TWM674079U - Airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink - Google Patents

Abstract

A three-dimensional temperature-averaging heat sink with airflow assistance is installed on a circuit board and covers a working component to dissipate heat from the working component. The heat sink includes a fin assembly, a three-dimensional temperature-averaging assembly, a fan mounting bracket, and a fan module. The fin assembly is provided with a plurality of assembly channels. The three-dimensional temperature-averaging assembly includes a temperature-averaging plate and a heat pipe. The temperature-averaging plate is thermally connected to the working component and provides a heat exchange space for accommodating a working fluid. The heat pipe extends from the temperature-averaging plate toward the fin assembly and is provided through the assembly channel, and provides a plurality of heat exchange channels connected to the heat exchange space. The fan mounting bracket is mounted and fixed to the fin assembly and is provided with ventilation holes. The fan module is fixed to the fan mounting frame to generate auxiliary heat dissipation airflow through the vents and fin assembly.

Description

Airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink

This invention relates to a three-dimensional uniform temperature radiator, and in particular to an airflow-assisted heat dissipation type three-dimensional uniform temperature radiator.

With the rapid advancement of technology, the integration density and computing performance of electronic components continue to increase, resulting in an annual increase in power consumption during operation, making heat dissipation a key bottleneck. While traditional tower coolers can meet moderate power requirements, as the power consumption of electronic components continues to rise, their limited thermal conductivity, excessive size, and high thermal resistance have become increasingly prominent. They are no longer able to meet the stringent cooling requirements of current servers (including CPUs and GPUs) and fifth-generation mobile communication devices (5G).

To meet stringent heat dissipation requirements, 3D Vapor Chamber (3D VC) technology was developed. A 3D VC typically consists of a vapor chamber and multiple heat pipes, each equipped with fins. Compared to tower heat sinks, 3D VCs, with their three-dimensional capillary structure and multi-layered conduction paths, effectively improve heat transfer efficiency and achieve a thinner and lighter overall structure.

However, most existing 3D vapor chambers rely solely on passive heat exchange between the fin assembly and the surrounding air. While passive heat exchange currently meets cooling requirements, it may become a bottleneck in improving cooling performance in the future as power consumption continues to rise.

In previous technologies, three-dimensional vapor chambers mostly relied solely on passive heat exchange between fin assemblies and the surrounding air, which could become a bottleneck in improving thermal dissipation performance in the future.

Therefore, the main purpose of this invention is to provide a three-dimensional uniform temperature heat sink with airflow-assisted heat dissipation. By installing a fan module on a fan mounting rack to generate auxiliary heat dissipation airflow, active heat exchange can significantly improve heat dissipation efficiency, thereby effectively overcoming the potential bottleneck of passive heat exchange in improving heat dissipation efficiency.

Based on the above, the essential technical means employed by this invention to resolve the problems of prior technologies is to provide an airflow-assisted three-dimensional temperature-averaging heat sink (hereinafter referred to as the "heat sink"). This heat sink is mounted on a circuit board and covers a working component to dissipate heat from the working component. The heat sink comprises a fin assembly, a three-dimensional temperature-averaging assembly, a fan mounting bracket, and a fan module. The fin assembly defines a plurality of assembly channels. Preferably, the fin assembly is a metal fin assembly, a ceramic fin assembly, or a composite fin assembly.

The three-dimensional temperature-averaging assembly includes a heat plate and a plurality of heat pipes. The heat plate is thermally connected to the working element and defines a heat exchange space for containing a working fluid. Preferably, the working fluid is pure water, deionized water (DI water), methanol, or ethanol. The three-dimensional temperature-averaging assembly is made of metal. The heat plate includes a base and a cover. The base is thermally connected to the working element, and the cover is fixed to the base and, together with the base, defines a heat exchange space.

The heat pipe extends from the temperature vapor chamber toward the fin assembly and penetrates the assembly channel, and is provided with a plurality of heat exchange channels connected to the heat exchange space. The fan mounting frame is mounted and fixed to the fin assembly and is provided with a ventilation hole. Preferably, the fan mounting frame is a metal fan mounting frame, a plastic fan mounting frame, or a composite fan mounting frame; the fan mounting frame includes a main body and two mounting portions. The main body is provided with ventilation holes, and the mounting portion is bent and extended from the main body toward the fin assembly for fixing to the fin assembly, thereby mounting and fixing the fan mounting frame to the fin assembly.

