TWM670423U - Wet process device - Google Patents
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- TWM670423U TWM670423U TW114201940U TW114201940U TWM670423U TW M670423 U TWM670423 U TW M670423U TW 114201940 U TW114201940 U TW 114201940U TW 114201940 U TW114201940 U TW 114201940U TW M670423 U TWM670423 U TW M670423U
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Abstract
Description
本申請涉及一種濕製程設備,特別是關於一種單晶圓濕製程設備。This application relates to a wet process equipment, in particular to a single wafer wet process equipment.
在半導體晶圓、封裝、顯示面板、發光二極體等產品的製造過程中,需要經過一晶圓(基板)處理系統,以對基板的表面供給處理液,例如化學品或去離子水等,進行蝕刻、清洗、塗布等處理程序,而在該基板處理系統中,則必須藉由一濕處理設備來針對使用過之製程液進行收集、排液、回收等後續處理。傳統濕製程旋轉設備取放片只能靠伺服馬達或交流電馬達去將旋轉機構的馬達或周圍的阻擋元件進行升降。然而,馬達的設置佔據較大空間,且馬達損壞更換的困難度極高,導致設備及維護方面皆需付出高額成本。In the manufacturing process of semiconductor wafers, packages, display panels, light-emitting diodes and other products, a wafer (substrate) processing system is required to supply processing liquids, such as chemicals or deionized water, to the surface of the substrate for etching, cleaning, coating and other processing procedures. In the substrate processing system, a wet processing equipment must be used to collect, drain, recycle and other subsequent processing of the used process liquid. Traditional wet process rotary equipment can only rely on servo motors or AC motors to raise and lower the motor of the rotating mechanism or the surrounding blocking components to load and place wafers. However, the motor setting occupies a large space, and it is extremely difficult to replace the damaged motor, resulting in high costs for both equipment and maintenance.
本申請之一目的在於提供一種應用於基板(晶圓)的處理製程的濕製程設備,其不需透過以馬達驅動旋轉機構周圍的阻擋機構或回收設備的升降,以減少設備及維護成本並大幅降低空間需求。One purpose of this application is to provide a wet process equipment for substrate (wafer) processing, which does not require a motor to drive a blocking mechanism around a rotating mechanism or the lifting of a recovery device, thereby reducing equipment and maintenance costs and significantly reducing space requirements.
為達上述目的,本申請提供一種濕製程設備,係應用於一基板的處理製程,該濕製程設備包括一旋轉台、一阻擋機構及一流體控制裝置。旋轉台用於承載該基板 。該阻擋機構設置在該旋轉台之周圍並包括:一固定座,包括複數個流體連接部;一伸縮環壁,可升降地設置在該固定座上,並包括至少一形變部;及一遮板,設置在該伸縮環壁遠離該固定座的一端,並朝該旋轉台的方向延伸,且該遮板、該伸縮環壁及該固定座之間具有一內部空間,該內部空間連通該複數個流體連接部,且該形變部圍繞該內部空間設置。該流體控制裝置包括一控制設備及複數個第一傳輸管,該複數個第一傳輸管連通於該複數個流體連接部,該控制設備用以通過該複數個第一傳輸管對該內部空間供應一流體。該伸縮環壁的形變部根據該內部空間內的流體的流動具有一第一形變狀態及一第二形變狀態,且該伸縮環壁在該第一形變狀態的高度大於該伸縮環壁在該第二形變狀態的高度。To achieve the above-mentioned purpose, the present application provides a wet process equipment, which is applied to a substrate processing process, and the wet process equipment includes a rotating table, a blocking mechanism and a fluid control device. The rotating table is used to carry the substrate. The blocking mechanism is arranged around the rotating table and includes: a fixed seat, including a plurality of fluid connecting parts; a telescopic ring wall, which can be raised and lowered on the fixed seat and includes at least one deformation part; and a shield plate, which is arranged at one end of the telescopic ring wall away from the fixed seat and extends toward the rotating table, and there is an internal space between the shield plate, the telescopic ring wall and the fixed seat, and the internal space is connected to the plurality of fluid connecting parts, and the deformation part is arranged around the internal space. The fluid control device includes a control device and a plurality of first transmission tubes, the plurality of first transmission tubes are connected to the plurality of fluid connection parts, and the control device is used to supply a fluid to the internal space through the plurality of first transmission tubes. The deformation part of the telescopic ring wall has a first deformation state and a second deformation state according to the flow of the fluid in the internal space, and the height of the telescopic ring wall in the first deformation state is greater than the height of the telescopic ring wall in the second deformation state.
較佳地, 該伸縮環壁包括一伸縮內壁及一伸縮外壁,該伸縮內壁及該伸縮外壁延繞該旋轉台之周圍設置並共同定義該形變部,且該內部空間位於該伸縮內壁及該伸縮外壁之間。Preferably, the telescopic ring wall includes a telescopic inner wall and a telescopic outer wall, the telescopic inner wall and the telescopic outer wall are arranged around the circumference of the rotating table and jointly define the deformation portion, and the internal space is located between the telescopic inner wall and the telescopic outer wall.
