TWM670066U - Camera - Google Patents

Abstract

A camera device includes a circuit board and a lens module, wherein the circuit board includes a photosensitive element and a grounding element. The lens module includes a lens and a conductive base, wherein the conductive base is disposed on the circuit board, the conductive base is directly or indirectly connected to the grounding element, the lens is disposed on the conductive base, and the position of the lens corresponds to the position of the photosensitive element.

Description

Camera

This work is about an electronic device, in particular a photographic device.

With the development of technology, camera devices are increasingly being used in personal electronics, automotive, and medical fields. For example, a personal computer can be equipped with a camera to support functions such as photography, web video, or facial recognition.

If a photographic device encounters static electricity problems during use, electrostatic discharge (ESD) can easily cause short circuits between electronic components or damage the normal operation of components. In particular, highly sensitive components such as photosensitive components may suffer irreparable damage once subjected to static electricity shock, affecting the performance and life of the product.

In view of the above, in one embodiment, a camera device is provided, including a circuit board and a lens module, wherein the circuit board includes a photosensitive element and a grounding element. The lens module includes a lens and a conductive base, wherein the conductive base is disposed on the circuit board, the conductive base is directly or indirectly connected to the grounding element, the lens is disposed on the conductive base, and the position of the lens corresponds to the position of the photosensitive element.

In summary, the camera device of the present invention is directly or indirectly connected to the grounding member on the circuit board through the conductive base of the lens module. When electrostatic current is generated at the lens, the electrostatic current can be conducted to the grounding member through the conductive base, thereby preventing the photosensitive element from being damaged by the static electricity.

FIG. 1 is a three-dimensional diagram of the first embodiment of the creative camera device, FIG. 2 is an exploded three-dimensional diagram of the first embodiment of the creative camera device, FIG. 3 is a partially exploded three-dimensional diagram of the first embodiment of the creative camera device, FIG. 4 is a cross-sectional view along line 4-4 of FIG. 1 , and FIG. 5 is a cross-sectional view along line 5-5 of FIG. 1 . As shown in FIG. 1 to FIG. 5 , the camera device 1 of the creative embodiment includes a circuit board 10 and a lens module 20. In some embodiments, the camera device 1 can be applied to various electronic products to capture images around the electronic products. For example, the camera device 1 can be applied to automotive products (such as a driving recorder, a reversing display system, or a surround imaging system), mobile devices (such as a smart phone, a tablet computer, or a notebook computer), or electronic products such as cameras.

As shown in FIG. 1 and FIG. 2 , for example, the camera device 1 can be installed inside a housing 50 of an electronic product. In this embodiment, the housing 50 can include a first housing plate 501 and a second housing plate 502, which are assembled to form a hollow housing 50, and the circuit board 10 and the lens module 20 are disposed in the housing 50, and the housing 50 can have an opening 503, so that a partial area of the lens module 20 can be exposed from the housing 50 to receive external light.

As shown in FIGS. 2 to 5 , the circuit board 10 has a photosensitive element 11 and a grounding member 15. In the present embodiment, the circuit board 10 has a front side 101 and a back side 102 opposite to each other, and the photosensitive element 11 is disposed on the front side 101 of the circuit board 10. For example, the photosensitive element 11 can be fixed on the front side 101 by adhesion, snapping or locking, but the invention is not limited thereto. In other embodiments, the photosensitive element 11 can also be disposed inside a hole of the circuit board 10.

In some embodiments, the photosensitive element 11 may be a charge-coupled device (CCD), a complementary metal-oxide semiconductor (CMOS), or a complementary metal-oxide semiconductor active pixel sensor (CMOS active pixel sensor) for sensing and acquiring images.

