TWM662131U - Transport box - Google Patents

Abstract

A transport box is suitable for at least one wafer box and includes: a first box body, including a bottom wall and a bottom outer wall extending upward from the periphery of the bottom wall, the bottom wall and the bottom outer wall together define a bottom chamber suitable for accommodating the wafer box therein, the bottom wall has a first supporting layer and a first buffer layer below the first supporting layer, wherein the material of the first buffer layer is an elastic material different from the material of the first supporting layer. By arranging the first buffer layer with elastic characteristics below the first supporting layer, the impact force from the bottom of the first box can be absorbed by the first buffer layer, and the first supporting layer provides support force for the first buffer layer, thereby achieving the effect of taking into account both buffering and structural stability.

Description

Transport box

The invention relates to a transport box, in particular to a transport box for accommodating and transporting wafer boxes.

Since wafers are high-value and fragile items, they must be transported with extreme caution to avoid damage to the wafers due to vibration or collision during transportation.

The wafer is transported by placing the wafer into a wafer box, and then placing the wafer box into a transport box, which is used to position and protect the wafer box. The general transport box is made of styrofoam. Although styrofoam helps to cushion the impact, its protective effect on reducing the impact from the bottom of the box still needs to be strengthened. In addition, since the wafer box in the transport box is usually taken by a robot, the transport box must have sufficient support and will not collapse downwards, so that the robot can stably take the wafer box. Therefore, how to improve the cushioning effect of the wafer box transport box and maintain the structural stability of the transport box has become an issue worth discussing.

Therefore, the purpose of the present invention is to provide a transport box that can take into account both the cushioning effect and the structural stability.

Therefore, the novel transport box is suitable for at least one wafer box and includes a first box body.

The first box body includes a bottom wall and a bottom outer wall extending upward from the periphery of the bottom wall. The bottom wall and the bottom outer wall together define a bottom chamber suitable for accommodating the wafer box. The bottom wall has a first supporting layer and a first buffer layer below the first supporting layer, wherein the material of the first buffer layer is an elastic material different from the material of the first supporting layer.

In some embodiments of the novel transport box, the material of the first supporting layer is styrofoam, and the material of the first buffer layer is foamed polyethylene.

In some embodiments of the novel transport box, it is suitable for multiple wafer boxes, wherein the first box body further includes a first inner wall structure extending upward from the bottom wall and dividing the bottom chamber into multiple bottom grid spaces, and the bottom grid spaces are respectively suitable for accommodating the wafer boxes therein.

In some embodiments of the novel transport box, it also includes at least one second box located above the first box, wherein the bottom chamber of the first box is suitable for accommodating the bottom of the wafer box; the second box includes a partition and a lower outer wall extending downward from the periphery of the partition and surrounding it, the partition and the lower outer wall together define a lower chamber suitable for accommodating the top of the wafer box, the partition has a second supporting layer and a second buffer layer located below the second supporting layer, and the material of the second buffer layer is an elastic material different from the material of the second supporting layer.

In some embodiments of the novel transport box, the material of the second supporting layer is styrofoam, and the material of the second buffer layer is foamed polyethylene.

In some embodiments of the novel transport box, it is suitable for at least two wafer boxes, wherein the bottom chamber and the lower chamber are respectively suitable for accommodating the bottom and top of one of the wafer boxes; the second box body also includes an upper outer wall extending upward from the periphery of the partition and surrounding the partition, the partition and the upper outer wall jointly define an upper chamber, and the upper chamber is suitable for accommodating the bottom of another wafer box.

In some embodiments of the novel transport box, the partition of the second box body further has another second supporting layer, and the second buffer layer is located in the middle of the second supporting layers.

In some embodiments of the novel transport box, it is suitable for multiple wafer boxes and includes several second boxes, wherein the second boxes are located above the first box and arranged up and down, the lower side chambers of the second boxes are respectively suitable for accommodating the tops of the wafer boxes, and the upper side chambers of the second boxes and the bottom chamber of the first box are respectively suitable for accommodating the bottoms of the wafer boxes.

