TWM600614U - Mold removal structure - Google Patents

Abstract

A mildew removal structure is used to remove mildew from a mildewed position. The mildew removal structure includes a carrier and an absorber. The absorber is combined with the carrier. The absorber is used to carry a fluid so that the The absorber has the effect of removing mildew, and the absorber is used to contact the mildewed location to remove mildew from the mildewed location.

Description

Mold removal structure

This creation is about a mold-removing structure, especially a mold-removing structure that prevents fluid from sagging or dripping, and a mold-removing structure that reduces the evaporation rate of the fluid, and can be easily removed after the mold is removed. .

Moisture and temperature are factors that affect the growth of mold, so mold is easy to grow in a humid environment. Generally, in order to inhibit mold growth, keep the environment ventilated or use a dehumidifier/dehumidifier for dehumidification to reduce the moisture in the environment.

However, the bathroom is one of the most difficult living environments to control humidity. Therefore, the bathroom is also the easiest to breed mold. In order to remove mold, mold removal gel, mildew spray or mildew foam and foam removal products are sold in the market.

To remove mildew using a mildew gel, apply the mildew gel to the moldy area, but because the gel is adhered to the wall, floor or ceiling by the gel, it is used to remove the mildew Or after plaque, there will be a problem that it is not easy to remove the mold gel.

Using mildew spray or mildew foam to remove mildew is to spray a wide range of mildew liquid or foam on the moldy areas. However, when the mildew liquid or foam is sprayed on the wall or ceiling, there will be sag In addition, since the mold liquid or mold foam is sprayed on the wall, floor or ceiling in a large area, there will be a problem of rapid evaporation; however, whether it is a droop, dripping or rapid evaporation will cause the The mildew liquid or the mildew-removing foam is not enough to remove the mildew. It can only remove the surface mold at the moldy site, and cannot remove the mildew root deeply. When the mildew root is not removed, the mold will grow again in a short time. The effect of mold removal is not long.

Regardless of the use of mildew gel, mildew spray or foam for mildew removal, after the mildew removal work, the mildew gel adheres to the wall, floor or ceiling, or the mildew spray or foam flows , Sag, and dripping must be cleaned after mold removal, such as rinsing mold gel, mold spray or mold foam with water, which will waste water resources.

The main purpose of the mold removing structure of the present invention is to provide a mold removing structure that prevents fluid from drooping and dripping and reducing the evaporation speed of the fluid, and the mold removing structure can be simply removed after the mold is removed.

A mold removing structure of the present invention is used to contact a moldy location to remove mold from the moldy location. The mold removing structure includes a carrier and an absorber. The carrier has a first fixing part and a second fixing part. And at least one liquid injection port, the liquid injection port is located between the first fixing part and the second fixing part, the absorber is combined with the carrier, and the absorber is used for absorbing and carrying a liquid injected through the liquid injection port. Fluid, the first fixing part and the second fixing part are used to fix the mold removing structure so that the absorber contacts the moldy position.

In this creation, the mold removing structure is fixed to the moldy position by the first fixing portion and the second fixing portion, so that the absorbent body contacts the moldy position, and the fluid is injected through the liquid injection port to make the absorbent body Absorb and carry the fluid to remove mildew from the moldy location. Since the fluid is held in the absorbent body, the fluid can be prevented from sagging or dripping, and the fluid evaporation speed can be reduced to increase the mildew removal efficiency. In addition, After the mold removal work is completed, the mold removal structure can be quickly removed.

