TWM574818U - Shield cover assembly - Google Patents

Abstract

A shield assembly includes a shield shell and a heat dissipation module. The heat dissipation module is assembled to the shielding shell, the heat dissipation module includes a heat sink type heat sink, and a cover member having a plate body and a plurality of heat dissipation portions disposed on a top surface of the plate body The fins, the heat dissipating fins and the plate body define a plurality of heat dissipating channels respectively located adjacent to the two heat dissipating fins and extending along the first direction, and each of the heat dissipating channels has a first side a first-class track inlet and a top-end exit at the upper ends, and a top opening extending in the first direction at the top end, the cover member is disposed on a top edge of the heat sink fin of the heat sink type heat sink, and covers the top Wait for the top opening of the heat dissipation channel.

Description

Shield assembly

The present invention relates to a shield assembly, and more particularly to a shield assembly having a heat dissipation structure.

The conventional heat sink type heat sink has a plurality of fins disposed on a bottom plate, and the fins extend in a front-rear direction and are parallel to each other in the left-right direction to form a passage between the fins for the airflow for heat dissipation. The front end and the rear end of the channel constitute the inlet and outlet of the airflow for heat dissipation, but the upper ends of these channels are generally open, so that the airflow for heat dissipation is shunted out from the upper ends of the channels, reducing the intensity of the airflow directly flowing through the channels. , affecting the heat dissipation efficiency of the heat sink.

U.S. Patent No. 8,887,262 discloses a thermally conductive gasket which can be made of silicone, elastomer, graphite or other thermally conductive material and which is compressible. The gasket is connected between the top of a heat conducting block and the bottom of a heat sink, and the heat sink may be an outer casing of an electronic device, a cooling plate or a heat sink with heat sink fins.

The thermal pad disclosed in U.S. Patent No. 7,239,515 is only partially disposed between the top of a heat sink fin of the heat sink and the bottom of the other heat sink. None of the patents completely solves the problem that the airflow for heat dissipation is shunted out from the upper end of the passage between the fins.

Accordingly, it is an object of the present invention to provide a shield assembly that concentrates airflow.

Thus, in some embodiments, the novel shield assembly includes a shield shell and a heat dissipation module. The shield shell has a plurality of walls and an accommodation space defined by the plurality of walls. The heat dissipation module is assembled on a top surface of one of the walls of the shielding case, the heat dissipation module includes a heat sink type heat sink, and a cover member having a plate body and a plurality of the heat dissipation module a heat dissipating fin on a top surface of the board body, the heat dissipating fins extending parallel to a first direction and side by side in a second direction perpendicular to the first direction, the heat dissipating fins and the board body defining a plurality of a heat dissipation flow path extending between the adjacent two heat dissipation fins and extending along the first direction, each of the heat dissipation flow paths having a first-class track inlet and a first-class track outlet respectively located at both ends in the first direction, and a And a top end opening extending along the first direction, the cover member is disposed on a top edge of the heat dissipation fin of the heat sink type heat sink and covers the top opening of the heat dissipation flow path.

In some embodiments, the cover is constructed of a compressible material.

In some embodiments, the material comprising the cover is also electrically conductive.

In some embodiments, the material comprising the cover also has thermal conductivity.

In some embodiments, the material comprising the cover member also has electrical and thermal conductivity.

In some implementations, the shield case includes side walls on both sides of the wall in which the heat dissipation module is assembled, and the heat sink type heat sink further has at least one outer side extending from the board body and adjacent to the outer side surface of the side wall. The additional heat dissipation structure has a sheet body connected to the board body and juxtaposed with the corresponding side wall, and a plurality of protruding strips protruding from the sheet body.

In some embodiments, the wall of the heat dissipating module is formed with an opening that communicates with the accommodating space. The heat dissipating module further includes a heat source contact plate extending through the opening into the accommodating space.

In some embodiments, the heat dissipation module further includes a heat plate disposed between the heat sink type heat sink and the heat source contact plate.

