TWM613027U - Portable electronic device and customized image capturing module thereof - Google Patents

Abstract

A portable electronic device and a customized image capturing module thereof are provided. The customized image capturing module includes a carrier substrate, an image capturing chip and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads and a plurality of second conductive pads. The image capturing chip is disposed inside a concave space of the carrier body, and the image capturing chip includes a plurality of chip conductive pads. Therefore, the second conductive pads are exposed from a bottom side of the carrier body, and the chip conductive pads are respectively electrically connected to the second conductive pads respectively through the first conductive pads, so that when the customized image capturing module is partially disposed inside a receiving space of a circuit substrate, the second conductive pads of the carrier substrate can respectively electrically connected to a plurality of substrate conductive pads of the circuit substrate respectively through a plurality of solder materials.

Description

Portable electronic device and customized image capturing module thereof

The present creation relates to an electronic device and its image capturing module, in particular to a portable electronic device and its customized image capturing module.

All portable electronic devices in the prior art are equipped with image capture modules. However, the existing image capture modules are limited due to the solder pad configuration of the main circuit board during installation, so there is still room for improvement.

The technical problem to be solved by this creation is to provide a portable electronic device and a customized image capturing module thereof for the shortcomings of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted in this creation is to provide a customized image capture module, which includes: a carrier substrate, an image capture chip, and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads arranged on the carrier body, a plurality of second conductive pads arranged on the carrier body, and a plurality of conductive circuits arranged inside the carrier body, and the carrier body It has a through opening and a recessed space connected to the through opening. The image capturing chip is arranged in the recessed space of the carrying body, and the image capturing chip includes an image sensing area and a plurality of chip conductive pads electrically connected to a plurality of first conductive pads, respectively. The lens assembly includes a lens holder arranged on the carrying body and a lens structure carried by the lens holder. Wherein, the plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads of the image capturing chip are respectively electrically connected to the plurality of second conductive pads through the plurality of first conductive pads. pad. Wherein, when the customized image capturing module is partially disposed in an accommodating space of a circuit substrate and located between two electronic components, the plurality of second conductive pads of the carrier substrate are electrically connected to the circuit, respectively Multiple substrate conductive pads of the substrate.

In order to solve the above technical problems, another technical solution adopted in this creation is to provide a customized image capture module, which includes: a carrier substrate, an image capture chip, and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads and a plurality of second conductive pads, and the carrier body has a recessed space. The image capturing chip is arranged in the recessed space of the carrying body, and the image capturing chip includes a plurality of chip conductive bonding pads. The lens assembly is arranged on the carrying body. Wherein, the plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads of the image capturing chip are respectively electrically connected to the plurality of second conductive pads through the plurality of first conductive pads. pad.

In order to solve the above technical problems, another technical solution adopted in this creation is to provide a portable electronic device. The portable electronic device uses an image capturing component, and the image capturing component includes a circuit substrate and is disposed on A plurality of electronic components on the circuit substrate and a customized image capturing module arranged on the circuit substrate. The customized image capture module includes a carrier substrate, an image capture chip and a lens assembly. The carrier substrate includes a carrier body, a plurality of first conductive pads arranged on the carrier body, a plurality of second conductive pads arranged on the carrier body, and a plurality of conductive circuits arranged inside the carrier body, and the carrier body It has a through opening and a recessed space connected to the through opening. The image capturing chip is arranged in the recessed space of the carrying body, and the image capturing chip includes an image sensing area and a plurality of chip conductive pads electrically connected to a plurality of first conductive pads, respectively. The lens assembly includes a lens holder arranged on the carrying body and a lens structure carried by the lens holder. Wherein, the plurality of second conductive pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive pads of the image capturing chip are respectively electrically connected to the plurality of second conductive pads through the plurality of first conductive pads. pad.