Please refer to Figures 1, 3, and 9A. This is a mold removing structure 100 created for this creation, which is used to contact a moldy location 11 to remove mold from the moldy location 11. The mold removal structure 100 includes a carrier 110 and an absorbent Body 120. In this embodiment, the carrier 110 is a flexible carrier, and the carrier 110 can be selected from polypropylene film (Oriented polypropylene, OPP), polyester film (Polyester), cellophane (Cellophane), and polyvinyl chloride. Flexible carriers such as film (Polyvinyl Chloride, PVC), polyethylene film (PE), polyurethane film (PU), paper, kraft paper, non-woven fabric, cotton paper, hemp or sponge, the absorbent 120 can be selected from For superabsorbent polymers (SAP), cotton, linen, paper, sponge or cloth and other absorbent materials, please refer to Figure 11. In another embodiment, the carrier 110 and the absorbent 120 can be selected from Based on the same material, for example, the carrier 110 and the absorbent body 120 can be selected from superabsorbent polymers (SAP) materials, cotton, linen, paper, sponge or cloth.

Please refer to Figure 1, the mold removing structure 100 can be rolled up in a carrier 200. In this embodiment, the carrier 200 is selected from a reel, or, in different embodiments, the carrier 200 is selected From a packaging bag or packaging box (not shown in the figure), the mold removing structure 100 can be folded or rolled and stored in the packaging bag or packaging box, but it is not limited thereto.

Please refer to FIGS. 2A, 2B, 2C, 3 and 9A. The carrier 110 has at least one fixing portion. In different embodiments, the fixing portion includes a first fixing portion 111 and a second fixing portion 112. In the embodiment, referring to FIGS. 9C and 9D, the fixing portion has only one of the first fixing portion 111 and the second fixing portion 112.

Please refer to FIGS. 2A, 2B, 2C, 3, and 9A. In this embodiment, the carrier 110 is described as having the first fixing portion 111 and the second fixing portion 112, but it is not limited to this. The carrier 110 has another There is at least one liquid injection port 113, and the liquid injection port 113 is located between the first fixing portion 111 and the second fixing portion 112. Please refer to FIGS. 2A and 3. In one embodiment, the liquid injection port 113 is The gap between the first fixing portion 111 and the second fixing portion 112, or refer to Figures 2B, 2C, and 4, in another embodiment, the liquid injection port 113 is a perforation penetrating the carrier 110, The shape of the liquid injection port 113 is selected from a slotted hole, a circular hole, an elliptical hole, a square hole or other geometrical perforations.

Please refer to Figures 3, 4, 5, 9A, 9C and 9D, the absorbent body 120 is combined with the carrier 110, and the absorbent body 120 is used to contact the moldy site 11. Please refer to Figure 4. Preferably, the absorbent The body 120 can be bonded to the carrier 110 by an adhesive 150. In this embodiment, the absorbent body 120 is bonded to the first fixing portion 111 and the second fixing portion 112 by the glue 150, so that the carrier 110 and the absorbent body 120 are combined into one body, or, referring to FIG. 5, in another embodiment, the absorbent body 120 has a first joining portion 121 and a second joining portion 122, and the first joining portion 121 The carrier 110 and the absorber 120 are thermally pressed to the first fixing portion 111, and the second joining portion 122 is thermally pressed to the second fixing portion 112 to integrate the carrier 110 and the absorber 120.

Please refer to Figures 3, 4, 5 and 9B, the absorbent body 120 is used to absorb a fluid 300, and the absorbent body 120 is used to absorb and carry the fluid 300 injected through the liquid injection port 113. Preferably, the injection The liquid port 113 exposes the absorber 120. In this embodiment, the fluid 300 is a mildew-removing fluid. The fluid 300 may be selected from the group consisting of bleach, alcohol, hydrogen peroxide (Hydrogen peroxide), borax/ Mould removal fluid such as vinegar/water mixture, baking soda powder/water mixture or tea tree oil/water mixture, but not limited to this, when the mould removal fluid is injected into the absorbent body 120 through the liquid injection port 113, The absorbent body 120 absorbs and carries the fluid 300, so that the absorbent body 120 has the effect of removing mildew.

In another embodiment, the absorbent body 120 is equipped with a mildew-removing substance (not shown in the figure). The mildew-removing substance can be selected from baking soda powder, borax, or bleach (Calcium hypochlorite), etc., and the fluid 300 It is selected from water. When the fluid 300 is injected into the absorbent 120, the mildew-removing substance can be dissolved in the fluid 300, so that the fluid 300 is formed into a mildew-removing fluid, and the absorbent body carrying the fluid 300 120 has the effect of removing mildew.