In some embodiments of the novel transport box, it is suitable for multiple wafer boxes, wherein the first box body also includes a first inner wall structure extending upward from the bottom wall and dividing the bottom chamber into a plurality of bottom grid spaces, and the bottom grid spaces and the upper chamber are respectively suitable for accommodating the bottoms of the wafer boxes therein; each second box body also includes a lower inner wall structure extending downward from the partition and dividing the lower chamber into a plurality of lower grid spaces, and the lower grid spaces of the second box body located at the bottom are respectively aligned with the bottom grid spaces, and are respectively suitable for accommodating the tops of the corresponding wafer boxes therein.

In some embodiments of the novel transport box, each of the second boxes further includes an upper inner wall structure extending upward from the partition and dividing the upper containing chamber into a plurality of upper grid-like spaces. In two adjacent second boxes, the upper grid-like spaces of the second box located below and the lower grid-like spaces of the second box located above are respectively aligned with each other, and the upper grid-like spaces of the second boxes and the bottom grid-like spaces of the first box are respectively suitable for accommodating the bottoms of the wafer boxes.

In some embodiments of the novel transport box, the thickness ratio of the first buffer layer of the bottom wall to the bottom wall is between 15% and 80%.

In some embodiments of the novel transport box, the thickness ratio of the second buffer layer of the partition relative to the partition is between 15% and 80%.

The effect of the present invention is that the bottom wall of the first box has the first buffer layer arranged below the first supporting layer, and the first buffer layer is made of an elastic material different from that of the first supporting layer, so that the impact force from the bottom of the first box can be absorbed by the first buffer layer, and the first supporting layer provides support for the first buffer layer, thereby achieving the effect of taking into account both buffering and structural stability, thereby improving the protection of the first box to the wafer boxes accommodated therein. Furthermore, through the provision of the second boxes, the new transport box can carry and protect more wafer boxes, and the partitions of each of the second boxes have the second supporting layer, and the material of the second buffer layer is an elastic material different from that of the second supporting layer, so the second buffer layer can absorb impact force, thereby enhancing the protection of the second boxes to the wafer boxes contained therein.

1 , 2 and 3 , which are an embodiment of the novel transport box. The transport box is suitable for positioning a plurality of wafer boxes 9 . The transport box includes a first box body 1 , a second box body 2 , and an upper cover 3 .

The first box body 1 includes a bottom wall 11, a bottom outer wall 12 extending upward from the periphery of the bottom wall 11, and a first inner wall structure 13 extending upward from the bottom wall 11. The bottom wall 11 and the bottom outer wall 12 together define a bottom chamber 14 suitable for accommodating the bottom of the wafer box 9, and the first inner wall structure 13 divides the bottom chamber 14 into a plurality of bottom grid spaces 141 suitable for accommodating several (six examples are used here) of the wafer boxes 9. Specifically, the bottom grid spaces 141 are suitable for accommodating the bottoms of the corresponding wafer boxes 9.

Referring to FIG. 4 , the bottom wall 11 has a first supporting layer 111 and a first buffer layer 112 below the first supporting layer 111, wherein the material of the first buffer layer 112 is an elastic material different from the material of the first supporting layer 111. The first supporting layer 111 can provide support force to the first buffer layer 112. The first buffer layer 112 is disposed below the first supporting layer 111, and the impact force from the bottom of the first box body 1 can be absorbed by the first buffer layer 112. Preferably, the material of the first supporting layer 111 is styrofoam, and the material of the first buffer layer 112 is foamed polyethylene. Since the material of foamed polyethylene is softer and more elastic than styrofoam, the first buffer layer 112 can effectively increase the buffering capacity of the first box 1, especially can reduce the impact force generated at the bottom of the first box 1 by external force collision.

Referring to FIG. 2 , in this embodiment, the bottom wall 11 of the first box body 1 is rectangular, the first inner wall structure 13 is located in the bottom chamber 14, and has a first partition wall portion 131 extending along the long side direction of the bottom wall 11, and two second partition wall portions 132 extending along the short side direction of the bottom wall 11 and penetrating the first partition wall portion 131. The second partition wall portions 132 are arranged and spaced apart in the long side direction of the bottom wall 11. The first partition wall portion 131 and the two second partition wall portions 132 divide the bottom chamber 14 into six bottom grid spaces 141, but the implementation of the first inner wall structure 13 is not limited thereto.