One of the beneficial effects of this creation is that the portable electronic device and its customized image capture module provided by this creation can pass through "the carrier substrate includes a carrier body, a plurality of first conductive pads, and a plurality of The second conductive pad, and the carrier body has a recessed space", "the image capturing chip is arranged in the recessed space of the carrier body, and the image capturing chip includes a plurality of chip conductive pads" and "a plurality of second conductive pads" The bonding pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive bonding pads of the image capturing chip are respectively electrically connected to the plurality of second conductive bonding pads through the plurality of first conductive bonding pads. So that when the customized image capture module is partially disposed in a accommodating space of a circuit substrate and is located between two electronic components, the plurality of second conductive pads of the carrier substrate can respectively pass through the plurality of soldering objects And a plurality of substrate conductive pads are electrically connected to the circuit substrate.

In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation. However, the provided drawings are only for reference and explanation, and are not used to limit this creation.

The following is a specific embodiment to illustrate the implementation of the "portable electronic device and its customized image capture module" disclosed in this creation. Those skilled in the art can understand this creation from the content disclosed in this specification. The advantages and effects. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of this creation. In addition, the drawings of this creation are merely schematic illustrations, and are not depicted in actual size, and are stated in advance. The following implementations will further describe the related technical content of this creation in detail, but the disclosed content is not intended to limit the scope of protection of this creation. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

As shown in Figure 1 to Figure 11, this creation provides a customized image capturing module M, an image capturing module C using the customized image capturing module M, and a flexible image capturing module C using the image capturing module C. Portable electronic device Z. The customized image capturing module M includes a carrier substrate 1, an image capturing chip 2 and a lens assembly 3. The carrier substrate 1 includes a carrier body 10, a plurality of first conductive pads 11 and a plurality of second conductive pads 12, and the carrier body 10 has a recessed space 101. The image capturing chip 2 is disposed in the recessed space 101 of the carrier body 10, and the image capturing chip 2 includes a plurality of chip conductive bonding pads 21. The lens assembly 3 is arranged on the carrier body 10. Furthermore, the plurality of second conductive bonding pads 12 are exposed from the bottom end of the carrier body 10, and the plurality of chip conductive bonding pads 21 of the image capturing chip 2 can respectively pass through the plurality of first conductive bonding pads 11. It is electrically connected to a plurality of second conductive pads 12. Thereby, when the customized image capturing module M is partially disposed in a accommodating space P1000 of a circuit substrate P and is located between two electronic components E, the plurality of second conductive pads of the carrier substrate 1 12 can be electrically connected to a plurality of substrate conductive pads P101 of the circuit substrate P through a plurality of solders, respectively.

[First Embodiment]

Referring to FIGS. 1 and 2, the first embodiment of the present creation provides a customized image capturing module M, which includes: a carrier substrate 1, an image capturing chip 2 and a lens assembly 3.

First, as shown in FIG. 1, the carrier substrate 1 includes a carrier body 10, a plurality of first conductive pads 11 arranged on the carrier body 10, a plurality of second conductive pads 12 arranged on the carrier body 10, and There are a plurality of conductive circuits 13 inside (or outside) the carrying body 10, and the carrying body 10 has a through opening 100 and a recessed space 101 connected to the through opening 100.

Furthermore, as shown in FIG. 1 and FIG. 2, the plurality of first conductive pads 11 can be divided into a plurality of first left conductive pads 11L and a plurality of first right conductive pads 11R. A plurality of first left conductive pads 11L may be arranged on a first left area 100L in the recessed space 101, and a plurality of first right conductive pads 11R may be arranged on a first right area 100R in the recessed space 101, And the first left area 100L and the first right area 100R are two opposite and corresponding pad placement areas. Furthermore, the plurality of second conductive pads 12 can be divided into a plurality of second left conductive pads 12L and a plurality of second right conductive pads 12R. A plurality of second left conductive pads 12L may be disposed on a second left area 1002L of the bottom end of the carrier body 10, and a plurality of second right conductive pads 12R may be disposed on a second right area 1002R of the bottom end of the carrier body 10 Above, and the second left area 1002L and the second right area 1002R are two opposite and corresponding pad placement areas. It is worth noting that, except for the plurality of first left conductive pads 11L and the plurality of first right conductive pads 11R, there are no other conductive pads in the recessed space 101 of the carrier substrate 1. In addition, apart from the plurality of second left conductive pads 12L and the plurality of second right conductive pads 12R, there are no other conductive pads on the bottom end of the carrier body 10. In other words, all conductive pads (for example, a plurality of first conductive pads 11) in the recessed space 101 are only distributed on the first left area 100L and the first right area 100R, and are located on the carrier body 10 All conductive pads on the bottom end (for example, a plurality of second conductive pads 12) are only distributed on the second left area 1002L and the second right area 1002R, thereby effectively reducing the width of the carrier body 10 Occupied space.