較佳地,該伸縮環壁包括多個該形變部,該多個形變部由該固定座朝上疊加設置。Preferably, the telescopic ring wall includes a plurality of the deformation portions, and the plurality of deformation portions are stacked upwardly from the fixing seat.
較佳地,該形變部包括一對彎折邊,該對彎折邊間隔且對稱地設在該伸縮內壁及該伸縮外壁。Preferably, the deformation portion includes a pair of bent edges, which are spaced and symmetrically arranged on the telescopic inner wall and the telescopic outer wall.
較佳地,該遮板延繞該旋轉台設置,並包括一遮擋部及一下對接部,且該伸縮環壁還包括一上對接部,其中該遮擋部由該伸縮環壁朝該旋轉台的方向延伸,該下對接部設置在該遮擋部相鄰該伸縮環壁的一端,用以和該上對接部密封地對接。Preferably, the shielding plate is arranged around the rotating table and includes a shielding portion and a lower docking portion, and the telescopic ring wall further includes an upper docking portion, wherein the shielding portion extends from the telescopic ring wall toward the rotating table, and the lower docking portion is arranged at one end of the shielding portion adjacent to the telescopic ring wall for sealingly docking with the upper docking portion.
較佳地,該遮板具有一硬度,其大於該伸縮環壁的硬度,且該遮板還包括一延伸壁,該延伸壁連接於該下對接部及該遮擋部之間,並延繞該遮擋部設置。Preferably, the shield has a hardness greater than that of the telescopic ring wall, and the shield further includes an extension wall connected between the lower abutting portion and the shielding portion and arranged around the shielding portion.
較佳地,該遮板與該伸縮環壁為一體成型之單一結構。Preferably, the shield and the telescopic ring wall are an integrally formed single structure.
較佳地,該流體控制裝置還包括一偵測元件及至少一第二傳輸管,該第二傳輸管的一端連接於該控制設備,另一端連通於每一該第一傳輸管,且該偵測元件設置在該第二傳輸管上,其中該流體由該控制設備輸出並依序由該第二傳輸管及該複數個第一傳輸管流入該阻擋機構的內部空間,該偵測元件用以感測該伸縮環壁的升降高度。Preferably, the fluid control device further includes a detection element and at least one second transmission tube, one end of the second transmission tube is connected to the control device, and the other end is connected to each of the first transmission tubes, and the detection element is arranged on the second transmission tube, wherein the fluid is output by the control device and flows into the internal space of the blocking mechanism in sequence from the second transmission tube and the plurality of first transmission tubes, and the detection element is used to sense the lifting height of the telescopic ring wall.
較佳地,該控制設備包括一進入口、一排出口及至少一通口,該進入口連接一外部流體供應源,用以供應該流體,該排出口連接一外部真空源,用以將該流體排出該內部空間,該至少一通口連通於該複數個第一傳輸管,用以供該流體在該複數個第一傳輸管與該進入口及該排出口之間流動。Preferably, the control device includes an inlet, an outlet and at least one port, the inlet is connected to an external fluid supply source for supplying the fluid, the outlet is connected to an external vacuum source for discharging the fluid out of the internal space, and the at least one port is connected to the plurality of first transmission tubes for allowing the fluid to flow between the plurality of first transmission tubes and the inlet and the outlet.
較佳地,該濕製程設備還包括一取放裝置及一液體供給裝置,其中該取放裝置用於放置該基板至該旋轉台上及取回該旋轉台上的基板,該液體供給裝置用於供應至少一種製程液體至該基板上。Preferably, the wet process equipment further includes a pick-and-place device and a liquid supply device, wherein the pick-and-place device is used to place the substrate on the turntable and retrieve the substrate on the turntable, and the liquid supply device is used to supply at least one process liquid to the substrate.
在本申請實施例中,濕製程設備利用具有氣囊結構的該伸縮環壁,可依據製程的需求透過進氣及洩壓的控制使該伸縮環壁產生形變,進而改變該伸縮環壁的高度,使該伸縮環壁及該遮板上升或下降而能有效遮擋製程液體的噴濺,不需透過以馬達驅動旋轉機構周圍的回收設備或阻擋設備的升降,以減少設備及維護成本並可大幅降低空間需求。In the embodiment of the present application, the wet process equipment utilizes the retractable ring wall with an airbag structure, which can be deformed by controlling the air intake and pressure relief according to the needs of the process, thereby changing the height of the retractable ring wall, so that the retractable ring wall and the shield plate rise or fall to effectively block the splashing of the process liquid. There is no need to use a motor to drive the recovery equipment around the rotating mechanism or the blocking equipment to rise and fall, thereby reducing equipment and maintenance costs and significantly reducing space requirements.
