TWM471360U - A precursor structure of cigs thin film solar cells - Google Patents
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- TWM471360U TWM471360U TW101225117U TW101225117U TWM471360U TW M471360 U TWM471360 U TW M471360U TW 101225117 U TW101225117 U TW 101225117U TW 101225117 U TW101225117 U TW 101225117U TW M471360 U TWM471360 U TW M471360U
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- 239000002243 precursor Substances 0.000 title claims abstract description 18
- 239000010409 thin film Substances 0.000 title claims description 26
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000000137 annealing Methods 0.000 claims abstract description 12
- 238000004544 sputter deposition Methods 0.000 claims abstract description 12
- 239000010408 film Substances 0.000 claims description 30
- 229910052738 indium Inorganic materials 0.000 claims description 21
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 12
- CDZGJSREWGPJMG-UHFFFAOYSA-N copper gallium Chemical compound [Cu].[Ga] CDZGJSREWGPJMG-UHFFFAOYSA-N 0.000 claims description 10
- 238000001704 evaporation Methods 0.000 claims description 8
- 230000008020 evaporation Effects 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 claims description 4
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 claims description 4
- PDYXSJSAMVACOH-UHFFFAOYSA-N [Cu].[Zn].[Sn] Chemical compound [Cu].[Zn].[Sn] PDYXSJSAMVACOH-UHFFFAOYSA-N 0.000 claims description 3
- YGSCHSPBVNFNTD-UHFFFAOYSA-N [S].[Sn].[Zn] Chemical compound [S].[Sn].[Zn] YGSCHSPBVNFNTD-UHFFFAOYSA-N 0.000 claims description 3
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 claims description 3
- ZZEMEJKDTZOXOI-UHFFFAOYSA-N digallium;selenium(2-) Chemical compound [Ga+3].[Ga+3].[Se-2].[Se-2].[Se-2] ZZEMEJKDTZOXOI-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- AKUCEXGLFUSJCD-UHFFFAOYSA-N indium(3+);selenium(2-) Chemical compound [Se-2].[Se-2].[Se-2].[In+3].[In+3] AKUCEXGLFUSJCD-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- AFNRRBXCCXDRPS-UHFFFAOYSA-N tin(ii) sulfide Chemical compound [Sn]=S AFNRRBXCCXDRPS-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000005083 Zinc sulfide Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910003437 indium oxide Inorganic materials 0.000 claims 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 238000001771 vacuum deposition Methods 0.000 claims 1
- 239000006096 absorbing agent Substances 0.000 abstract description 7
- 230000003746 surface roughness Effects 0.000 abstract description 7
- 238000009826 distribution Methods 0.000 abstract description 4
- 229910017612 Cu(In,Ga)Se2 Inorganic materials 0.000 abstract 8
- 239000010410 layer Substances 0.000 description 69
- 210000004027 cell Anatomy 0.000 description 26
- 239000011669 selenium Substances 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 14
- 238000010521 absorption reaction Methods 0.000 description 10
- 239000012071 phase Substances 0.000 description 9
- 239000013078 crystal Substances 0.000 description 6
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 229910052711 selenium Inorganic materials 0.000 description 4
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 3
- 229910000807 Ga alloy Inorganic materials 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 3
- 229910052951 chalcopyrite Inorganic materials 0.000 description 3
- WILFBXOGIULNAF-UHFFFAOYSA-N copper sulfanylidenetin zinc Chemical compound [Sn]=S.[Zn].[Cu] WILFBXOGIULNAF-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000005361 soda-lime glass Substances 0.000 description 3
- 239000005315 stained glass Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000000224 chemical solution deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- JODIJOMWCAXJJX-UHFFFAOYSA-N [O-2].[Al+3].[O-2].[Zn+2] Chemical compound [O-2].[Al+3].[O-2].[Zn+2] JODIJOMWCAXJJX-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- SPVXKVOXSXTJOY-UHFFFAOYSA-N selane Chemical compound [SeH2] SPVXKVOXSXTJOY-UHFFFAOYSA-N 0.000 description 1
- 229910000058 selane Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Photovoltaic Devices (AREA)
Abstract
Description
本創作涉及一種太陽能電池元件製作,尤其是關於一種CIGS薄膜太陽電池前趨層結構。 The present invention relates to the fabrication of a solar cell component, and more particularly to a pre-layered structure of a CIGS thin film solar cell.