Furthermore, as shown in FIG. 1, the image capturing chip 2 is disposed in the recessed space 101 of the carrier body 10, and the image capturing chip 2 includes an image sensing area 20 and electrically connected to a plurality of first conductive solders, respectively. A plurality of chip conductive pads 21 of the pad 11. For example, the image capturing chip 2 will be completely accommodated in the recessed space 101 of the carrying body 10, and will not protrude out of the recessed space 101 of the carrying body 10 (that is, the top of the carrying body 10 will be high At the top of the image capture chip 2). In addition, the image capturing chip 2 may be a Complementary Metal-Oxide-Semiconductor (CMOS) chip or a Charge-coupled Device (CCD) chip. However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present creation.

Furthermore, as shown in FIGS. 1 and 2, the plurality of chip conductive pads 21 can be divided into a plurality of left chip conductive pads 21L and a plurality of right chip conductive pads 21R. A plurality of left-side chip conductive pads 21L may be arranged on a left side area 200L of the image capturing chip 2, and a plurality of right-side chip conductive pads 21R may be arranged on a right side area 200R of the image capturing chip 2, and the left area 200L and the right side The area 200R is two opposite and corresponding pad setting areas. It is worth noting that, apart from the plurality of left chip conductive pads 21L and the plurality of right chip conductive pads 21R, there are no other conductive pads on the image capturing chip 2. In other words, all the conductive pads on the image capture chip 2 (for example, a plurality of chip conductive pads 21) are only distributed on the left area 200L and the right area 200R, thereby effectively reducing the image capture chip 2 The space occupied by the width direction.

In addition, as shown in FIG. 1, the lens assembly 3 includes a lens holder 31 provided on the carrying body 10 and a lens structure 32 carried by the lens holder 31. Furthermore, the lens holder 31 may be disposed on an upper surface 1001 of the supporting body 10, and the recessed space 101 may be recessed from the upper surface 1001 of the supporting body 10 to the inside, so that the recessed space 101 will face the lens structure 32. In addition, a plurality of first conductive solder pads 11 are arranged in the recessed space 101 and face the lens assembly 3, and a plurality of second conductive solder pads 12 are arranged on the lower surface 1002 of the carrier body 10 and face the lens assembly 3, and a plurality of The chip conductive pad 21 faces the lens structure 32. For example, the lens holder 31 includes a brake (not shown) that can drive the lens structure 32 to move, and the lens structure 32 may be composed of a plurality of optical lenses. However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present creation.

It is worth mentioning that, as shown in FIG. 1, the customized image capturing module M of the first embodiment of the present creation further includes a filter element 4. The filter element 4 can be disposed above the image sensing area 20 of the image capturing chip 2 through a plurality of supports S, and the filter element 4 is disposed between the image capturing chip 2 and the lens structure 32.

It is worth noting that, as shown in FIG. 1, the plurality of chip conductive pads 21 are respectively electrically connected to the plurality of first conductive pads 11 through the plurality of conductive wires W (for example, metal wires formed by wire bonding). . In addition, as shown in FIG. 2, the area of the second conductive pad 12 will be larger than the area of the first conductive pad 11, and the minimum distance D between one side end of the second conductive pad 12 and one side end of the carrier body 10 will be It is smaller than the length L of the second conductive pad 12. In addition, between the side end of the second conductive pad 12 and the side end of the carrier body 10 is an occupant-free area 1002N, and there are no solder pads or electronic components in the plurality of occupant-free areas 1002N.

