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TWM489869U - Heat insulation adhesive structure and substrate having the same - Google Patents

Heat insulation adhesive structure and substrate having the same

Info

Publication number
TWM489869U
TWM489869U TW103212657U TW103212657U TWM489869U TW M489869 U TWM489869 U TW M489869U TW 103212657 U TW103212657 U TW 103212657U TW 103212657 U TW103212657 U TW 103212657U TW M489869 U TWM489869 U TW M489869U
Authority
TW
Taiwan
Prior art keywords
substrate
same
heat insulation
adhesive structure
insulation adhesive
Prior art date
Application number
TW103212657U
Other languages
Chinese (zh)
Inventor
zhong-xian You
Original Assignee
Force Applied Material Tech Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Force Applied Material Tech Company filed Critical Force Applied Material Tech Company
Priority to TW103212657U priority Critical patent/TWM489869U/en
Priority to CN201410413549.3A priority patent/CN104202948A/en
Publication of TWM489869U publication Critical patent/TWM489869U/en

Links

TW103212657U 2014-07-16 2014-07-16 Heat insulation adhesive structure and substrate having the same TWM489869U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW103212657U TWM489869U (en) 2014-07-16 2014-07-16 Heat insulation adhesive structure and substrate having the same
CN201410413549.3A CN104202948A (en) 2014-07-16 2014-08-21 Heat insulation structure and base material with same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103212657U TWM489869U (en) 2014-07-16 2014-07-16 Heat insulation adhesive structure and substrate having the same

Publications (1)

Publication Number Publication Date
TWM489869U true TWM489869U (en) 2014-11-11

Family

ID=52088149

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103212657U TWM489869U (en) 2014-07-16 2014-07-16 Heat insulation adhesive structure and substrate having the same

Country Status (2)

Country Link
CN (1) CN104202948A (en)
TW (1) TWM489869U (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107416419A (en) * 2017-04-27 2017-12-01 山东隆源橡胶有限公司 Heat-resisting composite cover glue adds a layer conveyer belt
CN110753462A (en) * 2018-07-23 2020-02-04 宏碁股份有限公司 Case structure and manufacturing method thereof
CN109483975A (en) * 2018-12-27 2019-03-19 苏州逸峰新材料科技有限公司 A kind of new and effective antibacterial, heat insulating composite pad

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4104887B2 (en) * 2002-03-25 2008-06-18 北川工業株式会社 Internal structure of electrical and electronic equipment
CN202425274U (en) * 2011-12-12 2012-09-05 苏州聚力电机有限公司 Surface-mounted composite sheet for isolating and removing hot spots of electronic equipment
KR101161735B1 (en) * 2012-01-31 2012-07-03 (주)메인일렉콤 Heat-radiation sheet
CN103158306B (en) * 2013-03-18 2015-09-30 杭州威廉姆投资管理有限公司 A kind of Novel ceramic heat insulation coating and manufacture craft thereof

Also Published As

Publication number Publication date
CN104202948A (en) 2014-12-10

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees