), chromium (Cr), molybdenum (Mo), tungsten (W), vanadium (V), niobium (Nb), tantalum (Ta), iron (Fe), cobalt (Co), ruthenium (Ru), rhodium (Rh), Iridium (Ir) and any combination of these groups.

It should be noted that when the probe structure P is used to detect the object to be tested (such as a wafer), the first contact section 12 of the probe structure P will pierce the electrical contact point (such as a solder ball). ) The oxide layer on the surface. Therefore, the functional layer 2 provided on the first contact section 12 is subject to friction and wear. As the number of tests increases, the degree of wear of the functional layer 2 becomes more severe. Therefore, in the present creation, the material of the outer covering layer 22 of the functional layer 2 can be selected from materials with low resistance and higher hardness to increase the wear resistance of the probe structure P and prolong the service life of the probe structure P.

In addition, when the existing probes are used for detection, the probes will generate heat due to energization, which may cause the solder balls to be partially melted and stick to the probes. If you continue to use the stuck probe to detect another object to be tested, the probe may be stuck, which may cause errors in the detection value.

Therefore, in this creation, in addition to choosing the material of the outer covering layer 22 of the functional layer 2 with low resistance and high hardness, it can also be further selected with anti-sticking materials to avoid reducing the accuracy of the measurement. . In an embodiment, the material of the outer cladding layer 22 may at least include metal nitride. For example, the material of the outer cladding layer 22 can be selected from zirconium nitride (ZrN), titanium nitride (TiN), yttrium nitride (YN), hafnium nitride (HfN), lanthanum nitride (LaN), nitrogen Neodymium (NdN) and any combination thereof.

In an embodiment of the invention, both the adhesion layer 21 and the outer coating layer 22 can be formed on the outer surface of the probe body 1 through a sputtering process, but the invention is not limited to this. In one embodiment, the materials of the adhesion layer 21 and the outer coating layer 22 have the same metal elements. For example, when the material of the adhesion layer 21 is zirconium, the material of the outer coating layer 22 may be zirconium nitride.

When the functional layer 2 is made by the sputtering process, the adhesion layer 21 and the outer coating layer 22 can be formed on the probe body 1 without changing the target material, so as to avoid the adhesion layer 21 and the outer coating layer Between 22 oxides are formed. For example, after the adhesion layer 21 is formed on the probe body 1, nitrogen can be directly introduced into the sputtering chamber to make the metal atoms and the reaction gas undergo a nitridation reaction, and the outer coating layer 22 is formed on the adhesion layer 21 . However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present creation.

In an embodiment of the present invention, the adhesion layer 21 is first covered on the first contact section 12, and then an outer covering layer 22 is formed to cover the adhesion layer 21. On the whole, the functional layer 2 can not only make the probe structure P have low resistance, but also have higher adhesion to the probe body 1, and can increase the durability of the probe structure P. In addition, the functional layer 2 can also increase the hardness and adhesion resistance of the probe structure P.

[Second Embodiment]

FIG. 4 is a partial enlarged schematic diagram of the probe structure P according to the second embodiment of the creation. The same elements in the second embodiment and the first embodiment have the same reference numerals, and the same parts are not described again.

As shown in FIG. 4, the functional layer 2 may be provided on the first contact section 12 or the second contact section 13. In addition, in the functional layer 2 of this embodiment, the adhesion layer 21 is not completely covered by the outer coating layer 22. Furthermore, in this embodiment, the adhesion layer 21 is directly formed on the first contact section 12 or the second contact section 13 of the probe body 1, and the outer coating layer 22 partially covers the outer surface of the adhesion layer 21.

For example, the outer coating layer 22 may cover 40% to 60% of the total surface area of the adhesion layer 21. Specifically, the outer covering layer 22 may cover the adhesion layer 21 provided at the end of the first contact section 12. However, as long as the area on the first contact section 12 for contacting the contact point of the object to be measured forms a double-layer structure with the adhesion layer 21 and the outer covering layer 22, the present creation is not limited to this example.

Accordingly, in this embodiment, the thickness of different regions of the functional layer 2 may not be consistent. In detail, since the outer coating layer 22 is only formed on the adhesion layer 21 at the end of the first contact section 12 or the second contact section 13, the thickness of the functional layer 2 at the part farther from the central section 11 is greater than that at the part closer to the center. The thickness of the section 11 part. However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present creation.