As shown in FIG. 1 and FIG. 3 to FIG. 5, the first embodiment of the present invention provides an image capturing component C. The image capturing component C includes a circuit substrate P, a plurality of electronic components E arranged on the circuit substrate P, and a customized image capturing module M arranged on the circuit substrate P, and the customized image capturing module The group M includes a carrier substrate 1, an image capturing chip 2 and a lens assembly 3. More specifically, the circuit substrate P includes a substrate body P100 and a plurality of substrate conductive pads P101 provided on the substrate body P100, and the substrate body P100 has an accommodating space recessed from an upper surface of the substrate body P100 to the inside. P1000. In addition, a plurality of substrate conductive pads P101 are provided in the accommodating space P1000 of the substrate body P100, and a plurality of electronic components E are provided on the upper surface of the substrate body P100. Thereby, as shown in FIG. 5, when the customized image capturing module M is partially disposed in the accommodating space P1000 of the circuit substrate P and is located between the two electronic components E, a plurality of second conductive pads 12 (including a plurality of left chip conductive pads 21L and a plurality of right chip conductive pads 21R) can be respectively electrically connected through a plurality of solders (not shown, such as solder balls, solder paste or any conductive material) A plurality of substrate conductive pads P101 on the circuit substrate P.

Thereby, since the plurality of second conductive pads 12 are exposed from the bottom end of the carrier body 10, and the plurality of chip conductive pads 21 of the image capturing chip 2 can be electrically connected through the plurality of first conductive pads 11, respectively. Is connected to a plurality of second conductive pads 12, so when the customized image capturing module M is partially disposed in the accommodating space P1000 of the circuit substrate P and is located between the two electronic components E, the carrier substrate 1 The plurality of second conductive pads 12 can be respectively electrically connected to the plurality of substrate conductive pads P101 of the circuit substrate P through a plurality of solders. Therefore, as long as the plurality of second conductive pads 12 of the carrier substrate 1 and the plurality of substrate conductive pads P101 of the circuit substrate P can generate a corresponding electrical connection relationship, even if different types (such as different models, different sizes) are used in this creation ) Image capture chip 2 or different types (for example, different models, different sizes) of lens assembly 3, different types of image capture chip 2 or different types of lens assembly 3 can still be applied to the customized image capture module Group M, so the customized image capturing module M created by this invention can customize the image capturing chip 2 or the lens assembly 3 according to the different needs of use.

[Second Embodiment]

Referring to FIGS. 6 to 10, the second embodiment of the present creation provides a customized image capturing module M and an image capturing component C using the customized image capturing module M, and a customized image The capturing module M includes a carrier substrate 1, an image capturing chip 2 and a lens assembly 3. From the comparison of FIGS. 6 to 10 and FIGS. 1 to 5 respectively, the biggest difference between the second embodiment of the present invention and the first embodiment is that: first, the recessed space 101 is recessed from the lower surface 1002 of the carrier body 10 to the inside. , So that the recessed space 101 faces away from the lens structure 32. In addition, the plurality of first conductive pads 11 may be arranged in the recessed space 101 and be blocked by the carrier body 10, so the plurality of first conductive pads 11 cannot face the lens assembly 3. In addition, the plurality of chip conductive pads 21 face the recessed space 101 and face the first left region 100L and the first right region 100R located in the recessed space 101, and the plurality of chip conductive pads 21 respectively penetrate the plurality of conductors B (for example The solder balls, solder paste, or any kind of conductive materials) are electrically connected to the plurality of first conductive pads 11 respectively. Furthermore, the filter element 4 is disposed between the image capturing chip 2 and the lens structure 32 and partially accommodated in the through opening 100, thereby effectively reducing the overall height of the customized image capturing module M.