Therefore, in some embodiments, the shield assembly of the present invention is suitable for being disposed in a casing. The shield assembly includes a shielding shell and a heat dissipation module. The shield shell has a plurality of walls and an accommodation space defined by the plurality of walls. The heat dissipation module is assembled on a top surface of one of the walls of the shielding case, the heat dissipation module includes a heat sink type heat sink, and a cover member having a plate body and a plurality of the heat dissipation module a heat dissipating fin on a top surface of the board body, the heat dissipating fins extending parallel to a first direction and side by side in a second direction perpendicular to the first direction, the heat dissipating fins and the board body defining a plurality of a heat dissipating flow path respectively located adjacent to the two heat dissipating fins and extending along the first direction, each of the heat dissipating flow paths having a first-class track inlet and a first-class channel outlet respectively located at both ends in the first direction, and a top end And the top end opening extending along the first direction, the cover member covers the top opening of the heat dissipation flow path, and the cover member is disposed on the top edge of the heat dissipation fin of the heat sink type heat sink and the heat dissipation fin Between the body and a wall of the casing.

In some embodiments, the cover is constructed of a compressible material.

In some embodiments, the material comprising the cover is also electrically conductive.

In some embodiments, the material comprising the cover also has thermal conductivity.

In some embodiments, the material comprising the cover member also has electrical and thermal conductivity.

In some implementations, the shield case includes side walls on both sides of the wall in which the heat dissipation module is assembled, and the heat sink type heat sink further has at least one outer side extending from the board body and adjacent to the outer side surface of the side wall. The additional heat dissipation structure has a sheet body connected to the board body and juxtaposed with the corresponding side wall, and a plurality of protruding strips protruding from the sheet body.

In some embodiments, the wall of the heat dissipating module is formed with an opening that communicates with the accommodating space. The heat dissipating module further includes a heat source contact plate extending through the opening into the accommodating space.

In some embodiments, the heat dissipation module further includes a heat plate disposed between the heat sink type heat sink and the heat source contact plate.

In some embodiments, the casing has a plurality of air inlets, and the flow path inlets of the heat dissipation channels are adjacent to the air inlets of the casing.

The present invention has at least the following effects: the airflow is concentrated through the heat dissipation fins by the cover member disposed on the top edge of the heat dissipation fin of the heat sink fin and covering the top end of the heat dissipation channels The heat dissipation flow path is provided to improve the heat dissipation performance of the heat dissipation module.

Referring to FIGS. 1 and 2 , an embodiment of the present novel shield assembly 100 is adapted to be disposed in a casing 200 having a front end opening 201 and a plurality of intake air above the front end opening 201 . Mouth 202. The shield assembly 100 includes a shield case 1, a heat dissipation module 2, two light guide members 3, and a connector member 4.

Referring to FIG. 3 to FIG. 6 , the shielding shell 1 is made of a metal plate and is used for accommodating an electronic module (including a socket and a plug, not shown). The shielding shell 1 has a plurality of walls, and the plurality of walls An accommodating space 16 is formed. The wall includes a top wall 11 and a bottom wall 12 spaced apart from the top wall 11 in a third direction (in the present embodiment, the up-down direction D3). A second direction (in the present embodiment, the left-right direction D2) is spaced apart from each other and connected to the side wall 13 of the bottom wall 12 and the top wall 11 respectively, and is connected to the top wall 11 and the side walls 13 a rear side edge and a rear wall 14 having a rear end surface 141. The shield case 1 further has a plurality of downwardly extending sidewalls 13 and is adapted to be attached to a circuit board (not shown) and/or to ground. a foot portion 15 of the track, the top wall 11, the bottom wall 12, the two side walls 13 and the rear wall 14 together define the accommodating space extending along a first direction (in the front-back direction D1 in this embodiment) The accommodating space 16 has a front end socket 161 facing forward and opposite to the rear wall 14, and the top wall 11 is formed to communicate with the accommodating space. Space 16 is opening 111. In addition, as shown in FIG. 1 , the front wall 11 , the bottom wall 12 , and the front side edges of the two side walls 13 protrude from the front end opening 201 of the casing 200 , so that the front end socket 161 of the shielding shell 1 is exposed. The casing 200. The rear portion of the accommodating space 16 of the shielding case 1 is used for covering the socket and the front portion of the circuit board for inserting the plug. In the present embodiment, the shield case 1 is exemplified by having an accommodating space 16, but it can be understood that the shield case 1 may be a structure having two or more accommodating spaces 16 in other embodiments.

