TWM526683U - Automatic inspection device - Google Patents
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Description
本創作提出一種自動檢測裝置,特別是一種適用於檢測光傳接模組的自動檢測裝置。The present invention proposes an automatic detecting device, in particular an automatic detecting device suitable for detecting an optical transmission module.
在目前通訊科技之傳輸方面上,將電訊號或光訊號透過纜線作為訊號傳輸媒介之有線傳輸仍較無線傳輸更為穩定。於其中,又以光訊號傳輸方式最為快速。因此,隨著時光推演,通訊科技所採用之傳輸媒介已從用以傳輸電訊號一般電纜線演進至用以傳輸光訊號之光纖(Fiber Optics)。此外,由於光纖具有高頻寬、保密性佳以及不受電磁干擾等優點,故自問世以來已被廣泛鋪設且應用於網路佈線之主幹上,以期能達到光纖到戶(Fiber To The Home,FTTH)之目標。In terms of the transmission of communication technology, the transmission of telecommunication or optical signals through the cable as a signal transmission medium is still more stable than wireless transmission. Among them, the optical signal transmission method is the fastest. Therefore, with the time derivation, the transmission medium used by communication technology has evolved from a general cable used to transmit electrical signals to a fiber optic (Fiber Optics) for transmitting optical signals. In addition, due to its high frequency, good confidentiality and immunity to electromagnetic interference, the fiber has been widely deployed and applied to the backbone of network cabling since its inception, in order to achieve Fiber To The Home (FTTH). The goal.
在光纖通訊之網路中,光傳接模組通常扮演著不可或缺之重要角色。光傳接模組一般又可稱為光纖介面收發器,用以透過內部之光電轉換模組進行電訊號與光訊號間的相互轉換,來使得各款電子裝置可透過光纖通訊之網路相互通訊。因此,光傳接模組本身之轉換品質良否將影響其是否可正確地進行電訊號與光訊號間的相互轉換,且進而影響整個光纖通訊系統之穩定性。In the network of optical fiber communication, optical transmission modules usually play an indispensable role. The optical transmission module is generally also referred to as a fiber optic interface transceiver for inter-switching between the electrical signal and the optical signal through the internal photoelectric conversion module, so that the electronic devices can communicate with each other through the optical fiber communication network. . Therefore, the quality of the optical transmission module itself will affect whether it can correctly convert the electrical signal and the optical signal, and thus affect the stability of the entire optical fiber communication system.
有鑑於此,提供一種自動檢測裝置,用以檢測光傳接模組。其中,光傳接模組包含光傳輸口,且用以依據光傳輸口所接收之測試光訊號產生對應之輸出電訊號。本創作一實施例之自動檢測裝置包含電光轉換模組、光纖連接器、測試座、誤碼測試器、進料區、出料區、第一移載機構、第二移載機構以及控制模組。進料區用以放置未檢測的光傳接模組,且出料區則用以放置已檢測的光傳接模組。其中,出料區包含良品區與不良品區。電光轉換模組用以依據脈衝訊號產生對應之測試光訊號。光纖連接器包含光纖接頭,且用以傳輸測試光訊號。測試座用以依據輸出電訊號產生檢測訊號。誤碼測試器用以產生所述之脈衝訊號,且用以根據檢測訊號產生誤碼率。第一移載機構用以搬運光傳接模組,且第二移載機構用以攜載光纖連接器。控制模組用以控制第一移載機構將位於進料區之光傳接模組移至測試座,且控制第二移載機構將光纖連接器之光纖接頭插入光傳接模組之光傳輸口中,並致動誤碼測試器。於一預定時間後,控制模組更控制第二移載機構將光纖連接器之光纖接頭自光傳接模組之光傳輸口中拔出,且依據誤碼率控制第一移載機構將完成檢測之光傳接模組自測試座搬運至良品區或不良品區。In view of this, an automatic detecting device for detecting a light transmitting module is provided. The optical transmission module includes an optical transmission port, and is configured to generate a corresponding output electrical signal according to the test optical signal received by the optical transmission port. The automatic detecting device of an embodiment of the present invention comprises an electro-optical conversion module, an optical fiber connector, a test socket, an error code tester, a feeding area, a discharge area, a first transfer mechanism, a second transfer mechanism, and a control module. . The feeding area is for placing the undetected optical transmission module, and the discharging area is for placing the detected optical transmission module. Among them, the discharge area includes a good area and a defective area. The electro-optical conversion module is configured to generate a corresponding test optical signal according to the pulse signal. The fiber optic connector includes a fiber optic connector and is used to transmit test optical signals. The test socket is used to generate a detection signal according to the output electrical signal. The error tester is configured to generate the pulse signal and generate a bit error rate according to the detection signal. The first transfer mechanism is used to carry the optical transmission module, and the second transfer mechanism is used to carry the optical fiber connector. The control module is configured to control the first transfer mechanism to move the optical transmission module located in the feeding area to the test socket, and control the second transfer mechanism to insert the optical fiber connector of the optical fiber connector into the optical transmission module for optical transmission In the mouth, and activate the error tester. After a predetermined time, the control module further controls the second transfer mechanism to pull out the optical fiber connector of the optical fiber connector from the optical transmission port of the optical transmission module, and the first transfer mechanism is controlled according to the error rate. The light transmission module is transported from the test seat to the good product area or the defective product area.
綜上所述,根據本創作一實施例之自動檢測裝置,利用移載機構來搬運光傳接模組以及插拔光纖連接器,而無需仰賴人工進行作業,藉以自動化光傳接模組之檢測作業,並提高整體檢測之精準度與效率。In summary, according to the automatic detecting device of the embodiment of the present invention, the optical transfer module is used to carry the optical transmission module and the optical fiber connector is inserted and removed without relying on manual operation, thereby detecting the automatic optical transmission module. Work and improve the accuracy and efficiency of the overall inspection.
以下在實施方式中詳細敘述本創作之詳細特徵以及優點,其內容足以使任何熟習相關技藝者瞭解本創作之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本創作相關之目的及優點。The detailed features and advantages of the present invention are described in detail below in the embodiments, which are sufficient to enable any skilled artisan to understand the technical contents of the present invention and implement it according to the contents, the scope of the patent application and the drawings. Anyone familiar with the relevant art can easily understand the purpose and advantages of this creation.
請參閱圖1至圖3,本創作一實施例提供一種適用於檢測光傳接模組200的自動檢測裝置100。一般而言,光傳接模組200是整合光發送器(Transmitter)與光接收器(Receiver)兩大功能所形成之單一光訊號收發模組,且可用以進行電訊號與光訊號之間的相互轉換,以使各款式之電子裝置可透過光纖通訊網路相互連線。Referring to FIG. 1 to FIG. 3 , an embodiment of the present invention provides an automatic detecting apparatus 100 suitable for detecting the optical transmission module 200 . In general, the optical transmission module 200 is a single optical signal transceiver module formed by integrating two functions of a Transmitter and a Receiver, and can be used to perform between a telecommunication signal and an optical signal. Mutual conversion so that electronic devices of various models can be connected to each other through a fiber optic communication network.
在本實施例中,光傳接模組200可包含光傳輸口210、電傳輸口220與光電轉換單元230。其中,光傳輸口210可用以與後述之光纖連接器120的光纖接頭121相接,以傳輸光訊號。電傳輸口220可用以與電子裝置之訊號發射端或接收端相接,以傳輸電訊號。光電轉換單元230耦接至光傳輸口210與電傳輸口220,且可用以將光傳輸口210所接收之光訊號轉換成對應之電訊號後,再將電訊號從電傳輸口220輸出,或將電傳輸口220所接收之電訊號轉換成對應之光訊號後,再將光訊號從光傳輸口210輸出。In this embodiment, the optical transmission module 200 can include an optical transmission port 210, an electrical transmission port 220, and a photoelectric conversion unit 230. The optical transmission port 210 can be connected to the optical fiber connector 121 of the optical fiber connector 120 to be described later to transmit optical signals. The electrical transmission port 220 can be used to interface with the signal transmitting end or the receiving end of the electronic device to transmit the electrical signal. The photoelectric conversion unit 230 is coupled to the optical transmission port 210 and the electrical transmission port 220, and can be used to convert the optical signal received by the optical transmission port 210 into a corresponding electrical signal, and then output the electrical signal from the electrical transmission port 220, or After converting the electrical signal received by the electrical transmission port 220 into a corresponding optical signal, the optical signal is output from the optical transmission port 210.
在一些實施態樣中,光傳接模組200可為小封裝熱插拔收發器(Small Form-FactorPluggable,SFP)。但本創作並非以此為限,光傳接模組200亦可為增強型小封裝熱插拔收發器(Enhanced Small Form-FactorPluggable,SFP+)、四通道小封裝熱插拔收發器(Quad Small Form-FactorPluggable,QSFP)或萬兆小封裝熱插拔收發器(10 Gigabit Small Form-FactorPluggable,XFP)等或其他客製化規格之光學界面收發器。此外,光傳接模組200之光傳輸口210的規格可對應於光纖連接器120之光纖接頭121的規格,例如:FC、SC、ST或LC等。In some implementations, the optical transmission module 200 can be a Small Form-Factor Pluggable (SFP). However, the present invention is not limited thereto. The optical transmission module 200 can also be an Enhanced Small Form-Factor Pluggable (SFP+), a four-channel small package hot-swappable transceiver (Quad Small Form). -FactorPluggable, QSFP) or 10 Gigabit Small Form-Factor Pluggable (XFP) or other custom-made optical interface transceivers. In addition, the specification of the optical transmission port 210 of the optical transmission module 200 may correspond to the specification of the optical fiber connector 121 of the optical fiber connector 120, for example, FC, SC, ST, or LC.
本創作一實施例之自動檢測裝置100可包含進料區A1、出料區A2、電光轉換模組110、光纖連接器120、測試座130、誤碼測試器140、至少二移載機構(以下,分別稱之為第一移載機構150與第二移載機構160)以及控制模組300。其中,電光轉換模組110耦接至光纖連接器120,誤碼測試器140耦接至電光轉換模組110與測試座130,且控制模組300耦接至測試座130、誤碼測試器140、第一移載機構150以及第二移載機構160。於此,第一移載機構150用以搬運光傳接模組200,且第二移載機構160用以攜載光纖連接器120。The automatic detecting device 100 of an embodiment of the present invention may include a feeding area A1, a discharging area A2, an electro-optical conversion module 110, an optical fiber connector 120, a test socket 130, an error tester 140, and at least two transfer mechanisms (below They are referred to as a first transfer mechanism 150 and a second transfer mechanism 160, respectively, and a control module 300. The electro-optic conversion module 110 is coupled to the optical fiber connector 120. The error tester 140 is coupled to the electro-optical conversion module 110 and the test socket 130. The control module 300 is coupled to the test socket 130 and the error tester 140. The first transfer mechanism 150 and the second transfer mechanism 160. The first transfer mechanism 150 is used to carry the optical transmission module 200 , and the second transfer mechanism 160 is used to carry the optical fiber connector 120 .
進料區A1用以放置尚未檢測過的光傳接模組200,且出料區A2用以放置已完成檢測的光傳接模組200。其中,出料區A2包含良品區A21與不良品區A22。於此,良品區A21用以放置其檢測結果為正常的光傳接模組200,而不良品區A22則用以放置其檢測結果為異常的光傳接模組200。The feeding area A1 is used to place the optical transmission module 200 that has not been detected, and the discharging area A2 is used to place the optical transmission module 200 that has completed the detection. The discharge area A2 includes a good area A21 and a defective area A22. Here, the good product area A21 is used to place the optical transmission module 200 whose detection result is normal, and the defective product area A22 is used to place the optical transmission module 200 whose detection result is abnormal.
在本實施例中,誤碼測試器(Bit Error Rate Tester,BERT)140可用以產生脈衝訊號S1;電光轉換模組110可用以將脈衝訊號S1轉換成對應之測試光訊號S2;光纖連接器120可用以傳輸測試光訊號S2;光傳接模組200可用以依據光傳輸口210所接收之測試光訊號S2經由電傳輸口220產生對應之輸出電訊號S3;測試座130可用以依據輸出電訊號S3產生檢測訊號S4;且誤碼測試器140更可用以根據檢測訊號S4產生誤碼率(Bit Error Rate,BER)R1,藉以完成對光傳接模組200中之光接收部分的檢測。In this embodiment, a bit error rate tester (BERT) 140 can be used to generate the pulse signal S1; the electro-optical conversion module 110 can be used to convert the pulse signal S1 into a corresponding test optical signal S2; the fiber optic connector 120 The test optical signal S2 can be used to transmit the corresponding output electrical signal S3 via the electrical transmission port 220 according to the test optical signal S2 received by the optical transmission port 210; the test socket 130 can be used according to the output electrical signal. S3 generates a detection signal S4; and the error tester 140 is further configured to generate a bit error rate (BER) R1 according to the detection signal S4, thereby completing detection of the light receiving portion in the optical transmission module 200.
