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TWM477045U - Package substrate - Google Patents

Package substrate

Info

Publication number
TWM477045U
TWM477045U TW103200266U TW103200266U TWM477045U TW M477045 U TWM477045 U TW M477045U TW 103200266 U TW103200266 U TW 103200266U TW 103200266 U TW103200266 U TW 103200266U TW M477045 U TWM477045 U TW M477045U
Authority
TW
Taiwan
Prior art keywords
package substrate
package
substrate
Prior art date
Application number
TW103200266U
Other languages
Chinese (zh)
Inventor
Lee-Sheng Yen
Original Assignee
Lee-Sheng Yen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lee-Sheng Yen filed Critical Lee-Sheng Yen
Priority to TW103200266U priority Critical patent/TWM477045U/en
Publication of TWM477045U publication Critical patent/TWM477045U/en

Links

TW103200266U 2014-01-07 2014-01-07 Package substrate TWM477045U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103200266U TWM477045U (en) 2014-01-07 2014-01-07 Package substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103200266U TWM477045U (en) 2014-01-07 2014-01-07 Package substrate

Publications (1)

Publication Number Publication Date
TWM477045U true TWM477045U (en) 2014-04-21

Family

ID=60625587

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103200266U TWM477045U (en) 2014-01-07 2014-01-07 Package substrate

Country Status (1)

Country Link
TW (1) TWM477045U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556382B (en) * 2014-08-26 2016-11-01 矽品精密工業股份有限公司 Packaging substrate and a method for fabricating the same
TWI566331B (en) * 2015-08-14 2017-01-11 恆勁科技股份有限公司 Package module and its substrate structure
CN106469705A (en) * 2015-08-14 2017-03-01 恒劲科技股份有限公司 Packaging module and substrate structure thereof
US9786588B2 (en) 2014-12-10 2017-10-10 Via Alliance Semiconductor Co., Ltd. Circuit substrate and package structure
TWI675441B (en) * 2018-05-14 2019-10-21 欣興電子股份有限公司 Package carrier structure and manufacturing method thereof
CN110504238A (en) * 2018-05-16 2019-11-26 欣兴电子股份有限公司 Package carrier structure and manufacturing method thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556382B (en) * 2014-08-26 2016-11-01 矽品精密工業股份有限公司 Packaging substrate and a method for fabricating the same
US9786588B2 (en) 2014-12-10 2017-10-10 Via Alliance Semiconductor Co., Ltd. Circuit substrate and package structure
CN109378308A (en) * 2014-12-10 2019-02-22 上海兆芯集成电路有限公司 Circuit substrate and packaging structure
TWI566331B (en) * 2015-08-14 2017-01-11 恆勁科技股份有限公司 Package module and its substrate structure
CN106469705A (en) * 2015-08-14 2017-03-01 恒劲科技股份有限公司 Packaging module and substrate structure thereof
CN106469705B (en) * 2015-08-14 2019-02-05 恒劲科技股份有限公司 Packaging module and substrate structure thereof
TWI675441B (en) * 2018-05-14 2019-10-21 欣興電子股份有限公司 Package carrier structure and manufacturing method thereof
US10937723B2 (en) 2018-05-14 2021-03-02 Unimicron Technology Corp. Package carrier structure having integrated circuit design and manufacturing method thereof
CN110504238A (en) * 2018-05-16 2019-11-26 欣兴电子股份有限公司 Package carrier structure and manufacturing method thereof
CN110504238B (en) * 2018-05-16 2021-01-22 欣兴电子股份有限公司 Package carrier structure and manufacturing method thereof

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Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model