薄膜太陽電池是以具有黃銅礦晶相結構(chalcopyrite phase)的材料作為其光吸收層(absorber layer),如硒化銅銦鎵(CuInxGa1-xSe2)。因此,以此種黃銅礦晶相之材料作為光吸收層的薄膜太陽電池亦被稱為I-III-VI族化合物半導體。銅銦鎵二硒(Cu(In,Ga)Se2,CIGS)在薄膜太陽電池為一種黃銅礦相屬直接能隙的材料性質,具有穩定、高吸收係數、高效率、低成本與可撓 曲等優點,被認定為最具潛力的薄膜太陽電池。 A thin film solar cell is a material having a chalcopyrite phase as its absorber layer, such as copper indium gallium selenide (CuIn x Ga 1-x Se 2 ). Therefore, a thin film solar cell using a material of such a chalcopyrite crystal phase as a light absorbing layer is also referred to as an I-III-VI compound semiconductor. Copper indium gallium diselenide (Cu(In,Ga)Se 2 ,CIGS) is a material property of a direct energy gap of a chalcopyrite phase in a thin film solar cell. It has stability, high absorption coefficient, high efficiency, low cost and flexibility. The advantages of the song, etc., were identified as the most potential thin film solar cells.
近期雖以三階段共蒸鍍法可獲得高效率CIGS太陽能電池,然而為了提高應用面與擴大量產,大面積化與低成本勢必為主要考量,故發展出前趨層-硒化製程,過去至今,大部分的產品皆是以金屬與合金層,如銅、銦、鎵與硒等純元素及合金,最後在H2Se與H2S的環境下結晶完成,但目前以此製程完成之CIGS薄膜,其結晶結構仍存在以下問題:(1)前趨層薄膜表面粗糙度過高,導致後硒化之薄膜長晶無法獲得良好的平坦面與成長方向控制、(2)至後續緩衝層CdS與光窗層等之披覆,相對地,須以相當足夠之厚度進行披覆,否則將使元件的開路電壓(Voc)和填充因子(F.F.)下降、(3)進行前趨層硒化後之Ga原子,易產生擴散不均導致大量累積在背電極處,使CIGS薄膜表面能隙過低。其相關出處編號對應如下所示: In the near future, high-efficiency CIGS solar cells can be obtained by three-stage co-evaporation method. However, in order to improve the application surface and expand mass production, large-area and low-cost are inevitable, so the development of the pre-layer-selenization process has been carried out. Most of the products are made of metal and alloy layers, such as pure elements and alloys such as copper, indium, gallium and selenium, and finally crystallized in the environment of H 2 Se and H 2 S, but the CIGS is currently completed by this process. The film, its crystal structure still has the following problems: (1) the surface roughness of the precursor layer film is too high, resulting in the post-selenization film crystal growth can not obtain a good flat surface and growth direction control, (2) to the subsequent buffer layer CdS In contrast to the coating of the light window layer, etc., it must be covered with a considerable thickness, otherwise the open circuit voltage (Voc) and the fill factor (FF) of the device will be lowered, and (3) the selenization of the front layer will be carried out. The Ga atoms are prone to diffusion unevenness and cause a large amount of accumulation at the back electrode, so that the surface energy gap of the CIGS film is too low. The relevant source numbers correspond to the following:
(1) Tung-Po Hsieh, Chia-Chih Chuang, Chung-Shin Wu, Jen-Chuan Chang, Jhe-Wei Guo, Wei-Chien Chen, Effects of residual copper selenide on CuInGaSe2 solar cells, Solid-State Electronics, 56 (2011),175-178 (1) Tung-Po Hsieh, Chia-Chih Chuang, Chung-Shin Wu, Jen-Chuan Chang, Jhe-Wei Guo, Wei-Chien Chen, Effects of residual copper selenide on CuInGaSe 2 solar cells, Solid-State Electronics, 56 (2011), 175-178
(2) G.M.Hanket, W.N.Shafarman, B.E.McCandless, R.W.Birkmire, J.Appl.Phys.102 (2007), 074922. (2) G.M. Hanket, W.N. Shafarman, B.E. McCandless, R.W. Birkmire, J. Appl. Phys. 102 (2007), 074922.