As shown in FIGS. 2 to 5 , the grounding element 15 has a conductive function. For example, the grounding element 15 may be a grounding layer of the circuit board 10, wherein the material of the grounding layer may be metal (such as copper, aluminum or silver), and at least part of the grounding element 15 may be exposed on the surface of the circuit board 10 (as shown in FIG. 5 , part of the grounding element 15 is exposed on the back surface 102 of the circuit board 10). In other embodiments, the grounding element 15 may also be a grounding connector (such as a grounding terminal, a grounding plug or a grounding connector) disposed on the surface of the circuit board 10.

As shown in FIGS. 2 to 5 , the lens module 20 includes a lens 21 and a conductive base 25. The conductive base 25 can be made of a conductive material, such as a metal or a conductive polymer. The conductive base 25 is disposed on the circuit board 10 and surrounds the photosensitive element 11. The conductive base 25 can be assembled to the circuit board 10 by adhesion, snapping or locking. In this embodiment, the circuit board 10 has an assembly hole 104. The number of the assembly hole 104 can be one or more. In this embodiment, there are two assembly holes 104, which are respectively located on opposite sides of the photosensitive element 11, and each assembly hole 104 passes through the front 101 and the back 102 of the circuit board 10. The conductive base 25 has an assembly portion 252. The number and position of the assembly portions 252 correspond to the number and position of the assembly holes 104. Each assembly portion 252 of the conductive base 25 and each assembly hole 104 of the circuit board 10 are assembled with a fixing member 41. For example, the fixing member 41 can be a rivet, a screw or a bolt, so that the conductive base 25 is assembled on the circuit board 10.

As shown in FIGS. 2 to 5 , the lens 21 of the lens module 20 is disposed on the conductive base 25. For example, the lens 21 can be assembled to the conductive base 25 by adhesion, snapping or locking, and the position of the lens 21 corresponds to the photosensitive element 11 and the opening 503 of the housing 50, so that after external light enters through the opening 503, it can be transmitted to the photosensitive element 11 through the lens 21, so that the photosensitive element 11 senses and obtains an image.

In some embodiments, the conductive base 25 of the lens module 20 can be directly connected to the grounding member 15 of the circuit board 10, or the conductive base 25 can be indirectly connected to the grounding member 15 of the circuit board 10 through other conductive components, so that the conductive base 25 and the grounding member 15 are connected to each other. In this way, when electrostatic current is generated at the lens 21 of the lens module 20 and enters the housing 50, the electrostatic current can be conducted to the grounding member 15 of the circuit board 10 through the conductive base 25 of the lens module 20 to prevent the photosensitive element 11 from being damaged by the static electricity. The connection between the conductive base 25 and the grounding member 15 can be implemented in the following various ways.

As shown in FIGS. 2 to 5 , in this embodiment, the camera device 1 includes a heat sink 30. The heat sink 30 can be made of a material with good electrical and thermal conductivity, such as metal or conductive polymer. The heat sink 30 is connected to the grounding member 15 of the circuit board 10, and the conductive base 25 is connected to the heat sink 30, so that the conductive base 25 is indirectly connected to the grounding member 15 of the circuit board 10 through the heat sink 30, so that the conductive base 25, the heat sink 30 and the grounding member 15 are electrically connected to each other. Thus, when electrostatic current is generated at the lens 21 of the lens module 20 (for example, the end of the lens 21 close to the opening 503), the electrostatic current can be sequentially transmitted to the grounding member 15 of the circuit board 10 through the conductive base 25 and the heat sink 30 (as shown by the transmission path of the dotted arrow in FIG. 4), so as to prevent the photosensitive element 11 from being damaged by the electrostatic effect. In addition, the heat generated by the operation of each electronic component on the circuit board 10 and the waste heat in the conductive base 25 can also be transmitted to the heat sink 30, so as to simultaneously achieve the improvement of the heat dissipation performance of the camera device 1.