[Third Embodiment]

FIG. 5 is a partial enlarged schematic diagram of the probe structure P according to the third embodiment of the creation. The same elements in the third embodiment and the first embodiment have the same reference numerals, and the same parts will not be described again.

The functional layer 2 may be provided on the first contact section 12 or the second contact section 13. As shown in FIG. 5, the functional layer 2 includes an adhesion layer 21 and an outer covering layer 22. In this embodiment, in addition to the outer covering layer 22 completely covering the adhesion layer 21, a part of the outer covering layer 22 will cover the outer surface of the probe body 1. In other words, the total surface area of the outer coating layer 22 is greater than the total surface area of the adhesion layer 21, so that a part of the outer coating layer 22 covers the adhesion layer 21, and another part of the outer coating layer 22 directly covers the first Contact section 12. In this embodiment, the total surface area of the outer coating layer 22 is about 1.2 to 2 times the total surface area of the adhesion layer 21. In addition, the adhesion layer 21 can be disposed on the end of the first contact section 12 or the second contact section 13, so that the probe structure P has a double layer of the adhesion layer 21 and the outer coating layer 22 in the area of the contact point contacting the object under test. Layer structure.

In this embodiment, the functional layer 2 may have the same thickness in different regions, but the outer coating layer 22 may have different thicknesses in different regions. Specifically, the thickness of a part of the outer covering layer 22 covering the adhesion layer 21 is smaller than the thickness of the other part of the outer covering layer 22 that is not covered with the adhesion layer 21 but directly contacts the first contact section 12. In other words, the thickness of the outer covering layer 22 at the end of the first contact section 12 (farther from the central section 11) is greater than the thickness of the outer covering layer 22 on the outer surface of the first contact section 12 (closer to the central section 11). However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present creation.

[Fourth Embodiment]

FIG. 6 is a schematic longitudinal cross-sectional view of the probe structure P according to the fourth embodiment of the creation. The same elements in the fourth embodiment and the first embodiment have the same reference numerals, and the same parts will not be repeated.

In this embodiment, the functional layer 2 may be formed on the first contact section 12 and the second contact section 13 of the probe body 1. Specifically, the adhesion layer 21 and the outer coating layer 22 of the functional layer 2 are formed at the ends of the first contact section 12 and the second contact section 13, so that both ends of the probe structure P have abrasion resistance and Adhesion resistance.

When the probe structure P is used to detect the object to be measured (such as a wafer), the loss caused by the contact of the probe structure P and the contact of the object to be measured and the contact of the transfer carrier board can be reduced. Therefore, compared with the embodiment in which the functional layer 2 is only provided on the first contact section 12 or the second contact section 13, the probe structure P of this embodiment has higher durability.

It is worth mentioning that since the functional layer 2 is formed on at least one of the first contact section 12 and the second contact section 13, the first contact section 12 and the second contact section 13 are used to separate electrical properties. The resistance value of the functional layer 2 should not be too high for the contacts that contact the object under test and the contacts on the transfer carrier board, so as to avoid affecting the electrical test of the object under test. Further, the surface resistance of the creative functional layer 2 is measured with a Hall effect analyzer, and then the surface resistance is multiplied by the thickness to obtain the total resistivity. The total resistivity of the functional layer 2 in this creative embodiment ranges from 20x10 ^-6 ohm. cm to 80x10 ^-6 ohm. cm.

In order to further illustrate the influence of the adhesion layer 22 of the present creation on the adhesion of the functional layer 2, the adhesion of the functional layer 2 was tested by scratching with a nanoindenter/scratch meter. The experimental method is to fix the test piece with the film layer on the nanoindenter/scratch tester, and then use a diamond squeegee to gradually increase the load on the test piece with the film layer to carry out the scratch test. The load range is from 300 to 400 mN. The critical load of the film is estimated by the depth of the scratch when the film is broken. The greater the critical load, the stronger the adhesion of the film. The critical load range of the functional layer 2 provided by this creative embodiment can be 100 mN to 300 mN.

Please refer to Table 1 below to perform the above tests with the functional layer 2 of the comparative example and the creative embodiment respectively. The total thickness of the functional layer of the comparative example and the embodiment is 100 nm, but the film layer of the comparative example does not have an adhesion layer, and the functional layer of the embodiment includes an adhesion layer of 10 nm and an outer coating layer of 90 nm. Furthermore, the comparative example has no adhesion layer, only a zirconium nitride layer, while the functional layer of the embodiment includes an adhesion layer and an outer coating layer, wherein the material of the adhesion layer is zirconium, and the material of the outer coating layer is zirconium nitride . The experimental results are shown in Table 1.