Referring to FIG. 7 , the heat dissipation module 2 is assembled on the top surface of the top wall 11 of the shielding shell 1 . The heat dissipation module 2 includes a heat sink type heat sink 21 , a cover member 22 , a hot plate 23 , and a heat source . Contact plate 24, and two buckles 25. The heat sink type heat sink 21 has a plate body 211, a plurality of heat dissipation fins 212, and a plurality of additional heat dissipation structures 213. The plate body 211 of the heat sink type heat sink 21 is disposed on a top surface of the top wall 11 of the screen cover and extends rearward of the rear wall 14 of the shield case 1 in the front-back direction D3. The heat dissipation fins 212 are disposed on the top surface of the board body 211 and extend upward from the top surface of the board body 211. The heat dissipation fins 212 extend parallel to the front and rear direction D3 and are perpendicular to the front and rear directions. The left and right directions D2 of D3 are side by side. The heat dissipation fins 212 and the heat dissipation flow paths 214 are respectively located between the adjacent two heat dissipation fins 212 and extend along the front and rear direction D3. a first-stage track inlet 214a and a top-channel outlet 214b at both ends in the front-rear direction D3, and a top end opening 214c extending at the top end and extending in the front-rear direction D3, and the flow path inlet 214a of the heat-dissipating flow path 214 is adjacent to the machine At the air inlet 202 of the casing 200. In this embodiment, the air inlet 202 of the casing 200 is located in front of the heat sink type heat sink 21, and the other part of the casing 200 is further provided with a heat dissipation fan that extracts airflow from the casing 200. (not shown), so that the airflow enters the forward flow path inlets 214a of the heat sink type heat sink 21 via the air inlet 202 of the casing 200, and from the flow path exits located at the rear. 214b flows out. However, when the direction of the airflow is different, the runner inlets 214a may also be located at the rear, and at this time, the runner outlets 214b are located at the front, that is, the position of the runner inlet 214a and the runner outlet 214b are viewed at the end of the flow. Depending on the direction, this is not a limitation. In addition, in other variations, the heat dissipation fins 212 may be parallel to the left and right direction D2 and along the front and rear direction D3. At this time, the heat dissipation channels 214 will extend along the left and right direction D2. This embodiment should be limited. In addition, in the embodiment, the heat dissipation fins 212 are extended from the integrated structure of the board body 211. However, in a variant embodiment, the heat dissipation fins 212 may also be connected by soldering or the like. The top surface of the plate body 211 is not limited to the embodiment of the present embodiment. The additional heat dissipation structures 213 extend downward from the two sides of the plate body 211 and are adjacent to the outer side surfaces of the side walls 13 , and the additional heat dissipation structures 213 are distributed at the outer sides of the side walls 13 of the shielding case 1 , and Each additional heat dissipation structure 213 has a sheet body 213a connected to the board body 211 and juxtaposed with the corresponding side wall 13, and a plurality of protrusions from the sheet body 213a away from the corresponding side wall 13 and parallel to the front and rear direction The additional heat dissipation structure 213 increases the heat dissipation area of the heat sink type heat sink 21 to increase heat dissipation performance.