1, 2 and 3, the second box body 2 is located above the first box body 1 and includes a partition 21, a lower outer wall 22 extending downward from and surrounding the periphery of the partition 21, an upper outer wall 23 extending upward from and surrounding the periphery of the partition 21, a lower inner wall structure 24 extending downward from the partition 21, and an upper inner wall structure 25 extending upward from the partition 21. The partition 21 and the lower outer wall 22 jointly define a lower side chamber 26, and the lower side inner wall structure 24 divides the lower side chamber 26 into a plurality of lower side grid spaces 261, and the lower side grid spaces 261 are respectively aligned with the bottom grid spaces 141 of the first box body 1, and the lower side grid spaces 261 cooperate with the bottom grid spaces 141 of the first box body 1 and are respectively suitable for accommodating the tops of the corresponding wafer boxes 9 therein. The partition plate 21 and the upper outer wall 23 together define an upper chamber 27. The upper inner wall structure 25 divides the upper chamber 27 into a plurality of upper grid-like spaces 271. The upper grid-like spaces 271 are respectively suitable for accommodating the bottoms of other wafer boxes 9 therein.

Referring to FIG. 4 , the partition 21 is placed above the corresponding wafer boxes 9 and has a second supporting layer 211 and a second buffer layer 212 below the second supporting layer 211. The material of the second buffer layer 212 is an elastic material different from the material of the second supporting layer 211. The second supporting layer 211 can provide support force to the second buffer layer 212. The second buffer layer 212 is arranged below the second supporting layer 211 so that the impact force from the outside can be absorbed by the second buffer layer 212. Preferably, the material of the second supporting layer 211 is styrofoam, and the material of the second buffer layer 212 is foamed polyethylene.

Referring to Figures 2 and 3, in this embodiment, the partition 21 of the second box body 2 is rectangular, the lower inner wall structure 24 is located in the lower chamber 26, and has a third partition wall portion 241 extending along the long side direction of the partition 21, and two fourth partition wall portions 242 extending along the short side direction of the partition 21 and penetrating the third partition wall portion 241, and the fourth partition wall portions 242 are arranged in the long side direction of the partition 21 and spaced apart. The upper inner wall structure 25 is located in the upper chamber 27 and has a fifth partition wall portion 251 extending along the long side direction of the partition 21, and two sixth partition wall portions 252 extending along the short side direction of the partition 21 and penetrating the fifth partition wall portion 251, and the sixth partition wall portions 252 are arranged and spaced apart in the long side direction of the partition 21. The third partition wall portion 241 and the two fourth partition wall portions 242 divide the lower chamber 26 into six lower grid-like spaces 261, and the fifth partition wall portion 251 and the two sixth partition wall portions 252 divide the upper chamber 27 into six upper grid-like spaces 271, but the implementation of the lower inner wall structure 24 and the upper inner wall structure 25 is not limited thereto.

The upper cover 3 includes a cover body 31 and an upper cover outer wall 32 extending downward from the periphery of the cover body 31 and surrounding the upper cover 3. The upper cover 3 cooperates with the upper side chamber 27 of the second box body 2 and is suitable for accommodating the tops of the corresponding wafer boxes 9 therein to achieve a protective function for the tops of the wafer boxes 9.

Referring to FIG. 4 , preferably, the thickness ratio of the first buffer layer 112 of the bottom wall 11 to the bottom wall 11 is between 15% and 80%. In the present embodiment, the thickness ratio of the first buffer layer 112 of the bottom wall 11 to the bottom wall 11 is 20%. Thus, when the buffering capacity of the first box 1 is increased by providing the first buffer layer 112, the structural stability of the first box 1 can still be maintained to prevent the first box 1 from collapsing downwards, without the need to additionally adjust the parameters used by the robot arm to take the wafer boxes 9 contained therein.