以下各實施例的說明是參考附加的圖式,用以例示本申請可用以實施的特定實施例。本申請所提到的方向用語,例如“上”、“下”、“前”、“後”、“左”、“右”、“內”、“外”、“側面”等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明及理解本申請,而非用以限制本申請。The following descriptions of the embodiments refer to the attached drawings to illustrate specific embodiments that can be implemented in the present application. Directional terms mentioned in the present application, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to explain and understand the present application, but not to limit the present application.
本申請特別以下述例子加以描述,這些例子僅係用以舉例說明而已,因為對於熟習此技藝者而言,在不脫離本揭示內容之精神和範圍內,當可作各種之更動與潤飾,因此本揭示內容之保護範圍當視後附之申請專利範圍所界定者為準。在通篇說明書與申請專利範圍中,除非內容清楚指定,否則「一」以及「所述」的意義包含這一類敘述包含「一或至少一」所述元件或成分。此外,如本申請所用,除非從特定上下文明顯可見將複數個排除在外,否則單數冠詞亦包含複數個元件或成分的敘述。而且,應用在此描述中與下述之全部申請專利範圍中時,除非內容清楚指定,否則「在其中」的意思可包含「在其中」與「在其上」。The present application is particularly described with the following examples, which are used for illustration only, because for those skilled in the art, various changes and modifications can be made without departing from the spirit and scope of the present disclosure, so the protection scope of the present disclosure shall be subject to the definition of the attached patent scope. Throughout the specification and the patent scope, unless the content clearly specifies, the meaning of "one" and "the" includes such a description including "one or at least one" of the elements or components. In addition, as used in the present application, unless it is obvious from the specific context that the plural is excluded, the singular article also includes the description of plural elements or components. Moreover, when applied in this description and the entire patent scope below, unless the content clearly specifies, the meaning of "in which" may include "in which" and "on which".
下面將結合本申請實施例中的附圖,對本申請實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅是本申請一部分實施例,而不是全部的實施例。基於本申請中的實施例,本領域技術人員在沒有作出創造性勞動前提下所獲得的所有其他實施例,都屬本申請保護的範圍。The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by technical personnel in this field without creative labor are within the scope of protection of this application.
本申請提供一種濕製程設備,用於一基板的處理製程中,其隻該基板可為單晶圓或單片式基板,且本申請的濕製程設備可應用於半導體前段製程、半導體先進封裝製程、化合物半導體製程、光電製程等有關蝕刻、清洗、去光阻及乾燥等處理。參照圖1,圖1為本申請一實施例的濕製程設備1的立體結構示意圖,圖2為圖1的濕製程設備1中的阻擋機構3形變降低的立體結構示意圖。如圖1及圖2所示,本申請提供的濕製程設備1包括旋轉機構2、阻擋機構3及流體控制裝置4(參照圖4,詳如後述),並且配合一取放裝置5及一液體供給裝置6對基板7(參照圖5,詳如後述)供應製程藥液進行上述各種製程。如圖2所示,旋轉機構2包括一旋轉台21及一軸桿22。旋轉台21設置在軸桿22的頂部並用以承載基板7(參照圖5,詳如後述),軸桿22連接一驅動裝置(未圖示)以驅動旋轉台21及軸桿22樞轉。在此實施例中,旋轉機構2在半導體製程中的高度固定,不需升降高度,進而避免旋轉機構2在中間升降對製程穩定性所產生的不良影響。The present application provides a wet process equipment for use in a substrate processing process, wherein the substrate may be a single wafer or a monolithic substrate, and the wet process equipment of the present application may be applied to semiconductor front-end process, semiconductor advanced packaging process, compound semiconductor process, optoelectronic process, etc., and processes such as etching, cleaning, photoresist removal, and drying. Referring to FIG. 1 , FIG. 1 is a three-dimensional structural schematic diagram of a wet process equipment 1 of an embodiment of the present application, and FIG. 2 is a three-dimensional structural schematic diagram of a blocking mechanism 3 in the wet process equipment 1 of FIG. 1 with reduced deformation. As shown in FIG. 1 and FIG. 2 , the wet process equipment 1 provided by the present application includes a rotating mechanism 2, a blocking mechanism 3 and a fluid control device 4 (refer to FIG. 4 , as described below in detail), and cooperates with a pick-and-place device 5 and a liquid supply device 6 to supply process liquid to a substrate 7 (refer to FIG. 5 , as described below in detail) to perform the above-mentioned various processes. As shown in FIG. 2 , the rotating mechanism 2 includes a rotating table 21 and a shaft 22. The rotating table 21 is arranged on the top of the shaft 22 and is used to carry the substrate 7 (refer to FIG. 5 , as described below in detail), and the shaft 22 is connected to a driving device (not shown) to drive the rotating table 21 and the shaft 22 to rotate. In this embodiment, the height of the rotating mechanism 2 is fixed during the semiconductor manufacturing process and does not need to be raised or lowered, thereby avoiding the adverse effects of the rotating mechanism 2 being raised or lowered during the manufacturing process on the stability of the manufacturing process.