It is worth noting that, as shown in FIG. 10, since the image capturing chip 2 is completely accommodated in the recessed space 101 of the carrier body 10, it will not protrude from the recessed space 101 of the carrier body 10 (that is, the carrier body 10). The bottom end of 10 will be lower than the bottom end of the image capturing chip 2), so when the customized image capturing module M is disposed on the circuit substrate P, the image capturing chip 2 can be protected by the carrier body 10. Will hit the circuit board P.

Thereby, since the plurality of second conductive pads 12 are exposed from the bottom end of the carrier body 10, and the plurality of chip conductive pads 21 of the image capturing chip 2 can be electrically connected through the plurality of first conductive pads 11, respectively. Is connected to a plurality of second conductive pads 12, so when the customized image capturing module M is partially disposed in the accommodating space P1000 of the circuit substrate P and is located between the two electronic components E, the carrier substrate 1 The plurality of second conductive pads 12 can be respectively electrically connected to the plurality of substrate conductive pads P101 of the circuit substrate P through a plurality of solders.

[Third Embodiment]

Referring to FIG. 11, the third embodiment of the present invention provides a portable electronic device Z, and the portable electronic device Z uses an image capturing component C. As shown in FIG. 5 or FIG. 10, the image capturing component C includes a circuit substrate P, a plurality of electronic components E disposed on the circuit substrate P, and a customized image capturing module M disposed on the circuit substrate P And the customized image capturing module M includes a carrier substrate 1, an image capturing chip 2 and a lens assembly 3. For example, the portable electronic device Z can be a notebook computer, a tablet computer, or a smart mobile phone, but this creation is not limited to this example.

[Beneficial effects of the embodiment]

One of the beneficial effects of this creation is that the portable electronic device Z and its customized image capturing module M provided by this creation can pass through "the carrier substrate 1 includes a carrier body 10, a plurality of first conductive The bonding pad 11 and a plurality of second conductive bonding pads 12, and the carrier body 10 has a recessed space 101", "the image capturing chip 2 is disposed in the recessed space 101 of the carrier body 10, and the image capturing chip 2 includes a plurality of Chip conductive bonding pads 21" and "a plurality of second conductive bonding pads 12 are exposed from the bottom end of the carrier body 10, and the plurality of chip conductive bonding pads 21 of the image capturing chip 2 respectively pass through the plurality of first conductive bonding pads 11 The technical solution of electrically connecting to a plurality of second conductive pads 12" respectively, so that when the customized image capturing module M is partially disposed in a accommodating space P1000 of a circuit substrate P and located in two electronic components Between the elements E, the plurality of second conductive pads 12 of the carrier substrate 1 can be electrically connected to the plurality of substrate conductive pads P101 of the circuit substrate P through a plurality of solders, respectively.

The content disclosed above is only a preferred and feasible embodiment of this creation, and does not limit the scope of patent application for this creation. Therefore, all equivalent technical changes made using this creation specification and schematic content are included in the application for this creation. Within the scope of the patent.

Z: Portable electronic device C: Image capture component P: Circuit board P100: substrate body P1000: housing space P101: substrate conductive pad E: Electronic components M: Customized image capture module 1: Carrier substrate 10: Carrying body 1001: upper surface 1002: lower surface 1002N: No possession area 1002L: second left area 1002R: second right area 100: Through opening 100L: the first left area 100R: the first right area 101: sunken space 11: The first conductive pad 11L: The first left conductive pad 11R: The first right conductive pad 12: The second conductive pad 12L: second left conductive pad 12R: The second right conductive pad 13: Conductive circuit 2: Image capture chip 20: Image sensing area 200L: left area 200R: Right area 21: Chip conductive pad 21L: conductive pad on the left side chip 21R: Conductive pad on the right side of the chip W: Conductive wire B: Conductor 3: lens assembly 31: lens holder 32: lens structure 4: filter element S: Support D: distance L: length

FIG. 1 is a schematic front view of the customized image capturing module according to the first embodiment of the creation.

FIG. 2 is a schematic bottom view of the customized image capturing module according to the first embodiment of the creation.

FIG. 3 is an exploded schematic diagram of the image capturing component of the first embodiment of the creation.