Table 1 (Unit: mN) Comparative example (no adhesion layer) Example (with adhesion layer) Test point 1 160.85 244.74 Test point 2 166.48 270.31 Test point 3 189.65 239.05 average 172.32 254.49

According to the results in Table 1, in the comparative example (without adhesion layer), the average critical load measured at different test points is 172.32 mN. In the embodiment (including the adhesion layer and the outer coating layer), the critical load measured at different test points is at least 200 mN. Furthermore, the critical load range of the functional layer of this embodiment at different test points can be 220 mN to 300 mN. Specifically, the average critical load obtained by different test points of the functional layer of this embodiment is 254.49 mN. The experimental results in Table 1 prove that the adhesion layer 21 can indeed increase the adhesion between the probe body 1 and the functional layer 2, which can prevent the functional layer 2 from being gradually peeled off from the probe body 1 as the number of inspections increases, and can increase the detection rate. Durability of the needle structure P. In addition, avoiding peeling of the functional layer 2 can also avoid affecting the accuracy of detection.

In addition, a nanoindenter/scratch meter was also used to perform pressure measurement on the aforementioned comparative examples and examples. The test method is to fix the test piece with the film layer on the nanoindenter/scratch tester, and then use the nano-diamond indenter to apply a load of 0.0001 mN to 0.1 mN to the different test points of the test piece with the functional layer. The load holding time is 63 seconds, and the average value of the hardness measured at different test points. In this creative embodiment, the average hardness of the functional layer 2 ranges from 26 GPa to 32 GPa. The experimental results are shown in Table 2.

Table 2 (Unit: GPa) Comparative example (no adhesion layer) Example (with adhesion layer) Test point 1 22.97 24.21 Test point 2 21.61 25.69 Test point 3 25.44 28.10 average 23.34 26.00

According to the results of Table 2, the hardness of the functional layer of this example is also higher than that of the film layer of the comparative example. Furthermore, the average hardness of the film layer of the comparative example was 23.34 GPa, while the average hardness of the functional layer of this example reached 26.00 GPa. Accordingly, the functional layer 2 of the creative embodiment does have a relatively high hardness, which can improve the wear resistance of the probe structure P. In addition, the abrasion speed of the functional layer 2 in this creative embodiment is also low, which can increase the service life of the probe structure P.

In addition, deionized water is dropped on a test piece with a functional layer, and a water drop contact angle measuring instrument is used to measure the water drop contact angle of the drop on the functional layer 2 of this creative embodiment. The contact angle of water droplets refers to the angle formed by the contact between the liquid/gas interface and the surface of the solid (functional layer 2). The larger the value of the contact angle of the droplet, the smaller the surface energy, that is, the higher the hydrophobicity of the surface contacted by the droplet, and the better anti-sticking property. Generally speaking, if the surface is hydrophobic, the contact angle of the water droplet will be greater than 90°. Through actual tests, in this embodiment, the contact angle of the water droplet formed by the droplet on the surface of the functional layer 2 can be greater than or equal to 100°. In an embodiment, the contact angle of the water droplet on the functional layer 2 may be 108.82°. Therefore, the functional layer 2 of the present invention can improve the anti-sticking property of the probe structure P, so as to avoid the partial melting of tin due to heat during the test process from sticking to the probe structure P, which may affect another object under test in the future. The accuracy of the test. In addition, improving the adhesion resistance of the probe structure P can also reduce the frequency of cleaning the probe structure P.

Based on the above, the functional layer 2 provided by this creative embodiment not only has a lower resistance and can make the probe structure P meet the requirements for packaging and testing, but also can make the probe structure P have higher wear resistance and Adhesion resistance, thereby achieving the effect of improving measurement efficiency and prolonging the service life of the probe structure P.

[Beneficial effects of the embodiment]

One of the beneficial effects of this creation is that the probe structure P provided by this creation can pass through "the functional layer 2 includes an adhesion layer 21 and an outer covering layer 22" and "the functional layer 2 is arranged in the first contact section 12 or at least one of the second contact section 13" to improve the adhesion effect of the functional layer on the probe body and increase the durability of the probe structure.