換言之,於進行光傳接模組200之光接收部分的檢測程序中,自動檢測裝置100的控制模組300可先控制第一移載機構150將位於進料區A1之光傳接模組200移至測試座130,然後控制第二移載機構160將光纖連接器120之光纖接頭121插入至位於測試座130之光傳接模組200的光傳輸口210中後,再致動誤碼測試器140以開始檢測。之後,待一預定時間過後,控制模組300再控制第二移載機構160將光纖連接器120之光纖接頭121從光傳接模組200的光傳輸口210中拔出,然後再根據誤碼測試器140所得之誤碼率R1來控制第一移載機構150將此完成檢測的光傳接模組200自測試座130搬運至良品區A21或不良品區A22。In other words, in the detecting process of the light receiving portion of the optical transmission module 200, the control module 300 of the automatic detecting device 100 can first control the first transfer mechanism 150 to connect the optical transmission module 200 in the feeding area A1. Moving to the test socket 130, and then controlling the second transfer mechanism 160 to insert the optical fiber connector 121 of the optical fiber connector 120 into the optical transmission port 210 of the optical transmission module 200 of the test socket 130, and then actuating the error test. The device 140 starts the detection. Then, after a predetermined period of time, the control module 300 controls the second transfer mechanism 160 to remove the fiber connector 121 of the optical fiber connector 120 from the optical transmission port 210 of the optical transmission module 200, and then according to the error code. The error rate R1 obtained by the tester 140 controls the first transfer mechanism 150 to transport the optical transmission module 200 that has completed the detection from the test socket 130 to the good product area A21 or the defective product area A22.
在一些實施例中,控制模組300係根據所得之誤碼率R1計算出光傳接模組200的靈敏度(Sensitivity),然後再根據此靈敏度來評估光傳接模組200的效能,並根據評估之結果來搬運光傳接模組200至良品區A21或不良品區A22。In some embodiments, the control module 300 calculates the sensitivity (Sensitivity) of the optical transmission module 200 according to the obtained error rate R1, and then evaluates the performance of the optical transmission module 200 according to the sensitivity, and according to the evaluation. As a result, the optical transmission module 200 is transported to the good area A21 or the defective area A22.
此外,本創作一實施例之自動檢測裝置100更可包含通訊分析儀600,耦接至控制模組300與光纖連接器120,用以檢測光傳接模組200之光發送部分。於此,誤碼測試器140可用以產生脈衝訊號S1;光傳接模組200更可用以依據電傳輸口220所接收之脈衝訊號S1產生對應之輸出光訊號S5;光纖連接器120更可用以傳輸輸出光訊號S5;且通訊分析儀600可用以根據輸出光訊號S5產生分析訊號S6。In addition, the automatic detection device 100 of the embodiment of the present invention may further include a communication analyzer 600 coupled to the control module 300 and the optical fiber connector 120 for detecting the optical transmitting portion of the optical transmission module 200. In this case, the error tester 140 can be used to generate the pulse signal S1; the optical transmission module 200 can be further configured to generate a corresponding output optical signal S5 according to the pulse signal S1 received by the electrical transmission port 220; the optical fiber connector 120 can be further used to The output optical signal S5 is transmitted; and the communication analyzer 600 can be used to generate the analysis signal S6 according to the output optical signal S5.
換言之,於進行光傳接模組200之光發送部分的檢測程序中,自動檢測裝置100的控制模組300可先控制第一移載機構150將位於進料區A1之光傳接模組200移至測試座130,然後控制第二移載機構160將光纖連接器120之光纖接頭121插入至位於測試座140之光傳接模組200的光傳輸口210中後,再致動誤碼測試器140與通訊分析儀600以開始檢測。之後,待一預定時間過後,控制模組300再控制第二移載機構160將光纖連接器120之光纖接頭121從光傳接模組200的光傳輸口210中拔出,然後再根據通訊分析儀600所得之分析訊號S6來控制第一移載機構150將此完成檢測的光傳接模組200自測試座130搬運至良品區A21或不良品區A22。In other words, in the detecting process of the optical transmitting portion of the optical transmission module 200, the control module 300 of the automatic detecting device 100 can first control the first transfer mechanism 150 to connect the optical transmission module 200 located in the feeding area A1. Moving to the test socket 130, and then controlling the second transfer mechanism 160 to insert the optical fiber connector 121 of the optical fiber connector 120 into the optical transmission port 210 of the optical transmission module 200 of the test socket 140, and then actuating the error test. The device 140 communicates with the analyzer 600 to initiate detection. Then, after a predetermined period of time, the control module 300 controls the second transfer mechanism 160 to remove the fiber connector 121 of the optical fiber connector 120 from the optical transmission port 210 of the optical transmission module 200, and then analyzes according to the communication. The analysis signal S6 obtained by the meter 600 controls the first transfer mechanism 150 to transport the optical transmission module 200 that has completed the detection from the test socket 130 to the good product area A21 or the defective product area A22.
在一些實施態樣中,通訊分析儀600所產生之分析訊號S6可包含平均功率(Average Power)、消光率(Extinction Ratio)、抖動(Jitter)、上升時間(Rising Time)、下降時間(Falling Time)、眼圖遮罩測試(Eye Mask Test)及/或眼圖寬度(Eye Width)等數據。In some implementations, the analysis signal S6 generated by the communication analyzer 600 may include an Average Power, an Extinction Ratio, a Jitter, a Rising Time, and a Falling Time. ), eye mask test (Eye Mask Test) and / or eye width (Eye Width) and other data.
在本實施例中,自動檢測裝置100可先完成光傳接模組200之光接收部分的檢測程序後,再接續執行光傳接模組200之光發送部分的檢測程序。In this embodiment, the automatic detecting device 100 can complete the detecting process of the light transmitting portion of the optical transmission module 200 and then execute the detecting process of the light transmitting portion of the optical transmitting module 200.
因此,自動檢測裝置100的控制模組300是先控制第一移載機構150將位於進料區A1之光傳接模組200移至測試座130,然後控制第二移載機構160將光纖連接器120之光纖接頭121插入至位於測試座130之光傳接模組200的光傳輸口210中後,再致動誤碼測試器140以開始光接收部分的檢測。待一預定時間過後,控制模組300再致動通訊分析儀600以開始光發送部分的檢測。之後,待經過另一預定時間後,控制模組300再控制第二移載機構160將光纖連接器120之光纖接頭121從光傳接模組200的光傳輸口210中拔出,然後再根據誤碼測試器140所得之誤碼率R1以及根據通訊分析儀600所得之分析訊號S6來控制第一移載機構150將此完成所有檢測的光傳接模組200自測試座130搬運至良品區A21或不良品區A22。然而,本創作並非以此為限,自動檢測裝置100亦可先完成光傳接模組200之光發送部分的檢測程序後,再接續執行光傳接模組200之光接收部分的檢測程序。Therefore, the control module 300 of the automatic detecting device 100 first controls the first transfer mechanism 150 to move the optical transmission module 200 located in the feeding area A1 to the test socket 130, and then controls the second transfer mechanism 160 to connect the optical fibers. After the optical fiber connector 121 of the device 120 is inserted into the optical transmission port 210 of the optical transmission module 200 of the test socket 130, the error tester 140 is activated to start the detection of the light receiving portion. After a predetermined time has elapsed, the control module 300 reactivates the communication analyzer 600 to initiate detection of the light transmitting portion. Then, after another predetermined time, the control module 300 controls the second transfer mechanism 160 to remove the optical fiber connector 121 of the optical fiber connector 120 from the optical transmission port 210 of the optical transmission module 200, and then according to The error rate R1 obtained by the error tester 140 and the analysis signal S6 obtained by the communication analyzer 600 control the first transfer mechanism 150 to carry all the detected optical transmission modules 200 from the test stand 130 to the good product area. A21 or defective product area A22. However, the present invention is not limited thereto, and the automatic detecting device 100 may first complete the detecting process of the light transmitting portion of the optical transmission module 200, and then execute the detecting process of the light receiving portion of the optical transmitting module 200.
本創作一實施例之自動檢測裝置100的詳細架構與詳細作動,茲分述如下。The detailed structure and detailed operation of the automatic detecting apparatus 100 of an embodiment of the present invention will be described below.
請參閱圖2至圖5,自動檢測裝置100之進料區A1可包含供料區A11、待取區A12與空盤堆放區A13。其中,供料區A11可供一個以上之進料盤410以垂直間格排列之方式堆放於此區。在一實施態樣中,進料盤410概呈矩形板體,且其上凹設有多個置料槽410c,分別用以容置光傳接模組200。於此,在供料區A11的每一進料盤410上可承載至少一個尚未檢測過之光傳接模組200,然而,本創作並非以此為限,位於此供料區A11的各進料盤410亦可滿載尚未檢測過之光傳接模組200。Referring to FIGS. 2 to 5, the feeding area A1 of the automatic detecting device 100 may include a feeding area A11, a waiting area A12, and an empty tray stacking area A13. Wherein, the feeding area A11 can be used for stacking more than one feeding tray 410 in a vertical compartment. In one embodiment, the feed tray 410 has a rectangular plate body, and a plurality of receiving slots 410c are recessed therein for receiving the optical transmission module 200. Here, at least one undetected optical transmission module 200 can be carried on each feeding tray 410 of the feeding area A11. However, the present invention is not limited thereto, and the feeding in the feeding area A11 is The tray 410 can also be loaded with the optical transmission module 200 that has not been detected.
待取區A12可用以放置至少一個從供料區A11移送至此區的進料盤410,且位於此待取區A12之進料盤410上的光傳接模組200將依序被第一移載機構150搬運至測試座130進行檢測。而空盤堆放區A13則可供一個以上已無承載任何光傳接模組200的進料盤410以垂直間格排列之方式堆放於此區。The waiting area A12 can be used to place at least one feeding tray 410 transferred from the feeding area A11 to the area, and the optical transmission module 200 located on the feeding tray 410 of the waiting area A12 will be firstly moved in order. The carrier mechanism 150 is transported to the test socket 130 for detection. The empty tray stacking area A13 can be used to stack more than one feeding tray 410 that has not carried any optical transmission module 200 in a vertical compartment.
在本實施例中,進料區A1更包含一支撐架510,橫置於供料區A11、待取區A12與空盤堆放區A13。其中,支撐架510於供料區A11與空盤堆放區A13分別設有四個支撐柱511,每一支撐柱511上分設有多個支撐件512。於此,且每一支撐柱511上之支撐件512係間格設置,以使各進料盤410可藉由位於同一高度之四個支撐件512而堆放於供料區A11或空盤堆放區A13。In this embodiment, the feeding area A1 further includes a supporting frame 510 which is horizontally disposed in the feeding area A11, the waiting area A12 and the empty tray stacking area A13. The support frame 510 is respectively provided with four support columns 511 in the supply area A11 and the empty disk stacking area A13, and each support column 511 is provided with a plurality of support members 512. Herein, the support members 512 on each support column 511 are arranged in such a manner that the feed trays 410 can be stacked in the supply area A11 or the empty tray stacking area by four support members 512 at the same height. A13.
自動檢測裝置100更可包含第三移載機構170,設於支撐架510之下方,以搬運位於進料區A1之進料盤410。於此,控制模組300耦接至第三移載機構170,以控制第三移載機構170從供料區A11將承載有尚未檢測過之光傳接模組200的進料盤410移送至待取區A12來等待進入檢測程序。之後,待位於此待取區A12之進料盤410上之光傳接模組200已被第一移載機構150移光而並無承載任何光傳接模組200(空載)時,控制模組300再控制第三移載機構170將此空載的進料盤410移送至空盤堆放區A13堆放,並且控制第三移載機構170重新至供料區A11搬運另一個進料盤410至待取區A12,以接續進行檢測程序。The automatic detecting device 100 further includes a third transfer mechanism 170 disposed under the support frame 510 to carry the feeding tray 410 located in the feeding area A1. Here, the control module 300 is coupled to the third transfer mechanism 170 to control the third transfer mechanism 170 to transfer the feed tray 410 carrying the undetected optical transmission module 200 from the supply area A11 to The area to be taken A12 is waiting to enter the detection procedure. Then, when the optical transmission module 200 on the feeding tray 410 of the waiting area A12 has been moved by the first transfer mechanism 150 without carrying any optical transmission module 200 (no load), the control is performed. The module 300 then controls the third transfer mechanism 170 to transfer the empty feed tray 410 to the empty tray stacking area A13 for stacking, and controls the third transfer mechanism 170 to re-feed the feeding tray A11 to the other feeding tray 410. Go to the area to be taken A12 to continue the test procedure.