(3) Lundberg, M. Edoff and L. Stolt, The effect of Ga-grading in CIGS thin film solar cells. Thin Solid Films, 2005, 480-481:520-525. (3) Lundberg, M. Edoff and L. Stolt, The effect of Ga-grading in CIGS thin film solar cells. Thin Solid Films, 2005, 480-481: 520-525.
本創作提出一種CIGS薄膜太陽電池前趨層結構,主要目的是為獲得平坦化之CIGS薄膜太陽電池吸收層薄膜,並改善利用濺鍍方式沉積(Cu(In,Ga)Se2,CIGS)前驅層,經硒化後所產生之前驅層硒化後表面粗糙度過高和Ga原子擴散不均等問題。 This paper proposes a pre-layered structure of CIGS thin film solar cells. The main purpose is to obtain a flattened CIGS thin film solar cell absorber film and improve the deposition of Cu(In,Ga)Se 2 ,CIGS precursor layer by sputtering. After selenization, the surface roughness of the previous drive layer after selenization is too high and the Ga atoms are unevenly diffused.
本創作結構主要透過兩層不同製程In層及一CuGa層來堆疊CIGS薄膜太陽電池前驅層;兩層不同製程In層,其一為蒸鍍In爾後以In(E)來表示,其二為濺鍍In爾後以In(S)來表示,其前驅層CIG薄膜堆疊結構為In(E)/In(S)/CuGa,並經由兩階段硒化退火,來觀察對CIGS薄膜太陽電池吸收層薄膜表面形貌與Ga濃度分佈上之影響,研究發現In(E)/In(S)/CuGa結構能有效地降低硒化後CIGS薄膜太陽電池吸收層薄膜之表面粗糙度,主要係藉由蒸鍍(In(E))平坦的表面,可以改善原先濺鍍In島狀結構現象並大幅降低CIGS表面粗糙度。另外,較平坦之In表面可減少In擴散至CIGS薄膜太陽電池吸收層表面,因而減少在硒化過程中有大量的InxSey化合物產生,不但使液化Cu2-xSe相幫助CIGS結晶成長,亦可幫助Ga原子產生均勻地擴散,促使成長為較大晶粒尺寸且平坦化之黃銅礦結構。 The creation structure mainly stacks the CIGS thin film solar cell precursor layer through two layers of different process In layers and one CuGa layer; two layers of different process In layers, one of which is represented by In (E) after vapor deposition, and the other is splashed. After plating In, it is represented by In (S) , and its precursor layer CIG film stack structure is In (E) /In (S) /CuGa, and the surface of the absorption film of CIGS thin film solar cell is observed through two-stage selenization annealing. Morphology and the influence of Ga concentration distribution, it is found that the In (E) /In (S) /CuGa structure can effectively reduce the surface roughness of the CIGS thin film solar cell absorber film after selenization, mainly by evaporation ( In (E) ) flat surface improves the original Sp-In island structure and greatly reduces the surface roughness of CIGS. In addition, the flatter In surface reduces the diffusion of In onto the surface of the absorption layer of the CIGS thin film solar cell, thereby reducing the generation of a large amount of In x Se y compound during the selenization process, which not only causes the liquefied Cu 2-x Se phase to help the CIGS crystal grow. It can also help the Ga atoms to uniformly diffuse and promote the growth to a larger grain size and flattened chalcopyrite structure.