4 is a schematic top view of the circuit substrate carrying two electronic components in the first embodiment of the creation.

FIG. 5 is a schematic diagram of the assembly of the image capturing components according to the first embodiment of the creation.

6 is a schematic front view of the customized image capturing module according to the second embodiment of the creation.

FIG. 7 is a schematic bottom view of the customized image capturing module according to the second embodiment of the creation.

FIG. 8 is an exploded schematic diagram of the image capturing component of the second embodiment of the creation.

FIG. 9 is a schematic top view of the circuit substrate carrying two electronic components of the second embodiment of the creation.

FIG. 10 is a schematic diagram of the assembly of the image capturing components according to the second embodiment of the creation.

FIG. 11 is a three-dimensional schematic diagram of the portable electronic device according to the third embodiment of the creation.

M: Customized image capture module

1: Carrier substrate

10: Carrying body

1001: upper surface

1002: lower surface

100: Through opening

100L: the first left area

100R: the first right area

101: sunken space

11: The first conductive pad

11L: The first left conductive pad

11R: The first right conductive pad

12: The second conductive pad

12L: second left conductive pad

12R: The second right conductive pad

13: Conductive circuit

2: Image capture chip

20: Image sensing area

200L: left area

200R: Right area

21: Chip conductive pad

21L: conductive pad on the left side chip

21R: Conductive pad on the right side chip

W: Conductive wire

3: lens assembly

31: lens holder

32: lens structure

4: filter element

S: Support

Claims (10)