Please refer to Figures 6, 7 and 8, the mold removing structure 100 further includes a cover 130 for selectively covering the liquid injection port 113 or the absorbent body 120, or simultaneously covers the liquid injection port 113 and the absorbent body 120, please refer to Figures 6 and 7. In this embodiment, the mold removing structure 100 further includes a plurality of connecting ribs 140. The carrier 110, the cover 130, and the connecting ribs 140 may be The same material, and the carrier 110, the cover 130 and the connecting ribs 140 are integrally formed by a thin film, the cover 130 is located in the liquid injection port 113, and the connecting ribs 140 connect the cover portion 130 and the The carrier 110 enables the cover 130 to cover the liquid injection port 113 and the absorber 120. In this embodiment, the connecting ribs 140 connect the cover 130 and a side wall 113a of the liquid injection port 113. When the fluid 300 is injected into the absorbent body 120, the cover 130 covering the liquid injection port 113 is first lifted, and the connecting ribs 140 are disconnected from the cover 130 or the carrier 110, and the injection is revealed The liquid port 113, the fluid can be injected into the absorbent body 120 through the liquid injection port 113. If necessary, after the fluid 300 is injected, the cover 130 can cover the liquid injection port 113 to reduce the liquid injection port 113 The exposed area is used to reduce the evaporation speed of the fluid 300 carried on the absorber 120.

Please refer to Figure 8. In another embodiment, the cover 130 and the carrier 110 are different individuals. Preferably, the cover 130 is attached to the cover 130 with an adhesive (not shown in the figure) or electrostatically. The carrier 110 covers the liquid injection port 113 and the absorber 120. When the fluid 300 is to be injected into the absorber 120, first lift the cover 130 covering the liquid injection port 113 to reveal the The liquid injection port 113, the fluid 300 can be injected into the absorbent body 120 through the liquid injection port 113, and if necessary, after the fluid 300 is injected, the cover 130 can cover the liquid injection port 113 to reduce the liquid injection port 113. In order to reduce the evaporation rate of the fluid 300 carried on the absorber 120.

Please refer to Figures 3, 4, 5, 9A and 9B. The first fixing portion 111 and the second fixing portion 112 are used to fix the mold removing structure 100 to an object 10 (such as a wall, or a tile, etc.). The absorbent body 120 used to absorb and carry the fluid 300 contacts the moldy position 11. Please refer to Figures 9C and 9D. In another embodiment, the mold removing structure 100 uses the first fixing portion 111 or the One of the two fixing parts 112 fixes the mold removing structure 100 to the object 10. The first fixing part 111 and the second fixing part 112 can be attached to the object 10 by water or static electricity to make the absorber 120 For contacting the moldy position 11, please refer to drawings 9A, 9C and 9D. The moldy position 11 is located on a surface of a rubber strip 12 in a corner, but not limited to this.

Please refer to Figures 4, 5, 9A, 9B, 9C and 9D. Preferably, the adhesive 150 is disposed on a first surface 111a of the first fixing portion 111 and a second surface of the second fixing portion 112 112a, please refer to FIGS. 9A, 9B, 9C, and 9D. In this embodiment, the mold removing structure 100 is attached to the object 10 by the adhesive 150, and the absorbent body 120 is brought into contact with the moldy location 11.

Please refer to FIGS. 3 and 4. The mold removing structure 100 further includes an isolation film 160. Please refer to FIG. 3. In one embodiment, the isolation film 160 covers the first surface 111a of the first fixing portion 111 and The second surface 111 a of the second fixing portion 112.

Please refer to FIG. 4, in another embodiment, the isolation film 160 covers the adhesive 150 disposed on the first fixing portion 111 and the adhesive 150 of the second fixing portion 112, please refer to Nos. 3 and 4 As shown, preferably, the isolation film 160 covers a contact surface 120a of the absorber 120.