As shown in FIGS. 2 to 5 , in this embodiment, the conductive base 25 is disposed on the front side 101 of the circuit board 10, the heat sink 30 is disposed on the back side 102 of the circuit board 10, and the grounding member 15 is located on the back side 102 of the circuit board 10 and contacts the heat sink 30. The circuit board 10 may have at least one through hole 103, wherein the number of through holes 103 is four and they are in the shape of long strips, and the plurality of through holes 103 are disposed at intervals and surround the photosensitive element 11. The conductive base 25 has at least one extension member 251, wherein the extension member 251 may be a plate, a block or a convex rib, the number of the extension members 251 may correspond to the number of the through holes 103, and each extension member 251 is disposed in the through hole 103 to directly or indirectly contact the heat sink 30 located on the back side 102. Thus, when electrostatic current is generated at the lens 21 of the lens module 20, the electrostatic current can be conducted to the grounding member 15 on the back side 102 of the circuit board 10, so that the static electricity is less likely to affect the photosensitive element 11 on the front side 101 of the circuit board 10. In addition, in this embodiment, the number of through holes 103 and extension members 251 is multiple and they are in the shape of long strips, which can increase the contact area between each extension member 251 and the heat sink 30 to improve the electrostatic conduction efficiency, but the invention is not limited thereto. In other embodiments, the through holes 103 and the extension members 251 can also be other shapes (such as round, square or irregular).

As shown in FIGS. 2 to 5 , the heat sink 30 may include a main board 31 and at least one extension arm 35. The main board 31 is spaced apart from the circuit board 10. The extension arm 35 connects the main board 31 and the grounding member 15 of the circuit board 10, so that the heat sink 30 is electrically connected to the grounding member 15. In this embodiment, there are four extension arms 35, which are integrally connected to the periphery of the main board 31 (here, the four extension arms 35 are integrally connected to the four corners of the main board 31), and at least one of the plurality of extension arms 35 contacts the grounding member 15 of the circuit board 10 (as shown in FIG. 5 ). Thereby, when electrostatic current is generated at the lens 21 of the lens module 20, the electrostatic current can be guided to the extension arm 35 around the heat sink 30, so that the electrostatic current is further away from the photosensitive element 11, thereby ensuring that the photosensitive element 11 is not affected by static electricity.

As shown in FIGS. 2 to 5 , the imaging device 1 may include at least one conductive elastic body 42, wherein the conductive elastic body 42 may be an elastic body having properties of conductivity, high thermal conductivity, and elasticity. For example, the conductive elastic body 42 may be an elastic body made of an elastic material with a high thermal conductivity coefficient (e.g., a thermal conductivity coefficient greater than 1 W/mK), and the conductive elastic body 42 may contain a conductive filler (e.g., carbon black, metal powder, or graphite, etc.). The number of the conductive elastic bodies 42 may correspond to the number of the extension pieces 251 of the conductive base 25. For example, in the present embodiment, the number of the conductive elastic bodies 42 is four, and each conductive elastic body 42 is disposed between each extension piece 251 of the conductive base 25 and the main board 31 of the heat sink 30 (as shown in FIG. 4 ), so that each extension piece 251 of the conductive base 25 is indirectly in contact with the heat sink 30 via each conductive elastic body 42. In this way, the conductive base 25 can also be electrically connected to the heat sink 30, and when an assembly tolerance occurs between the conductive base 25 and the heat sink 30, each conductive elastic body 42 can continue to contact the conductive base 25 and the heat sink 30 based on its elastic characteristics, thereby maintaining a good conductive effect.

As shown in FIGS. 2 to 5 , the camera device 1 may include a heat conductor 40 , for example, the heat conductor 40 may be a metal part (e.g., a plate or block made of materials such as iron, aluminum or steel), or the heat conductor 40 may also be an elastic part made of an elastic material with a high thermal conductivity (e.g., a thermal conductivity greater than 1 W/mK). The heat conductor 40 may contact the back surface 102 of the circuit board 10 and the main board 31 of the heat sink 30 , so that the heat generated by the circuit board 10 during operation can be further transferred to the heat sink 30 via the heat conductor 40 , so as to enhance the heat dissipation performance of the camera device 1 .