在本實施例中,如圖4所示,第三移載機構170可包含橫向滑軌組件171、承載板172、二升降組件173、二抵持組件174以及驅動電路(圖未示)。其中,二升降組件173以及二抵持組件174分別設置於供料區A11與空盤堆放區A13。橫向滑軌組件171耦接承載板172,二升降組件173分別耦接對應之抵持組件174,且驅動電路耦接橫向滑軌組件171、升降組件173以及控制模組300。於此,驅動電路可根據控制模組300所輸出之控制訊號驅動橫向滑軌組件171及/或升降組件173進行相應的作動。In this embodiment, as shown in FIG. 4, the third transfer mechanism 170 can include a lateral rail assembly 171, a carrier plate 172, two lifting assemblies 173, two resisting assemblies 174, and a drive circuit (not shown). The two lifting assemblies 173 and the two abutting assemblies 174 are respectively disposed in the feeding area A11 and the empty tray stacking area A13. The lateral rail assembly 171 is coupled to the carrier plate 172. The two lifting assemblies 173 are respectively coupled to the corresponding abutting members 174, and the driving circuit is coupled to the lateral rail assembly 171, the lifting assembly 173, and the control module 300. In this case, the driving circuit can drive the horizontal rail assembly 171 and/or the lifting assembly 173 according to the control signal outputted by the control module 300 to perform corresponding operations.
承載板172可用以承載進料盤410且設置於橫向滑軌組件171上,以藉由橫向滑軌組件171之作動而可帶動進料盤410於供料區A11、待取區A12與空盤堆放區A13之間移動。於此,承載板172概呈矩形板體,且在平行於其移動方向之相對二側邊上分別凹設一凹口,以使抵持組件174可經由此凹口抵持位於承載板172上的進料盤410,並藉由升降組件173之作動而可帶動進料盤410於垂直方向上移動,如圖5所示。The carrying plate 172 can be used to carry the feeding tray 410 and is disposed on the lateral rail assembly 171 to drive the feeding tray 410 in the feeding area A11, the waiting area A12 and the empty tray by the action of the horizontal sliding rail assembly 171. Move between the stacking areas A13. The carrier plate 172 has a rectangular plate body, and a recess is recessed on opposite sides of the opposite side of the moving direction, so that the resisting component 174 can be placed on the carrier plate 172 via the notch. The feeding tray 410, and by the action of the lifting assembly 173, can drive the feeding tray 410 to move in the vertical direction, as shown in FIG.
因此,控制模組300可先控制驅動電路驅動橫向滑軌組件171來帶動承載板172移位至供料區A11,然後控制驅動電路驅動位於供料區A11之升降組件173來帶動抵持組件174經由承載板172之凹口向上升直至可抵持到進料盤410後,再控制供料區A11中目前支撐住此進料盤410的四個支撐件512自第一狀態(可支撐進料盤410)變更至第二狀態(不支撐進料盤410),以使此進料盤410可改由抵持組件174來抵持。之後,控制模組300控制驅動電路驅動升降組件173來帶動抵持組件174經由承載板172之凹口向下移動直至抵持組件174所抵持的進料盤410可放置於承載板172上後,再控制驅動電路驅動橫向滑軌組件171來帶動承載板172移位至待取區A12。Therefore, the control module 300 can first control the driving circuit to drive the lateral rail assembly 171 to drive the carrier plate 172 to the feeding area A11, and then control the driving circuit to drive the lifting assembly 173 located in the feeding area A11 to drive the resisting assembly 174. After rising through the notch of the carrying plate 172 until it can be resisted to the feeding tray 410, the four supporting members 512 currently supporting the feeding tray 410 in the feeding area A11 are controlled from the first state (supportable feeding) The pan 410) is changed to the second state (the feed pan 410 is not supported) such that the feed pan 410 can be resisted by the resisting assembly 174. Thereafter, the control module 300 controls the driving circuit to drive the lifting assembly 173 to drive the resisting assembly 174 to move downward through the recess of the carrying plate 172 until the feeding tray 410 abutted by the resisting assembly 174 can be placed on the carrying plate 172. The control circuit further drives the lateral rail assembly 171 to drive the carrier plate 172 to be moved to the area A12 to be taken.
待位於待取區A12之進料盤410空載後,控制模組300可先控制驅動電路驅動橫向滑軌組件171來帶動承載板172移位至空盤堆放區A13,然後控制驅動電路驅動位於空盤堆放區A13之升降組件173來帶動抵持組件174經由承載板172之凹口向上升,以抵持位於承載板172上的進料盤410,並帶動進料盤410隨同向上,直至到達預定位置後,再控制空盤堆放區A13中位於此預定位置之高度的四個支撐件512自第二狀態(不支撐進料盤410)變更至第一狀態(可支撐進料盤410),以使此進料盤410可改由此四個支撐件512來抵持。之後,控制模組300可控制驅動電路驅動升降組件173來帶動抵持組件174經由承載板172之凹口向下移動至最低點後,便可再控制驅動電路驅動橫向滑軌組件171來帶動承載板172移位至待取區A12,以重複前述之動作來將位於供料區A11之所有進料盤410一一依序移位至待取區A12與空盤堆放區A13。After the feeding tray 410 of the waiting area A12 is unloaded, the control module 300 can first control the driving circuit to drive the horizontal rail assembly 171 to drive the carrying board 172 to the empty tray stacking area A13, and then control the driving circuit drive to be located. The lifting assembly 173 of the empty tray stacking area A13 drives the resisting assembly 174 to rise upward through the notch of the carrying plate 172 to abut the feeding tray 410 on the carrying plate 172, and drives the feeding tray 410 to follow up until reaching After the predetermined position, the four supports 512 at the height of the predetermined position in the empty tray stacking area A13 are controlled to change from the second state (not supporting the feeding tray 410) to the first state (the feeding tray 410 can be supported). So that the feed tray 410 can be resisted by the four supports 512. After that, the control module 300 can control the driving circuit to drive the lifting assembly 173 to drive the resisting assembly 174 to move to the lowest point via the recess of the carrying plate 172, and then control the driving circuit to drive the horizontal sliding rail assembly 171 to drive the bearing. The plate 172 is displaced to the area to be taken A12 to repeat the foregoing action to sequentially shift all the feed trays 410 located in the supply area A11 one by one to the area to be taken A12 and the area of the empty tray A13.
在一實施例中,進料區A1可設有第一偵測模組(圖未示),用以偵測供料區A11中是否還有進料盤410,且於未偵測到有進料盤410位於供料區A11時,可產生第一補充警示,以提示進行補充進料盤410之動作。此外,第一偵測模組更可用以偵測空盤堆放區A13中所堆放之進料盤410的數量是否已達一閾值,並於偵測到進料盤410的數量達到閾值時,產生警示訊號,以提示操作員。In an embodiment, the feeding area A1 may be provided with a first detecting module (not shown) for detecting whether there is a feeding tray 410 in the feeding area A11, and no progress is detected. When the tray 410 is located in the feeding area A11, a first supplementary warning may be generated to prompt the action of replenishing the feeding tray 410. In addition, the first detecting module is further configured to detect whether the number of the feeding trays 410 stacked in the empty tray stacking area A13 has reached a threshold value, and when detecting that the number of the feeding trays 410 reaches a threshold value, A warning signal to alert the operator.
自動檢測裝置100之良品區A21可包含良品空盤區A211、良品待置區A212與良品滿盤區A213。其中,良品空盤區A211可供一個以上之良品出料盤420以垂直間格排列之方式堆放於此區。在一實施態樣中,良品出料盤420概呈矩形板體,且其上凹設有多個置料槽,分別用以容置被檢測為良品之光傳接模組200。於此,在良品空盤區A211的每一良品出料盤420上並未承載任何光傳接模組200,而呈空載狀態。The good area A21 of the automatic detecting device 100 may include a good empty area A211, a good waiting area A212, and a good full area A213. Among them, the good empty area A211 can be stacked in the area in which the one or more good output trays 420 are arranged in a vertical compartment. In one embodiment, the good product discharge tray 420 has a rectangular plate body, and a plurality of receiving grooves are recessed therein for receiving the light transmission module 200 which is detected as a good product. Here, the optical transmission module 200 is not carried on each of the good output trays 420 of the good empty panel A211, but is in an empty state.
良品待置區A212可用以放置至少一個從良品空盤區A211移送至此區的良品出料盤420,以使被檢測為良品之光傳接模組200可依序放置在位於此區之良品出料盤420的置料槽中。而良品滿盤區A213則可供一個以上載滿光傳接模組200之良品出料盤420自良品待置區A212移送至此區堆放。於此,滿載之良品出料盤420係以垂直間格排列之方式堆放於此。The good waiting area A212 can be used to place at least one good product discharging tray 420 transferred from the good empty area A211 to the area, so that the light transmission module 200 detected as good can be sequentially placed in the good area in the area. In the receiving trough of the tray 420. The good full panel A213 can be transferred to the good stacking area A212 of the full light transmission module 200 from the good waiting area A212 to the area for stacking. Here, the fully loaded good output trays 420 are stacked here in a vertical grid arrangement.
在本實施例中,良品區A21更包含一支撐架520,橫置於良品空盤區A211、良品待置區A212與良品滿盤區A213。於此,支撐架520的架構與位在進料區A1之支撐架510的架構大致上相同,故不再贅述。In this embodiment, the good product area A21 further includes a support frame 520, which is placed across the good empty area A211, the good waiting area A212 and the good full area A213. Herein, the structure of the support frame 520 is substantially the same as the structure of the support frame 510 located in the feeding area A1, and therefore will not be described again.
自動檢測裝置100更可包含第四移載機構180,設於支撐架520之下方,以搬運位於良品區A21之良品出料盤420。於此,控制模組300耦接至第四移載機構180,以控制第四移載機構180將空載之良品出料盤420自良品空盤區A211移送至良品待置區A212來容置被檢測為良品的光傳接模組200。之後,待位於此良品待置區A212之良品出料盤420已載滿被檢測為良品的光傳接模組200而呈現滿載狀態時,控制模組300再控制第四移載機構180將此滿載的良品出料盤420移送至良品滿盤區A213堆放,並且控制第四移載機構180重新至良品空盤區A211搬運另一個良品出料盤420至良品待置區A212,以接續進行檢測程序。The automatic detecting device 100 further includes a fourth transfer mechanism 180 disposed under the support frame 520 to carry the good output tray 420 located in the good area A21. Here, the control module 300 is coupled to the fourth transfer mechanism 180 to control the fourth transfer mechanism 180 to transfer the empty good output tray 420 from the good empty tray A211 to the good waiting area A212. The optical transmission module 200 is detected as a good product. Then, when the good product discharge tray 420 located in the good product waiting area A212 is full of the optical transmission module 200 detected as good, and the full load state is present, the control module 300 controls the fourth transfer mechanism 180 to control the The fully loaded good product discharge tray 420 is transferred to the good full tray area A213 for stacking, and the fourth transfer mechanism 180 is controlled to return to the good empty area A211 to transport another good product discharge tray 420 to the good product waiting area A212 for subsequent detection. program.
在本實施例中,第四移載機構180之架構與第三移載機構170大致上相同,故於此不再贅述。In this embodiment, the structure of the fourth transfer mechanism 180 is substantially the same as that of the third transfer mechanism 170, and thus will not be described herein.
在一實施例中,良品區A21可設有第二偵測模組(圖未示),用以偵測良品空盤區A211中是否還有良品出料盤420,且於未偵測到有良品出料盤420位於良品空盤區A211時,可產生第二補充警示,以提示進行補充良品出料盤420之動作。此外,第二偵測模組更可用以偵測良品滿盤區A213中所堆放之良品出料盤420的數量是否已達一閾值,並於偵測到良品出料盤420的數量達到閾值時,產生警示訊號以提示操作員。In an embodiment, the good product area A21 can be provided with a second detecting module (not shown) for detecting whether there is a good product discharging tray 420 in the good empty area A211, and no detection is detected. When the good product discharge tray 420 is located in the good empty area A211, a second supplementary warning may be generated to prompt the action of replenishing the good output tray 420. In addition, the second detecting module is further configured to detect whether the number of good product discharging trays 420 stacked in the good full panel A213 has reached a threshold value, and when the number of good product discharging trays 420 reaches a threshold value is detected. , generate a warning signal to alert the operator.
自動檢測裝置100之不良品區A22可包含不良品空盤區A221、不良品待置區A222與不良品滿盤區A223。其中,不良品空盤區A221可供一個以上之不良品出料盤430以垂直間格排列之方式堆放於此區。在一實施態樣中,不良品出料盤430概呈矩形板體,且其上凹設有多個置料槽,分別用以容置被檢測為不良品之光傳接模組200。於此,在不良品空盤區A221的每一不良品出料盤430上並未承載任何光傳接模組200,而呈空載狀態。The defective product area A22 of the automatic detecting device 100 may include a defective product empty area A221, a defective product waiting area A222, and a defective product full area A223. Among them, the defective product empty panel A221 can be stacked in this area by one or more defective product discharge trays 430 arranged in a vertical compartment. In one embodiment, the defective product discharge tray 430 has a rectangular plate body, and is provided with a plurality of receiving grooves for receiving the light transmission module 200 that is detected as a defective product. Here, the optical transmission module 200 is not carried on each of the defective product discharge trays 430 of the defective product empty panel A221, but is in an idle state.