A customized image capture module, which includes: A carrier substrate, which includes a carrier body, a plurality of first conductive pads arranged on the carrier body, a plurality of second conductive pads arranged on the carrier body, and A plurality of conductive circuits inside the body, the carrying body has a through opening and a recessed space connected to the through opening; An image capture chip, the image capture chip is disposed in the recessed space of the carrier body, the image capture chip includes an image sensing area and is electrically connected to a plurality of the first conductive A plurality of chip conductive bonding pads of bonding pads; and A lens assembly, the lens assembly including a lens holder arranged on the carrying body and a lens structure carried by the lens holder; Wherein, the plurality of second conductive bonding pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive bonding pads of the image capturing chip are respectively separated through the plurality of first conductive bonding pads Electrically connected to a plurality of the second conductive pads; Wherein, when the customized image capturing module is partially disposed in an accommodating space of a circuit substrate and located between two electronic components, the plurality of second conductive pads of the carrier substrate A plurality of substrate conductive pads respectively electrically connected to the circuit substrate. The customized image capture module according to claim 1, wherein the image capture chip is completely accommodated in the recessed space of the carrier body; wherein, a plurality of the first conductive pads It is divided into a plurality of first left conductive pads and a plurality of first right conductive pads. The plurality of first left conductive pads are arranged on a first left area in the recessed space, and a plurality of The first right conductive pad is disposed on a first right area in the recessed space; wherein, the plurality of second conductive pads are divided into a plurality of second left conductive pads and a plurality of second right conductive pads Conductive solder pads, a plurality of the second left conductive solder pads are arranged on a second left side area of the bottom end of the carrier body, and a plurality of the second right conductive solder pads are arranged on the carrier body On a second right side area of the bottom end; wherein the plurality of chip conductive pads are divided into a plurality of left chip conductive pads and a plurality of right chip conductive pads, and a plurality of the left chip conductive pads are arranged on all A left area of the image capture chip, and a plurality of conductive pads of the right chip are arranged on a right area of the image capture chip; wherein, except for a plurality of the first left conductive pads and a plurality of Except for the first right conductive solder pad, there are no other conductive solder pads in the recessed space of the carrier substrate; wherein, except for a plurality of the second left conductive solder pads and a plurality of the second right conductive solder pads Except for the pads, there are no other conductive pads on the bottom end of the carrier body; wherein, except for a plurality of conductive pads of the left chip and a plurality of conductive pads of the right chip, the image capture Take no other conductive pads on the chip. The customized image capturing module according to claim 1, further comprising: a filter element, the filter element being disposed on the image sensing area of the image capturing chip through a plurality of supports And the filter element is disposed between the image capturing chip and the lens structure; wherein, the lens holder is disposed on an upper surface of the carrier body, and the recessed space is separated from the The upper surface of the carrier body is recessed inwardly, so that the recessed space faces the lens structure; wherein a plurality of the first conductive solder pads are arranged in the recessed space and face the lens assembly, A plurality of the second conductive bonding pads are arranged on the lower surface of the carrying body, and the area of the second conductive bonding pads is larger than the area of the first conductive bonding pads; wherein, a plurality of the chips are conductively bonded The pad faces the lens structure, and the plurality of chip conductive pads are respectively electrically connected to the plurality of first conductive pads through a plurality of conductive wires; wherein, one side of the second conductive pad The minimum distance between the end and the side end of the carrying body is smaller than the length of the second conductive solder pad, and there is a gap between the side end of the second conductive solder pad and the side end of the carrying body No possession area. The customized image capturing module according to claim 1, further comprising: a filter element, the filter element being disposed on the image sensing area of the image capturing chip through a plurality of supports Above, and the filter element is disposed between the image capturing chip and the lens structure and partly accommodated in the through opening; wherein, the lens holder is disposed on a On the upper surface, and the recessed space is recessed and formed inside from the lower surface of the carrier body, so that the recessed space faces away from the lens structure; wherein, a plurality of the first conductive pads are disposed on In the recessed space and blocked by the carrier body so as not to face the lens assembly, a plurality of the second conductive solder pads are arranged on the lower surface of the carrier body, and the second conductive solder pads The area is greater than the area of the first conductive pad; wherein, a plurality of the chip conductive pads face the recessed space, and the plurality of chip conductive pads respectively pass through a plurality of conductors to be electrically connected to a plurality of One of the first conductive pads; wherein the minimum distance between one side end of the second conductive pad and one side end of the carrying body is smaller than the length of the second conductive pad, and the second conductive pad There is a non-occupied area between the side end of the welding pad and the side end of the carrying body. A customized image capture module, which includes: A carrier substrate, the carrier substrate includes a carrier body, a plurality of first conductive pads and a plurality of second conductive pads, the carrier body has a recessed space; An image capturing chip, the image capturing chip is disposed in the recessed space of the carrier body, the image capturing chip includes a plurality of chip conductive bonding pads; and A lens assembly, the lens assembly is arranged on the carrying body; Wherein, the plurality of second conductive bonding pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive bonding pads of the image capturing chip are respectively separated through the plurality of first conductive bonding pads It is electrically connected to the plurality of second conductive pads. A portable electronic device that uses an image capture component, the image capture component including a circuit substrate, a plurality