More preferably, the mounting portion is provided with a plurality of avoidance grooves corresponding to the heat pipes, and the avoidance grooves are used to avoid the heat pipes when the mounting portion is fixed to the fin assembly. The fan module is fixed to the fan mounting frame to generate an auxiliary heat dissipation airflow flowing through the vents and the fin assembly.

After the working fluid absorbs the heat energy generated by the operation of the working components, it evaporates and transforms into a working gas. After the evaporated working gas flows from the heat exchange space into the heat exchange channel, it transfers the absorbed heat energy to the fin assembly. After being dissipated by the auxiliary heat dissipation airflow, it condenses and transforms back into the working fluid. The condensed working fluid flows back into the heat exchange space through the heat exchange channel.

Based on the above essential technical means, the following additional technical means can be derived. Preferably, the heat sink further includes a fixing fastener, which is mounted on the three-dimensional temperature-averaging assembly and is used to fix it to the circuit board, thereby fastening the three-dimensional temperature-averaging assembly to the circuit board. More preferably, the fixing fastener is a metal fixing fastener, a plastic fixing fastener, or a composite material fixing fastener.

In summary, the airflow-assisted heat dissipation three-dimensional uniform temperature heat sink provided by this invention uses a fan mounting bracket to mount a fan module to generate auxiliary heat dissipation airflow. This significantly improves heat dissipation efficiency through active heat exchange, effectively overcoming the potential cooling bottleneck of passive heat exchange.

The specific embodiments adopted in this invention will be further described through the following embodiments and drawings.

Since the airflow-assisted heat dissipation type three-dimensional temperature-averaging heat sink provided by this invention has multiple implementation methods, its combination and variation implementation methods are too numerous to list. Here, only one of the preferred embodiments is listed for specific description.

Please refer to the first and second figures. The first figure is a three-dimensional schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink of the better embodiment of the present invention arranged in front of the circuit board; and the second figure is a three-dimensional schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink of the better embodiment of the present invention arranged behind the circuit board.

As shown in Figures 1 and 2, a three-dimensional heat sink (hereinafter referred to as a heat sink) 100 with airflow-assisted heat dissipation is mounted on a circuit board 200 and covers a working component 300 to dissipate heat from the working component 300. In this embodiment, the working component 300 is a central processing unit (CPU) or a graphics processing unit (GPU), but the present invention is not limited thereto.

Please refer to Figures 3 to 5. Figure 3 is a three-dimensional schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature uniformity radiator of the better embodiment of the present invention; Figure 4 is a three-dimensional schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature uniformity radiator of the better embodiment of the present invention from another perspective; Figure 5 is a three-dimensional decomposition schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature uniformity radiator of the better embodiment of the present invention; Figure 6 is a three-dimensional decomposition schematic diagram showing the three-dimensional temperature uniformity component of the better embodiment of the present invention; and Figure 7 is a cross-sectional schematic diagram showing the A-A section in Figure 3.

As shown in FIG3 to FIG7 , the heat sink 100 includes a fin assembly 1 , a three-dimensional temperature balancing assembly 2 , a fan mounting bracket 3 , a fan module 4 and a fixing fastener 5 .

Fin assembly 1 defines six assembly channels AC (only one of which is labeled) and includes multiple fins (not shown). Fin assembly 1 can be made of, for example, a metal with high thermal conductivity (such as copper, aluminum 6061, or aluminum 7075), a ceramic, or a composite material (such as carbon fiber).

The three-dimensional temperature-stabilizing assembly 2 includes a heat plate 21 and six heat pipes 22 (only one of which is labeled). The heat plate 21 is thermally connected to the working element 300 and defines a heat exchange space (HES) for containing a working fluid (not shown). Depending on the operating temperature requirements, the working fluid can be, for example, pure water, deionized water (DI water), methanol, or ethanol.

Heat pipes 22 extend from the heat spreader 21 toward the fin assembly 1, passing through assembly channel AC and defining six heat exchange channels HEC (only one of which is shown) connected to the heat exchange space HES. The three-dimensional heat spreader assembly 2 can be made of a metal with high thermal conductivity (e.g., copper or a copper alloy).