圖1為本創作CIGS薄膜太陽電池前趨層結構之斷面示意圖,前驅層透過蒸鍍銦手段,尋求降低表面粗糙度之一較佳實施例,包含以下結構:(a)一基板,其係為在一真空環境內濺鍍一bi-layer Mo背電極層102之基板101,其中基板可以為玻璃、不鏽鋼或是其它硬質材料,也可以為可撓性之基板如塑膠基板、鈦基板等軟性金屬基板;(b)一蒸鍍銦層(In(E)),可透過在一真空環境內的該一Mo背電極層102上蒸鍍一In(E)層103a完成,本創作其蒸鍍金屬層不限定為銦層也可以為銅鋅錫硫層,或也可以為銅銦鎵硒、銅鋅錫硫所構成之二元粉末(如硒化銅、硒化銦、硒化鎵、硫化鋅、硫化銅、硫化錫等)、三元粉末(如銅銦鎵、銅銦硒、銅鋅錫、鋅錫硫等);(c)一CuGa層,可透過在一真空環境內的該一In(S)層103b或一In(E)層103a上濺鍍一CuGa層104完成,其 濺鍍層也可以為銅鋅錫硫所構成之二元靶材(如硒化銅、硒化銦、硫化鋅、硫化銅、硫化錫等)、三元靶材如銅銦鎵、銅銦硒、銅鋅錫、鋅錫硫等),其堆疊層數可以為單層、或多層以上;及(d)該前驅層可在一真空環境內進行退火形成一CIGS薄膜太陽電池吸收層105,其退火氣氛可為硒蒸氣、硫蒸氣、硒化氫、硫化氫或以上之組合。 1 is a schematic cross-sectional view showing a front layer structure of a CIGS thin film solar cell. The precursor layer seeks to reduce surface roughness by means of vapor deposition of indium. The preferred structure comprises the following structure: (a) a substrate, The substrate 101 of a bi-layer Mo back electrode layer 102 is sputtered in a vacuum environment, wherein the substrate may be glass, stainless steel or other hard materials, or may be a flexible substrate such as a plastic substrate or a titanium substrate. a metal substrate; (b) a deposited layer of indium (in (E)), can be deposited through the Mo back electrode layer 102 a in a vacuum environment, a in (E) layer 103a is completed, the creation of which evaporation The metal layer is not limited to the indium layer, and may be a copper zinc tin sulfide layer, or may be a binary powder composed of copper indium gallium selenide or copper zinc tin sulfide (eg, copper selenide, indium selenide, gallium selenide, sulfurized). Zinc, copper sulfide, tin sulfide, etc.), ternary powder (such as copper indium gallium, copper indium selenide, copper zinc tin, zinc tin sulfur, etc.); (c) a CuGa layer, which can be transmitted through a vacuum environment In (S) In a layer 103b or sputtering a layer 104 is completed on CuGa (E) layer 103a, which may be a sputtering layer composed of a sulfur copper zinc tin bis Targets (such as copper selenide, indium selenide, zinc sulfide, copper sulfide, tin sulfide, etc.), ternary targets such as copper indium gallium, copper indium selenide, copper zinc tin, zinc tin sulfur, etc., the number of stacked layers The layer may be a single layer or more; and (d) the precursor layer may be annealed in a vacuum environment to form a CIGS thin film solar cell absorber layer 105. The annealing atmosphere may be selenium vapor, sulfur vapor, hydrogen selenide, sulfurization. Hydrogen or a combination of the above.
本實施例之CIGS薄膜太陽電池吸收層105薄膜製備完成後,可以利用化學水浴法(chemical bath deposition,CBD)堆疊緩衝層硫化鎘(CdS),之後再濺鍍窗口層本質氧化鋅(intrinsic-ZnO),在於窗口層上濺鍍低阻值透明導電層摻雜鋁之氧化鋅(AZO),最後在濺鍍鎳鋁導線作為上電極,即完成CIGS薄膜太陽電池之元件。 After the preparation of the CIGS thin film solar cell absorption layer 105 film of the present embodiment, the buffer layer cadmium sulfide (CdS) can be stacked by chemical bath deposition (CBD), and then the window layer is intrinsic zinc oxide (intrinsic-ZnO). ), the aluminum oxide zinc oxide (AZO) is sputtered on the window layer with a low-resistance transparent conductive layer, and finally the nickel-aluminum wire is sputtered as an upper electrode to complete the components of the CIGS thin film solar cell.