of electronic components arranged on the circuit substrate, and the circuit A customized image capture module on a substrate, wherein the customized image capture module includes: A carrier substrate, which includes a carrier body, a plurality of first conductive pads arranged on the carrier body, a plurality of second conductive pads arranged on the carrier body, and A plurality of conductive circuits inside the body, the carrying body has a through opening and a recessed space connected to the through opening; An image capture chip, the image capture chip is disposed in the recessed space of the carrier body, the image capture chip includes an image sensing area and is electrically connected to a plurality of the first conductive A plurality of chip conductive bonding pads of bonding pads; and A lens assembly, the lens assembly including a lens holder arranged on the carrying body and a lens structure carried by the lens holder; Wherein, the plurality of second conductive bonding pads are exposed from the bottom end of the carrier body, and the plurality of chip conductive bonding pads of the image capturing chip are respectively separated through the plurality of first conductive bonding pads It is electrically connected to the plurality of second conductive pads. The portable electronic device according to claim 6, wherein the image capturing chip is completely accommodated in the recessed space of the carrier body; wherein, the circuit substrate includes a substrate body and is disposed on the A plurality of substrate conductive pads on the substrate body, and the substrate body has an accommodating space recessed from an upper surface of the substrate body to the inside; wherein, a plurality of substrate conductive pads are provided on the substrate In the accommodating space of the substrate body, and a plurality of the electronic components are disposed on the upper surface of the substrate body; wherein, when the customized image capturing module is partially disposed in the circuit When the accommodating space of the substrate is located between the two electronic components, the plurality of second conductive pads of the carrier substrate are electrically connected to the plurality of substrates of the circuit substrate. Welding pad. The portable electronic device according to claim 6, wherein the plurality of first conductive pads are divided into a plurality of first left conductive pads and a plurality of first right conductive pads, and a plurality of the first conductive pads A left side conductive pad is arranged on a first left side area in the recessed space, and a plurality of the first right side conductive pads are arranged on a first right side area in the recessed space; wherein, a plurality of The second conductive bonding pads are divided into a plurality of second left conductive bonding pads and a plurality of second right conductive bonding pads, and the plurality of second left conductive bonding pads are provided on one of the bottom ends of the carrier body. On the second left area, and a plurality of the second right conductive pads are arranged on a second right area of the bottom end of the carrier body; wherein the plurality of chip conductive pads are divided into a plurality of left chips Conductive bonding pads and a plurality of right chip conductive bonding pads, a plurality of the left chip conductive bonding pads are arranged on a left side area of the image capturing chip, and a plurality of the right chip conductive bonding pads are arranged on the image capturing chip Take a right side area of the chip; where, except for the plurality of first left conductive pads and the plurality of first right conductive pads, there are no other conductive pads in the recessed space of the carrier substrate Wherein, in addition to the plurality of second left conductive pads and the plurality of second right conductive pads, there are no other conductive pads on the bottom end of the carrier body; wherein, in addition to a plurality of Except for the conductive bonding pads of the left chip and the plurality of conductive bonding pads of the right chip, there are no other conductive bonding pads on the image capturing chip. The portable electronic device according to claim 6, wherein the customized image capturing module further includes: a filter element, and the filter element is disposed on the image capturing element through a plurality of supports. Take above the image sensing area of the chip, and the filter element is arranged between the image capturing chip and the lens structure; wherein, the lens holder is arranged on an upper surface of the carrier body , And the recessed space is recessed from the upper surface of the carrier body to the inside, so that the recessed space faces the lens structure; wherein, a plurality of the first conductive pads are provided in the recess In the space and facing the lens assembly, a plurality of the second conductive solder pads are arranged on the lower surface of the carrier body, and the area of the second conductive solder pads is larger than the area of the first conductive solder pads; Wherein, the plurality of chip conductive bonding pads face the lens structure, and the plurality of chip conductive bonding pads are respectively electrically connected to the plurality of first conductive bonding pads through a plurality of conductive wires; The minimum distance between one side end of the second conductive solder pad and one side end of the carrying body is smaller than the length of the second conductive solder pad, and the side end of the second conductive solder pad and the carrying body There is a non-occupied area between the side ends. The portable electronic device according to claim 6, wherein the customized image capturing module further includes: a filter element, and the filter element is disposed on the image capturing element through a plurality of supports. Take the upper part of the image sensing area of the chip, and the filter element is disposed between the image capturing chip and the lens structure and is partially accommodated in the through opening; wherein, the lens The bracket is disposed on an upper surface of the supporting body, and the recessed space is recessed and formed from the lower surface of the supporting body, so that the recessed space faces away from the lens structure; wherein, a plurality of The first conductive solder pads are arranged in the recessed space and are blocked by the carrier body so as not to face the lens assembly, and a plurality of second conductive solder pads are arranged on the lower surface of the carrier body, And the area of the second conductive pad is larger than the area of the first conductive pad; wherein, a plurality of the chip conductive pads face the recessed space, and the plurality of chip conductive pads respectively penetrate through a plurality of The conductor is electrically connected to a plurality of the first conductive pads respectively; wherein the minimum distance between one side end of the second conductive pad and one side end of the carrier body is smaller than the second conductive pad The length of the second conductive pad and the side end of the carrying body is a non-occupied area.

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