The cover member 22 is in the form of a sheet and is disposed on the top edge of the heat dissipation fin 212 of the heat sink type heat sink 21 and covers the top end opening 214c of the heat dissipation flow path 214 to prevent the heat dissipation flow path 214 from being removed. The airflow entering the flow path inlet 214a is dissipated from the top end opening 214c of the heat dissipation flow path 214, so that the air flow can flow completely through the heat dissipation channels 214 and out of the flow path outlets 214b of the heat dissipation flow paths 214. That is, the airflow is concentrated through the heat dissipation fins 212 of the heat sink fins 21 and covers the cover 22 of the top end openings 214c of the heat dissipation channels 214. The heat dissipation channel 214 between the fins 212 improves the heat dissipation performance of the heat dissipation module 2. Moreover, in the present embodiment, the cover member 22 may be composed of a material having compressibility, for example, a material such as sponge, rubber, silicone rubber or silicone rubber. In an embodiment, as shown in FIG. 1 and FIG. 2, the cover member 22 is sandwiched between the heat sink type heat sink 21 and a wall 203 of the casing 200, and The compressibility is to fill the gap between the top edge of the heat sink fin 212 of the heat sink fin 21 and the wall 203 of the cabinet 200, thereby avoiding the airflow entering from the air inlet 202 of the cabinet 200. Passing through the gap to further concentrate the airflow on the heat dissipation channels 214 to improve the heat dissipation performance of the heat dissipation module 2. In an embodiment, the cover 22 may be composed of a material that is compressible and has electrical and/or thermal conductivity. The conductive cover 22 can prevent electromagnetic interference to generate electromagnetic shielding, and further strengthen the The shielding performance of the shield assembly 100, the cover member 22 having thermal conductivity can help the thermal energy of the heat dissipation fins 212 of the heat sink fins 21 to be transmitted to the wall 203 of the casing 200 via the cover 22 to strengthen the The heat dissipation performance of the shield assembly 100.

Referring to FIGS. 4 , 5 , 7 and 8 , the heat sink heat sink 21 further has a hot plate mounting groove 215 formed on a bottom surface of the plate body 211 . The hot plate 23 is disposed on the hot plate mounting groove 215, for example, in a welded manner, and the top surface of the hot plate 23 is connected to the plate body 211. The hot plate 23 extends rearward from the rear wall 14 of the shielding case 1 length. The hot plate 23 is also referred to as a Vapor Chamber or a Thermal Plate, which is made of a metal material having high heat transfer efficiency (for example, copper), and has an inside filled with an actuating fluid (for example). The closed cavity of pure water, by the two-phase change of liquid and vapor which continuously circulates the working fluid in the closed cavity, makes the hot plate 23 exhibit the characteristics of rapid average temperature and achieve rapid heat conduction. The heat source contact plate 24 is disposed, for example, on the heat sink type heat sink 21 and the bottom of the heat plate 23, and extends into the accommodating space 16 via the opening 111. The heat source of the plug is transferred to the heat sink type heat sink 21 and the heat plate 23 via the heat source contact plate 24 by the heat source contacting the board 24 which is inserted into the accommodating space 16 to contact the plug of the heat source. The heat plate 23 can uniformly transfer thermal energy to portions of the heat sink type heat sink 21 to further enhance the heat dissipation performance of the heat dissipation module 2. In some variations, the heat dissipation module 2 may not have the hot plate 23, and even the plate body 211 of the heat sink heat sink 21 may be directly replaced by the hot plate 23, and in some variations. The heat source contact plate 24 may be formed integrally with the plate body 211 of the heat sink type heat sink 21 or the heat plate 23. In another embodiment, the heat dissipation module 2 may further include another heat sink type heat sink (not shown) disposed on the bottom surface of the heat board 23 extending from the rear of the shield shell 1 or may further include A plurality of heat dissipating fins (not shown) are disposed on the bottom surface of the heat plate 23 extending from the rear of the shielding shell 1.