When the mold removal structure 100 is to be used for mold removal, first, please refer to Figures 4 and 9A. If the mold removal structure 100 is provided with the isolation membrane 160, and the first fixing portion 111 and the second fixing portion 112 When the adhesive 150 is provided, the isolation film 160 is first torn away to expose the adhesive 150 disposed on the first fixing portion 111 and the second fixing portion 112, and the second fixing portion 112 is exposed by the adhesive 150 A fixing portion 111 and the second fixing portion 112 are attached to the object 10, and the contact surface 120a of the absorber 120 contacts the moldy position 11; or, in different embodiments, when the first fixing portion When the adhesive 150 is not provided on the second fixing portion 111 and the second fixing portion 112, the first fixing portion 111 and the second fixing portion 112 can be attached to the object 10 by water or static electricity, and make the absorber 120 The contact surface 120a contacts the moldy position 11.

Please refer to FIGS. 6, 7, 8 and 9A. When the mold removing structure 100 is provided with the cover 130, the cover 130 is lifted to expose the liquid injection port 113.

Please refer to Figure 9B. After the mold removal structure 100 is attached to the object 10, the fluid 300 is injected into the mold removal structure 100 through the liquid injection port 113. In this embodiment, the fluid 300 is installed in a container In 400, the container 400 can be selected from containers such as syringes or bottles, and the fluid 300 is output through a liquid outlet 410 of the container 400, and the fluid 300 is injected into the mold removing structure through the liquid injection port 113 The absorbent body 120 of 100 allows the absorbent body 120 to absorb and carry the fluid 300, and the absorbent body 120 absorbing and carrying the fluid 300 contacts the moldy site 11 to remove mold from the moldy site 11. The fluid 300 is held in the absorber 120. Therefore, when the mold removing structure 100 is used on a wall, floor or ceiling, the fluid 300 can be prevented from flowing or dripping, and the evaporation rate of the fluid 300 can be reduced to increase the removal rate. Mildew performance.

In addition, when the mold removal work is completed, the mold removal structure 100 only needs to be torn away from the object 10, that is, the mold removal structure 100 attached to the object 10 can be quickly removed, so as to reduce the cleaning after mold removal. jobs.

Please refer to Figures 9C, 9D and 10, in another embodiment, the carrier 110 of the mold removing structure 100 does not have the liquid injection port 113. When the mold removing structure 100 is to be used for mold removing, the The fluid 300 is injected into the absorber 120, or the fluid 300 is injected through the contact surface 120a of the absorber 120, so that the absorber 120 absorbs and carries the fluid 300, and then the first fixing portion 111 and/or the second The fixing portion 112 is attached to the object 10 and the absorbent body 120 is brought into contact with the moldy position 11 to remove mold from the moldy position 11.

Please refer to Figure 11, in another embodiment, the carrier 110 of the mold removing structure 100 and the absorbent body 120 are made of the same material, and the carrier 110 of the mold removing structure 100 does not have the liquid injection port 113, the The carrier 110 and the absorbent body 120 can be selected from materials such as superabsorbent polymers (SAP), cotton, linen, paper, sponge or cloth, and the carrier 110 and the absorbent body 120 are integrated, similarly The carrier 110 has at least one fixing portion. In this embodiment, it is assumed that the carrier 110 has the first fixing portion 111 and the second fixing portion 112. The first fixing portion 111 and the second fixing portion 112 may The adhesive 150 is attached to the object 10, and the absorbent body 120 is brought into contact with the moldy site 11. When the fluid 300 is injected into the absorbent body 120, the absorbent body 120 is made to absorb and carry the fluid 300 to Mold removal is performed at the moldy position 11.

