TWM487394U - Solid-state illuminating apparatus and LED tube lamp - Google Patents

Abstract

The invention provides a solid state illumination device. The device comprises a substrate, a transparent portion, a heat dissipation portion and a metal supporting component. The substrate has a plurality of light emitting diodes thereon. The transparent portion comprises a secure portion aside and on the substrate for securing the substrate. The heat dissipation portion comprises a mounting portion. The transparent portion and the heat dissipation portion are electrically insulated and formed together to form a case of the solid state illumination device. The metal supporting component has a trench. The metal supporting component supports the substrate and combines with the heat dissipation portion via the conjunction between the trench and the mounting portion.

Description

Solid state lighting device and LED lamp

The present invention relates to a solid state lighting device, and more particularly to a light emitting diode lamp.

A light-emitting diode belongs to a semiconductor component. The main semiconductor materials used include semiconductor III-V Group elements, which use electrical energy to provide semiconductor energy, which allows the combination of holes and electrons to release energy and emit photons or light. Since the light-emitting diode (LED) has many advantages such as fast reaction time, small volume, low power consumption, low pollution, high reliability, mass production, etc., the light-emitting diode is widely used in various fields, and even Light-emitting elements such as traditional incandescent bulbs or fluorescent lamps have been gradually replaced.

The development of light-emitting diodes has enabled the production of high-intensity white light-emitting diodes in a large number, making them widely applicable to many lighting devices, such as indoor lighting devices, or outdoor street lamps. High luminous efficacy LEDs represent high power at the same time.

Conventionally, a lamp using a light-emitting diode includes a lamp tube or a full-circle lamp tube using an aluminum fin and a translucent cover. The use of aluminum fins and translucent cover lamps has the advantage of good heat dissipation due to the use of aluminum fins, but the disadvantage is that the cost is high and the elasticity of the transmissive cover material is susceptible to external forces, causing the aluminum fins to be disconnected from the transmissive cover, and Have Concerns about electrical insulation. The advantages of the full-circle lamp are low cost, labor saving during assembly, and no electrical insulation. However, the disadvantage is that the heat dissipation effect is poor. When the lamp is used for a long time to generate heat to withstand the light-emitting components and its own weight, there is a possibility of deformation.

In view of the above, one of the objects of the present invention is to provide a solid-state lighting device to solve the problems of high cost, heat dissipation effect and electrical insulation of a conventional light-emitting diode lamp.

According to an embodiment of the present invention, the present invention provides a solid state lighting device. The solid state lighting device comprises a substrate, a light transmissive member, a heat conducting member and a metal supporting member. The substrate has a plurality of light emitting diode elements. The light transmissive member includes a fixing portion located above the two sides of the substrate for fixing the substrate. The heat conducting member comprises a fixing point, and the light transmitting member is electrically insulated from the heat conducting member and integrally formed to form a casing of the solid state lighting device. The metal supporting member has a circular groove, and the metal supporting member carries the substrate and is coupled to the heat conducting member through the circular groove and the fixing point.

1‧‧‧Semiconductor LED components

2‧‧‧Substrate

30‧‧‧Metal support elements

31‧‧‧Aluminum fin upper

32‧‧‧Aluminum fin lower part

33‧‧‧ semicircular ditch

34‧‧‧round ditch

41‧‧‧Light transmission parts

42‧‧‧ Fixed Department

43‧‧‧Heat-conducting parts

44‧‧‧ fixed point

The first figure is a cross-sectional view of a solid state lighting device in accordance with an embodiment of the present invention.

Some embodiments of the novel will be described in detail below. However, the present invention may be widely practiced in other embodiments than the following description, and the scope of the present invention is not limited by the embodiments, which are subject to the scope of the following patents. Furthermore, in order to provide a clearer description and to more easily understand the novel, the figure The various parts of the formula are not drawn according to their relative dimensions. Some dimensions have been exaggerated compared to other related scales; the irrelevant details are not completely drawn to make the schema simple.

The present invention discloses a solid state lighting device. The first figure is a cross-sectional view of a solid state lighting device in accordance with an embodiment of the present invention. The solid state lighting device of the present invention comprises a semiconductor light emitting diode (LED) lamp tube comprising a semiconductor light emitting diode element 1, a substrate 2, a metal supporting component 30, a light transmitting member 41 and heat conduction. Item 43. The omitting of solid state lighting devices in the first figures is well understood and implemented by those of ordinary skill in the art. Therefore, other components in the solid state lighting device are not specifically disclosed herein except for the components directly related to the solid state lighting device and the method of manufacturing the same disclosed herein.

The semiconductor light emitting diode (LED) element 1 comprises a plurality of light emitting diode beads. The semiconductor light-emitting diode elements 1 are all disposed on the substrate 2, and the substrate 2 has a circuit for driving the semiconductor light-emitting diode element 1 to emit light.

The metal supporting member 30 is used for supporting the substrate 2 and conducting the semiconductor light emitting diode element 1 and conducting the heat energy generated by the substrate 2 to the heat conducting member, facilitating heat dissipation of the lamp tube, rigidity thereof and preventing deformation and bending of the lamp tube. The metal supporting member 30 is preferably an aluminum fin member or abbreviated aluminum fin, but is not limited thereto.