Structurally, the vapor chamber 21 comprises a base 211 and a cover 212. The base 211 is thermally connected to the operating element 300. The cover 212 is secured to the base 211 and, together with the base 211, encloses a heat exchange space (HES). As mentioned above, to connect the heat exchange channels (HEC) to the heat exchange space (HES), the cover 212 has six perforations (not shown) corresponding to the number of heat pipes 22.

In this embodiment, the structures of the base 211 and the upper cover 212 are formed by numerical control machining (CNC), stamping, or etching.

In this embodiment, the upper cover 212 is fixed to the base 211 by diffusion bonding or laser welding, and the heat pipe 22 is also fixed to the fin assembly 1 by diffusion bonding or laser welding to completely seal the heat exchange channel HEC and the heat exchange space HES. This ensures that the working fluid can evaporate and condense efficiently in a low-pressure environment after vacuum evacuation to remove the internal gas.

The interior of the temperature plate 21 has a capillary structure (not shown) to promote the circulation of the working fluid. The capillary structure can be made by sintering metal powder (such as sintered copper powder), micro-grooved structure, or mesh wick.

The fan mounting bracket 3 is fixed to the fin assembly 1 and defines a ventilation hole VH. Structurally, the fan mounting bracket 3 comprises a main portion 31 and two mounting portions 32 (only one of which is shown). The main portion 31 defines the ventilation hole VH. The mounting portions 32 extend from the main portion 31 toward the fin assembly 1 and are secured (by snapping, locking, or other means) to the fin assembly 1, thereby securing the fan mounting bracket 3 to the fin assembly 1.

Furthermore, the mounting portion 32 is provided with six clearance grooves AG (three each on the upper and lower sides) corresponding to the heat pipes 22. These clearance grooves are used to clear the heat pipes 22 when the mounting portion 32 is secured to the fin assembly 1. The design of the clearance grooves AG allows the mounting portion 32 to extend further toward the fin assembly 1 (increasing the contact area between the mounting portion 32 and the fin assembly 1), thereby enhancing the stability of the mounting.

In terms of material, the fan mounting frame 3 can be, for example, a metal fan mounting frame (such as aluminum), a plastic fan mounting frame, or a composite material fan mounting frame (such as carbon fiber).

Fan module 4 is secured (by snapping, locking, or other means) to fan mounting bracket 3 to generate an auxiliary heat dissipation airflow (not shown) that flows through vents VH and fin assembly 1. By varying the geometry of the blades in fan module 4, the auxiliary heat dissipation airflow can be directed from fan module 4 to fin assembly 1, or vice versa.

The fastener 5 is mounted on the three-dimensional temperature-averaging assembly 2 and is secured to the circuit board 200, thereby fastening and securing the three-dimensional temperature-averaging assembly 2 (heat sink 100) to the circuit board 200. The fastener 5 can be made of, for example, a metal fastener (e.g., stainless steel), a plastic fastener, or a composite fastener (e.g., carbon fiber).

After the working fluid absorbs the heat energy generated by the operation of the working components, it evaporates and transforms into a working gas. After the evaporated working gas flows from the heat exchange space HES into the heat exchange channel HEC, it transfers the absorbed heat energy to the fin assembly 1. After being dissipated by the auxiliary heat dissipation airflow, it condenses and transforms back into the working fluid. The condensed working fluid then flows back from the heat exchange channel HEC into the heat exchange space HES.

In summary, the airflow-assisted heat dissipation three-dimensional temperature-averaging heat sink 100 provided by this invention utilizes a fan mounting bracket 3 to mount a fan module 4 to generate auxiliary heat dissipation airflow. This significantly enhances heat dissipation efficiency through active heat exchange, thereby effectively overcoming the potential bottlenecks in improving heat dissipation efficiency associated with passive heat exchange.

The above detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various modifications and equivalent arrangements within the scope of the patent application for the present invention.