The two buckles 25 are disposed on the shielding shell 1 and above the shielding shell 1 . The shielding shell 1 further includes four fastening tabs 17 respectively protruding outwardly from the sidewalls 13 , and the heat sink heat sink 21 further has two top surfaces formed on the heat dissipation fins 212 along the A top recess 216 extending in the left-right direction D2, and four through-holes 217 penetratingly formed in the board body 211 and adjacent to both ends of the two top recesses 216, respectively. Each of the fasteners 25 has a fixing portion 251 that is received in the corresponding top recess 216, and two extend downward from the two ends of the fixing portion 251 and are fastened to the two side walls 13 through the corresponding through holes 217. Each of the fastening sections 252 is formed with a fastening hole 252a for fastening the corresponding fastening tab. The heat sink type heat sink 21 is restrained between the shield case 1 and the clip 25 by the elasticity of the clips 25, so that the plate body 211 of the heat sink type heat sink 21 is The bottom surface and the bottom surface of the heat plate 23 cover the top surface of the shield case 1 to ensure that the thermal energy of the shield case 1 can be transmitted to the heat dissipation module 2.

Referring to FIG. 4, FIG. 5, FIG. 9, and FIG. 10, the shielding shell 1 further includes two first mounting pieces 18 respectively located at the left and right sides of the opening 111 and extending upward and the board surface direction is parallel to the front and rear direction D3. And two second mounting pieces 19 extending integrally rearwardly along the front and rear direction D3 toward the rear end surface 141 away from the rear wall 14 and located adjacent to the two side walls 13, respectively, the two second mounting pieces 19 are respectively from the two The trailing edge of the side wall 13 extends and the direction of the plate surface of the two second mounting pieces 19 is parallel to the front-rear direction D3. The heat sink type heat sink 21 further has two receiving grooves 218 defined by the heat radiating fins 212 adjacent to the side edges of the heat sink type heat sink 21 and extending along the front and rear direction D3, and four corresponding to the Two accommodating grooves 218 are formed in the plate body 211 and respectively correspond to the through holes 219 of the two first mounting pieces 18 and the two second mounting pieces 19. The light guide member 3 is disposed on the shielding shell 1 and is respectively partially received in the two receiving slots 218. Each light guiding member 3 has two light guiding tubes 31, a first mounting post 32, and a second mounting. Column 33. The two light pipes 31 are arranged side by side in the up-and-down direction D1 and are accommodated in one of the receiving grooves 218. Each of the light guiding tubes 31 is slightly L-shaped and has a light-input end facing downward and behind the rear wall 14. 311, and a light-emitting end 312 facing forward and close to the front end socket 161. The light guide tubes 31 are used to guide the light emitted from the light-emitting elements (not shown) on the circuit board from the light-incident end 311 to the light-emitting end 312. It should be noted that the number of the light-guiding tubes 31 is required. It can also be one or three or more. In this embodiment, each light incident end 311 is located behind the corresponding second mounting post 33 and spaced apart from the second mounting post 33 , thereby bypassing the portion of the board 211 extending to the rear of the rear wall 14 . To face the light-emitting elements on the aforementioned circuit board. The first mounting post 32 is connected to the two light guiding tubes 31 at the light emitting end 312 and extends through the corresponding through holes 219 to be fastened to one of the first mounting pieces 18, and the second mounting post 33 is connected to The two light guide tubes 31 are biased against the light incident end 311 and extend through the corresponding through holes 219 to be fastened to one of the second mounting pieces 19 . Each of the first mounting pieces 18 defines a splicing groove 181 from the top edge. Each of the first mounting posts 32 has a latch 321 corresponding to the splicing slot 181 . Each of the second mounting pieces 19 is formed with a splicing groove 191 from the top edge, and each of the second mounting posts 33 has a latch 331 corresponding to the splicing groove 191. The light guides 3 are fixed to the shielding shell 1 by the first mounting post 32 and the second mounting post 33, and the receiving slots 218 of the heat sink type heat sink 21 are used to limit the guiding. Light piece 3.