參照圖1至圖3,圖3為本申請一實施例的濕製程設備1的剖面示意圖,需要注意的是,為清楚起見,圖3所示的旋轉台21是以立體視角呈現。如圖1至圖3所示,阻擋機構3設置在該旋轉台21之周圍,並包括一伸縮環壁31、一遮板32及一固定座33。具體地,伸縮環壁31可升降地設置在該固定座33上,並包括多個形變部312。遮板32設置在伸縮環壁31遠離固定座33的一端,並朝旋轉台21的方向延伸,且遮板32、伸縮環壁31及固定座33之間具有一內部空間310。在一些實施例中,如圖1至圖3所示,伸縮環壁31及遮板32為環狀中空的構型,使旋轉台21被伸縮環壁31及遮板32圍繞,且形變部312圍繞內部空間310設置。固定座33包括複數個連通內部空間310的流體連接部331。Referring to FIGS. 1 to 3 , FIG. 3 is a schematic cross-sectional view of a wet process equipment 1 according to an embodiment of the present application. It should be noted that, for the sake of clarity, the turntable 21 shown in FIG. 3 is presented in a three-dimensional perspective. As shown in FIGS. 1 to 3 , the blocking mechanism 3 is disposed around the turntable 21 and includes a telescopic ring wall 31, a shield plate 32 and a fixed seat 33. Specifically, the telescopic ring wall 31 is movably disposed on the fixed seat 33 and includes a plurality of deformation portions 312. The shield plate 32 is disposed at one end of the telescopic ring wall 31 away from the fixed seat 33 and extends toward the turntable 21, and an internal space 310 is provided between the shield plate 32, the telescopic ring wall 31 and the fixed seat 33. In some embodiments, as shown in FIGS. 1 to 3 , the retractable annular wall 31 and the shield 32 are annular hollow structures, so that the rotating platform 21 is surrounded by the retractable annular wall 31 and the shield 32 , and the deformation portion 312 is disposed around the inner space 310 . The fixing seat 33 includes a plurality of fluid connection portions 331 connected to the inner space 310 .
詳細地,伸縮環壁31包括一伸縮內壁311及一伸縮外壁313。伸縮內壁311及伸縮外壁313延繞旋轉台21之周圍設置並共同定義該多個形變部312,且內部空間310位於伸縮內壁311及伸縮外壁313之間。在此實施例中,如圖3所示,每一形變部312包括一對彎折邊312a及312b,該對彎折邊312a及312b彼此間隔且對稱地形成在伸縮內壁311及伸縮外壁313,且多個形變部312由固定座33朝上疊加相鄰設置。具體地,該對彎折邊312a及312b分別由上下對稱的斜邊構成。伸縮內壁311及伸縮外壁313之間的內部空間310用於提供容置由流體控制裝置4傳輸的流體的空間。在一些實施例中,該流體可為氣體或液體。較佳地,流體控制裝置4對內部空間310供應壓縮乾燥空氣(compressed dry air, CDA)。在此實施例中,伸縮環壁31的作用猶如一氣囊結構,透過對內部空間310的空氣壓力控制,使伸縮環壁31的形變部312產生形變,進而改變伸縮環壁31整體的高度而達到上升及下降的升降效果。在一些實施例中,伸縮環壁31的材質可為過氟烷基乙烯基醚(perfluoroalkoxy alkane,PFA)或聚四氟乙烯(polytetrafluoroethene,PTFE)等具耐酸鹼軟性材質,惟並不以此為限,其他具有耐酸鹼特性且可產生形變的材質皆可。In detail, the telescopic ring wall 31 includes a telescopic inner wall 311 and a telescopic outer wall 313. The telescopic inner wall 311 and the telescopic outer wall 313 are arranged around the circumference of the rotating table 21 and define the plurality of deformation parts 312 together, and the inner space 310 is located between the telescopic inner wall 311 and the telescopic outer wall 313. In this embodiment, as shown in FIG. 3 , each deformation part 312 includes a pair of curved edges 312a and 312b, and the pair of curved edges 312a and 312b are spaced from each other and symmetrically formed on the telescopic inner wall 311 and the telescopic outer wall 313, and the plurality of deformation parts 312 are stacked and adjacently arranged upward by the fixing base 33. Specifically, the pair of curved edges 312a and 312b are respectively formed by upper and lower symmetrical hypotenuses. The internal space 310 between the telescopic inner wall 311 and the telescopic outer wall 313 is used to provide a space for accommodating the fluid transmitted by the fluid control device 4. In some embodiments, the fluid can be a gas or a liquid. Preferably, the fluid control device 4 supplies compressed dry air (CDA) to the internal space 310. In this embodiment, the telescopic annular wall 31 acts like an airbag structure. By controlling the air pressure of the internal space 310, the deformation portion 312 of the telescopic annular wall 31 is deformed, thereby changing the overall height of the telescopic annular wall 31 to achieve the lifting effect of rising and falling. In some embodiments, the material of the telescopic ring wall 31 can be perfluoroalkoxy alkane (PFA) or polytetrafluoroethene (PTFE) or other soft materials with acid and alkali resistance, but it is not limited thereto, and other materials with acid and alkali resistance and capable of generating deformation can be used.