圖2為本CIGS薄膜太陽電池前趨層結構斷面比較例示意圖,前驅層為透過濺鍍銦之一比較例,比較例前驅層包含以下步驟製成:(a)在一真空環境內的一基板201上濺鍍一bi-layer Mo背電極層202;(b)在一真空環境內的該一Mo背電極層202上濺鍍一In(S)層203;(c)在一真空環境內的該一In(S)層203上濺鍍一CuGa層204;及(d)在一真空環境內與實施例相同的氣氛中進行退火形成一CIGS層205。 2 is a schematic view showing a comparative example of a front layer structure of a CIGS thin film solar cell. The precursor layer is a comparative example of sputtering through indium. The comparative example precursor layer comprises the following steps: (a) a vacuum environment Sputtering a bi-layer Mo back electrode layer 202 on the substrate 201; (b) sputtering an In (S) layer 203 on the Mo back electrode layer 202 in a vacuum environment; (c) in a vacuum environment The In (S) layer 203 is sputtered with a CuGa layer 204; and (d) annealed in the same atmosphere as in the embodiment to form a CIGS layer 205.
由SEM圖3(a)實施例(b)比較例所示,從截面形貌可知,在未硒化前已具有明顯的兩種型態的微結構,In使用蒸鍍技術並從圖3(a)實施例觀察In沒有島狀成長,所以具有較平滑的表面,圖3(b)比較例因為In在沉積的過程中因為低熔點溫度及高表面張力的特性易產生此島狀結構(Island structure)。圖4(a)實施例(b)比較例為經過熱處理後薄膜表面形貌和橫截面表面形貌之 SEM圖,顯然經過兩階段硒化退火熱處理過後,島狀成長依然相當明顯。在透過原子力顯微鏡(Atomic Force Microscope,AFM)從圖5(a)實施例觀察到其表面粗糙度為RMS:61.17nm;然而濺鍍In結構之粗糙度,如圖5(b)比較例可知道CIGS硒化過後的粗糙度RMS高達117.86nm,因此使用濺鍍銦所造成之島狀結構,容易會形成不平坦及粗糙的表面形貌降低薄膜品質,不利於爾後元件堆疊之製造,故以此證實實施例和比較例本創新之功效,為了進一步了解其形成原因以下以硒化退火的過程示意圖來進一步說明。 From the comparative example of the SEM Fig. 3(a) example (b), it can be seen from the cross-sectional morphology that there are two distinct types of microstructures before the selenization, and In uses the evaporation technique and from Figure 3 ( a) The example shows that In has no island growth, so it has a smoother surface, and the comparative example of Fig. 3(b) is easy to produce this island structure because of the low melting point temperature and high surface tension property during deposition (Island). Structure). Figure 4 (a) Example (b) Comparative Example is the surface morphology and cross-sectional surface topography of the film after heat treatment The SEM image shows that after two-stage selenization annealing heat treatment, the island growth is still quite obvious. The surface roughness was observed by the Atomic Force Microscope (AFM) from the example of Fig. 5(a) to be RMS: 61.17 nm; however, the roughness of the Sp-plated In structure was as shown in the comparative example of Fig. 5(b). After the selenization of CIGS, the roughness RMS is as high as 117.86 nm. Therefore, the island structure caused by sputtering of indium is likely to form an uneven and rough surface morphology to reduce the film quality, which is disadvantageous for the fabrication of the rear component stack. The effects of the innovations of the examples and comparative examples are confirmed, and the reason for the formation is further explained below by the schematic diagram of the process of selenization annealing.