100: Heat sink 200: Circuit board 300: Working element 1: Fin assembly 2: Three-dimensional temperature balancing assembly 21: Temperature balancing plate 211: Base 212: Top cover 22: Heat pipe 3: Fan mounting bracket 31: Main body 32: Mounting portion 4: Fan module 5: Fastener AC: Assembly channel HES: Heat exchange space HEC: Heat exchange channel VH: Ventilation hole AG: Avoidance slot

The first figure is a three-dimensional schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature radiator of the better embodiment of the present invention arranged in front of the circuit board; the second figure is a three-dimensional schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature radiator of the better embodiment of the present invention arranged behind the circuit board; the third figure is a three-dimensional schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature radiator of the better embodiment of the present invention; the fourth figure is a three-dimensional schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature radiator of the better embodiment of the present invention FIG1 is a three-dimensional schematic diagram showing another perspective of the airflow-assisted heat dissipation type three-dimensional temperature uniforming radiator of the better embodiment of the present invention; FIG5 is a three-dimensional exploded schematic diagram showing the airflow-assisted heat dissipation type three-dimensional temperature uniforming radiator of the better embodiment of the present invention; FIG6 is a three-dimensional exploded schematic diagram showing the three-dimensional temperature uniforming component of the better embodiment of the present invention; and FIG7 is a cross-sectional schematic diagram showing the A-A section in FIG3.

100: Radiator

1: Fin assembly

2: Three-dimensional temperature balancing assembly

21: Vapor chamber

211: Base

212: Upper cover

22: Heat pipe

3: Fan mounting bracket

31: Main body

32: Attachment

4: Fan module

5: Fastening fasteners

AC: Assembly Channel

VH:Ventilation Hole

AG: Avoidance groove

Claims (10)

A three-dimensional heat dissipation radiator with airflow-assisted heat dissipation is arranged on a circuit board and covers a working component for dissipating heat from the working component, and comprises: a fin assembly having a plurality of assembly channels; a three-dimensional temperature-averaging assembly comprising: a temperature-averaging plate thermally connected to the working component and having a heat exchange space for accommodating a working fluid; and a plurality of heat pipes extending from the temperature-averaging plate toward the fin assembly and penetrating the assembly channels, and having a plurality of heat exchange channels connected to the heat exchange space; a fan mounting bracket mounted and fixed to the fin assembly, and A vent is provided; and a fan module is fixed to the fan mounting frame for generating an auxiliary heat dissipation airflow flowing through the vent and the fin assembly; wherein, after the working fluid absorbs the heat energy generated during the operation of the working element, it evaporates and transforms into a working gas; after the evaporated working gas flows from the heat exchange space into the heat exchange channels, it transfers the absorbed heat energy to the fin assembly, and after being dissipated by the auxiliary heat dissipation airflow, it condenses and transforms back into the working fluid; the condensed working fluid flows back into the heat exchange space through the heat exchange channels. The airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink as described in claim 1, wherein the fin assembly is a metal fin assembly, a ceramic fin assembly or a composite material fin assembly. The airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink as described in claim 1, wherein the working liquid is pure water, deionized water (DI water), methanol or ethanol. The airflow-assisted heat dissipation type three-dimensional temperature uniformity radiator as described in claim 1, wherein the three-dimensional temperature uniformity component is a three-dimensional temperature uniformity component made of a metal material. As described in claim 1, the airflow-assisted heat dissipation type three-dimensional temperature radiator, wherein the temperature radiating plate includes: a base, which is thermally connected to the working element; and a top cover, which is fixed to the base and together with the base forms the heat exchange space. As described in claim 1, the airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink, wherein the fan mounting rack includes: a main body, which is provided with the vent; and two mounting parts, which are bent and extended from the main body toward the fin assembly and are used to be fixed to the fin assembly, thereby mounting and fixing the fan mounting rack to the fin assembly. As described in claim 6, the airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink, wherein the two hanging parts are provided with a plurality of avoidance grooves corresponding to the heat pipes, and the avoidance grooves are used to avoid the heat pipes when the two hanging parts are fixed to the fin assembly. The airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink as described in claim 1, wherein the fan mounting frame is a metal fan mounting frame, a plastic fan mounting frame or a composite fan mounting frame. The airflow-assisted heat dissipation type three-dimensional temperature averaging heat sink as described in claim 1 further includes a fixing fastener, which is mounted on the three-dimensional temperature averaging assembly and is used to be fixed to the circuit board, thereby fastening and fixing the three-dimensional temperature averaging assembly to the circuit board. The airflow-assisted heat dissipation type three-dimensional temperature uniform heat sink as described in claim 9, wherein the fixing fastener is a metal fixing fastener, a plastic fixing fastener or a composite material fixing fastener.