繼續參照圖1至圖3,遮板32延繞旋轉台21設置,並包括一遮擋部321及一下對接部323(如圖3所示)。此外,伸縮環壁31還包括一上對接部315,其相鄰於遮板32。較佳地,遮擋部321由伸縮環壁31朝旋轉台21的方向延伸,使遮擋部321延伸出伸縮內壁311外。遮板32的下對接部323設置在遮擋部321相鄰伸縮環壁31的一端,用以和上對接部315密封地對接,使遮擋部321固定在伸縮環壁31的頂部。在一些實施例中,遮板32與伸縮環壁31可為一體成型之單一結構,用以達到較佳的密封效果。在另一些實施例中,遮板32的材料可為聚丙烯(polypropylene,PP)、聚乙烯(polyethylene, PE)等具有耐酸鹼特性的硬質材料,惟並不以此為限,其他具有耐酸鹼特性的材質皆可。較佳地,遮板32具有一硬度,其大於伸縮環壁31的硬度,以確保遮板32不易因處理基板的製程藥液的噴濺而變形。Continuing to refer to FIG. 1 to FIG. 3 , the shielding plate 32 is arranged around the rotating table 21 and includes a shielding portion 321 and a lower abutting portion 323 (as shown in FIG. 3 ). In addition, the telescopic ring wall 31 further includes an upper abutting portion 315 adjacent to the shielding plate 32. Preferably, the shielding portion 321 extends from the telescopic ring wall 31 toward the rotating table 21, so that the shielding portion 321 extends outside the telescopic inner wall 311. The lower abutting portion 323 of the shielding plate 32 is arranged at one end of the shielding portion 321 adjacent to the telescopic ring wall 31, so as to be sealedly abutted with the upper abutting portion 315, so that the shielding portion 321 is fixed to the top of the telescopic ring wall 31. In some embodiments, the shield 32 and the telescopic ring wall 31 can be a single structure formed in one piece to achieve a better sealing effect. In other embodiments, the shield 32 can be made of hard materials with acid and alkali resistance such as polypropylene (PP) and polyethylene (PE), but it is not limited to this, and other materials with acid and alkali resistance can be used. Preferably, the shield 32 has a hardness greater than the hardness of the telescopic ring wall 31 to ensure that the shield 32 is not easily deformed by the splashing of the process solution for processing the substrate.
參照圖4及圖5,圖4為濕製程設備1的流體控制裝置4的結構示意圖,圖5為濕製程設備1的使用狀態示意圖。在一些實施例中,流體控制裝置4包括一控制設備41、複數個第一傳輸管421、至少一第二傳輸管422及一偵測元件43。具體地,複數個第一傳輸管421對應連通於該複數個流體連接部331。控制設備41包括一進入口411、一排出口412及至少一通口413,較佳地,控制設備41配置有可程式化邏輯控制器,用以控制壓縮乾燥空氣的進氣與排出。在另一些實施例中,控制設備41亦可以手動方式控制,在此並不限定。詳細地,進入口411連接一外部流體供應源(未圖示),用以供應該流體,排出口412連接一外部真空源(未圖示),用以將該流體排出該內部空間310,通口413連通於複數個第一傳輸管421,用以供該流體在複數個第一傳輸管421與進入口411及排出口412之間流動。Referring to FIG. 4 and FIG. 5 , FIG. 4 is a schematic diagram of the structure of the fluid control device 4 of the wet process equipment 1, and FIG. 5 is a schematic diagram of the use state of the wet process equipment 1. In some embodiments, the fluid control device 4 includes a control device 41, a plurality of first transmission tubes 421, at least one second transmission tube 422, and a detection element 43. Specifically, the plurality of first transmission tubes 421 are connected to the plurality of fluid connection parts 331. The control device 41 includes an inlet 411, an outlet 412, and at least one port 413. Preferably, the control device 41 is equipped with a programmable logic controller to control the intake and exhaust of compressed dry air. In other embodiments, the control device 41 can also be controlled manually, which is not limited here. In detail, the inlet 411 is connected to an external fluid supply source (not shown) for supplying the fluid, the outlet 412 is connected to an external vacuum source (not shown) for discharging the fluid from the internal space 310, and the port 413 is connected to a plurality of first transmission tubes 421 for allowing the fluid to flow between the plurality of first transmission tubes 421 and the inlet 411 and the outlet 412.