The connecting member 4 is disposed on the light guiding members 3, and each of the light guiding members 3 further has a connecting portion between the two light guiding tubes 31 adjacent to the light end 311 and a buckle groove 341 formed at the inner side. The latching post 34 has a body 41 and two snap ribs 42 extending integrally from the two sides of the body 41 and being fastened to the latching recesses 341, and four through holes are formed. The upper portion of the accommodating hole 43 is configured to receive the light-incident end 311 of the four light-guiding tubes 31, and the lower portion of the accommodating holes 43 corresponds to the light-emitting element. (not shown), so that light of the light-emitting element can be transmitted to the light-incident end 311 of the light-guiding tubes 31 via the connecting member 4 to ensure that light emitted from the light-emitting elements can be transmitted through the light guide tubes 31.

In summary, the shield assembly 100 of the present invention is disposed on the top edge of the heat dissipation fin 212 of the heat sink fins 21 and covers the cover 22 of the top opening 214c of the heat dissipation channels 214. The airflow is concentrated through the heat dissipation channels 214 between the heat dissipation fins 212 to improve the heat dissipation performance of the heat dissipation module 2.

However, the above is only the embodiment of the present invention, and when it is not possible to limit the scope of the present invention, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still This new patent covers the scope.

100‧‧‧Shield assembly

200‧‧‧Chassis

201‧‧‧ front opening

202‧‧‧air inlet

203‧‧‧ wall

1‧‧‧Shielding shell

11‧‧‧ top wall

111‧‧‧ openings

12‧‧‧ bottom wall

13‧‧‧ side wall

14‧‧‧ Back wall

141‧‧‧ rear end face

15‧‧‧foot

16‧‧‧ accommodating space

161‧‧‧ front end socket

17‧‧‧Snap tabs

18‧‧‧First installation film

181‧‧‧榫接槽

19‧‧‧Second installation piece

191‧‧‧榫接槽

2‧‧‧ Thermal Module

21‧‧‧ Heat sink radiator

211‧‧‧ board

212‧‧‧heat fins

213‧‧‧Additional heat dissipation structure

213a‧‧‧ tablets

213b‧‧‧ ribs

214‧‧‧heating runner

214a‧‧‧ runner entrance

214b‧‧‧Flower exit

214c‧‧‧top opening

215‧‧‧hot plate installation slot

216‧‧‧Top groove

217‧‧‧Perforation

218‧‧‧ accommodating slots

219‧‧‧through hole

22‧‧‧ Covers

23‧‧‧ hot plate

24‧‧‧heat source contact plate

25‧‧‧ buckle

251‧‧‧ fixed section

252‧‧‧ fastening section

252a‧‧‧Snap holes

3‧‧‧Light guides

31‧‧‧Light pipe

311‧‧‧ into the optical end

312‧‧‧ light end

32‧‧‧First mounting post

321‧‧‧Carmen

33‧‧‧Second installation column

331‧‧‧Carmen

34‧‧‧ buckle column

341‧‧‧Snap groove

4‧‧‧Connecting parts

41‧‧‧Ontology

42‧‧‧Snap ribs

43‧‧‧ accommodating holes

D1‧‧‧ direction

D2‧‧‧ direction

D3‧‧‧Up and down direction

Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a perspective view showing an embodiment of the present novel shield assembly disposed in a housing. 2 is a side view of FIG. 1; FIG. 3 is a perspective view of the embodiment; FIG. 4 is an exploded perspective view of the embodiment; FIG. 5 is an exploded perspective view of the embodiment. Figure 6 is a view from another perspective view; Figure 7 is a perspective view showing a heat sink type heat sink, a hot plate and a heat source contact plate of the embodiment; Figure 8 is an exploded perspective view of Figure 7; Figure 9 is a perspective view showing a shield case and two light guide members of the embodiment; and Figure 10 is an exploded perspective view of Figure 9.