The second buffer layer 212 of the second box body 2 can effectively increase the buffering capacity of the second box body 2. Preferably, the thickness ratio of the second buffer layer 212 of the partition 21 to the partition 21 is between 15% and 80%, and in the present embodiment, the thickness ratio of the second buffer layer 212 of the partition 21 to the partition 21 is 20%. The reason is the same as the reason for the first buffer layer 112 of the first box body 1 mentioned above, so it will not be repeated.

Referring to FIG. 5 , another embodiment of the novel transport box is shown. In this embodiment, the partition 21 of the second box body 2 further has another second supporting layer 211, and the second buffer layer 212 is located in the middle of the second supporting layers 211. The second supporting layers 211 can provide upper and lower side support for the second buffer layer 212.

In other embodiments not shown in the figures, the novel transport box includes a plurality of the second boxes 2, wherein the second boxes 2 are located above the first box 1 and arranged up and down, the lower grid-shaped spaces 261 of the lower chambers 26 of the second boxes 2 are respectively suitable for accommodating the tops of the wafer boxes 9, and the upper grid-shaped spaces 271 and the bottom grid-shaped spaces 141 of the upper chambers 27 of the second boxes 2 are respectively suitable for accommodating the bottoms of the wafer boxes 9. In two adjacent second boxes 2, the upper grid-shaped spaces 271 of the lower second box 2 and the lower grid-shaped spaces 261 of the upper second box 2 are respectively aligned with each other.

It is to be noted that the outer surfaces of the bottom outer wall 12 of the first box body 1 and the upper outer wall 23 and the lower outer wall 22 of the second box body 2 are respectively provided with one or more protrusions or grooves (not shown) to strengthen the structure.

In summary, the bottom wall 11 of the first box 1 has the first buffer layer 112 disposed below the first supporting layer 111, and the first buffer layer 112 is made of an elastic material different from that of the first supporting layer 111, so that the impact force from the bottom of the first box 1 can be absorbed by the first buffer layer 112, and the first supporting layer 111 provides supporting force for the first buffer layer 112, thereby achieving the effect of taking into account both buffering and structural stability, thereby enhancing the protection of the first box 1 to the wafer boxes 9 accommodated therein. Furthermore, through the provision of the second boxes 2, the new transport box can carry and protect more of the wafer boxes 9, and the partitions 21 of each of the second boxes 2 have the second supporting layer 211, and the material of the second buffer layer 212 is an elastic material different from the material of the second supporting layer 211, so the second buffer layer 212 can absorb the impact force, thereby enhancing the protection of the second boxes 2 to the wafer boxes 9 accommodated therein, so that the purpose of the new model can be achieved.

However, the above is only an example of the implementation of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. All simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still within the scope of the present patent.

1: First box 11: Bottom wall 111: First support layer 112: First buffer layer 12: Bottom outer wall 13: First inner wall structure 131: First partition wall 132: Second partition wall 14: Bottom chamber 141: Bottom grid space 2: Second box 21: Partition 211: Second support layer 212: Second buffer layer 22: Lower outer wall 23: Upper outer wall 24: Lower inner wall structure 241: Third partition wall 242: Fourth partition wall 25: Upper inner wall structure 251: Fifth partition wall 252: Sixth partition wall 26: Lower chamber 261: Lower grid space 27: Upper chamber 271: Upper grid space 3: Upper cover 31: Cover body 32: Upper cover outer wall 9: Wafer box

Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, wherein: FIG. 1 is a three-dimensional diagram illustrating an embodiment of the present invention transport box used for positioning multiple wafer boxes; FIG. 2 is a three-dimensional exploded diagram of the embodiment; FIG. 3 is a three-dimensional exploded diagram of the embodiment from an oblique downward angle; FIG. 4 is a side cross-sectional view of the embodiment; and FIG. 5 is a side cross-sectional view illustrating an embodiment of a second box of another embodiment of the embodiment.