繼續參照圖4及圖5,第二傳輸管422的一端連接於控制設備41,另一端連通於每一該第一傳輸管421,且偵測元件43設置在第二傳輸管422上。控制設備41用以通過該複數個第一傳輸管421對內部空間310供應一流體。具體地,流體(即壓縮乾燥空氣)由進入口411輸入控制設備41,並由通口413輸出,之後依序由第二傳輸管422及複數個第一傳輸管421流入阻擋機構3的內部空間310。偵測元件43用以感測流體的流動狀態,包括例如流體的壓力。在一些實施例中,偵測元件43為壓力開關,當被測壓力上升或下降到預設的壓力動作點時,運用壓力開關內的部件改變開關的導通或斷開狀態,能讓控制設備41達到壓力自動控制的效果。在其他實施例中,偵測元件43可為對照式感測器或近接開關,其設置及運作方式為為此業界所熟悉的內容,在此不贅述。在此實施例中,如圖4所示,兩條第一傳輸管421是共接於同一第二傳輸管上422。在其他實施例中,兩條第一傳輸管421也可各自連接於兩條第二傳輸管上422,亦即,兩條第一傳輸管421是直接連接於在控制設備41各自對應的通口413,其皆可達到傳送流體的作用。具體地,本申請的流體控制裝置4可在流體的流動路徑上利用單個或多個電磁閥(未圖示)完成進氣及洩壓動作。Continuing to refer to FIG. 4 and FIG. 5 , one end of the second transmission tube 422 is connected to the control device 41, and the other end is connected to each of the first transmission tubes 421, and the detection element 43 is disposed on the second transmission tube 422. The control device 41 is used to supply a fluid to the internal space 310 through the plurality of first transmission tubes 421. Specifically, the fluid (i.e., compressed dry air) is input into the control device 41 through the inlet 411 and output through the port 413, and then flows into the internal space 310 of the blocking mechanism 3 through the second transmission tube 422 and the plurality of first transmission tubes 421 in sequence. The detection element 43 is used to sense the flow state of the fluid, including, for example, the pressure of the fluid. In some embodiments, the detection element 43 is a pressure switch. When the measured pressure rises or falls to a preset pressure action point, the components in the pressure switch are used to change the on or off state of the switch, so that the control device 41 can achieve the effect of automatic pressure control. In other embodiments, the detection element 43 can be a contrast sensor or a proximity switch, and its configuration and operation are familiar to the industry and will not be described here. In this embodiment, as shown in FIG. 4 , two first transmission tubes 421 are connected to the same second transmission tube 422. In other embodiments, the two first transmission pipes 421 may be connected to the two second transmission pipes 422, that is, the two first transmission pipes 421 are directly connected to the corresponding ports 413 of the control device 41, and both of them can achieve the function of transmitting fluid. Specifically, the fluid control device 4 of the present application can use a single or multiple electromagnetic valves (not shown) on the flow path of the fluid to complete the intake and pressure relief actions.
參照圖5並配合圖3。流體控制裝置4控制壓縮乾燥空氣(即流體)的流動狀態,亦即控制進氣及洩壓,使伸縮環壁31的形變部312根據內部空間310內的流體的流動具有一第一形變狀態及一第二形變狀態,且伸縮環壁31在該第一形變狀態的高度H1大於伸縮環壁31在該第二形變狀態的高度H2。詳細地,本申請之濕製程設備1在基板7尚未放置於旋轉台21上時,如圖5所示,伸縮環壁31內的空氣被洩壓排出內部空間310,使伸縮環壁31在該第二形變狀態時下降並形成一高度H2。如圖3所示,待取放裝置5放置基板7至旋轉台21上定位後(為清楚起見,圖3並未顯示基板7),內部空間310內壓縮乾燥空氣增壓,使伸縮環壁31在該第一形變狀態時上升並形成一高度H1,此時,伸縮環壁31及遮板32上升到達高於旋轉台21上方。接著,液體供給裝置6供應至少一種製程液體至基板7上。藉此,旋轉台21旋轉造成製程液體的噴濺可被遮板32遮擋並順延伸縮環壁31往下流,最後排放或流進回收設備(未圖示)。濕製程設備1完成作業後可進一步利用清洗設備清洗阻擋機構3。Refer to FIG. 5 and FIG. 3 . The fluid control device 4 controls the flow state of the compressed dry air (i.e., fluid), that is, controls the air intake and pressure release, so that the deformation portion 312 of the telescopic annular wall 31 has a first deformation state and a second deformation state according to the flow of the fluid in the internal space 310, and the height H1 of the telescopic annular wall 31 in the first deformation state is greater than the height H2 of the telescopic annular wall 31 in the second deformation state. In detail, when the substrate 7 of the wet process equipment 1 of the present application is not placed on the rotating table 21, as shown in FIG. 5 , the air in the telescopic annular wall 31 is released from the internal space 310, so that the telescopic annular wall 31 drops in the second deformation state and forms a height H2. As shown in FIG3 , after the pick-and-place device 5 places the substrate 7 on the turntable 21 for positioning (for the sake of clarity, FIG3 does not show the substrate 7), the internal space 310 is compressed and the dry air is pressurized, so that the telescopic ring wall 31 rises in the first deformation state and forms a height H1. At this time, the telescopic ring wall 31 and the shield plate 32 rise to a height higher than the turntable 21. Then, the liquid supply device 6 supplies at least one process liquid to the substrate 7. Thereby, the splash of the process liquid caused by the rotation of the turntable 21 can be blocked by the shield plate 32 and flow down along the telescopic ring wall 31, and finally discharged or flow into the recovery equipment (not shown). After the wet process equipment 1 completes the operation, the blocking mechanism 3 can be further cleaned by a cleaning device.