不良品待置區A222可用以放置至少一個從不良品空盤區A221移送至此區的不良品出料盤430,以使被檢測為不良品之光傳接模組200可依序放置在位於此區之不良品出料盤430的置料槽中。而不良品滿盤區A223則可供一個以上載滿光傳接模組200之不良品出料盤430自不良品待置區A222移送至此區堆放。於此,滿載之不良品出料盤430係以垂直間格排列之方式堆放於此。The defective product waiting area A222 can be used to place at least one defective product discharging tray 430 transferred from the defective product empty panel A221 to the defective material, so that the optical transmission module 200 detected as a defective product can be sequentially placed therein. The defective tank discharge tray 430 of the zone is in the receiving tank. The defective product full panel A223 can be transferred from the defective product waiting area A222 to the area where the defective product discharging tray 430 is loaded. Here, the fully loaded defective product discharge trays 430 are stacked thereon in a vertical grid arrangement.
在本實施例中,不良品區A22更包含一支撐架530,橫置於不良品空盤區A221、不良品待置區A222與不良品滿盤區A223。於此,支撐架530的架構與位在進料區A1之支撐架510、位在良品區A21之支撐架520的架構大致上相同,故不再贅述。In the embodiment, the defective product area A22 further includes a support frame 530 disposed transversely to the defective product empty panel area A221, the defective product waiting area A222, and the defective product full tray area A223. Herein, the structure of the support frame 530 is substantially the same as the structure of the support frame 510 located in the feed area A1 and the support frame 520 located in the good product area A21, and therefore will not be described again.
自動檢測裝置100更可包含第五移載機構190,設於支撐架530之下方,以搬運位於不良品區A22之不良品出料盤430。於此,控制模組300耦接至第五移載機構190,以控制第五移載機構190將空載之不良品出料盤430自不良品空盤區A221移送至不良品待置區A222來容置被檢測為不良品的光傳接模組200。之後,待位於此不良品待置區A222之不良品出料盤430已載滿被檢測為不良品的光傳接模組200而呈現滿載狀態時,控制模組300再控制第五移載機構190將此滿載的不良品出料盤430移送至不良品滿盤區A223堆放,並且控制第五移載機構190重新至不良品空盤區A221搬運另一個不良品出料盤430至不良品待置區A222,以接續進行檢測程序。The automatic detecting device 100 further includes a fifth transfer mechanism 190 disposed under the support frame 530 to transport the defective product discharge tray 430 located in the defective product area A22. The control module 300 is coupled to the fifth transfer mechanism 190 to control the fifth transfer mechanism 190 to transfer the empty defective product discharge tray 430 from the defective product empty tray A221 to the defective product waiting area A222. The optical transmission module 200 that is detected as a defective product is accommodated. Then, when the defective product discharge tray 430 located in the defective product waiting area A222 is full of the optical transmission module 200 detected as a defective product and is in a full load state, the control module 300 controls the fifth transfer mechanism again. 190, the fully loaded defective product discharge tray 430 is transferred to the defective product full tray A223, and the fifth transfer mechanism 190 is controlled to return to the defective empty tray A221 to transport another defective discharge tray 430 to the defective product. The area A222 is set to continue the detection process.
在本實施例中,第五移載機構190之架構與第四移載機構180、第三移載機構170之架構大致上相同,故於此不再贅述。In this embodiment, the structure of the fifth transfer mechanism 190 is substantially the same as that of the fourth transfer mechanism 180 and the third transfer mechanism 170, and thus will not be described herein.
在一實施例中,不良品區A22可設有第三偵測模組(圖未示),用以偵測不良品空盤區A221中是否還有不良品出料盤430,且於未偵測到有不良品出料盤430位於不良品空盤區A221時,可產生第三補充警示,以提示進行補充不良品出料盤430之動作。此外,第三偵測模組更可用以偵測不良品滿盤區A223中所堆放之不良品出料盤430的數量是否已達一閾值,並於偵測到不良品出料盤430的數量達到閾值時,產生警示訊號以提示操作員。In an embodiment, the defective product area A22 may be provided with a third detecting module (not shown) for detecting whether there is a defective product discharging tray 430 in the defective product empty area A221, and is not detected. When it is detected that the defective product discharge tray 430 is located in the defective product empty panel A221, a third supplementary warning may be generated to prompt the action of replenishing the defective product discharge tray 430. In addition, the third detecting module is further configured to detect whether the number of defective product discharge trays 430 stacked in the defective product panel A223 has reached a threshold value, and detects the number of defective product discharge trays 430. When the threshold is reached, a warning signal is generated to alert the operator.
因此,在自動檢測裝置100之檢測程序的初始步驟中,控制模組300可控制第三移載機構170將進料盤410自供料區A11移至待取區A12,且控制第四移載機構180將良品出料盤420自良品空盤區A211移至良品待置區A212,並控制第五移載機構190將不良品出料盤430自不良品空盤區A221移至不良品待置區A222。於此,第三移載機構170、第四移載機構180與第五移載機構190可同步作動,但本創作並非以此為限,第三移載機構170、第四移載機構180與第五移載機構190亦可依序分別作動。Therefore, in the initial step of the detecting process of the automatic detecting device 100, the control module 300 can control the third transfer mechanism 170 to move the feeding tray 410 from the feeding area A11 to the waiting area A12, and control the fourth transfer mechanism. 180 moves the good product discharge tray 420 from the good product empty tray area A211 to the good product waiting area A212, and controls the fifth transfer mechanism 190 to move the defective product discharge tray 430 from the defective product empty tray area A221 to the defective product waiting area. A222. Here, the third transfer mechanism 170, the fourth transfer mechanism 180, and the fifth transfer mechanism 190 can be operated in synchronization, but the present creation is not limited thereto, and the third transfer mechanism 170 and the fourth transfer mechanism 180 are The fifth transfer mechanism 190 can also be separately operated in sequence.
請參閱圖2、圖6與圖7。在本創作一實施例中,自動檢測裝置100更可包含預熱載台900,耦接至控制模組300。預熱載台900可用以預先加熱光傳接模組200至一預熱溫度,例如70℃,以加速檢測之流程。於此,預熱載台900之預熱溫度可由控制模組300設定。Please refer to Figure 2, Figure 6, and Figure 7. In an embodiment of the present invention, the automatic detecting device 100 further includes a preheating stage 900 coupled to the control module 300. The preheating stage 900 can be used to preheat the optical transfer module 200 to a preheating temperature, such as 70 ° C, to speed up the process of detection. Here, the preheating temperature of the preheating stage 900 can be set by the control module 300.
在本實施例中,預熱載台900包含一承載基座910與加熱槽920。其中,加熱槽920位於承載基座910上,且加熱槽920具有一出料端。於此,加熱槽920可凹設於承載基座910,且加熱槽920之一出料端係鄰接於承載基座910之一側邊。In the present embodiment, the preheating stage 900 includes a carrying base 910 and a heating tank 920. The heating tank 920 is located on the carrier base 910, and the heating tank 920 has a discharge end. Here, the heating tank 920 can be recessed on the bearing base 910, and one of the discharging ends of the heating tank 920 is adjacent to one side of the bearing base 910.
因此,第一移載機構150可先將尚未檢測之光傳接模組200自待取區A12移送至預熱載台900加熱至預熱溫度後,再移送至測試座130。其中,當光傳接模組200位於預熱載台900之加熱槽920時,其電傳輸口220係鄰近於加熱槽920之出料端,如圖7所示。Therefore, the first transfer mechanism 150 can transfer the undetected optical transmission module 200 from the waiting area A12 to the preheating stage 900 to be heated to the preheating temperature, and then transfer to the test socket 130. Wherein, when the optical transmission module 200 is located in the heating tank 920 of the preheating stage 900, the electrical transmission port 220 is adjacent to the discharging end of the heating tank 920, as shown in FIG.
在本實施例中,第一移載機構150可包含第一移載組件151與第二移載組件152。其中,第一移載組件151用以將位於待取區A12之光傳接模組200移送至預熱載台900之加熱槽920中,而第二移載組件則可用以將光傳接模組200自加熱槽920中移送至測試座130。In the present embodiment, the first transfer mechanism 150 can include a first transfer component 151 and a second transfer component 152. The first transfer component 151 is configured to transfer the optical transmission module 200 located in the area A12 to be moved to the heating slot 920 of the preheating stage 900, and the second transfer component can be used to transmit the optical transmission mode. Group 200 is transferred from heating tank 920 to test station 130.
第一移載組件151跨設於進料區A1與出料區A2之上。第一移載組件151可包含水平滑軌組件1511、升降組件1512、取置部1513以及驅動電路(圖未示)。其中,升降組件1512耦接取置部1513,以帶動取置部1513於垂直方向上移動;水平滑軌組件1511耦接升降組件1512,以帶動升降組件1512與取置部1513於水平方向上移動;且驅動電路耦接至水平滑軌組件1511、升降組件1512、取置部1513以及控制模組300,以根據控制模組300之控制訊號驅動水平滑軌組件1511、升降組件1512及/或取置部1513進行相應的作動。The first transfer component 151 is disposed across the feed zone A1 and the discharge zone A2. The first transfer component 151 can include a horizontal slide assembly 1511, a lift assembly 1512, a take-up portion 1513, and a drive circuit (not shown). The lifting assembly 1512 is coupled to the accommodating portion 1513 to move the accommodating portion 1513 in the vertical direction. The horizontal sliding frame assembly 1511 is coupled to the lifting assembly 1512 to drive the lifting assembly 1512 and the accommodating portion 1513 to move in the horizontal direction. The driving circuit is coupled to the horizontal rail assembly 1511, the lifting assembly 1512, the receiving portion 1513, and the control module 300 to drive the horizontal rail assembly 1511, the lifting assembly 1512, and/or the control signal according to the control signal of the control module 300. The portion 1513 performs the corresponding action.
於此,第一移載組件151之取置部1513可用以取放光傳接模組200。在一實施態樣中,第一移載組件151之取置部1513可為真空吸嘴,以透過真空吸力來取放光傳接模組200。The accessing portion 1513 of the first transfer component 151 can be used to access the optical transmission module 200. In one embodiment, the receiving portion 1513 of the first transfer component 151 can be a vacuum nozzle to take the light transmission and reception module 200 through vacuum suction.
因此,在檢測程序中,控制模組300可控制驅動電路驅動水平滑軌組件1511帶動取置部1513移動至待取之光傳接模組200的上方,然後控制驅動電路驅動升降組件1512帶動取置部1513向下移動直至取置部1513可取起光傳接模組200後再帶動取置部1513向上移動,如圖6所示。接續,控制模組300可控制驅動電路驅動水平滑軌組件1511帶動取置部1513移動至預熱載台900之加熱槽920的上方後,再控制驅動電路驅動升降組件1512帶動取置部1513向下移動以將光傳接模組200置入加熱槽920中,如圖7所示。Therefore, in the detecting process, the control module 300 can control the driving circuit to drive the horizontal sliding rail assembly 1511 to move the picking portion 1513 to the upper side of the optical transmission module 200 to be taken, and then control the driving circuit to drive the lifting assembly 1512 to drive The placing portion 1513 is moved downward until the accommodating portion 1513 can take up the optical transmission module 200 and then move the accommodating portion 1513 upward, as shown in FIG. In the continuation, the control module 300 can control the driving circuit to drive the horizontal rail assembly 1511 to move the picking portion 1513 to the upper portion of the heating tank 920 of the preheating station 900, and then control the driving circuit to drive the lifting assembly 1512 to drive the receiving portion 1513 to Move down to place the light transfer module 200 into the heating bath 920, as shown in FIG.
請參閱圖8與圖9。第二移載組件152耦接於預熱載台900。第二移載組件152可包含一橫向滑軌組件1521、縱向推移組件1522以及驅動電路(圖未示)。其中,橫向滑軌組件1521耦接於承載基座910,以帶動承載基座910橫向移動;縱向推移組件1522設置於承載基座910上且鄰近於加熱槽920,以將光傳接模組200自加熱槽920中推出;驅動電路耦接至橫向滑軌組件1521、縱向推移組件1522以及控制模組300,以根據控制模組300之控制訊號驅動橫向滑軌組件1521及/或縱向推移組件1522進行相應的作動。Please refer to Figure 8 and Figure 9. The second transfer component 152 is coupled to the preheating stage 900. The second transfer assembly 152 can include a lateral rail assembly 1521, a longitudinal shift assembly 1522, and a drive circuit (not shown). The lateral rail assembly 1521 is coupled to the carrier base 910 to drive the carrier base 910 to move laterally. The longitudinal displacement component 1522 is disposed on the carrier base 910 and adjacent to the heating slot 920 for the optical transmission module 200. The driving circuit is coupled to the lateral rail assembly 1521, the longitudinal shifting component 1522, and the control module 300 to drive the lateral rail assembly 1521 and/or the longitudinal shifting assembly 1522 according to the control signal of the control module 300. Perform the corresponding action.