Claims (17)

A shield assembly includes: a shield shell having a plurality of walls and an accommodating space defined by the plurality of walls; and a heat dissipation module assembled to a top surface of one of the walls of the shield shell, The heat dissipation module includes a heat sink type heat sink and a cover member. The heat sink type heat sink has a plate body and a plurality of heat dissipation fins disposed on a top surface of the plate body, and the heat dissipation fins are parallel to one The first direction extends and is parallel along a second direction perpendicular to the first direction, and the heat dissipation fins and the board body define a plurality of adjacent heat dissipation fins and extend along the first direction. a heat dissipating flow path, each of the heat dissipating flow paths having a first-class channel inlet and a first-class channel outlet respectively located at both ends in the first direction, and a top opening extending at the top end and extending in the first direction, the cover member being disposed on the The top edge of the heat sink fin of the heat sink type heat sink covers the top opening of the heat dissipation channels. The shield assembly of claim 1 wherein the cover is constructed of a compressible material. The shield assembly of claim 2, wherein the material constituting the cover further has electrical conductivity. The shield assembly of claim 2, wherein the material constituting the cover further has thermal conductivity. The shield assembly of claim 2, wherein the material constituting the cover further has electrical conductivity and thermal conductivity. The shield assembly of claim 1, wherein the shield shell comprises sidewalls on both sides of the wall in which the heat dissipation module is assembled, the heat sink heat sink further having at least one extending from the panel and adjacent to the An additional heat dissipation structure of the outer side surface of the side wall, the additional heat dissipation structure having a sheet body connected to the board body and juxtaposed with the corresponding side wall, and a plurality of ridges protruding from the sheet body. The shield assembly of claim 1, wherein the wall of the heat dissipating module is formed with an opening that communicates with the accommodating space, and the heat dissipating module further includes a through hole extending into the accommodating space. Heat source contact plate. The shield assembly of claim 7, wherein the heat dissipation module further comprises a heat plate disposed between the heat sink heat sink and the heat source contact plate. A shield assembly is adapted to be disposed in a casing, the shield assembly comprising: a shield shell having a plurality of walls, and an accommodation space defined by the plurality of walls; and a heat dissipation module, assembly The heat dissipation module includes a heat sink type heat sink and a cover member, and the heat sink type heat sink has a plate body and a plurality of top surfaces disposed on the top surface of the plate body The heat dissipating fins are parallel to a first direction and are arranged side by side in a second direction perpendicular to the first direction, and the heat dissipating fins and the board body are respectively defined by a plurality of adjacent fins a heat dissipation flow path extending between the two heat dissipation fins and extending along the first direction, each of the heat dissipation flow paths having a first-class track inlet and a first-class channel outlet respectively located at both ends in the first direction, and a top end along the a top end opening extending in a first direction, the cover member covers a top end opening of the heat dissipation flow path, and the cover member is disposed on a top edge of the heat dissipation fin of the heat sink type heat sink and the heat sink type heat sink Between a wall of the casing. The shield assembly of claim 9, wherein the cover is constructed of a compressible material. The shield assembly of claim 10, wherein the material constituting the cover further has electrical conductivity. The shield assembly of claim 10, wherein the material constituting the cover further has thermal conductivity. The shield assembly of claim 10, wherein the material constituting the cover further has electrical conductivity and thermal conductivity. The shield assembly of claim 9, wherein the shield shell comprises sidewalls on both sides of the wall in which the heat dissipation module is assembled, the heat sink heat sink further having at least one extending from the panel and adjacent to the An additional heat dissipation structure of the outer side surface of the side wall, the additional heat dissipation structure having a sheet body connected to the board body and juxtaposed with the corresponding side wall, and a plurality of ridges protruding from the sheet body. The shield assembly of claim 9, wherein the wall of the heat dissipating module is formed with an opening that communicates with the accommodating space, and the heat dissipating module further includes a through the opening into the accommodating space. Heat source contact plate. The shield assembly of claim 15, wherein the heat dissipation module further comprises a heat plate disposed between the heat sink heat sink and the heat source contact plate. The shield assembly of claim 9, wherein the housing has a plurality of air inlets, and the flow path inlets of the heat dissipation channels are adjacent to the air inlets of the housing.