參照圖6及圖7,圖6為本申請另一實施例的濕製程設備1’的立體結構示意圖,圖7為圖6的濕製程設備1’中的阻擋機構3降低的立體結構示意圖。圖6及圖1所示的實施例的主要區別在於遮板32的結構。詳細地,如圖6所示,遮板32還包括一延伸壁322,延伸壁322連接於下對接部323及遮擋部321之間,並延繞遮擋部321設置。此外,遮板32包括下對接部323,用以和伸縮環壁31的上對接部315密封地對接,使遮板32固定在伸縮環壁31的頂部。較佳地,延伸壁322為一環繞旋轉台21形成的環壁。在一些實施例中,延伸壁322上設置有多個抽出口325,以提升抽出壓縮乾燥空氣的效果。圖6所示的遮板32具有一硬度,其大於伸縮環壁31的硬度。延伸壁322的設置可增加遮板32對於基板7旋轉時的風壓的抵抗程度,使遮板32不易因該風壓產生形變或橫向的位移,進而提升阻擋機構3阻擋製程藥液的效果。Referring to FIG. 6 and FIG. 7 , FIG. 6 is a three-dimensional structural schematic diagram of a wet process equipment 1 ' of another embodiment of the present application, and FIG. 7 is a three-dimensional structural schematic diagram of the blocking mechanism 3 in the wet process equipment 1 ' of FIG. 6 when it is lowered. The main difference between FIG. 6 and the embodiment shown in FIG. 1 is the structure of the shield 32. In detail, as shown in FIG. 6 , the shield 32 further includes an extension wall 322, and the extension wall 322 is connected between the lower docking portion 323 and the shielding portion 321, and is arranged around the shielding portion 321. In addition, the shield 32 includes a lower docking portion 323 for sealingly docking with the upper docking portion 315 of the telescopic ring wall 31, so that the shield 32 is fixed to the top of the telescopic ring wall 31. Preferably, the extension wall 322 is an annular wall formed around the rotating table 21. In some embodiments, a plurality of extraction ports 325 are provided on the extension wall 322 to enhance the effect of extracting compressed dry air. The shield plate 32 shown in FIG6 has a hardness greater than the hardness of the retractable annular wall 31. The provision of the extension wall 322 can increase the resistance of the shield plate 32 to the wind pressure when the substrate 7 rotates, so that the shield plate 32 is not easily deformed or displaced laterally due to the wind pressure, thereby enhancing the effect of the blocking mechanism 3 in blocking the process liquid.
參照圖8,圖8為為本申請另一實施例的濕製程設備1的剖面示意圖,圖8所示的實施例與上述實施例的不同僅在於形變部312的一對彎折邊312a及312b分別為一彎曲的弧邊構成,其同樣可使形變部312產生形變,進而使伸縮環壁31升降改變高度。Referring to FIG. 8 , FIG. 8 is a cross-sectional schematic diagram of a wet process equipment 1 of another embodiment of the present application. The embodiment shown in FIG. 8 differs from the above-mentioned embodiment only in that a pair of bent edges 312a and 312b of the deformation portion 312 are respectively formed of curved arc edges, which can also cause the deformation portion 312 to deform, thereby causing the telescopic ring wall 31 to rise and fall to change its height.
綜上所述,本申請提供的濕製程設備利用具有氣囊結構的該伸縮環壁,可依據製程的需求透過進氣及洩壓的控制使該伸縮環壁產生形變,進而改變該伸縮環壁的高度,使該伸縮環壁及該遮板上升或下降而能有效地遮擋製程液體的噴濺,不需透過以馬達驅動旋轉機構周圍的回收設備或阻擋設備的升降,以減少設備及維護成本並可大幅降低空間需求。In summary, the wet process equipment provided by the present application utilizes the retractable ring wall with an airbag structure, which can deform the retractable ring wall through the control of air intake and pressure relief according to the needs of the process, thereby changing the height of the retractable ring wall, so that the retractable ring wall and the shield plate rise or fall to effectively block the splashing of the process liquid. There is no need to use a motor to drive the recovery equipment around the rotating mechanism or the blocking equipment to rise and fall, thereby reducing equipment and maintenance costs and significantly reducing space requirements.