因此,在檢測程序中,待預熱載台900將位於加熱槽920中之光傳接模組200加熱至預熱溫度時,如圖8所示,控制模組300可先控制驅動電路驅動橫向滑軌組件1521帶動預熱載台900移動至一第一插入位置後,再控制驅動電路驅動縱向推移組件1522,以將光傳接模組200自加熱槽920中推移至測試座130,如圖9所示。此外,待光傳接模組200被移至測試座130後,控制模組300可再控制驅動電路驅動橫向滑軌組件1521帶動預熱載台900回復至預設位置。Therefore, in the detecting procedure, when the preheating stage 900 heats the optical transmission module 200 located in the heating tank 920 to the preheating temperature, as shown in FIG. 8, the control module 300 can first control the driving circuit to drive the lateral direction. After the slide rail assembly 1521 moves the preheating stage 900 to a first insertion position, the control circuit drives the longitudinal shifting component 1522 to move the optical transmission module 200 from the heating slot 920 to the test socket 130. 9 is shown. In addition, after the optical transmission module 200 is moved to the test socket 130, the control module 300 can control the driving circuit to drive the lateral rail assembly 1521 to bring the preheating stage 900 back to the preset position.
在一實施例中,測試座130可包含承載基台131與測試電路板132。其中,測試電路板132可設置於承載基台131上。測試電路板132上可佈有多個電子零件與一測試槽1321。於此,測試槽1321具有一進出端,以供光傳接模組200可自此進出端進入或離開測試槽1321。此外,測試槽1321中可設有與光傳接模組200之電傳輸口220相匹配之接頭,藉以與光傳接模組200電性連接。In an embodiment, the test socket 130 can include a carrier base 131 and a test circuit board 132. The test circuit board 132 can be disposed on the carrier base 131. The test circuit board 132 can be provided with a plurality of electronic components and a test slot 1321. The test slot 1321 has an access end for the optical transmission module 200 to enter or leave the test slot 1321 from the access end. In addition, a connector matching the electrical transmission port 220 of the optical transmission module 200 may be disposed in the test slot 1321 to electrically connect to the optical transmission module 200.
此外,在一實施例中,測試座130更可包含溫控模組(圖未示),耦接至測試槽1321。於此,溫控模組可用以調控位於測試槽1321中之光傳接模組200至測試溫度,例如70℃。In addition, in an embodiment, the test socket 130 further includes a temperature control module (not shown) coupled to the test slot 1321. Here, the temperature control module can be used to regulate the optical transmission module 200 located in the test slot 1321 to a test temperature, for example, 70 ° C.
在一實施例中,自動檢測裝置100可包含一個以上之測試座130,例如二個,且各個測試座130之溫控模組可將位於其測試槽1321中之光傳接模組200調控至不同的或相同的測試溫度。In an embodiment, the automatic detection device 100 can include more than one test socket 130, for example, two, and the temperature control module of each test socket 130 can regulate the optical transmission module 200 located in the test slot 1321 to Different or the same test temperature.
於此,當橫向滑軌組件1521帶動預熱載台900移動至第一插入位置時,加熱載台900可鄰靠於測試座130,且其加熱槽920之出料端可對準於測試槽1321之進出端,以使縱向推移組件1522可將光傳接模組200自加熱槽920推移進測試槽1321中。在一實施態樣中,位於測試槽1321中之光傳接模組200,其光傳輸口210可裸露於測試槽1321外。Here, when the lateral rail assembly 1521 drives the preheating stage 900 to move to the first insertion position, the heating stage 900 can abut against the test socket 130, and the discharge end of the heating tank 920 can be aligned with the test slot. The entry and exit end of the 1321 is such that the longitudinal shifting assembly 1522 can move the optical transmission module 200 from the heating tank 920 into the test slot 1321. In one embodiment, the optical transmission module 200 located in the test slot 1321 can be exposed outside the test slot 1321.
請參閱圖10至圖14。接續,第二移載機構160可攜載光纖連接器120至第二插入位置,且將光纖連接器120與位於測試槽1321中之光傳接模組200相接合以進行檢測。Please refer to Figures 10 to 14. In succession, the second transfer mechanism 160 can carry the optical fiber connector 120 to the second insertion position, and engage the optical fiber connector 120 with the optical transmission module 200 located in the test slot 1321 for detection.
一般而言,光纖連接器120可用以於二光纖之間進行可拆卸連接的器件,以使其中一光纖所輸出之光訊號能最大限度地耦合到另一光纖。在本實施例中,光纖連接器120具有光纖接頭121,且可透過其光纖接頭121與光傳接模組200之光傳輸口210之接合來將電光轉換模組110所產生之測試光訊號S2傳輸至光傳接模組200。In general, the fiber optic connector 120 can be used to detachably connect devices between two fibers so that the optical signals output by one of the fibers can be coupled to the other fiber to the utmost. In this embodiment, the optical fiber connector 120 has a fiber optic connector 121, and the test optical signal S2 generated by the electro-optical conversion module 110 can be connected through the optical fiber connector 121 and the optical transmission port 210 of the optical transmission module 200. Transfer to the optical transmission module 200.
在本實施例中,光纖連接器120之光纖接頭121包含支撐套管1211與光纖1212。其中,光纖1212係可替換的,且可固定於支撐套管1211中。於此,光纖1212可穿出此支撐套管1211而裸露出一小段之端部。此外,光纖連接器120之光纖接頭121的規格可對應於光傳接模組200之光傳輸口210的規格,例如:FC、SC、ST或LC等。In the present embodiment, the fiber optic connector 121 of the fiber optic connector 120 includes a support sleeve 1211 and an optical fiber 1212. The optical fiber 1212 is replaceable and can be fixed in the support sleeve 1211. Here, the optical fiber 1212 can pass through the support sleeve 1211 to expose a short end portion. In addition, the specification of the optical fiber connector 121 of the optical fiber connector 120 may correspond to the specification of the optical transmission port 210 of the optical transmission module 200, for example, FC, SC, ST, or LC.
由於光纖連接器120之光纖接頭121上(即,光纖1212之端部面)可能殘存有細微髒汙,例如灰塵,而可能影像到光傳接模組200之檢測結果的正確性。因此,在本實施例中,自動檢測裝置100更可包含光纖清潔組710與攝像組720分別耦接至控制模組300。其中,光纖清潔組710可用以清潔光纖連接器120之光纖接頭121,且攝像組720可用以擷取光纖接頭121之影像,以使控制模組300可根據攝像組720所擷取之影像確認光纖接頭121是否已清潔乾淨。Since the fiber connector 121 of the fiber connector 120 (ie, the end face of the fiber 1212) may have fine dirt, such as dust, the detection result of the image to the light transmission module 200 may be correct. Therefore, in the embodiment, the automatic detecting device 100 further includes a fiber cleaning group 710 and a camera group 720 coupled to the control module 300 respectively. The fiber cleaning group 710 can be used to clean the fiber connector 121 of the fiber connector 120, and the camera group 720 can be used to capture the image of the fiber connector 121, so that the control module 300 can confirm the fiber according to the image captured by the camera group 720. Whether the connector 121 is clean.
在一實施例中,光纖清潔組710可包含殼體711、光纖清潔帶捲(圖未示)、輸出輪組(圖未示)與單向輸送輪組(圖未示)。其中,殼體711包含容置室(圖未示)、收納室(圖未示)與清潔口711c,且清潔口711c開設於殼體711之一側;光纖清潔帶捲係長條狀之光纖清潔帶捲繞而成,且可繞設於輸出輪組上,而與輸出輪組可旋轉地裝設於殼體711之收納室中;單向輸送輪組裝設於收納室中,且可用以夾持光纖清潔帶以將未使用之光纖清潔帶移送置清潔口711c,並將使用後之光纖清潔帶輸送至收納室中收納。In an embodiment, the fiber cleaning group 710 can include a housing 711, a fiber cleaning tape roll (not shown), an output wheel set (not shown), and a one-way transport wheel set (not shown). The housing 711 includes a housing chamber (not shown), a storage chamber (not shown) and a cleaning port 711c, and the cleaning port 711c is opened on one side of the housing 711; the optical fiber cleaning tape is wound with a long strip of optical fiber cleaning. The belt is wound and can be wound around the output wheel set, and is rotatably mounted in the storage chamber of the housing 711 with the output wheel set; the one-way conveying wheel is assembled in the storage chamber and can be used for clamping The optical fiber cleaning tape is used to transfer the unused optical fiber cleaning tape to the cleaning port 711c, and the used optical fiber cleaning tape is transported to the storage chamber for storage.
在一實施態樣中,光纖清潔組710更可包含一緩衝墊(圖未示)相對於清潔口711c而設置於殼體711中,且光纖清潔帶可由清潔口與緩衝墊之間通過,以使光纖連接器120之光纖接頭121於光纖清潔帶上擦拭時可有彈性緩衝之空間。In one embodiment, the fiber cleaning group 710 may further include a cushion (not shown) disposed in the housing 711 with respect to the cleaning port 711c, and the fiber cleaning tape may pass between the cleaning port and the cushion to When the fiber connector 121 of the fiber connector 120 is wiped on the fiber cleaning tape, there is room for elastic buffering.
此外,光纖清潔組710更包含遮板與操作組件712。其中,遮板上開設有一通孔,且通孔之大小大致上可相等於清潔口711c之大小。於此,遮板可活動地位於光纖清潔帶與清潔口711c之間,且可隨操作組件712之作動來啟閉清潔口711c。在一實施例中,操作組件712包含按壓部712a與推壓件712b。其中,按壓部712a設於殼體711之一側,且耦接至遮板;而推壓件712b設置於殼體711外,且耦接至控制模組300,以根據控制模組300之控制訊號作動。In addition, the fiber cleaning kit 710 further includes a shutter and operating assembly 712. A through hole is defined in the shutter, and the size of the through hole is substantially equal to the size of the cleaning port 711c. Here, the shutter is movably located between the optical fiber cleaning tape and the cleaning port 711c, and can be opened and closed with the operation component 712 to open and close the cleaning port 711c. In an embodiment, the operating assembly 712 includes a pressing portion 712a and a pusher 712b. The pressing portion 712a is disposed on one side of the housing 711 and coupled to the shielding plate. The pressing member 712b is disposed outside the housing 711 and coupled to the control module 300 for controlling according to the control module 300. The signal is activated.
於此,推壓件712b可根據控制模組300之控制訊號活動至一開啟位置與一關閉位置。當推壓件712b活動至開啟位置時,推壓件712b可推抵按壓部712a以帶動遮板移動,使得遮板之通孔可相對於清潔口711c而露出未使用之光纖清潔帶。而當推壓件712b活動至關閉位置時,推壓件712b可以一間距與按壓部712a相隔,且此時遮板之通孔與清潔口711c因錯位而關閉,藉以避免異物侵入殼體711內。The pusher 712b can be moved to an open position and a closed position according to the control signal of the control module 300. When the pressing member 712b is moved to the open position, the pressing member 712b can push against the pressing portion 712a to drive the shutter to move, so that the through hole of the shutter can expose the unused optical fiber cleaning belt with respect to the cleaning opening 711c. When the pressing member 712b is moved to the closed position, the pressing member 712b can be separated from the pressing portion 712a at a distance, and at this time, the through hole of the shutter and the cleaning opening 711c are closed due to the misalignment, so as to prevent foreign matter from intruding into the housing 711. .
在一些實施態中,攝像組720可為照相機、攝影機、或CCD(charge-coupled device)相機等。In some implementations, camera group 720 can be a camera, a video camera, or a CCD (charge-coupled device) camera or the like.
在一實施例中,第二移載機構160可包含水平滑軌組件161、縱向滑軌組件162、攜載部163以及驅動電路(圖未示)。其中,攜載部163可用以攜載光纖連接器120;水平滑軌組件161與縱向滑軌組件162耦接至攜載部163,且水平滑軌組件161與縱向滑軌組件162可偕同運作以帶動光纖連接器120進行移位;且驅動電路耦接至水平滑軌組件161、縱向滑軌組件162與控制模組300,以根據控制模組300之控制訊號驅動水平滑軌組件161及/或縱向滑軌組件162進行相應的作動。In an embodiment, the second transfer mechanism 160 can include a horizontal rail assembly 161, a longitudinal rail assembly 162, a carrier 163, and a drive circuit (not shown). The carrying portion 163 can be used to carry the fiber optic connector 120; the horizontal rail assembly 161 and the longitudinal rail assembly 162 are coupled to the carrying portion 163, and the horizontal rail assembly 161 and the longitudinal rail assembly 162 can operate together. The fiber optic connector 120 is driven to be displaced; and the driving circuit is coupled to the horizontal rail assembly 161, the longitudinal rail assembly 162 and the control module 300 to drive the horizontal rail assembly 161 according to the control signal of the control module 300 and/or The longitudinal rail assembly 162 performs the corresponding actuation.