1: First box

11: Bottom wall

111: The first supporting layer

112: First buffer layer

12: Bottom outer wall

13: First inner wall structure

131: First partition wall section

132: Second partition wall

14: Bottom level storage room

141: Bottom grid space

2: Second box

21: Partition

211: The second supporting layer

212: Second buffer layer

22: Lower outer wall

23: Upper outer wall

25: Upper inner wall structure

251: Fifth partition wall

252: Sixth partition wall section

27: Upper accommodation room

271: Upper grid space

3: Upper cover

31: Cover

32: Upper cover outer wall

Claims (12)

A transport box is suitable for at least one wafer box and comprises: A first box body, including a bottom wall and a bottom outer wall extending upward from the periphery of the bottom wall and surrounding it, the bottom wall and the bottom outer wall together define a bottom chamber suitable for accommodating the wafer box therein, the bottom wall has a first supporting layer and a first buffer layer below the first supporting layer, wherein the material of the first buffer layer is an elastic material different from the material of the first supporting layer. The transport box as described in claim 1, wherein the material of the first supporting layer is styrofoam, and the material of the first buffer layer is foamed polyethylene. The transport box as described in claim 1 is suitable for multiple wafer boxes, wherein the first box body also includes a first inner wall structure extending upward from the bottom wall and dividing the bottom container into a plurality of bottom grid spaces, and the bottom grid spaces are respectively suitable for accommodating the wafer boxes therein. The transport box as described in claim 1 further includes at least one second box located above the first box, wherein the bottom chamber of the first box is suitable for accommodating the bottom of the wafer box; the second box includes a partition and a lower outer wall extending downward from the periphery of the partition and surrounding it, the partition and the lower outer wall together define a lower chamber suitable for accommodating the top of the wafer box, the partition has a second supporting layer and a second buffer layer located below the second supporting layer, and the material of the second buffer layer is an elastic material different from the material of the second supporting layer. A transport box as described in claim 4, wherein the material of the second supporting layer is styrofoam, and the material of the second buffer layer is foamed polyethylene. The transport box as described in claim 4 is suitable for at least two wafer boxes, wherein the bottom chamber and the lower chamber are respectively suitable for accommodating the bottom and top of one of the wafer boxes; the second box body also includes an upper outer wall extending upward from the periphery of the partition and surrounding the partition, the partition and the upper outer wall jointly define an upper chamber, and the upper chamber is suitable for accommodating the bottom of another wafer box. A transport box as described in any one of claims 4 to 6, wherein the partition of the second box body also has another second supporting layer, and the second buffer layer is located in the middle of the second supporting layers. The transport box as described in claim 6 is suitable for multiple wafer boxes and includes a plurality of second boxes, wherein the second boxes are located above the first box and arranged up and down, the lower side chambers of the second boxes are respectively suitable for accommodating the tops of the wafer boxes, and the upper side chambers of the second boxes and the bottom chamber of the first box are respectively suitable for accommodating the bottoms of the wafer boxes. The transport box as described in claim 8 is suitable for multiple wafer boxes, wherein the first box body also includes a first inner wall structure extending upward from the bottom wall and dividing the bottom chamber into a plurality of bottom grid spaces, and the bottom grid spaces and the upper chamber are respectively suitable for accommodating the bottoms of the wafer boxes therein; each second box body also includes a lower inner wall structure extending downward from the partition and dividing the lower chamber into a plurality of lower grid spaces, and the lower grid spaces of the second box body located at the bottom are respectively aligned with the bottom grid spaces, and are respectively suitable for accommodating the tops of the corresponding wafer boxes therein. A transport box as described in claim 9, wherein each of the second boxes further includes an upper inner wall structure extending upward from the partition and dividing the upper containing chamber into a plurality of upper grid-like spaces, and in two adjacent second boxes, the upper grid-like spaces of the second box located below and the lower grid-like spaces of the second box located above are respectively aligned with each other, and the upper grid-like spaces of the second boxes and the bottom grid-like spaces of the first box are respectively suitable for accommodating the bottoms of the wafer boxes therein. In the transport box as described in claim 1, 2 or 3, the thickness ratio of the first buffer layer of the bottom wall relative to the bottom wall is between 15% and 80%. In the transport box as described in claim 4, 5 or 6, the thickness ratio of the second buffer layer of the partition relative to the partition is between 15% and 80%.

Images