The light transmissive member 41 and the heat conducting member 43 are formed by a two-material extrusion molding process to produce an integrally formed solid state lighting device housing or a circular cross-section lamp housing. The two-material integrated extrusion process can simplify the assembly process and improve the manufacturing capacity. The light transmissive member 41 comprises a light transmissive plastic material such as polycarbonate (PC), and the degree of light transmission may be determined according to requirements. The light transmissive member 41 includes a fixing portion 42 for fixing the substrate 2. The heat conducting member 43 comprises a highly thermally conductive plastic material for conducting the thermal energy generated by the semiconductor light emitting diode element 1 and the substrate 2 together with the metal supporting member 30. The heat conducting member 43 includes a fixed point 44 for bonding with the metal support member 30. In a preferred embodiment, the non-transparent heat conductive member 43 occupies about three points of the outer casing such as a circular tube. One of them causes the light-emitting diode lamp to pass through the light transmitting member 41. When the light-transmitting member 41 has a light-emitting area exceeding one-half of the outer casing such as a circular tube, the light type is preferable.

In one embodiment, the metal support member 30 is an aluminum fin, and the aluminum fin upper portion 31 and the aluminum fin lower portion 32 are respectively attached to the substrate 2 and the heat conductive member 43, the aluminum fin upper portion 31 and the substrate 2, and the aluminum fin lower portion 32 and the heat conductive member 43. The contact surface may be coated with a heat conductive material, respectively, to cause the heat generated by the semiconductor light emitting diode element 1 and the substrate 2 to pass through the aluminum fin to the heat conducting member 43 to lower the temperature of the lamp. The aluminum fin lower portion 32 has a circular groove 34 which is a screw hole for locking the side cover to the heat conductive member 43, and the aluminum fin upper portion 31 has a semicircular groove 33 for fixing the substrate 2 to the screw hole of the aluminum fin. The fixing point 44 of the heat conducting member 43 extends and protrudes from the lower portion 32 of the aluminum fin (below the circular groove or the screw hole), and can also serve as a fixed aluminum fin and a semiconductor light emitting diode element 1 and a substrate 2 in addition to promoting heat conduction. use. The substrate 2 is fixed by a multi-point method in which the symmetrical fixing portion 42, the aluminum fin upper portion 31, the aluminum fin lower portion 32, and the fixing point 44 are fixed. In addition, the rigid structure of the aluminum fin can prevent the light-transmitting member 41 and the heat-conducting member 43 from being deformed due to prolonged heat aging and load weight.

The present invention provides a solid state lighting device with excellent thermal conductivity. In one embodiment, the solid state lighting device is a straight tube type light emitting diode lamp. Due to the use of a fully insulated surface-integrated double-material housing, CE safety regulations are available. At the same time, the use of heat-conductive insulating plastics enables the light-emitting diode lamp to have the advantage of good heat dissipation. The solid-state lighting device supports the light-emitting diode substrate with a metal heat-dissipating supporting member, and the metal heat-dissipating supporting member has the advantages of light weight and heat dissipation efficiency by using aluminum as a material and fin shape.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the present invention should be included in the following. Within the scope of the patent application.

1‧‧‧Semiconductor LED components

2‧‧‧Substrate

30‧‧‧Metal heat-dissipating support components

31‧‧‧Aluminum fin upper

32‧‧‧Aluminum fin lower part

33‧‧‧Semicircular hole

34‧‧‧round ditch

41‧‧‧Light transmission parts

42‧‧‧ Fixed Department

43‧‧‧Heat-conducting parts

44‧‧‧ fixed point

Claims (13)

A solid-state lighting device comprising: a substrate having a plurality of light-emitting diode elements; a light-transmissive member comprising a fixing portion above the two sides of the substrate for fixing the substrate; a heat-conducting member comprising a fixing point, the light transmissive member is electrically insulated from the heat conducting member and integrally formed to form a casing of the solid state lighting device; and a metal supporting member having a circular groove, the metal supporting member carrying the substrate and passing through the circular groove and The fixing point is combined with the heat conducting member. The solid state lighting device of claim 1, wherein the light transmissive member comprises a light transmissive plastic material, preferably polycarbonate. The solid state lighting device of claim 1, wherein the heat conducting member comprises a high thermal conductive plastic material. The solid state lighting device of claim 1, wherein the fixing point is extended and protrudes into the circular groove. The solid state lighting device of claim 1, wherein the metal support member comprises an aluminum fin. The solid state lighting device of claim 1, wherein the upper portion of the metal supporting member has at least half of a circular groove for bonding and fixing the substrate. A light-emitting diode lamp tube comprising: a substrate having a plurality of light-emitting diode elements; a circular-section lamp tube housing comprising a light-transmissive member and a heat-conducting member, the light-transmitting member comprising a fixing The portion is located above the two sides of the substrate for fixing the substrate, the heat conducting member comprises a fixing point, the light transmitting member is electrically insulated from the heat conducting member and integrally formed; and a metal supporting member has a circular groove, the metal The support member carries the substrate and is coupled to the bulb housing through the circular groove and the fixing point. The illuminating diode lamp of claim 7, wherein the metal supporting member and the substrate and the contact surface between the metal supporting member and the heat conducting member have a heat conductive material. The illuminating diode lamp of claim 7, wherein the heat conducting member occupies one third of the lamp housing. The light-emitting diode lamp of claim 7, wherein the heat-conducting member comprises a high thermal conductive plastic material. The light-emitting diode lamp of claim 7, wherein the fixing point is extended and protrudes into the circular groove. The illuminating diode lamp of claim 7, wherein the metal supporting member comprises an aluminum fin. The light-emitting diode lamp of claim 7, wherein the upper portion of the metal support member has at least half of a circular groove for bonding and fixing the substrate.