因此,在檢測程序中,控制模組300可先控制驅動電路驅動水平滑軌組件161及/或縱向滑軌組件162攜載光纖連接器120移動至一擦拭位置以清潔光纖接頭121,如圖10與圖11所示。其中,當光纖連接器120移動至擦拭位置時,光纖連接器120之光纖接頭121可對準於光纖清潔組710之清潔口610c。之後,控制模組300可控制驅動電路驅動水平滑軌組件161攜載光纖連接器120移動至一攝像位置以使控制模組300可根據攝像組720所擷取之影像確認光纖接頭121是否已符合一乾淨標準,如圖12所示。當控制模組300判斷光纖接頭121已符合乾淨標準時,如圖11所示,控制模組300便可控制驅動電路驅動水平滑軌組件161及/或縱向滑軌組件162攜載光纖連接器120移動至第二插入位置,以將光纖接頭121插入位於測試座130之光傳接模組200的光傳輸口210中。於此,當光纖連接器120移動至第二插入位置時,光纖連接器120之光纖接頭121可對準於光傳接模組200的光傳輸口210。反之,當確認光纖接頭121仍不符合乾淨標準時,控制模組300則重新控制驅動電路驅動水平滑軌組件161及/或縱向滑軌組件162攜載光纖連接器120移動至擦拭位置重新進行清潔程序,直至判斷光纖接頭121已符合乾淨標準時,才控制驅動電路驅動水平滑軌組件161及/或縱向滑軌組件162攜載光纖連接器120移動至第二插入位置。Therefore, in the detecting process, the control module 300 can first control the driving circuit to drive the horizontal rail assembly 161 and/or the longitudinal rail assembly 162 to carry the fiber optic connector 120 to a wiping position to clean the fiber connector 121, as shown in FIG. As shown in Figure 11. Wherein, when the optical fiber connector 120 is moved to the wiping position, the optical fiber connector 121 of the optical fiber connector 120 can be aligned with the cleaning opening 610c of the optical fiber cleaning group 710. Then, the control module 300 can control the driving circuit to drive the horizontal slide assembly 161 to carry the optical fiber connector 120 to an imaging position, so that the control module 300 can confirm whether the optical fiber connector 121 has been matched according to the image captured by the camera group 720. A clean standard, as shown in Figure 12. When the control module 300 determines that the fiber optic connector 121 has met the clean standard, as shown in FIG. 11, the control module 300 can control the drive circuit to drive the horizontal rail assembly 161 and/or the longitudinal rail assembly 162 to carry the fiber optic connector 120 to move. To the second insertion position, the optical fiber connector 121 is inserted into the optical transmission port 210 of the optical transmission module 200 of the test socket 130. Here, when the optical fiber connector 120 is moved to the second insertion position, the optical fiber connector 121 of the optical fiber connector 120 can be aligned with the optical transmission port 210 of the optical transmission module 200. Conversely, when it is confirmed that the fiber optic connector 121 still does not meet the clean standard, the control module 300 re-controls the drive circuit to drive the horizontal rail assembly 161 and/or the longitudinal rail assembly 162 to carry the fiber optic connector 120 to the wiping position to re-clean the program. The control drive circuit drives the horizontal rail assembly 161 and/or the longitudinal rail assembly 162 to carry the fiber optic connector 120 to the second insertion position until it is determined that the fiber optic connector 121 has met the clean criteria.
在一實施例中,自動檢測裝置100更包含第一計數器(圖未示),耦接至控制模組300,且可用以計數光纖清潔組710對光纖接頭121進行清潔之清潔次數。因此,控制模組300可根據第一計數器所計數之清潔次數確認光纖清潔組710之使用次數(與清潔次數之值相同)是否已達第一閾值,且於判斷清潔次數達到第一閾值時,產生第一更換警示以提示進行更換光纖清潔組710中之光纖清潔帶捲。In an embodiment, the automatic detecting device 100 further includes a first counter (not shown) coupled to the control module 300 and can be used to count the number of times the fiber cleaning unit 710 cleans the fiber connector 121. Therefore, the control module 300 can confirm whether the number of uses of the optical fiber cleaning group 710 (same as the number of cleaning times) has reached the first threshold according to the number of cleanings counted by the first counter, and when it is determined that the number of cleaning reaches the first threshold, A first replacement alert is generated to prompt replacement of the fiber cleaning tape roll in the fiber cleaning kit 710.
於光纖連接器120之光纖接頭121插入至光傳接模組200的光傳輸口210中後,控制模組300便可發送致能訊號給誤碼測試器140,以致動誤碼測試器140產生脈衝訊號S1。於此,脈衝訊號S1係為一種電訊號,故須先將脈衝訊號S1經由電光轉換模組110轉換成對應之測試光訊號S2後,再將測試光訊號S2經由光纖連接器120傳輸至位於測試座130之光傳接模組200以進行檢測。After the optical fiber connector 121 of the optical fiber connector 120 is inserted into the optical transmission port 210 of the optical transmission module 200, the control module 300 can send an enable signal to the error tester 140 to activate the error tester 140. Pulse signal S1. In this case, the pulse signal S1 is a type of electrical signal. Therefore, the pulse signal S1 is first converted into the corresponding test optical signal S2 via the electro-optical conversion module 110, and then the test optical signal S2 is transmitted to the test via the optical fiber connector 120. The light transmission module 200 of the socket 130 is used for detection.
因此,光傳接模組200便可根據光傳輸口210所接收到之測試光訊號S2轉換出對應之輸出電訊號S3,且測試座130可根據光傳接模組200所轉換出之輸出電訊號S3產生對應之檢測訊號S4輸出,以使誤碼測試器140可根據檢測訊號S4產生誤碼率R1。Therefore, the optical transmission module 200 can convert the corresponding output electrical signal S3 according to the test optical signal S2 received by the optical transmission port 210, and the test socket 130 can output the output telecommunication according to the optical transmission module 200. The number S3 generates a corresponding detection signal S4 output, so that the error tester 140 can generate the error rate R1 according to the detection signal S4.
在一實施例中,誤碼測試器140可包含脈衝產生單元(Pulse Pattern Generator,PPG)141與誤碼偵測單元(Error Detector,ED)142。其中,脈衝產生單元141耦接至電光轉換模組110,且誤碼偵測器142耦接電光轉換模組110、測試座130以及控制模組300。In an embodiment, the error tester 140 may include a Pulse Pattern Generator (PPG) 141 and an Error Detector (ED) 142. The pulse generating unit 141 is coupled to the electro-optical conversion module 110 , and the error detector 142 is coupled to the electro-optical conversion module 110 , the test socket 130 , and the control module 300 .
在一實施態樣中,脈衝產生單元141可為偽隨機位元序列(PRBS)產生器,用以產生並輸出具有2N-1種之排列組合的脈衝訊號S1,其中N為位元數。而誤碼偵測單元142則可用以根據檢測訊號S4以及脈衝產生單元141所產生的脈衝訊號S1來得到誤碼率R1。於此,誤碼率R1是指每一個從發送端(如脈衝產生單元141)送出之位元在接收端(如光傳接模組200)發生錯誤的機率,而可用以衡量數據在規定時間內的傳輸精確性。In one embodiment, the pulse generation unit 141 may be a pseudo random bit sequence (PRBS) generator for generating and outputting a pulse signal S1 having a permutation combination of 2N-1, where N is the number of bits. The error detection unit 142 can be used to obtain the error rate R1 according to the detection signal S4 and the pulse signal S1 generated by the pulse generation unit 141. Here, the bit error rate R1 refers to the probability that each bit sent from the transmitting end (such as the pulse generating unit 141) has an error at the receiving end (such as the optical transmission module 200), and can be used to measure the data at a specified time. Transmission accuracy within.
此外,於光纖連接器120之光纖接頭121插入至光傳接模組200的光傳輸口210中後,誤碼測試器140所產生之脈衝訊號S1亦可經由測試座130之測試槽1321以及與測試槽1321中之接頭相接之電傳輸口220傳輸至光傳接模組200,且光傳接模組200可根據電傳輸口220所接收之脈衝訊號S1轉換出對應之輸出光訊號S5至通訊分析儀600,以使通訊分析儀600可根據輸出光訊號S5來產生對應之分析訊號S6,藉以完成對光傳接模組200之光發送功能的檢測。In addition, after the optical fiber connector 121 of the optical fiber connector 120 is inserted into the optical transmission port 210 of the optical transmission module 200, the pulse signal S1 generated by the error tester 140 can also pass through the test slot 1321 of the test socket 130 and The electrical transmission port 220 connected to the connector in the test slot 1321 is transmitted to the optical transmission module 200, and the optical transmission module 200 can convert the corresponding output optical signal S5 according to the pulse signal S1 received by the electrical transmission port 220. The communication analyzer 600 is configured to enable the communication analyzer 600 to generate a corresponding analysis signal S6 according to the output optical signal S5, thereby completing the detection of the optical transmission function of the optical transmission module 200.
在一實施態樣中,通訊分析儀600可為數位通訊分析示波器(DCA)。In one embodiment, the communication analyzer 600 can be a digital communication analysis oscilloscope (DCA).
於此,自動檢測裝置100可先完成對光傳接模組200之光接收功能的檢測後,再完成對光傳接模組200之光發送功能的檢測。然而,本創作並非以此為限,自動檢測裝置100亦可先完成對光傳接模組200之光發送功能的檢測後,再完成對光傳接模組200之光接收功能的檢測。In this case, the automatic detecting device 100 can complete the detection of the light receiving function of the optical transmission module 200 before completing the detection of the optical transmitting function of the optical transmission module 200. However, the present invention is not limited thereto. The automatic detecting device 100 can also complete the detection of the light transmitting function of the optical transmission module 200 before completing the detection of the light receiving function of the optical transmission module 200.
因此,於經過預計可完成所有檢測的一預定時間後,例如20分鐘,控制模組300便可控制第二移載機構160將光纖連接器120之光纖接頭121自光傳接模組200之光傳輸口210中拔出。Therefore, after a predetermined time period, for example, 20 minutes, after all the tests are expected to be completed, the control module 300 can control the second transfer mechanism 160 to light the optical fiber connector 121 of the optical fiber connector 120 from the optical transmission module 200. The transmission port 210 is pulled out.
請參閱圖15至圖17。在一實施例中,光纖連接器120更包含一彈臂122,設置於支撐套管1211上,用以於光纖接頭121插入至光傳接模組200之光傳輸口210時可扣合於光傳接模組200之外殼。此外,第二移載機構160更包含升降組件164與推壓件165。其中,推壓件165耦接升降組件,且升降組件164耦接至縱向滑軌組件162與驅動電路,以根驅動電路之驅動訊號進行相應之作動。於此,推壓件165可相對於攜載部163設置於其之上方,並可隨縱向滑軌組件162一同移動。Please refer to Figure 15 to Figure 17. In one embodiment, the fiber optic connector 120 further includes a spring arm 122 disposed on the support sleeve 1211 for engaging the optical fiber connector 121 when inserted into the optical transmission port 210 of the optical transmission module 200. The housing of the module 200 is transferred. In addition, the second transfer mechanism 160 further includes a lifting assembly 164 and a pressing member 165. The pusher 165 is coupled to the lift assembly, and the lift assembly 164 is coupled to the longitudinal slide assembly 162 and the drive circuit for corresponding actuation of the drive signal of the root drive circuit. Here, the pressing member 165 can be disposed above the carrying portion 163 and can move together with the longitudinal rail assembly 162.
因此,當欲將光纖接頭121自光傳輸口210中拔出時,控制模組300可先控制驅動電路驅動升降組件164帶動推壓件165朝攜載部163之方向下降,以推壓位於攜載部163之光纖連接器120的彈臂122,如圖16所示。之後,控制模組300再控制驅動電路驅動縱向滑軌組件162朝向遠離光傳接模組200之光傳輸口210的方向移動,以使光纖連接器120的光纖接頭121可與光傳輸口210分離,如圖17所示。此外,控制模組300更可控制驅動電路驅動水平滑軌組件161帶動攜載部163回復至擦拭位置進行清潔,以待測試下一個光傳接模組200。Therefore, when the optical fiber connector 121 is to be pulled out from the optical transmission port 210, the control module 300 can first control the driving circuit to drive the lifting assembly 164 to drive the pressing member 165 downward in the direction of the carrying portion 163, so as to push and hold The elastic arm 122 of the optical fiber connector 120 of the carrier portion 163 is as shown in FIG. Thereafter, the control module 300 controls the driving circuit to drive the longitudinal rail assembly 162 to move away from the optical transmission port 210 of the optical transmission module 200, so that the optical fiber connector 121 of the optical fiber connector 120 can be separated from the optical transmission port 210. As shown in Figure 17. In addition, the control module 300 can further control the driving circuit to drive the horizontal slide assembly 161 to drive the carrying portion 163 to return to the wiping position for cleaning, so as to test the next optical transmission module 200.