圖6(a)實施例SLG/Mo/In(E)/CuGa及(b)比較例SLG/Mo/In(S)/CuGa為經兩階段後硒化退火的過程示意圖,因為圖6(b)比較例濺鍍In有較為粗糙的表面,所以In容易擴散形成InSe相,利用濺鍍In之製程會形成較多的InxSey相(InSe2及In2Se3),而Cu2-xSe為液化相和In2Se3固態相會同時存在於CIGS長晶過程中,由於InxSey會阻礙CIGS成核;圖6(a)實施例為SLG/Mo/In(E)/CuGa經兩階段後硒化退火的結晶過程,由於蒸鍍In所形成的的表面較為平坦,In較不易擴散形成InxSey相,所以在較沒有InxSey相的情形下,使用蒸鍍In對於CIGS的表面可以獲得較佳品質。 Figure 6 (a) Example SLG / Mo / In (E) / CuGa and (b) Comparative Example SLG / Mo / In (S) / CuGa is a schematic diagram of the process after two-stage post-selenization annealing, because Figure 6 (b) In the comparative example, sputtering has a rough surface, so In is easily diffused to form an InSe phase, and a process of sputtering In forms a large number of In x Se y phases (InSe 2 and In 2 Se 3 ), and Cu 2- x Se is the liquefied phase and the In 2 Se 3 solid phase will exist simultaneously in the CIGS crystal growth process, since In x Se y will hinder CIGS nucleation; Figure 6 (a) embodiment is SLG/Mo/In (E) / After the crystallization process of CuGa after two-stage selenization annealing, since the surface formed by vapor deposition of In is relatively flat, In is less likely to diffuse to form the In x Se y phase, so in the case where there is no In x Se y phase, steaming is used. Plated In can achieve better quality for the surface of CIGS.
由於CIS薄膜的禁帶寬度比較小,不能吸收能量較高的光子,所以在薄膜當中加入Ga以提高薄膜的能隙,但在CIGS太陽電池的製程中,Ga是向背電極方向擴散,在此特性之下很容易導致薄膜表面Ga的含量不足,要提高薄膜表面之能隙造成困難。由圖7(a)實施例和(b)比較例SIMS縱深分布圖所示,圖7(a) 實施例可以看到於薄膜表面已有固定含量的Ga,從薄膜表面到背電極維持很穩定濃度分布,在1μm深度時才又增加了Ga的含量,這種逐漸增加的帶隙形成一個電場,把電子推向空間電荷區,進而減少電子在背電極的複合,產生電流的少數載流子增加,電流也就跟著增加;如圖7(b)比較例薄膜表面Ga的含量明顯不足,因為都往背電極方向擴散,這種成分梯度形成了一個反向電場不利於載子的收集,所以在這種情況會導致短路電流(Jsc)和填充因子(FF)無法提高;故由此證明本創作結構,可避免Ga於硒化過程中,大幅的往背電極增加,並可以維持薄膜表面Ga的含量,可以提高光子的吸收效率。 Since the CIS film has a small forbidden band width and cannot absorb high-energy photons, Ga is added to the film to increase the energy gap of the film. However, in the process of CIGS solar cells, Ga is diffused toward the back electrode. It is easy to cause the content of Ga on the surface of the film to be insufficient, and it is difficult to increase the energy gap of the surface of the film. Figure 7(a) and (b) Comparative Example SIMS depth profile, Figure 7(a) In the embodiment, it can be seen that there is a fixed content of Ga on the surface of the film, and a stable concentration distribution is maintained from the surface of the film to the back electrode, and the content of Ga is increased at a depth of 1 μm. This gradually increasing band gap forms an electric field. Pushing electrons into the space charge region, thereby reducing the recombination of electrons in the back electrode, the minority carriers that generate current increase, and the current increases; as shown in Figure 7(b), the surface Ga content of the film is obviously insufficient, because both Diffusion in the direction of the back electrode, this composition gradient forms a reverse electric field which is not conducive to the collection of carriers, so in this case, the short-circuit current (Jsc) and the fill factor (FF) cannot be improved; The structure can avoid the increase of Ga to the back electrode during the selenization process, and can maintain the content of Ga on the surface of the film, which can improve the absorption efficiency of photons.
綜上所述,透過本創作之CIGS薄膜太陽電池前驅層結構可提升了吸收層晶粒成長,進而改善前驅層硒化後CIGS吸收層結晶太小之問題。 In summary, through the creation of the CIGS thin film solar cell precursor layer structure, the grain growth of the absorption layer can be improved, thereby improving the problem that the crystal of the CIGS absorption layer is too small after selenization of the precursor layer.