In this creation, the mold removing structure 100 is fixed to the moldy position 11 by at least one fixing portion (the first fixing portion 111 and the second fixing portion 112, or one of them) of the carrier 110, so as to absorb and carry The absorbent body 120 with the fluid 300 contacts the moldy position 11 to remove mold from the moldy position 11. Since the fluid 300 is held in the absorbent body 120, the fluid 300 can be prevented from flowing or dripping, and The evaporation rate of the fluid 300 can be reduced to increase the mold removal efficiency. In addition, after the mold removal work is completed, the mold removal structure 100 can be quickly removed to reduce the cleaning work after mold removal.

The scope of protection of this creation shall be subject to the scope of the attached patent application. Any changes and modifications made by anyone who is familiar with this technique without departing from the spirit and scope of this creation shall fall within the scope of protection of this creation. .

10: Object 11: Moldy location 12: Adhesive strip 100: Mildew removal structure 110: carrier 111: The first fixed part 111a: first surface 112: second fixed part 112a: second surface 113: Liquid injection port 113a: side wall 120: Absorber 120a: contact surface 121: first joint 122: second joint 130: cover 140: connecting rib 150: viscose 160: isolation film 200: Vehicle 300: fluid 400: container 410: Liquid Outlet

Figure 1: A three-dimensional view of the mold removal structure of this creation wrapped in a reel. Figure 2A: A top view of an embodiment of the mold removal structure of the present creation. Figure 2B: A top view of an embodiment of the mold removal structure of the present creation. Figure 2C: A top view of an embodiment of the mold removing structure of the present creation. Figure 3: A cross-sectional perspective view of an embodiment of the mold removing structure of the present creation. Figure 4: A cross-sectional perspective view of an embodiment of the mold removing structure of this creation. Figure 5: A cutaway perspective view of an embodiment of the mold removing structure of the present creation. Figure 6: The top view of an embodiment of the mold removal structure of the present creation. Figure 7: A cut-away perspective view of an embodiment of the mold removing structure of this creation. Figure 8: A cross-sectional perspective view of an embodiment of the mold removing structure of this creation. Figure 9A: A cross-sectional view of mold removal using the mold removal structure of this creation. Figure 9B: A cross-sectional view of mold removal using the mold removal structure of this creation. Figure 9C: A cross-sectional view of mold removal using the mold removal structure of this creation. Figure 9D: A cross-sectional view of the mold removal structure using this creation. Figure 10: A cross-sectional view of mold removal using the mold removal structure of this creation. Figure 11: A cross-sectional view of mold removal using the mold removal structure of this creation.

10: Object

11: Moldy location

12: Adhesive strip

100: Mildew removal structure

110: carrier

111: The first fixed part

112: second fixed part

113: Liquid injection port

120: Absorber

120a: contact surface

150: viscose

Claims (30)