接續,於光纖接頭121自光傳輸口210中拔出後,控制模組300便可根據誤碼測試器140所產生之誤碼率R1與通訊分析儀600所產生之分析訊號S6控制第一移載機構150將光傳接模組200自測試座130搬運至對應之良品區A21或不良品區A22。After the optical fiber connector 121 is removed from the optical transmission port 210, the control module 300 can control the first shift according to the error rate R1 generated by the error tester 140 and the analysis signal S6 generated by the communication analyzer 600. The carrier mechanism 150 transports the optical transmission module 200 from the test socket 130 to the corresponding good product area A21 or defective product area A22.
請參閱圖18至圖22。在一實施例中,自動檢測裝置100更包含一出料載台800,以使第一移載機構150可先將檢測完之光傳接模組200先移送至此處後,再搬運至對應之良品區A21或不良品區A22。在本實施例中,出料載台800可包含承載基座810、出料槽820以及滑軌組件830。其中,出料槽820位於承載基座810上,且出料槽820具有一進料端。於此,出料槽820可凹設於承載基座810,且進料端係鄰接於承載基座810之一側邊。滑軌組件830耦接承載基座810以及控制模組300,以根據控制模組300之控制訊號帶動承載基座810進行相應之作動。Please refer to Figure 18 to Figure 22. In an embodiment, the automatic detecting device 100 further includes a discharge loading platform 800, so that the first transfer mechanism 150 can first transfer the detected optical transmission module 200 to the first transfer device, and then transport it to the corresponding one. Good product area A21 or defective product area A22. In the present embodiment, the discharge stage 800 can include a carrier base 810, a discharge chute 820, and a slide rail assembly 830. The discharge trough 820 is located on the carrier base 810, and the discharge trough 820 has a feeding end. Here, the discharge trough 820 can be recessed on the carrying base 810, and the feeding end is adjacent to one side of the carrying base 810. The slide rail assembly 830 is coupled to the base 810 and the control module 300 for driving the base 810 according to the control signal of the control module 300 to perform corresponding operations.
此外,第一移載機構150更可包含第三移載組件153,設置於出料載台800之承載基座810上,用以將已完成檢測之光傳接模組200自測試座130之測試槽1321中移出至出料載台800之出料槽820中。In addition, the first transfer mechanism 150 further includes a third transfer component 153 disposed on the carrier base 810 of the discharge loading platform 800 for self-testing the optical transmission module 200 from the test socket 130. The test tank 1321 is removed into the discharge chute 820 of the discharge stage 800.
在本實施例中,光傳接模組200更包含拉環240,鄰設於光傳輸口210。於此,拉環240可旋轉於一扣合位置與一拉動位置之間,以將光傳接模組200固定於或拔出於與之相接的電子裝置。因此,當光傳接模組200被插入至測試座130之測試槽1321中時,拉環240可被旋轉至扣合位置以將光傳接模組200固定於測試槽1321中;而當欲將光傳接模組200自測試槽1321中拔出時,拉環240則可被旋轉至拉動位置,以使光傳接模組200可被輕鬆拉出。In the embodiment, the optical transmission module 200 further includes a pull ring 240 disposed adjacent to the optical transmission port 210. In this case, the pull ring 240 can be rotated between a fastening position and a pulling position to fix or pull the optical transmission module 200 to the electronic device connected thereto. Therefore, when the optical transmission module 200 is inserted into the test slot 1321 of the test socket 130, the pull ring 240 can be rotated to the fastening position to fix the optical transmission module 200 in the test slot 1321; When the optical transmission module 200 is pulled out from the test slot 1321, the pull ring 240 can be rotated to the pulling position, so that the optical transmission module 200 can be easily pulled out.
第一移載機構150之第三移載組件153可包含縱向滑軌組件1531、垂直伸縮組件1532與驅動電路(圖未示)。其中,垂直伸縮組件1532耦接縱向滑軌組件1531,以跟隨縱向滑軌組件1531一同移動;且驅動電路耦接縱向滑軌組件1531、垂直伸縮組件1532與控制模組300,以根據控制模組300之控制訊號驅動縱向滑軌組件1531及/或垂直伸縮組件1532進行相應的作動。The third transfer assembly 153 of the first transfer mechanism 150 can include a longitudinal rail assembly 1531, a vertical telescoping assembly 1532, and a drive circuit (not shown). The vertical telescopic assembly 1532 is coupled to the longitudinal rail assembly 1531 to move along with the longitudinal rail assembly 1531; and the driving circuit is coupled to the longitudinal rail assembly 1531, the vertical telescopic assembly 1532 and the control module 300, according to the control module. The control signal of 300 drives the longitudinal rail assembly 1531 and/or the vertical telescoping assembly 1532 to perform corresponding actuations.
因此,當控制模組300欲根據誤碼率R1與分析訊號S6控制第一移載機構150將光傳接模組200自測試座130移至對應之良品區A21或不良品區A22時,控制模組300可先控制出料載台800之滑軌組件830帶動承載基座810移動至一進料位置,以使得出料槽820之進料端可相對於測試槽1321之進出端。於此,當承載基座810移動至進料位置時,裸露於測試槽1321外之光傳接模組200的光傳輸口210可位於出料槽820中。Therefore, when the control module 300 is to control the first transfer mechanism 150 to move the optical transmission module 200 from the test socket 130 to the corresponding good product area A21 or the defective product area A22 according to the error rate R1 and the analysis signal S6, the control module 300 is controlled. The module 300 can first control the slide rail assembly 830 of the discharge stage 800 to move the carrier base 810 to a feeding position, so that the feeding end of the discharge trough 820 can be opposite to the inlet and outlet ends of the test slot 1321. Here, when the carrier base 810 is moved to the feeding position, the light transmission port 210 of the light transmission module 200 exposed outside the test slot 1321 may be located in the discharge slot 820.
然後,控制模組300可控制第三移載組件153之驅動電路驅動縱向滑軌組件1531帶動垂直伸縮組件1532朝測試座130之方向移動,以使垂直伸縮組件1532可位於光傳接模組200之光傳輸口210的上方,如圖18所示。於此,垂直伸縮組件1532具有一伸縮件,且當垂直伸縮組件1532位於光傳輸口210的上方時,伸縮件可對準於由光傳接模組200之拉環240與光傳輸口210所形成之穿孔(此時之拉環240是位於扣合位置)。Then, the control module 300 can control the driving circuit of the third transfer component 153 to drive the vertical slide assembly 1531 to move the vertical telescopic assembly 1532 toward the test socket 130, so that the vertical telescopic assembly 1532 can be located in the optical transmission module 200. Above the light transmission port 210, as shown in FIG. Here, the vertical telescopic assembly 1532 has a telescopic member, and when the vertical telescopic assembly 1532 is located above the optical transmission port 210, the telescopic member can be aligned with the pull ring 240 and the optical transmission port 210 of the optical transmission module 200. The perforations are formed (the tabs 240 are now in the snap-fit position).
接續,如圖19所示,控制模組300可控制第三移載組件153之驅動電路驅動垂直伸縮組件1532之伸縮件向下伸展,以使伸縮件可位於由拉環240與光傳輸口210所形成之穿孔中後,再驅動縱向滑軌組件1531朝遠離於測試座130之方向移動,以將光傳接模組200之拉環240自扣合位置拉動至拉動位置並藉以將整個光傳接模組200自測試槽1321中拉至出料槽820中,如圖20所示。之後,如圖21所示,控制模組300便可控制出料載台800之滑軌組件830帶動承載基座810移動至出料位置。接續,如圖20所示,控制模組300控制第一移載組件151之驅動電路驅動水平滑軌組件1511帶動取置部1513移動至位於出料槽820之光傳接模組200的上方後,再控制第一移載組件151之驅動電路驅動升降組件1512帶動取置部1513向下移動直至取置部1513可取起已檢測完之光傳接模組200後,再帶動取置部1513向上移動。然後,控制模組300便可根據誤碼測試器140所產生之誤碼率R1與通訊分析儀600所產生之分析訊號S6控制第一移載組件151之驅動電路驅動水平滑軌組件1511、升降組件1512與取置部1513,以將光傳接模組200置放到對應之良品待置區A212的良品出料盤420上或不良品待置區A222的不良品出料盤430上。Continuing, as shown in FIG. 19, the control module 300 can control the driving circuit of the third transfer component 153 to drive the telescopic member of the vertical telescopic assembly 1532 to extend downward so that the telescopic member can be located by the pull ring 240 and the optical transmission port 210. After the formed perforation, the longitudinal slide assembly 1531 is further moved away from the test seat 130 to pull the pull ring 240 of the optical transmission module 200 from the fastening position to the pulling position, thereby transferring the entire light. The module 200 is pulled from the test slot 1321 into the discharge slot 820 as shown in FIG. Thereafter, as shown in FIG. 21, the control module 300 can control the slide rail assembly 830 of the discharge stage 800 to move the carrier base 810 to the discharge position. In the continuation, as shown in FIG. 20, the control module 300 controls the driving circuit of the first transfer component 151 to drive the horizontal slide assembly 1511 to move the pickup portion 1513 to the upper side of the optical transmission module 200 located in the discharge slot 820. And driving the driving circuit of the first transfer component 151 to drive the lifting component 1512 to move the picking portion 1513 downward until the picking portion 1513 can pick up the detected optical transmission module 200, and then drive the loading portion 1513 upward. mobile. Then, the control module 300 can control the driving circuit of the first transfer component 151 to drive the horizontal slide assembly 1511 according to the error rate R1 generated by the error tester 140 and the analysis signal S6 generated by the communication analyzer 600. The component 1512 and the accommodating portion 1513 are arranged to place the optical transmission module 200 on the good product discharge tray 420 of the corresponding good product waiting area A212 or the defective product discharge tray 430 of the defective product waiting area A222.
在一實施例中,自動檢測裝置100更包含第二計數器(圖未示),耦接至控制模組300,且可用以計數光纖連接器120之光纖接頭121插入至光傳接模組200之光傳輸口210之使用次數。因此,控制模組300可根據第二計數器所計數之使用次數確認光纖連接器120之使用次數是否已達第二閾值,且於判斷使用次數達到第二閾值時,產生第二更換警示以提示進行更換光纖連接器120中之光纖1212。In an embodiment, the automatic detecting device 100 further includes a second counter (not shown) coupled to the control module 300, and the optical fiber connector 121 of the counting fiber connector 120 can be inserted into the optical transmission module 200. The number of times the optical transmission port 210 is used. Therefore, the control module 300 can confirm whether the number of uses of the optical fiber connector 120 has reached a second threshold according to the number of uses counted by the second counter, and when determining that the number of uses reaches the second threshold, generating a second replacement alert to prompt The fiber 1212 in the fiber optic connector 120 is replaced.
此外,自動檢測裝置100更包含第三計數器(圖未示),耦接至控制模組300,且可用以計數測試座130之測試槽1321的測試次數。因此,控制模組300可根據第三計數器所計數之測試次數確認測試座130之測試槽1321之使用次數(即,所述之測試次數)是否已達第三閾值,且於判斷測試次數達到第三閾值時,產生第三更換警示以提示進行更換測試座130之測試槽1321。In addition, the automatic detecting device 100 further includes a third counter (not shown) coupled to the control module 300 and can be used to count the number of tests of the test slot 1321 of the test socket 130. Therefore, the control module 300 can confirm whether the number of uses of the test slot 1321 of the test socket 130 (ie, the number of tests) has reached a third threshold according to the number of tests counted by the third counter, and determines that the number of tests reaches the third At the third threshold, a third replacement alert is generated to prompt the replacement of the test slot 1321 of the test socket 130.
在一實施例中,每一光傳接模組200上可具有其對應之識別碼,且自動檢測裝置100可包含讀碼器(圖未示),耦接至控制模組300,且可於光傳接模組200插入至測試座130之測試槽1321中時,用以讀取並記錄光傳接模組200上之識別碼,以使控制模組300可根據此識別碼與其檢測之結果(即,誤碼率R1與分析訊號S6)得知各個光傳接模組200之品質。In an embodiment, each optical transmission module 200 can have its corresponding identification code, and the automatic detection device 100 can include a code reader (not shown) coupled to the control module 300, and can be When the optical transmission module 200 is inserted into the test slot 1321 of the test socket 130, the identification code on the optical transmission module 200 is read and recorded, so that the control module 300 can be based on the identification code and the result of the detection. (ie, the bit error rate R1 and the analysis signal S6) are known for the quality of each of the optical transmission modules 200.
綜上所述,根據本創作一實施例之自動檢測裝置,利用移載機構來搬運光傳接模組以及插拔光纖連接器,而無需仰賴人工進行作業,藉以自動化光傳接模組之檢測作業,並提高整體檢測之精準度與效率。In summary, according to the automatic detecting device of the embodiment of the present invention, the optical transfer module is used to carry the optical transmission module and the optical fiber connector is inserted and removed without relying on manual operation, thereby detecting the automatic optical transmission module. Work and improve the accuracy and efficiency of the overall inspection.
雖然本創作的技術內容已經以較佳實施例揭露如上,然其並非用以限定本創作,任何熟習此技藝者,在不脫離本創作之精神所作些許之更動與潤飾,皆應涵蓋於本創作的範疇內,因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art, and some modifications and refinements that do not depart from the spirit of the present invention should be included in the creation. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application.