101‧‧‧玻璃基板(Soda-lime glass,SLG) 101‧‧‧Stained glass substrate (Soda-lime glass, SLG)
102‧‧‧bi-layer結構背電極(鉬電極)膜層 102‧‧‧bi-layer structure back electrode (molybdenum electrode) film layer
103a‧‧‧蒸鍍銦(In(E))膜層 103a‧‧‧Indium (In (E) ) coating
103b‧‧‧濺鍍銦(In(S))膜層 103b‧‧‧spray indium (In (S) ) film
104‧‧‧銅鎵合金(70-30at%)膜層 104‧‧‧copper gallium alloy (70-30at%) film layer
105‧‧‧CIGS薄膜太陽電池吸收層 105‧‧‧CIGS thin film solar cell absorption layer
201‧‧‧玻璃基板(Soda-lime glass,SLG) 201‧‧‧Stained glass substrate (Soda-lime glass, SLG)
202‧‧‧bi-layer結構背電極(鉬電極)膜層 202‧‧‧bi-layer structure back electrode (molybdenum electrode) film layer
203‧‧‧濺鍍銦(In(S))膜層 203‧‧‧Indium (In (S) ) coating
204‧‧‧銅鎵合金(70-30at%)膜層 204‧‧‧copper gallium alloy (70-30at%) film layer
205‧‧‧CIGS薄膜太陽電池吸收層 205‧‧‧ CIGS thin film solar cell absorption layer
圖1是本創作較佳實施例之CIGS薄膜太陽電池前驅層結構斷面示意圖。 1 is a schematic cross-sectional view showing a structure of a precursor layer of a CIGS thin film solar cell according to a preferred embodiment of the present invention.
圖2是本創作比較例之CIGS薄膜太陽電池前驅層結構斷面比較例示意圖。 2 is a schematic view showing a comparative example of a structure of a precursor layer of a CIGS thin film solar cell according to a comparative example of the present invention.
圖3不同In製程硒化前結構之SEM圖 Figure 3 SEM image of the structure before selenization in different In processes
(a)SLG/Mo/In(E)/CuGa (b)SLG/Mo/In(S)/CuGa (a) SLG/Mo/In (E) /CuGa (b)SLG/Mo/In (S) /CuGa
圖4不同In製程硒化後結構之SEM圖 Figure 4 SEM image of the structure after selenization in different In processes
(a)SLG/Mo/In(E)/CuGa (b)SLG/Mo/In(S)/CuGa (a) SLG/Mo/In (E) /CuGa (b)SLG/Mo/In (S) /CuGa
圖5不同In製程結構經硒化後所量測的AFM圖 Figure 5 AFM diagram of different In process structures after selenization
(a)SLG/Mo/In(E)/CuGa (b)SLG/Mo/In(S)/CuGa (a) SLG/Mo/In (E) /CuGa (b)SLG/Mo/In (S) /CuGa
圖6(a)SLG/Mo/In(E)/CuGa (b)SLG/Mo/In(S)/CuGa Figure 6 (a) SLG / Mo / In (E) / CuGa (b) SLG / Mo / In (S) / CuGa
不同In製程結構在硒化CIGS成長變化比較示意圖 Comparison of the growth changes of selenium CIGS in different In process structures
圖7(a)SLG/Mo/In(E)/CuGa (b)SLG/Mo/In(S)/CuGa Figure 7 (a) SLG / Mo / In (E) / CuGa (b) SLG / Mo / In (S) / CuGa
不同In製程退火後SIMS縱深分析圖 SIMS depth analysis after annealing in different In processes
101‧‧‧玻璃基板(Soda-lime glass,SLG) 101‧‧‧Stained glass substrate (Soda-lime glass, SLG)
102‧‧‧bi-layer結構背電極(鉬電極)膜層 102‧‧‧bi-layer structure back electrode (molybdenum electrode) film layer
103a‧‧‧蒸鍍銦(In(E))膜層 103a‧‧‧Indium (In (E) ) coating
103b‧‧‧濺鍍銦(In(S))膜層 103b‧‧‧spray indium (In (S) ) film
104‧‧‧銅鎵合金(70-30at%)膜層 104‧‧‧copper gallium alloy (70-30at%) film layer
105‧‧‧CIGS薄膜太陽電池吸收層 105‧‧‧CIGS thin film solar cell absorption layer
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