As shown in FIG. 2 to FIG. 5 , in this embodiment, the position of the heat conductive element 40 corresponds to the position of the photosensitive element 11, so that the heat generated by the photosensitive element 11 during operation can be immediately transferred to the heat sink 30 through the heat conductive element 40 to prevent the photosensitive element 11 from overheating and affecting the quality of the captured image.

FIG6 is a partially exploded perspective view of the second embodiment of the creative photography device. As shown in FIG6, the difference between the present embodiment and the first embodiment is at least that the photosensitive element 11 of the present embodiment has a first side 111 and a second side 112 opposite to each other and a third side 113 and a fourth side 114 opposite to each other, and the first side 111 and the second side 112 respectively have at least one electrical connection portion 115, wherein the electrical connection portion 115 can be connected to the circuit on the circuit board 10 via a wire, so that the photosensitive element 11 can transmit signals. The number of through holes 103 of the circuit board 10 is two, and the two through holes 103 are respectively adjacent to the third side 113 and the fourth side 114 of the photosensitive element 11. The number of extension pieces 251 of the conductive base 25 is two, and the two extension pieces 251 are respectively penetrated in the two through holes 103 to contact the heat sink 30. Thus, in this embodiment, the two through holes 103 are respectively adjacent to the third side 113 and the fourth side 114 of the photosensitive element 11 without the electrical connection portion 115, so that the circuit on the circuit board 10 and the electrical connection portion 115 of the photosensitive element 11 will not be blocked by the through holes 103, and the wiring is easier to be arranged.

FIG7 is a partially exploded perspective view of the third embodiment of the creative photography device, and FIG8 is a cross-sectional view of the third embodiment of the creative photography device. The difference between the present embodiment and the first embodiment is at least that the grounding member 15 of the circuit board 10 of the present embodiment is arranged on the front surface 101 of the circuit board 10, and the conductive base 25 of the lens module 20 directly contacts the grounding member 15 of the circuit board 10, so that the conductive base 25 and the grounding member 15 are connected to each other. Thereby, when an electrostatic current is generated at the lens 21 of the lens module 20, the electrostatic current can be directly transmitted to the grounding member 15 of the circuit board 10 through the conductive base 25. Compared to the first embodiment, the circuit board 10 of the present embodiment does not need to be provided with a through hole 103, and the conductive base 25 does not need to be provided with an extension piece 251 passing through the through hole 103 to contact the heat sink 30.

FIG9 is a cross-sectional view of the fourth embodiment of the creative camera device. As shown in FIG9 , the difference between the present embodiment and the first embodiment is at least that the conductive base 25 of the present embodiment is indirectly connected to the grounding member 15 of the circuit board 10 via the fixing member 41. For example, the fixing member 41 can be a conductive fixing member made of a conductive material. The grounding member 15 of the circuit board 10 is arranged on the back side 102 of the circuit board 10 and adjacent to each assembly hole 104. Each fixing member 41 is assembled to each assembly portion 252 of the conductive base 25 and each assembly hole 104 of the circuit board 10, and each fixing member 41 contacts the grounding member 15 of the circuit board 10, so that the conductive base 25 is indirectly connected to the grounding member 15 of the circuit board 10 via the fixing member 41, so that the conductive base 25 and the grounding member 15 are electrically connected to each other. Thus, when electrostatic current is generated at the lens 21 of the lens module 20, the electrostatic current can be transmitted to the grounding member 15 of the circuit board 10 via the conductive base 25 and the fixing members 41. Compared with the first embodiment, the circuit board 10 of this embodiment does not need to be provided with a through hole 103, and the conductive base 25 does not need to be provided with an extension member 251 passing through the through hole 103 to contact the heat sink 30.