100‧‧‧自動檢測裝置
110‧‧‧電光轉換模組
120‧‧‧光纖連接器
121‧‧‧光纖接頭
1211‧‧‧支撐管
1212‧‧‧光纖
122‧‧‧彈臂
130‧‧‧測試座
131‧‧‧承載基台
132‧‧‧測試電路板
1321‧‧‧測試槽
140‧‧‧誤碼測試器
141‧‧‧脈衝產生單元
142‧‧‧誤碼偵測單元
150‧‧‧第一移載機構
151‧‧‧第一移載組件
1511‧‧‧水平滑軌組件
1512‧‧‧升降組件
1513‧‧‧取置部
152‧‧‧第二移載組件
1521‧‧‧橫向滑軌組件
1522‧‧‧縱向滑軌組件
153‧‧‧第三移載組件
1531‧‧‧縱向滑軌組件
1532‧‧‧垂直伸縮組件
160‧‧‧第二移載機構
161‧‧‧水平滑軌組件
162‧‧‧縱向滑軌組件
163‧‧‧攜載部
164‧‧‧升降組件
165‧‧‧推壓件
170‧‧‧第三移載機構
171‧‧‧橫向滑軌組件
172‧‧‧承載板
173‧‧‧升降組件
174‧‧‧抵持組件
180‧‧‧第四移載機構
190‧‧‧第五移載機構
200‧‧‧光傳接模組
210‧‧‧光傳輸口
220‧‧‧電傳輸口
230‧‧‧光電轉換單元
240‧‧‧拉環
300‧‧‧控制模組
410‧‧‧進料盤
410c‧‧‧置料槽
420‧‧‧良品出料盤
430‧‧‧不良品出料盤
510‧‧‧支撐架
511‧‧‧支撐柱
512‧‧‧支撐件
520‧‧‧支撐架
530‧‧‧支撐架
600‧‧‧通訊分析儀
710‧‧‧光纖清潔組
711‧‧‧殼體
711c‧‧‧清潔口
712‧‧‧操作組件
712a‧‧‧按壓部
712b‧‧‧推壓件
720‧‧‧攝像組
800‧‧‧出料載台
810‧‧‧承載基座
820‧‧‧出料槽
830‧‧‧滑軌組件
900‧‧‧預熱載台
910‧‧‧承載基座
920‧‧‧加熱槽
A1‧‧‧進料區
A2‧‧‧出料區
A11‧‧‧供料區
A12‧‧‧待取區
A13‧‧‧空盤堆放區
A21‧‧‧良品區
A211‧‧‧良品空盤區
A212‧‧‧良品待置區
A213‧‧‧良品滿盤區
A22‧‧‧不良品區
A221‧‧‧不良品空盤區
A222‧‧‧不良品待置區
A223‧‧‧不良品滿盤區
R1‧‧‧誤碼率
S1‧‧‧脈衝訊號
S2‧‧‧測試光訊號
S3‧‧‧輸出電訊號
S4‧‧‧檢測訊號
S5‧‧‧輸出光訊號
S6‧‧‧分析訊號100‧‧‧Automatic detection device
110‧‧‧Electro-optical conversion module
120‧‧‧Fiber Optic Connectors
121‧‧‧Fiber Optic Connector
1211‧‧‧Support tube
1212‧‧‧ fiber
122‧‧‧Bounce arm
130‧‧‧ test seat
131‧‧‧bearing abutments
132‧‧‧Test circuit board
1321‧‧‧Test slot
140‧‧‧Error code tester
141‧‧‧pulse generating unit
142‧‧‧Error detection unit
150‧‧‧First transfer mechanism
151‧‧‧First transfer component
1511‧‧‧Horizontal rail assembly
1512‧‧‧ Lifting components
1513‧‧‧Removal Department
152‧‧‧Second transfer assembly
1521‧‧‧Horizontal rail assembly
1522‧‧‧Longitudinal slide assembly
153‧‧‧ Third Transfer Assembly
1531‧‧‧Longitudinal slide assembly
1532‧‧‧Vertical telescopic components
160‧‧‧Second transfer mechanism
161‧‧‧Horizontal rail assembly
162‧‧‧Longitudinal slide assembly
163‧‧‧ Carrying Department
164‧‧‧ lifting assembly
165‧‧‧Pushing parts
170‧‧‧ Third transfer mechanism
171‧‧‧Horizontal rail assembly
172‧‧‧Loading board
173‧‧‧ Lifting components
174‧‧‧Resist the component
180‧‧‧fourth transfer mechanism
190‧‧‧ fifth transfer mechanism
200‧‧‧Light transmission module
210‧‧‧Light transmission port
220‧‧‧Electric transmission port
230‧‧‧ photoelectric conversion unit
240‧‧‧ pull ring
300‧‧‧Control Module
410‧‧‧feed tray
410c‧‧‧feeding trough
420‧‧‧Good product tray
430‧‧‧Delivery product discharge tray
510‧‧‧Support frame
511‧‧‧Support column
512‧‧‧Support
520‧‧‧Support frame
530‧‧‧Support frame
600‧‧‧Communication Analyzer
710‧‧‧Fiber Cleaning Group
711‧‧‧shell
711c‧‧‧ cleaning mouth
712‧‧‧Operating components
712a‧‧‧ Pressing department
712b‧‧‧Pushing parts
720‧‧‧ camera group
800‧‧‧ discharging platform
810‧‧‧Loading base
820‧‧‧draw trough
830‧‧‧Slide assembly
900‧‧‧Preheating stage
910‧‧‧Loading base
920‧‧‧heating tank
A1‧‧‧feeding area
A2‧‧‧Drawing area
A11‧‧‧Feeding area
A12‧‧‧ waiting area
A13‧‧‧ empty storage area
A21‧‧‧ good area
A211‧‧‧ good empty area
A212‧‧‧ good goods waiting area
A213‧‧‧Good product area
A22‧‧‧Defective area
A221‧‧‧Dangerous goods empty panel
A222‧‧‧Don't be reserved
A223‧‧‧Dangerous goods full panel
R1‧‧‧ bit error rate
S1‧‧‧ pulse signal
S2‧‧‧ test optical signal
S3‧‧‧ output telecommunication number
S4‧‧‧ detection signal
S5‧‧‧ output optical signal
S6‧‧‧ analysis signal
[圖1]為本創作一實施例之自動檢測裝置的方塊概要示意圖。 [圖2]為本創作一實施例之自動檢測裝置的立體概要示意圖。 [圖3]為圖2的俯視概要示意圖。 [圖4]為第三移載機構搬運進料盤之一實施例的概要示意圖(一)。 [圖5]為第三移載機構搬運進料盤之一實施例的概要示意圖(二)。 [圖6]為第一移載機構自進料區取起光傳接模組之一實施例的概要示意圖。 [圖7]為第一移載機構將光傳接模組移至預熱載台之一實施例的概要示意圖(一)。 [圖8]為第一移載機構將光傳接模組移至預熱載台之一實施例的概要示意圖(二)。 [圖9]為將光傳接模組自預熱載台移至測試座之一實施例的概要示意圖。 [圖10]為光纖連接器位於擦拭位置之一實施例的概要示意圖(一)。 [圖11]為光纖連接器位於擦拭位置之一實施例的概要示意圖(二)。 [圖12]為光纖連接器位於攝像位置之一實施例的概要示意圖。 [圖13]為光纖連接器位於第二插入位置之一實施例的概要示意圖。 [圖14]為光纖接頭插入至光傳輸口光纖接頭。 [圖15]為圖14之局部放大概要示意圖。 [圖16]為第二移載機構將光纖接頭自光傳輸口中拔出之一實施例的概要示意圖(一)。 [圖17]為第二移載機構將光纖接頭自光傳輸口中拔出之一實施例的概要示意圖(二)。 [圖18]為第一移載機構將光傳接模組自測試座移至出料載台之一實施例的概要示意圖(一)。 [圖19]為第一移載機構將光傳接模組自測試座移至出料載台之一實施例的概要示意圖(二)。 [圖20]為第一移載機構將光傳接模組自測試座移至出料載台之一實施例的概要示意圖(三)。 [圖21]為第一移載機構將光傳接模組自測試座移至出料載台之一實施例的概要示意圖(四)。 [圖22]為第一移載機構將光傳接模組自出料載台取起之一實施例的概要示意圖。1 is a schematic block diagram of an automatic detecting device according to an embodiment of the present invention. Fig. 2 is a schematic perspective view showing the automatic detecting device of an embodiment of the present invention. FIG. 3 is a schematic plan view of FIG. 2 . Fig. 4 is a schematic view (1) showing an embodiment of a feeding tray of a third transfer mechanism. Fig. 5 is a schematic view (2) showing an embodiment of a feeding tray of a third transfer mechanism. FIG. 6 is a schematic diagram showing an embodiment of the optical transfer module taken from the feeding zone by the first transfer mechanism. FIG. 7 is a schematic diagram (1) showing an embodiment in which the first transfer mechanism moves the optical transmission module to the preheating stage. FIG. FIG. 8 is a schematic diagram (2) showing an embodiment in which the first transfer mechanism moves the optical transmission module to the preheating stage. FIG. FIG. 9 is a schematic diagram showing an embodiment of moving an optical transmission module from a preheating stage to a test socket. Fig. 10 is a schematic diagram (1) showing an embodiment of the optical fiber connector in a wiping position. [Fig. 11] is a schematic view (2) of an embodiment in which the optical fiber connector is located at the wiping position. Fig. 12 is a schematic diagram showing an embodiment in which an optical fiber connector is located at an imaging position. Fig. 13 is a schematic diagram showing an embodiment of a fiber optic connector in a second insertion position. [Fig. 14] A fiber connector is inserted into an optical transmission port fiber connector. Fig. 15 is a partially enlarged schematic view showing Fig. 14; Fig. 16 is a schematic view (1) showing an embodiment in which the second transfer mechanism pulls out the optical fiber connector from the optical transmission port. Fig. 17 is a schematic diagram (2) showing an embodiment in which the second transfer mechanism pulls out the optical fiber connector from the optical transmission port. FIG. 18 is a schematic diagram (1) showing an embodiment in which the first transfer mechanism moves the optical transmission module from the test socket to the discharge carrier. FIG. 19 is a schematic diagram (2) showing an embodiment in which the first transfer mechanism moves the optical transmission module from the test socket to the discharge carrier. FIG. 20 is a schematic diagram (3) showing an embodiment in which the first transfer mechanism moves the optical transmission module from the test socket to the discharge carrier. FIG. FIG. 21 is a schematic diagram (4) showing an embodiment in which the first transfer mechanism moves the optical transmission module from the test socket to the discharge carrier. Fig. 22 is a schematic view showing an embodiment in which the first transfer mechanism picks up the optical transmission module from the discharge stage.
130‧‧‧測試座 130‧‧‧ test seat
151‧‧‧第一移載組件 151‧‧‧First transfer component
152‧‧‧第二移載組件 152‧‧‧Second transfer assembly
160‧‧‧第二移載機構 160‧‧‧Second transfer mechanism
170‧‧‧第三移載機構 170‧‧‧ Third transfer mechanism
180‧‧‧第四移載機構 180‧‧‧fourth transfer mechanism
190‧‧‧第五移載機構 190‧‧‧ fifth transfer mechanism
200‧‧‧光傳接模組 200‧‧‧Light transmission module
410‧‧‧進料盤 410‧‧‧feed tray
420‧‧‧良品出料盤 420‧‧‧Good product tray
430‧‧‧不良品出料盤 430‧‧‧Delivery product discharge tray
510‧‧‧支撐架 510‧‧‧Support frame
511‧‧‧支撐柱 511‧‧‧Support column
520‧‧‧支撐架 520‧‧‧Support frame
530‧‧‧支撐架 530‧‧‧Support frame
710‧‧‧光纖清潔組 710‧‧‧Fiber Cleaning Group
720‧‧‧攝像組 720‧‧‧ camera group
800‧‧‧出料載台 800‧‧‧ discharging platform
900‧‧‧預熱載台 900‧‧‧Preheating stage
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105204790U TWM526683U (en) | 2016-04-07 | 2016-04-07 | Automatic inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105204790U TWM526683U (en) | 2016-04-07 | 2016-04-07 | Automatic inspection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM526683U true TWM526683U (en) | 2016-08-01 |
Family
ID=57182696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105204790U TWM526683U (en) | 2016-04-07 | 2016-04-07 | Automatic inspection device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM526683U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI821780B (en) * | 2021-09-17 | 2023-11-11 | 致茂電子股份有限公司 | Temperature control system, temperature control method and testing apparatus of image sensor with the same |
-
2016
- 2016-04-07 TW TW105204790U patent/TWM526683U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI821780B (en) * | 2021-09-17 | 2023-11-11 | 致茂電子股份有限公司 | Temperature control system, temperature control method and testing apparatus of image sensor with the same |
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