雖然本申請已以優選實施例闡述如上,但上述優選實施例並非用以限制本申請,本領域的普通技術人士在不脫離本申請的精神和範圍內,均可作各種更動與潤飾,因此本申請的保護範圍以請求項界定的範圍為準。Although the present application has been described above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined in the claims.
以上對本申請實施例所提供用於晶圓及基板的處理製程中的濕製程設備詳細介紹,本文中應用了具體個例對本申請的原理及實施方式進行了闡述,以上實施例的說明只是用於幫助理解本申請的方法及其核心思想。同時,對於本領域的技術人員,依據本申請的思想,在具體實施方式及應用範圍上均會有改變的地方,綜上所述,本說明書內容不應理解為對本申請的限制。The above is a detailed introduction to the wet process equipment used in the processing of wafers and substrates provided by the embodiment of this application. This article uses specific examples to explain the principles and implementation methods of this application. The above description of the embodiment is only used to help understand the method and core ideas of this application. At the same time, for technical personnel in this field, according to the ideas of this application, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on this application.
1、1’:濕製程設備 2:旋轉機構 21:旋轉台 22:軸桿 3:阻擋機構 31:伸縮環壁 310:內部空間 311:伸縮內壁 312:形變部 312a:彎折邊 312b:彎折邊 313:伸縮外壁 315:上對接部 32:遮板 321:遮擋部 322:延伸壁 323:下對接部 325:抽出口 33:固定座 331:流體連接部 4:流體控制裝置 41:控制設備 411:進入口 412:排出口 413:通口 421:第一傳輸管 422:第二傳輸管 43:偵測元件 5:取放裝置 6:液體供給裝置 7:基板 H1:高度 H2:高度 1, 1': Wet process equipment 2: Rotating mechanism 21: Rotating table 22: Shaft 3: Blocking mechanism 31: Telescopic ring wall 310: Internal space 311: Telescopic inner wall 312: Deformation part 312a: Bend edge 312b: Bend edge 313: Telescopic outer wall 315: Upper docking part 32: Shield 321: Shielding part 322: Extension wall 323: Lower docking part 325: Extraction port 33: Fixed seat 331: Fluid connection part 4: Fluid control device 41: Control device 411: Inlet 412: Outlet 413: Through port 421: First transmission tube 422: Second transmission tube 43: Detection element 5: Pick-and-place device 6: Liquid supply device 7: Substrate H1: Height H2: Height
圖1為本申請一實施例的濕製程設備的立體結構示意圖。 圖2為圖1的濕製程設備中的阻擋機構形變降低的立體結構示意圖。 圖3為本申請一實施例的濕製程設備的剖面示意圖。 圖4為本申請一實施例的濕製程設備的流體控制裝置的結構示意圖。 圖5為本申請一實施例的濕製程設備的使用狀態示意圖。 圖6為本申請另一實施例的濕製程設備的立體結構示意圖。 圖7為圖6的濕製程設備中的阻擋機構降低的立體結構示意圖。 圖8為為本申請另一實施例的濕製程設備的剖面示意圖。 FIG. 1 is a three-dimensional structural schematic diagram of a wet process device of an embodiment of the present application. FIG. 2 is a three-dimensional structural schematic diagram of a barrier mechanism in the wet process device of FIG. 1 with reduced deformation. FIG. 3 is a cross-sectional schematic diagram of a wet process device of an embodiment of the present application. FIG. 4 is a structural schematic diagram of a fluid control device of a wet process device of an embodiment of the present application. FIG. 5 is a schematic diagram of a wet process device in use of an embodiment of the present application. FIG. 6 is a three-dimensional structural schematic diagram of a wet process device of another embodiment of the present application. FIG. 7 is a three-dimensional structural schematic diagram of a barrier mechanism in the wet process device of FIG. 6 with reduced deformation. FIG. 8 is a cross-sectional schematic diagram of a wet process device of another embodiment of the present application.
1:濕製程設備 1: Wet process equipment
21:旋轉台 21: Rotating table
3:阻擋機構 3: Blocking mechanism
31:伸縮環壁 31: Telescopic ring wall
311:伸縮內壁 311: Telescopic inner wall
312:形變部 312: Deformation Department
313:伸縮外壁 313:Telescopic outer wall
32:遮板 32: Shield
33:固定座 33: Fixed seat
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW114201940U TWM670423U (en) | 2025-02-25 | 2025-02-25 | Wet process device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW114201940U TWM670423U (en) | 2025-02-25 | 2025-02-25 | Wet process device |
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| TWM670423U true TWM670423U (en) | 2025-05-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120656977A (en) * | 2025-08-20 | 2025-09-16 | 江苏元夫半导体科技有限公司 | Wafer drying device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120656977A (en) * | 2025-08-20 | 2025-09-16 | 江苏元夫半导体科技有限公司 | Wafer drying device |
| CN120656977B (en) * | 2025-08-20 | 2025-10-17 | 江苏元夫半导体科技有限公司 | Wafer drying device |
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