FIG10 is a cross-sectional view of the fifth embodiment of the creative camera device. As shown in FIG10 , the difference between the present embodiment and the first embodiment described above is at least that the conductive base 25 of the present embodiment is connected to the heat sink 30 via a fixing member 41. For example, the fixing member 41 may be a conductive fixing member made of a conductive material. Thus, when an electrostatic current is generated at the lens 21 of the lens module 20, the electrostatic current may be sequentially transmitted through the conductive base 25, each fixing member 41 and the heat sink 30 to the grounding member 15 of the circuit board 10. Compared to the first embodiment described above, the circuit board 10 of the present embodiment does not need to be additionally provided with a through hole 103, and the conductive base 25 does not need to be additionally provided with an extension member 251 passing through the through hole 103 to contact the heat sink 30. In addition, in this embodiment, the fixing member 41 is further assembled to the heat sink 30, so that the fixing member 41 is not only used to guide the electrostatic current, but also can fix the circuit board 10, the conductive base 25 and the heat sink 30 to each other.

FIG11 is a perspective view of another embodiment of the conductive base of the creative camera device, and FIG12 is a cross-sectional view of the sixth embodiment of the creative camera device. As shown in FIG11 and FIG12, the difference between the present embodiment and the first embodiment at least lies in the structure of the conductive base 25. Specifically, the lens 21 of the present embodiment has a first end 211 and a second end 212 opposite to each other, the first end 211 is assembled to the conductive base 25, and the second end 212 is adjacent to the opening 503 of the housing 50. The conductive base 25a of this embodiment further has an extension plate 26, which is an annular plate and surrounds the lens 21, and has an extension end 261. The extension end 261 of the extension plate 26 is adjacent to the second end 212 of the lens 21 and the opening 503 of the housing 50. Thus, when the second end 212 of the lens 21 generates electrostatic current, the electrostatic current can be transmitted to the grounding member 15 of the circuit board 10 more quickly through the extension plate 26, so as to improve the electrostatic conduction efficiency and prevent the photosensitive element 11 from being damaged by the electrostatic effect.

Fig. 13 is a perspective view of another embodiment of the conductive base of the creative camera device. The difference between this embodiment and the embodiment of Fig. 11 is at least that the conductive base 25b of this embodiment has a plurality of extension plates 26, and the plurality of extension plates 26 are arranged at intervals and can surround the lens 21 (such as shown in Fig. 12).

FIG14 is a perspective view of another embodiment of the conductive base of the creative camera device. As shown in FIG14, in this embodiment, the extension plate 26 of the conductive base 25c is a ring-shaped plate. The difference between this embodiment and the embodiment of FIG11 is at least that the surface of the extension plate 26 of this embodiment has a plurality of heat dissipation fins 262. Thus, in addition to improving the electrostatic conduction efficiency, the heat dissipation fins 262 on the extension plate 26 of the conductive base 25c can further improve the heat dissipation performance of the camera device 1.

Although the technical content of this creation has been disclosed as above in the form of a preferred embodiment, it is not intended to limit this creation. Any slight changes and modifications made by anyone familiar with this art without departing from the spirit of this creation should be included in the scope of this creation. Therefore, the scope of protection of this creation shall be based on the scope defined in the attached patent application.

1: Camera device 10: Circuit board 101: Front 102: Back 103: Through hole 104: Assembly hole 11: Photosensitive element 111: First side 112: Second side 113: Third side 114: Fourth side 115: Electrical connection part 15: Grounding part 20: Lens module 21: Lens 211: First end 212: Second end 25,25a,25b,25c: Conductive base 251: Extension part 252: Assembly part 26: Extension plate 261: Extension end 262: Heat sink fin 30: Heat sink 31: Main board 35: Extension arm 40: Heat conducting part 41: Fixing member 42: Conductive elastic body 50: Outer shell 501: First shell plate 502: Second shell plate 503: Opening