Furthermore, in an embodiment of the present invention, an adhesion layer 21 and an outer coating layer 22 can be formed on the probe body 1 through a sputtering process to form the functional layer 2. The outer covering layer 22 provided by this creation can improve the adhesion resistance and abrasion resistance of the probe structure P, and the adhesion layer 21 between the probe body 1 and the outer covering layer 22 can improve the probe body The adhesion between 1 and the functional layer 2 makes the probe structure P have a lower resistance. Therefore, the probe structure P of the present invention can have better durability, reduce the frequency of cleaning or replacing the probe structure P, thereby increasing the productivity utilization rate.

The content disclosed above is only a preferred and feasible embodiment of this creation, and does not limit the scope of patent application for this creation. Therefore, all equivalent technical changes made using this creation specification and schematic content are included in the application for this creation. Within the scope of the patent.

P: Probe structure 1: Probe body 11: Central section 12: The first contact segment 13: The second contact section 2: Functional layer 21: Adhesion layer 22: Outer cladding layer

FIG. 1 is a schematic longitudinal cross-sectional view of the probe structure of the first embodiment of the creation.

FIG. 2 is a schematic cross-sectional view of the probe structure of the first embodiment of the creation along the line II-II in FIG. 1.

FIG. 3 is a partial enlarged schematic diagram of the probe structure of the first embodiment of the creation in the area III of FIG. 1.

Fig. 4 is a partial enlarged schematic diagram of the probe structure of the second embodiment of the creation.

FIG. 5 is a partial enlarged schematic diagram of the probe structure of the third embodiment of the creation.

FIG. 6 is a schematic longitudinal cross-sectional view of the probe structure of the fourth embodiment of the creation.

P: Probe structure

1: Probe body

11: Central section

12: The first contact segment

13: The second contact section

2: Functional layer

21: Adhesion layer

22: Outer cladding layer

Claims (15)

A probe structure, which includes: A probe body, the probe body includes: A central section A first contact section connected to one end of the central section; and A second contact section connected to the other end of the central section relative to the first contact section; and A functional layer, which is disposed on at least one of the first contact section or the second contact section, and includes an adhesion layer and an outer coating layer, wherein the outer coating layer at least partially covers The adhesion layer. The probe structure according to claim 1, wherein the thickness of the adhesion layer is smaller than the thickness of the outer coating layer. The probe structure according to claim 1, wherein the thickness of the functional layer ranges from 10 nm to 400 nm. The probe structure according to claim 1, wherein the material of the adhesion layer includes at least metal. The probe structure according to claim 1, wherein the material of the adhesion layer is selected from zirconium (Zr), titanium (Ti), silver (Ag), gold (Au), palladium (Pd), platinum (Pt) , Nickel (Ni), copper (Cu), chromium (Cr), molybdenum (Mo), tungsten (W), vanadium (V), niobium (Nb), tantalum (Ta), iron (Fe), cobalt (Co) , Ruthenium (Ru), rhodium (Rh), iridium (Ir) and any combination of them. The probe structure according to claim 1, wherein the thickness of the adhesion layer ranges from 1 nm to 10 nm. The probe structure according to claim 1, wherein the material of the outer coating layer includes at least metal nitride. The probe structure according to claim 1, wherein the material of the outer coating layer is selected from zirconium nitride (ZrN), titanium nitride (TiN), yttrium nitride (YN), hafnium nitride (HfN) , Lanthanum Nitride (LaN), Neodymium Nitride (NdN) and any combination thereof. The probe structure according to claim 1, wherein the thickness of the outer coating layer ranges from 10 nm to 400 nm. The probe structure according to claim 1, wherein the critical load range of the functional layer is from 100 mN to 300 mN for scratch measurement with a nanoindenter. The probe structure according to claim 1, wherein the pressure measurement is performed with a nanoindenter, and the average hardness of the film of the functional layer ranges from 26 GPa to 32 GPa. The probe structure according to claim 1, wherein the total resistivity of the functional layer ranges from 20x10 ^-6 ohm. cm to 80x10 ^-6 ohm. cm. The probe structure according to claim 1, wherein the water droplet contact angle of the functional layer is greater than or equal to 100°. The probe structure according to claim 1, wherein the other part of the outer coating layer directly contacts at least one of the first contact section or the second contact section. The probe structure according to claim 1, wherein a part of the adhesion layer farther from the central section is covered by the outer coating layer, and another part of the adhesion layer closer to the central section is exposed to The outer covering layer is outside.

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