A mold removing structure used for contacting a moldy location to remove mold on the moldy location, the mold removing structure comprising: A carrier having a first fixing portion, a second fixing portion and at least one liquid injection port, the liquid injection port being located between the first fixing portion and the second fixing portion; and An absorbent body is combined with the carrier, the absorbent body is used to absorb and carry a fluid injected through the liquid injection port, and the first fixing part and the second fixing part are used to fix the mold removing structure so that the absorbent Touch the moldy area. Such as the mold removing structure of claim 1, wherein the liquid injection port reveals the absorbent body. Such as the mold removing structure of claim 1, wherein the liquid injection port is a gap between the first fixing part and the second fixing part. Such as the mold removing structure of claim 1, wherein the liquid injection port is a perforation penetrating the carrier. Such as the mold removing structure of claim 1, which further includes a cover for selectively covering the liquid injection port. For example, the mold removing structure of claim 5, which further includes at least one connecting rib, the cover is located in the liquid injection port, and the connecting rib connects the cover portion and the carrier. Such as the mold removing structure of claim 6, wherein the connecting rib connects the cover and a side wall of the liquid injection port. For example, the mold removing structure of claim 1, which further includes a glue disposed on a first surface of the first fixing portion and a second surface of the second fixing portion. Such as the mold removing structure of claim 1, wherein the absorbent is bonded to the carrier by an adhesive. Such as the mold removing structure of claim 1, wherein the absorbent body has a first joining part, and the first joining part is heat-compressed to the first fixing part. Such as the mold removing structure of claim 10, wherein the absorbent body has a second joining part, and the second joining part is heat-compressed to the second fixing part. For example, the mold removal structure of claim 1, 2, 5, 9, 10 or 11, which further includes an isolation film covering a first surface of the first fixing portion and a second surface of the second fixing portion surface. For example, the mold removing structure of claim 1, 2, 5, 9, 10, or 11 further includes an isolation film covering the absorber. Such as the mold removal structure of claim 8, which further includes an isolation film covering the adhesive. Such as the mold removing structure of claim 14, wherein the isolation film covers the absorber. Such as the mildew removal structure of claim 1, wherein the absorbent body is equipped with a mildew removal material, and the mildew removal material is selected from baking soda powder, borax or bleaching powder (Calcium hypochlorite). Such as the mildew removal structure of claim 1, wherein the fluid is a mildew removal fluid, and the mildew removal fluid is selected from the group consisting of bleach, alcohol, hydrogen peroxide (hydrogen peroxide), borax/vinegar/water mixture, and small Soda powder/water mixture or tea tree oil/water mixture. Such as the mildew-removing structure of claim 1, wherein the carrier is selected from polypropylene film (Oriented polypropylene, OPP), polyester film (Polyester), cellophane (Cellophane), polyvinyl chloride film (Polyvinyl Chloride, PVC), polyethylene Film (PE), polyurethane film (PU), paper, kraft paper, non-woven fabric, cotton paper, hemp or sponge. Such as the mildew-removing structure of claim 1, wherein the absorbent body is selected from superabsorbent polymers (SAP) materials, cotton, linen, paper, sponge or cloth. A mold removing structure used for contacting a moldy location to remove mold on the moldy location, the mold removing structure comprising: A carrier having at least one fixing part and at least one liquid injection port; and An absorbent body is combined with the carrier, the absorbent body is used to absorb and carry a fluid injected through the liquid injection port, the fixing part is used to fix the mold removing structure, and the absorbent body used to absorb the fluid contacts the mold position. Such as the mold removing structure of claim 20, wherein the liquid injection port is a perforation penetrating the carrier. A mold removing structure used for contacting a moldy location to remove mold on the moldy location, the mold removing structure comprising: A carrier having at least one fixing part; and An absorber is combined with the carrier, the absorber is used for absorbing and carrying a fluid, the fixing part is used for fixing the mold removing structure, and the absorber used for absorbing the fluid contacts the moldy position. A mold removing structure for contacting a moldy location to remove mold from the moldy location, wherein the mold removing structure includes a carrier and an absorber, the carrier and the absorber are made of the same material, and the carrier has At least one fixing part is used for fixing the mold removing structure and making the absorber contact a moldy position, and the absorber is used for absorbing and carrying a fluid. For example, the mold removing structure of any one of claims 20 to 23, which further includes an adhesive, and the adhesive is disposed on a surface of the fixing portion. For example, the mold removing structure of any one of claims 20 to 23 further includes an isolation film covering a surface of the fixing portion. Such as the mold removing structure of any one of claims 20 to 23, which further includes an isolation film covering the absorber. For example, the mildew-removing structure of claim 24 further includes an isolation film covering the glue. According to any one of claims 20 to 23, the mold removing structure, wherein the absorbent body is equipped with a mold removing substance selected from baking soda powder, borax or bleach (Calcium hypochlorite). Such as the mold removal structure of any one of claims 20 to 23, wherein the fluid is selected from the group consisting of bleach, alcohol, hydrogen peroxide (hydrogen peroxide), borax/vinegar/water mixture, baking soda/water Mixture or tea tree oil/water mixture. Such as the mold removal structure of any one of claims 20 to 23, wherein the absorbent is selected from superabsorbent polymers (SAP) materials, cotton, linen, paper, sponge or cloth.

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