Figure 1 is a stereoscopic diagram of the first embodiment of the creative photographic device. Figure 2 is a disassembled stereoscopic diagram of the first embodiment of the creative photographic device. Figure 3 is a partially disassembled stereoscopic diagram of the first embodiment of the creative photographic device. Figure 4 is a cross-sectional view along the line 4-4 of Figure 1. Figure 5 is a cross-sectional view along the line 5-5 of Figure 1. Figure 6 is a partially disassembled stereoscopic diagram of the second embodiment of the creative photographic device. Figure 7 is a partially disassembled stereoscopic diagram of the third embodiment of the creative photographic device. Figure 8 is a cross-sectional view of the third embodiment of the creative photographic device. Figure 9 is a cross-sectional view of the fourth embodiment of the creative photographic device. Figure 10 is a cross-sectional view of the fifth embodiment of the creative photographic device. FIG. 11 is a three-dimensional diagram of another embodiment of the conductive base of the creative photographic device. FIG. 12 is a cross-sectional view of the sixth embodiment of the creative photographic device. FIG. 13 is a three-dimensional diagram of another embodiment of the conductive base of the creative photographic device. FIG. 14 is a three-dimensional diagram of another embodiment of the conductive base of the creative photographic device.

10: Circuit board

101: Front

102: Back

103:Through hole

104: Assembly hole

11: Photosensitive element

20: Lens module

21: Lens

25: Conductive base

251: Extension piece

252: Assembly and connection section

30: Heat sink

31: Motherboard

35: Extension arm

40: Heat conducting parts

41:Fixers

50: Shell

501: First shell plate

502: Second shell plate

503: Open mouth

Claims (16)

A camera device includes: a circuit board including a photosensitive element and a grounding element; and a lens module including a lens and a conductive base, wherein the conductive base is disposed on the circuit board, the conductive base is directly or indirectly connected to the grounding element, the lens is disposed on the conductive base, and the position of the lens corresponds to the position of the photosensitive element. The imaging device as described in claim 1 further includes a heat sink connected to the grounding member of the circuit board, and the conductive base contacts the heat sink. The imaging device as described in claim 2, wherein the circuit board has a front side and a back side, the conductive base is disposed on the front side, and the heat sink is disposed on the back side. The imaging device as described in claim 2, wherein the circuit board has a through hole, and the conductive base has an extension piece, which passes through the through hole and contacts the heat sink. The camera device as described in claim 4 further includes a conductive elastic body, which is arranged between the extension piece and the heat sink. A camera device as described in claim 2, wherein the photosensitive element has a first side and a second side opposite to each other and a third side and a fourth side opposite to each other, the first side and the second side respectively having an electrical connection portion; the circuit board has two through holes, the two through holes are respectively adjacent to the third side and the fourth side, the conductive base has two extension pieces, the two extension pieces are respectively inserted into the two through holes and contact the heat sink. The imaging device as described in claim 2, wherein the heat sink includes a main board and an extension arm, the main board is spaced apart from the circuit board, and the extension arm is connected to the main board and the grounding member of the circuit board. The imaging device as described in claim 7 further includes a heat conductive element which contacts the main board of the circuit board and the heat sink. An imaging device as described in claim 8, wherein the position of the heat conductor corresponds to the position of the photosensitive element. The imaging device as described in claim 2, wherein the circuit board has an assembly hole, the conductive base has an assembly portion, the assembly hole and the assembly portion are assembled with a conductive fixing member, and the conductive fixing member contacts the heat sink. The imaging device as described in claim 10, wherein the conductive fixing member is further assembled to the heat sink. The imaging device as described in claim 1, wherein the circuit board has an assembly hole, the conductive base has an assembly portion, the assembly hole and the assembly portion are assembled with a conductive fixing member, and the conductive fixing member is connected to the grounding member of the circuit board. A camera device as described in claim 1, wherein the lens has a first end and a second end opposite to each other, the first end is assembled to the conductive base, the conductive base has an extension plate, the extension plate has an extension end, and the extension end is adjacent to the second end of the lens. A camera device as described in claim 13, wherein the extension plate is an annular plate and surrounds the lens. A camera device as described in claim 13, wherein the number of the extension plates is multiple, and the extension plates are arranged at intervals from each other and surround the lens. A camera device as described in claim 13, wherein the surface of the extension plate further has a plurality of heat dissipation fins.

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